CN117457563B - Silicon wafer positioning and feeding device and positioning and feeding method thereof - Google Patents
Silicon wafer positioning and feeding device and positioning and feeding method thereof Download PDFInfo
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- CN117457563B CN117457563B CN202311793971.1A CN202311793971A CN117457563B CN 117457563 B CN117457563 B CN 117457563B CN 202311793971 A CN202311793971 A CN 202311793971A CN 117457563 B CN117457563 B CN 117457563B
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 41
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 41
- 239000010703 silicon Substances 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 11
- 230000007246 mechanism Effects 0.000 claims abstract description 72
- 238000007665 sagging Methods 0.000 claims abstract description 4
- 235000012431 wafers Nutrition 0.000 claims description 33
- 230000009471 action Effects 0.000 claims description 8
- 230000005540 biological transmission Effects 0.000 claims description 6
- 230000000712 assembly Effects 0.000 claims description 2
- 238000000429 assembly Methods 0.000 claims description 2
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention belongs to the technical field of photovoltaic automation equipment, and discloses a silicon wafer positioning and feeding device and a positioning and feeding method thereof; silicon chip location loading attachment includes: a silicon wafer positioning mechanism; a suction mechanism; a lifting mechanism; and a tray. The invention also discloses a silicon wafer positioning and feeding method, which comprises the following steps: step 1), placing a silicon wafer on a positioning platform, and positioning the silicon wafer in a positioning disc by edge; step 2), the gantry sucker group on the suction mechanism descends to finish taking sheets; step 3), lifting the lifting mechanism, and firstly flattening the sagging part of the tray; the guiding and positioning pin on the lifting mechanism is lifted, and the guiding and positioning pin is inserted into the tray positioning pin hole in the tray; step 4), the lifting mechanism descends to put the sheet, and the sheet is put. The invention has low requirements on personnel and reduces the difficulty of machine adjustment.
Description
Technical Field
The invention relates to the technical field of photovoltaic automation equipment, in particular to a silicon wafer positioning and feeding device and a positioning and feeding method thereof.
Background
Because the photovoltaic PVD process has higher energy yield (16000 pcs/h) and higher precision requirement (the silicon wafer placement precision is +/-0.25 mm), the existing photovoltaic PVD silicon wafer is automatically fed, and a camera positioning tray is adopted for positioning in a mode of matching with an XY theta three-axis platform.
In the positioning mode, more cameras and the XY theta three-axis platform are required to be arranged, positioning accuracy is affected by the factors such as ambient light, dust and fragments of the cameras, the XY theta three-axis platform is required to correspondingly adjust three-axis point positions according to the positioning information of the cameras, so that the requirement of film placement accuracy is met, and the takt time is required to be longer; therefore, the PVD feeding equipment manufactured by the method has poor stability and difficult capacity improvement, and the requirements on the technical level of the personnel to be debugged are high and the difficulty of debugging is high because more cameras are used.
Disclosure of Invention
In order to solve the problems, the invention aims to provide a silicon wafer positioning and feeding device and a positioning and feeding method thereof, which are guided by a mechanical positioning pin and matched with a mechanical floating mechanism to achieve the purpose of high-precision wafer placement, and solve the problems in the prior art.
The technical scheme of the invention is as follows:
silicon chip location loading attachment includes: the silicon wafer positioning mechanism comprises a positioning platform, wherein a plurality of platform positioning components and gantry positioning pins arranged on the positioning platform are arranged on the positioning platform; the suction mechanism comprises a cross beam, and a moving mechanism is arranged on the cross beam; the moving mechanism is provided with a connecting frame, and a plurality of groups of sucking action units are arranged at the lower part of the connecting frame; the suction action unit comprises a state switching cylinder arranged on the connecting frame, the lower part of the state switching cylinder is in transmission connection with a plurality of guide shaft sleeves, the lower ends of all the guide shaft sleeves are connected with a first mechanical floating mechanism, and the lower end of the first mechanical floating mechanism is connected with a gantry sucker group; the lifting mechanism comprises a lifting base, and two lifting frames are symmetrically arranged on the lifting base; each lifting frame is provided with a lifting shaft; the upper ends of the two lifting shafts are connected with lifting seats together, and a plurality of groups of lifting positioning assemblies are arranged on the lifting seats; the lifting positioning assembly comprises a plurality of lifting cylinders arranged on the lifting seat, all the lifting cylinders are connected with a lifting platform together, a plurality of second mechanical floating mechanisms are arranged on the lifting platform, one second mechanical floating mechanism is connected with a tray supporting plate, and a guiding positioning pin is arranged on the tray supporting plate; the tray is arranged above the lifting base and is used for placing the silicon wafers; the tray is provided with a plurality of tray positioning pin holes.
