WO2023216439A1 - Automatic tray changing device for chip - Google Patents

Automatic tray changing device for chip Download PDF

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Publication number
WO2023216439A1
WO2023216439A1 PCT/CN2022/110888 CN2022110888W WO2023216439A1 WO 2023216439 A1 WO2023216439 A1 WO 2023216439A1 CN 2022110888 W CN2022110888 W CN 2022110888W WO 2023216439 A1 WO2023216439 A1 WO 2023216439A1
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WIPO (PCT)
Prior art keywords
tray
chip
linear motor
production line
line
Prior art date
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PCT/CN2022/110888
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French (fr)
Chinese (zh)
Inventor
林海涛
赵凯
梁猛
倪海铨
陈玉林
杨滨炜
Original Assignee
上海世禹精密机械有限公司
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Publication of WO2023216439A1 publication Critical patent/WO2023216439A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/34Sorting according to other particular properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/36Sorting apparatus characterised by the means used for distribution
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/74Feeding, transfer, or discharging devices of particular kinds or types
    • B65G47/90Devices for picking-up and depositing articles or materials
    • B65G47/91Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G59/00De-stacking of articles
    • B65G59/06De-stacking from the bottom of the stack
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Definitions

  • the invention belongs to chip production line equipment, and specifically relates to an automatic chip changing equipment.
  • the production line material trays usually used for production and the packaging materials trays used for product delivery are different in arrangement and structure. For this reason, how to transfer the production line materials
  • the chip on the tray (JDtray) is automatically converted to the packaging tray (SPtray), which is a problem that needs to be solved at present.
  • the technical problem to be solved by the present invention is to provide an automatic chip tray changing device that can automatically switch the chips on the production line tray to the packaging tray.
  • the present invention adopts the following technical solutions:
  • An automatic chip tray changing equipment including at least one production line tray conveyor line and a packaging tray conveyor line in parallel, at least one chip transplanting device transversely erected on the two conveyor lines, the production line, and the packaging tray conveyor
  • Both ends of the line are respectively equipped with loading and unloading areas, and a linear motor module is arranged between the loading area and the corresponding unloading area, and a tray carrier is driven by the linear motor module to and from the two areas.
  • Each loading and unloading area includes a silo, a tray clamping mechanism located at the bottom of the silo for forking the tray, and a tray lifting mechanism for lifting the tray.
  • the tray carrier is located on the The clamping claw mechanism is below the bin and lower than the material tray, and there is a whole tray mechanism on the material tray platform, including several clamping blocks driven by respective cylinders and pushing to clamp the corresponding sides of the material tray.
  • the packaging tray conveyor line has a pair of tray carriers and linear motor modules, and the carrier surfaces of the two tray carriers can be arranged alternately up and down through their respective lifting mechanisms.
  • the two linear motor modules are respectively located on their respective sides. outside of the tray carrier, and alternately drive the tray carrier back and forth.
  • the tray conveyor line of the production line has one tray carrier and a linear motor module, and the tray carrier is located on the linear motor module.
  • the material tray clamping jaw mechanism includes a clamping jaw that matches the notch on the same side of the material tray and a cylinder that drives the clamping jaw to expand and contract.
  • a chip visual detection device is also provided between the loading area of the production line's material tray conveyor line and the chip transplanting device.
  • the chip transplanting device includes a transplanting head composed of several suction cups that can be lifted and lowered, and a linear motor module that drives the transplanting head to move laterally between the production line and the packaging tray conveyor line.
  • An NG material area is also arranged on one side of the production line's tray conveyor line, including a tray carrier for placing NG chip trays and a linear motor module that controls the parallel movement of the tray carrier and the production line's tray conveyor line. Group.
  • Figure 1 is a top view of an automatic chip changing device according to an embodiment of the present invention.
  • Figure 2 is a schematic structural diagram of three loading areas according to an embodiment of the present invention.
  • Figure 3 is a top view of Figure 2;
  • Figure 4 is a perspective view of the tray conveyor line of the production line according to one embodiment of the present invention.
  • Figure 5 is a side view of the tray conveyor line of the production line according to one embodiment of the present invention.
  • Figure 6 is a perspective view of a packaging tray conveyor line according to one embodiment of the present invention.
  • Figure 7 is a perspective view of the material tray supporting mechanism according to one embodiment of the present invention.
  • Figure 8 is a perspective view of a tray carrier of the packaging tray conveyor line according to one embodiment of the present invention.
  • Figure 9 is a schematic structural diagram of a chip transplanting device according to an embodiment of the present invention.
  • Figure 10 is a schematic structural diagram of a transplanting head according to an embodiment of the present invention.
  • the automatic chip tray changing equipment includes at least one parallel production line tray conveying line 1 and one packaging tray conveying line 2, and at least one horizontally erected on the two conveying lines.
