CN203631525U - Splitter cutter axis automatic compensation device - Google Patents
Splitter cutter axis automatic compensation device Download PDFInfo
- Publication number
- CN203631525U CN203631525U CN201320828511.3U CN201320828511U CN203631525U CN 203631525 U CN203631525 U CN 203631525U CN 201320828511 U CN201320828511 U CN 201320828511U CN 203631525 U CN203631525 U CN 203631525U
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- China
- Prior art keywords
- camera
- cutter shaft
- shaft line
- sliding table
- motor
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 238000009434 installation Methods 0.000 claims description 9
- 230000005540 biological transmission Effects 0.000 abstract 1
- 125000004122 cyclic group Chemical group 0.000 abstract 1
- 238000006073 displacement reaction Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- 230000001351 cycling effect Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 150000002505 iron Chemical class 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
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- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model provides a splitter cutter axis automatic compensation device. The compensation device is mounted on a wafer splitter, and used for compensating positional deviation between a cutter axis of a splitter cutter and a reference line within a shooting image of a camera. The compensation device comprises a controller, a horizontal slide platform and a motor, wherein the controller is connected with the motor and the camera; the horizontal slide platform carries the camera and is arranged on a horizontal slide rail; and the motor drives the horizontal slide platform to slide through a transmission element, thereby changing the position of the camera. Before a splitting operation is performed, if the cutter axis is not in the same line with the reference line within the shooting image of the camera, the controller drives the motor to move the horizontal slide platform, and the cutter axis is enabled to overlap the reference line within the shooting image of the camera, thereby completing the automatic compensation of the cutter axis. The compensation is carried out automatically, so that the compensation can be done quickly and can be performed before every splitting cyclic operation, improving the splitting accuracy.
Description
Technical field
The utility model relates to the wafer splitting machine of splitting wafer, relates in particular to the compensation arrangement of the chopper cutter shaft line position of wafer splitting machine.
Background technology
Refer to shown in " Fig. 1 " and figure " 2 ", wafer splitting machine 1 is for being the crystal grain of a grain by wafer 2 splittings, to carry out follow-up encapsulation operation, wafer 2 is before carrying out splitting, can first go out laterally and longitudinal pre-tangent line 3 by laser cutting, after then wafer 2 being attached to a blue film 4 and being fixed, send into a wafer splitting machine 1 by an iron hoop 5 and carry out splitting operation.
Wafer splitting machine 1 comprises a rotation microscope carrier 6, one Z axis body 7, one chopper 8, one camera 9, one press element 10 and a pressing plate lamp source group 11, sandwiched this iron hoop 5 of this rotation microscope carrier 6, and can do movement and the rotation of in-plane, this chopper 8 is fixed on this Z axis body 7 and is arranged at the top of this wafer 2, to carry out splitting operation, and in the time carrying out splitting operation, utilize this press element 10 to compress this wafer 2, to avoid wafer 2 warpages, this pressing plate lamp source group 11 can one be connected on this press element 10, it irradiates this wafer 2 for generation of imaging source (not shown), to penetrate wafer 2, this camera 9 is arranged at the below of this wafer 2, for the image for obtaining this wafer 2, to learn the position of this wafer 2.
Therefore this wafer 2 can position the capture of this wafer 2 by the displacement of this rotation microscope carrier 6 and this camera 9, and after location completes, can pass through the upper and lower displacement of this chopper 8 and the quantitative displacement of this rotation microscope carrier 6, multiple pre-tangent lines 3 are carried out to splitting continuously, this camera 9 is in continuous splitting process, whether the location that continues this pre-tangent line 3 of monitoring is offset, and to look the degree compensation location of skew, and completes splitting operation after being laterally all split with longitudinal pre-tangent line 3.
In addition in the picked-up picture of this camera 9, be provided with a datum line, this datum line is aimed at the cutter shaft line (the splitting knife edge) of this chopper 8, therefore the locate mode of this camera 9 to this wafer 2, for passing through the displacement of this rotation microscope carrier 6, adjust the datum line in the picked-up picture of this camera 9, aim at the pre-tangent line 3 of this wafer 2, also the cutter shaft line of this chopper 8 can be overlapping and complete correction with the pre-tangent line 3 of this wafer 2.