According to a further improved technical scheme, the platform positioning assembly comprises a transverse positioning assembly and a vertical positioning assembly, a positioning disc is arranged at the position between the transverse positioning assembly and the vertical positioning assembly, and a silicon wafer is placed in the positioning disc.
According to a further improved technical scheme, the transverse positioning assembly comprises transverse positioning plates arranged on the upper side and the lower side of the positioning plate; the transverse positioning plate is provided with a plurality of transverse positioning shafts; two ends of the transverse positioning plate are respectively provided with a protection rubber cushion; the vertical positioning assembly comprises vertical positioning plates arranged on the left side and the right side of the positioning plate, and a plurality of vertical positioning shafts are arranged on the vertical positioning plates.
According to a further improved technical scheme, the moving mechanism comprises a moving seat arranged on the cross beam, a moving motor is arranged on the moving seat, the moving motor is connected with a moving wheel in a transmission mode, and the moving wheel drives the cross beam to move the moving seat.
According to a further improved technical scheme, the structures of the first mechanical floating mechanism on the guide shaft sleeve and the second mechanical floating mechanism on the lifting platform are the same; the first mechanical floating mechanism comprises a floating connecting plate, a plurality of mounting holes are formed in the floating connecting plate, and an elastic piece is arranged on each mounting hole.
The invention provides a silicon wafer positioning and feeding method, which comprises the following steps of:
step 1), placing a silicon wafer on a positioning platform, and positioning the silicon wafer in a positioning disc by edge;
step 2), the gantry sucker group on the suction mechanism descends, and the sheet taking is completed through the cooperation of the gantry positioning pin, the guide shaft sleeve and the first mechanical floating mechanism;
step 3), lifting the lifting mechanism, and firstly flattening the sagging part of the tray; the guiding and positioning pin on the lifting mechanism is lifted, and the guiding and positioning pin is inserted into the tray positioning pin hole in the tray;
step 4), the lifting mechanism descends to put the sheet, and the sheet is put through the cooperation of the guide locating pin, the guide shaft sleeve and the second mechanical floating mechanism.
Compared with the prior art, the invention has the beneficial effects that:
according to the invention, the purpose of high-precision sheet placement is achieved by adopting the mechanical positioning pin for guiding and matching with the mechanical floating mechanism, camera positioning is not needed, the stability and the production efficiency of sheet placement are improved, the technical level requirements on debugging personnel are not high, and the machine adjustment difficulty is greatly reduced.
According to the invention, a mode of a plurality of subareas is adopted, each subarea can be respectively fed, and a plurality of subareas can be fed at one time by the design, so that the productivity of equipment is improved.
Drawings
The invention is described in further detail below with reference to the attached drawings and detailed description:
FIG. 1 is a schematic side view of a silicon wafer positioning mechanism of the present invention.
FIG. 2 is a schematic top view of the silicon wafer positioning mechanism of the present invention.
FIG. 3 is a schematic view of a stage positioning assembly according to the present invention.
Fig. 4 is a schematic structural view of the suction mechanism of the present invention.
Fig. 5 is a schematic structural view of the lifting mechanism of the present invention.
Fig. 6 is a schematic structural view of the tray of the present invention.
Fig. 7 is a schematic structural view of a tray positioning pin hole on a tray according to the present invention.
In the figure, 1, a gantry positioning pin; 2. a platform positioning assembly; 3. positioning a platform; 4. a vertical positioning plate; 5. a vertical positioning shaft; 6. protecting the rubber cushion; 7. a transverse positioning shaft; 8. a transverse positioning plate; 21. a state switching cylinder; 22. a first mechanical float mechanism; 23. a guide sleeve; 24. a gantry suction cup group; 31. a lifting shaft; 32. a second mechanical float mechanism; 33. a lifting cylinder; 34. a guide positioning pin; 35. a tray support plate; 41. tray registration pin holes.