  • Chip transplanting device 3 in order to effectively improve production efficiency, as shown in Figure 1, a production line tray conveyor line 1 can be set up on both sides of a packaging tray conveyor line 2, and a pair of chip transplanters can be set horizontally Device 3, and both ends of the production line and the packaging tray conveyor line 1 and 2 are respectively provided with a loading area 4 and an unloading area 5, and a linear motor module is arranged between the loading area 4 and the corresponding unloading area 5 6a and the material tray carrier 7 driven by the linear motor module 6a to and from the two areas.
  • Each loading and unloading area 4 and 5 includes a silo 8 and is separately located in the silo 8.
  • the bottom of the tray clamping mechanism 9 is used to fork the tray 100 and the tray lifting mechanism 10 is used to lift the tray 100.
  • the tray clamping mechanism 9 includes a notch on the same side as the tray 100.
  • Adaptable clamping jaws and cylinders that drive the clamping jaws to telescope.
  • the clamping jaws and cylinders shown in Figure 3 have two sets on each side.
  • the clamping jaws extend to hold the material tray 100 of the corresponding layer.
  • the material tray is supported by The mechanism 10 can lift or lower the material tray 100 from below through its lifting mechanism 101 such as an electric cylinder or a lifting motor, and can change the material tray 100 clamped by the material tray clamping mechanism 9 to the material tray below.
  • the tray carriers 7 of the production line and packaging tray conveyor lines 1 and 2 are located below the bin 8 and lower than the tray clamping mechanism 9, and the tray carrier 7 is provided with a whole tray mechanism 11, including the respective
  • the cylinder drives and pushes several clamping blocks on the corresponding sides (or corners) of the clamping tray 100. By pushing and clamping the clamping blocks, the position of the tray 100 on the tray carrier can be adjusted, thus playing the role of integrating the tray. , and maintain positioning without slipping during transportation.
  • the tray conveyor line 1 of the production line has one tray carrier 7 and a linear motor module 6a, and the tray carrier 7 is located on the linear motor module 6a.
  • the tray lifting mechanism 9 is placed on both sides of the tray carrier 7 and can be lifted up and down from the notches 12 on both sides of the tray carrier 7 to lift the tray 100 on both sides.
  • the tray carrier 7 and the linear motor module 6a group of the packaging tray conveyor line 2 located in the middle are designed with A pair, and the platform surfaces of the two tray carriers 7 can be driven by their respective lifting mechanisms 102 such as electric cylinders to form an alternating arrangement of up and down lifting.
  • the two linear motor module components 6a are located outside the respective tray carriers 7 , and alternately drive the respective material tray carriers 7 to carry out the round trip between the loading and unloading areas 5.
  • the platform can be designed as a hollow structure, and the tray supporting mechanism 10 is as shown in Figure 7. It can be located under the middle of the tray 7, and can be lifted and lowered in the hollow through the middle of the tray 100. Lift.
  • Each chip transplanting device 3 includes a transplanting head 32 composed of several suction cups 31 that can be lifted and lowered.
  • the transplanting head 32 is driven to move laterally between the production line and the packaging tray conveyor line 1 and 2.
  • the linear motor module 6b can suck the chips in the material tray 100 of the production line through the vertical lifting of the transplanting head 32 and then place them in the packaging material tray 100 through transverse movement.
  • the suction cup 31 can also be adjusted along the track 33 spacing.
  • a chip visual inspection device 13 is also provided between the loading area 4 of the production line tray conveyor line 1 and the chip transplanting device 3 to detect the movement of the tray carrier of the production line tray conveyor line 1 from the loading area 4 The chips in the tray 100 moved there are visually inspected.
  • the outside of the production line tray conveyor line 1 (opposite side of the packaging tray conveyor line 2) is also equipped with an NG material area, including a tray carrier for placing the NG chip tray 200 and a control tray carrier and product.
  • the linear motor module 6c (see Figure 4) that moves the wire tray conveyor line 1 in parallel can adjust the position of the NG chip tray through the linear motor module.
  • the NG chip When the NG chip is detected by the visual inspection device, it will be transplanted by the chip.
  • the device 3 is transplanted to the NG chip tray 200.
  • a complete stack of production line trays with chips is fed into the bins 8 of the loading area 4 of the two production line tray conveyor lines 1, and the materials in the loading area 4 of the packaging tray conveyor line 2 are
  • a whole stack of packaging trays without chips is fed into warehouse 8, and the bottom trays are held by the clamping claws of its tray clamping mechanism 9; taking the tray conveying line 1 of the left production line as an example, first The tray lifting mechanism 10 in the feeding area 4 rises and holds the tray, and then the clamping claw is retracted to transfer the tray to the tray pushing mechanism 10, and then the tray pushing mechanism 10 descends one level and The clamping jaws hold the penultimate layer of material tray, and finally the material tray supporting mechanism 10 descends until the bottom layer of material tray falls onto the material tray carrier 7, and the tray is positioned by the whole tray mechanism 11 to realize loading; after completion After loading, the linear motor module 6a drives the tray carrier 7 to be transported to the bottom of the chip visual inspection device 13.
