JP3109801B2 - IC lead frame processing system - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC lead frame processing system. More specifically, the present invention relates to a serially connected manufacturing process with a lead frame attached.
The present invention relates to an IC lead frame processing system for bending and cutting a lead frame of C or one IC.

[0002]

2. Description of the Related Art An IC is manufactured through various manufacturing processes. The process of processing a lead frame portion of an IC having a lead frame is roughly as follows. When the IC chip is completed, it is attached to a lead frame, wired, and covered with plastic to protect it. Next, an extra portion of the lead frame is cut off, and then the pin portion is bent into a desired shape with a bending die to complete the IC.

[0003] Machinery of these lead frames is performed by arranging devices necessary for processing such as a cutting device and a bending device on a line. This lead frame machining line
Equipment is provided for each type of lead frame. The reason is IC
This is because the dimensions, the number of pins, and the pin intervals of the lead frame are different for each type, and are adapted to these.

[0004] If a machining line is provided for each type of lead frame, a huge capital investment is required. In addition, maintenance for this and the cost required for it are not easy. In order to increase the amount of lead frame machining, if the production exceeds the capacity of one machining line, the same machining line must be newly added. 1 when reducing production capacity
It can only be done on a line-by-line basis and cannot fine-tune production.

The present inventors have proposed an IC stocker, an IC take-out positioning device, and an IC supply system applicable to ICs of various specifications (US Pat. No. 5,645,393).
However, this proposal is not a processing system that performs a series of steps from supply of an IC lead frame to final machining by one unit.

[0006]

SUMMARY OF THE INVENTION The present invention has been invented with the above technical background and achieves the following objects.

An object of the present invention is to provide an IC manufacturing apparatus,
An object of the present invention is to provide an IC lead frame processing system capable of processing a single type of IC lead frame machining.

Another object of the present invention is to increase or decrease the number of IC lead frame processing apparatuses unitized as a single processing system when increasing or decreasing the production quantity of IC lead frames. I can respond
An object of the present invention is to provide a C lead frame processing system.

[0009]

The present invention employs the following means to achieve the above object.

An IC lead frame processing system according to the present invention is an IC lead frame processing system unitized as a single processing system, and a storage means for stacking and storing lead frames mounting a plurality of IC chips. (30, 45); separating means (100) for separating the lead frames stored by the storing means one by one; and the ICs of one lead frame separated from the storing means. Individual cutting means (160, 580) for cutting into individual chips to form a plurality of package ICs, and a machine for machining each lead wire of the package IC cut by the individual cutting means Processing means (210, 260, 330, 29
5,360,400), and a lead processing machine for transferring the package IC to a position of the machining means for machining by the machining means, and indexing an angle so as to machine each side of the package IC. Table (26
0) and the package separated from the lead frame by transferring the lead frame separated by the separating means (100) between the separating means (100) and the individual piece cutting means (160). The IC is cut into the individual piece cutting means (160) and the machining means (210, 26).
0, 295, 330, 360, and 400).

[0011] The IC lead frame processing system includes:
Disposed between the separating means and the individual piece cutting means,
It is more effective to arrange a width shifting device for positioning the lead frame separated by the separating means. However, the width shifting device is not always essential to the IC lead frame processing system of the present invention. It is desirable that the transfer means be composed of two or more devices, but may be one if the transfer efficiency is not considered.

Further, the separating means pushes up and separates from the lowermost surface of the lead frame laminated on the storage means in order to separate only the lead frame at the uppermost layer position of the lead frame one by one. It is good to arrange the IC push-up mechanism for it.

Further, the machining means cuts a corner portion of the lead wire, cuts a dam portion interconnecting the lead wires, and cuts a tip portion of the lead wire. If it comprises a cutting means and a lead bending device for gripping and moving the tip of the lead wire to bend the lead wire, the cutting and the bending may be separated.

Further, the transfer means includes a first transfer device for transferring the lead frame between the width shifting device and the individual cutting device, and the package IC cut by the individual cutting device. A second transfer device for transferring the IC chip to the machining means, and a third transfer device for transferring the IC chip between a plurality of machining steps in the machining means.
With the transfer device, more efficient machining can be realized.

Further, the cutting means includes a lead processing machine indexing table for determining the rotational angle position of the IC chip mounted on the lead processing machine table on the plane. And a cutting die for cutting the lead wire of the package IC.

Further, the cutting means includes cutting a corner of the lead wire, cutting a dam portion of the lead wire,
In addition, if the cutting dies are driven simultaneously by the same press device to cut the end portions of the lead wires, the mechanical simplification may be achieved.

Further, the lead processing machine indexing table includes:
A first lead processing machine indexing table for determining a rotational angle position of the package IC substantially on the plane to cut a pinch portion which is a corner of the lead wire of the package IC; A second lead processing machine indexing table for determining a rotational angle position of the package IC substantially on the plane so as to cut a dam portion which is partially connected so as not to be separated from each other; A third lead processing machine indexing table for determining a rotational angle position of the package IC substantially on the plane, in order to cut a lead tip to which a tip is connected so as not to be separated;
In order to bend the end of the lead wire, it is preferable that the package IC includes a fourth lead processing machine indexing table for determining a rotational angle position substantially on the plane.

Further, the first lead processing machine index table, the third lead processing machine index table, and the fourth
If the lead processing machine indexing table is provided with a feed correction drive mechanism for correcting the position on the plane, the positioning accuracy of the cutting processing is higher.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION

[Processing Process] An embodiment of the present invention will be described below with reference to the drawings. FIG. 1A is an oblique projection view showing an outline of a process of individually cutting and machining a long lead frame on which a package IC is mounted, and shows a function of the lead frame processing system of the present invention. This is for explaining the outline of the above. It is a figure which shows the outline of the movement locus | trajectory when a lead frame is cut and machined as a package IC. FIG. 1B is a plan view showing the shape of the package IC before processing. The three IC chips 1 are arranged at regular intervals in the center of the lead frame 2 and are connected by the lead frame 2. A plurality of lead wires 3 are previously formed on a lead frame 2 made of a thin metal plate by punching or the like.

The lead wire 3 is electrically connected to the packaged IC chip 1 and is connected to a printed wiring board (not shown) by soldering, and is electrically connected and mechanically fixed. It has the function of. The lead frame 2 is made of a hoop material (coil material), and an IC chip 1 is arranged at the center of a holed hoop material, and a lead wire 3 is formed at a peripheral portion by punching. The lead frames 2 are stacked in multiple stages and stored in a cassette 45 (see FIG. 4).

The cassette 45 for stacking and holding the lead frames 2 is an IC stocker 30 (see FIGS. 5 to 9).
And are held centered by Cassette 4
When the lead frame 2 is pushed upward (in the direction of arrow a) by the IC push-up mechanism 100 (see FIG. 10) from the lowermost end of the lead frame 5, the uppermost lead frame 2 in the cassette 45 is
Is introduced into the width adjusting plates 131a and 131b (see FIG. 11) of the width adjusting device 120 (see FIGS. 11 to 15), and is positioned in a centered state. The lead frame 2 is gripped by the arm 150 of the first transfer device 140 (see FIGS. 11 and 12) and transferred to a preset tip recognition position b.

When the leading end of the lead frame 2 is transferred and positioned at the leading end recognition position b, the position of the leading end and the pitch of the package IC 5 are imaged by a recognition camera (not shown), and the analyzing device (not shown) sends the image. By analyzing the video, the cutting positions c and d are accurately recognized. When the cutting position of the lead frame 2 is accurately measured and recognized, the positions of the cutting position c and the cutting position d of the lead frame 2 can be determined. The accurate cutting positions c and d are detected by detecting the slit 4 which is the center position between the two IC chips 1. Next, the first transfer device 140 transfers the lead frame 2 to the individual cutting device 160 (see FIGS. 16 to 18). The individual piece cutting device 160 is a lead frame 2
At the cutting position c.

When the connected lead frame 2 is cut, one package IC 5 is formed. The cut package IC 5 is sent to the next processing step for this machining because the portion of the lead wire 3 is not yet processed. After the cutting, the remaining lead frame 2 is moved to the above-mentioned tip recognition position b.
Then, the cutting operation at the cutting position d is performed by the same cutting operation as described above. The package IC 5 cut into individual pieces can be moved in two orthogonal axes directions, that is, the lead processing machine table 260 (see FIGS. 22 to 26) capable of plane movement and rotation indexing (θ) in the X and Y axis directions. ), The second transfer device 210
(See FIGS. 19 to 21).

The package IC 5 placed on the rotating table of the lead processing machine table 260 recognizes the size and position of the package IC 5 and the pitch of the lead wires 3 by a recognition camera which is a CCD camera. Based on the recognition of the position and the type of the package IC 5, the lead processing machine indexing table 295 (see FIGS. 22 and 23) is driven to correct the position of the package IC 5, and a pinch cutting die 339 (see FIG. 32). 4), and cut the pinch portions 6 at the four corners of the lead frame 2 of the package IC 5. When the pinch portion 6 is cut, the package IC 5 is mounted on the rotary table of the lead processing machine indexing table 295 on the lead processing machine table 260 and rotated at 90 ° intervals in a plane including a horizontal plane about the vertical axis. And sequentially cut with a cutting die.

When the cutting of the pinch portions 6 at the four corners is completed,
After the package IC 5 is returned to the position of the intermediate pocket I, it is transferred from the intermediate pocket I to the intermediate pocket II, that is, the position of the rotary table of the lead processing machine indexing table 296 by the third transfer device 310 (FIGS. 27 to 30). Is done. Package I placed in the middle pocket II position
The C5 is transported to the position of the dam cutting blade 350 (see FIG. 31) for dam cutting, and the dam portion 7, ie, the lead wire 3
At the middle position of the lead wire 3 is cut so that the lead wire 3 is not separated. The package IC5 on which the processing of the dam portion 7 in the four directions has been completed is returned from the dam cutting blade 350 to the intermediate pocket II, and further conveyed from the intermediate pocket II to the intermediate pocket III.