Detailed Description
Further advantages and effects of the present invention will become apparent to those skilled in the art from the disclosure of the present invention, which is described by the following specific examples.
Please refer to fig. 1-7. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the invention to the extent that it can be practiced, since modifications, changes in the proportions, or otherwise, used in the practice of the invention, are not intended to be critical to the essential characteristics of the invention, but are intended to fall within the spirit and scope of the invention. Also, the terms such as "upper," "lower," "left," "right," "middle," and "a" and the like recited in the present specification are merely for descriptive purposes and are not intended to limit the scope of the invention, but are intended to provide relative positional changes or modifications without materially altering the technical context in which the invention may be practiced.
Example 1
As shown in fig. 1-7, the embodiment discloses a silicon wafer positioning and feeding device, which comprises a silicon wafer positioning mechanism, a suction mechanism, a lifting mechanism and a tray.
Specifically, the silicon wafer positioning mechanism comprises a positioning platform 3, wherein a plurality of platform positioning components 2 and gantry positioning pins 1 arranged on the positioning platform 3 are arranged on the positioning platform 3. The platform positioning assembly 2 comprises a transverse positioning assembly and a vertical positioning assembly, a positioning disc is arranged at the position between the transverse positioning assembly and the vertical positioning assembly, and a silicon wafer is placed in the positioning disc. The transverse positioning assembly comprises transverse positioning plates 8 arranged on the upper side and the lower side of the positioning plate, a plurality of transverse positioning shafts 7 are arranged on the transverse positioning plates 8, and protection rubber mats 6 are respectively arranged at two ends of the transverse positioning plates 8. The vertical positioning assembly comprises vertical positioning plates 4 arranged on the left side and the right side of the positioning plate, and a plurality of vertical positioning shafts 5 are arranged on the vertical positioning plates 4.
The suction mechanism comprises a cross beam, a moving mechanism is arranged on the cross beam, a connecting frame is arranged on the moving mechanism, and a plurality of groups of suction action units are arranged at the lower part of the connecting frame. The moving mechanism comprises a moving seat arranged on the cross beam, a moving motor is arranged on the moving seat, the moving motor is connected with a moving wheel in a transmission manner, and the moving wheel drives the cross beam to move so as to realize the movement of the moving seat. The suction action unit comprises a state switching cylinder 21 arranged on the connecting frame, a plurality of guide shaft sleeves 23 are connected to the lower part of the state switching cylinder 21 in a transmission way, a first mechanical floating mechanism 22 is connected to the lower ends of all the guide shaft sleeves 23, and a gantry sucker group 24 is connected to the lower end of the first mechanical floating mechanism 22. The first mechanical floating mechanism 22 comprises a floating connection plate, a plurality of mounting holes are formed in the floating connection plate, and an elastic piece is arranged on each mounting hole.
The lifting mechanism comprises a lifting base, two lifting frames are symmetrically arranged on the lifting base, and each lifting frame is provided with a lifting shaft 31. The upper ends of the two lifting shafts 31 are connected with lifting seats together, and a plurality of groups of lifting positioning components are arranged on the lifting seats. The second mechanical floating mechanism comprises a floating connecting plate, a plurality of mounting holes are formed in the floating connecting plate, and an elastic piece is arranged on each mounting hole. The lifting positioning assembly comprises a plurality of lifting cylinders 33 arranged on a lifting seat, all the lifting cylinders 33 are connected with a lifting platform together, a plurality of second mechanical floating mechanisms 32 are arranged on the lifting platform, a second mechanical floating machine is connected with a tray supporting plate 35, and guide positioning pins 34 are arranged on the tray supporting plate 35.
The tray is arranged above the lifting movable seat and is used for placing the silicon wafers. The tray is provided with a plurality of tray registration pin holes 41.
According to the invention, the purpose of high-precision sheet placement is achieved by adopting the mechanical positioning pin for guiding and matching with the mechanical floating mechanism, camera positioning is not needed, the stability and the production efficiency of sheet placement are improved, the technical level requirements on debugging personnel are not high, and the machine adjustment difficulty is greatly reduced.
According to the invention, a mode of a plurality of subareas is adopted, each subarea can be respectively fed, and a plurality of subareas can be fed at one time by the design, so that the productivity of equipment is improved.
