CN114701084A - Turnover type sheet taking and cutting machine - Google Patents
Turnover type sheet taking and cutting machine Download PDFInfo
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- CN114701084A CN114701084A CN202210162435.0A CN202210162435A CN114701084A CN 114701084 A CN114701084 A CN 114701084A CN 202210162435 A CN202210162435 A CN 202210162435A CN 114701084 A CN114701084 A CN 114701084A
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- lifting
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- sucking disc
- cutting
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- 238000005520 cutting process Methods 0.000 title claims abstract description 72
- 230000007306 turnover Effects 0.000 title claims abstract description 12
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 102
- 239000010703 silicon Substances 0.000 claims abstract description 102
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 101
- 230000007246 mechanism Effects 0.000 claims abstract description 96
- 239000000463 material Substances 0.000 claims abstract description 50
- 239000003921 oil Substances 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 description 9
- 238000013461 design Methods 0.000 description 8
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- 239000013078 crystal Substances 0.000 description 4
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- 230000003028 elevating effect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 208000019300 CLIPPERS Diseases 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
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- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 208000021930 chronic lymphocytic inflammation with pontine perivascular enhancement responsive to steroids Diseases 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
Abstract
The invention relates to a turnover type slice taking and cutting machine which comprises a material loading platform for bearing a silicon rod, a cutting mechanism, a slice taking mechanism positioned above the material loading platform and a moving mechanism positioned below the material loading platform and capable of lifting and driving the silicon rod to move, wherein the material loading platform is used for loading the silicon rod; the silicon rod picking mechanism comprises a mounting frame and a sucker for sucking the silicon rod, and the mounting frame is provided with a silicon rod picking lifting device for driving the sucker to move up and down and a rotating device for driving the sucker to rotate in the opposite direction; the silicon rod lifting device comprises a lifting mechanism, a rotating device and a lifting device, wherein the rotating device and the lifting device are arranged on the upper surface of a material carrying platform, the rotating device and the lifting device are arranged on the inner side of a mounting frame, the rotating device and the lifting device are arranged in the vertical direction of the material carrying platform, the material carrying platform is arranged on the inner side of the mounting frame, the rotating device and the lifting device are arranged on the inner side of the mounting frame, the space is saved, the silicon rod is prevented from being damaged by a cutter in the horizontal range, and the silicon rod can be efficiently moved by the aid of the moving mechanism.
Description
Technical Field
The invention relates to the technical field of crystalline silicon processing equipment, in particular to a turnover type slice taking and cutting machine.
Background
The monocrystalline silicon rod body needs to be cut off through cutting equipment in the output process to form the thickness to be processed, the monocrystalline silicon rod body needs to be conveyed on a cutting table board through a conveying device, and a silicon rod or silicon wafer output on one side in the existing structure needs to be designed to be a wafer taking mechanism, so that the occupied space is large. During operation, operators easily collide with surrounding personnel, and the silicon rods are conveyed on the table top of the cutting mechanism through the conveying device in the prior art, and the silicon rods cannot be conveyed well in different lengths, sizes and types due to the fact that the silicon rods are conveyed by the single lifting conveying component in the prior art.
Disclosure of Invention
The invention provides a turnover type sheet taking and cutting machine, which aims to solve the technical problem that a supporting wheel or a silicon rod is damaged due to high-position impact easily occurring in feeding overshoot of the silicon rod.
The technical scheme of the invention is as follows: the turnover type slice taking and cutting machine comprises a material loading platform for bearing a silicon rod and a cutting mechanism positioned above the material loading platform, and is characterized by further comprising a slice taking mechanism positioned above the material loading platform and a moving mechanism positioned below the material loading platform and capable of lifting and driving the silicon rod to move;
the silicon rod taking mechanism comprises a silicon rod conveying mechanism, a silicon rod taking mechanism and a silicon rod conveying mechanism, wherein the silicon rod conveying mechanism is arranged on the silicon rod conveying mechanism, the silicon rod taking mechanism comprises a mounting rack which is arranged above a material carrying platform and can move along the output direction of the silicon rod, a sucking disc used for sucking the silicon rod is arranged below the mounting rack, and a silicon rod taking lifting device and a rotating device which drive the sucking disc to move up and down and a rotating device which drive the sucking disc to rotate in the opposite direction are arranged on the mounting rack;
the moving mechanism comprises a moving seat and a bracket arranged above the moving seat and driven to lift by a jacking driving device, and the upper surface of the bracket is provided with a lifting surface which inclines downwards from two sides to the center.