From the intermediate pocket III to the tip cutting blade 353
(See FIG. 31) to cut the lead tip 8. It is transported from the intermediate pocket III to the intermediate pocket IV. Next, the IC lead bending device 40 from the intermediate pocket IV
0 (see FIG. 38) and the lead bending device 400
The lead wire 3 is formed by the two-axis control servomotor, that is, the lead wire 3 is bent into an L shape. IC
The package IC 5 is returned from the lead bending device 400 to the intermediate pocket IV, and the package IC 5 is returned from the intermediate pocket IV to the reversing device 560.
The intermediate pocket IV is temporarily placed on the temporary placement table 561 at the intermediate pocket position V while being inverted (see FIGS. 44 to 46). The temporarily placed package ICs 5 are stacked and stored on a tray by a transfer device (not shown).

[Lead Frame Processing Machine 20] FIG. 2 is a view showing the appearance of the lead frame processing machine 20. The lead frame processing machine 20 is covered with a cover made of a sheet metal having a rectangular shape. The lead frame processing machine 20 roughly includes a processing machine box 21 and an unloading box 22.

A CRT 23 is arranged at an upper position of the processing machine box 21. This is for displaying data and the like on the control device of the lead frame processing machine 20. CRT23
A control panel 24 for a control device is arranged beside the. A keyboard and the like are provided for inputting the size of the lead frame 2, the size of the package IC 5, and the like from the control panel 24.

At the middle position on the front surface of the processing machine box 21, a carry-in door 25 for carrying the package ICs 5 stacked and stored in the magazine into the processing machine box 21 is arranged. The carry-in door 25 is hingedly connected to the processing machine box 21 so that it can be opened and closed freely. The cassette 45 (see FIG. 4) containing the lead frame 2 is carried in from the carry-in door 25. In the middle stage of the processing machine box 21, a mold changing door 26 used for changing the mold is arranged. At the bottom of the processing machine box 21, a chip discharge door 27 for discharging the chips of the cut lead frame 2 is disposed.
Unloading door 2 arranged in the middle stage of unloading box 22
8 is a package IC placed in a processed magazine
5 is to be taken out.

FIG. 3 is a plan view of the lead frame processing apparatus. The width shift plates 131a and 131b are used for positioning and centering the lead frame 2 supplied by being pushed up from the IC stocker 30 (see FIG. 5) disposed at the lower part thereof, and preparing for the transfer to the next step. is there. The IC stocker 30 is arranged below the width adjusting device 120 and is used for centering the lead frames 2 stacked and stored in the cassette 45 and sending out the lead frames 2 from the upper portion of the cassette 45 one by one. Things.

The 1 centered by the width adjuster 120
The lead frames 2 are extruded and transferred by the first transfer device 140 for the next cutting process. The transferred lead frame 2 is cut by the individual cutting device 160 as a single package IC 5 as described above (see FIGS. 16 to 18). The cut individual package IC5 is transferred to the second transfer device 210 (see FIG. 19).
22 through FIG. 22 through FIG.
6).

The lead processing machine table 260 can be moved in the XY plane and indexed and rotated on a vertical axis (Z axis). The package IC 5 mounted on the lead processing machine table 260 is processed by a cutting die 330 (see FIGS. 31 to 34). The cutting die 330 includes an upper die and a lower die. The cutting die 330 is provided with the pinch portions 6 at the four corners of the package IC 5 as described above.
And cut of the dam part 7 of the lead frame 2,
And cutting of the lead tip 8 are performed, and these processes are driven by the same press and are simultaneously processed. The upper die is a screw press 360 (Fig. 35).
).

When the cutting of the leading end of the lead has been completed and all of the three steps have been completed, the package IC 5 is conveyed to the lead bending apparatus 400. Lead bending device 400
Is a processing device for bending the lead wire 3 into an L shape. The transfer of the package IC 5 between the cutting die 330 (see FIG. 31) and the lead bending device 400 (see FIG. 38) is performed at a constant pitch. The transport of the package IC 5 is performed by the third transfer device 310 (see FIGS. 28 to 30). The lead wire 3 is bent into, for example, an L shape by the lead bending device 400. The package IC 5 further includes a reversing device 5
It is reversed at 60 and stored in the storage case. Hereinafter, the structure and function of each device described above will be described in detail.

[IC stocker 30] Lead frame 2
Is sent from the previous process in a state of being connected to the lead frame 2 in a triple manner in the example shown in FIG. As shown in FIG. 4, the lead frame 2 on which the IC chips 1 are arranged is stored in a cassette 45 in a state where a large number of them are stacked. The cassette 45 has a box shape as a whole, and is manually mounted on an IC stocker 30 described later. The cassette 45 has an opening 46 that is open at the front, bottom and top.

Since an opening 46 is formed in the cassette 45, as will be described later, a push-up member 111 (see FIG. 10) described later from the bottom of the cassette 45 allows one of the lead frames 2 to be connected.
By pushing up the lowermost lead frame 2 by the thickness of the sheet, the lead frames 2 can be separated and taken out one by one from above the cassette 45. Since the shape and size of the lead frame 2 are different depending on the type thereof, those having different sizes of the cassette 45 are prepared. The cassette 45 is gripped and fixed at a predetermined position on the IC stocker 30 by a cassette gripping mechanism 65 (see FIGS. 5 to 9).

Hereinafter, a detailed structure of the IC stocker 30 will be described. The IC stocker 30 includes a cassette lifting mechanism 48 for vertically moving the cassette 45 and a cassette gripping mechanism 65 for gripping the cassette 45. FIGS. 5, 6 and 7 show the IC stocker 30. FIG. 5 is a partially cutaway side view. FIG. FIG. 7 is a right side view of FIG. On the frame 44 of the IC stocker 30, a plate-shaped lower support 47 is arranged.
A cassette elevating mechanism 48 for vertically moving the upper support 49 is disposed between the lower support 47 and the upper support 49. The upper support 49 is composed of two first support rods 50.
And two second support rods 51.

The upper ends of the two first support rods 50 are swingably supported on the lower surface of the upper support 49 by a swing shaft 52 at intervals. The lower ends of the two second support rods 50 are arranged so as to sandwich the moving block 53, and are swingably supported at intervals by a swing shaft 54.
The upper ends of the two second support rods 51 are swingably supported by the swing shaft 55 on the lower surface of the upper support 49. The lower ends of the two second support rods 51 are arranged so as to sandwich the moving block 56, and are swingably supported by a swing shaft 57. Moving block 53 and moving block 56
Are screwed into the drive screw 58. The drive screw 58 has both a right-handed screw and a left-handed screw. The moving block 53 is screwed into one right-hand screw, and the other left-hand screw is screwed into the other moving block 56.

Both ends of the driving screw 58 are rotatably supported by bearings 59 fixed on the lower support 47. A knob 60 is fixed to one end of the driving screw 58. As can be understood from the above description, when the knob 60 is turned, the driving screw 58 is driven to rotate, and the moving block 53 and the moving block 56 are driven on the lower support 47 so as to approach or separate from each other. When the moving blocks 53 and 56 approach each other, the state as shown in FIG.
Rise up.

A linear guide rail 61 for vertically guiding the upper support 49 is fixed to the frame 44 in the vertical direction. A linear bearing 62 is provided on the side of the upper support 49.
Has been fixed. On the upper support 49, the first vertical plate 6
6 and the second vertical plate 67 are opposed to each other (FIG. 7).
reference). A cassette space 75, which is a space between the first vertical plate 66 and the second vertical plate 67, is for holding the cassette 45 (see FIG. 4). The first connecting plate 68 is fixed to the first vertical plate 66.

Similarly, the second vertical plate 67 has the second connecting plate 6
9 is fixed. First connecting plate 68 and second connecting plate 6
9, a linear bearing 70 and a linear bearing 71 are respectively fixed. The linear bearing 70 and the linear bearing 71 slide on the front end 72 of the upper support 49. Nuts are fixed to lower ends of the first connecting plate 68 and the second connecting plate 69, respectively, and a feed screw 73 is screwed into both nuts. The feed screw 73 has threads formed in opposite directions. Both ends of the feed screw 73 are rotatably supported on the upper support 49 by bearings.
A rotary knob 74 is fixed to one end of the feed screw 73. Therefore, when the rotary knob 74 is rotated, the feed screw 73 is rotated, and the first connection plate 68 and the second
The connecting plates 69 are simultaneously moved in the opposite directions by the same amount, and move toward and away from each other.

As a result, the first vertical plate 66 and the second vertical plate 67 simultaneously approach or move away from each other while maintaining the parallel state. A cassette space 75 is formed between the first vertical plate 66 and the second vertical plate 67. The cassette space 75 is arranged at one position in this example. In the cassette space 75, the cassette 45 is gripped by two opposed cassette fixing claws. Cassette 45
Are held at the center of both the front and rear, which is the depth of the cassette space 75, and the left and right, which are the width directions.
The width and length of the cassette 45 vary depending on the shape of the lead frame 2 as described above. Ultimately, the cassette space 75 can be adjusted in width and length to accommodate cassettes 45 of any size. Positioning of the cassette space 75 in the width direction is performed by an interlocking mechanism using the feed screw 73 described above. For positioning of the depth, a cassette gripping mechanism 65 described below is used.

[Cassette Grasping Mechanism 65] FIG. 5 is a view seen from the direction A in FIG. FIG. 8 is a plan view of FIG. 5, and FIG. 9 is a left side view of FIG. Two screw rods 81a and 81b are arranged above and below the second vertical plate 67. Screw rods 81a, 8
1b is formed with a right-handed screw and a left-handed screw. Screw rod 8
A rotary knob 82 is fixed to one end of 1a. A timing pulley 83 is attached to the other ends of the screw rods 81a and 81b.
a and 83b are fixed respectively. A timing belt 84 is provided between the two timing pulleys 83a and 83b.
Is spanned. Right screws of the screw rods 81a and 81b,
The left screw has four nuts 85a, 85b, 8
5c and 85d are screwed. Two nuts 85
A first gripping claw 86 having an L-shape is fixed to a and 85b.