  • the bottom packaging tray in the loading area 4 of the packaging tray conveyor line 2 is loaded in the same way.
  • the material is transported to a tray carrier 7 located above and transported to the middle of the packaging tray conveyor line 2 (i.e., the tray changing station, part A in Figure 1); when the chips that have passed the visual inspection are transferred to the chip transplanting device 3
  • the transplanting head 32 is transplanted to the packaging tray located on the tray changing station, and the chips that have not passed are transplanted by the transplanting head 32 to the NG chip tray 200 located outside; when the production line tray After the chips are emptied, they will continue to be transported to the unloading area 5, and will be held in the bin 8 by the clamping claws of the unloading area 5 through the opposite steps to the loading area, and the tray carrier will return to the loading area 4 again.
  • the production line tray conveyor line 1 on the right also transports the production line trays to the inspection station and tray changing station in sequence, and then the transplanting head 32 transplants the chips accordingly. If the packaging tray is full of chips Then it is transported to its unloading area 5 for the same unloading, and the next empty packaging tray has already fallen onto the raised another tray carrier 7 and is transported to the tray changing station, so that such uninterrupted Orderly round-trip chip changing operation.
  • the production line tray conveyor line and the packaging tray conveyor line the production line trays equipped with chips and the packaging trays to be loaded with chips are transported to the chip transplanting device position in the loading area respectively, and the chip transplanting device will The chips on the production line material tray are transplanted to the packaging material tray in sequence, and then transported to the unloading area respectively to realize automatic chip tray changing;
  • the chips on the production line material tray can be detected through the chip visual inspection device, and the NG chips can be transplanted to the NG material area on the other side through the chip transplanting device;
  • the position of the tray on the tray carrier can be adjusted through the whole tray mechanism, and the positioning can be maintained without slipping during the transportation process.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Specific Conveyance Elements (AREA)

Abstract

Disclosed in the present invention is an automatic tray changing device for a chip, comprising at least one production line tray conveying line and a packaging tray conveying line which are in parallel, and at least one chip transferring apparatus transversely erected on the two conveying lines. A feeding area and a discharging area are provided at two ends of both the production line tray disc conveying line and the packaging tray disc conveying line, respectively, and a linear motor module and a tray carrying platform driven by the linear motor module to move back and forth between the feeding area and the corresponding discharging area are provided between the two areas. Each of the feeding and discharging areas comprises a stock bin, tray clamping jaw mechanisms separately arranged at the bottom of the stock bin and used for forking and supporting a tray, and a tray jacking mechanism used for jacking the tray; the tray carrying platform is located below the stock bin and lower than the tray clamping jaw mechanisms; and a tray arranging mechanism is provided on the tray carrying platform and comprises a plurality of clamping blocks which are driven by respective cylinders and push and clamp corresponding side portions of the tray.

Description

一种芯片自动换盘设备A chip automatic disk changing equipment 技术领域Technical field
本发明属于芯片产线设备、具体涉及一种芯片自动换盘设备。The invention belongs to chip production line equipment, and specifically relates to an automatic chip changing equipment.
背景技术Background technique
芯片在生产加工过程中,由于型号、规格等的不同,因此通常生产所采用的产线料盘与产品出厂采用的包装料盘在排列布置结构上有所不同,为此,如何将产线料盘(JDtray)上的芯片自动转换至包装料盘(SPtray),是目前需要解决的问题。During the production and processing of chips, due to different models, specifications, etc., the production line material trays usually used for production and the packaging materials trays used for product delivery are different in arrangement and structure. For this reason, how to transfer the production line materials The chip on the tray (JDtray) is automatically converted to the packaging tray (SPtray), which is a problem that needs to be solved at present.
发明内容Contents of the invention
本发明所要解决的技术问题是提供一种芯片自动换盘设备,能够将产线料盘上的芯片自动转换至包装料盘上。The technical problem to be solved by the present invention is to provide an automatic chip tray changing device that can automatically switch the chips on the production line tray to the packaging tray.
