CN113976467A - System for be used for selecting separately silicon chip - Google Patents
System for be used for selecting separately silicon chip Download PDFInfo
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- CN113976467A CN113976467A CN202111235997.5A CN202111235997A CN113976467A CN 113976467 A CN113976467 A CN 113976467A CN 202111235997 A CN202111235997 A CN 202111235997A CN 113976467 A CN113976467 A CN 113976467A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 93
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 93
- 239000010703 silicon Substances 0.000 title claims abstract description 93
- 235000012431 wafers Nutrition 0.000 claims abstract description 128
- 238000012545 processing Methods 0.000 claims abstract description 36
- 238000000034 method Methods 0.000 claims abstract description 9
- 230000003287 optical effect Effects 0.000 claims description 18
- 238000011144 upstream manufacturing Methods 0.000 claims description 18
- 238000004364 calculation method Methods 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 238000012935 Averaging Methods 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/04—Sorting according to size
- B07C5/10—Sorting according to size measured by light-responsive means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Sorting Of Articles (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The embodiment of the invention discloses a system for sorting silicon wafers, which comprises a conveyor belt, a plurality of processing stations and a plurality of sorting units, wherein the conveyor belt is used for conveying a plurality of silicon wafers to the processing stations; a detector for detecting a thickness value of each silicon wafer being transferred; a removing device arranged between the detector and the processing station, wherein the removing device is used for removing the silicon wafers with the thickness values which do not meet the requirements of the processing station from the conveyor belt in the process that the silicon wafers are conveyed.
Description
Technical Field
The invention relates to the field of semiconductor silicon wafer production, in particular to a system for sorting silicon wafers.
Background
Semiconductor silicon materials are the main functional materials in the integrated circuit industry, and the processing technology of silicon wafers has gradually become an important driving force for the development of the electronic information industry. With the increasing diameter of the silicon wafer and the decreasing feature size of the integrated circuit, higher requirements are put forward on the surface flatness and the removal rate of the silicon wafer, and grinding processing is one of the most effective technical means for accelerating the surface removal rate and improving the surface flatness of the silicon wafer.
For the polishing process, thickness removal efficiency and thickness control are important evaluation parameters for the process. Therefore, before the silicon wafer is polished, the thickness of the silicon wafer is first measured to determine whether the silicon wafer meets the polishing thickness requirement. Specifically, after being placed on a conveyor belt, the silicon wafer is conveyed to a thickness measuring area to stop, the tray is used for driving the silicon wafer to rotate in place, an infrared point scanning probe is used for performing thickness measurement along the periphery of the silicon wafer, and the thickness of the periphery of the silicon wafer is used for estimating the whole thickness of the silicon wafer. Under the test condition, if the thickness meets the range of the grinding requirement, the thickness measuring probe exits, and the next procedure is continued; if the thickness exceeds the processing allowable range, the equipment is stopped, an alarm is given to remind an operator, and the operator takes out the silicon wafer and then restarts the equipment.
The operation process needs the participation of operators to complete the taking out of the silicon wafer, the labor cost is increased, the equipment can be shut down to reduce the productivity, the equipment is restarted after being shut down to influence the processing precision, the precision adjustment needs to be carried out again, and the complexity of the processing process is increased.
Disclosure of Invention
In order to solve the above technical problems, it is desirable to provide a system for sorting silicon wafers, which can avoid an increase in labor cost and a decrease in productivity, and can avoid an adverse effect on processing accuracy due to restart.
The technical scheme of the invention is realized as follows:
the embodiment of the invention provides a system for sorting silicon wafers, which comprises:
the conveying belt is used for conveying a plurality of silicon wafers to the processing station;
a detector for detecting a thickness value of each silicon wafer being transferred;
a removing device arranged between the detector and the processing station, wherein the removing device is used for removing the silicon wafers with the thickness values which do not meet the requirements of the processing station from the conveyor belt in the process that the silicon wafers are conveyed.