Further, a second gripping claw 87 is fixed to the other two nuts 85c and 85d. Second gripping claw 87
Rotates about a shaft 88 (see FIG. 8). The second gripping claw 87 is constantly pushed toward the cassette space 75 by a spring. A pressing plate 89 is provided above the second gripping claw 87 so as to be rotatable about a shaft 90. Press plate 89
Is provided with a spring so as to press the second gripping claw 87 toward the first vertical plate 66. As a result, when the pressing plate 89 is pressed against the spring pressure, the pressing plate 89 swings about the shaft 90.
When the pressing plate 89 presses the second gripping claw 87, the second gripping claw 87 swings around the shaft 88. Therefore, the cassette 45 can be inserted into the cassette space 75 but cannot be removed. This function is used when the cassette 45 is inserted into the cassette space 75 from the front.

FIG. 9 is a left side view of FIG. Between the first vertical plate 66 and the second vertical plate 67 and at a rear position, a third vertical plate 91 is mounted and arranged on the upper support 49. The third vertical plate 91 has four guide rods 9 in the horizontal direction.
2a, 92b, 92c and 92d are arranged in parallel. The guide rods 92a, 92b, 92c, 92d have
Moving members 93a, 93b, 93c and 93d are inserted movably via bearings. Moving member 93
One end of each of a and 93d is fixed to the second vertical plate 67 with a screw. Therefore, the second vertical plate 67 and the moving members 93a and 93d move integrally.

Similarly, since one ends of the moving members 93b and 93c are fixed to the first vertical plate 66 with screws, the first vertical plate 66 and the moving members 93b and 93c move integrally. On the other hand, the shafts 55a, 55 of the third vertical plate 91
5b includes two interlocking rings 56a and 56b rotatably.
Is attached. U-shaped grooves are formed at both ends of the interlocking links 56a and 56b.
4a, 54b, 54c and 54d are inserted. As a result, the first vertical plate 66 or the second vertical plate 67 moves closer to or away from each other while being kept parallel by the interlocking links 56a and 56b.

[IC Lifting Mechanism 100] FIG. 10 shows the IC lifting mechanism 100. The lead frames 2 stacked on the cassette 45 are transferred one by one from the upper layer to the next step by the first transfer device 140. At this time, it is necessary to push up the lead frame 2 from the lowermost part of the cassette 45 and take it out. The IC lifting mechanism 100 is a mechanism for lifting the lead frame 2. The frame at the corner of the side of the stocker 30 has two ends of the ball screw 101 in the vertical direction.
02 and 102 are rotatably supported. A timing pulley 103 is fixed to a lower end of the ball screw 101. A timing belt 104 is stretched over the timing pulley 103. Timing belt 1
04 is rotationally driven by a servo motor 105 (see FIG. 7). A ball nut 107 is attached to the ball screw 101.
Is screwed. An arm 108 is integrally fixed to the ball nut 107.

At the tip of the arm 108, a lifting member 111
Are provided integrally. The push-up member 111 pushes up the lowermost lead frame 2 of the cassette 45 held in the cassette space 75. As shown in FIG. 8, a linear bearing 109 is fixed to the arm 108, and the linear bearing 109 is guided along a vertical guide rail 110 fixed to the frame. Therefore, when the servo motor 105 is driven to rotate, the ball nut 107 moves up and down along the ball screw 101, and the push-up member 111 moves up and down along the up and down guide rail 110.

[Width adjustment device 120] Cassette space 7
In the upper part of 5, the width shifting device 120 and the first transfer device 14
0 is arranged. The width shifting device 120 is a cassette 4
5 is for positioning and centering the lead frame 2 pushed up to the uppermost part of the lead frame 5 to prepare for transfer to the next step. The first transfer device 140 transfers the centered lead frame 2 to the individual cutting device 160. FIG. 11 is a plan view of the width adjusting device 120. 12 is a front view of FIG. 11, and FIG.
14 is a sectional view taken along line AA of FIG. The frame 121 has a rectangular shape. On the upper side of the frame 121, two parallel screw bars 122a and 122b are rotatably supported and arranged (see FIG. 11).

The screw rods 122a and 122b are provided with a right-hand screw and a left-hand screw, respectively. One screw rod 122b
, A rotary knob 123 is fixed. A timing pulley 124 is fixed to the other end of the screw rod 122b. A timing belt 125 is stretched over the timing pulley 124 (see FIG. 12). A timing pulley 127 is fixed coaxially with the timing pulley 126. A timing belt 128 is stretched around the timing pulley 127. The timing belt 128 is further stretched around a timing pulley 129 (see FIG. 13). The timing pulley 129 is wound around a timing pulley (not shown) fixed to one end of the screw rod 122a with a timing belt. Therefore, the screw rod 122a and the screw rod 122b are rotated in the same direction in conjunction with each other.

The right and left screws of the screw rods 122a and 122b have nuts 130a, 130b and 130, respectively.
c and 130d are screwed. The nut 130a and the nut 130c have a rectangular crossing plate 131a having a rectangular cross section.
Are connected. Similarly, nut 130b and nut 13
0d is connected to a width approaching plate 131b having a rectangular cross section. Side surface 132 of width approaching plates 131a, 131b
The positions a and 132b are in contact with the side surface of the lead frame 2 for positioning. After all, when the rotary knob 123 is turned, the screw rod 122b is rotated, and this rotation drives the timing pulley 127 via the timing pulley 124, the timing belt 125, and the timing pulley 126.

When the timing pulley 127 is further rotated, the timing belt 128 and the timing pulley 12 are rotated.
9. Timing belt, timing pulley (not shown)
, The screw rod 122a is driven to rotate simultaneously with the screw rod 122b. The rotation of the two screw rods 122a and 122b causes the nuts 130a, 130b, 130c and 1 to rotate.
30d moves, and finally both width shift plates 131a, 131
b is moved toward or away from the center line. Therefore, the lead frame 2 is always located at the center of the width adjusting device 120.

[First Transfer Apparatus 140] FIGS.
FIG. 14 shows the first transfer device 140. First
The transfer device 140 is for transferring the lead frame 2 from the width adjusting device 120 to the individual cutting device 160, and is disposed at a position beside the two devices. A feed screw 143 is connected to an output shaft of the servomotor 141 through a joint 142.
Are connected at one end. Both ends of the feed screw 143 are supported by bearings 145 on the frame 144. Feed screw 1
A nut 146 is screwed into 43. Nut 1
A connecting member 147 is fixed to 46 (see FIG. 12). The linear bearing 14 is provided at the upper end of the connecting member 147.
8 are connected. The linear bearing 148 is guided on a rail 149. Rail 149 is feed screw 1
43, and both ends thereof are fixed to the frame 144. One end of an arm 150 is further fixed to the linear bearing 148.

At the other end of the arm 150, a chuck 151 is provided as shown in FIG. Chuck 151
Is provided with an air cylinder 152, and a movable claw 15 is provided at the tip of a piston rod 153 of the air cylinder 152.
4 is fixed. A fixed claw 155 is provided on the arm 150 at a position facing the movable claw 154. The movable frame 154 and the fixed claw 155 grip the lead frame 2. A dog 156 is fixed to a lower end of the connecting member 147 fixed to the nut 146. A mechanical origin detection sensor 157 is disposed at a position on the frame 144 corresponding to the moving position of the dog 156. The mechanical origin detection sensor 157 is for detecting the mechanical absolute origin of the arm 150, and determines the amount of movement of the position of the arm 150 from this detected position.

As is apparent from the above structure, when the servo motor 141 is rotationally driven, the feed screw 143 is rotated. Since the nut 146 is screwed into the feed screw 143, the nut 146 moves along the feed screw 143. I do. Since the linear bearing 148 moves along the rail 149, the arm 1 integrated with the linear bearing 148 is used.
50 will also move along rail 149. By this movement, the IC lead frame 2 gripped by the chuck 151 is transferred to the individual cutting device 160.

[Individual Piece Cutting Apparatus 160] FIGS. 16 and 17
FIGS. 18 and 18 show a piece cutting device 160 for cutting the lead frame 2 into individual pieces. FIG. 16 is a front view, FIG. 17 is a plan view, and FIG. . The individual piece cutting device 160 includes the rotary blade cutting device 16.
1 and a drive device 162. Rotary blade cutting device 16
Reference numeral 1 is for cutting a package IC5 (see FIG. 1) formed on the lead frame 2 at a constant pitch into one package IC5. Drive 162
Is for driving the rotary blade cutting device 161 to cut the lead frame 2.

The plate-like base 16 of the rotary blade cutting device 161
Support members 164 are arranged upright at both ends on 3 (see FIG. 16). Both ends of a guide member 165 for guiding the rotary cutting blade 179 and the rotary cutting blade 181 are fixed to upper portions of both support members 164. Base 16
A guide rail 166 is fixed on 3. A linear bearing 168 is movably mounted on the guide surface 167 of the guide rail 166.

The lower plate 16 is placed on the linear bearing 168.
The lower surface of 9 is fixed. The lower end of the standing plate 170 is fixed to one end of the upper surface of the lower plate 169. One end of an upper plate 171 is fixed to an upper portion of the standing plate 170. Lower plate 1
A movable frame 194 having a rectangular shape whose one side is open is constituted by the 69, the standing plate 170, and the upper plate 171. A dog 172 is fixed to the lower surface of the lower plate 169, and a non-contact sensor 173 is disposed on the base 163. The movement of the moving frame 194 is detected by the dog 172 and the non-contact sensor 173, and
Determine the mechanical origin of 4. One end of two shaft support members 175 is fixedly arranged in parallel at the tip of the upper plate 171. A rotary blade shaft 176 is provided between the two shaft support members 175 and 175.
Both ends are fixed. A rotary cutting blade 179 is rotatably supported on the rotary blade shaft 176 by a bearing 178. An annular elastic member 1 is provided on the outer circumference of the rotary cutting blade 179.
80 is wound and arranged and fixed.

