CN203746818U

CN203746818U - Wafer splitting machine

Info

Publication number: CN203746818U
Application number: CN201320876016.XU
Authority: CN
Inventors: 郑礼忠; 蔡奇陵
Original assignee: Individual
Current assignee: Individual
Priority date: 2013-12-30
Filing date: 2013-12-30
Publication date: 2014-07-30
Anticipated expiration: 2023-12-30

Abstract

The utility model discloses a wafer splitting machine comprising a gun barrel seat, an n-shaped fixed substrate and a cleaver seat. The gun barrel seat is fixed on the n-shaped fixed substrate, and is internally provided with a gun barrel and a steel ball disposed in the gun barrel. Through operation of an electrically-controlled pressure adjusting valve, the steel ball knocks the cleaver seat disposed below and enables a cleaver on the cleaver seat to knock and cut a wafer. The n-shaped fixed substrate and the cleaver seat are connected with each other through two pairs of elastic sheets. Downward displacement distance of the cleaver seat generated when the steel ball knocks the cleaver seat is shortened by elastic force of the elastic sheets. Therefore, the cleaver seat is enabled to generate stable up-and-down movement and generate high-speed rebound, wafer cutting operation is more complete and more accurate, and the cost loss is reduced.

Description

Wafer splitting machine

Technical field

The utility model is about a kind of wafer cutting device, the splitting machine using while referring in particular in a kind of semiconductor technology for cutting crystal wafer.

Background technology

In recent years,, along with International Environmental Protection trend and the industry demand of carbon reduction, light-emitting diode (Light-Emitting Diode is called for short LED) industry is increasingly important in the development in Taiwan.Light-emitting diode belongs to one of semiconductor subassembly, owing to having the advantages such as small volume, long service life, power consumption are few, is widely used at present on various electronic product.Light-emitting diode is one of product the most competitive in the opto-electronics of Taiwan, the light-emitting diode industry in Taiwan is only second to Japan in the world, be the light-emitting diode industry production value world's second largest in Taiwan in 2010, along with the growth of prior art, light-emitting diode is produced yield and is gradually improved, unit manufacturing cost will significantly reduce, and the demand of light-emitting diode can continue to increase, and relevant exhibition industry development prospect is good.

In present light-emitting diode technique, because the wafer of light-emitting diode is compared with the wafer volume of other applications little a lot, therefore necessary special fine processing when LED wafer is cut apart, if there is any problem in the process of cutting crystal wafer, as cut apart not exclusively or accidentally injure wafer body etc., crystal particle function after wafer is cut apart reduces or even cannot use, and yield after allowing wafer cut apart reduces, serious impact is caused to wafer production process in capital, also cause great cost allowance, therefore the cutting of processing wafer in light-emitting diode technique must be prudent especially careful.

In known technology, wafer splitting machine generally adopts calutron to be used as the hammer of chopper, but, calutron is slower in the reaction time, in the process of cutting crystal wafer when calutron knocks after chopper, need pass into reverse current makes calutron leave chopper, to carry out follow-up cutting operation, and the calutron spring of conventionally can arranging in pairs or groups again, so that the time of calutron contact chopper can narrow down to the shortest, but be just difficult to thus control the strength of calutron in the time knocking chopper, and after using a period of time, there is elastic fatigue in spring, the strength that makes calutron knock chopper needs to such an extent that adjust again, often cause the puzzlement of equipment on maintenance and production, simultaneously, if chopper is application of force inequality or application of force deficiency in the time of start, just not can completely cutting of wafer, if therefore produce the incomplete wafer of cutting, just cannot carry out the next one and make flow process, even must give up the infull wafer of cutting, so can cause burden to production cost, utilize wafer splitting machine that wafer is done to complete cutting apart so how to reach, become problem important in light-emitting diode technique.

In view of this, how to research and develop improvement for the existing shortcoming of above-mentioned known wafer splitting machine, allow the user can more convenient use and promote finished product yield, the real target for the required effort research and development of relevant industry.

Utility model content

In order to solve above-mentioned mentioned problem, a main purpose of the present utility model is to provide a kind of wafer splitting machine, and particularly one configures a pair of shell fragment on chopper seat, can promote the stable movement of chopper seat, to prepare to carry out cutting operation next time.

