JP2022007357A - Breaking method of composite substrate - Google Patents

Abstract

To provide a breaking method capable of parting a resin film and a brittle material substrate at once without performing substrate inversion in a breaking step and without using a sharp breaking bar by parting a composite substrate where a deposition layer including the resin film is formed on the brittle material substrate.SOLUTION: Provided is a breaking method of a composite substrate where a deposition layer 2 including a resin film is formed on one side surface of a brittle material substrate 1. The breaking method includes: a scribe step of forming a scribe line on a surface of the brittle material substrate 1; and a breaking step of parting the deposition layer together with the brittle material substrate by separating the composite substrates W divided by the scribe line in a direction along a contact surface between the deposition layer 2 and the brittle material substrate 1 while a contact member 5 having a flat contact surface is pressed on a breaking projected line which is located at a back side position across the brittle material substrate 1 of the scribe line, and on a resin film surface of the deposition layer 2.SELECTED DRAWING: Figure 6

Description

The present invention relates to a break method for dividing a composite substrate in which a film-forming layer containing a resin film is formed on one surface of a brittle material substrate such as glass.
Here, the "resin film" refers to a film mainly made of a polymer resin, which is formed in a sheet shape so as to seal the surface of one surface on the brittle material substrate. In addition to the film formed for the purpose of protecting the brittle material substrate or the functional film formed on the brittle material substrate, the resin film itself becomes a part of the functional film. It also includes cases where it works. The "functional film" refers to a film that exhibits optical, acoustic, electrical, chemical functions, etc. due to a laminated structure of a metal film, an organic film, a semiconductor film, etc., and is used as a device or element such as a sensor or a MEMS. A membrane that fulfills these functions. The film-forming layer may be a resin film alone or a laminated structure with a functional film. The method for forming a functional film or a resin film on a brittle material substrate and the method for fixing the film are not particularly limited.

In order to divide a composite substrate having a resin film sealed on one surface of the brittle material substrate, first, as shown in FIG. 8A, a scribing line is used on the surface of the brittle material substrate 1 using a cutter wheel K. (Cut groove) S is processed (scribe process). In the next step, as shown in FIG. 8B, the substrate W (composite substrate containing the brittle material substrate 1 and the film-forming layer (resin film) 2) is inverted (first time) and placed on the cushion sheet 13. Place. Then, as shown in FIG. 8C, the break bar 14 is pressed from above to bend the substrate W to infiltrate the cracks in the scribe line and completely divide the brittle material substrate 1 along the scribe line (brittle material). Substrate break process).
At this time, even if the substrate W is bent (in a convex shape downward), the crack penetration stops at the brittle material substrate 1, and the crack cannot be penetrated at once for the resin film whose material is different from that of the brittle material.

Therefore, subsequently, as shown in FIG. 8 (d), the substrate W is inverted (second time) again and placed on the cushion sheet 13, and the break bar 14 is placed along the dividing line as shown in FIG. 8 (e). The brittle material substrate 1 is pushed and bent into a V shape to split the film-forming layer (resin film) 2 so as to tear it (see Patent Documents 1 and 2). The scribe line S can be processed by using a laser instead of the cutter wheel.

Japanese Unexamined Patent Publication No. 2015-79824 Japanese Patent Application Laid-Open No. 2015-83336

In this conventional method, after undergoing a scribing step of processing a brittle material substrate 1 on a support plate by a scribing mechanism, the brittle material substrate 1 is first completely separated from the brittle line by being conveyed to a break mechanism, and then the substrate. It is necessary to separately perform the break step of the brittle material substrate 1 and the break step of the film-forming layer (resin film) 2 in the break step, such as dividing the film-forming layer (resin film) 2 after inverting W. There is.
That is, there is a problem that the inversion mechanism of the substrate W is required during the break process, the apparatus configuration becomes complicated and large, and the work is complicated and time-consuming.