A thrust bearing 177 is arranged between the rotary cutting blade 179 and the shaft supporting member 175 to make the rotation of the rotary blade 179 smooth. A shaft support member 174 is fixed on the lower plate 169. Shaft support member 174
A rotary cutting blade 181 is rotatably supported on the upper part of the blade. The support structure of the rotary cutting blade 181 is the same as that of the rotary cutting blade 179, and a description thereof will be omitted. Rotary cutting blade 1
The support shaft of the rotary cutting blade 181 is parallel to the support shaft of the rotary cutting blade 179, and the outer peripheral surface of the elastic member 180 of the rotary cutting blade 179 is in contact with the outer peripheral surface of the rotary cutting blade 181. The surface and the outer peripheral surface of the rotary cutting blade 179 are in contact with each other. A support roller 182 is in contact with the outer periphery of the rotary cutting blade 181. The support roller 182 is a bearing 183
, And is rotatably supported by the shaft support member 174.

The outer periphery of the support roller 182 is the guide member 1
65, and is supported. As a result, the support roller 182 supports the rotary cutting blade 181 with the guide member 165 to prevent the rotary cutting blade 181 from being deformed. On the base 163, two upright members 185 are arranged.
The table support member 186 is fixed to the upper part of the fifth table 5. The cutting table 18 for mounting and fixing the transferred lead frame 2 on the table support member 186.
7 is fixed. A mounting surface 188 for mounting the lead frame 2 is formed on the upper surface of the cutting table 187. A vacuum suction path 189 is formed between the center of the cutting table 187 and the table support member 186. Air is sucked in from the vacuum suction port 190 through the suction path 189, and the inside thereof is set to a negative pressure so that the lead frame 2 is placed on the mounting surface 1.
Fix at 88.

A connecting plate 195 is fixed to the back of the standing plate 170 of the moving frame 194 (see FIG. 17). A U-shaped U groove 196 is formed in the connecting plate 195. U
The cam floor 197 is inserted into the groove 196. The cam floor 197 is fixed to the tip of the connecting plate 198.
The lower end of the plate member 203 is fixed to the connecting plate 198.
The driven member 204 is integrally fixed to the plate member 203. The driven member 204 is a driven member driven by the rodless cylinder 205. Rodless cylinder 2
05 are fixed to the base 201 at both ends. The rail 200 is fixed to the base 201.

A linear bearing 199 is fixed to the lower surface of the connecting plate 198. The linear bearing 199 moves on a moving surface 202 which is the upper surface of the rail 200. Both ends of the movement of the moving frame 194 are detected by the moving end sensors 206 and 207. When the lead frame 2 is mounted on the upper surface of the cutting table 187, the lead frame 2 is fixed to the mounting surface 188 by the negative pressure of the air in the suction path 189. When the rodless cylinder 205 is driven,
The driven member 204 is driven and moved on the guide surface 202, and the movement of the driven member 204 causes the moving frame 194 connected thereto to move. The lead frame 2 with the movable frame 194 on the rail 166 is cut between the rotary cutting blade 179 and the rotary cutting blade 181 by shearing.

[Second transfer device 210] FIG. 19 is a front view showing the second transfer device 210, FIG. 20 is a plan view of FIG.
FIG. 21 is a left side view of FIG. Second transfer device 210
Is a device for cutting an IC chip 5 that has been cut into pieces.
It is for sending the sheet from 60 to the position of the rotary table of the lead processing machine indexing table 295. At both ends on the base 211, support stands 212 are provided upright. Support stand 2
A rail 213 is fixed on 12. Rail 2
13 is provided with a linear bearing 21
5 is movably arranged. Linear bearing 21
5 is fixed to the lower surface of the moving table 226. Rail 21
A ball screw 216 is arranged in parallel with 3 and both ends thereof are rotatably supported by bearings 218.

The bearing 218 is fixed to a bearing holding member 217, and the bearing holding member 217 is provided on the base 211. After all, the ball screw 216 is
1 is rotatably supported. A timing pulley 219 is fixed to one end of the ball screw 216. On the other hand, a servo motor 222 is fixed on the base 211. A timing pulley 221 is fixed to an output shaft of the servo motor 222. Timing pulley 219
A timing belt 220 is stretched between the timing belt 221 and the timing pulley 221. A ball nut case 225 is fixed to the lower surface of the moving table 226, and the ball screw 21 is fixed to the ball nut fixed in the ball nut case 225.
6 is screwed.

A rail 230 is provided on the upper surface of the moving table 226.
It is arranged and fixed in a direction perpendicular to the ball screw 216. A linear bearing 232 is movably mounted on a moving surface 231 on the upper surface of the rail 230. The linear bearing 232 is fixed to the lower surface of the cross slide 233. As a result, the cross slide 233 is movable along the rail 230. A connecting plate 234 is fixed on the cross moving table 233, and the connecting plate 234 is connected to the driven body 235. The driven body 235 is the rodless cylinder 2
36 are arranged to cover the outer peripheral surface. After all, the rodless cylinder 236 is
Is driven along the guide surface 231 of the rail 230. A stopper 241 is provided at the moving end of the cross moving table 233.
Is arranged.

The stopper 241 is fixed to the movable base 226. A buffer member 242 made of a rubber material is fixed to the tip of the stopper 241. A shock absorber 243 is arranged between the two stoppers 241 in parallel. The shock absorber 243 receives the movement of the cross slide 233 and attenuates the velocity energy. The detection of the position of the mechanical origin of the cross carriage 233 is performed by the dog 237 fixed to the cross carriage 233 and the carriage 22.
6 by means of a non-contact sensor 238 fixed on it.
The column 250 is fixedly provided in the upright direction on the cross moving table 233. The column 2 has a rail 2 in the vertical direction.
58 are arranged. An L-shaped vertical moving member 251 is arranged near the column 250.

A linear bearing 259 is fixed to the vertically moving member 251, and the linear bearing 259 is guided by a rail 258. A tension spring 255 is interposed between the vertical moving member 251 and the cross moving table 233, and the vertical moving member 251 and the cross moving table 233 are mutually pulled. One end of an arm member 252 disposed horizontally is fixed to a lower end of the vertically moving member 251 via an L-shaped connecting member. Arm member 252
Is provided with an air passage 254. Arm member 252
A vacuum chuck 253 is provided at the tip of the. The vacuum chuck 253 suctions and holds the package IC5. The vertical movement member 251 is
6 rods. The vertical moving member 251 is
It is driven up and down by an air cylinder 256. The upper end position of the vertical moving member 251 is detected by the upper end contact sensor 257, and the lower end position of the vertical moving member 251 is detected by the lower end contact sensor 249.

[Operation of the Second Moving Device 210] As understood from the above structure, when the servo motor 222 is driven to rotate, the timing pulley 221 and the timing belt 22 are driven.
0, ball screw 216 via timing pulley 219
To rotate. The rotation of the ball screw 216 causes the moving table 226 to move in the Y-axis direction along the rail 213. When the rodless cylinder 236 is activated, the cross moving table 233 is moved in the X-axis direction along the guide surface 231 of the rail 230 via the driven member 235 and the connecting plate 234. Package I sucked by vacuum chuck 253
C5 can be transferred to a desired plane position by the driving. The package IC 5 is placed at a predetermined position with
When the air cylinder 256 is sucked, the air cylinder 256 moves upward. After being moved to a predetermined position, the vertical moving member 251 is driven downward by the air cylinder 256,
The vacuum chuck 253 is released, and the transfer of the package IC 5 is completed.

[Lead processing machine table 260] FIG.
FIGS. 23, 24, 25 and 26 (a), (b)
FIG. 3 is a view showing a lead processing machine table 260. 22 is a front view showing the lead processing machine table 260, FIG. 23 is a plan view of FIG. 22, and FIG. FIG.

The lead processing machine table 260 is located at the position of the cutting die 330 and the lead bending device 400 for mainly cutting the lead wire 3 of the package IC 5 cut and transferred by the individual cutting device 160. This is a processing table for indexing and rotating in 90-degree units for transferring and cutting the lead wires 3 on the four sides of the package IC 5 respectively. 4 on the lead processing machine table 260
Lead processing machine indexing tables 295, 296, 29
7, 298 are arranged. The lead processing machine index table 295 includes the pinch portions 6 at the four corners of the package IC 5.
Is an indexing table for cutting L into an L-shape. The lead processing machine indexing table 296 is an indexing table for cutting a portion where a plurality of lead wires 3 of the package IC 5 are connected to one another at an intermediate position thereof, that is, a dam portion 7 so as not to be separated from each other.

The lead machine indexing table 297 is an indexing table for cutting the lead tip 8 to which the tips of the package IC 5 are connected so that the lead wires 3 of the package IC 5 are not separated. Lead processing machine indexing table 298
Is an indexing table for bending the lead wire 3 of the package IC 5 into a Z-shape by a lead bending device 400 (described later). Hereinafter, details of the structure and functions of the lead processing machine table 260 will be described. Lead processing machine table 26
The three rails 270 are arranged in parallel on the base 261 of No. 0. Linear bearing 2 on rail 270
A movable table 272 is provided movably via 71. A ball screw 263 is arranged on the lower surface of the base 261 in parallel with the lower surface and in the X-axis direction.

