CN109747054A - A kind of automatic test cutting all-in-one machine - Google Patents
A kind of automatic test cutting all-in-one machine Download PDFInfo
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- CN109747054A CN109747054A CN201711057488.1A CN201711057488A CN109747054A CN 109747054 A CN109747054 A CN 109747054A CN 201711057488 A CN201711057488 A CN 201711057488A CN 109747054 A CN109747054 A CN 109747054A
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- cutting
- silicon wafer
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- locating platform
- automatic test
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Abstract
The present invention provides a kind of automatic test cutting all-in-one machine, including feeding portion, detection cutting part and the blanking portion set gradually, the detection cutting part includes the testing agency being arranged according to this and cutting mechanism, the testing agency is for detecting silicon wafer, for the cutting mechanism for cutting the silicon wafer after the detection, the feeding portion, the detection cutting part and the blanking portion pass through control system control.The beneficial effects of the invention are as follows using automatic test cutting all-in-one machine, automatically it tested, cut, manual operation amount and operation intensity are reduced using equipment automatization, operator can combine other equipment and carry out operation, reduce personnel amount and personnel cost, the features such as security level is high.
Description
Technical field
The invention belongs to conductor silicon wafer technical field of mechanical automation, more particularly, to a kind of automatic test cutting all-in-one machine.
Background technique
With the development of semicon industry, the processing production capacity demand of circular semiconductor silicon wafer increases increasingly, needs one kind certainly
Dynamicization degree is high, the equipment of high production efficiency, and realization carries out lower silicon slice automatically, and test, cutting, lower turn replace artificial cumbersome
Manual working.Currently, round silicon wafer adds man-hour requirement operating personnel by round silicon wafer from a upper process in test, cutting action
It takes out in sheets used basket, and classifies according to fixed batch, model, by manually silicon wafer is placed in test equipment, carry out
Monolithic test, then cutting action will be gone in the silicon wafer tested, pendulum is carried out by operator and is manually adjusted, then carries out list
Piece cutting, a process produces still further below.Entire detection correction, scribing correction, the process of loading and unloading and the complete hand of transfer process
Dynamic operation.This operation has the disadvantage in that
1. manual pendulum and taking piece, fragment rate is high；
2. manual pendulum takes piece, the hand of operator, which can contact silicon wafer, can generate pollution；
3. manual correction need to be equipped with special messenger and operate, the accumulation working efficiency of only elapsed-time standards can be promoted；
4. manual test, cutting intricate operation, low efficiency, great work intensity easily go out to make mistakes, cause damages.
Therefore, for manual test, cutting operation disadvantage, it is badly in need of a kind of replacing artificial pendulum using automation equipment, taking
Piece, correction, test, cutting action complete round silicon test, the automation for cutting work, integrated equipment.
Summary of the invention
The invention aims to solve the problems in background technique, a kind of automatic test cutting all-in-one machine is provided.
In order to solve the above technical problems, the technical solution adopted by the present invention is that: a kind of automatic test cutting all-in-one machine, including
Feeding portion, detection cutting part and the blanking portion set gradually, the detection cutting part include the testing agency set gradually and cut
Cutting mill structure, the testing agency is for detecting silicon wafer, and the cutting mechanism is for cutting the silicon wafer after the detection, the feeding
Portion, the detection cutting part and the blanking portion pass through control system control.
Further, the testing agency includes probe card and rotation slide holder, and the probe card is set to the rotation
The top of slide holder, the rotation slide holder includes the feeding station circumferentially set gradually, positional stations, detection station and mark
Know station, the probe card is used for the silicon slice under test tested in the detection station.
Further, the probe card includes the pcb board set gradually, third needle plate, the second needle plate and the first needle plate, institute
The bottom fixed setting probe of the first needle plate is stated, the probe is contacted with the silicon slice under test.
Further, the cutting mechanism includes laser cutting machine and locating platform, and fixture is arranged on the locating platform,
The fixture is for clamping silicon wafer, and the laser cutting machine is set to the top of the locating platform, for cutting the positioning
Silicon wafer on platform.