As another means, there is a method disclosed in FIG. 8 of Patent Document 2. In this method, as described in FIG. 9A of the present specification, first, a scribe line S is processed on the surface of the brittle material substrate 1 by a scribe mechanism with a cutter wheel K, and then the substrate W (the brittle material substrate 1 and the like) are formed. The composite substrate (composite substrate including the film forming layer (resin film) 2) is conveyed to the break mechanism, and as shown in FIG. 9B, the substrate W is inverted so that the scribe line S is on the lower surface side, and the left and right sides are left and right. Place it on the pedestal so that the scribe line S is located between the pedestals 15 and 15. Then, as shown in FIG. 9 (c), the break bar 16 having a sharp cutting edge is pressed from above the scribe line to bend the substrate W. By this pressing, the film formation layer (resin film) 2 that is first pressed by the sharp cutting edge is cut, and then by further pressing, the substrate W is bent to develop cracks in the scribe line S in the thickness direction, and the brittle material substrate 1 Is to divide.

According to this method, in the break step, the brittle material substrate 1 and the film-forming layer (resin film) 2 can be simultaneously separated without being inverted by pressing the break bar 16. However, the break bar 16 used for division requires an acute-angled cutting edge (for example, a cutting edge angle of 30 degrees) with a sharp tip in order to cut the film forming layer (resin film) 2. Further, since the break bar 16 not only cuts the film forming layer (resin film) 2 but also subsequently presses the brittle material substrate 1 to separate it from the scribe line S, a large load is continuously applied to the tip of the cutting edge. Will be loaded. A sharp cutting edge is extremely delicate and easily damaged, so if a large load is repeatedly applied to such a cutting edge, wear and spillage will occur, making it impossible to divide the blade accurately and cleanly, and in some cases. There is a big problem that the break bar may be replaced frequently and the work efficiency may be deteriorated because the break bar may be left in a continuous state without being completely divided.

Further, since the film forming layer 2 is broken from the pressing position of the cutting edge tip separately from the scribe line, the cutting edge tip is the film forming layer (resin film) 2 in order to improve the processing quality of the sectional cross section. It is also necessary to accurately align the position in contact with the scribe line S so as not to deviate from the extension line of the scribe line S.

Therefore, in the present invention, when the composite substrate in which the film-forming layer containing the resin film is formed on one side of the brittle material substrate is broken, the film-forming layer containing the resin film and the brittle material substrate are not subjected to the inversion operation of the substrate. Can be broken at the same time, and can be broken without using a break bar with a sharp cutting edge (which is prone to blade spillage and requires accurate alignment on the extension of the scrib line). The purpose is to provide a break method.

The break method of the present invention made to solve the above-mentioned problems is a break method of a composite substrate in which a film-forming layer containing a resin film for sealing the surface is formed on one side of a brittle material substrate. In the scribing step of forming a scribing line on the brittle material substrate surface on the side of the composite substrate on which the film formation layer is not formed, and on the planned break line located on the back side of the brittle material substrate of the scribing line. Further, the composite substrate divided by the scribing line is pressed against the resin film surface of the film-forming layer while a contact member having a flat contact surface is pressed against the film-forming layer and the brittle material substrate. The structure comprises a break step of dividing the film-forming layer together with the brittle material substrate by pulling it away in the direction along the contact surface with the brittle material.

According to the present invention, in the break step, a force is applied to separate the composite substrate from each other in the direction along the contact surface between the film-forming layer and the brittle material substrate, but at the same time, the back side of the brittle material substrate of the scrib line is sandwiched. A contact member having a flat contact surface is pressed against the resin film surface of the film-forming layer on the planned break line at the position. In the brittle material substrate, the pulling force (tensile load) is concentrated on the uncut portion of the scribe line that has already been cracked and the actual wall thickness is reduced.
Therefore, the brittle material substrate penetrates deeply along the uncut portion of the scribe line, propagates along the line direction, and is completely broken. At this time, since the contact member presses the planned break line (that is, directly above the scribe line), the substrate bends at the press contact position to assist the crack penetration of the brittle material substrate.
When the brittle material substrate is completely broken, the pulling force is continuously concentrated on the position of the resin film of the film-forming layer on the planned break line (immediately above the scribe line). At this time, in the portion of the resin film on the planned break line that is in pressure contact with the contact member, the resin film is locally thinly elastically deformed by the pressure contact force and is easily broken. Moreover, the resin film is in close contact with the brittle material substrate due to the pressure contact force, and the film formation layer (resin film) that is in close contact with the brittle material substrate follows the position of the planned break line as the brittle material substrate is separated. As a result of being torn in, the brittle material substrate and the film-forming layer (resin film) are simultaneously separated along the scribing line (scheduled break line).