The bearing support member 26 is provided on the lower surface of the base 261.
2 is fixed. Both ends of the ball screw 263 are rotatably supported by bearings provided on the bearing support member 262. One end of the ball screw 263 is connected to the output shaft of the X-axis feed servo motor 265 via a joint. A ball nut 266 is screwed into the ball screw 263. The ball nut 266 is connected to the movable base 2 by the connecting member 267.
72. When the servo motor 265 is started to rotate the ball screw 263, the ball nut 266 is rotated.
Moves to move the moving table 272 along the rail 270, and the moving table 272 is transferred in a direction (X-axis direction) orthogonal to a direction (Y-axis direction) toward the cutting die 330 and the lead bending device 400. You. X-axis feed servo motor 265,
An X-axis feed servo mechanism 269 is constituted by the ball screw 263, the ball nut 266, and the like, and the X-axis feed servo mechanism 269 drives the moving table 272 by a movement amount commanded in the X-axis direction.

A cross table 275 is mounted on the movable table 272 with a space above and below. An X-axis feed servo mechanism 269 for driving the cross table 275 in a direction crossing the moving direction of the moving table 272 in the upper and lower spaces.
A Y-axis feed servo mechanism 280 (see FIG. 24) substantially the same as that described above is disposed. An upper end of a support member 274 is fixed to a lower surface of the cross table 275, and a linear bearing 281 is fixed to a lower end of the support member 274. The linear bearing 281 is movable on the cross rail 273. The Y-axis feed servo mechanism 280 moves the cross table 275 along the rail 273 by activating the servo motor 276.
Drive in the axial direction. Since the Y-axis feed servo mechanism 280 is substantially the same as the X-axis feed servo mechanism 269, the detailed description of the mechanism is omitted. As understood from the above description, the four lead processing machine index tables 295, 296, 297, and 2 mounted on the cross table 275
98 can be moved to any XY plane position.

The Y-axis feed servo mechanism 280 (FIG. 24) driven by the servo motor 276 transfers the cross table 275 in the direction where the cutting die 330 and the lead bending device 400 are arranged. Lead processing machine indexing table 295
Are indexing tables for cutting the pinch portions 6 at the four corners of the package IC 5 into an L-shape. The lead machine indexing table 296 is an indexing table for cutting the dam portion 7 which is connected to a part of the intermediate position so that the plurality of lead wires 3 of the package IC 5 are not separated.

[X-Axis Direction Correction Driving Mechanism 291 of Lead Processing Machine Indexing Table 295] As shown in FIG. 22, a bearing support member 277 is fixed to the lower surface of the cross table 275. Both ends of the ball screw 285 are rotatably supported by bearings provided on a bearing support member 277. One end of the ball screw 285 is connected to the servo motor 2 via a joint 286.
87 output shafts. A ball nut is screwed into the ball screw 285.

The ball nut is fixed to the index table 289 by a connecting member 288. The table table 289 is fixed to two rails 290 arranged on the cross table 275. On the table base 289, a lead processing machine indexing table 295 is mounted. After all, the servomotor 287 and the like constitute the X-axis direction correction mechanism 291.
The X-axis direction correction drive mechanism 291 corrects the feed of the lead processing machine indexing table 295 in the X-axis direction, and precisely corrects the processing position of the lead wire 3.

[Lead Processing Machine Indexing Table 295] The lead processing machine indexing table 295 is a table for fixing the package IC 5, and the lead wire 3 of the package IC 5 is fixed.
4 is a processing table for calculating a rotation angle position and cutting a position in the Y-axis direction in order to cut the pinch portion 6 which is the four corners into an L-shape. In order to cut the pinch portion 6 into an L-shape, it must be positioned in both the X and Y axis directions. The control in the Y-axis direction is performed by the Y-axis feed servo mechanism 280 (see FIG. 24). That is, the cross table 275 is driven along the rail 273 in the Y-axis direction by activating the servomotor 276. The X-axis feed correction control is performed by the X-axis line feed correction mechanism 29 described above.
1 (FIG. 22). The structural functions of the other parts are the same as those of the lead processing machine indexing table 298 described later, and detailed description and illustration thereof are omitted.

[Lead Processing Machine Index Table 296] FIG.
6 (a) is a side view of the lead processing machine indexing table 296, and FIG. 26 (b) is an enlarged view of a vacuum chuck portion. The lead processing machine index table 296 is a package I
This is a table for fixing C5, and a rotational angle position is determined to cut a portion where a plurality of lead wires 3 of the package IC 5 are connected to each other so as not to be separated from each other, that is, four dam portions 7. Table for processing. To cut the dam 7,
The position of the lead processing machine indexing table 296 is determined based on the position in the X and Y axis directions. On the basis of the position of the dam portion 7, other lead processing machine indexing tables 295, 29
The positioning of 7,298 is performed.

The position in the X-axis direction is determined by driving the X-axis feed servomotor 265 to position the movable table 272, and in the Y-axis direction by the Y-axis servo mechanism 280. Therefore, the lead machine indexing table 296 for cutting the dam portion 7 does not have a position correcting function in both the X-axis direction and the Y-axis direction.

FIG. 26A is a side view of the lead processing machine indexing table 296. The rotation of the servo motor 300a is controlled by indexing the rotation of a rotary table 305a via a speed reduction mechanism 304a. The table table 384a is fixed on the cross table 275a and cannot be moved. An air passage 306 is formed at the center of the rotary table 305a.
Is configured. The vertical drive of the rotary table 305a is the same as the mechanism described later, and the rotary table vertical drive mechanism 308
a.

[Lead Processing Machine Indexing Table 297] The lead processing machine indexing table 297 is a table for fixing the package IC5. ,
This is a processing table for calculating a rotational angle position for cutting the lead tip 8 and correcting a position in the Y-axis direction. In order to cut the end of the lead wire 3 of the package IC 5, the lead processing machine indexing table 297 is moved and positioned in the Y-axis direction where the cutting die 330 is arranged. Lead processing machine indexing table 297
Does not require positioning in the X-axis direction, only positioning in the Y-axis direction.

The position in the Y-axis direction is corrected by the Y-axis direction correction drive mechanism 293 (see FIG. 24). The Y-axis direction correction drive mechanism 293 is a lead processing machine indexing table 2
This is for correcting a delicate position 97 in the Y-axis direction at the time of machining. Accordingly, the structural functions of the lead processing machine indexing table 297 and its Y-axis direction correction driving mechanism 293 are substantially the same as those of the lead processing machine indexing table 298 and a feed correction mechanism 380 described later, and the detailed description thereof is omitted. Illustration is omitted.

[Y-Axis Direction Feeding Correction Mechanism 380 of Lead Processing Machine Index Table 298] FIG. 25 is a side view of the lead processing machine index table 298. The lead processing machine indexing table 298 is a table for fixing the package IC 5, and is used for calculating a rotation angle position for bending the end of the lead wire 3 of the package IC 5 and correcting the Y-axis direction. It is a table. This bending step is the last step of machining. Cross stand 2
The two linear rails 385 are arranged on the reference numeral 75, and a table base 384 is provided on the linear rail 385 by a linear guide 386 so as to be movable in the Y-axis direction.

A lead processing machine indexing table 298 is mounted on the table base 384. On the table stand 384,
It is fixed to a ball nut 382 via a connecting member 383. The ball nut 382 is screwed into the ball screw 381. The ball screw 381 is connected to the cross table 275
Is rotatably supported by the servomotor 392 for Y-axis correction.
It is connected to. When the Y-axis correction servo motor 392 is rotationally driven, the table base 384 is driven in the Y-axis direction. The Y-axis correction servomotor 392, the ball screw 381, the ball nut 382, the connecting member 383, and the like constitute a Y-axis direction feed correction mechanism 380. The Y-axis direction feed correction mechanism 380 is for correcting a delicate position of the lead processing machine indexing table 298 in the Y-axis direction at the time of processing.

[Lead Processing Machine Index Table 298] The lead processing machine index table 298 is mounted on the table base 384. The table support 384 has four support columns 3
The lower end of 88 is fixed. A rectangular plate member 309 is supported on the support column 388 via a bearing so as to be vertically movable. The plate member 309 is a lead processing machine indexing table 29.
8 is the main body. A timing pulley 301 is fixed to an output shaft of the servo motor 300. A timing pulley 303 is rotatably fixed to a shaft provided on a plate member 309 at a position separated from the timing pulley 301.

A timing belt 302 extends between the timing pulley 301 and the timing pulley 303, and transmits the rotation of the servomotor 300 at a reduced speed. Further, a timing pulley is fixed to the lower portion of the timing pulley 303 coaxially therewith, and transmits the rotation of the timing pulley to the rotary table 305. After all, the timing pulley 301, the timing belt 302, the timing pulley 303, and the like constitute a speed reduction mechanism 304 for indexing the rotary table 305 to a predetermined angular position.

The index angle position of the rotary table 305 is detected by detecting the disk connected to the shaft of the timing pulley 303 by an angle detection sensor 391 as a photo sensor. The rotation table 305 is rotated at a predetermined angle by the speed reduction mechanism 304 to perform a desired indexing. The rotary table 305 is a packaged IC5 with a built-in vacuum chuck.
Is gripped and fixed. The package IC 5 held by the turntable 305 is transferred (Y-axis direction) to an IC lead bending device 400 described later, and then the IC lead bending device 40 is moved.
It must be lowered to move it to the 0 processing position, and raised when processing is completed.

The vertical movement of the rotary table 305 is performed by a rotary table vertical drive mechanism 308. Table stand 3
A cylinder 387 is mounted on 84. A cam 389 is fixed to the tip of the piston rod of the cylinder 387. A cam follower 390 is in contact with the cam 389. The cam follower 390 is fixed to the back surface of the plate member 309. When the cylinder 387 is driven, the cam 389 moves and the movement of the cam 389 causes the cam follower 390 in contact therewith to follow.
09 rises. With this rise, the rotary table 305 mounted on the plate member 309 rises. Rotary table 30
The lowering of 5 is performed by an operation reverse to the above-mentioned raising.