Preferably, the bracket comprises a main supporting block and an auxiliary supporting block, the jacking driving device comprises a main lifting mechanism for driving the main supporting block to lift and an auxiliary lifting mechanism for driving the auxiliary supporting block to lift, and the top of the main supporting block and the top of the auxiliary supporting block are different from the lifting area of the rod-shaped object.
Preferably, a lifting seat is fixed at the telescopic end of the sheet taking lifting device, the rotating device is fixed in the lifting seat, and the rotating end of the rotating device is fixedly connected with the sucker assembly.
Preferably, the sucking disc subassembly includes sucking disc cylinder and sucking disc seat, the flexible end and the sucking disc fixed connection of sucking disc cylinder, the sucking disc seat is provided with the through-hole that stretches out for the sucking disc, the sucking disc nestification is in the through-hole of sucking disc seat, and sucking disc figure has more than two, still is provided with the sensor that is used for detecting distance on the sucking disc seat.
Preferably, the film taking lifting device is an air cylinder, an oil cylinder or an electric cylinder, and the rotating device is a rotating air cylinder or a motor.
Preferably, the material loading platform side part is fixed with a mounting rack guide rail, a mounting rack slider capable of being matched with the mounting rack guide rail is fixed on the mounting rack, the material loading platform side part is provided with a mounting rack parallel to the guide rail, the lower part of the mounting rack is fixed with a driving motor, and the output end of the driving motor is fixed with a driving gear meshed with the mounting rack.
Preferably, the middle part of the material loading platform is provided with a channel along the length direction for the bracket to extend out, a base is arranged below the material loading platform, the moving seat is positioned below the middle part of the channel, the lower part of the moving seat is fixedly connected with a moving sliding block, a convex rail is fixed on the base, and the lower part of the moving sliding block is in sliding fit with the convex rail;
the lower part of the moving seat is fixedly provided with a moving motor serving as a moving driving device, the output end of the moving motor is fixedly provided with a driving gear, and the base is fixedly provided with a rack which is meshed with the gear and is parallel to the convex rail.
The flip-type film-taking and cutting machine as claimed in claim 7, wherein the material-carrying platform is fixed with conveying pulleys arranged in pairs for carrying silicon rods, the conveying pulleys are arranged obliquely, the material-carrying platform is provided with a material-receiving hopper at the output end of the silicon rods, and the two ends of the material-receiving hopper are provided with concave arc-shaped notches.
Preferably, the main lifting mechanism is fixedly connected with the upper surface of the movable seat, the auxiliary lifting mechanism is fixedly connected with the telescopic end of the main lifting mechanism, the main supporting block and the auxiliary supporting block comprise a pair of supporting blocks, and the top surfaces of the pair of supporting blocks form a supporting surface by inclined planes which incline downwards from two sides to the center.
Preferably, the cutting mechanism comprises a portal frame fixed above the material loading platform, a linear cutting mechanism driven by the cutting lifting device to move downwards is arranged in the portal frame, and the linear cutting mechanism comprises a rotating cutting disc and a cutting line wound on the cutting disc.
Compared with the prior art, the invention has the following beneficial effects:
(1) according to the invention, the sucker is designed at the inner side of the mounting frame, the rotating device and the lifting device can be arranged in the vertical direction of the material carrying platform, so that the space is saved, and the personnel in the transverse range are prevented from being damaged by the cutting machine.
(2) The sucking disc auxiliary cutting machine is designed to assist the cutting machine in cutting the silicon rod and transferring the silicon chip or the cut silicon rod, so that the cutting stability of the silicon rod can be improved, the transferring efficiency can be improved, the manpower is reduced, the operation environment is improved, and the safety of the silicon chip or the silicon rod is guaranteed.
(3) According to the silicon rod lifting device, the silicon rods with different lengths or different diameters are stably lifted and output by utilizing the dual functions of the main lifting mechanism and the auxiliary lifting mechanism.
(4) The silicon rod can be better supported by the supporting block by adopting the lifting surfaces which incline downwards from two sides to the center.