According to above-mentioned purpose, the utility model provides a kind of wafer splitting machine, comprising: a barrel block is a hollow tube, has one second end of a first end and relative first end, and forms a gas joint chair in first end outer peripheral edges; One gun barrel, is a hollow tube, has one second end of a first end and relative first end, is to be disposed in the hollow tube of barrel block by the second end of barrel block, and makes the second end aligned configuration of the second end and the barrel block of gun barrel; One buffer stopper, is to be disposed in the hollow tube of barrel block by the first end of barrel block, is connected to the first end of gun barrel, and has an air intake duct, and the longitudinal centre line of air intake duct is the longitudinal centre line configuration of aiming at the hollow tube of gun barrel; One cover, be to be placed on gas joint chair, and there is an air admission hole, the air admission hole of covering be aim at buffer stopper air intake duct and configure; One steel ball is to be disposed in the hollow tube of gun barrel; One door character type fixing base, is made up of a level board and two vertical panels that are positioned at level board both sides end, and level board has a configuration hole of running through, with so that barrel block passes and terminate in the gas joint chair of barrel block; A pair of shell fragment, has two configuration sections and a suspending part, and two configuration sections are connected with waiting vertical panel below respectively, and hanging part is between two configuration sections; One chopper seat, is the below being disposed at shell fragment, and is connected in suspending part, and makes the second end of barrel block be positioned at chopper seat top; And a chopper, be to be disposed at chopper seat below.

Wherein the periphery of this buffer stopper is around an O type ring.

Wherein this air admission hole of this covering is further connected in an automatically controlled air throttle.

Wherein this air admission hole of this covering is further connected in an automatically controlled pressure-regulating valve.

Wherein this buffer stopper has an extension, and is extended into by the first end of this gun barrel in the hollow tube of this gun barrel.

Wherein this barrel block is inner forms an internal thread, and on this buffer stopper, forms an external screw thread corresponding with this internal thread of this barrel block inside.

Wherein on this buffer stopper, form multiple axis holes, and the configuration set screw corresponding with described axis hole on this barrel block.

Wherein further configuration one electrical-controlled lifting device of this buffer stopper.

The wafer splitting machine that the utility model proposes, can, in the time of splitting operation, produce stable moving up and down, and produces resilience at a high speed, to guarantee the complete and accuracy of wafer cutting, the loss reducing costs.

Brief description of the drawings

For making the purpose of this utility model, technical characterictic and advantage, more correlative technology field personnel understand and are implemented the utility model, coordinate appended accompanying drawing at this, illustrate technical characterictic of the present utility model and execution mode in follow-up specification, and enumerate preferred embodiment and further illustrate, so following examples explanation is not in order to limit the utility model, and accompanying drawing hereinafter to be contrasted, to express the signal relevant with the utility model feature, wherein:

Fig. 1 is the generalized section of the barrel block of wafer splitting machine of the present utility model.

Fig. 2 A-Fig. 2 B is the schematic diagram of wafer splitting machine of the present utility model.

Fig. 3 A-Fig. 3 B is the generalized section of wafer splitting machine of the present utility model start.

Fig. 4 is the buffer stopper schematic diagram of wafer splitting machine of the present utility model.

Embodiment

First, referring to Fig. 1, is the generalized section for the barrel block of wafer splitting machine of the present utility model.As shown in Figure 1, wafer splitting machine 1 has a barrel block 10, and it is a hollow tube, and barrel block 10 has one second end 103 of a first end 101 and relative first end 101, and forms a gas joint chair 12 in first end 101 outer peripheral edges; One gun barrel 20, it is a hollow tube, gun barrel 20 has one second end 203 of a first end 201 and relative first end 201, and gun barrel 20 is disposed in the hollow tube of barrel block 10 by the second end 103 of barrel block 10, and makes the second end 103 aligned configuration of the second end 203 with the barrel block 10 of gun barrel 20; One buffer stopper 22, is disposed in the hollow tube of barrel block 10 by the first end 101 of barrel block 10, is connected to the first end 201 of gun barrel 20, and has an air intake duct 221, and the longitudinal centre line of air intake duct 221 is the longitudinal centre line configurations of aiming at the hollow tube of gun barrel 20; One covers 30, is placed on the gas joint chair 12 of barrel block 10, and has an air admission hole 301, covers 30 air admission hole 301 and be to aim at the air intake duct 221 of buffer stopper 22 and configure; One steel ball 40, is disposed at the hollow tubular of gun barrel 20.Wherein, the air intake duct 221 of buffer stopper 22 is the calibers that are less than gun barrel 20 with the air admission hole 301 that covers 30, to prevent that steel ball 40 from skidding off from the first end 201 of gun barrel 20.In addition, in the periphery of buffer stopper 22 around an O type ring 24, in order to increase the air-tightness in gun barrel 20.