Example 2
The invention provides a silicon wafer positioning and feeding method, which comprises the following steps of:
the first step: after the original gantry descends to a certain height, the state switching cylinder acts, the gantry suction disc group is switched to a floating state by the action of the first mechanical floating mechanism and descends continuously, and the gantry suction disc group and the guide shaft sleeve are contacted with each other through the guide inclined surface of the guide shaft sleeve. In addition, the silicon wafer is positioned by the transverse positioning assembly and the vertical positioning assembly, so that errors caused by self tolerance of the silicon wafer are eliminated.
And a second step of: after the gantry suction sheet is lifted to the guide shaft sleeve and is separated from the gantry guide pin, the state switching cylinder acts, so that the gantry suction disc group is switched to a fixed state, and then the suction mechanism integrally moves transversely to the sheet placing position.
And a third step of: lifting cylinder, lift platform and direction locating pin rise, prop flat back with tray sagging portion by the tray backup pad, it is ejecting with the direction locating pin to act by lifting cylinder, owing to second machinery floating mechanism exists, and the direction locating pin is ejecting can insert in the tray locating pin hole smoothly, ensures that the locating pin is located the position accurate.
Fourth step: after the gantry in the first step descends to a certain height, the state switching cylinder acts, the gantry sucker group is switched to a floating state by the action of the first mechanical floating mechanism and descends continuously, the gantry sucker group is contacted with the guide locating pin through the guide slope of the guide shaft sleeve, and the gantry sucker group and the guide shaft sleeve are in a floating state and can descend smoothly, and the guide locating pin is inserted into the guide shaft sleeve to place the gantry sucker group into a sheet, so that the sheet placing position is ensured to be accurate.
Fifth step: after the gantry suction piece rises to the position that the guide shaft sleeve is separated from the guide positioning pin, the state switching cylinder acts to switch the gantry suction disc group to a fixed state, and then the gantry transversely moves to the piece taking position for the next cycle.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.
Claims (6)
1. Silicon chip location loading attachment, its characterized in that includes:
the silicon wafer positioning mechanism comprises a positioning platform (3), wherein a plurality of platform positioning components (2) and a gantry positioning pin (1) arranged on the positioning platform (3) are arranged on the positioning platform (3);
the suction mechanism comprises a cross beam, and a moving mechanism is arranged on the cross beam; the moving mechanism is provided with a connecting frame, and a plurality of groups of sucking action units are arranged at the lower part of the connecting frame; the suction action unit comprises a state switching cylinder (21) arranged on the connecting frame, a plurality of guide shaft sleeves (23) are connected to the lower part of the state switching cylinder (21) in a transmission way, a first mechanical floating mechanism (22) is connected to the lower ends of all the guide shaft sleeves (23), and a gantry sucker group (24) is connected to the lower end of the first mechanical floating mechanism (22);
the lifting mechanism comprises a lifting base, and two lifting frames are symmetrically arranged on the lifting base; each lifting frame is provided with a lifting shaft (31); the upper ends of the two lifting shafts (31) are connected with lifting seats together, and a plurality of groups of lifting positioning assemblies are arranged on the lifting seats; the lifting positioning assembly comprises a plurality of lifting cylinders (33) arranged on the lifting seat, all the lifting cylinders (33) are connected with a lifting platform together, a plurality of second mechanical floating mechanisms (32) are arranged on the lifting platform, one second mechanical floating mechanism (32) is connected with a tray supporting plate (35), and a guiding positioning pin (34) is arranged on the tray supporting plate (35);
the tray is arranged above the lifting base and is used for placing the silicon wafers; the tray is provided with a plurality of tray positioning pin holes (41).
2. The silicon wafer positioning and feeding device according to claim 1, wherein the platform positioning assembly (2) comprises a transverse positioning assembly and a vertical positioning assembly, a positioning disc is arranged at a position between the transverse positioning assembly and the vertical positioning assembly, and a silicon wafer is placed in the positioning disc.