But, carrying out after splitting operation, the cutter shaft line of the datum line of this camera 9 and this chopper 8 may have position deviation, thereby, even if the datum line in the picked-up picture of this camera 9 has been aimed at the pre-tangent line 3 of this wafer 2, the cutter shaft line of this chopper 8, in the time of actual splitting, still cannot be aimed at pre-tangent line 3 splittings of this wafer 2.
Therefore, known splitting machine need to regularly utilize manual mode to adjust the position of this camera 9, makes the datum line of this camera 9 again aim at the cutter shaft line of this chopper 8, to maintain the precision of splitting, and its obvious suitable trouble and time-consuming.
Utility model content
Therefore, main purpose of the present utility model is to provide a kind of splitting machine cutter shaft line autocompensation installation, with the cutter shaft line of auto-compensation chopper, and can complete fast.
Through as known from the above, for achieving the above object, the utility model is a kind of splitting machine cutter shaft line autocompensation installation, be installed on a wafer splitting machine, for compensating the position deviation of the datum line in the cutter shaft line of a chopper and the picked-up picture of a camera, it comprises a horizontal sliding table, one motor and a controller, wherein this horizontal sliding table carries this camera, and be arranged on a horizontal slide rail, and this motor orders about this horizontal sliding table slippage by an actuated element, this controller connects this motor and this camera, this controller orders about this horizontal sliding table slippage of this motor interlock, make the datum line in the cutter shaft line of this chopper and the picked-up picture of this camera overlapping.
Further, the glide direction of this horizontal sliding table is perpendicular to the cutter shaft line of this chopper.
Further, this camera is fixed on a grip slipper, and this grip slipper is carried on this horizontal sliding table.
Further, this grip slipper is fixed on a vertical slide unit, and this vertical slide unit is arranged in a vertical slide rail, and this vertical slide rail is arranged on this horizontal sliding table, and this vertical slide unit is subject to the driving of a height motor and upper and lower slippage.
Accordingly, before carrying out splitting operation, take the cutter shaft line of this chopper by this camera, can learn that datum line in the picked-up picture of this cutter shaft line and this camera is not or not on the same line, when not on the same line, this controller can order about this horizontal sliding table slippage of this motor interlock, make the datum line in the picked-up picture of this cutter shaft line and this camera overlapping, it complete cutter shaft line auto-compensation, its advantage is to carry out into full-automation, thereby can complete fast, before each splitting cycling, all can implement the auto-compensation of cutter shaft line, can guarantee splitting precision, meet the needs on using.
Accompanying drawing explanation
Fig. 1 is the structure chart of known wafer.
Fig. 2 is known wafer splitting machine structure chart.
Fig. 3 is the splitting machine structure chart that the utility model is implemented on wafer.
Fig. 4 is the picked-up picture view of the utility model camera.
Embodiment
For making that feature of the present utility model, object and effect are had to more deep understanding and approval, now enumerate preferred embodiment and coordinate accompanying drawing to be described as follows:
Refer to shown in " Fig. 3 " and " Fig. 4 ", the utility model is a kind of splitting machine cutter shaft line autocompensation installation, be installed on a wafer splitting machine 10, for compensating the position deviation of the datum line 32 in the cutter shaft line 21 of a chopper 20 and the picked-up picture 31 of a camera 30, it comprises a horizontal sliding table 40, a motor 50 and a controller 60, wherein these horizontal sliding table 40 these cameras 30 of carrying, and be arranged on a horizontal slide rail 70, and the glide direction of this horizontal sliding table 40 can be perpendicular to the cutter shaft line 21 of this chopper 20.
This motor 50 orders about this horizontal sliding table 40 slippages by an actuated element 51, can change the cutter shaft line 21 of this chopper 20 and the relative position of the datum line 32 of this camera 30, also can compensate the position deviation of cutter shaft line 21 with the datum line 32 of this camera 30 of this chopper 20.
This controller 60 connects this motor 50 and this camera 30, and this controller 60, for ordering about these horizontal sliding table 40 slippages of these motor 50 interlocks, can make the datum line 32 in the cutter shaft line 21 of this chopper 20 and the picked-up picture 31 of this camera 30 overlapping.