Further, the locating platform includes X-axis locating platform, Y-axis locating platform and turntable, in which:
The X-axis locating platform is for driving fixture mobile in X-direction；
The Y-axis locating platform is for driving the fixture mobile in Y direction；
The turntable drives the fixture mobile in vertical direction, and the turntable drives the fixture rotation；
The X-axis locating platform, Y-axis locating platform and turntable pass through control system control.
Further, the cutting mechanism further includes high power image-forming module and low power image-forming module, and mould is imaged in the high power
Block and the low power image-forming module are set to the bottom of the locating platform, for acquiring silicon wafer information.
Further, the detection cutting part further includes manipulator, described for the silicon wafer tested to be placed into
On locating platform.
Further, the feeding portion includes the full magazine feeding device set gradually, lamination feeding device, the lamination
Feeding device includes vacuum cups, and the vacuum cups is delivered to the detection cutting part after drawing silicon wafer piecewise.
Further, the feeding portion further includes sky magazine blanking device and lifting device, and the lifting device is set to
Between the full magazine feeding device and the lamination feeding device, the sky magazine blanking device and the full magazine feeding dress
It sets and is arranged in parallel, the sky magazine blanking device is set to the bottom of the full magazine feeding device, and the lifting device is in institute
It states and is slided between full magazine feeding device and the empty magazine blanking device, for driving magazine to go up and down.
Further, the blanking portion includes:
Transport mechanism, the silicon wafer after being used for transmission cutting.
Waste material load station is set to the side of the transport mechanism, stores identified silicon wafer；
Product load station is set to the other side of the transport mechanism, for storing the qualified silicon wafer of detection.
The invention has the advantages and positive effects that due to the adoption of the above technical scheme:
1. replacing artificial pendulum using automation equipment, taking piece, correction, test, cutting action, round silicon wafer can be realized
Lower silicon slice is gone up automatically in detection cutting action.
2. being tested, being cut automatically using automatic test cutting all-in-one machine, manual work is reduced using equipment automatization
Amount and operation intensity, operator can combine other equipment and carry out operation, reduce personnel amount and personnel cost, safety level
The features such as not high.
3. eliminating the high loss of fragment rate caused by manual work fault, have the advantages that stability height, high production efficiency,
Also it can avoid wafer contamination caused by manual working, there is very high practical value.
Detailed description of the invention
Fig. 1 is structural schematic diagram of the invention；
Fig. 2 is the structural schematic diagram in feeding portion of the present invention；
Fig. 3 is the structural schematic diagram of probe card of the present invention；
Fig. 4 is the structural schematic diagram of laser cutting machine of the present invention；
Fig. 5 is the overlooking structure diagram of present invention rotation slide holder.
In figure:
1, feeding portion 2, detection cutting part 3, blanking portion
11, full magazine feeding device 12, empty magazine blanking device 13, lifting device
14, feed mechanism 21, pcb board 22, third needle plate are stacked
23, the second needle plate 24, the first needle plate 25, cushion block
26, probe 31, fixture 32, turntable
33, X-axis locating platform 34, Y-axis locating platform 35, high power image-forming module
36, low power image-forming module 41, feeding station 42, positional stations
43, detection station 44, mark station
Specific embodiment
As shown in Figure 1, a kind of automatic test cutting all-in-one machine of this example, including set gradually feeding portion 1, detection cutting
Portion 2 and blanking portion 3, detection cutting part 2 include testing agency and cutting mechanism, and testing agency is for detecting silicon wafer, cutting mechanism
For cutting the silicon wafer after detecting, feeding portion 1, detection cutting part 2 and blanking portion 3 pass through PLC control system and control.
As shown in Fig. 2, feeding portion 1 includes the full magazine feeding device 11 set gradually and stacking feed mechanism 14, wherein
Full magazine feeding device 11, is controlled when supplied materials is the piece basket form for sticking with silicon wafer by PLC for the silicon wafer in extracting sheet basket
It is piece basket feeding that system processed, which controls setting feeding manner, and equipment identifies can be by the silicon in piece basket after full magazine feeding device has piece basket
Piece extraction.Feed mechanism 14 is stacked, feed mechanism is stacked and also PLC control system is used to control, including vacuum cups, for that will fold
To detection cutting part, means of transportation uses Belt Conveying for transport after the silicon wafer of sheet form is drawn piecewise by vacuum cups, and
Sensor is set in the starting point of belt, sensor connect with control system, needs to convey whether there is or not silicon wafer for perceiving.
