CN111933551B - All-in-one is selected separately in image sensor chip test - Google Patents
All-in-one is selected separately in image sensor chip test Download PDFInfo
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- CN111933551B CN111933551B CN202010811747.0A CN202010811747A CN111933551B CN 111933551 B CN111933551 B CN 111933551B CN 202010811747 A CN202010811747 A CN 202010811747A CN 111933551 B CN111933551 B CN 111933551B
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- 238000012360 testing method Methods 0.000 title claims abstract description 108
- 230000007246 mechanism Effects 0.000 claims abstract description 124
- 230000002950 deficient Effects 0.000 claims abstract description 23
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 239000000463 material Substances 0.000 claims abstract description 15
- 238000007689 inspection Methods 0.000 claims abstract description 14
- 230000005540 biological transmission Effects 0.000 claims description 6
- 238000011179 visual inspection Methods 0.000 abstract description 9
- 230000009471 action Effects 0.000 abstract description 4
- 238000012546 transfer Methods 0.000 abstract description 2
- 230000007547 defect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 230000001133 acceleration Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000011990 functional testing Methods 0.000 description 2
- 238000012216 screening Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000013100 final test Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
Abstract
The invention discloses an image sensor chip testing and sorting all-in-one machine which comprises a to-be-tested flow channel, a testing flow channel, a good product flow channel and a bad product flow channel which are sequentially arranged and are provided with conveying mechanisms, wherein the front end of the to-be-tested flow channel is provided with a to-be-tested full-material tray loading bin, and the rear end of the to-be-tested flow channel is provided with an empty tray unloading bin; the front end of the good product flow passage is provided with a good product full material tray unloading bin, and the rear end of the good product flow passage is provided with an empty tray loading bin; a lower test seat with a heating function is arranged on the conveying mechanism of the test flow channel, and a matched lower pressing test mechanism is arranged at the rear end of the test flow channel; a conveying mechanism of the defective product flow channel is provided with a tray for storing the defective products; a beam is spanned above each flow passage, and a chip suction mechanism capable of moving along the beam is respectively arranged at the front side and the rear side of the beam. The chip testing, heating, visual inspection and other functions are integrated in the whole sorting machine, only one step of pause and photographing inspection is added in the original action logic, and the risk of damage or pollution caused by chip transfer can be effectively avoided.
Description
Technical Field
The invention belongs to a chip testing and packaging technology, and particularly relates to an image sensor chip testing and sorting all-in-one machine.
Background
In a chip testing and packaging process of a semiconductor, a chip of an image sensor needs to be heated at high temperature while performing a functional test, appearance defects of a tin spherical surface of a product are inspected, and classification is performed according to a final test and inspection result.
However, the three functions of high temperature, testing and visual inspection of defects are not integrated into one machine at present. Therefore, after the functional tests are completed, the chips need to be additionally placed on a separate vision inspection machine for inspection and screening again, and the operations of carrying, loading, unloading, inspection, taking and placing are repeated, so that the risk of chip damage or pollution is increased.
Disclosure of Invention
The invention aims to solve the technical problem of providing an image sensor chip testing and sorting all-in-one machine which has a multifunctional detecting and sorting effect through reasonable layout.
In order to solve the technical problems, the invention adopts the following technical scheme:
an image sensor chip testing and sorting all-in-one machine comprises a flow channel to be tested, a testing flow channel, a good product flow channel and a defective product flow channel which are sequentially arranged and are all provided with a conveying mechanism, wherein the front end of the flow channel to be tested is provided with a full tray loading bin to be tested, and the rear end of the flow channel to be tested is provided with an empty tray unloading bin; the front end of the good product flow passage is provided with a good product full material tray unloading bin, and the rear end of the good product flow passage is provided with an empty tray loading bin; a lower test seat with a heating function is arranged on the conveying mechanism of the test flow channel, and a matched lower pressing test mechanism is arranged at the rear end of the test flow channel; a conveying mechanism of the defective product flow channel is provided with a tray for storing the defective products; a beam is spanned above each flow passage, and a chip suction mechanism capable of moving along the beam is respectively arranged at the front side and the rear side of the beam.
