CN204088274U - The wafer core grain automatic alignment apparatus of probe station - Google Patents
The wafer core grain automatic alignment apparatus of probe station Download PDFInfo
- Publication number
- CN204088274U CN204088274U CN201420564913.1U CN201420564913U CN204088274U CN 204088274 U CN204088274 U CN 204088274U CN 201420564913 U CN201420564913 U CN 201420564913U CN 204088274 U CN204088274 U CN 204088274U
- Authority
- CN
- China
- Prior art keywords
- wafer
- vision system
- video camera
- ccd video
- platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model discloses a kind of wafer core grain automatic alignment apparatus of probe station, comprise wafer probe platform; Wherein it also has the vision system for controlling the motion of wafer probe platform; Described vision system, comprise industrial computer, and on the support arm that is attached thereto, this support arm is provided with the camera lens that ccd video camera and ccd video camera connect and the LED light source be arranged on camera lens, is connected with industrial computer control system by data line by ccd video camera.Controlled by the motion of vision system to wafer probe platform.First this is novel realizes by the wafer upper slice process of wafer probe platform, then carries out IMAQ computational analysis by vision system, realizes the position fixing process of automatic angle adjustment to wafer and wafer first core grain.Solve Traditional Man upper slice precision and ineffective problem, improve acceptance rate and production capacity greatly.
Description
Technical field
The utility model relates to a kind of wafer probe platform, particularly a kind of wafer core grain automatic alignment apparatus of probe station.
Background technology
The major function of wafer probe platform is that wafer is adsorbed on wafer-supporting platform by vacuum valve, the position of crystal grain along with locating platform steady shift and and probes touch, realize the test to crystal grain indices.Complete machine comprises wafer-supporting platform, three axle locating platform, turntable and control system.
Traditional probe station fluctuating plate is completed by hand by workman, and not only efficiency is low but also easily cause probe not at wafer first center, and makes test process subsequently produce accumulated error, and serious situation can make probe sideslip, can not complete test.And test is as a ring important in production process of semiconductor, the precision of probe station directly has influence on whole production, manually to go up slice in angle adjustment and aim in the process of wafer first core grain, that efficiency reduces and produces the main cause of error, and improve due to the development of whole semiconductor front road technique, all more accurate complexity of the number of wafer product body, product volume graphic, require that probe station is while raising mechanical precision, the alignment precision of probe station, aiming at efficiency all will have higher requirement.
Summary of the invention
In view of above-mentioned present situation, the utility model is in order to solve wafer angle and automatically adjust and the technical problem of auto-alignment wafer first core grain, and provide a kind of wafer core grain automatic alignment apparatus of probe station, effectively improve mechanical precision, probe station alignment precision and aim at efficiency.
Technology solution of the present utility model is, a kind of wafer core grain automatic alignment apparatus of probe station, comprises wafer probe platform; Wherein it also has the vision system for controlling the motion of wafer probe platform; Described vision system, comprise industrial computer, and the support arm be connected with industrial computer, this support arm is provided with the camera lens of ccd video camera and ccd video camera connection, with the LED light source be arranged on camera lens, be connected with industrial computer control system by data line by ccd video camera.Therefore, by the LED light source floor light in vision system, and camera lens in vision system and ccd video camera gather the wafer image information on wafer probe platform, and send industrial computer to and process, and send corresponding movement instruction to wafer probe platform, carry out the motion controlling them.
During this is novel, involved LED light source is distributed in around camera lens.
The wafer probe relatives of Taiwan compatriots living on the Mainland prior art of this novel indication, mainly utilizes wafer probe platform to control wafer-supporting platform and carries out angle adjustment.
The effect that the utility model has is, because have employed the vision system analyzing and processing wafer image in automatic contraposition device, and carry out calculating reaching and accurately control turntable adjustment angle, and accurately wafer first core grain is navigated to assigned address by mobile two axle locating platforms, greatly can shorten upper slice time to sheet like this, and replace the process manually to go up slice, effectively improve precision and efficiency, reduce error, improve acceptance rate.
Accompanying drawing explanation
Fig. 1 is this novel view.
