CN211404463U - Automatic insert machine for silicon wafers - Google Patents
Automatic insert machine for silicon wafers Download PDFInfo
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- CN211404463U CN211404463U CN202020227208.8U CN202020227208U CN211404463U CN 211404463 U CN211404463 U CN 211404463U CN 202020227208 U CN202020227208 U CN 202020227208U CN 211404463 U CN211404463 U CN 211404463U
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- conveyer belt
- feeding conveyer
- telescopic cylinder
- silicon wafer
- exit conveyor
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Abstract
The utility model discloses an automatic insert machine of silicon chip, including feeding conveyer belt, feeding conveyer belt bottom is provided with first lifter, first lifter drives feeding conveyer belt reciprocates, one side of feeding conveyer belt is provided with discharge mechanism, feeding conveyer belt is close to one side of discharge mechanism has set gradually cleaning device and detection device, discharge mechanism includes telescopic cylinder, lift cylinder, material collection device and exit conveyor, the lift cylinder sets up telescopic cylinder bottom, material collection device sets up telescopic cylinder with between the exit conveyor, the exit conveyor bottom is provided with the second lifter, exit conveyor one side is provided with extracting device, extracting device includes the workstation and sets up the manipulator on the workstation. The utility model discloses simple structure can carry out the operation of silicon chip inserted sheet and last unloading automatically, and is efficient.
Description
Technical Field
The utility model relates to a silicon chip processing equipment field, concretely relates to automatic insert machine of silicon chip.
Background
The processing of the monocrystalline silicon wafer comprises the steps of firstly squaring a monocrystalline silicon rod and then slicing, the processing of the polycrystalline silicon wafer comprises the steps of cutting a polycrystalline silicon ingot and then slicing, and the processing of the quasi-monocrystalline silicon wafer comprises the steps of cutting the quasi-monocrystalline silicon ingot and then slicing. Therefore, slicing is one of the indispensable processes in the processing technology of the crystalline silicon solar cell. And stacking the sliced silicon wafers together, and inserting the sliced silicon wafers into a flower basket for transportation after the slicing is needed.
However, the existing wafer inserting machine has low efficiency, and workers insert the silicon wafers into the silicon wafer boxes placed on the wafer carrying device by using auxiliary tools. The silicon wafer box is provided with a plurality of slots for accommodating silicon wafers. In order to ensure that the silicon wafer can be accurately inserted into the slot on the silicon wafer box, the auxiliary tool and the wafer carrying device need to be aligned and calibrated before the silicon wafer is inserted. Most of traditional calibration methods are that workers carry out visual inspection alignment by experience and then adjust an auxiliary tool and a slide glass device, but the tool is adjusted in such a way that errors are large, control precision is low, and a card phenomenon is easy to form
Disclosure of Invention
The to-be-solved technical problem of the utility model is to provide an automatic insert machine of silicon chip, simple structure can carry out the operation of silicon chip inserted sheet and last unloading automatically, and is efficient.
In order to solve the technical problem, the utility model provides an automatic silicon wafer inserting machine, which comprises a feeding conveyor belt, the bottom of the feeding conveyor belt is provided with a first lifting rod which drives the feeding conveyor belt to move up and down, a discharging mechanism is arranged on one side of the feeding conveyor belt, a cleaning device and a detection device are sequentially arranged on one side of the feeding conveyor belt close to the discharging mechanism, the discharging mechanism comprises a telescopic cylinder, a lifting cylinder, a material collecting device and a discharging conveyor belt, the lifting cylinder is arranged at the bottom of the telescopic cylinder, the material collecting device is arranged between the telescopic cylinder and the discharging conveyor belt, the discharging conveyor belt is characterized in that a second lifting rod is arranged at the bottom of the discharging conveyor belt, a material taking device is arranged on one side of the discharging conveyor belt and comprises a workbench and a manipulator arranged on the workbench.
Further, the cleaning device consists of an air cavity and a nozzle, and the air cavity is respectively communicated with the nozzle and the air pump.
Further, the detection device comprises a fixing plate, a position sensor and an information transmitter, wherein the position sensor and the information transmitter are arranged on the fixing plate.
Furthermore, the material collecting device comprises a plurality of overlapped material taking plates which are arranged at equal intervals, and the telescopic cylinder can push the material taking plates to the discharge conveyor belt.
Further, the manipulator comprises a first rotating seat and a second rotating seat, the first rotating seat is arranged on the workbench, a mechanical arm is arranged between the first rotating seat and the second rotating seat, and a clamping jaw is further arranged on the second rotating seat.
Further, the lift cylinder with material collection device all sets up on the base, on the base with the position that material collection device corresponds is provided with gravity sensor.
The utility model has the advantages that: this device adopts automatic control feeding, gets material and ejection of compact, and degree of automation is high, and is efficient.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
The reference numbers in the figures illustrate: 1. a feed conveyor; 2. a first lifting rod; 3. a cleaning device; 4. a detection device; 5. a telescopic cylinder; 6. a lifting cylinder; 7. a material collecting device; 8. a discharge conveyor belt; 9. a second lifting rod; 10. a work table; 11. a manipulator; 12. a first rotating base; 13. a second rotary base; 14. a mechanical arm; 15. a clamping jaw; 16. a base; 17. a gravity sensor.
Detailed Description
The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.