为了解决上述技术问题,本发明采用如下的技术方案:In order to solve the above technical problems, the present invention adopts the following technical solutions:
一种芯片自动换盘设备,包括相并行的至少一条产线料盘输送线与一条包装料盘输送线、横向架设于两输送线上的至少一芯片移栽装置,产线、包装料盘输送线的两端均分别设有上料区、下料区且上料区与对应下料区之间布设有直线电机模组及由直线电机模组驱动往返于两区的料盘载台,每个上、下料区均包括料仓、分设于料仓底部用以叉托料盘的料盘夹爪机构及用以顶升料盘的料盘顶托机构,所述料盘载台位于料仓下方并低于料盘夹爪机构,且料盘载台上设有整盘机构,包括由各自气缸驱动并推夹料盘对应侧部的数个夹紧块。An automatic chip tray changing equipment, including at least one production line tray conveyor line and a packaging tray conveyor line in parallel, at least one chip transplanting device transversely erected on the two conveyor lines, the production line, and the packaging tray conveyor Both ends of the line are respectively equipped with loading and unloading areas, and a linear motor module is arranged between the loading area and the corresponding unloading area, and a tray carrier is driven by the linear motor module to and from the two areas. Each loading and unloading area includes a silo, a tray clamping mechanism located at the bottom of the silo for forking the tray, and a tray lifting mechanism for lifting the tray. The tray carrier is located on the The clamping claw mechanism is below the bin and lower than the material tray, and there is a whole tray mechanism on the material tray platform, including several clamping blocks driven by respective cylinders and pushing to clamp the corresponding sides of the material tray.
所述包装料盘输送线的料盘载台及直线电机模组均具有一对,且两料盘载台的载台面通过各自的升降机构能够呈上下交替布置,两直线电机模组分设于各自料盘载台的外侧,并交替驱动料盘载台进行往返。The packaging tray conveyor line has a pair of tray carriers and linear motor modules, and the carrier surfaces of the two tray carriers can be arranged alternately up and down through their respective lifting mechanisms. The two linear motor modules are respectively located on their respective sides. outside of the tray carrier, and alternately drive the tray carrier back and forth.
所述产线料盘输送线的料盘载台及直线电机模组均为一个,且料盘载 台设于直线电机模组之上。The tray conveyor line of the production line has one tray carrier and a linear motor module, and the tray carrier is located on the linear motor module.
所述料盘夹爪机构包括与料盘同侧的槽口相适配的夹爪及驱动夹爪伸缩的气缸。The material tray clamping jaw mechanism includes a clamping jaw that matches the notch on the same side of the material tray and a cylinder that drives the clamping jaw to expand and contract.
所述产线料盘输送线的上料区与芯片移栽装置之间还设有芯片视觉检测装置。A chip visual detection device is also provided between the loading area of the production line's material tray conveyor line and the chip transplanting device.
所述芯片移栽装置包括由数个能够升降的吸盘构成的移栽头、驱动移栽头在产线、包装料盘输送线中间横向移动的直线电机模组。The chip transplanting device includes a transplanting head composed of several suction cups that can be lifted and lowered, and a linear motor module that drives the transplanting head to move laterally between the production line and the packaging tray conveyor line.
所述产线料盘输送线的一侧还布设有NG料区,包括用以放置NG芯片料盘的料盘载台及控制料盘载台与产线料盘输送线平行移动的直线电机模组。An NG material area is also arranged on one side of the production line's tray conveyor line, including a tray carrier for placing NG chip trays and a linear motor module that controls the parallel movement of the tray carrier and the production line's tray conveyor line. Group.
附图说明Description of the drawings
下面结合附图和具体实施方式对发明进行详细说明:The invention will be described in detail below with reference to the accompanying drawings and specific embodiments:
图1是本发明一个实施例的芯片自动换盘设备的俯视图;Figure 1 is a top view of an automatic chip changing device according to an embodiment of the present invention;
图2是本发明一个实施例的三个上料区的结构示意图;Figure 2 is a schematic structural diagram of three loading areas according to an embodiment of the present invention;
图3是图2的俯视图;Figure 3 is a top view of Figure 2;
图4是本发明一个实施例的产线料盘输送线的立体图;Figure 4 is a perspective view of the tray conveyor line of the production line according to one embodiment of the present invention;
图5是本发明一个实施例的产线料盘输送线的侧视图;Figure 5 is a side view of the tray conveyor line of the production line according to one embodiment of the present invention;
图6是本发明一个实施例的包装料盘输送线的立体图;Figure 6 is a perspective view of a packaging tray conveyor line according to one embodiment of the present invention;
图7是本发明一个实施例的料盘顶托机构的立体图;Figure 7 is a perspective view of the material tray supporting mechanism according to one embodiment of the present invention;
图8是本发明一个实施例的包装料盘输送线的一料盘载台的立体图;Figure 8 is a perspective view of a tray carrier of the packaging tray conveyor line according to one embodiment of the present invention;
图9是本发明一个实施例的芯片移栽装置的结构示意图;Figure 9 is a schematic structural diagram of a chip transplanting device according to an embodiment of the present invention;
图10是本发明一个实施例的移栽头的结构示意图。Figure 10 is a schematic structural diagram of a transplanting head according to an embodiment of the present invention.