Then, please refer to Fig. 2 A and Fig. 2 B, be, the schematic diagram for wafer splitting machine of the present utility model.One door character type fixing base 50, by a level board 501 and be positioned at 503,505 of two vertical panels that level board 501 both sides ends 5011,5013 extend and form, level board 501 has a configuration hole 5015 of running through, and uses so that barrel block 10 passes and terminate in the gas joint chair 12 of barrel block 10; Two pairs of shell fragments 60, every pair of shell fragment 60 has two configuration sections 601 and a suspending part 603, suspending part 603 is between two configuration sections 601, wherein two configuration sections 601 of every a pair of shell fragment 60 are connected with two vertical panel 503,505 belows respectively, and each suspending part 603 is extended toward two vertical panel 503,505 opposite face directions; One chopper seat 70, it is connected with each suspending part 603 of two pairs of shell fragments 60, and makes the second end 103 of barrel block 10 be positioned at chopper seat 70 tops; And a chopper 72, be disposed at chopper seat 70 belows.Wherein a vertical panel 505 of door character type fixing base 50 can form an installation portion 507, in order to be fixed on an outside board, to fix wafer splitting machine 1.

Referring to Fig. 3 A and Fig. 3 B, is the generalized section for wafer splitting machine of the present utility model start.Please first consult Fig. 3 A, the air admission hole 301 of the covering 30 configuring on the barrel block 10 of wafer splitting machine 1 is connected in automatically controlled air throttle (figure does not draw) and an automatically controlled pressure-regulating valve (figure does not draw), the size that air throttle energy adjustments of gas is come in and gone out, pressure-regulating valve is that a gas positive pressure source or a gas negative pressure source can be provided.In the time of 1 start of wafer splitting machine, pressure-regulating valve can disengage a gas positive pressure source and enter in gun barrel 20, promotes inner steel ball 40 and accelerates to move from first end 201 to second ends 203 of gun barrel 20, and further knock the chopper seat 70 that is disposed at gun barrel 20 belows; Chopper seat 70 can, because of the past bottom offset of knocking of steel ball 40, make the chopper 72 that is positioned at chopper seat 70 belows knock wafer 2, and on splitting wafer 2, the beating position of acquiescence is to complete cutting operation.

Then, refer to Fig. 3 B, when steel ball 40 completes after cutting operation the chopper 72 of below because knocking chopper seat 70, pressure-regulating valve can disengage a gas negative pressure source, make the interior formation negative pressure of gun barrel 20, now steel ball 40 can be accelerated to move to first end 201 by the second end 203 of gun barrel 20 because of negative pressure state, so that steel ball 40 is got back to origin-location, prepares to carry out cutting next time.Repeatedly provide gas positive pressure source and gas negative pressure source by automatically controlled pressure-regulating valve, make steel ball knock chopper seat 70 more than 40 time, and make the chopper of chopper seat 70 belows knock wafer 2 more than 72 time, guarantee wafer 2 completely and cutting accurately, the loss reducing costs.

That narrates at Fig. 3 A and Fig. 3 B knocks in process, and chopper seat 70 connects on the fixing door character type fixing base 50 of barrel block 10 with two pairs of shell fragments 60, and makes chopper seat 70 be positioned at the second end 203 belows of the gun barrel 20 of barrel block 10.In the time that steel ball 40 makes it down to knock chopper seat 70 because of gas positive pressure source (in Fig. 3 A), chopper seat 70 allows chopper seat 70 by the elasticity of shell fragment 60, and down unlikely displacement is excessive, only produces short distance displacement, and makes chopper 72 down knock wafer 2; And in the time that steel ball 40 makes it up to move because of gas negative pressure source (in Fig. 3 B), chopper seat 70 can, because the elastic recovery of shell fragment 60 is to original position, make chopper 72 away from wafer 2, to prepare to carry out the cutting operation that steel ball 40 knocks next time.Because the cutting of wafer needs accurate operation, Fang Buhui accidentally injures wafer body, therefore, by the configuration of shell fragment 60, makes chopper seat 70 in the time being clashed into by steel ball 40, makes chopper seat 70 produce stable moving up and down, and produces resilience at a high speed.And the utility model does not limit the thickness of shell fragment 60, its thinner shell fragment 60 can produce larger displacement, thicker 60 less displacements of generation of shell fragment, and its configuration is determined according to job requirements.

The utility model is after cutting operation completes, the pressure-regulating valve that gun barrel 20 connects can continue to provide a gas negative pressure source, make inner the continuing of gun barrel 20 produce suction, make steel ball 40 continue to be held in the first end 201 of gun barrel 20, in order to carrying out wafer cutting operation next time.In addition, be disposed at the buffer stopper 22 of gun barrel 20 first end 201 tops, can be in the time of barrel block 10 start, absorb inertia force and vibrations that steel ball 40 knocks the 70 rear generations of chopper seat, the chopper that further prevents chopper seat 70 touches wafer 2 72 2 times, cause the damage of wafer 2, simultaneously, buffer stopper 22 absorbs shake can make chopper seat 70 can within the shortest time, reach stable state, and around the O type ring 24 of buffer stopper 22 peripheries, can make preferably air-tightness of the interior generation of gun barrel 20, be beneficial to negative-pressure adsorption steel ball 40.