[Third transfer device 310] FIGS. 27 and 28
(A), (b), FIGS. 29 (a), (b), and FIG.
FIG. 27 is a front view when assembled in a system, FIG. 28 is a left side view, FIG. 29 (a) is a plan view of a third transfer device, and FIG. 29 (b) is a third transfer device. FIG. 30 is a sectional view taken along line AA of FIG. The third transfer device 310 is fixedly arranged on a front surface of a press 360 described later. A rectangular plate 311 made of a sheet metal is fixed to a base 361 of a press 360.

On the front surface of the plate 311, two rails 312 are vertically arranged and fixed. Rail 312
The linear bearing 313 is movably arranged on the guide surface of the. A cylinder 315 driven by air pressure by a mounting member 314 is fixed to the plate 311.
The cylinder 315 is arranged parallel to the rail 312. Up and down moving arms 317 are fixed to both linear bearings 313 via mounting members. The piston rod 316 of the cylinder 315 is fixed to the vertical movement arm 317.

A shock absorber 319 and a stopper 320 are fixed to the front surface of the plate 311 via an L-shaped mounting member 318. On the other hand, the vertical movement arm 3
The lower end of a dog support member 321 bent in a Z-shape is fixed to 17. A dog 322 is fixed to an upper end of the dog support member 321. By driving the cylinder 315, the up-and-down movement arm 317 moves up and down, and the dog 322 first collides with the shock absorber 319 and its speed is reduced. Then, the dog 322 is stopped at that position by the stopper 320.

A vacuum chuck 325 is fixed to the lower surface of the vertically moving arm 317 via an L-shaped mounting member 323. Three vacuum chucks 325 are arranged at equal intervals so as to match the intervals at which the rotary tables 305 of the four lead processing machine index tables 295, 296, 297, 298 are arranged.

Therefore, the third transfer device 310 simultaneously holds the three package ICs 5 simultaneously with the vacuum chuck 325.
The package IC 5 is moved up and down by the vertical drive of the cylinder 315 (in the Z-axis direction), and the package I is moved by the horizontal movement of the lead processing machine table 260 (in the X-axis direction).
C5 is transferred to the next turntable 305. That is,
The vertical movement at the time of gripping or releasing is performed by the air cylinder 315, and the horizontal movement of the lead processing machine table 260 causes the transfer in the horizontal direction. Accordingly, the vacuum chuck 325 of the third transfer device 310 simultaneously grips the three package ICs 5 with the vacuum chuck 325 while moving the cylinder 315 up and down, and indexes each of the lead processing machine indexing tables 295 to 298. The sheet is transferred to the table 305 in units of one pitch.

A CCD camera 326 is arranged on the same side of the base 311 as the third transfer device 310. CC
At the lower position of the D camera 326, a light 32 as a light source is provided.
7 are arranged. The CCD camera 326 is for specifying the center position of the package IC 5 illuminated by the light 327 placed on the lead processing machine indexing table 295, the type of the package IC 5, and the like. The shape of the package, the lead frame 2 and the like, the number and the size of the lead wires 3 are measured, and the type is specified by comparing with the data input in advance.

When the center position of the package IC 5 is measured, each indexing table 305 of the lead processing machine indexing tables 295 to 298 is adjusted so as to match the center position.
Position. In this embodiment, the other three lead processing machine index tables 295, 297, and 298 are positioned based on the X and Y axis positions of the dam portion 7 based on the measurement results.

[Cutting Die 330] FIGS. 31, 32, 33, and 34 show the cutting die 330. FIG. 31 is a front view of the whole, and FIG. 32 shows L-shaped four corners of the package IC5. FIG. 33 is a partial cross-sectional view of a cutting die for cutting a pinch portion to be cut, FIG. 33 is a partial cross-sectional view of a cutting die for cutting a dam portion 7, and FIG. It is a fragmentary sectional view of a cutting die. Mold base 3
A discharge space for receiving cutting chips discharged when cutting is formed in 31. A mold holder 340 is mounted on the base 331.

The mold holding table 340 is for holding a cutting mold. Since holes are formed in the mold holding base 340 corresponding to the discharge spaces, the chips cut by the cutting die can be discharged. A pinch cut lower mold 339 is fixedly arranged on the upper surface of the mold holding base 340. The lower ends of the two sleeves 332 are fixed to the base 331. A movable base 333 is guided by the sleeve 332 so as to be vertically movable. A joint 3 for driving with a press machine 360 (see FIG. 35) described later is provided above the movable base 333.
34 are formed integrally.

The T-shaped socket 3 is provided inside the joint 334.
35 are formed. The joint of the press 360 is connected to the socket 335. A mold holding base 342 is fixed to the lower surface of the movable base 333. An upper pitch cut die 341 is fixedly arranged on the die holding base 342. A stripper 343 is arranged on the lower surface of the mold holder 342 so as to be vertically movable. Stripper 343 is bolt 3
It is fixed to the T bolt 344 via 45.

The movable table 33 is located above the T bolt 344.
3 is provided with a coil spring 346 housed therein. The coil spring 346 always pushes the T bolt 344 downward. Therefore, the stripper 343 forms a stripper mechanism for fixing the workpiece at the time of cutting, and pressing the package IC5, which is the workpiece after cutting, to separate it from the blade. The bush hole 336 is a hole for guiding the stripper 343 (FIG. 33).
reference). The dam cutting blade 350 is a comb blade (fork) blade which is relatively thin because the cutting portion is narrow. Tip cutting blade 3
Numeral 53 is for cutting the lead tip portion 8 in a straight line in cooperation with the lower blade 354, and has a wide cutting blade.

[Pressing machine 360] FIGS. 35, 36 and 3
7 shows a screw press 360, FIG. 35 is a front sectional view, FIG. 36 is a sectional view taken along line AA of FIG.
7 is a right side view. A cylindrical main body 362 having a cylindrical lower part opened is fixed on the base 361. A screw shaft 363 is rotatably supported on the cylindrical body 362 by a bearing 364. A timing pulley 367 is fixed to an upper end of the screw shaft 363. Servo motor 37
A timing pulley 369 is fixed to one output shaft 370. A timing belt 368 extends between the timing pulley 369 and the timing pulley 367. When the servomotor 371 is started, the timing pulley 369, the timing belt 368, and the timing pulley 367 are rotationally driven, and the screw shaft 363 is rotationally driven.

A nut member 366 is screwed into the screw shaft 363. The nut member 366 is integrally fixed to the ram 399, and a key 372 is fixed to the outer peripheral surface of the ram 399 so that the ram 399 is not further rotated. The key 372 is inserted into a key groove 373 formed in the key groove member 374, and moves up and down slidably. The key groove member 374 is fixed to the cylindrical member 362. Ram 39
The lower portion of 9 is inserted into a bearing 365 so as to be vertically movable.
The vertical angle of the ram 399 is controlled by detecting the rotation angle. Also, on the outer periphery of the timing pulley 367,
A non-contact sensor 379 is arranged via the fixing member 378, and detects the rotation angle of the timing pulley 367. Further, a dog 375 is fixed to the outer periphery of the ram 399, and the upper and lower contact sensors 376 and 377 fixed to the cylindrical main body 362 detect the upper and lower end positions of the dog 375.

The lower end of the ram 399 has a connecting bolt 397
Is screwed in and fixed. Head 3 of connecting bolt 397
Reference numeral 98 is for inserting and connecting to the socket 335 of the cutting die 330. When the servomotor 371 is started, the timing pulley 369 and the timing belt 36
8 and the timing pulley 367 are rotationally driven to rotate the screw shaft 3
63 is driven to rotate. By rotating the screw shaft 363,
The nut member 366 moves up and down along the key groove 373 to drive the movable table 333 which is the upper die of the cutting die 330.

[IC Lead Bending Apparatus 400] FIG.
1 is an overall perspective view of an IC lead bending device. The IC lead bending device 400 is a bending device for bending the lead wire 3 into a Z shape. On the frame of this processing machine, there is a substrate 4
01 is fixed. A moving plate 402 is provided on a substrate 401.
Are mounted so as to be movable in one direction (Y-axis direction) on a horizontal plane. The lead support base 45 is also provided on the substrate 401.
3 is fixed, and a lead holding means including a lead support fixing member 451 and a lead support movable member 452 is installed on the lead support base 453. The Y-axis direction is set in a direction in which the moving plate 402 approaches and separates from the lead gripping means. The lead wire 3 of the package IC 5 is positioned and fixedly mounted on the rotary table 305 described above. The lead wire 3 of the package IC 5 has its root portion gripped from above and below by a lead support fixing member 451 and a lead support movable member 452.

FIG. 39 is a cross-sectional view from the side of the IC lead bending apparatus. A Y-axis guide 411 is provided on the substrate 401 in the Y-axis direction, and a Y-axis slider 412 is guided on the Y-axis guide 411 so as to be movable in the Y-axis direction. The Y-axis slider 412 is fixed to the lower surface of the moving plate 402, so that the moving plate 402 can move smoothly in the Y-axis direction. Moving table 402
Is driven by the power of the Y-axis servomotor 421. An output shaft of the Y-axis servo motor 421 is connected to a Y-axis ball screw 423 by a Y-axis coupling 422,
Rotation is transmitted. A Y-axis ball nut 424 is screwed into the Y-axis ball screw 423, and the Y-axis ball nut 42
Numeral 4 is non-rotatably fixed to the moving table 402 via a connecting member 425. Therefore, the Y-axis servomotor 421
By the rotation of, the moving table 402 is linearly driven in the Y-axis direction.

The leading end of the lead wire 3 is held by a lower lead holding member 441 and an upper lead holding member 442, and is bent into a predetermined shape. At this time, the root of the lead wire 3 is held between the lead support fixing member 451 and the lead support movable member 452 so as not to move. The lower lead holding member 441 and the lead supporting movable member 452 are driven in a vertical Z-axis direction by a Z-axis servo motor 431. The output shaft of the Z-axis servo motor 431 is connected to a Z-axis ball screw 433 by a Z-axis coupling 432. The upper lead holding member 442 is driven by the cylinder device 443 via the cylinder shaft 444 in the Z-axis direction.