According to the above invention, the inversion mechanism in the break process becomes unnecessary, the processing process is reduced, the brittle material substrate is divided and the film-forming layer (resin film) is divided at once, and the processing time is increased. Can be shortened. In addition, the composite substrate is divided by the pressure contact force of the contact member on the flat contact surface and the pulling force without using the break bar of the sharp cutting edge as in the conventional case, so that the blade is spilled or worn. You can continue the break process stably without worrying about.

In the above invention, a pair of horizontal tables are arranged with a gap between them, and the contact member is arranged above the gap so that the planned break line is located between the gaps in the break step. The composite substrate may be placed and held on the table, and the table may be pulled horizontally while the contact member is pressed against the planned break line.
As a result, in the break step, the brittle material substrate can be broken and the film-forming layer (resin film) can be broken at the same time without inverting the substrate on the same table, which simplifies the device configuration. Moreover, since the contact member uses a flat surface, it is not necessary to accurately align it on the planned break line (immediately above the scribe line).

In the above invention, the contact member is a roller, and in the break step, the position of one side edge of the planned break line which is the starting point of the break may be pressed against each other.
As a result, the break treatment between the brittle material substrate and the resin film can be performed starting from one side edge on the planned break line.
In this case, the roller may be further rolled while being pressed against the roller from the position of the one-sided edge. For example, even with a relatively thick resin film, the brittle material substrate and the resin film can be accurately sequentially separated along the planned break line.

In the above invention, the contact member is a rod-shaped body, and may be pressure-welded so as to cross the planned break line in the break step.

A cross-sectional view and a perspective view showing an example of a composite substrate to be a break target of the method of the present invention. The schematic front view of the substrate processing apparatus used in one Example of the method of this invention. FIG. 3 is a cross-sectional view showing a first stage of a scribe process in an embodiment of the method of the present invention. FIG. 6 is a cross-sectional view showing a second stage of the scribe process of FIG. FIG. 3 is a cross-sectional view showing a first stage of a break step in an embodiment of the method of the present invention. FIG. 5 is a cross-sectional view showing a second stage of the break step of FIG. Schematic front view of the substrate processing apparatus used in another embodiment of the present invention. Explanatory drawing which shows the division method of the conventional composite board. Explanatory drawing which shows the other division method of the conventional composite board.

Hereinafter, the details of the present invention will be described in detail based on the examples shown in the figure. In the following description, a composite substrate in which a film-forming layer containing a resin film is laminated on one surface and a large number of sensor devices are manufactured by splitting is described as a processing target. In this embodiment, as shown in FIG. 1A, a flat plate-shaped glass substrate 1 having a thickness of 0.5 mm is used as the brittle material substrate, and the functional film 2a and the resin film for the sensor device are used as the film forming layer 2. A composite substrate W on which 2b is laminated is used.
An organic film and a metal electrode film constituting a sensor device are laminated on the functional film 2a, and a polymer resin (for example, polyimide) is laminated on the resin film 2b so as to seal the upper surface of the functional film 2a. Yes, these form a film-forming layer 2 having a thickness of about 50 μm.
As shown in FIG. 1B, the film-forming layer 2 of the composite substrate W is patterned by arranging individual device forming regions G, each of which is a sensor device, vertically and horizontally, and is formed between adjacent device forming regions G and G. Is provided with a partition allowable band D (street region) having a bandwidth d used for engraving and breaking a scribe line when breaking the composite substrate W to separate individual sensor devices in a grid pattern. There is.

FIG. 2 is an explanatory diagram showing an outline of a substrate processing apparatus for carrying out the method of the present invention. In FIG. 2, the left side is the upstream side in the feed direction of the substrate W to be processed, and the right side is the downstream side.
The substrate processing apparatus A includes a pair of tables 3a and 3b for placing and holding the composite substrate W in a horizontal posture. The tables 3a and 3b have a large number of suction ports 4 (see FIG. 3) formed on the surface thereof, and are formed so that the substrate W can be sucked and held by suction by a suction device (vacuum pump) (not shown). .. Further, the tables 3a and 3b are arranged in series in the substrate feed direction (X direction) with a gap L, and the table 3b on the downstream side is separated from the other table 3a by a drive mechanism (not shown) such as an air cylinder. It is formed so that it can move horizontally in the direction.