The lower test seat is provided with a plurality of chip test grooves, and a plurality of heating rods and temperature sensors are arranged in the lower test seat.
The chip visual inspection device is arranged between the testing flow channel and the good product flow channel and is positioned below the moving path of the chip suction mechanism on the rear side.
The chip suction mechanism comprises a plurality of suction heads, independent lifting mechanisms and an integral lifting mechanism which are fixed on the mounting plate, the distance between the suction heads is the same as that of the chip testing groove, each suction head is provided with an independent lifting mechanism, the integral lifting mechanism is connected with the mounting plate, and the two sides of the cross beam are respectively provided with a transverse moving mechanism corresponding to the chip suction mechanism.
The independent lifting mechanism is an air cylinder which is respectively arranged at the upper end of each suction head and is fixed on the mounting plate.
The whole lifting mechanism comprises a lifting motor, a transmission mechanism, a screw rod assembly and a guide rod assembly, wherein the transmission mechanism comprises a pair of belt pulleys which are respectively arranged at the upper ends of a lifting motor shaft and a screw rod, and a sliding block of the screw rod assembly is connected with a sliding block of the guide assembly through a connecting block and is connected with the mounting plate through a connecting block.
The number of the suction heads is the same as that of the chip testing grooves of the lower testing seat.
The transverse moving mechanism adopts a linear module, the transverse moving mechanism on the front side of the cross beam is arranged on the flow channel to be tested and the test flow channel in a spanning mode, and the transverse moving mechanism on the rear side of the cross beam is arranged on the good product flow channel and the defective product flow channel in a spanning mode.
The conveying mechanisms in the flow channel to be detected and the flow channel to be qualified comprise rails and shuttle flying mechanisms arranged in the rails, and each shuttle flying mechanism comprises a shuttle car and a linear module driving the shuttle car to reciprocate.
The conveying mechanism in the test flow channel adopts a linear module, and the conveying mechanism in the defective product flow channel comprises the linear module and auxiliary slide rails arranged on two sides of the linear module.
The integrated testing and sorting machine for the image sensor chip has the following advantages that:
1. the lower test seat with the heating function is adopted, so that the heating requirement of chips such as an image sensor and the like during testing can be met; through setting up a plurality of heating rods and temperature-sensing ware, can effectively regulate and control heating temperature and make the heating keep whole equilibrium.
2. Adopt chip vision inspection device, can accomplish the inspection and the screening of appearance defects such as chip lower surface when the test is selected separately, improve efficiency, reduced the risk that the chip received the pollution, and the vision inspection station arranges on the chip suction means's of rear side removal route, can avoid the elongation in arm route, also is favorable to raising the efficiency.
3. Adopt a plurality of intervals and the same head that absorbs of chip test recess, can once put into down the test seat with a plurality of chips that await measuring, and according to the different specifications of the full material tray that awaits measuring, adopted independent elevating system again to cooperate sideslip mechanism with the control absorb the head with this independent lift absorb corresponding chip in the tray.
Drawings
The invention is described in detail below with reference to the following figures and detailed description:
fig. 1 is a schematic structural diagram of the testing and sorting all-in-one machine of the invention.
Fig. 2 is a schematic view of the mounting of the chip suction mechanism on the front side of the present invention.
FIG. 3 is a schematic structural diagram of a lower test socket of the present invention.
Fig. 4 is a schematic top view of a chip vision inspection apparatus mounting site of the present invention.
FIG. 5 is a schematic structural diagram of a lower test socket of the present invention.
Fig. 6 is a schematic structural view of the chip suction mechanism of the present invention.
Fig. 7 is a schematic view of the lifting structure of the chip suction mechanism of the present invention.
