CN114571650B

CN114571650B - Full-automatic semiconductor plastic packaging equipment and method

Info

Publication number: CN114571650B
Application number: CN202210490263.XA
Authority: CN
Inventors: 曾庆文; 袁媛; 刘宗果; 梁嘉凯; 郑怡业; 吕志远
Original assignee: Guangdong Funeng Oriental Technology R & D Co ltd
Current assignee: Guangdong Funeng Oriental Technology R & D Co ltd
Priority date: 2022-05-07
Filing date: 2022-05-07
Publication date: 2022-07-22
Anticipated expiration: 2042-05-07
Also published as: CN114571650A

Abstract

The invention discloses full-automatic semiconductor plastic packaging equipment and a method, and relates to the field of semiconductor packaging, wherein the equipment comprises a feeding and sheet discharging device, a feeding and glue discharging device, a plastic packaging device, a glue removing device and a carrying device; the feeding and glue discharging device comprises a feeding vibration disc and a transferring and discharging mechanism; the transfer discharging mechanism comprises a discharging mechanism and a transfer mechanism, the discharging mechanism comprises a discharging seat and a discharging driving mechanism, and a discharging storage groove is formed in the discharging seat; the transfer mechanism comprises a gripping piece and a transfer driving mechanism; the plastic packaging device comprises a plastic packaging mold and a cleaning mechanism; the plastic package mold comprises an upper mold and a lower mold; the cleaning mechanism comprises a blowing assembly and a blowing driving mechanism, the blowing assembly comprises an air knife, and the air knife is connected with a blowing device; the carrying device comprises a wafer carrying frame, a colloidal particle carrying frame and a carrying driving mechanism. The full-automatic plastic package mould cleaning device can not only realize full-automatic colloidal particle feeding work, but also clean a plastic package mould.

Description

Full-automatic semiconductor plastic packaging equipment and method

Technical Field

The invention relates to a semiconductor plastic packaging device and a semiconductor plastic packaging method, in particular to full-automatic semiconductor plastic packaging equipment and a full-automatic semiconductor plastic packaging method.

Background

In the existing semiconductor plastic packaging process, a lead frame is required to be arranged on a feeding frame, a feeding cover is covered, the feeding frame is manually placed into a plastic packaging machine for plastic packaging and solidification, the feeding frame is taken out after the plastic packaging is completed and placed into a glue removing machine for gluing, and after the gluing is completed, semiconductor parts on the feeding frame are manually discharged and moved to a checking process.

In the plastic package production process, the following defects exist:

1. after a feeding frame loaded with a wafer (lead frame) is placed into the plastic packaging machine, colloidal particle feeding needs to be manually placed into the plastic packaging machine, so that the feeding efficiency is low, misoperation is easy to occur, products are scrapped, and even production accidents occur.

2. After a plurality of times of plastic packaging work, sundries such as colloidal particle scraps are easily generated on the plastic packaging mold, and before the wafer is thrown into the plastic packaging machine, the plastic packaging mold is not cleaned, and the sundries such as the colloidal particle scraps are directly contacted with the wafer, so that the plastic packaging operation of the wafer is influenced, and the plastic packaging precision and the plastic packaging quality are reduced.

Disclosure of Invention

The invention aims to overcome the problems and provides full-automatic semiconductor plastic packaging equipment which not only can realize full-automatic colloidal particle feeding work, but also can clean a plastic packaging mold, avoids the influence of sundries such as colloidal particle fragments on normal plastic packaging work, and has the advantages of high working efficiency, high plastic packaging quality and the like.

The invention also aims to provide a full-automatic semiconductor plastic packaging method.

The purpose of the invention is realized by the following technical scheme:

a full-automatic semiconductor plastic package device comprises a feeding and discharging device for automatically placing wafers to be plastic packaged, a feeding and discharging device for automatically placing colloidal particles, a plastic packaging device for plastic packaging of the wafers, a glue removing device for removing waste materials on the wafers after plastic packaging, and a carrying device for carrying materials among a plurality of stations;

the feeding and glue discharging device comprises a feeding vibration disc for orderly conveying colloidal particles and a transfer discharging mechanism for transferring and placing the colloidal particles; the transfer discharging mechanism comprises a discharging mechanism and a transfer mechanism, the discharging mechanism comprises a discharging seat and a discharging driving mechanism for driving the discharging seat to move, a plurality of discharging storage grooves for temporarily storing colloidal particles are formed in the discharging seat, and one side, close to the feeding vibration disc, of each discharging storage groove is of an open structure; under the working state, the discharging driving mechanism sequentially drives the discharging storage groove of the discharging seat to move to the front of the feeding channel of the feeding vibrating disk; the transfer mechanism comprises a plurality of grabbing pieces for grabbing the colloidal particles and a transfer driving mechanism for driving the grabbing pieces to move;

the plastic packaging device comprises a plastic packaging mold and a cleaning mechanism for cleaning the plastic packaging mold; the plastic package mold comprises an upper mold and a lower mold; the cleaning mechanism comprises a blowing assembly and a blowing driving mechanism for driving the blowing assembly to move transversely, the blowing assembly comprises an air knife, and the air knife is connected with a blowing device; in a working state, the air blowing driving mechanism drives the air knife to move between the upper die and the lower die, and the air knife cleans the upper die and the lower die;

the carrying device comprises a wafer carrying frame for storing wafers, a colloidal particle carrying frame for storing colloidal particles and a carrying driving mechanism for driving the wafer carrying frame and the colloidal particle carrying frame to move; the colloidal particle conveying frame is provided with a conveying and storing groove for storing colloidal particles; the conveying driving mechanism is arranged among the feeding and discharging device, the plastic packaging device and the glue removing device.