And the utility model reality implement on, this camera 30 can be fixed on a grip slipper 80, and this grip slipper 80 is carried on this horizontal sliding table 40.Further, this grip slipper 80 is fixed on a vertical slide unit 81, this vertical slide unit 81 is arranged in a vertical slide rail 82, this vertical slide rail 82 is arranged on this horizontal sliding table 40, and this vertical slide unit 81 is subject to the driving of a height motor 83 and upper and lower slippage, also can adjust the focal length of this camera 30, to increase the definition of picked-up picture 31.
The utility model is in the time that reality is used, before carrying out splitting operation, take the cutter shaft line 21 of this chopper 20 by this camera 30, can learn that datum line 32 in the picked-up picture 31 of this cutter shaft line 21 and this camera 30 is not or not on the same line, when not on the same line (as shown in " Fig. 4 "), this controller 60 can order about these horizontal sliding table 40 slippages of these motor 50 interlocks, make the datum line 32 in the picked-up picture 31 of this cutter shaft line 21 and this camera 30 overlapping, it complete cutter shaft line auto-compensation.
As mentioned above, the utility model is by this controller 60, judge that by picked-up picture 31 whether this cutter shaft line 21 is overlapping with the datum line 32 of this camera 30, and order about these horizontal sliding table 40 slippages of these motor 50 interlocks, to change the position of this camera 30, thereby can make this cutter shaft line 21 overlapping with this datum line 32, to complete cutter shaft line auto-compensation, it can full-automaticly be carried out, thereby can complete fast.In other words,, by the utility model, in the time carrying out splitting operation, can before each splitting cycling, all can implement, to improve splitting precision.
Claims (4)
1. a splitting machine cutter shaft line autocompensation installation, is installed on a wafer splitting machine, for compensating the position deviation of the datum line in the cutter shaft line of a chopper and the picked-up picture of a camera, it is characterized in that, described splitting machine cutter shaft line autocompensation installation comprises:
One horizontal sliding table, described horizontal sliding table carries described camera, and is arranged on a horizontal slide rail;
One motor, described motor orders about described horizontal sliding table slippage by an actuated element; And
One controller, described controller connects described motor and described camera, and described controller orders about horizontal sliding table slippage described in described motor interlock, makes the datum line in the cutter shaft line of described chopper and the picked-up picture of described camera overlapping.
2. splitting machine cutter shaft line autocompensation installation according to claim 1, is characterized in that, the glide direction of described horizontal sliding table is perpendicular to the cutter shaft line of described chopper.
3. splitting machine cutter shaft line autocompensation installation according to claim 1, is characterized in that, described camera is fixed on a grip slipper, and described grip slipper is carried on described horizontal sliding table.
4. splitting machine cutter shaft line autocompensation installation according to claim 3, it is characterized in that, described grip slipper is fixed on a vertical slide unit, described vertical slide unit is arranged in a vertical slide rail, described vertical slide rail is arranged on described horizontal sliding table, and described vertical slide unit is subject to the driving of a height motor and upper and lower slippage.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320828511.3U CN203631525U (en) | 2013-12-13 | 2013-12-13 | Splitter cutter axis automatic compensation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320828511.3U CN203631525U (en) | 2013-12-13 | 2013-12-13 | Splitter cutter axis automatic compensation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203631525U true CN203631525U (en) | 2014-06-04 |
Family
ID=50817976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320828511.3U Expired - Lifetime CN203631525U (en) | 2013-12-13 | 2013-12-13 | Splitter cutter axis automatic compensation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203631525U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105140182A (en) * | 2015-04-28 | 2015-12-09 | 苏州镭明激光科技有限公司 | Wafer splitting machine |
| CN114803452A (en) * | 2022-04-29 | 2022-07-29 | 河北圣昊光电科技有限公司 | Synchronous transmission assembly and splitting machine with same |
-
2013
- 2013-12-13 CN CN201320828511.3U patent/CN203631525U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105140182A (en) * | 2015-04-28 | 2015-12-09 | 苏州镭明激光科技有限公司 | Wafer splitting machine |
| CN105140182B (en) * | 2015-04-28 | 2018-10-30 | 苏州镭明激光科技有限公司 | Wafer splitting machine |
| CN114803452A (en) * | 2022-04-29 | 2022-07-29 | 河北圣昊光电科技有限公司 | Synchronous transmission assembly and splitting machine with same |
| CN114803452B (en) * | 2022-04-29 | 2024-04-09 | 河北圣昊光电科技有限公司 | Synchronous transmission assembly and splitting machine with same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140604 |