It further include sky magazine blanking device 12, empty magazine blanking device 12 and full magazine feeding device 11 are arranged in parallel, empty
Magazine blanking device 12 is set to full 11 bottom of magazine feeding device, further includes lifting device 13, lifting device is for going up and down material
Box, lifting device are set between full magazine feeding device 11 and the lamination feeding device 14, and the setting of magazine lifting platform 13 exists
Between full magazine feeding device 11 and stacking feed mechanism 14, magazine lifting platform 13 is under full magazine feeding device 11 and empty magazine
It is slided up and down between material device 12, to drive magazine to go up and down.
Detection cutting part 2 includes the testing agency set gradually and cutting mechanism, wherein testing agency includes probe card 2
With rotation slide holder, the probe card be set to it is described rotation slide holder top, the rotation slide holder including circumferentially according to
Feeding station, positional stations, detection station and the mark station of secondary setting, the probe card is for testing the detection station
The silicon slice under test.
Probe card is used to test silicon slice under test in detection station 43, as shown in figure 3, probe card includes from top to bottom successively
Pcb board 21, third needle plate 22, the second needle plate 23 and the first needle plate 24 of setting, wherein pcb board is integrated circuit board, is welded thereon
Multiple electronic components are connect to realize that electrical function, third needle plate 22 and the second needle plate 23 are used for coarse positioning, the first needle plate 24 is used
Probe is fixedly installed in the bottom of fine positioning, the first needle plate 24, probe 26 is contacted with silicon slice under test, and probe 26 is 200-2000
It is a, quickly silicon wafer can be detected, greatly shorten detection time, increase production efficiency, probe 26 is imperial crown head probe, is prevented
Probe is blocked by foul, and cushion block 25 is arranged between third needle plate 22 and the second needle plate, is adjusted by cushion block 25, reaches probe 26
Basic fixed position, and cushion block 25 can reduce heat transfer, and the first needle plate 24 through adjusting is accurately positioned, and makes its lower installation
Multiple probes 26 reach exact position, and the piece basket supplied materials for filling round silicon wafer need to be only placed on by operator during operation
Feeding station simultaneously positions, and after confirming equipment state, presses start button, the state that equipment detects tablet basket automatically is laggard
Row operates in next step, greatly reduces the operation difficulty and tired degree of operator, effectively improves production efficiency.
As shown in figure 5, rotation slide holder 4 includes the feeding station 41 circumferentially set gradually, positional stations 42, detection work
Position 43 and mark station 44, mark station 44 are set as INK mark, rotation slide holder 4 realize the transmission of round silicon wafer, test, under
Round silicon wafer, the fixation position of rotation slide holder 4 is placed in via manipulator 1 by the automation turned, and rotation slide holder 4 uses vacuum
Silicon wafer is fixed, after three axial adjustment, is tested by 2 Multi probe of probe card, is then marked by the tattooing needle of INK mark station
Know, then turn, detecting in cutting part 2 further includes manipulator, and the silicon wafer tested is placed into locating platform with manipulator
First-class to be cut, manipulator is connected to motor, and is operated by motor control using manipulator, can be realized round silicon wafer and detecting
Automatic loading/unloading in process, solve in the prior art manually pendulum, take piece, reduce manual operation amount and operation intensity,
Also it can avoid wafer contamination caused by manual working, save personnel, security level height.
Cutting mechanism includes laser cutting machine and locating platform, and laser cutting machine uses femto-second laser or picosecond laser
Device, wherein second laser or picosecond laser to cutting speed≤450mm/s of silicon wafer, to 25 μm of the cutting width of silicon wafer~
45 μm, depth of cut is the 25%~50% of silicon wafer thickness.The laser head power of femto-second laser or picosecond laser: 15W~
25W, laser head tranmitting frequency 60KHz~80KHz guarantee cutting accuracy and cutting efficiency, and it is flat that laser cutting machine is set to positioning
The top of platform, for cutting the silicon wafer on locating platform from the top of silicon wafer to be cut.