Referring to fig. 1, an embodiment of an automatic silicon wafer inserting machine of the present invention comprises a feeding conveyor belt 1, a first lifting rod 2 is disposed at the bottom of the feeding conveyor belt 1, the first lifting rod 2 drives the feeding conveyor belt 1 to move up and down, a discharging mechanism is disposed at one side of the feeding conveyor belt 1, a cleaning device 3 and a detecting device 4 are sequentially disposed at one side of the feeding conveyor belt 1 close to the discharging mechanism, the discharging mechanism comprises a telescopic cylinder 5, a lifting cylinder 6, a material collecting device 7 and a discharging conveyor belt 8, the lifting cylinder 6 is disposed at the bottom of the telescopic cylinder 5, the material collecting device 7 is disposed between the telescopic cylinder 5 and the discharging conveyor belt 8, a second lifting rod 9 is disposed at the bottom of the discharging conveyor belt 8, a material taking device is disposed at one side of the discharging conveyor belt 8, the material taking device comprises a workbench 10 and a manipulator 11 arranged on the workbench 10.
During the use, the material is put into from feeding conveyer belt 1, later loop through cleaning device 3 and detection device 4, dust on the cleaning device 3 clearance silicon chip, detection device 4 is used for detecting whether damaged or silicon chip has appeared or has been transported the assigned position, later utilize manipulator 11 on the workstation 10, put into material collection device 7 with the silicon chip on the feeding conveyer belt 1, when material collection device 7 was put to capacity, lift cylinder 6 drives telescopic cylinder 5 and reciprocates, telescopic cylinder 5 will be filled the material collection device 7 ejecting to discharging conveyer belt 8, there is discharging conveyer belt 8 to see off.
The cleaning device 3 consists of an air cavity and a nozzle, the air cavity is respectively communicated with the nozzle and an air pump, and the air pump is used for driving the nozzle to spray air so as to clean fine impurities such as dust on the silicon wafer.
The detection device 4 comprises a fixing plate, a position sensor and an information transmitter, wherein the position sensor is arranged on the fixing plate and used for detecting the position of the silicon wafer on the feeding conveyor belt 1, and the information transmitter is used for transmitting the information obtained by the detection device 4 to a host machine.
The material collecting device 7 comprises a plurality of overlapped material taking plates which are arranged at equal intervals, the telescopic cylinder 5 can push the material taking plates to the discharge conveyor belt 8, a plurality of material taking plates are arranged, and the multilayer material taking plates can be used in sequence and are high in efficiency.
Manipulator 11 includes first roating seat 12 and second roating seat 13, and first roating seat 12 sets up on the workstation 10, be provided with arm 14 between first roating seat 12 and the second roating seat 13, still be provided with clamping jaw 15 on the second roating seat 13, utilize first roating seat 12 and second roating seat 13 can increase manipulator 11's rotation range, excellent in use effect.
The lifting cylinder 6 and the material collecting device 7 are arranged on the base 16, the gravity sensor 17 is arranged at the position, corresponding to the material collecting device 7, on the base 16, the gravity sensor 17 can detect the weight of the material collecting device 7, and when the weight reaches a specified value, the telescopic cylinder 5 can be used for ejecting the material collecting device 7 to the discharging conveyor belt 8.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.
Claims (6)
1. The utility model provides an automatic insert machine of silicon chip, its characterized in that, includes feeding conveyer belt, feeding conveyer belt bottom is provided with first lifter, first lifter drives feeding conveyer belt reciprocates, one side of feeding conveyer belt is provided with discharge mechanism, feeding conveyer belt is close to one side of discharge mechanism has set gradually cleaning device and detection device, discharge mechanism includes telescopic cylinder, lift cylinder, material collection device and exit conveyor, the lift cylinder sets up telescopic cylinder bottom, material collection device sets up telescopic cylinder with between the exit conveyor, the exit conveyor bottom is provided with the second lifter, exit conveyor one side is provided with extracting device, extracting device includes the workstation and sets up the manipulator on the workstation.
2. The automatic silicon wafer inserting machine according to claim 1, wherein the cleaning means is composed of an air chamber and a nozzle, and the air chamber is communicated with the nozzle and the air pump, respectively.
3. The automatic silicon wafer inserting machine according to claim 1, wherein the detecting means comprises a fixing plate and a position sensor and an information transmitter provided on the fixing plate.
4. The automatic silicon wafer inserting machine according to claim 1, wherein the material receiving device comprises a plurality of material taking plates arranged in an overlapping manner, the plurality of material taking plates are arranged at equal intervals, and the telescopic cylinder can push the material taking plates to the discharging conveyor belt.
5. The automatic silicon wafer inserting machine according to claim 1, wherein the robot comprises a first rotary base and a second rotary base, the first rotary base is arranged on the worktable, a mechanical arm is arranged between the first rotary base and the second rotary base, and a clamping jaw is further arranged on the second rotary base.
6. The automatic silicon wafer inserting machine according to claim 1, wherein the lifting cylinder and the material collecting device are both disposed on a base, and a gravity sensor is disposed on the base at a position corresponding to the material collecting device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020227208.8U CN211404463U (en) | 2020-02-28 | 2020-02-28 | Automatic insert machine for silicon wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020227208.8U CN211404463U (en) | 2020-02-28 | 2020-02-28 | Automatic insert machine for silicon wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211404463U true CN211404463U (en) | 2020-09-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020227208.8U Active CN211404463U (en) | 2020-02-28 | 2020-02-28 | Automatic insert machine for silicon wafers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211404463U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113611648A (en) * | 2021-10-08 | 2021-11-05 | 江苏泰明易自动化设备有限公司 | Full-automatic intelligent overturning and folding double-wafer inserting machine for silicon wafers |
-
2020
- 2020-02-28 CN CN202020227208.8U patent/CN211404463U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113611648A (en) * | 2021-10-08 | 2021-11-05 | 江苏泰明易自动化设备有限公司 | Full-automatic intelligent overturning and folding double-wafer inserting machine for silicon wafers |
| CN113611648B (en) * | 2021-10-08 | 2021-12-03 | 江苏泰明易自动化设备有限公司 | Full-automatic intelligent overturning and folding double-wafer inserting machine for silicon wafers |
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