The embodiment of the invention provides a system for sorting silicon wafers, which comprises the following steps that when the thickness value of a specific silicon wafer is detected not to meet the requirement of a processing station: the specific silicon wafer can be automatically moved out of the conveying belt by the moving-out device, so that the specific silicon wafer is taken out without manual participation, and the waste of labor cost is avoided; in addition, the removing device can remove the specific silicon wafer in the conveying process of the specific silicon wafer, so that the conveying operation of the conveying belt is not required to be stopped, and the problems of capacity reduction and influence on processing precision caused by restarting after stopping are avoided.
Drawings
FIG. 1 is a schematic block diagram of a system for sorting silicon wafers according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a conveyor belt and detector configuration according to an embodiment of the invention;
fig. 3 is an explanatory diagram for explaining a dark area formed on a light screen;
FIG. 4 is a schematic diagram of a conveyor belt and removal device according to an embodiment of the invention;
FIG. 5 is a schematic diagram of a conveyor belt and detector according to another embodiment of the invention;
FIG. 6 is a cross-sectional view taken along line A-A in FIG. 5;
FIG. 7 is a schematic structural diagram of a clamp driving unit according to an embodiment of the present invention;
fig. 8 is a schematic structural view of a roller of a clamp driving unit according to an embodiment of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Referring to fig. 1, an embodiment of the present invention provides a system 1 for sorting silicon wafers, where the system 1 may include:
a conveyor belt 10 as schematically shown in fig. 1 by a hatched area, the conveyor belt 10 being used for conveying a plurality of silicon wafers W to a processing station TS, for example, the conveyor belt 10 may be wound on two rollers not shown in fig. 1, and rotated in the direction of an arrow a1 shown in fig. 1 by the rotation of the two rollers, thereby moving the silicon wafers W resting on the conveyor belt 10 toward the processing station TS, wherein 3 silicon wafers are exemplarily shown in fig. 1;
a detector 20 for detecting a thickness value of each of the wafers W being transferred;
and a removing device 30 disposed between the detector 20 and the processing station TS, wherein the removing device 30 is used for removing the silicon wafers W having the thickness value not meeting the requirement of the processing station TS from the conveyor belt 10 during the plurality of silicon wafers W are conveyed, for example, the silicon wafer W adjacent to the processing station TS in fig. 1 is moved from the position shown by the broken line to the position shown by the solid line along the direction of the arrow a 2.
For the way the take-out 30 corresponds the wafer W to the thickness values, for example, the detector 20 may sequentially store the respective thickness values of the plurality of wafers W sequentially transferred as a thickness value sequence, and the take-out 30 may sequentially read the thickness values from the thickness value sequence when the wafer W is transferred; for another example, the distance between the detector 20 and the removing device 30 may be set to be smaller than the distance between two adjacent wafers W, so that the thickness value detected by the detector 20 can be immediately sent to the removing device 30, and the removing device 30 can determine whether the thickness of the next wafer W meets the requirement according to the thickness value received in real time. For example, when the wafer W has an identification mark, the detector 20 may identify the identification mark of the wafer W and associate the detected thickness value with the identified identification mark, and the removal apparatus 30 may identify the identification mark of the wafer W and inquire about the thickness value associated with the identified identification mark.
In the system 1 according to the embodiment of the present invention, when it is detected that the thickness value of a specific wafer W does not satisfy the requirement of the processing station TS: since the removing device 30 can automatically remove the specific silicon wafer W from the conveyor belt 10, the specific silicon wafer W is removed without manual intervention, thereby avoiding waste of labor cost; in addition, since the removing device 30 can remove the particular wafer W during its transfer, it is not necessary to stop the transfer operation of the transfer belt 10, thereby preventing the problem of a reduction in productivity and the problem of an influence on the processing accuracy due to a restart after the stoppage.