Embodiment
The wafer core grain automatic alignment apparatus of a kind of probe station shown in Fig. 1, comprises wafer probe platform and vision system two parts.This novel described wafer probe platform, comprise X-axis and Y-axis locating platform 3 and 4, and on the X-axis that is equipped with and Y-axis drive motors 5 and 11, described Y-axis locating platform 4 is provided with turntable 2, and be arranged on the electric rotating machine 10 controlled on turntable 2, this turntable 2 arranges wafer-supporting platform 1.This novel wafer-supporting platform 1 has vacuum suction assembly (being signal in figure), and be arranged on the top of X-axis locating platform 3.Therefore, in operating process, control wafer-supporting platform 1 by the electric rotating machine 10 on turntable 2 and carry out angle adjustment.X-axis drive motors 5 on X-axis locating platform 3 during this is novel controls wafer-supporting platform 1 in X-axis and the motion of Y-axis both direction.Vision system described in the present embodiment, comprise industrial computer 8, and the support arm 12 to be connected with industrial computer 8, the camera lens 6 and the LED light source 7 be arranged on camera lens 6 that this support arm 12 are provided with ccd video camera 9 and ccd video camera 9 connection form, LED light source 7 described in the present embodiment is distributed in camera lens 6 around, and is connected with industrial computer 8 control system by data line by ccd video camera 9.Vision system is utilized to aim at wafer probe platform, by LED light source 7 floor light, and camera lens in vision system and ccd video camera gather the wafer image information on wafer probe platform, and send industrial computer to and process, and send corresponding movement instruction to wafer probe platform, control their motion.
In above-mentioned, the stepping motor that described X-axis and Y-axis drive motors 5 and 11 drive for pulse mode.
Major function:
1, be put into by wafer on wafer-supporting platform 1, the vision system in automatic contraposition device gathers the wafer image on wafer-supporting platform 1 by ccd video camera 9 IMAQ part, image information is sent to industrial computer 8.
2, on the basis of the above, industrial computer 8 processing image information in vision system, and generate automatic aligning instruction.
3, after process terminates, instruction is sent to turntable 2 and X-axis and Y-axis locating platform 3 and 4 by the industrial computer 8 in vision system, controls wafer-supporting platform 1 and moves, by the mobile assigned address of this point, realize automatic aligning function.
Claims (2)
1. a wafer core grain automatic alignment apparatus for probe station, comprises wafer probe platform; It is characterized in that, it also has the vision system for controlling the motion of wafer probe platform; Described vision system, comprise industrial computer (8), and on the support arm (12) that is attached thereto, this support arm (12) is provided with the camera lens (6) that ccd video camera (9) and ccd video camera (9) connect and the LED light source (7) be arranged on camera lens (6), is connected with industrial computer (8) control system by data line by ccd video camera (9).
2. the wafer core grain automatic alignment apparatus of a kind of probe station according to claim 1, it is characterized in that, described LED light source (7) is distributed in camera lens (6) around.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420564913.1U CN204088274U (en) | 2014-09-29 | 2014-09-29 | The wafer core grain automatic alignment apparatus of probe station |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420564913.1U CN204088274U (en) | 2014-09-29 | 2014-09-29 | The wafer core grain automatic alignment apparatus of probe station |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204088274U true CN204088274U (en) | 2015-01-07 |
Family
ID=52180955
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420564913.1U Expired - Lifetime CN204088274U (en) | 2014-09-29 | 2014-09-29 | The wafer core grain automatic alignment apparatus of probe station |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204088274U (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104992918A (en) * | 2015-05-08 | 2015-10-21 | 江苏艾科瑞思封装自动化设备有限公司 | Die bonder automatic calibration method and system |
| CN105304541A (en) * | 2015-09-30 | 2016-02-03 | 秦皇岛视听机械研究所 | Automatic semiconductor wafer positioning device |
| CN109782103A (en) * | 2019-03-11 | 2019-05-21 | 潘元志 | The alignment methods and system of probe and pin of electronic device |
| CN110170785A (en) * | 2019-05-31 | 2019-08-27 | 广东瑞谷光网通信股份有限公司 | A kind of LD chip positioning device |
| CN113120616A (en) * | 2019-12-31 | 2021-07-16 | 苏州必思实精密机械有限公司 | Automatic alignment lighting detection method for liquid crystal screen |