Drawings
FIG. 1 is a schematic overall perspective view of an embodiment of the present invention;
FIG. 2 is a schematic perspective view of a sheet taking mechanism according to an embodiment of the present invention;
FIG. 3 is a schematic structural view of a mounting frame of the sheet taking mechanism of the present invention;
FIG. 4 is a schematic view of the elevating seat and the sucking disc seat of the sheet taking mechanism of the present invention;
FIG. 5 is a structural view illustrating the suction cup holder of FIG. 4 in a state of being turned 180 degrees;
FIG. 6 is a schematic side view of the sheet taking mechanism according to the present invention;
FIG. 7 is a perspective view of the cutting device of the present invention;
FIG. 8 is a schematic view of the overall structure of an embodiment of the moving mechanism of the present invention;
FIG. 9 is a schematic diagram of the lifting state of the auxiliary lifting mechanism of the moving mechanism according to the present invention;
FIG. 10 is a side view of the moving mechanism of the present invention;
fig. 11 is a schematic view of the receiving hopper of the present invention.
In the figure: 100-silicon rod, 10-material loading platform, 101-pulley, 102-channel, 103-base, 110-guide rail, 120-mounting rack, 121-driving gear, 20-mounting rack, 210-vertical support, 211-mounting rack slider, 220-crossbeam, 230-driving motor, 231-gear, 30-sucker, 310-sucker cylinder, 320-sucker seat, 40-chip taking lifting device, 410-lifting seat and 420-rotating device;
50-a cutting device; 510-gantry, 520-cutting disc, 521-cutting line;
60-moving seat, 610-sliding block, 611-convex rail, 620-moving motor, 621-driving gear, 630-cavity, 70-main supporting block, 710-main lifting mechanism, 701-supporting block, 702-lifting surface, 711-transverse fixing plate, 712-vertical plate, 80-auxiliary supporting block, 810-auxiliary lifting mechanism, 90-receiving hopper and 910-arc-shaped notch.
Detailed Description
The invention is described in detail below with reference to the figures and the specific embodiments.
Referring to fig. 1-5, the turnover type slice taking and cutting machine comprises a material loading platform 10 for loading silicon rods, wherein a cutting device 50 is arranged above the material loading platform 10, and a slice taking mechanism is arranged above the material loading platform and positioned above the cutting device 50 and faces towards the direction of material output;
in the embodiment, in order to realize the movement of the silicon rods on the material loading platform, in the above embodiment of the present invention, the material loading platform is fixed with the conveying pulleys 101 arranged in pairs, and the conveying pulleys 101 are obliquely arranged to facilitate the carrying and movement of the silicon rods.
Get piece mechanism including carrying material platform top have can follow the mounting bracket 20 that carries the material platform and remove, the mounting bracket below is equipped with the sucking disc 30 that is used for adsorbing the silicon rod with the negative pressure device intercommunication, it gets piece elevating gear 40 and the rotatory rotating device 420 towards of drive sucking disc to have the drive sucking disc to reciprocate on the mounting bracket.
In this embodiment, mounting bracket 20 includes that a pair of branch locates the vertical support piece 210 of carrying the material platform both sides, and the top between a pair of vertical support piece is fixed with crossbeam 220, and the mounting bracket that adopts the portal frame form can set up rotating device and get piece elevating gear in the vertical of carrying the material platform, has practiced thrift the space, avoids mounting bracket intercommunication sucking disc to cause the damage to the personnel of horizontal scope at the in-process of transporting.
In this embodiment, the telescopic end of the lifting driving device is fixed with a lifting seat 410, the rotating device 420 is fixed in the lifting seat, and the rotating end of the rotating device is fixedly connected with the suction cup assembly.
The mechanism adsorbs the auxiliary cutting machine at the end part of the silicon rod through the sucking disc to cut the silicon rod, realizes the transportation of the silicon wafer, can improve the stability and the precision of the silicon rod cutting process, improves the transportation efficiency, reduces the manpower, improves the operation environment and ensures the safety of the silicon wafer.
In an embodiment of the present invention, the suction cup assembly includes a suction cup cylinder 310 and a suction cup holder 320, the telescopic end of the suction cup cylinder 310 is fixedly connected to the suction cup 30, the suction cup holder 320 is provided with a through hole for the suction cup to extend out, the suction cup is nested in the through hole of the suction cup holder, the suction cup cylinder 310 and the suction cup holder 320 are fixed to the rotating end of the rotating device 420, the suction cup holder and the suction cup can be driven to advance and retract by the telescopic action of the suction cup cylinder 310, so as to control the distance between the suction cup and the silicon rod more accurately, and prevent the silicon rod from being damaged by direct contact with the suction cup.