具体实施方式Detailed ways
本发明其中一个实施例的芯片自动换盘设备如图1所示,包括相并行的至少一条产线料盘输送线1与一条包装料盘输送线2、横向架设于两输送线上的至少一芯片移栽装置3,当然,为了有效提高生产效率,可如图1所示在一条包装料盘输送线2的两侧各设一条产线料盘输送线1,以及横向设置一对芯片移栽装置3,并且产线、包装料盘输送线1、2的两端均分 别设有上料区4、下料区5且上料区4与对应下料区5之间布设有直线电机模组6a及由直线电机模组6a驱动往返于两区的料盘载台7,请结合图2-3所示,每个上、下料区4、5均包括料仓8、分设于料仓8底部用以叉托料盘100的料盘夹爪机构9及用以顶升料盘100的料盘顶托机构10,其中,料盘夹爪机构9包括与料盘100同侧的槽口相适配的夹爪及驱动夹爪伸缩的气缸,图3中所示的夹爪及气缸,每侧均具有两组,通过夹爪伸出可夹托相应层的料盘100,料盘顶托机构10通过其顶升机构101如电缸或顶升电机等可从下方对料盘100进行顶升或下降,可将由料盘夹爪机构9夹住的料盘100换至下方的料盘载台7上。The automatic chip tray changing equipment according to one embodiment of the present invention is shown in Figure 1 and includes at least one parallel production line tray conveying line 1 and one packaging tray conveying line 2, and at least one horizontally erected on the two conveying lines. Chip transplanting device 3, of course, in order to effectively improve production efficiency, as shown in Figure 1, a production line tray conveyor line 1 can be set up on both sides of a packaging tray conveyor line 2, and a pair of chip transplanters can be set horizontally Device 3, and both ends of the production line and the packaging tray conveyor line 1 and 2 are respectively provided with a loading area 4 and an unloading area 5, and a linear motor module is arranged between the loading area 4 and the corresponding unloading area 5 6a and the material tray carrier 7 driven by the linear motor module 6a to and from the two areas. Please refer to Figure 2-3. Each loading and unloading area 4 and 5 includes a silo 8 and is separately located in the silo 8. The bottom of the tray clamping mechanism 9 is used to fork the tray 100 and the tray lifting mechanism 10 is used to lift the tray 100. The tray clamping mechanism 9 includes a notch on the same side as the tray 100. Adaptable clamping jaws and cylinders that drive the clamping jaws to telescope. The clamping jaws and cylinders shown in Figure 3 have two sets on each side. The clamping jaws extend to hold the material tray 100 of the corresponding layer. The material tray is supported by The mechanism 10 can lift or lower the material tray 100 from below through its lifting mechanism 101 such as an electric cylinder or a lifting motor, and can change the material tray 100 clamped by the material tray clamping mechanism 9 to the material tray below. On stage 7.
产线、包装料盘输送线1、2的料盘载台7均位于料仓8下方并低于料盘夹爪机构9,且料盘载台7上设有整盘机构11,包括由各自气缸驱动并推夹料盘100对应侧部(或者边角部)的数个夹紧块,通过夹紧块的推夹能够调整料盘100在料盘载台上的位置,起到整盘作用,并在输送过程中保持定位不滑脱。The tray carriers 7 of the production line and packaging tray conveyor lines 1 and 2 are located below the bin 8 and lower than the tray clamping mechanism 9, and the tray carrier 7 is provided with a whole tray mechanism 11, including the respective The cylinder drives and pushes several clamping blocks on the corresponding sides (or corners) of the clamping tray 100. By pushing and clamping the clamping blocks, the position of the tray 100 on the tray carrier can be adjusted, thus playing the role of integrating the tray. , and maintain positioning without slipping during transportation.
请结合图4-5所示,产线料盘输送线1的料盘载台7及直线电机模组6a均为一个,且料盘载台7设于直线电机模组6a之上,其料盘顶托机构9分置于料盘载台7的两侧,可从料盘载台7两侧的凹口12处实现升降穿过对料盘100的两侧进行托举。As shown in Figure 4-5, the tray conveyor line 1 of the production line has one tray carrier 7 and a linear motor module 6a, and the tray carrier 7 is located on the linear motor module 6a. The tray lifting mechanism 9 is placed on both sides of the tray carrier 7 and can be lifted up and down from the notches 12 on both sides of the tray carrier 7 to lift the tray 100 on both sides.