As shown in figure 4, fixture 31 is arranged on locating platform, fixture 31 includes X-axis positioning for clamping silicon wafer, locating platform
Platform 33, Y-axis locating platform 34 and turntable 32, in which: X-axis locating platform 33 is for driving fixture mobile in X-direction；Y-axis
Locating platform 34 is for driving the fixture mobile in Y direction；Using X-axis locating platform 33 and 34 pairs of Y-axis locating platform folders
Silicon wafer on tool 31 carries out level correction, carries out depth correction to the silicon wafer on fixture 31 using turntable 32, turntable 32 drives folder
Tool 31 is mobile in vertical direction, and during cutting, the pendulum for driving the rotation of fixture 31 to pass through fixture 31 by turntable 32
It moves to cut silicon wafer to be cut；X-axis locating platform 33, Y-axis locating platform 34 and turntable 32 pass through PLC control system control
System, cutting mechanism further include high power image-forming module 35 and low power image-forming module 36, high power image-forming module 35 and low power image-forming module
36 are set to the bottom of locating platform, for acquiring the groove information of silicon wafer bottom, guarantee the cutting line and silicon of silicon wafer upper surface
Piece undercut position is corresponding.
Blanking portion 3 includes transport mechanism, and transport mechanism uses belt transport, the silicon wafer after being used for transmission cutting, waste material dress
Station is carried, the side of the transport mechanism is set to, stores identified silicon wafer；Product load station is set to the transmission
The other side of mechanism, for storing the qualified silicon wafer of detection, blanking portion is connect with PLC control system, passes through setting in blanking portion
Identification device identifies ink dot silicon wafer, the qualified storage with ink dot silicon wafer, wherein identification device can be CCD industrial camera or its
The equipment that he can identify product surface ink dot.
The course of work of this example: feeding portion passes through PLC controller control from piece basket feeding or lamination feeding, material-uploading style
Silicon wafer, is sent to detection cutting part by system piecewise, and round silicon wafer is placed in the feeding station of rotation slide holder via manipulator,
Rotation slide holder is fixed silicon wafer using vacuum, and rotation slide holder rotates a station, silicon wafer is sent to positional stations, through three
Axis calibration, then rotate a station to detection station, carries out electrical testing to silicon wafer by probe card Multi probe, after being completed under
INK mark station is gone to, defective products is identified using tattooing needle, then transfer and be sent to cutting mechanism, in cutting mechanism
Groove information through high power image-forming module and low power image-forming module acquisition silicon wafer bottom, sends PLC control system, PLC control to
The information that system is acquired according to image-forming module, by the fixture of fixed silicon wafer through X-axis locating platform, Y-axis locating platform and turntable
Effect, with laser cutting machine to being just cut by laser afterwards, the silicon wafer after cutting is sent to blanking portion by feed belt.
The beneficial effects of the present invention are: 1. replace artificial pendulum using automation equipment, take piece, correction, test, cutting dynamic
Make, can be realized round silicon wafer and go up lower silicon slice automatically in detection cutting action.
2. being tested, being cut automatically using automatic test cutting all-in-one machine, manual work is reduced using equipment automatization
Amount and operation intensity, operator can combine other equipment and carry out operation, reduce personnel amount and personnel cost, safety level
The features such as not high.
3. eliminating the high loss of fragment rate caused by manual work fault, have the advantages that stability height, high production efficiency,
Also it can avoid wafer contamination caused by manual working, there is very high practical value.
4. test section cooperates probe card using rotation slide holder, it is provided with 200-2000 probe on probe card, greatly
Fast detection speed, improves production efficiency, has test speed fast, identify bad products, the high advantage of stability automatically.
One embodiment of the present invention has been described in detail above, but the content is only preferable implementation of the invention
Example, should not be considered as limiting the scope of the invention.It is all according to all the changes and improvements made by the present patent application range
Deng should still be within the scope of the patent of the present invention.
Claims (10)
1. a kind of automatic test cutting all-in-one machine, it is characterised in that: including feeding portion, detection cutting part and the blanking set gradually
Portion, the detection cutting part include the testing agency set gradually and cutting mechanism, and the testing agency is for detecting silicon wafer, institute
Cutting mechanism is stated for cutting the silicon wafer after the detection, the feeding portion, the detection cutting part and the blanking portion are logical
Cross control system control.