Fig. 8 is a schematic structural diagram of a conveying mechanism of a flow channel to be tested or a good product flow channel according to the present invention;
fig. 9 is a schematic structural view of a conveying mechanism of the test flow channel of the present invention;
fig. 10 is a schematic structural view of a conveying mechanism of a defective product flow path according to the present invention;
fig. 11 is a schematic structural view of the tray stacking and separating mechanism of the present invention.
Detailed Description
The integrated testing and sorting machine for the image sensor chip is shown in fig. 1-4 and mainly comprises a flow channel to be tested 1, a testing flow channel 2, a good product flow channel 3 and a defective product flow channel 4 which are transversely arranged in sequence and are all provided with a conveying mechanism. As shown in fig. 8, the conveying mechanisms in the flow channel to be tested 1 and the good product flow channel 3 both include a rail 13 and a shuttle flying mechanism 9 disposed in the rail 13, the shuttle flying mechanism 9 includes a shuttle car 91 and a linear module 8 for driving the shuttle car 91 to reciprocate, the shuttle car 91 clamps the carrying tray 10, and the linear module 8 drives the shuttle car 91 and drags the tray 10 to convey backward, and return to the empty state. A full-material tray loading bin 11 to be detected is arranged at the front end of the runner 1 to be detected, an empty tray unloading bin 12 is arranged at the rear end of the runner 1 to be detected, a plurality of trays 10 filled with chips to be detected are stacked in the full-material tray loading bin 11 to be detected, and after the chips are completely sucked away, the empty trays 10 are conveyed to the empty tray unloading bin 12 by the flying shuttle mechanism 9; the front end of the good product runner 3 is provided with a good product full material tray unloading bin 31, the rear end is provided with an empty tray loading bin 32, and after the empty trays 10 in the empty tray loading bin 32 are filled with good product chips, the good product full material tray unloading bin 31 is conveyed from back to front by the flying shuttle mechanism 9.
As shown in fig. 11, the full tray loading bin 11 and the empty tray unloading bin 12 to be tested of the flow channel 1 to be tested, and the good product full tray unloading bin 31 and the empty tray loading bin 32 of the good product flow channel 3 are both provided with tray stacking and separating mechanisms 20, which include a plurality of pairs of latch mechanisms 21 (two pairs are shown) driven by a motor and respectively disposed at two sides of the track, and a jacking mechanism 22 driven by a motor and disposed below the track, when the jacking mechanism 22 ascends to hold the whole stacked trays from below, the latch mechanism 21 releases the tray at the lowest layer, the jacking mechanism 22 descends by one layer to place the tray at the lowest layer on the shuttle car 91, and the latch mechanism is inserted into the bayonet 23 of the tray at the upper layer to be fixed, so as to separate and take out a tray from below, otherwise, stacking of trays at the other end from below to above can be realized.
The conveying mechanism of the test runner 2 is provided with a lower test seat 21 with a heating function, the rear end of the test runner 2 is provided with a matched press-down test mechanism 22, when a chip to be tested is placed in the lower test seat 21 and then conveyed to the lower part of the press-down test mechanism 22 through a linear module, the chip is pressed down and combined through the press-down test mechanism 22 to carry out corresponding chip test, and if the test needs heating, the heating function (or preheating) can be started. The number of the conveying mechanisms of the test flow channel 2 can be a plurality of side-by-side conveying mechanisms, the number is four in the figure, each conveying mechanism is provided with a lower test seat 21 and a lower pressure test mechanism 22, the four conveying mechanisms can respectively carry out independent operation tests, and when a chip of a certain lower test seat 21 is full, the chip can be conveyed to be tested, so that the efficiency is improved. As shown in fig. 9, the conveying mechanism of the test flow channel 2 only uses the linear module 8, and the linear motor drives the lower test seat 21 to move back and forth.