In the middle portion of the gap L of the tables 3a and 3b, the roller 5 is arranged above the substrate W held by these tables, and the cutter wheel 6 is located below the substrate W and facing the roller 5 (position vertically below). Is placed. The roller 5 is held up and down by the upper scribe head 8 via the elevating mechanism 7, and the upper scribe head 8 is held by a drive mechanism (not shown) along the guide rail 9 in a direction along the gap L (relative to the X direction). It is formed so that it can move in the Y direction orthogonal to each other on the horizontal plane. As shown in FIG. 3, the roller 5 has a flat peripheral surface 5a on the outer peripheral surface, and is formed in a shape in which the edge 5b is rounded. Further, the width of the peripheral surface 5a of the roller 5 is narrower than the band width d of the division allowable band D (street region) of the substrate W.
The cutter wheel 6 is held up and down by the lower scribe head 11 via the elevating mechanism 10, and the lower scribe head 11 is moved along the guide rail 12 by a drive mechanism (not shown) in the same movement direction as the roller 5, that is, in the Y direction. It is formed so that it can be moved.

Next, the break method of the present invention using the above device will be described.
First, as shown in FIG. 3, the composite substrate W to be processed is placed so that the film forming layer 2 is on the upper side, and the rollers 5 and the cutter wheel 6 are above and below the band width d of the division allowable region D (street region). It is placed on the tables 3a and 3b so as to be located within the range of the space and is adsorbed and held. Then, as shown in FIG. 4, the roller 5 is lowered and rolled in the Y direction in a state of being in contact with the surface of the film forming layer 2. At the same time, the cutter wheel 6 is raised and pressed against the surface of the glass substrate 1 while traveling in the Y direction together with the roller 5. As a result, the roller 5 acts as a cradle for the substrate W, and the scribe line S can be machined on the glass substrate 1 (scribe process).

As an example of the processing conditions, a cutter wheel 6 having a diameter of 2 mm and a cutting edge angle of 115 ° was used, and the scribe line was processed at a traveling speed of 100 mm / sec and a pressing load of 6 N. Further, the roller 5 used had a flat peripheral surface 5a having a width of 25 μm. As a result, it was possible to process the scribe line S with high accuracy on the glass substrate 1. At this time, as a result of the film forming layer 2 being pressed by the roller 5 due to the drag force against the pressing load of the cutter wheel 6, the film forming layer 2 portion of the band-shaped region where the roller 5 travels and comes into contact is strongly adhered to the glass substrate 1. It became a state.

Next, as shown in FIG. 5, the cutter wheel 6 is retracted downward, and the table 3b on the downstream side is horizontally separated from the other table 3a (corresponding to the contact surface direction between the glass substrate and the film forming layer). .. As shown in FIG. 6, when the downstream table 3b is horizontally separated from the other table 3a, the roller 5 is at a desired position on the film forming layer 2 on the planned break line (that is, directly above the scribe line). It is in a state of being pressed against. Here, the one-sided edge on the planned break line is pressed. By pressing the resin film at a desired position on the planned break line in this way, the resin film at the desired position is locally thinly elastically deformed by the pressure contact force and is easily broken. Then, it becomes possible to control that the break between the glass substrate 1 and the film forming layer 2 (resin film) is surely advanced (along the scheduled break line) from this position as a starting point. Then, if it is in contact with one side edge, it can be propagated in one direction from one side edge, and it becomes possible to control a high degree of crack growth in the break process.

For example, when a scribe line is formed on the glass substrate 1 in the scribe process, a region of about 0.5 mm is provided on one side edge of the glass substrate 1 so as not to form a scribe line, and the scribe line is formed from a position inside the one side edge. A scribing method (referred to as "inner cutting scribing") for improving the processing quality of a segmented cross section near one edge by forming a line is known. When this inward cutting scribe is adopted in the scribe process of the present invention, the roller 5 is pressed against the position on the planned break line near the one-sided edge where the inward cutting scribe did not form the scribe line. By setting this, the crack will surely penetrate along the planned break line (that is, the scribe line) starting from the vicinity of the pressure contact position of the roller 5 (over the entire planned break line including the edge edge where the scribe line is not formed). It will be possible to make it progress in the line direction.