FIG. 40 is an enlarged view of a mechanism for driving the lower lead holding member 441, the upper lead holding member 442, and the lead supporting movable member 452 in the Z-axis direction. Four vertical Z-axis guides 435 are fixed to the moving table 402. The Z-axis guide 435 has a cylindrical shape, and includes a lower moving plate 481, an upper moving plate 491, and a roller holding plate 56.
1 is guided in the Z-axis direction. The Z-axis ball screw 433 driven by the Z-axis servo motor 431 has a lower ball screw 461 and an upper ball screw 462 above and below the center. Lower ball screw 461 and upper ball screw 4
Reference numerals 62 are opposite screws, and have the same pitch.

A lower ball nut 471 is screwed into the lower ball screw 461, and the lower ball nut 471 is fixed to the lower moving plate 481 so as not to rotate. A lower lead holding member 441 is fixed to the distal end of the lower moving plate 481. Therefore, by rotating the Z-axis ball screw 433 by the Z-axis servo motor 431,
The lower lead holding member 441 can be moved in the Z-axis direction. An upper ball nut 472 is screwed into the upper ball screw 462.
Is fixed to the roller holding plate 561 so as not to rotate. A driving roller 456 is rotatably supported at the end of the roller holding plate 561. Therefore, by driving the Z-axis ball screw 433 to rotate by the Z-axis servomotor 431, the drive roller 456 can be moved in the Z-axis direction.

Lower ball screw 461 and upper ball screw 4
62 and Z-axis ball screw 43
Due to the rotation of 3, the drive roller 456 and the lower lead holding member 441 move by the same distance in the vertical direction. The driving roller 456 is provided in the engagement groove 541 of the engagement member 454.
By moving the drive roller 456 in the Z-axis direction, the lead support movable member 452 can be pressed and biased toward the lead support fixing member 451 via the spring 455. Drive roller 456 and engagement groove 541
Is for biasing the lead support movable member 452 irrespective of the movement of the movable plate 402 in the Y-axis direction.

The engagement groove 541 allows the moving plate 402
Absorbs axial movement. Upper lead holding member 4
The upper moving plate 491 having the front end 42 fixed thereto is pressed and driven in the Z-axis direction by a cylinder device 443 via a cylinder shaft 444. Accordingly, the upper lead holding member 442 is urged against the lower lead holding member 441. In a state where the upper lead holding member 442 is urged by the lower lead holding member 441 by air pressure or the like, if the lower lead holding member 441 moves, the upper lead holding member 442 is also urged following the movement. They will move together.

FIG. 41 is an enlarged front view of a lead gripping means for fixing and supporting the root of the lead when bending the IC lead, and a part thereof is shown in a cross section. FIG. 42 is a cross-sectional view of the lead gripper shown in FIG. The lead holding means is provided on a lead support base 453. The lead support base 453 is fixedly installed on the substrate 401. The lead gripping means includes a lower position fixed lead support fixing member 451 and an upper lead support movable member 452. As described above, the lead support movable member 452 is urged toward the lead support fixing member 451 by the Z-axis servo motor 431 and the Z-axis ball screw 433.

A guide bar 457 is fixed to the engaging member 454 in the Z-axis direction. Upper lead support member mounting part 5
21 and the lower lead support member mounting portion 511 are provided with guide rods 45.
7 so as to be relatively movable. The guide bar 457 allows the engagement member 454 and the lead support movable member 4
52 is guided movably in the Z-axis direction with respect to the lead support fixing member 451. By lowering the drive roller 456 engaged in the engagement groove 541, the engagement member 45
4 is lowered, and the lead support movable member 452 is further lowered via the spring 455 to fix and support the lead base. Even after the lead support movable member 452 comes into contact with the lead base, the engagement member 454 is further lowered until the support force of the spring 455 reaches a predetermined value.

A space 522 and a space 512 are formed inside the upper lead support member mounting portion 521 and the lower lead support member mounting portion 511, and these spaces 522, 512 are formed.
The upper lead holding member 442 and the lower lead holding member 441 can move freely in the Y-axis direction and the Z-axis direction. FIG. 43 is a view showing a state of lead bending of the package IC5. The package IC5 is positioned and fixedly supported on the turntable 305.

The rotary table 305 supports the package IC 5 by suction by vacuum suction or the like, and has a function of indexing and rotating a lead L to be processed of the package IC 5 at a processing position. With the base of the lead L pressed and supported by the lead support fixing member 451 and the lead support movable member 452, the distal end of the lead L is sandwiched by the lower lead holding member 441 and the upper lead holding member 442. Then, the Y-axis servo motor 421 and the Z-axis servo motor 431 are controlled so that the lower lead holding member 441 and the upper lead holding member 442 draw an arc-shaped trajectory as shown in FIG. Perform processing.

[Inverting device 560] FIG. 44, FIG. 45, FIG.
6 shows a reversing device 560, FIG. 44 is a plan view, FIG. 45 is a front view, and FIG. 46 is a side view. The reversing device 560 is a package IC that has completed processing.
5 is to be temporarily placed on the temporary table 561 while being inverted. The temporarily placed package ICs 5 are stacked and stored on a tray by a transfer device (not shown). The rotary actuator 562 includes an output shaft 563 that is operated by air and swings and rotates. A swing arm 564 is fixed to the output shaft 563. A vacuum chuck 565 for holding the package IC 5 is disposed at the tip of the swing arm.

The temporary mounting table 561 has a through hole 566 so that the tip of the swing arm 564 passes through. Accordingly, when the swing arm 564 grips and swings the package IC 5, only the package IC 5 passes through the through hole 566 and is placed on the temporary mounting table 561. A dog 578 that swings integrally with the swing arm 564 is fixed to the root of the output shaft 563. A dog 5 is mounted on a frame 559 to which the rotary actuator 562 is fixed.
Shock absorber 56 for receiving swing of 78
7 is fixedly arranged. Package I after processing
Swing arm 564 holding C5 with vacuum chuck 565
When the package IC5 is mounted on the temporary mounting table 561, the shock absorber 567 receives the tip of the dog 578 and buffers the swing.

[Other Embodiments] In the above-described embodiment, the width adjusting device 120 is provided. However, as will be understood from the above description, since the lead frame 2 is positioned by the cassette holding mechanism 65, that is, centered. The width shifting device 120 is not always necessary. The cutting die 33
Although 0 is constituted by one unit, it may be constituted by a plurality of units. Further, the content of the cutting process is not limited to the above process, but can be changed according to the content of the package IC5.

[Individual Roller Cutting Apparatus 580] The above-described individual cutting apparatus 160 cuts the lead frame 2 into two individual package ICs 5 by shearing between two rotary cutting blades. there were. 47, 48 and 49 show a disk blade connected to the lead frame 2.
An individual roller cutting device 580 showing another embodiment of the type of rolling and cutting above. 47 is a plan view of the individual roller cutting device 580, FIG. 48 is a front view of FIG. 47, and FIG. 49 is a right side sectional view of FIG.
The base plate 581 is fixed to the frame of the system.

The lower end of a column 582 having two circular cross sections is fixedly disposed on the base plate 581 in parallel, and the upper portion thereof is connected and fixed by a horizontal plate 583. Horizontal plate 58
An air cylinder 584 is fixedly arranged at the uppermost part of 3. A piston rod 585, which is an output shaft of the air cylinder 584, is fixed to an upper end of a vertically movable table 586. The vertical moving table 586 has a substantially cubic shape, and has a frame structure.

[0118] In the vertical position at the rear of the vertical moving table 586,
Bearings 587 are provided at four places for the vertical moving table 586 to move up and down on the column 582. Eventually, the vertical movement base 586 is moved to the column 5 by the driving of the air cylinder 584.
82 will move up and down. A rail 590 is fixed inside the vertical moving table 586. Rail 590
Above, a linear bearing 591 is movably arranged.

The linear bearing 591 has the connecting member 5
92 is fixed, and the connecting member 592 is fixed to a driven member 593 disposed on the back. The driven member 593 is for driving the linear bearing 591. On the other hand, both ends of the rodless cylinder 595 are fixed to the vertical moving table 586. A cutting blade support member 597 is fixed to the lower surface of the connecting member 592. A cutting blade support shaft 598 is fixed to the cutting blade support member 597, and a cutting blade 599 is rotatably supported by a bearing on the cutting blade support shaft 598.

Therefore, the rodless cylinder 595,
The driven member 593 and the connecting member 592 are connected to the vertical moving table 58.
6 and move up and down together.
The cutting blade 599 is guided and moved by the rail 590 by the driving of the. A vertically moving table 600 is disposed below the column 582 so as to be vertically movable. A processing table 601 is arranged above the vertical movement table 600.

A vacuum suction chuck 602 for fixing the lead frame 2 is arranged on the processing table 601 and fixes the lead frame 2 on the processing table 601 during cutting. The processing table 601 has a slit 603 formed therein. The slit 603 is for inserting the cutting blade 599 when cutting the lead frame 2.

Below the vertical movement table 600, a table vertical drive mechanism 610 is arranged. The table up / down drive mechanism 610 connects the lead frame 2 to the processing table 6
01 so that it does not interfere
This is for moving 0 downward. Table 60
A linear cam 611 is fixed to the lower surface of the “0”. A cam follower 612 as a roller is in contact with the linear cam 611. The cam follower 612 is rotatably supported on the movable base 613. The moving table 613 includes a base plate 581.
Are guided by linear bearings 615 on two rails 614 fixed to the rails.

The moving base 613 is connected to the output rod of the air cylinder 616, and the rail 61 is driven by this driving.
4 Move on. By this driving, the cam follower 612
Moves, the linear cam 611 is pushed up to move the table 6
00 will be pushed up or down.