| CN113670816A (en) * | 2021-07-08 | 2021-11-19 | 成都云绎智创科技有限公司 | Device and system for visual identification positioning guide |
| CN114295613A (en) * | 2021-12-24 | 2022-04-08 | 济南晶正电子科技有限公司 | Wafer direction judging system and method |
| CN119064650A (en) * | 2024-07-31 | 2024-12-03 | 闽都创新实验室 | A non-contact electroluminescent detection probe tilt adjustment device and method based on machine vision |
-
2014
- 2014-09-29 CN CN201420564913.1U patent/CN204088274U/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104992918A (en) * | 2015-05-08 | 2015-10-21 | 江苏艾科瑞思封装自动化设备有限公司 | Die bonder automatic calibration method and system |
| CN105304541A (en) * | 2015-09-30 | 2016-02-03 | 秦皇岛视听机械研究所 | Automatic semiconductor wafer positioning device |
| CN109782103A (en) * | 2019-03-11 | 2019-05-21 | 潘元志 | The alignment methods and system of probe and pin of electronic device |
| CN109782103B (en) * | 2019-03-11 | 2021-07-30 | 镇江宏祥自动化科技有限公司 | Alignment method and system for probe and electronic device pin |
| CN110170785A (en) * | 2019-05-31 | 2019-08-27 | 广东瑞谷光网通信股份有限公司 | A kind of LD chip positioning device |
| CN110170785B (en) * | 2019-05-31 | 2024-08-23 | 广东瑞谷光网通信股份有限公司 | LD chip positioning device |
| CN113120616A (en) * | 2019-12-31 | 2021-07-16 | 苏州必思实精密机械有限公司 | Automatic alignment lighting detection method for liquid crystal screen |
| CN113670816A (en) * | 2021-07-08 | 2021-11-19 | 成都云绎智创科技有限公司 | Device and system for visual identification positioning guide |
| CN114295613A (en) * | 2021-12-24 | 2022-04-08 | 济南晶正电子科技有限公司 | Wafer direction judging system and method |
| CN114295613B (en) * | 2021-12-24 | 2024-05-28 | 济南晶正电子科技有限公司 | Wafer direction judging system and method |
| CN119064650A (en) * | 2024-07-31 | 2024-12-03 | 闽都创新实验室 | A non-contact electroluminescent detection probe tilt adjustment device and method based on machine vision |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204088274U (en) | The wafer core grain automatic alignment apparatus of probe station | |
| CN208027173U (en) | A robot camera installation parameter adjustable test device | |
| CN206601101U (en) | A kind of one-touch intelligent double vision feels image measurer | |
| CN105304541A (en) | Automatic semiconductor wafer positioning device | |
| CN107289876A (en) | Multi-shaft interlocked vision, laser combined type non-contact measurement device for measuring and measuring method | |
| CN105025290A (en) | Method for automatically adjusting inclination between image photographing module group sensor and lens | |
| CN107991795B (en) | Method for detecting liquid crystal module by using automatic optical detection system of liquid crystal module | |
| CN201893321U (en) | BGA (ball grid array) chip repair device | |
| CN104914109B (en) | A kind of cell phone back chitin amount detection systems and detection method | |
| CN117020517A (en) | Pre-weld addressing method and system | |
| CN104931507B (en) | A kind of phone housing edge quality detecting system and detection method | |
| CN110553584A (en) | Measuring tool, automatic measuring system and measuring method for small-sized complex parts | |
| CN204405004U (en) | Valve spring physical dimension measures testing machine | |
| CN105526881A (en) | Blade automated detection device based on three-dimensional raster scanning and detection method thereof | |
| CN104819705B (en) | Based on the binocular measurement apparatus and application method for becoming ken target search | |
| CN108942927B (en) | A method for unifying pixel coordinates and robotic arm coordinates based on machine vision | |
| CN104384902A (en) | Press fit system based on machine vision positioning | |
| CN104019761A (en) | Three-dimensional configuration obtaining device and method of corn plant | |
| CN103553369A (en) | Glass fitting device | |
| CN205380337U (en) | Vision soldering tin machine | |
| CN206772244U (en) | A kind of battery core R angle detecting devices and battery core R angle detection case | |
| CN202565587U (en) | Cross-positioning device for chip mounter | |
| CN203464904U (en) | Image measurement instrument | |
| CN203163693U (en) | Workpiece specification automatic detection machine | |
| US10955239B2 (en) | Positioning device and positioning method, color film coating machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No. 165, middle section of Hebei Avenue, seaport area, Qinhuangdao, Hebei Province Patentee after: Qinhuangdao audio-visual Machinery Research Institute Co.,Ltd. Address before: No. 165, middle section of Hebei Avenue, seaport area, Qinhuangdao, Hebei Province Patentee before: QINHUANGDAO AUDIO-VISUAL MACHINERY Research Institute |
|
| CP01 | Change in the name or title of a patent holder | ||
| CX01 | Expiry of patent term |
Granted publication date: 20150107 |
|
| CX01 | Expiry of patent term |