Then, referring to Fig. 4, is the buffer stopper schematic diagram for wafer splitting machine of the present utility model.When in the time that wafer need cut, for in response to some special material, therefore the splitting power of chopper 72 need to be very little, if required power is less than the limit of current pressure-regulating valve, just must shorten gun barrel 20 length (steel ball stroke) to reduce the shock power of steel ball 40.As shown in Figure 4, buffer stopper 22 of the present utility model has an extension 223, in the time that buffer stopper 22 is put into barrel block 10, its extension 223 can extend into gun barrel 20 by the first end 201 of gun barrel 20, shortens by this distance length (steel ball stroke) that the steel ball in gun barrel 20 walks to reduce the shock power of steel ball 40; And according to need shorten length, can adjust by the buffer stopper 22 of changing different extension 223 length.

The adjustment of the utility model extension 223, can be by manually adjusting, for example: at the inner internal thread (figure does not draw) that forms of barrel block 10, and on buffer stopper 22, form an external screw thread (figure do not draw) corresponding with the internal thread of barrel block 10 inside, reach the action of adjusting lifting by manual rotation buffer stopper 22, and except configuration screw thread, also can on buffer stopper 22, form multiple axis holes (figure do not draw) with and the corresponding set screw (scheming not draw) of the interior configuration of barrel block 10, reach to fix the axis hole of differing heights on buffer stopper 22 action of adjusting lifting.Except manual adjustment, also configurable automatic adjustment mechanism, for example: configuration electrical-controlled lifting device (figure does not draw), on buffer stopper 22, is adjusted the lifting action of buffer stopper 2 in automatically controlled mode; Therefore, the utility model is not limited the up-down mode of buffer stopper 22.

Although the utility model discloses as above with aforesaid preferred embodiment; so it is not in order to limit the utility model; anyly have the knack of art technology person; not departing from spirit and scope of the present utility model; when doing a little change and retouching, what therefore scope of patent protection of the present utility model must define depending on the appended claim scope of this specification is as the criterion.

Claims

1. a wafer splitting machine, is characterized in that, comprising:

One barrel block, is a hollow tube, has a first end and one second end of this first end relatively, and forms a gas joint chair in these first end outer peripheral edges;

One gun barrel, is a hollow tube, has a first end and one second end of this first end relatively, is disposed in the hollow tube of this barrel block, and makes the second end aligned configuration of the second end and this barrel block of this gun barrel by the second end of this barrel block;

One buffer stopper, is disposed at by the first end of this barrel block in the hollow tube of this barrel block, is connected to the first end of this gun barrel, and has an air intake duct, and the longitudinal centre line of this air intake duct is aimed at the longitudinal centre line configuration of the hollow tube of this gun barrel;

One covers, and is placed on this gas joint chair, and has an air admission hole, and the air admission hole of this covering is aimed at the air intake duct of this buffer stopper and configured;

One steel ball, is disposed in the hollow tube of this gun barrel;

One door character type fixing base, is made up of a level board and two vertical panels that are positioned at this level board both sides end, and this level board has a configuration hole of running through, with so that this barrel block passes and terminate in the gas joint chair of this barrel block;

A pair of shell fragment, has two configuration sections and a suspending part, and two configuration sections are connected with described vertical panel below respectively, and hanging part is between two configuration sections;

One chopper seat, is disposed at this below to shell fragment, and is connected in this suspending part, and makes the second end of this barrel block be positioned at this chopper seat top; And

One chopper, is disposed at this chopper seat below.

2. wafer splitting machine according to claim 1, is characterized in that, wherein the periphery of this buffer stopper is around an O type ring.

3. wafer splitting machine according to claim 1, is characterized in that, wherein this air admission hole of this covering is further connected in an automatically controlled air throttle.

4. wafer splitting machine according to claim 1, is characterized in that, wherein this air admission hole of this covering is further connected in an automatically controlled pressure-regulating valve.

5. wafer splitting machine according to claim 1, is characterized in that, wherein this buffer stopper has an extension, and is extended into by the first end of this gun barrel in the hollow tube of this gun barrel.

6. wafer splitting machine according to claim 5, is characterized in that, wherein this barrel block is inner forms an internal thread, and on this buffer stopper, forms an external screw thread corresponding with this internal thread of this barrel block inside.

7. wafer splitting machine according to claim 5, is characterized in that, wherein on this buffer stopper, forms multiple axis holes, and the configuration set screw corresponding with described axis hole on this barrel block.

8. wafer splitting machine according to claim 5, is characterized in that, wherein further configuration one electrical-controlled lifting device of this buffer stopper.