In this embodiment, the lifting driving device 40 is a lifting cylinder, and the rotating device 420 is a revolving cylinder.
In the actual design, lift cylinder, sucking disc cylinder also can be replaced by linear drive structures such as hydro-cylinder, linear electric motor, the gyration cylinder can choose for use servo motor or rack drive gear's mode design, in this embodiment, rotating device at least rotation angle can reach more than 180.
In an embodiment of the invention, the number of the suckers is more than two, 4 in the figure, the suckers are uniformly arranged along the sucker seat along the circumferential direction, and the suction force required by fixing the silicon wafer is dispersed to the suckers by a single sucker through arranging a plurality of material fixing suckers, so that uniform stress is conveniently applied to the sample wafer, the problem that the silicon wafer is cracked due to overlarge central negative pressure suction force of the single sucker, or the sample wafer cannot be fixed due to failure of the single sucker is avoided, or the suction force and the fixed position of the material fixing sucker are conveniently adapted when the sample wafers with different sizes and weights need to be loaded is solved.
Still be provided with the sensor that is used for the detection distance on the sucking disc seat, the sensor can design between adjacent sucking disc to avoid producing with the sucking disc position and interfering, can guarantee the control to sucking disc seat 320 and silicon rod tip in the absorption process through the even array overall arrangement of sucking disc, the sensor can select for use commercially available infrared formula or laser type.
In one embodiment of the invention, a guide rail 110 is fixed on the side of the loading platform, a slide block 211 capable of cooperating with the guide rail 110 is fixed on the mounting frame 20, and the mounting frame is driven by a walking driving mechanism to move along the conveying direction of the bars on the loading platform.
In this embodiment, the side of the loading platform is provided with a mounting rack 120 parallel to the guide rail 110, the traveling driving mechanism includes a driving motor 230 fixed on the lower portion of the mounting rack 20, and a gear 231 engaged with the mounting rack 120 is fixed on the output end of the driving motor.
When driving motor during operation, thereby drive gear 231 and the meshing of rack 120 drive the rack and the guide rail removal of mounting bracket along parallel arrangement, generally, the guide rail be parallel with rack and ground, the removal of removal frame can satisfy the sucking disc and carry out long distance displacement fast to do benefit to being close to of silicon rod and the collection of silicon chip.
In this embodiment, the cutting device 50 is a linear cutting device according to the principle, the cutting device 50 includes a portal frame 510 fixed above the material loading platform, a linear cutting mechanism driven by a cutting lifting device to move downwards is arranged in the portal frame, the linear cutting mechanism includes a rotating cutting disc and a cutting line 521 wound on the cutting disc 520, in this embodiment, the cutting lifting device is an oil cylinder, the cutting lifting device is used to drive the cutting mechanism to move up and down integrally, and the cutting disc drives the cutting line 521 to move at high speed, so that the silicon rod 100 on the material loading platform below is cut off.
In order to facilitate the conveying of the silicon rods, a moving mechanism which is positioned below the material loading platform and can lift and drive the silicon rods to move is arranged;
the invention is described in detail below with reference to the figures and specific embodiments.
Referring to fig. 6-11, the moving mechanism includes a moving base 60 and a main supporting block 70 located above the moving base 60 for supporting the rod-shaped objects, the main supporting block is driven by a main lifting mechanism 710 to lift, at least one auxiliary lifting mechanism 810 is further disposed beside the main lifting mechanism, an auxiliary supporting block 80 is fixed to a telescopic end of the auxiliary lifting mechanism, and the upper surfaces of the main supporting block and the auxiliary supporting block have lifting surfaces which incline downwards from two sides to the center.
In this embodiment, the auxiliary lifting mechanism 810 is fixedly connected to the telescopic end of the main lifting mechanism 710, and in practical design, the auxiliary lifting mechanism 810 may be separately fixed to the movable base 60 for independent control.
In this embodiment, the lifting areas of the tops of the main support block and the auxiliary support block, which can be in contact with the rod-shaped object, are different, so that the working form change of the single main support block, the single auxiliary support block, a part of the auxiliary support blocks or the common contact between the main support block and the auxiliary support block and the outer circumferential surface of the crystal bar can be realized as required, and further, the change of the contact area with the silicon rod can be realized.