请结合图6-图8所示,为了配合两条产线料盘输送线1的高效作业,位于中间的包装料盘输送线2的料盘载台7及直线电机模6a组则均设计具有一对,且两料盘载台7的载台面能够通过各自的如电缸等升降机构102驱动而形成上下升降的交替布置,两直线电机模组分6a设于各自料盘载台7的外侧,并交替驱动各自料盘载台7进行上、下料区5之间的往返。其载台面可设计为中空结构,而其料盘顶托机构10则如图7所示,其可设于料盘载台7中部下方,在中空处实现升降穿过对料盘100的中部进行托举。Please combine Figure 6 to Figure 8. In order to cooperate with the efficient operation of the two production line tray conveyor lines 1, the tray carrier 7 and the linear motor module 6a group of the packaging tray conveyor line 2 located in the middle are designed with A pair, and the platform surfaces of the two tray carriers 7 can be driven by their respective lifting mechanisms 102 such as electric cylinders to form an alternating arrangement of up and down lifting. The two linear motor module components 6a are located outside the respective tray carriers 7 , and alternately drive the respective material tray carriers 7 to carry out the round trip between the loading and unloading areas 5. The platform can be designed as a hollow structure, and the tray supporting mechanism 10 is as shown in Figure 7. It can be located under the middle of the tray 7, and can be lifted and lowered in the hollow through the middle of the tray 100. Lift.
请结合图9-10,每个芯片移栽装置3包括由数个能够升降的吸盘31构成的移栽头32、驱动移栽头32在产线、包装料盘输送线1、2中间横向移动的直线电机模组6b,通过移栽头32的纵向升降可将产线的料盘100内的芯片吸取并通过横向移动进而放置在包装的料盘100内,吸盘31还可 沿轨道33进行调节间距。在产线料盘输送线1的上料区4与芯片移栽装置3之间还设有芯片视觉检测装置13,用以对产线料盘输送线1的料盘载台从上料区4移至该处的料盘100内的芯片进行视觉检测。Please refer to Figures 9-10. Each chip transplanting device 3 includes a transplanting head 32 composed of several suction cups 31 that can be lifted and lowered. The transplanting head 32 is driven to move laterally between the production line and the packaging tray conveyor line 1 and 2. The linear motor module 6b can suck the chips in the material tray 100 of the production line through the vertical lifting of the transplanting head 32 and then place them in the packaging material tray 100 through transverse movement. The suction cup 31 can also be adjusted along the track 33 spacing. A chip visual inspection device 13 is also provided between the loading area 4 of the production line tray conveyor line 1 and the chip transplanting device 3 to detect the movement of the tray carrier of the production line tray conveyor line 1 from the loading area 4 The chips in the tray 100 moved there are visually inspected.
而产线料盘输送线1的外侧(包装料盘输送线2的相对侧)还布设有NG料区,包括用以放置NG芯片料盘200的料盘载台及控制料盘载台与产线料盘输送线1平行移动的直线电机模组6c(见图4),通过直线电机模组可调整NG芯片料盘的位置,而当被视觉检测装置检测出的NG芯片会由芯片移栽装置3移栽至NG芯片料盘200上。The outside of the production line tray conveyor line 1 (opposite side of the packaging tray conveyor line 2) is also equipped with an NG material area, including a tray carrier for placing the NG chip tray 200 and a control tray carrier and product. The linear motor module 6c (see Figure 4) that moves the wire tray conveyor line 1 in parallel can adjust the position of the NG chip tray through the linear motor module. When the NG chip is detected by the visual inspection device, it will be transplanted by the chip. The device 3 is transplanted to the NG chip tray 200.
该芯片自动换盘设备的工作原理如下:The working principle of this chip automatic disc changing equipment is as follows:
首先,在两条产线料盘输送线1上料区4的料仓8内分别送入一整叠置有芯片的产线料盘,而包装料盘输送线2的上料区4的料仓8内则则送入一整叠无芯片的包装料盘,并且底层料盘均由其料盘夹爪机构9的夹爪夹托;以左侧产线料盘输送线1为例,先由其上料区4的料盘顶托机构10上升并托住料盘,再由夹爪缩回使得料盘转移至料盘顶托机构10上,然后料盘顶托机构10下降一层并使夹爪夹托倒数第二层料盘,最后料盘顶托机构10下降直至底层料盘落入料盘载台7上,并通过整盘机构11将料盘定位,实现上料;在完成上料后,由其直线电机模组6a带动料盘载台7输送至芯片视觉检测装置13下方,与此同时,包装料盘输送线2的上料区4的底层包装料盘同样方式进行上料至位于上方的一料盘载台7并输送至包装料盘输送线2的中部(即换盘工位,即图1中的A部);当视觉检测通过的芯片由芯片移栽装置3的移栽头32移栽至位于换盘工位上的包装料盘内,而未通过的芯片则由移栽头32移栽至位于外侧的NG芯片料盘200上;当该产线料盘的芯片取空后则继续输送至下料区5,并通过与上料相反的步骤由下料区5的夹爪夹托于料仓8内,而料盘载台则返回至上料区4重新上料;而右侧的产线料盘输送线1同样将产线料盘依次输送至检测工位与换盘工位后,由移栽头32相应移栽芯片,若包装料盘装满芯片则输送至其下料区5同样进行下料,而下一空载包装料盘则早已落入升起的另一料盘载台7上,并输送至换盘工位,从而进行如此无间断往返有序的芯片换盘作业。First, a complete stack of production line trays with chips is fed into the bins 8 of the loading area 4 of the two production line tray conveyor lines 1, and the materials in the loading area 4 of the packaging tray conveyor line 2 are A whole stack of packaging trays without chips is fed into warehouse 8, and the bottom trays are held by the clamping claws of its tray clamping mechanism 9; taking the tray conveying line 1 of the left production line as an example, first The tray lifting mechanism 10 in the feeding area 4 rises and holds the tray, and then the clamping claw is retracted to transfer the tray to the tray pushing mechanism 10, and then the tray pushing mechanism 10 descends one level and The clamping jaws hold the penultimate layer of material tray, and finally the material tray supporting mechanism 10 descends until the bottom layer of material tray falls onto the material tray carrier 7, and the tray is positioned by the whole tray mechanism 11 to realize loading; after completion After loading, the linear motor module 6a drives the tray carrier 7 to be transported to the bottom of the chip visual inspection device 13. At the same time, the bottom packaging tray in the loading area 4 of the packaging tray conveyor line 2 is loaded in the same way. The material is transported to a tray carrier 7 located above and transported to the middle of the packaging tray conveyor line 2 (i.e., the tray changing station, part A in Figure 1); when the chips that have passed the visual inspection are transferred to the chip transplanting device 3 The transplanting head 32 is transplanted to the packaging tray located on the tray changing station, and the chips that have not passed are transplanted by the transplanting head 32 to the NG chip tray 200 located outside; when the production line tray After the chips are emptied, they will continue to be transported to the unloading area 5, and will be held in the bin 8 by the clamping claws of the unloading area 5 through the opposite steps to the loading area, and the tray carrier will return to the loading area 4 again. loading; and the production line tray conveyor line 1 on the right also transports the production line trays to the inspection station and tray changing station in sequence, and then the transplanting head 32 transplants the chips accordingly. If the packaging tray is full of chips Then it is transported to its unloading area 5 for the same unloading, and the next empty packaging tray has already fallen onto the raised another tray carrier 7 and is transported to the tray changing station, so that such uninterrupted Orderly round-trip chip changing operation.
采用本发明的一种芯片自动换盘设备,具有以下优点:The automatic chip changing equipment of the present invention has the following advantages:
1、通过产线料盘输送线与包装料盘输送线分别在上料区输送装有芯片的产线料盘及待装芯片的包装料盘至芯片移栽装置位,由芯片移栽装置将产线料盘上的芯片依次移栽至包装料盘上,再分别输送至下料区,实现芯片的自动换盘;1. Through the production line tray conveyor line and the packaging tray conveyor line, the production line trays equipped with chips and the packaging trays to be loaded with chips are transported to the chip transplanting device position in the loading area respectively, and the chip transplanting device will The chips on the production line material tray are transplanted to the packaging material tray in sequence, and then transported to the unloading area respectively to realize automatic chip tray changing;
2、通过料盘夹爪机构与料盘顶托机构的配合使用,能够实现料盘的依次上料;2. Through the cooperative use of the tray clamping mechanism and the tray lifting mechanism, the sequential loading of the trays can be realized;
3、通过芯片视觉检测装置可对产线料盘上的芯片进行检测,并可将NG芯片通过芯片移栽装置移栽至另一侧的NG料区;3. The chips on the production line material tray can be detected through the chip visual inspection device, and the NG chips can be transplanted to the NG material area on the other side through the chip transplanting device;
4、通过整盘机构能够调整料盘在料盘载台上的位置,并在输送过程中保持定位不滑脱。4. The position of the tray on the tray carrier can be adjusted through the whole tray mechanism, and the positioning can be maintained without slipping during the transportation process.
但是,本技术领域中的普通技术人员应当认识到,以上的实施例仅是用来说明本发明,而并非用作为对本发明的限定,只要在本发明的实质精神范围内,对以上所述实施例的变化、变型都将落在本发明的权利要求书范围内。However, those of ordinary skill in the art should realize that the above embodiments are only used to illustrate the present invention and are not used to limit the present invention. As long as the above-described implementations are within the scope of the essential spirit of the present invention, Any changes or modifications to the examples will fall within the scope of the claims of the present invention.