2. automatic test cutting all-in-one machine according to claim 1, it is characterised in that: the testing agency includes probe card
With rotation slide holder, the probe card be set to it is described rotation slide holder top, the rotation slide holder including circumferentially according to
Feeding station, positional stations, detection station and the mark station of secondary setting, the probe card is for testing the detection station
The silicon slice under test.
3. automatic test cutting all-in-one machine according to claim 2, it is characterised in that: the probe card includes setting gradually
Pcb board, third needle plate, the second needle plate and the first needle plate, the bottom of first needle plate is fixedly installed probe, the probe with
The silicon slice under test contact.
4. automatic test cutting all-in-one machine according to claim 1 to 3, it is characterised in that: the cutting mechanism includes
Fixture is arranged on the locating platform for laser cutting machine and locating platform, and the fixture is for clamping silicon wafer, the laser cutting
Machine is set to the top of the locating platform, for cutting the silicon wafer on the locating platform.
5. automatic test cutting all-in-one machine according to claim 4, which is characterized in that the locating platform includes that X-axis is fixed
Bit platform, Y-axis locating platform and turntable, in which:
The X-axis locating platform is for driving fixture mobile in X-direction；
The Y-axis locating platform is for driving the fixture mobile in Y direction；
The turntable drives the fixture mobile in vertical direction, and the turntable drives the fixture rotation；
The X-axis locating platform, Y-axis locating platform and turntable pass through control system control.
6. automatic test cutting all-in-one machine according to claim 5, it is characterised in that: the cutting mechanism further includes high power
Image-forming module and low power image-forming module, the high power image-forming module and the low power image-forming module are set to the locating platform
Bottom, for acquiring silicon wafer information.
7. automatic test cutting all-in-one machine according to claim 4, it is characterised in that: the detection cutting part further includes machine
Tool hand, for the silicon wafer tested to be placed into the locating platform.
8. automatic test cutting all-in-one machine according to claim 1, it is characterised in that: the feeding portion includes setting gradually
Full magazine feeding device, lamination feeding device, the lamination feeding device includes vacuum cups, and the vacuum cups is by silicon wafer
The detection cutting part is delivered to after drawing piecewise.
9. automatic test cutting all-in-one machine according to claim 8, which is characterized in that the feeding portion further includes sky magazine
Blanking device and lifting device, the lifting device be set to the full magazine feeding device and the lamination feeding device it
Between, the sky magazine blanking device is arranged in parallel with the full magazine feeding device, and the sky magazine blanking device is set to institute
State the bottom of full magazine feeding device, the lifting device the full magazine feeding device and the empty magazine blanking device it
Between slide, for driving magazine to go up and down.
10. automatic test cutting all-in-one machine according to claim 1, which is characterized in that the blanking portion includes:
Transport mechanism, the silicon wafer after being used for transmission cutting.
Waste material load station is set to the side of the transport mechanism, stores identified silicon wafer；
Product load station is set to the other side of the transport mechanism, for storing the qualified silicon wafer of detection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711057488.1A CN109747054A (en) | 2017-11-01 | 2017-11-01 | A kind of automatic test cutting all-in-one machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711057488.1A CN109747054A (en) | 2017-11-01 | 2017-11-01 | A kind of automatic test cutting all-in-one machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109747054A true CN109747054A (en) | 2019-05-14 |
Family
ID=66398929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711057488.1A Pending CN109747054A (en) | 2017-11-01 | 2017-11-01 | A kind of automatic test cutting all-in-one machine |
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| Country | Link |
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| CN207736544U (en) * | 2017-11-01 | 2018-08-17 | 天津环鑫科技发展有限公司 | A kind of automatic test cutting all-in-one machine |
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Patent Citations (11)
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|---|---|---|---|---|
| CN1387978A (en) * | 2001-05-30 | 2003-01-01 | 株式会社迪斯科 | Cutting machine |
| CN1718370A (en) * | 2004-07-07 | 2006-01-11 | 株式会社迪斯科 | Grinding device |
| CN1783432A (en) * | 2004-11-30 | 2006-06-07 | 株式会社迪斯科 | Rectangular substrate dividing apparatus |
| TW200833447A (en) * | 2006-10-19 | 2008-08-16 | Disco Corp | Laser processing device |
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