Further, in the break step, it is also possible to roll the roller 5 in contact with one side edge along the planned break line while pressing the roller 5. For example, when the thickness of the resin film of the film forming layer 2 becomes thick to some extent, it is necessary to sufficiently increase the pulling force (tensile load) in order to tear the resin film, but the resin film is locally formed by the pressure contact force of the roller 5. By moving the position where the resin film is thinly elastically deformed and easily broken, even if the resin film becomes thick, the resin film can be divided without increasing the pulling force.

Further, in the above embodiment, the roller 5 is used as the contact member to be pressed against the planned break line, but instead, as shown in FIG. 7, a bar 15 (rod-shaped body) having a flat contact surface 15a is used. It may be used to abut the composite substrate W so as to cross the edges of the composite substrate W. In this case, when the film-forming layer 2 (resin film) is broken, the entire area on the planned break line is locally thinly elastically deformed and easily broken. Therefore, it is possible to break the glass substrate 1 and the film forming layer 2 (resin film) at the same time without increasing the pulling force for the entire planned break line.

As described above, according to the present invention, the resin film and the brittle material substrate can be simultaneously separated from the composite substrate W without inversion of the substrate in the break step. Moreover, since it is performed by horizontal pulling without using a sharp cutting edge as in the past, it is possible to break stably without worrying about blade spillage or wear, and it is not necessary to accurately align the cutting edge tip.

Although the typical examples of the present invention have been described above, the present invention is not necessarily specified in the above-described embodiment, and the present invention is appropriately modified or modified within a range that achieves the object and does not deviate from the claims. It is possible to do.

In the above embodiment, in the composite substrate W, a functional film 2a and a resin film 2b for a sensor device are laminated as a film forming layer 2 on a glass substrate 1, and a break treatment is performed on a breakable region thereof. However, if the resin film is laminated on the brittle material substrate such as a glass substrate, the break treatment by the method of the present invention is possible.

Further, in the above embodiment, in the scribe process, the roller 5 and the cutter wheel 6 are used, and the cutter wheel 6 is raised and pressed against the surface of the glass substrate 1 in a state where the roller 5 is lowered and brought into contact with the film forming layer 2. While rolling in the Y direction together with the roller 5, a scribe line was formed. However, the processing method of the scribe line is not limited to this, and laser processing or the like may be used.

INDUSTRIAL APPLICABILITY The present invention can be used for dividing a composite substrate in which a film-forming layer containing a resin film is formed on one surface of a brittle material substrate.

A Substrate processing equipment L Gap between tables S Scrivener W Composite board D Allowable division band (street area)
G Device formation area 1 Glass substrate 2 Film film layer 2a Functional film 2b Resin film 3a Table 3b Table 5 Roller (contact member)
6 Cutter wheel 7 Elevating mechanism 8 Upper scribe head 9 Guide rail 10 Elevating mechanism 11 Lower scribe head 12 Guide rail 15 Bar (contact member)

Claims (5)

A method for breaking a composite substrate in which a film-forming layer containing a resin film that seals the surface is formed on one side of a brittle material substrate.
A scribe step of forming a scribe line on the brittle material substrate surface on the side of the composite substrate on which the film formation layer is not formed, and a scribe step.
On the planned break line located on the back side of the brittle material substrate across the brittle material substrate, and while pressing a contact member provided with a flat contact surface against the resin film surface of the film film layer, while pressing the contact member. The composition comprises a break step of separating the film-forming layer together with the brittle material substrate by separating the composite substrate separated by the scribing line in a direction along the contact surface between the film-forming layer and the brittle material substrate. How to break a composite board. A pair of horizontal tables are arranged with a gap between them, and the contact member is arranged above the gap. In the break step, the planned break line is located between the gaps on the table. The method for breaking a composite substrate according to claim 1, wherein the composite substrate is placed and held on the table, and the table is horizontally separated while the contact member is pressed against the scheduled break line. The break method according to claim 1 or 2, wherein the contact member is a roller, and the position of one side edge of the planned break line, which is the starting point of the break in the break step, is pressed against each other. The break method according to claim 3, wherein in the break step, the roller is rolled while being pressed against the roller from the position of the one-sided edge. The break method according to claim 1, wherein the contact member is a rod-shaped body, and the contact member is pressed so as to cross over the planned break line in the break step.

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