In this embodiment, the mechanism is operated to lift the silicon rod by the main support block or the auxiliary support block so that the silicon rod moves synchronously with the moving seat and the logistics of the silicon rod are transferred.
The main supporting block and the auxiliary supporting block are different in length along the moving direction of the moving seat, namely the main supporting block and the auxiliary supporting block are different in contact length with the outer circumferential surface line of the crystal bar, and are lifted by utilizing independent lifting mechanisms, at least two groups of lifting mechanisms are simultaneously jacked when a longer bar is transported, and only one group of supporting jacking mechanisms is required to jack a shorter silicon bar when the shorter silicon bar is transported, so that the effect of horizontally and stably transporting the crystal bars with different lengths is achieved;
in practical design, the size of the auxiliary supporting block or the main supporting block can be changed to adapt to the transportation of the silicon rod which does not pass through the diameter or the shape.
In one embodiment of the present invention, the main and sub-pallets include a pair of pallets 701, the top surfaces of which are inclined downward from both sides to the center to form lifting surfaces 702.
The inclined planes which incline downwards from two sides to the center are used as the lifting planes 702, so that the centering and the stability of the silicon rod can be ensured.
In one embodiment of the present invention, the main lifting mechanism 710 and the sub lifting mechanism 810 are air cylinders, a horizontal fixing plate 711 is fixedly connected to an expansion end of the main lifting mechanism 710, a vertical plate 712 is fixed to the horizontal fixing plate, and the sub lifting mechanism 810 is fixed to the vertical plate 712.
In this embodiment, the length of the main supporting block is smaller than that of the auxiliary supporting block, during operation, the telescopic end of the main lifting mechanism 710 drives the main supporting block 70 and the auxiliary lifting mechanism 810 to move upwards, when the silicon rod is long, the auxiliary lifting mechanism 310 drives the auxiliary supporting block 80 to move upwards to the same height as the main supporting block 70 to support the silicon rod, and if the silicon rod is long, the auxiliary lifting mechanism 810 can be used alone to drive the auxiliary supporting block to lift the silicon rod.
In practical design, the main lifting mechanism and the auxiliary lifting mechanism can also adopt mechanisms such as an electric cylinder, gear rack transmission, a linear motor, a ball screw or an oil cylinder and the like to realize lifting of the supporting block.
In one embodiment of the present invention, in order to facilitate the movement, the main lifting mechanism is fixedly connected to the upper surface of the movable base, the middle of the loading platform has a slot 102 along the length direction for the bracket to extend out, a base 103 is disposed below the loading platform, the movable base is located below the middle of the slot, a movable slider 610 is fixedly connected below the movable base, a sliding slot is disposed below the slider, the slider is slidably engaged with a convex rail 611 fixed on the base 103, and the movable base is driven by the movable driving device to move along the sliding rail.
In order to facilitate the movement of the movable base, in one embodiment of the present invention, the lower portion of the movable base 60 has a concave groove surface, the slider is fixed on the lower surface of the groove surface, and the cavity of the lower portion of the movable base is fixed with a moving motor 620 as a moving driving device. The lower part of the movable seat is provided with a cavity 630, the movable driving device is fixed in the cavity, the output end of the movable motor is fixed with a driving gear 621, a rack meshed with the gear is fixed on the base, and the movable seat moves along the length direction of the channel when the driving gear rotates by utilizing the movable motor 20.
In actual design, structures such as a screw rod, an oil cylinder and an air cylinder can be used as a moving driving device, and linear movement of the moving seat is achieved.
The material loading platform is provided with a material receiving hopper 90 at the output end of the silicon rod, and the two ends of the material receiving hopper are provided with concave arc-shaped notches 910.