As shown in fig. 10, the conveying mechanism in the defective product flow path 4 includes a linear module 8 and auxiliary slide rails 42 disposed on two sides of the linear module 8, and is used for auxiliary carrying during conveying of the large tray 41. When the defective chips are filled, the tray 41 can be transported to the rear side by the linear module 8. A beam 5 spans above each flow channel, a chip suction mechanism 6 capable of moving along the beam 5 is respectively arranged at the front side and the rear side of the beam 5, the chip suction mechanism 6 at the front side is used for sucking and taking out chips in full trays in the flow channel 1 to be tested and placing the chips in the full trays in the corresponding lower test seat 21, and the chip suction mechanism 6 at the rear side is used for sucking and taking out chips which are tested in the lower test seat 21 and placing the chips in empty trays of corresponding good product flow channels 3 or trays of corresponding bad product flow channels 4 according to test results.
As shown in fig. 5, as an embodiment, each of the lower test seats 21 has a plurality of chip test grooves 23 (four are shown), and a plurality of heating rods 24 and temperature sensors 25 such as thermocouples are disposed in the lower test seats 21 at intervals, so that the heating temperature can be effectively controlled by measuring the temperature, and the heating can be maintained uniformly at intervals.
As an embodiment, the testing and sorting all-in-one machine further includes a chip vision inspection device 26, which is disposed between the testing flow channel 2 and the good product flow channel 3 and below the moving path of the chip suction mechanism 6 on the rear side, when the tested lower testing seat 21 is moved back to below the chip suction mechanism 6 on the rear side, the chip is sucked by the chip suction mechanism 6 on the rear side and transferred to the chip vision inspection device 26, and the chip vision inspection device 26 inspects the defects on the lower surface (i.e. the tin sphere) of the chip one by one.
As an embodiment, as shown in fig. 6-7, each of the chip suction mechanisms 6 includes a plurality of suction heads 61 (four suction heads are shown as being the same as the chip test grooves 23) fixed on the mounting plate 62, an independent lifting mechanism, and an integral lifting mechanism, wherein the distance between the suction heads 61 is the same as the distance between the chip test grooves 23, so that chips on the plurality of suction heads 61 can be conveniently placed in the corresponding chip test grooves 23 at a time, each suction head 61 has an independent lifting mechanism capable of independently driving the corresponding suction head 61 to lift, the integral lifting mechanism is connected to the mounting plate 62 to drive the plurality of suction heads 61 to integrally and synchronously lift, and the cross-moving mechanisms corresponding to the chip suction mechanisms 6 are respectively disposed on both sides of the beam 5 to drive the chip suction mechanisms 6 to move transversely along the beam 5.
The independent lifting mechanism can specifically adopt an air cylinder 63 which is respectively arranged at the upper end of each suction head 61 and fixed on the mounting plate 62. The whole lifting mechanism comprises a lifting motor 64, a transmission mechanism, a lead screw 66 assembly and a guide rod assembly 67, the transmission mechanism comprises a pair of belt pulleys 65 which are respectively arranged at the upper ends of the shaft of the lifting motor 64 and the lead screw, and a sliding block of the lead screw assembly 66 is connected with a sliding block of the guide rod assembly 67 through a connecting block 68 and is connected with the mounting plate 62 through the connecting block 68. Through the positive and negative rotation of the lifting motor 64, the belt pulley 65 drives the mounting plate 62 on the screw assembly 66 to integrally lift, and the guide assembly 67 plays a role in lifting and guiding.
The transverse moving mechanism also adopts a linear module 8, the transverse moving mechanism at the front side of the cross beam 5 is arranged on the flow channel 1 to be tested and the test flow channel 2 in a spanning mode, and the transverse moving mechanism at the rear side of the cross beam 5 is arranged on the good product flow channel 3 and the defective product flow channel 4 in a spanning mode. Adopt linear module 8, its linear electric motor has the speed and the acceleration of preferred, has very big improvement to absorbing sorting efficiency, even increased chip visual inspection can not cause the influence to efficiency yet.