In one example, referring to fig. 2 in conjunction with fig. 3, the conveyor belt 10 may include an upstream segment US1 and a downstream segment DS1 defining a gap G1, the detector 20, schematically illustrated by a dashed box, being fixedly disposed relative to the processing station TS and including:
a light source 211 for emitting a light beam 211B parallel to the conveyor belt 10 and passing through the gap G1, as schematically shown by the arrowed lines in fig. 2;
a light screen 212, the light screen 212 being opposed to the light source 211 with respect to the conveyor belt 10 so that the light beam 211B is irradiated on the light screen 212, wherein the silicon wafer W shields the light beam 211B while being conveyed through the gap G1, so that a dark area DA corresponding to the shielded portion of the light beam 211B as shown in fig. 3 is formed on the light screen 212;
a sensing unit 213 for acquiring a height H of an arbitrary section of the silicon wafer W perpendicular to the conveying direction TD of the conveyor belt 10 from the dark area DA, as schematically shown by a double-headed arrow in fig. 3;
a calculation unit 214, said calculation unit 214 being adapted to calculate an average value of the height H of said arbitrary cross section as said thickness value.
In the above example, it is possible to realize the detection of the thickness of the wafers W during the transportation, thereby preventing the reduction of productivity, and the thickness value of the wafers W is obtained by averaging the heights H of arbitrary sections of the wafers W perpendicular to the transporting direction TD of the conveyor belt 10, which is more accurate than the thickness value obtained by measuring only the thickness of the wafer edge at present, reducing the possibility of transporting the wafers not meeting the requirements to the processing station TS.
In one example, referring to fig. 4, the conveyor belt 10 may include an upstream segment US2 and a downstream segment DS2, the removal device 30, schematically illustrated by a dashed box, is fixedly disposed between the upstream segment US2 and the downstream segment DS2 relative to the processing station TS, and the removal device 30 may include:
a plurality of first rollers 31, schematically illustrated by the areas filled by vertical hatching, and a plurality of second rollers 32, schematically illustrated by the areas filled by transverse hatching, wherein in figure 4 exemplarily 4 first rollers 31 and 4 second rollers 32 are illustrated,
wherein the plurality of first rollers 31 and the plurality of second rollers 32 are adapted to receive and support the silicon wafer W transferred from the upstream segment US2 in an alternating manner:
wherein the plurality of first rollers 31 are also used to transport the supported wafers W to the downstream segment DS2 by rotating about their longitudinal axes 31A, it being understood that the longitudinal axes 31A of the first rollers 31 are perpendicular to the conveying direction TD,
wherein the plurality of second rollers 32 are also adapted to transport the supported wafers W in a direction perpendicular to the transport direction TD by rotating about their longitudinal axes 32A, it being understood that the longitudinal axes 32A of the second rollers 32 are parallel to the transport direction TD.
It will be appreciated that the upstream segment US2 in the above example and the downstream segment DS1 in the previous example may be the same segment of the conveyor belt 10, but may of course be different segments.
In one example, the plurality of first rollers 31 and the plurality of second rollers 32 may be alternately brought to a position flush with the upstream segment US2 by being lifted and lowered, thereby achieving the receiving and supporting of the silicon wafers W transferred from the upstream segment US2 in an alternating manner.