The working principle of the full-automatic semiconductor plastic packaging equipment is as follows:

when the packaging machine works, the wafer carrying frame is placed in the feeding and arranging device, the wafers are neatly placed on the wafer carrying frame by the feeding and arranging device, and then the wafer carrying frame filled with the wafers is driven to the packaging device by the carrying driving mechanism to prepare for packaging.

Placing the colloidal particle conveying frame in a feeding and glue discharging device, and neatly placing colloidal particles on the colloidal particle conveying frame by the feeding and glue discharging device; wherein, the material loading binder removal operation of material loading binder removal device is: a large amount of colloidal particles are put into a feeding vibration disc, the colloidal particles are orderly arranged by the feeding vibration disc, and the colloidal particles are sequentially transferred to a discharging seat through a feeding channel. Wherein, because be equipped with a plurality of row material storage tanks on the row material seat, before the micelle is carried out from the material loading passageway, move the place ahead to the material loading passageway through arranging the row material storage tank of row material drive mechanism drive row material seat in proper order for load the micelle. After the row material storage tank of arranging the material seat filled with the micelle, it is close to the micelle to grab the piece through the drive of transfer actuating mechanism, snatchs the micelle by grabbing the piece, is grabbed the piece by the drive of transfer actuating mechanism again and is removed to the top of micelle carrying frame to make the micelle align with the transport storage tank of below, then put in the micelle to the transport storage tank. And then, the conveying driving mechanism drives the colloidal particle conveying frame to move into the plastic packaging device, colloidal particles are placed on a mold of the plastic packaging device, the conveying driving mechanism drives the colloidal particle conveying frame to reset, and then the plastic packaging device finishes plastic packaging operation.

Further, the plastic packaging operation of the plastic packaging device is as follows: and opening the plastic packaging mold, and separating the upper mold from the lower mold so as to put the wafer (lead frame) to be plastic packaged. Before putting into the wafer of treating the plastic envelope, remove between last mould and lower mould through the actuating mechanism drive air knife of blowing, the air-blast device carries high-speed air current to the air knife this moment, sweeps the lower mould by the air knife, clears away debris such as micelle piece on the mould, avoids debris such as micelle piece to influence normal plastic envelope work, is favorable to improving plastic envelope precision and plastic envelope quality. And after the wafer to be subjected to plastic packaging and the colloidal particles are placed, performing plastic packaging operation.

After the plastic packaging is finished, the wafer carrying frame provided with the wafer after the plastic packaging is driven by the carrying driving mechanism to move to the glue removing device, and the corner plastic waste materials on the wafer after the plastic packaging are removed by the glue removing device, so that the whole plastic packaging process is finished.

In a preferable scheme of the invention, a blocking mechanism is arranged at an outlet of the feeding channel, and the blocking mechanism comprises a blocking sheet and a blocking driving mechanism, and the blocking sheet is connected with a driving end of the blocking driving mechanism.

Furthermore, block actuating mechanism and drive actuating cylinder including blockking, should block the telescopic link that drives actuating cylinder and block piece fixed connection. Through the structure, when the discharge seat is far away from the feeding channel, the blocking piece extends to the outlet of the feeding channel under the driving of the blocking driving cylinder to block colloidal particles in the feeding channel; and after the discharging seat is close to the discharging seat, the driving cylinder is blocked to drive the blocking piece to be far away from the outlet of the feeding channel, and the colloidal particles are continuously transferred.

In a preferred embodiment of the present invention, the discharge mechanism further includes a baffle plate, the baffle plate is erected on one side of the open structure close to the discharge storage slots, and the extension direction of the baffle plate is parallel to the arrangement direction of the plurality of discharge storage slots; when the discharging storage groove moves to the front of the baffle, the discharging storage groove is in a closed state at the moment. Through above-mentioned structure, after the colloidal particle has been loaded to previous row material storage tank, should arrange the material storage tank and keep away from material loading channel through arranging material actuating mechanism drive, next row material storage tank is close to material loading channel simultaneously, and the material storage tank is arranged to previous and is kept away from material loading channel after-moving to the place ahead of baffle to blockking by the colloidal particle of baffle in this row material storage tank, prevent that the colloidal particle from dropping.

In a preferred embodiment of the present invention, the discharging driving mechanism includes a discharging driving motor and a discharging transmission assembly; the discharging driving motor is fixedly arranged on the equipment rack;

the discharging transmission assembly comprises a discharging transmission belt and two discharging transmission belt wheels, the discharging transmission belt is connected between the two discharging transmission belt wheels, and the discharging seat is connected with the discharging transmission belt. Through above-mentioned structure, arrange material driving motor's drive down, arrange the material seat and can carry out lateral shifting in the place ahead of material loading passageway, load the micelle in proper order.

Further, a linear guide structure is arranged between the discharging seat and the equipment rack and comprises a linear guide rail and a sliding block, the linear guide rail is fixedly arranged on the equipment rack, and the discharging seat is connected with the sliding block through a fixing structure.

In a preferred embodiment of the present invention, the grasping element is a negative pressure suction head communicated with a negative pressure device.

In a preferred embodiment of the present invention, the transfer driving mechanism includes a vertical driving mechanism and a horizontal driving mechanism, the gripping member is disposed on the vertical driving mechanism, and the vertical driving mechanism is disposed on the horizontal driving mechanism.

Further, the vertical driving mechanism comprises a vertical driving motor and a vertical transmission assembly; the vertical driving motor is fixedly arranged on the transverse transmission plate;

the vertical transmission assembly comprises a vertical transmission belt and two vertical transmission belt wheels, the vertical transmission belt is connected between the two vertical transmission belt wheels, and the grabbing piece is connected with the vertical transmission belt through a mounting frame. Through above-mentioned structure, under vertical driving motor's drive, it can carry out vertical removal to snatch the piece to shift the micelle.

Further, the transverse driving mechanism comprises a first transverse driving mechanism and a second transverse driving mechanism, and the driving direction of the first transverse driving mechanism is vertical to the driving direction of the second transverse driving mechanism;

the first transverse driving mechanism comprises a first transverse driving motor and a first transverse transmission assembly; the first transverse driving motor is fixedly arranged on the transverse moving frame; the first transverse transmission assembly comprises a first transverse transmission screw rod and a first transverse transmission screw rod nut; the first transverse transmission screw rod nut is fixedly connected with the transverse transmission plate;

the second transverse driving mechanism comprises a second transverse driving motor and a second transverse transmission assembly; the second transverse driving motor is fixedly arranged on the carrying rack; the second transverse transmission assembly comprises a second transverse transmission screw rod and a second transverse transmission screw rod nut; and the second transverse transmission screw rod nut is fixedly connected with the transverse moving frame. Through above-mentioned structure, under first transverse driving motor and second transverse driving motor's drive, it can move on two-dimensional plane to snatch the piece to shift the micelle to in the different transport storage tanks.

In a preferred embodiment of the present invention, the blowing driving mechanism includes a blowing driving motor and a blowing transmission assembly, and the blowing driving motor is fixedly disposed on the sweeping machine frame;

the blowing transmission assembly comprises a blowing transmission belt and two blowing transmission belt wheels, and the blowing transmission belt is arranged between the two blowing transmission belt wheels; the air knife is fixedly connected with the blowing transmission belt through the transverse moving plate. Through the structure, the air knife can move transversely under the driving of the air blowing driving motor, so that the plastic package mold is cleaned.

In a preferred embodiment of the present invention, the plastic packaging apparatus further includes a visual inspection module for inspecting the cleaning condition of the mold and the placement position of the wafer. Firstly, in the return stroke process after the air knife is cleaned, the surface of the plastic package mold is subjected to image recognition through the visual detection module, and the cleaning condition of the plastic package mold is detected, so that high cleanliness is guaranteed. And after the wafer to be subjected to plastic packaging is placed, image recognition is carried out on the placing position of the wafer through a visual detection module, whether position deviation and other conditions exist is detected, and if yes, remedial measures are taken in time, so that the plastic packaging quality of the wafer is ensured.

Furthermore, the visual detection module is connected with the driving end of the blowing driving mechanism through the transverse moving plate, so that one driving mechanism can be shared, the visual detection module can carry out transverse movement detection, and a target image can be comprehensively and accurately acquired.

Further, the visual detection module includes camera and refractor, the camera level is placed, the refractor refracts the light of below to the camera that the level was placed in.

Further, the vision detection module further comprises a light supplement lamp for increasing luminosity, and the light supplement lamp is arranged below the transverse moving plate.

In a preferred embodiment of the present invention, the plastic packaging device further includes a plurality of height meters for detecting the placement postures of the wafers, and a height measurement driving mechanism for driving the height meters to move laterally.

Further, the height measuring driving mechanism is composed of a blowing driving mechanism, and the height measuring instrument is connected with the driving end of the blowing driving mechanism through a transverse moving plate;

the plurality of height gauges are uniformly arranged in a direction perpendicular to a driving direction of the blowing driving mechanism. Through above-mentioned structure, after putting into the wafer of treating the plastic envelope, the actuating mechanism drive altimeter that bloies carries out lateral shifting, carries out the height finding to the wafer of below, detects whether to have the circumstances such as "fin", "stick up foot", if, in time takes remedial measure to guarantee the plastic envelope quality of wafer.

In a preferable mode of the invention, the carrying and storing grooves are provided with a plurality of groups, and each group of carrying and storing grooves comprises a plurality of carrying and storing grooves. Like this, can put a plurality of colloidal particles on colloidal particle handling frame, the plastic envelope work of a plurality of wafers is carried out in the follow-up synchronization of being convenient for, improves plastic envelope efficiency.

In a preferred embodiment of the present invention, the conveyance drive mechanism is a multi-degree-of-freedom robot connected to the colloidal particle conveyance frame and the wafer conveyance frame by a structure capable of being quickly detached.

A full-automatic semiconductor plastic package method comprises the following steps:

the wafer carrying frame is placed in the feeding and arranging device, the wafers are neatly placed on the wafer carrying frame by the feeding and arranging device, the wafer carrying frame filled with the wafers is driven to the plastic packaging device by the carrying driving mechanism, and preparation for plastic packaging is made;

putting the colloidal particles into a feeding vibration disc, orderly arranging the colloidal particles by the feeding vibration disc, and sequentially transferring the colloidal particles to a discharging seat through a feeding channel; when the discharging storage groove of the discharging seat is filled with colloidal particles, the grabbing piece is driven by the transfer driving mechanism to be close to the colloidal particles, the colloidal particles are grabbed by the grabbing piece, then the grabbing piece is driven by the transfer driving mechanism to move to the position above the colloidal particle conveying frame, the colloidal particles are aligned with the conveying storage groove below the colloidal particle conveying frame, and the colloidal particles are put into the conveying storage groove;

the conveying driving mechanism drives the colloidal particle conveying frame to move into the plastic packaging device, colloidal particles are placed on the plastic packaging mold, the conveying driving mechanism drives the colloidal particle conveying frame to reset, and the plastic packaging device finishes plastic packaging operation;

before a wafer to be subjected to plastic packaging is placed, an upper die and a lower die of a plastic packaging device are separated, an air knife is driven to move between the upper die and the lower die through a blowing driving mechanism, a blowing device conveys high-speed air flow to the air knife, and the air knife sweeps the lower die;

after the wafer to be subjected to plastic packaging and the colloidal particles are placed, performing plastic packaging operation;

According to a preferable scheme of the invention, after a previous discharging storage tank is filled with colloidal particles, the discharging storage tank is driven to be far away from the feeding channel through the discharging driving mechanism, and meanwhile, the next discharging storage tank is close to the feeding channel; the former row of material storing tank is kept away from material loading passageway and is moved to the place ahead of baffle, is blockked the micelle in this row of material storing tank by the baffle.

In a preferred scheme of the invention, in the whole process of the plastic packaging procedure, the blowing driving mechanism performs at least twice circulating driving:

before a wafer to be plastically packaged is placed, the air blowing driving mechanism is driven forwards for the first time, and the air knife moves between the upper die and the lower die to blow and sweep the lower die; the blowing driving mechanism is reset and driven for the first time, the visual detection module moves transversely and carries out image recognition on the surface of the plastic package mold, and the cleaning condition of the plastic package mold is detected;

after the wafer to be plastically packaged is placed, the air blowing driving mechanism is driven forwards again, the visual detection module moves transversely and carries out image recognition on the placement position of the wafer, and whether the position deviation exists is detected; and the blowing driving mechanism is reset and driven again, the height measuring instrument moves transversely and measures the height of the wafer below, and whether the posture of the wafer is abnormal or not is detected.

Compared with the prior art, the method has the following beneficial effects:

1. the rubber particle discharging and feeding device can automatically complete rubber particle discharging and feeding work without manual participation, and has the advantages of high working efficiency, lower error rate and the like.

2. The invention can clean the plastic package mold before plastic package work begins, avoids sundries such as colloidal particle scraps from influencing normal plastic package work, and is beneficial to improving the plastic package precision and the plastic package quality.

Drawings

Fig. 1-2 are schematic perspective views of two different viewing angles of the fully automatic semiconductor plastic packaging device of the present invention.

Fig. 3-4 are schematic perspective views of two different viewing angles of the feeding and glue discharging device of the present invention.

Fig. 5 is a schematic view of fig. 4 with the transfer mechanism hidden.

Fig. 6 is an enlarged view of X in fig. 5.

Fig. 7 is a schematic perspective view of the transfer mechanism of the present invention.

Fig. 8 is a schematic perspective view of one of the viewing angles of the plastic packaging apparatus of the present invention.

Fig. 9 is a schematic view of the cover with the lateral moving plate hidden in fig. 8.

Fig. 10 is a schematic perspective view of another viewing angle of the plastic packaging apparatus of the present invention.

Detailed Description

In order to make those skilled in the art understand the technical solutions of the present invention well, the following description of the present invention is provided with reference to the embodiments and the accompanying drawings, but the embodiments of the present invention are not limited thereto.

Referring to fig. 1-2, the full-automatic semiconductor plastic package apparatus of this embodiment includes a material loading and discharging device 1 for automatically placing a wafer to be plastic-packaged, a material loading and discharging device 2 for automatically placing colloidal particles, a plastic package device 3 for plastic-packaging the wafer, a glue removing device 4 for removing waste materials on the wafer after plastic-packaging, and a carrying device for carrying materials between multiple stations.

The feeding and sheet discharging device 1 and the glue removing device 4 respectively adopt a sheet discharging machine and a glue punching machine (runner punching machine) in the prior art.

Referring to fig. 2-6, the feeding and glue discharging device 2 includes a feeding vibration tray 2-1 for orderly conveying the colloidal particles and a transferring and discharging mechanism for transferring and placing the colloidal particles. The transfer discharging mechanism comprises a discharging mechanism and a transfer mechanism, the discharging mechanism comprises a discharging seat 2-2 and a discharging driving mechanism for driving the discharging seat 2-2 to move, a plurality of discharging storage grooves 2-2-1 for temporarily storing colloidal particles are formed in the discharging seat 2-2, and one side, close to the feeding vibration disc 2-1, of each discharging storage groove 2-2-1 is of an open structure; under the working state, the discharging driving mechanism sequentially drives the discharging storage groove 2-2-1 of the discharging seat 2-2 to move to the front of the feeding channel 2-1-1 of the feeding vibrating disk 2-1.

Referring to fig. 2-6, a blocking mechanism is arranged at an outlet of the feeding channel 2-1-1, the blocking mechanism comprises a blocking piece 2-3 and a blocking driving mechanism, and the blocking piece 2-3 is connected with a driving end of the blocking driving mechanism.

Further, the blocking driving mechanism comprises a blocking driving cylinder 2-4, and a telescopic rod of the blocking driving cylinder 2-4 is fixedly connected with the blocking sheet 2-3. Through the structure, when the discharging seat 2-2 is far away from the feeding channel 2-1-1, the blocking piece 2-3 extends to the outlet of the feeding channel 2-1-1 under the driving of the blocking driving cylinder 2-4 to block colloidal particles in the feeding channel 2-1-1; after the discharging seat 2-2 approaches, the driving cylinder 2-4 is blocked to drive the blocking sheet 2-3 to be far away from the outlet of the feeding channel 2-1-1 again, and the colloidal particles are continuously transferred.

Referring to fig. 6, the discharging mechanism further comprises a baffle 2-5, the baffle 2-5 is erected on one side of the open structure close to the discharging storage groove 2-2-1, and the extending direction of the baffle 2-5 is parallel to the arrangement direction of the discharging storage grooves 2-2-1; when the discharge storage groove 2-2-1 moves to the front of the baffle 2-5, the discharge storage groove 2-2-1 is in a closed state. Through the structure, after the last discharging storage tank 2-2-1 is loaded with colloidal particles, the discharging storage tank 2-2-1 is driven to be far away from the feeding channel 2-1-1 through the discharging driving mechanism, and meanwhile, the next discharging storage tank 2-2-1 is close to the feeding channel 2-1-1; the last discharging storage groove 2-2-1 is far away from the feeding channel 2-1-1 and then moves to the front of the baffle 2-5, so that the baffle 2-5 can block the colloidal particles in the discharging storage groove 2-2-1 and prevent the colloidal particles from falling.

Referring to fig. 2-6, the discharge drive mechanism includes a discharge drive motor 2-6 and a discharge drive assembly; the discharging driving motor 2-6 is fixedly arranged on the equipment rack 2-7; the discharging transmission assembly comprises a discharging transmission belt and two discharging transmission belt wheels, the discharging transmission belt is connected between the two discharging transmission belt wheels, and the discharging seat 2-2 is connected with the discharging transmission belt. Through the structure, the discharging seat 2-2 can move transversely in front of the feeding channel 2-1-1 under the driving of the discharging driving motor 2-6, and then colloidal particles are loaded in sequence.

Further, a linear guide structure is arranged between the discharging seat 2-2 and the equipment rack 2-7 and comprises a linear guide rail and a sliding block, the linear guide rail is fixedly arranged on the equipment rack 2-7, and the discharging seat 2-2 is connected with the sliding block through a fixing structure.

Referring to fig. 3-4 and 7, the transfer mechanism comprises a plurality of gripping members 2-8 for gripping the colloidal particles and a transfer driving mechanism for driving the gripping members 2-8 to move; wherein, the grabbing pieces 2 to 8 are negative pressure suction heads communicated with a negative pressure device.

Referring to fig. 3-4 and 7, the transfer drive mechanism includes a vertical drive mechanism on which the grippers 2-8 are disposed and a transverse drive mechanism on which the vertical drive mechanism is disposed.

Further, the vertical driving mechanism comprises vertical driving motors 2-9 and a vertical transmission assembly; the vertical driving motors 2-9 are fixedly arranged on the transverse transmission plates 2-10; the vertical transmission assembly comprises a vertical transmission belt and two vertical transmission belt wheels, the vertical transmission belt is connected between the two vertical transmission belt wheels, and the grabbing piece 2-8 is connected with the vertical transmission belt through the mounting frame 2-16. Through the structure, the grabbing pieces 2-8 can move vertically under the driving of the vertical driving motors 2-9, so that colloidal particles are transferred.

Further, the transverse driving mechanism comprises a first transverse driving mechanism and a second transverse driving mechanism, and the driving direction of the first transverse driving mechanism is vertical to the driving direction of the second transverse driving mechanism; the first transverse driving mechanism comprises a first transverse driving motor 2-11 and a first transverse transmission assembly; the first transverse driving motor 2-11 is fixedly arranged on the transverse moving frame 2-12; the first transverse transmission assembly comprises a first transverse transmission screw rod and a first transverse transmission screw rod nut; the first transverse transmission screw rod nut is fixedly connected with the transverse transmission plates 2-10; the second transverse driving mechanism comprises second transverse driving motors 2-13 and a second transverse transmission assembly; the second transverse driving motor 2-13 is fixedly arranged on the carrying rack 2-14; the second transverse transmission assembly comprises a second transverse transmission screw rod and a second transverse transmission screw rod nut; and the second transverse transmission screw rod nut is fixedly connected with the transverse moving frame 2-12. Through the structure, the grabbing pieces 2-8 can move on a two-dimensional plane under the driving of the first transverse driving motor 2-11 and the second transverse driving motor 2-13, so that the colloidal particles are transferred to different carrying and storing tanks 5-2-1.

Referring to fig. 1-3 and 8-10, the plastic package device 3 includes a plastic package mold and a cleaning mechanism for cleaning the plastic package mold; the plastic package mold comprises an upper mold 3-1 and a lower mold 3-2, and the specific structure can refer to a plastic package machine in the prior art.

The cleaning mechanism comprises a blowing assembly and a blowing driving mechanism for driving the blowing assembly to move transversely, the blowing assembly comprises an air knife 3-3 and an air supply pipe, and two ends of the air supply pipe are connected with the air knife 3-3 and an air blowing device; in a working state, the air blowing driving mechanism drives the air knife 3-3 to move between the upper die 3-1 and the lower die 3-2, and the air knife 3-3 cleans the workpiece.

The blowing driving mechanism comprises a blowing driving motor 3-4 and a blowing transmission assembly, and the blowing driving motor 3-4 is fixedly arranged on the sweeping rack; the blowing transmission assembly comprises a blowing transmission belt and two blowing transmission belt wheels, and the blowing transmission belt is arranged between the two blowing transmission belt wheels; the air knife 3-3 is fixedly connected with the blowing transmission belt through a transverse moving plate 3-7. Through the structure, the air knife 3-3 can move transversely under the driving of the air blowing driving motor 3-4, so that the plastic package mold is cleaned.

Referring to fig. 1-3 and 8-10, the plastic packaging device 3 further includes a visual inspection module for inspecting the cleaning condition of the mold and the placement position of the wafer; the visual detection module comprises cameras 3-5 and refractors 3-6, the cameras 3-5 are horizontally placed, and the refractors 3-6 refract the light rays below into the cameras 3-5 which are horizontally placed. Through the structure, firstly, in the return stroke process after the air knife 3-3 is cleaned, the surface of the plastic package mold is subjected to image recognition through the visual detection module, and the cleaning condition of the plastic package mold is detected, so that high neatness and cleanliness are guaranteed. And after the wafer to be subjected to plastic packaging is placed, image recognition is carried out on the placing position of the wafer through a visual detection module, whether position deviation and other conditions exist is detected, and if yes, remedial measures are taken in time, so that the plastic packaging quality of the wafer is ensured.

Furthermore, the visual detection module is connected with the driving end of the blowing driving mechanism through the transverse moving plates 3-7, so that one driving mechanism can be shared, the visual detection module can carry out transverse movement detection, and a target image can be accurately obtained.

Further, the vision detection module further comprises a light supplement lamp 3-8 for increasing luminosity, and the light supplement lamp 3-8 is arranged below the transverse moving plate 3-7.

Referring to fig. 1-3 and 9-10, the plastic package device 3 further includes a plurality of height meters 3-9 for detecting the placing postures of the wafers (lead frames) and a height measurement driving mechanism for driving the height meters 3-9 to move transversely.

Further, the height measuring driving mechanism is composed of a blowing driving mechanism, and the height measuring instrument 3-9 is connected with the driving end of the blowing driving mechanism through a transverse moving plate 3-7; the plurality of altimeters 3-9 are arranged uniformly in a direction perpendicular to the driving direction of the blowing driving mechanism. Through the structure, after the lead frame to be subjected to plastic packaging is placed, the blowing driving mechanism drives the height measuring instruments 3-9 to move transversely, the height of the lead frame below is measured, whether the conditions of 'fin', 'pin warp' and the like exist or not is detected, and if yes, remedial measures are taken in time, so that the plastic packaging quality of the lead frame is ensured.

Referring to fig. 1-6, the conveying device comprises a wafer conveying frame 5-1 (see the feeding frame of the lead frame in the prior art) for storing wafers, a colloidal particle conveying frame 5-2 for storing colloidal particles, and a conveying driving mechanism for driving the wafer conveying frame 5-1 and the colloidal particle conveying frame 5-2 to move, wherein a conveying storage groove 5-2-1 for storing colloidal particles is arranged on the colloidal particle conveying frame 5-2; the conveying driving mechanism is arranged among the feeding and discharging device 1, the feeding and discharging device 2, the plastic packaging device 3 and the glue removing device 4.

Wherein, the carrying and storing grooves 5-2-1 are provided with a plurality of groups, and each group of carrying and storing grooves 5-2-1 comprises a plurality of carrying and storing grooves 5-2-1. Therefore, a plurality of colloidal particles can be placed on the colloidal particle conveying frame 5-2, so that the subsequent plastic packaging work of a plurality of wafers can be conveniently and synchronously performed, and the plastic packaging efficiency is improved.

Specifically, the conveying driving mechanism is composed of a multi-degree-of-freedom manipulator 5-3, and the multi-degree-of-freedom manipulator 5-3 is connected with the colloidal particle conveying frame 5-2 and the wafer conveying frame 5-1 through a structure capable of being rapidly disassembled and assembled.

Referring to fig. 1 to 10, the method for plastic packaging of a full-automatic semiconductor of the present embodiment includes the following steps:

the wafer carrier 5-1 is placed in the loading and discharging device 1, the wafer is neatly placed on the wafer carrier 5-1 by the loading and discharging device 1, and the wafer carrier 5-1 filled with the wafers is driven by the carrier driving mechanism to the plastic sealing device 3, so that preparation for plastic sealing is made.

A large amount of colloidal particles are put into a feeding vibration disc 2-1, the feeding vibration disc 2-1 is used for orderly arranging the colloidal particles, and the colloidal particles are sequentially transferred to a discharging seat 2-2 through a feeding channel 2-1-1; when the discharging storage groove 2-2-1 of the discharging seat 2-2 is filled with colloidal particles, the transfer driving mechanism drives the grabbing part 2-8 to be close to the colloidal particles, the grabbing part 2-8 grabs the colloidal particles, the transfer driving mechanism drives the grabbing part 2-8 to move to the upper part of the colloidal particle conveying frame 5-2, the colloidal particles are aligned with the conveying storage groove 5-2-1 below the colloidal particle conveying frame, and the colloidal particles are thrown into the conveying storage groove 5-2-1.

The conveying driving mechanism drives the colloidal particle conveying frame 5-2 to move into the plastic packaging device 3, and colloidal particles are placed on a plastic packaging mold; the conveying driving mechanism drives the colloidal particle conveying frame 5-2 to reset, and the plastic packaging operation is completed by the plastic packaging device 3.

Before a wafer to be subjected to plastic packaging is placed, an upper die 3-1 and a lower die 3-2 of a plastic packaging device 3 are separated, an air knife 3-3 is driven to move between the upper die 3-1 and the lower die 3-2 through an air blowing driving mechanism, a high-speed air flow is conveyed to the air knife 3-3 through an air blowing device, the lower die 3-2 is blown and swept through the air knife 3-3, and sundries such as colloidal particles and scraps on the die are removed.

And after the wafer to be subjected to plastic packaging and the colloidal particles are placed, performing plastic packaging operation.

After the plastic packaging is finished, the wafer carrying frame 5-1 provided with the wafer after the plastic packaging is driven by the carrying driving mechanism to move to the glue removing device 4, and the corner plastic waste materials on the wafer after the plastic packaging are removed by the glue removing device 4, so that the whole plastic packaging process is finished.

In the whole process of the plastic packaging process, the blowing driving mechanism performs at least twice circulating driving:

before a wafer to be plastically packaged is placed, the air blowing driving mechanism is driven forwards for the first time, the air knife 3-3 moves between the upper die 3-1 and the lower die 3-2, the lower die 3-2 is blown and swept, and impurities such as colloidal particle fragments and the like on the die are removed; the blowing driving mechanism is reset and driven for the first time, the visual detection module (the camera 3-5) moves transversely and carries out image recognition on the surface of the plastic package mold, and the cleaning condition of the plastic package mold is detected.

After the wafer to be plastically packaged is placed, the air blowing driving mechanism is driven forwards again, the visual detection module moves transversely and carries out image recognition on the placement position of the wafer, and whether position deviation exists or not is detected; and the blowing driving mechanism is reset and driven again, the height measuring instrument 3-9 moves transversely and measures the height of the wafer below, and whether the posture of the wafer is abnormal or not is detected.

Referring to fig. 1 to 10, the operating principle of the fully automatic semiconductor plastic packaging device of the present embodiment is as follows:

when the plastic packaging device works, the wafer carrier 5-1 is placed in the feeding and arranging device 1, the wafer is orderly placed on the wafer carrier 5-1 by the feeding and arranging device 1, and then the wafer carrier 5-1 filled with the wafers is driven to the plastic packaging device 3 by the carrier driving mechanism to prepare for plastic packaging.

Placing the colloidal particle conveying frame 5-2 in the feeding and glue discharging device 2, and placing colloidal particles on the colloidal particle conveying frame 5-2 in order by the feeding and glue discharging device 2; wherein, the material loading binder removal operation of material loading binder removal device 2 is: a large amount of colloidal particles are put into a feeding vibration disk 2-1, the colloidal particles are orderly arranged by the feeding vibration disk 2-1, and the colloidal particles are sequentially transferred to a discharging seat 2-2 through a feeding channel 2-1-1. Because the discharging seat 2-2 is provided with the plurality of discharging storage grooves 2-2-1, before the colloidal particles are conveyed out of the feeding channel 2-1-1, the discharging storage grooves 2-2-1 of the discharging seat 2-2 are sequentially driven by the discharging driving mechanism to move to the front of the feeding channel 2-1-1 for loading the colloidal particles. When the discharging storage groove 2-2-1 of the discharging seat 2-2 is filled with colloidal particles, the transfer driving mechanism drives the grabbing piece 2-8 to be close to the colloidal particles, the grabbing piece 2-8 grabs the colloidal particles, the transfer driving mechanism drives the grabbing piece 2-8 to move to the position above the colloidal particle conveying frame 5-2, the colloidal particles are aligned with the conveying storage groove 5-2-1 below the colloidal particle conveying frame, and then the colloidal particles are thrown into the conveying storage groove 5-2-1. And then, the conveying driving mechanism drives the colloidal particle conveying frame 5-2 to move into the plastic packaging device 3, colloidal particles are placed on a mold of the plastic packaging device 3, the conveying driving mechanism drives the colloidal particle conveying frame 5-2 to reset, and then the plastic packaging device 3 finishes plastic packaging operation.

Further, the plastic sealing operation of the plastic sealing device 3 is: and opening the plastic packaging mold, and separating the upper mold 3-1 and the lower mold 3-2 so as to put the wafer to be plastic packaged. Before a lead frame to be subjected to plastic packaging is placed, the air knife 3-3 (the air knife 3-3, the visual detection module and the height indicator 3-9 are all arranged on the transverse moving plate 3-7) is driven to move between the upper die 3-1 and the lower die 3-2 through the air blowing driving mechanism, at the moment, the air blowing device conveys high-speed air flow to the air knife 3-3, the lower die 3-2 is blown and swept by the air knife 3-3, sundries such as colloidal particle fragments and the like on the die are removed, the phenomenon that the normal plastic packaging work is influenced by the sundries such as the colloidal particle fragments and the like is avoided, and the plastic packaging precision and the plastic packaging quality are improved.

And after the wafer to be subjected to plastic packaging and the colloidal particles are placed, performing plastic packaging operation. After plastic packaging is finished, the wafer carrying frame 5-1 provided with the wafer after plastic packaging is driven by the carrying driving mechanism to move into the glue removing device 4, corner plastic waste materials on the wafer after plastic packaging are removed by the glue removing device 4, and the whole plastic packaging process is finished.

The present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents and equivalents thereof, which are intended to be included in the scope of the present invention.

Claims

1. A full-automatic semiconductor plastic package device is characterized by comprising a feeding and chip discharging device, a feeding and glue discharging device, a plastic package device, a glue removing device and a carrying device, wherein the feeding and glue discharging device is used for automatically placing a wafer to be subjected to plastic package;

the feeding and glue discharging device comprises a feeding vibration disc for orderly conveying colloidal particles and a transfer discharging mechanism for transferring and placing the colloidal particles; the transfer discharging mechanism comprises a discharging mechanism and a transfer mechanism, the discharging mechanism comprises a discharging seat and a discharging driving mechanism for driving the discharging seat to move, a plurality of discharging storage grooves for temporarily storing colloidal particles are formed in the discharging seat, and one side, close to the feeding vibration disc, of each discharging storage groove is of an open structure; under the working state, the discharging driving mechanism sequentially drives the discharging storage groove of the discharging seat to move to the front of the feeding channel of the feeding vibration disc; the transfer mechanism comprises a plurality of grabbing pieces for grabbing the colloidal particles and a transfer driving mechanism for driving the grabbing pieces to move;