[Rotary table vertical drive mechanism 620] In the rotary table 305 (see FIGS. 25 and 26),
When the package IC 5 is placed on the cutting die 330 for processing, the package IC 5 is moved up and down by a rotary table up / down drive mechanism 308 including a cam mechanism. However, the vertical movement of the rotary table 305 may not be performed by the cam mechanism. FIG. 50 shows an example in which a rotary table is moved up and down by an air cylinder. A vacuum hole 622 for sucking air is formed in the rotation center shaft 625 of the turntable 621. Air is sucked from the vacuum holes 622 to suck the package IC 5 onto the turntable 621.

A piston 623 is formed on the rotation center shaft 625, and this piston 623 is connected to a cylinder 624.
Has been inserted. Therefore, when air is introduced into the cylinder 624, the piston 623 moves, and the rotary table 6
21 is raised and lowered. A gear 626 is fixed to a lower portion of the rotation center shaft 625, and the gear 626 further includes a gear 627.
Is further driven to rotate by an electric servomotor (not shown). Therefore, the rotary table 621 is provided with the gear 627
Will be indexed.

[0126]

As described above in detail, according to the present invention, a large number of package ICs having different dimensions and shapes can be efficiently positioned and centered and machined by a single processing system. And the processing system is simplified. When trying to increase production, new equipment is not required and can be dealt with only by increasing the number of installations.

[Brief description of the drawings]

FIG. 1A is a diagram showing an outline of an operation of an IC lead frame processing system of the present invention. FIG. 1 (b)
FIG. 3 is a front view of the package IC.

FIG. 2 is a diagram illustrating an appearance of an IC lead frame processing apparatus.

FIG. 3 is a plan view of the IC lead frame processing apparatus.

FIG. 4 is an oblique projection view showing an IC cassette.

FIG. 5 is a diagram illustrating an IC stocker;

FIG. 6 is a diagram illustrating a state in which a cassette elevating mechanism of the IC stocker is operated and raised.

FIG. 7 is a right side view of FIG. 5;

FIG. 8 is a plan view of FIG. 5;

FIG. 9 is a left side view of the cassette gripping mechanism shown in FIG. 5;

FIG. 10 is a front view of the IC lifting mechanism.

FIG. 11 is a plan view of the width adjusting device, and FIG.
It is sectional drawing at the time of cutting | disconnection by the BB line of No. 2.

FIG. 12 is a front view of FIG. 11;

FIG. 13 is a side view cut along the line AA in FIG. 12;

FIG. 14 is a cross-sectional view of a tip end of an arm of the first transfer device.

FIG. 15 is a cross-sectional view of the width shifting device.

FIG. 16 is a partial cross-sectional front view of an individual cutting device for cutting a lead frame into individual units.

FIG. 17 is a plan view of FIG. 16;

FIG. 18 is a sectional view of a rotary cutting blade portion.

FIG. 19 is a front view showing a second transfer device.

FIG. 20 is a plan view of FIG. 19;

FIG. 21 is a left side view of FIG. 19;

FIG. 22 is a front view showing a lead processing machine table;

FIG. 23 is a plan view of FIG. 22;

FIG. 24 is a diagram when four lead processing machine index tables mounted on the lead processing machine table are removed;

FIG. 25 is a side view of a lead processing machine indexing table.

26 (a) is a side view of a lead processing machine indexing table, and FIG. 26 (b) is an enlarged sectional view of a vacuum chuck portion.

FIG. 27 is a front view when the third transfer device is arranged in the IC lead frame processing system.

FIG. 28 is a left side view of FIG. 27;

29 (a) is a plan view of a third transfer device, and FIG. 29 (b) is a front view of the third transfer device.

FIG. 30 is a sectional view taken along the line AA of FIG. 29 (b).

FIG. 31 is a front view showing a cutting die.

FIG. 32 is a cross-sectional view of FIG. 31, which is a cross-sectional view of a cutting die portion for cutting a pinch portion of the package IC.

FIG. 33 is a cross-sectional view of FIG. 31, which is a cross-sectional view of a cutting die portion for cutting a dam portion of the package IC.

FIG. 34 is a cross-sectional view of FIG. 31 and is a cross-sectional view of a cutting die portion for cutting a lead end portion.

FIG. 35 is a front sectional view showing a screw press.

FIG. 36 is a sectional view taken along line AA of FIG. 35;

FIG. 37 is a right side sectional view of FIG. 35;

FIG. 38 is a perspective projection view showing the entire IC lead bending apparatus of the present invention.

FIG. 39 is a cross-sectional view from the side of the IC lead bending apparatus.

FIG. 40 is an enlarged view of a Y-axis direction drive mechanism of a lead holding member and a drive mechanism of a lead support member.

FIG. 41 is an enlarged front view of a lead support member.

FIG. 42 is a sectional view of the lead support member of FIG.
It is sectional drawing cut | disconnected by the line.

FIG. 43 is a diagram showing a state of IC lead bending.

FIG. 44 shows a reversing device for a processed package IC.

FIG. 45 is a front view of FIG. 44.

FIG. 46 is a side view of FIG. 44.

FIG. 47 shows another embodiment of another individual roller cutting device, and is a plan view of the individual roller cutting device.

FIG. 48 is a front view of FIG. 47;

FIG. 49 is a right side sectional view of FIG. 48;

FIG. 50 shows another embodiment of the turntable.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... IC chip 2 ... Lead frame 5 ... Package IC 20 ... Lead frame processing machine 30 ... IC cassette 65 ... Cassette gripping mechanism 100 ... IC push-up mechanism 120 ... Width shifting device 140 ... First transfer device 160 ... Single piece cutting device 210 ... second transfer device 260 ... lead machine table 295,296,297,298 ... lead machine index table 310 ... third transfer device 330 ... cutting die 360 ... press machine 400 ... IC lead bending device 580 ... piece Single roller cutting device

──────────────────────────────────────────────────続 き Continued on front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 23/50 H05K 13/02

Claims (9)

(57) [Claims] An IC lead frame processing system unitized as a single processing system, comprising: storage means (30, 45) for stacking and storing lead frames on which a plurality of IC chips are mounted; The lead frame stored by the storage means is
A separating means (100) for separating the sheets, and a plurality of package ICs by cutting the lead frame separated from the storage means into individual IC chips. Individual cutting means (160, 580)
And the package I cut by the individual piece cutting means.
Machining means (2) for machining each lead wire of C
10, 260, 330, 295, 360, 400) and the package for machining by the machining means.
Transfer the IC to the position of the machining means, and
Angular indexing to process each side of package IC
A lead processing machine table (260) and the lead holder separated by the separating means (100);
The frame is separated by the separating means (100) and the individual cutting means
(160) and said lead frame
Cutting the package IC from the individual piece cutting means
(160) and the machining means (210, 260, 29)
5, 330, 360, and 400), and a transfer means (140, 210, 310) for transferring to and from the IC lead frame processing system. 2. The IC lead frame processing system according to claim 1, wherein said separating means (100) and said individual cutting means (16).
0) and a width adjusting device (120) for positioning the lead frame separated by the separating means (100). 3. The IC lead frame processing system according to claim 1, wherein said separating means (100) separates only said lead frame at the uppermost layer position of said lead frame by one sheet. , The storage means (3
IC push-up mechanism (100) for pushing up and separating from the lowermost surface of the lead frame laminated on (0, 100)
An IC lead frame processing system, characterized in that: 4. The IC lead frame processing system according to claim 1, wherein said machining means (210, 260, 330, 295,
360, 400) cut the corners of the lead wire,
Cutting means (260, 295, 330) for cutting a dam portion connecting the lead wires to each other and cutting a tip portion of the lead wire; An IC lead frame processing system, comprising: a lead bending device (400) for moving and bending the lead wire. 5. The IC lead frame processing system according to claim 2, wherein said transfer means comprises: said width adjusting device and said individual cutting device.
0) for transferring the lead frame between
A transfer device (140), and the package IC cut by the individual piece cutting device (160) is processed by the machining means (210, 260, 33).
0, 295, 360, 400), and a second transfer device (210) for transferring to the machining means (210, 260, 330, 295,
And a third transfer device (310) for transferring the package IC between a plurality of machining steps in the process (360, 400). 6. The IC lead frame processing system according to claim 4, wherein said cutting means (260, 295, 330) is configured to remove said package IC placed on said lead processing machine table (260). A lead processing machine indexing table (295) for substantially determining a rotational angle position on the plane.
298) and a cutting die (330) for cutting the lead wire. 7. The IC lead frame processing system according to claim 4, wherein said cutting means (260, 295, 330) cuts corners of said lead wires and cuts dam portions of said lead wires. And a cutting die (330) driven simultaneously by the same pressing device (360) to cut the end of the lead wire. 8. The IC lead frame processing system according to claim 6, wherein said lead processing machine indexing table (295-298) cuts a pinch portion (6) which is a corner of said lead wire. A first lead processing machine indexing table (295) for determining the rotational angle position of the package IC substantially on the plane; and a dam part partially connected so that the lead wires are not separated from each other. A second lead processing machine indexing table (296) for determining the rotational angle position of the package IC on the plane for cutting, and a lead having a leading end connected so that the lead wire is not separated; A third lead processing machine indexing table (297) for determining a rotational angle position of the package IC substantially on the plane to cut off the tip, and a tip of the lead wire. To lower processing, IC lead frame processing system characterized by consisting of said packaged IC substantially the in plane angular position the indexing fourth lead processing machine indexing table (298). 9. The IC lead frame processing system according to claim 8, wherein said first lead processing machine index table (295), said third lead processing machine index table (297), and said fourth lead processing machine index table (297).
A feed correction drive mechanism (291, 38) for correcting the position of the lead processing machine indexing table (298) on the plane.
0). An IC lead frame processing system comprising: