CN105140182A - Wafer splitting machine - Google Patents
Wafer splitting machine Download PDFInfo
- Publication number
- CN105140182A CN105140182A CN201510204747.3A CN201510204747A CN105140182A CN 105140182 A CN105140182 A CN 105140182A CN 201510204747 A CN201510204747 A CN 201510204747A CN 105140182 A CN105140182 A CN 105140182A
- Authority
- CN
- China
- Prior art keywords
- rotary table
- frame
- wafer
- axle
- ccd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
Abstract
The invention relates to a wafer splitting machine used for guaranteeing wafer processing quality and improving wafer processing precision. A frame is provided with a rotary work station, the left side frame of the rotary work station is provided with a material box, the material box is driven by a stepping motor to move up and down along an automatic charging and discharging shaft, a pre-distorting device is arranged between the automatic charging and discharging shaft and the rotary work station, a CCD is arranged above the pre-distorting device, a scanner used for scanning two-dimensional codes on processing materials is arranged between the CCD and the pre-distorting device, the front side of the frame is provided with a material taking shaft, the material taking shaft is provided with a material taking shaft clamping jaw, the rotary work station is provided with multiple positioning devices, a positioning sensor is arranged above the rotary work station, the positioning sensor is in matching with the positioning devices to realize positioning of the processing materials, and a pressing board and a splitting knife capable of moving up and down in the vertical direction are arranged above the rotary work station. The wafer splitting machine has advantages of high processing precision and high processing efficiency and guarantees wafer processing quality.
Description
Technical field
The present invention relates to splitting machine technical field, specifically a kind of splitting machine for wafer processing.
Background technology
Wafer refers to the silicon wafer that Si semiconductor production of integrated circuits is used, because its shape is circular, therefore is called wafer; Various circuit component structure can be manufactured on silicon, and become the IC product having certain electric sexual function.Along with the fast development of integrated circuit, have higher requirement to the requirement of wafer quality, the quality of wafer crudy plays vital effect for the normal work of wafer.Therefore, a kind of processing and manufacturing of splitting machine realization to wafer of wafer is needed, to improve the Mechanization Level that wafer adds man-hour.
Summary of the invention
The object of the present invention is to provide a kind of wafer splitting machine efficiently, for ensure wafer crudy, improve the precision that wafer adds man-hour.
The present invention solves the technical scheme that its technical problem takes: wafer splitting machine, it is characterized in that, it comprises feeding axle, predistortion device, automatic loading/unloading axle, magazine, CCD, scanner, alignment sensor, rotary table, pressing plate, splitting platform axle, positioner and frame, described frame is provided with rotary table, frame on the left of described rotary table is provided with the magazine for holding rapidoprint, frame below described magazine is provided with automatic loading/unloading axle, described magazine moves up and down along automatic loading/unloading axle under the driving of stepper motor, between described automatic loading/unloading axle and rotary table, be provided with predistortion device, be provided with CCD, between described CCD and predistortion device, be provided with scanner above described predistortion device, described scanner can Quick Response Code on scanning machining material, be provided with feeding axle in the front side of described frame, described feeding axle is provided with the feeding axle clamp pawl moved left and right, described rotary table is provided with some be positioned at same circumferentially for gripping the positioner of material to be processed, above described rotary table, be provided with alignment sensor, described alignment sensor and positioner mating reaction realize the location to rapidoprint, be provided with above described rotary table can in the vertical direction lifting pressing plate and splitting cutter, be provided with splitting platform in the front side of described frame, be provided with in the bottom of described frame can another CCD of movement in the lateral direction, this CCD for gathering target information on rapidoprint to feed back to control system.
Further, described pressing plate and splitting cutter are elevated by hydraulic oil cylinder driving.
Further, described positioner moved by hydraulic oil cylinder driving and the moving direction of positioner along the radial direction of rotary table.
Further, described positioner is three.
Further, described splitting cutter is driven by stepper motor.
The invention has the beneficial effects as follows: wafer splitting machine, be placed on by rapidoprint in magazine, the lifting of magazine is controlled by stepper motor.Capture rapidoprint by feeding axle clamp pawl to be then placed on rotary table, and by CCD take pictures judge rapidoprint time full wafer or relic, by the machine-readable target information of getting on rapidoprint of CCD, workpiece is adjusted to machinable position according to the angle of feedack adjustment rotary table by control system.This splitting machine can realize capturing the intellectuality of rapidoprint, judge, information scanning, location and processing, machining accuracy is high and working (machining) efficiency is high, ensure that wafer adds the quality in man-hour.
Accompanying drawing explanation
Fig. 1 is graphics of the present invention;
Fig. 2 is the front view of Fig. 1;
Fig. 3 is the left view of Fig. 1;
Fig. 4 is the vertical view of Fig. 1;
In figure: 1 feeding axle, 2 predistortion devices, 3 automatic loading/unloading axles, 4 magazines, 5 rapidoprints, 6CCD, 7 scanners, 8Z axle, 9 splitting cuttves, 10 alignment sensors, 11Y axle, 12 rotary tables, 13X axle, 14 pressing plates, 15 splitting platform axles, 16 positioners, 17 frames.
Embodiment
As shown in Figures 1 to 4, the present invention includes feeding axle 1, predistortion device 2, automatic loading/unloading axle 3, magazine 4, CCD6, scanner 7, Z axis 8, splitting cutter 9, alignment sensor 10, Y-axis 11, rotary table 12, X-axis 13, pressing plate 14, splitting platform axle 15, positioner 16 and frame 17, below in conjunction with accompanying drawing, present invention is described.
As shown in Figure 1, frame 17 is matrix of the present invention, and frame, for supporting the main body of splitting machine, frame is provided with other parts.Frame is rotatablely equipped with rotary table 12, and rotary table is by the motor-driven rotation of Y-axis 11.Working face on rotary table is positioned at horizontal plane, is provided with alignment sensor 10 above rotary table, whether is arranged in the machining area of rotary table for detecting rapidoprint, is in place to make rapidoprint.The edge placement of workbench is provided with and is somely positioned at same positioner 16 circumferentially, some positioners are for realizing the location to wafer, the fit inside effect of positioner surrounds the location of circular arc realization to wafer, the now center of circle of wafer and the center superposition of rotary table.Positioner moved by air cylinder driven and the moving direction of positioner along the radial direction of rotary table; Positioner can be set to three, determines that the principle of a circle realizes the location to rapidoprint according to 3.Be provided with magazine 4 in the left side of rotary table, magazine is used for holding rapidoprint 5, is provided with automatic loading/unloading axle 3 in the below of magazine, and magazine moves up and down along automatic loading/unloading axle under the driving of stepper motor.
Be provided with feeding axle 1 in the front side of rotary table, motor drives feeding axle clamp pawl to move left and right along feeding axle, realizes the material extracting operation to rapidoprint when feeding axle clamp pawl moves to feeding position.Between rotary table and magazine, be provided with predistortion device 2, rapidoprint is placed on predistortion device by feeding axle clamp pawl, carries out rectification work.CCD6 is provided with directly over predistortion device, CCD is for taking the shape of rapidoprint and judging that rapidoprint is full wafer or relic, meanwhile, judged result is fed back to control system by CCD, and control system takes different processing modes according to different judged results.Between rotary table and magazine, be also provided with scanner 7, the Quick Response Code of scanner on scanning machining material, record the information of rapidoprint and add up.After this, wafer is placed on rotary table by feeding axle clamp pawl, and positioner and alignment sensor mating reaction realize the location to rapidoprint, and rapidoprint is placed on Working position.Be provided with splitting platform axle 15 in the front side of rotary table, rapidoprint is placed on after on rotary table, the splitting platform on splitting platform axle Unscrew splitting platform axle.Frame is provided with X-axis 13, X-axis is provided with CCD, the CCD in X-axis runs to the target information that assigned address gathers rapidoprint, and feeds back to control system.Rapidoprint, by the angle of computing adjustment rotary table, is adjusted to machinable position by control system.Above rotary table, be provided with Z axis, Z axis is provided with by the pressing plate 14 of air cylinder driven, hydraulic oil cylinder driving pressing plate moves down and is pressed on rapidoprint, to avoid rapidoprint generation warpage, and then convenient processing.Z axis is also provided with splitting cutter 9, and splitting cutter is rotated by drive motor, and now splitting cutter running is to Working position, and after starter motor, splitting cutter carries out processing process to rapidoprint.After machining, splitting cutter and pressing plate rise under the drive of cylinder, and feeding axle moves to rotary table position, and positioner unclamps rapidoprint, capture the rapidoprint after processing by feeding jaw, then former for rapidoprint road is returned in magazine.
Claims (5)
1. wafer splitting machine, it is characterized in that, it comprises feeding axle, predistortion device, automatic loading/unloading axle, magazine, CCD, scanner, alignment sensor, rotary table, pressing plate, splitting platform axle, positioner and frame, described frame is provided with rotary table, frame on the left of described rotary table is provided with the magazine for holding rapidoprint, frame below described magazine is provided with automatic loading/unloading axle, described magazine moves up and down along automatic loading/unloading axle under the driving of stepper motor; Between described automatic loading/unloading axle and rotary table, be provided with predistortion device, be provided with CCD, between described CCD and predistortion device, be provided with scanner above described predistortion device, described scanner can Quick Response Code on scanning machining material; Be provided with feeding axle in the front side of described frame, described feeding axle is provided with the feeding axle clamp pawl moved left and right; Described rotary table is provided with some be positioned at same circumferentially for gripping the positioner of material to be processed, above described rotary table, be provided with alignment sensor, described alignment sensor and positioner mating reaction realize the location to rapidoprint; Be provided with above described rotary table can in the vertical direction lifting pressing plate and splitting cutter; Be provided with splitting platform in the front side of described frame, be provided with in the bottom of described frame can another CCD of movement in the lateral direction, this CCD for gathering target information on rapidoprint to feed back to control system.
2. wafer splitting machine according to claim 1, is characterized in that, described pressing plate and splitting cutter are elevated by air cylinder driven.
3. wafer splitting machine according to claim 1, is characterized in that, described positioner moved by air cylinder driven and the moving direction of positioner along the radial direction of rotary table.
4. wafer splitting machine according to claim 3, is characterized in that, described positioner is three.
5. wafer splitting machine according to claim 1, is characterized in that, described splitting cutter is driven by stepper motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510204747.3A CN105140182B (en) | 2015-04-28 | 2015-04-28 | Wafer splitting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510204747.3A CN105140182B (en) | 2015-04-28 | 2015-04-28 | Wafer splitting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105140182A true CN105140182A (en) | 2015-12-09 |
| CN105140182B CN105140182B (en) | 2018-10-30 |
Family
ID=54725480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510204747.3A Active CN105140182B (en) | 2015-04-28 | 2015-04-28 | Wafer splitting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105140182B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105590884A (en) * | 2015-12-30 | 2016-05-18 | 天津天物金佰微电子有限公司 | Semi-automatic chip splitting machine and splitting method |
| CN110676199A (en) * | 2019-10-16 | 2020-01-10 | 广东长苏科技有限公司 | High-speed mounting imprinter |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100175834A1 (en) * | 2009-01-13 | 2010-07-15 | Shin-Kan Liu | Wafer splitting laminate mechanism |
| CN102646611A (en) * | 2011-02-17 | 2012-08-22 | 竑腾科技股份有限公司 | Method for detecting height of wafer splitting breakpoint |
| KR20120131458A (en) * | 2011-05-25 | 2012-12-05 | 코리아테크노(주) | Laser scanning apparatus for fabricating organic light emitting display device |
| CN203631525U (en) * | 2013-12-13 | 2014-06-04 | 正恩科技有限公司 | Splitter cutter axis automatic compensation device |
| JP2014120508A (en) * | 2012-12-13 | 2014-06-30 | Disco Abrasive Syst Ltd | Dividing device and dividing method |
| CN203746818U (en) * | 2013-12-30 | 2014-07-30 | 郑礼忠 | Wafer splitting machine |
| CN204809205U (en) * | 2015-04-28 | 2015-11-25 | 苏州镭明激光科技有限公司 | Wafer splitting machine |
-
2015
- 2015-04-28 CN CN201510204747.3A patent/CN105140182B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100175834A1 (en) * | 2009-01-13 | 2010-07-15 | Shin-Kan Liu | Wafer splitting laminate mechanism |
| CN102646611A (en) * | 2011-02-17 | 2012-08-22 | 竑腾科技股份有限公司 | Method for detecting height of wafer splitting breakpoint |
| KR20120131458A (en) * | 2011-05-25 | 2012-12-05 | 코리아테크노(주) | Laser scanning apparatus for fabricating organic light emitting display device |
| JP2014120508A (en) * | 2012-12-13 | 2014-06-30 | Disco Abrasive Syst Ltd | Dividing device and dividing method |
| CN203631525U (en) * | 2013-12-13 | 2014-06-04 | 正恩科技有限公司 | Splitter cutter axis automatic compensation device |
| CN203746818U (en) * | 2013-12-30 | 2014-07-30 | 郑礼忠 | Wafer splitting machine |
| CN204809205U (en) * | 2015-04-28 | 2015-11-25 | 苏州镭明激光科技有限公司 | Wafer splitting machine |
Non-Patent Citations (1)
| Title |
|---|
| 周波 等: "紫外激光切割磷化铟晶圆的工艺研究", 《应用激光》 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105590884A (en) * | 2015-12-30 | 2016-05-18 | 天津天物金佰微电子有限公司 | Semi-automatic chip splitting machine and splitting method |
| CN105590884B (en) * | 2015-12-30 | 2018-06-01 | 天津天物金佰微电子有限公司 | Semi-automatic chip breaking machine and splinter method |
| CN110676199A (en) * | 2019-10-16 | 2020-01-10 | 广东长苏科技有限公司 | High-speed mounting imprinter |
| CN110676199B (en) * | 2019-10-16 | 2022-04-22 | 深圳市迈诺为智能科技有限公司 | High-speed mounting imprinter |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105140182B (en) | 2018-10-30 |
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