The working principle of the testing and sorting all-in-one machine is as follows:
1. a tray stacking and separating mechanism and a flying shuttle mechanism of a runner 1 to be detected act, a material tray is taken from a full material tray loading bin 11 to be detected and is moved forwards to a material taking station (below a chip suction mechanism 6 at the front side);
2. the tray stacking and separating mechanism and the flying shuttle mechanism of the good product runner 3 act to take an empty tray from the empty tray loading bin 32 and move the empty tray to the discharging station (below the chip sucking mechanism 6 at the rear side);
3. the chip suction mechanism 6 at the front side sucks four chips one by one, moves the chip to the upper part of the lower test seat 21 at the left side, and places the chip in the chip test groove 23 corresponding to the lower test seat 21;
4. the lower test seat 21 on the left moves to the position below the lower pressing test mechanism 22 at the rear end through the shuttle vehicle, the lower pressing test mechanism 22 and the lower test seat 21 are used for pressing and testing the performance of the chip, and after the test is finished, the lower test seat 21 returns to the corresponding position of the chip suction mechanism 6 at the rear side of the beam 5;
5. the chip suction mechanism 6 on the rear side takes out the four tested chips, then translates the four tested chips to a visual inspection station, inspects the four chips one by one, puts good products into empty trays in good product flow channels according to final results after the four chips are inspected, and correspondingly puts defective products into one of six defective trays in defective product flow channels according to defective information classification;
by analogy, after the material of the tray to be tested is taken out, the flying shuttle mechanism pushes the empty tray to the position below the empty tray unloading bin 12, the empty tray is piled into the empty tray unloading bin 12 through the bottom jacking mechanism, and the flying shuttle mechanism takes a full tray of the material to be tested again; and after the empty tray of the good product runner is filled with good product chips, the full tray is pushed to the position below the good product full tray by the flying shuttle mechanism, the full tray is stacked into the good product full tray by the bottom jacking mechanism, the flying shuttle mechanism can take the empty tray again, and then the actions of material taking, testing, checking and discharging are continuously and circularly carried out.
In summary, the present invention integrates the chip testing, heating and visual inspection functions into the whole sorting machine, and only one step of pause and photographing inspection is added to the original action logic, so as to effectively avoid the risk of damage or pollution caused by the chip transfer. In addition, the linear motor moving at high speed is matched to increase the movement speed, so that the problem that the movement beat time length is increased due to the fact that the visual inspection function is added is solved. In addition, the invention eliminates the risk of slowing down the exercise tempo caused by function increase through reasonable layout and mechanism optimization. The reason why the exercise tempo becomes slow is: 1. as the sorting result has more appearance defects, the number of trays for placing defective products is increased, and the size of a defective product placing station is increased; 2. the chip that comes out from test seat 21 down, originally be according to test result direct sorting to corresponding tray in, the action of shooing is carried out to the visual inspection station that removes earlier before sucking the arm and can placing now, because the existence of this station, can directly lead to the arm stroke to lengthen. Aiming at the two points, firstly, the visual inspection station is arranged in the arm moving route, and in addition, a linear motor is selected, so that the speed and the acceleration are greatly improved, and the influence on the productivity is comprehensively reduced.
However, those skilled in the art should realize that the above embodiments are illustrative only and not limiting to the present invention, and that changes and modifications to the above described embodiments are intended to fall within the scope of the appended claims, provided they fall within the true spirit of the present invention.
Claims (9)
1. The utility model provides an all-in-one is selected separately in image sensor chip test which characterized in that: the device comprises a to-be-tested flow channel, a testing flow channel, a good product flow channel and a defective product flow channel which are sequentially arranged and are provided with conveying mechanisms, wherein the front end of the to-be-tested flow channel is provided with a to-be-tested full tray loading bin, and the rear end of the to-be-tested flow channel is provided with an empty tray unloading bin; the front end of the good product flow passage is provided with a good product full material tray unloading bin, and the rear end of the good product flow passage is provided with an empty tray loading bin; a lower test seat with a heating function is arranged on the conveying mechanism of the test flow channel, and a matched lower pressing test mechanism is arranged at the rear end of the test flow channel; a conveying mechanism of the defective product flow channel is provided with a tray for storing the defective products; each runner top still spans there is a crossbeam, and both sides divide to be equipped with one along the chip suction means of crossbeam removal around the crossbeam, still includes chip vision inspection device, locates between test runner and the yields runner and be located the chip suction means's of rear side removal route below.