Claims (7)

  1. 一种芯片自动换盘设备,其特征在于:包括相并行的至少一条产线料盘输送线与一条包装料盘输送线、横向架设于两输送线上的至少一芯片移栽装置,产线、包装料盘输送线的两端均分别设有上料区、下料区且上料区与对应下料区之间布设有直线电机模组及由直线电机模组驱动往返于两区的料盘载台,每个上、下料区均包括料仓、分设于料仓底部用以叉托料盘的料盘夹爪机构及用以顶升料盘的料盘顶托机构,所述料盘载台位于料仓下方并低于料盘夹爪机构,且料盘载台上设有整盘机构,包括由各自气缸驱动并推夹料盘对应侧部的数个夹紧块。An automatic chip tray changing equipment, characterized by: including at least one parallel production line tray conveying line and one packaging tray conveying line, and at least one chip transplanting device transversely erected on the two conveying lines. The production line, Both ends of the packaging tray conveyor line are equipped with loading and unloading areas respectively, and a linear motor module is arranged between the loading area and the corresponding unloading area, and the linear motor module drives the material trays that shuttle between the two areas. Each loading and unloading area includes a silo, a tray clamping mechanism located at the bottom of the silo for forking the tray, and a tray lifting mechanism for lifting the tray. The carrier is located below the bin and lower than the tray clamping mechanism, and the tray carrier is equipped with a whole tray mechanism, including several clamping blocks that are driven by respective cylinders and push the corresponding sides of the tray.
  2. 根据权利要求1所述的一种芯片自动换盘设备,其特征在于:所述包装料盘输送线的料盘载台及直线电机模组均具有一对,且两料盘载台的载台面通过各自的升降机构能够呈上下交替布置,两直线电机模组分设于各自料盘载台的外侧,并交替驱动料盘载台进行往返。An automatic chip tray changing equipment according to claim 1, characterized in that: the tray carrier and the linear motor module of the packaging tray conveyor line each have a pair, and the platform surfaces of the two tray carriers are The respective lifting mechanisms can be arranged alternately up and down. The two linear motor modules are located outside the respective tray carriers and alternately drive the tray carriers back and forth.
  3. 根据权利要求1所述的一种芯片自动换盘设备,其特征在于:所述产线料盘输送线的料盘载台及直线电机模组均为一个,且料盘载台设于直线电机模组之上。An automatic chip tray changing equipment according to claim 1, characterized in that: the tray conveying line of the production line has one tray carrier and a linear motor module, and the tray carrier is located on the linear motor on top of the module.
  4. 根据权利要求1所述的一种芯片自动换盘设备,其特征在于:所述料盘夹爪机构包括与料盘同侧的槽口相适配的夹爪及驱动夹爪伸缩的气缸。An automatic chip changing device according to claim 1, characterized in that the material tray clamping claw mechanism includes a clamping claw matching the notch on the same side of the material tray and a cylinder that drives the clamping claw to expand and contract.
  5. 根据权利要求1所述的一种芯片自动换盘设备,其特征在于:所述产线料盘输送线的上料区与芯片移栽装置之间还设有芯片视觉检测装置。An automatic chip tray changing equipment according to claim 1, characterized in that a chip visual detection device is further provided between the loading area of the production line tray conveyor line and the chip transplanting device.
  6. 根据权利要求1所述的一种芯片自动换盘设备,其特征在于:所述芯片移栽装置包括由数个能够升降的吸盘构成的移栽头、驱动移栽头在产 线、包装料盘输送线中间横向移动的直线电机模组。An automatic chip tray changing equipment according to claim 1, characterized in that: the chip transplanting device includes a transplanting head composed of several lifting suction cups, a driving transplanting head in the production line, and a packaging material tray A linear motor module that moves laterally in the middle of the conveyor line.
  7. 根据权利要求5所述的一种芯片自动换盘设备,其特征在于:所述产线料盘输送线的一侧还布设有NG料区,包括用以放置NG芯片料盘的料盘载台及控制料盘载台与产线料盘输送线平行移动的直线电机模组。An automatic chip tray changing equipment according to claim 5, characterized in that: an NG material area is also arranged on one side of the production line tray conveyor line, including a tray carrying platform for placing NG chip trays and a linear motor module that controls the parallel movement of the tray carrier and the production line tray conveyor line.
PCT/CN2022/110888 2022-05-13 2022-08-08 Automatic tray changing device for chip WO2023216439A1 (en)

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CN117594706A (en) * 2024-01-18 2024-02-23 深圳市韵腾激光科技有限公司 Full-automatic online laser-assisted sintering machine for photovoltaic silicon wafer
CN117594706B (en) * 2024-01-18 2024-04-09 深圳市韵腾激光科技有限公司 Full-automatic online laser-assisted sintering machine for photovoltaic silicon wafer

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