During working, before cutting the silicon rod, the silicon rod 100 is placed on the material carrying platform 10, the silicon rod is supported by the pulleys 101 on the material carrying platform, then according to the difference of the length of the silicon rod, the main lifting mechanism and/or the auxiliary lifting mechanism are used for realizing that the single main supporting block, the single auxiliary supporting block, part of auxiliary supporting blocks or the main supporting block and the auxiliary supporting blocks are contacted with the outer circumferential surface of the crystal rod and lifted to be separated from the pulleys together according to the needs, and the movable seat is driven to move by the moving driving device to meet the transfer of silicon rod logistics;
after reaching the appointed cutting position, the main lifting mechanism and/or the auxiliary lifting mechanism move downwards to place the silicon rod on the pulley again;
before cutting, the lifting seat 410 is driven to stretch by the lifting driving device, and is lifted synchronously together with the rotating device and the sucker, then the sucker is close to the end part of the silicon rod and performs negative pressure adsorption, and the cut and separated silicon rod is firmly adsorbed by the sucker during cutting;
in the actual design, the silicon rod can be pressed and fixed by a device which can press the silicon rod downwards and is driven by other power sources, so that the shaking in the cutting process is prevented.
The cutting line of the cutting mechanism is driven by the cutting lifting device to cut the silicon rod downwards;
utilize the flexible silicon chip lifting that drives after the cutting of lift drive arrangement 410 will cut after the cutting, rotating device deviates from silicon rod one side with the sucking disc with the silicon chip steering, utilizes the mounting bracket removal to put into the material receiving hopper with the sucking disc together with the silicon chip and collects concentratedly, also can utilize the sucking disc to promote silicon rod propelling movement to the output to realize supplementary pay-off if the clipper only cuts.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes performed by the present specification and drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. The turnover type slice taking and cutting machine comprises a material loading platform for bearing a silicon rod, and a cutting mechanism positioned above the material loading platform, and is characterized by also comprising a slice taking mechanism positioned above the material loading platform and a moving mechanism positioned below the material loading platform and capable of lifting and driving the silicon rod to move;
the silicon rod taking mechanism comprises a silicon rod conveying mechanism, a silicon rod taking mechanism and a silicon rod conveying mechanism, wherein the silicon rod conveying mechanism is arranged on the silicon rod conveying mechanism, the silicon rod taking mechanism comprises a mounting rack which is arranged above a material carrying platform and can move along the output direction of the silicon rod, a sucking disc used for sucking the silicon rod is arranged below the mounting rack, and a silicon rod taking lifting device and a rotating device which drive the sucking disc to move up and down and a rotating device which drive the sucking disc to rotate in the opposite direction are arranged on the mounting rack;
the moving mechanism comprises a moving seat and a bracket which is arranged above the moving seat and is driven by a jacking driving device to lift, and the upper surface of the bracket is provided with a lifting surface which is inclined downwards from two sides to the center.
2. The roll-over type film-taking guillotine according to claim 1, wherein the bracket comprises a main supporting block and an auxiliary supporting block, the lifting drive device comprises a main lifting mechanism for driving the main supporting block to lift and an auxiliary lifting mechanism for driving the auxiliary supporting block to lift, and the lifting areas of the tops of the main supporting block and the auxiliary supporting block, which are contacted with the rod-shaped object, are different.
3. The roll-over type film-taking guillotine according to claim 1 or 2, wherein the telescopic end of the film-taking lifting device is fixed with a lifting seat, the rotating device is fixed in the lifting seat, and the rotating end of the rotating device is fixedly connected with the sucker component.
4. The turnover type film taking and cutting machine according to claim 3, wherein said sucking disc assembly comprises a sucking disc cylinder and a sucking disc seat, the telescopic end of the sucking disc cylinder is fixedly connected with the sucking disc, said sucking disc seat is provided with a through hole for the sucking disc to extend out, said sucking disc is nested in the through hole of the sucking disc seat, the number of the sucking discs is more than two, and the sucking disc seat is further provided with a sensor for detecting the distance.
5. The turnover type film taking and cutting machine according to claim 3, wherein the film taking and lifting device is an air cylinder, an oil cylinder or an electric cylinder, and the rotating device is a rotary air cylinder or an electric motor.
6. The turnover type film taking and cutting machine according to any one of claims 1 to 4, wherein a mounting rack guide rail is fixed on the side portion of the material carrying platform, a mounting rack slider capable of being matched with the mounting rack guide rail is fixed on the mounting rack, a mounting rack parallel to the guide rail is arranged on the side portion of the material carrying platform, a driving motor is fixed on the lower portion of the mounting rack, and a driving gear meshed with the mounting rack is fixed on the output end of the driving motor.