2. The image sensor chip testing and sorting all-in-one machine of claim 1, wherein: the lower test seat is provided with a plurality of chip test grooves, and a plurality of heating rods and temperature sensors are arranged in the lower test seat.
3. The image sensor chip testing and sorting all-in-one machine of claim 2, wherein: the chip suction mechanism comprises a plurality of suction heads, independent lifting mechanisms and an integral lifting mechanism which are fixed on the mounting plate, the distance between the suction heads is the same as that of the chip testing groove, each suction head is provided with an independent lifting mechanism, the integral lifting mechanism is connected with the mounting plate, and the two sides of the cross beam are respectively provided with a transverse moving mechanism corresponding to the chip suction mechanism.
4. The image sensor chip testing and sorting all-in-one machine of claim 3, wherein: the independent lifting mechanism is an air cylinder which is respectively arranged at the upper end of each suction head and is fixed on the mounting plate.
5. The image sensor chip testing and sorting all-in-one machine of claim 3, wherein: the whole lifting mechanism comprises a lifting motor, a transmission mechanism, a screw rod assembly and a guide rod assembly, wherein the transmission mechanism comprises a pair of belt pulleys which are respectively arranged at the upper ends of a lifting motor shaft and a screw rod, and a sliding block of the screw rod assembly is connected with a sliding block of the guide assembly through a connecting block and is connected with the mounting plate through a connecting block.
6. The image sensor chip testing and sorting all-in-one machine of claim 3, wherein: the number of the suction heads is the same as that of the chip testing grooves of the lower testing seat.
7. The image sensor chip testing and sorting all-in-one machine of claim 3, wherein: the transverse moving mechanism adopts a linear module, the transverse moving mechanism on the front side of the cross beam is arranged on the flow channel to be tested and the test flow channel in a spanning mode, and the transverse moving mechanism on the rear side of the cross beam is arranged on the good product flow channel and the defective product flow channel in a spanning mode.
8. The image sensor chip testing and sorting all-in-one machine of claim 1, wherein: the conveying mechanisms in the flow channel to be detected and the flow channel to be qualified comprise rails and shuttle flying mechanisms arranged in the rails, and each shuttle flying mechanism comprises a shuttle car and a linear module driving the shuttle car to reciprocate.
9. The image sensor chip testing and sorting all-in-one machine of claim 1, wherein: the conveying mechanism in the test flow channel adopts a linear module, and the conveying mechanism in the defective product flow channel comprises the linear module and auxiliary slide rails arranged on two sides of the linear module.
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| CN114377986B (en) * | 2022-01-20 | 2023-04-18 | 无锡昌鼎电子有限公司 | Chip sorting machine |
| CN114690024B (en) * | 2022-05-31 | 2022-08-26 | 广东东博自动化设备有限公司 | Full-automatic chip testing machine |
| CN115069575A (en) * | 2022-05-31 | 2022-09-20 | 珠海市科迪电子科技有限公司 | Automatic test equipment for pressure sensor |
| CN114950996B (en) * | 2022-06-10 | 2024-02-23 | 晶太集成电路(台州)有限公司 | Device and method for screening industrial-grade memory chips |
| CN116281797A (en) * | 2023-04-11 | 2023-06-23 | 技感半导体设备(南通)有限公司 | Tray capping and uncapping conveying system for chip cleaning |
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| KR20040045986A (en) * | 2002-11-26 | 2004-06-05 | 주식회사 실트론 | A Classification method of defect area of silicon wafer or single crystalline silicon ingot |
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| JPH08233901A (en) * | 1994-12-28 | 1996-09-13 | Advantest Corp | Separate type handler system for ic tester |
| KR20030000613A (en) * | 2001-06-26 | 2003-01-06 | 삼성전자 주식회사 | Semiconductor manufacturing device |
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| CN111933551A (en) | 2020-11-13 |
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