In one example, referring to fig. 5 in conjunction with fig. 6, the conveyor belt 10 may include an upstream segment US3 and a downstream segment DS3 defining a gap G2, the detector 20 schematically illustrated by a dashed box being fixedly disposed relative to the processing station TS and including:
a clamp driving unit 221 as schematically shown by 4 circular rings of the outer periphery of the wafer W in fig. 5, the clamp driving unit 221 for clamping the wafer W and driving the wafer W to rotate about its central axis WA (shown in fig. 6) as shown by an arrow inside the wafer W in fig. 5 when the center O (as shown by a cross in fig. 5) of the wafer W is located between the upstream section US3 and the downstream section DS3 during the transfer of the wafer W by the transfer belt 10;
a first optical distance meter 222 disposed above the conveyor belt 10, the first optical distance meter 222 being in the shape of a rod and being positioned in the same vertical plane as the gap G2, the first optical distance meter 222 being for measuring a distance DU between itself and any point on a diameter of the upper surface of the silicon wafer W parallel to the gap G2 with the silicon wafer W being held, as schematically shown by a double-headed arrow above the silicon wafer W in fig. 6, it being understood that, with the silicon wafer W rotated, a distance between the first optical distance meter 222 and any point on any diameter of the upper surface of the silicon wafer W or any point in the entire upper surface can be measured;
a second optical distance meter 223 shown in fig. 6 disposed below the conveyor belt 10, the second optical distance meter 223 being rod-shaped and positioned in the same vertical plane as the gap G2, the second optical distance meter 223 being for measuring a distance DL between itself and any point on a diameter of the lower surface of the silicon wafer W parallel to the gap G2 through the gap G2 with the silicon wafer W being held, as schematically shown by a double-headed arrow below the silicon wafer W in fig. 6, it being understood that the distance between the second optical distance meter 223 and any point on any diameter of the lower surface of the silicon wafer W or any point in the entire lower surface can be measured with the silicon wafer W rotated;
a calculation unit 224 for calculating the thickness of the silicon wafer W at any point from the distance DU measured by the first optical distance meter 222 and the distance DL measured by the second optical distance meter 223, and for calculating the average value of the thicknesses at the any point as the thickness value.
It can be understood that: the upstream segment US3 in the above example and the upstream segment US1 in the preceding example may be the same segment of the conveyor belt 10, but may of course be different segments; the downstream segment DS3 in the above example may be the same segment of conveyor belt 10 as the downstream segment DS1 in the previous example, but may of course be a different segment; accordingly, the gap G2 in the above example may be the same gap as the gap G1 in the previous example, but may be a different gap.
In the above example, although the wafer W is clamped to interrupt the transfer, the thickness value of the wafer W is obtained by averaging the thicknesses of the wafers W at arbitrary points, and the accuracy of the thickness value thus obtained is further improved.
In one example, referring to fig. 7 in combination with fig. 8, the clamping driving unit 221 may include:
a plurality of rollers 2211, such as the 4 rollers exemplarily shown in fig. 7, each roller 2211 having a circumferentially extending groove 2211R, such as shown in fig. 8,
wherein the plurality of rollers 2211 are used to clamp the wafer W with the peripheral edge of the wafer W inserted into the recess 2211R;
wherein the plurality of rollers 2211 are further adapted to rotate the clamped wafer W about its central axis by rotating about its longitudinal axis 2211A (shown in fig. 8).
In one example, the plurality of rollers 2211 may be uniformly distributed along the circumferential direction of the wafer W while clamping the wafer W. Thus, the silicon wafer W is held more stably.
In one example, the widths of the gap G1 and the gap G2 may be less than 10% of the diameter of the wafer W. In this way, the silicon wafer can be transferred in a more stable manner.
In one example, the processing station TS may be a station for grinding the wafer W.
In one example, the wafer W may be a wafer subjected to grinding, and the processing station TS may be a station for cleaning and drying the wafer W.
It should be noted that: the technical schemes described in the embodiments of the present invention can be combined arbitrarily without conflict.
The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (10)
1. A system for sorting a silicon wafer, the system comprising:
the conveying belt is used for conveying a plurality of silicon wafers to the processing station;
a detector for detecting a thickness value of each silicon wafer being transferred;
a removing device arranged between the detector and the processing station, wherein the removing device is used for removing the silicon wafers with the thickness values which do not meet the requirements of the processing station from the conveyor belt in the process that the silicon wafers are conveyed.
2. The system of claim 1, wherein the conveyor belt includes an upstream segment and a downstream segment defining a gap, the detector being fixedly disposed relative to the processing station and comprising:
a light source for emitting a light beam parallel to the conveyor belt and passing through the gap;
a light screen opposed to the light source with respect to the conveyor belt such that the light beam impinges on the light screen, wherein the silicon wafer, when conveyed through the gap, obscures the light beam such that a dark region corresponding to the obscured portion of the light beam is formed on the light screen;
the sensing unit is used for acquiring the height of any section of the silicon wafer, which is vertical to the conveying direction of the conveying belt, according to the dark area;
a calculation unit for calculating an average value of the heights of the arbitrary cross sections as the thickness value.