7. The turnover type film taking and cutting machine as claimed in claim 2, wherein the middle of the material carrying platform is provided with a channel along the length direction for the bracket to extend out, a base is arranged below the material carrying platform, the movable base is arranged below the middle of the channel, the lower part of the movable base is fixedly connected with a movable sliding block, a convex rail is fixed on the base, and the lower part of the movable sliding block is in sliding fit with the convex rail;
the lower part of the moving seat is fixedly provided with a moving motor serving as a moving driving device, the output end of the moving motor is fixedly provided with a driving gear, and the base is fixedly provided with a rack which is meshed with the gear and is parallel to the convex rail.
8. The flip-type film-taking and cutting machine as claimed in claim 7, wherein the material-carrying platform is fixed with conveying pulleys arranged in pairs for carrying silicon rods, the conveying pulleys are arranged obliquely, the material-carrying platform is provided with a material-receiving hopper at the output end of the silicon rods, and the two ends of the material-receiving hopper are provided with concave arc-shaped notches.
9. The flip-type film-taking guillotine according to claim 2, wherein said main lifting mechanism is fixedly connected to the upper surface of the movable base, said auxiliary lifting mechanism is fixedly connected to the telescopic end of the main lifting mechanism, said main supporting block and the auxiliary supporting block comprise a pair of supporting blocks, and the top surfaces of the pair of supporting blocks are inclined downward from two sides to the center to form a supporting surface.
10. The turning type sheet taking and cutting machine according to claim 2, wherein the cutting mechanism comprises a portal frame fixed above the material loading platform, a linear cutting mechanism driven by the cutting lifting device to move downwards is arranged in the portal frame, and the linear cutting mechanism comprises a rotating cutting disc and a cutting line wound on the cutting disc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210162435.0A CN114701084A (en) | 2022-02-22 | 2022-02-22 | Turnover type sheet taking and cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210162435.0A CN114701084A (en) | 2022-02-22 | 2022-02-22 | Turnover type sheet taking and cutting machine |
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| Publication Number | Publication Date |
|---|---|
| CN114701084A true CN114701084A (en) | 2022-07-05 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210162435.0A Pending CN114701084A (en) | 2022-02-22 | 2022-02-22 | Turnover type sheet taking and cutting machine |
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| CN (1) | CN114701084A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117457563A (en) * | 2023-12-25 | 2024-01-26 | 无锡釜川科技股份有限公司 | Silicon wafer positioning and feeding device and positioning and feeding method thereof |
| WO2024046002A1 (en) * | 2022-09-02 | 2024-03-07 | Tcl Zhonghuan Renewable Energy Technology Co., Ltd. | Unloading and collecting device for slice and cutting machine with the same |
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| CN208375624U (en) * | 2018-05-31 | 2019-01-15 | 青岛高测科技股份有限公司 | A kind of crystal silicon hilted broadsword shear |
| CN211162439U (en) * | 2019-11-08 | 2020-08-04 | 佛山汇百盛激光科技有限公司 | Laser pipe cutting machine |
| CN211162474U (en) * | 2019-11-08 | 2020-08-04 | 佛山汇百盛激光科技有限公司 | Pipe support frame |
| CN113334597A (en) * | 2021-06-28 | 2021-09-03 | 福州天瑞线锯科技有限公司 | Clipper lifting and taking mechanism |
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| IT8821523A0 (en) * | 1987-07-31 | 1988-07-27 | Mitsubishi Metal Corp | APPLIANCE FOR COLLECTING WAFERS |
| CN208375624U (en) * | 2018-05-31 | 2019-01-15 | 青岛高测科技股份有限公司 | A kind of crystal silicon hilted broadsword shear |
| CN211162439U (en) * | 2019-11-08 | 2020-08-04 | 佛山汇百盛激光科技有限公司 | Laser pipe cutting machine |
| CN211162474U (en) * | 2019-11-08 | 2020-08-04 | 佛山汇百盛激光科技有限公司 | Pipe support frame |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024046002A1 (en) * | 2022-09-02 | 2024-03-07 | Tcl Zhonghuan Renewable Energy Technology Co., Ltd. | Unloading and collecting device for slice and cutting machine with the same |
| CN117457563A (en) * | 2023-12-25 | 2024-01-26 | 无锡釜川科技股份有限公司 | Silicon wafer positioning and feeding device and positioning and feeding method thereof |
| CN117457563B (en) * | 2023-12-25 | 2024-04-02 | 无锡釜川科技股份有限公司 | Silicon wafer positioning and feeding device and positioning and feeding method thereof |
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