3. A silicon wafer positioning and feeding device according to claim 2, wherein the transverse positioning assembly comprises transverse positioning plates (8) arranged on the upper side and the lower side of the positioning plate;
a plurality of transverse positioning shafts (7) are arranged on the transverse positioning plate (8); the two ends of the transverse positioning plate (8) are respectively provided with a protection rubber cushion (6);
the vertical positioning assembly comprises vertical positioning plates (4) arranged on the left side and the right side of the positioning plate, and a plurality of vertical positioning shafts (5) are arranged on the vertical positioning plates (4).
4. A silicon wafer positioning and feeding device according to claim 3, wherein the moving mechanism comprises a moving seat arranged on the cross beam, a moving motor is arranged on the moving seat, the moving motor is in transmission connection with a moving wheel, and the moving wheel drives the cross beam to move the moving seat.
5. A silicon wafer positioning and feeding device according to claim 4, wherein the first mechanical floating mechanism (22) on the guide sleeve (23) and the second mechanical floating mechanism (32) on the lifting platform are identical in structure; the first mechanical floating mechanism (22) comprises a floating connecting plate, a plurality of mounting holes are formed in the floating connecting plate, and an elastic piece is arranged on each mounting hole.
6. A silicon wafer positioning and feeding method, which is characterized by using the silicon wafer positioning and feeding device according to any one of claims 1-5, and comprising the following steps:
step 1), placing a silicon wafer on a positioning platform, and positioning the silicon wafer in a positioning disc by edge;
step 2), the gantry sucker group on the suction mechanism descends, and the sheet taking is completed through the cooperation of the gantry positioning pin, the guide shaft sleeve and the first mechanical floating mechanism;
step 3), lifting the lifting mechanism, and firstly flattening the sagging part of the tray; the guiding and positioning pin on the lifting mechanism is lifted, and the guiding and positioning pin is inserted into the tray positioning pin hole in the tray;
step 4), the lifting mechanism descends to put the sheet, and the sheet is put through the cooperation of the guide locating pin, the guide shaft sleeve and the second mechanical floating mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311793971.1A CN117457563B (en) | 2023-12-25 | 2023-12-25 | Silicon wafer positioning and feeding device and positioning and feeding method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311793971.1A CN117457563B (en) | 2023-12-25 | 2023-12-25 | Silicon wafer positioning and feeding device and positioning and feeding method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN117457563A CN117457563A (en) | 2024-01-26 |
| CN117457563B true CN117457563B (en) | 2024-04-02 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311793971.1A Active CN117457563B (en) | 2023-12-25 | 2023-12-25 | Silicon wafer positioning and feeding device and positioning and feeding method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN117457563B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201435403Y (en) * | 2009-06-22 | 2010-03-31 | 武汉帝尔激光科技有限公司 | Automatic solar silicon wafer loading device |
| CN206116369U (en) * | 2016-10-20 | 2017-04-19 | 上海客辉自动化设备有限公司 | Piece positioning system is arranged to CV line of battery silicon chip |
| CN209471985U (en) * | 2018-12-27 | 2019-10-08 | 广东启天自动化智能装备股份有限公司 | A kind of monocrystalline making herbs into wool feeder |
| WO2022116514A1 (en) * | 2020-12-04 | 2022-06-09 | 苏州天准科技股份有限公司 | Intelligent silicon wafer sorting machine |
| CN114701084A (en) * | 2022-02-22 | 2022-07-05 | 福州天瑞线锯科技有限公司 | Turnover type sheet taking and cutting machine |
-
2023
- 2023-12-25 CN CN202311793971.1A patent/CN117457563B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201435403Y (en) * | 2009-06-22 | 2010-03-31 | 武汉帝尔激光科技有限公司 | Automatic solar silicon wafer loading device |
| CN206116369U (en) * | 2016-10-20 | 2017-04-19 | 上海客辉自动化设备有限公司 | Piece positioning system is arranged to CV line of battery silicon chip |
| CN209471985U (en) * | 2018-12-27 | 2019-10-08 | 广东启天自动化智能装备股份有限公司 | A kind of monocrystalline making herbs into wool feeder |
| WO2022116514A1 (en) * | 2020-12-04 | 2022-06-09 | 苏州天准科技股份有限公司 | Intelligent silicon wafer sorting machine |
| CN114701084A (en) * | 2022-02-22 | 2022-07-05 | 福州天瑞线锯科技有限公司 | Turnover type sheet taking and cutting machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117457563A (en) | 2024-01-26 |
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