3. The system of claim 1, wherein the conveyor belt includes an upstream segment and a downstream segment, the removal device is fixedly disposed between the upstream segment and the downstream segment relative to the processing station, and the removal device includes:
a plurality of first rollers and a plurality of second rollers,
wherein the first and second plurality of rollers are configured to receive and support the silicon wafers transferred from the upstream segment in an alternating manner:
wherein the first plurality of rollers are further adapted to transport the supported silicon wafer to the downstream segment by rotating about its longitudinal axis;
wherein the plurality of second rollers are further adapted to transport the supported silicon wafer in a direction perpendicular to the transport direction by rotating about its longitudinal axis.
4. The system of claim 3, wherein the first and second plurality of rollers are alternately brought to a position flush with the upstream segment by lifting.
5. The system of claim 1, wherein the conveyor belt includes an upstream segment and a downstream segment defining a gap, the detector being fixedly disposed relative to the processing station and comprising:
a clamping driving unit for clamping the silicon wafer and driving the silicon wafer to rotate around a central axis thereof when the center of the silicon wafer is located between the upstream section and the downstream section in the process that the silicon wafer is conveyed by the conveyor belt;
a first optical distance meter disposed above the conveyor belt, the first optical distance meter being rod-shaped and positioned in the same vertical plane as the gap, the first optical distance meter being for measuring a distance between itself and any point on a diameter parallel to the gap in the upper surface of the silicon wafer with the silicon wafer clamped;
a second optical distance meter disposed below the conveyor belt, the second optical distance meter being rod-shaped and positioned in the same vertical plane as the gap, the second optical distance meter being for measuring a distance between itself and any point on a diameter parallel to the gap in the lower surface of the silicon wafer through the gap with the silicon wafer clamped;
a calculation unit for calculating a thickness at an arbitrary point of the silicon wafer from the distance measured by the first optical distance meter and the distance measured by the second optical distance meter, and for calculating an average value of the thicknesses at the arbitrary point as the thickness value.
6. The system of claim 5, wherein the clamp drive unit comprises:
a plurality of rollers, each roller having a circumferentially extending groove,
wherein the rollers are used for clamping the silicon wafer under the condition that the periphery of the silicon wafer is inserted into the groove;
the rollers are also used for enabling the clamped silicon wafer to rotate around the central axis of the silicon wafer by rotating around the longitudinal axis of the silicon wafer.
7. The system of claim 6, wherein the plurality of rollers are evenly distributed along a circumference of the silicon wafer while clamping the silicon wafer.
8. The system of claim 2 or 5, wherein the gap has a width of less than 10% of the diameter of the silicon wafer.
9. The system of claim 1, wherein the processing station is a station for grinding a silicon wafer.
10. The system of claim 1, wherein the silicon wafer is a silicon wafer undergoing grinding, and the processing station is a station for cleaning and drying the silicon wafer.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111235997.5A CN113976467A (en) | 2021-10-22 | 2021-10-22 | System for be used for selecting separately silicon chip |
| TW111129814A TWI827192B (en) | 2021-10-22 | 2022-08-09 | A system for sorting silicon wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111235997.5A CN113976467A (en) | 2021-10-22 | 2021-10-22 | System for be used for selecting separately silicon chip |
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| Publication Number | Publication Date |
|---|---|
| CN113976467A true CN113976467A (en) | 2022-01-28 |
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| CN202111235997.5A Pending CN113976467A (en) | 2021-10-22 | 2021-10-22 | System for be used for selecting separately silicon chip |
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| TW (1) | TWI827192B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI827192B (en) | 2023-12-21 |
| TW202303794A (en) | 2023-01-16 |
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