the plastic packaging device also comprises a visual detection module for detecting the cleaning condition of the die and the placing position of the wafer; the visual detection module is connected with the driving end of the blowing driving mechanism through the transverse moving plate;

the plastic packaging device also comprises a plurality of height meters for detecting the placing postures of the wafers and a height measurement driving mechanism for driving the height meters to transversely move; the height measuring driving mechanism consists of a blowing driving mechanism, and the height measuring instrument is connected with the driving end of the blowing driving mechanism through a transverse moving plate; the plurality of height meters are uniformly arranged along the direction vertical to the driving direction of the blowing driving mechanism;

after the wafer to be plastically packaged is placed, the air blowing driving mechanism is driven forwards again, the visual detection module moves transversely and carries out image recognition on the placement position of the wafer, and whether the position deviation exists is detected; the blowing driving mechanism is reset and driven again, the height measuring instrument moves transversely and measures the height of the lower wafer, and whether the posture of the wafer is abnormal or not is detected; the carrying device comprises a wafer carrying frame for storing wafers, a colloidal particle carrying frame for storing colloidal particles and a carrying driving mechanism for driving the wafer carrying frame and the colloidal particle carrying frame to move; the colloidal particle conveying frame is provided with a conveying and storing groove for storing colloidal particles; the conveying driving mechanism is arranged among the feeding and discharging device, the plastic packaging device and the glue removing device.

2. The apparatus according to claim 1, wherein the discharge mechanism further comprises a baffle plate, the baffle plate is erected at a side of the open structure adjacent to the discharge storage slots, and the extension direction of the baffle plate is parallel to the arrangement direction of the discharge storage slots; when the discharge storage tank moves to the front of the baffle, the discharge storage tank is in a closed state;

after the previous discharging storage tank is filled with the colloidal particles, the discharging storage tank is driven to be far away from the feeding channel through the discharging driving mechanism, and meanwhile, the next discharging storage tank is close to the feeding channel; the former row of material storing tank is kept away from material loading passageway and is moved to the place ahead of baffle, is blockked the micelle in this row of material storing tank by the baffle.

3. The full-automatic semiconductor plastic packaging equipment according to claim 1, wherein the transfer driving mechanism comprises a vertical driving mechanism and a transverse driving mechanism, the grasping member is arranged on the vertical driving mechanism, and the vertical driving mechanism is arranged on the transverse driving mechanism;

the vertical driving mechanism comprises a vertical driving motor and a vertical transmission assembly; the vertical driving motor is fixedly arranged on the transverse transmission plate;

the vertical transmission assembly comprises a vertical transmission belt and two vertical transmission belt wheels, the vertical transmission belt is connected between the two vertical transmission belt wheels, and the grabbing piece is connected with the vertical transmission belt through a mounting frame.

4. The fully automatic semiconductor plastic packaging equipment according to claim 3, wherein the transverse driving mechanism comprises a first transverse driving mechanism and a second transverse driving mechanism, and the driving direction of the first transverse driving mechanism is perpendicular to the driving direction of the second transverse driving mechanism;

the second transverse driving mechanism comprises a second transverse driving motor and a second transverse transmission assembly; the second transverse driving motor is fixedly arranged on the carrying rack; the second transverse transmission assembly comprises a second transverse transmission screw rod and a second transverse transmission screw rod nut; and the second transverse transmission screw rod nut is fixedly connected with the transverse moving frame.

5. The full-automatic semiconductor plastic package equipment according to claim 1, wherein the blowing driving mechanism comprises a blowing driving motor and a blowing transmission assembly, and the blowing driving motor is fixedly arranged on the cleaning rack;

the blowing transmission assembly comprises a blowing transmission belt and two blowing transmission belt wheels, and the blowing transmission belt is arranged between the two blowing transmission belt wheels; the air knife is fixedly connected with the blowing transmission belt through the transverse moving plate.

6. The full-automatic semiconductor plastic package device according to claim 1, wherein the vision inspection module comprises a camera, a refractor and a light supplement lamp for increasing luminosity, and the camera is horizontally placed on the transverse moving plate; the refractor refracts the light rays below the refractor into the horizontally placed camera;

the light supplementing lamp is arranged below the transverse moving plate.

7. A full-automatic semiconductor plastic packaging method applied to the full-automatic semiconductor plastic packaging equipment of claim 1 is characterized by comprising the following steps:

placing a wafer carrying frame in a material loading and sheet arranging device, placing the wafer on the wafer carrying frame by the material loading and sheet arranging device, driving the wafer carrying frame filled with the wafer into a plastic packaging device by a carrying driving mechanism, and preparing for plastic packaging;

in the whole process of the plastic packaging procedure, the blowing driving mechanism performs at least twice circular driving:

before a wafer to be plastically packaged is placed, the air blowing driving mechanism is driven forwards for the first time, and the air knife moves between the upper die and the lower die to blow and sweep the lower die; the air blowing driving mechanism is reset and driven for the first time, the visual detection module moves transversely and performs image recognition on the surface of the plastic package mold, and the cleaning condition of the plastic package mold is detected;

after the wafer to be plastically packaged is placed, the air blowing driving mechanism is driven forwards again, the visual detection module moves transversely and carries out image recognition on the placement position of the wafer, and whether the position deviation exists is detected; the blowing driving mechanism is reset and driven again, the height measuring instrument moves transversely and measures the height of the lower wafer, and whether the posture of the wafer is abnormal or not is detected;

after the wafer and the colloidal particles to be subjected to plastic packaging are placed in the mold, performing plastic packaging operation;