JP2017177453A - Substrate dividing device - Google Patents

Substrate dividing device Download PDF

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Publication number
JP2017177453A
JP2017177453A JP2016065997A JP2016065997A JP2017177453A JP 2017177453 A JP2017177453 A JP 2017177453A JP 2016065997 A JP2016065997 A JP 2016065997A JP 2016065997 A JP2016065997 A JP 2016065997A JP 2017177453 A JP2017177453 A JP 2017177453A
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Prior art keywords
substrate
holding table
holding
rotation center
rotation
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嘉文 廣野
Yoshifumi Hirono
嘉文 廣野
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Priority to JP2016065997A priority Critical patent/JP2017177453A/en
Priority to CN201710164587.3A priority patent/CN107240574A/en
Publication of JP2017177453A publication Critical patent/JP2017177453A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

Abstract

PROBLEM TO BE SOLVED: To improve precision of a divided surface in dividing a substrate formed of brittle material.SOLUTION: A first holding table 3 and a second holding table 5 have a first holding surface 11 and a second holding surface 21 for holding a substrate respectively, and are arranged adjacently with a clearance 33 between side parts 3a, 5a of both of the holding tables so as to form a horizontal surface by arranging the first holding surface 11 and second holding surface 21 side by side. A turning connection part 7 turnably connects the side parts 3a, 5a of the first holding table 3 and second holding table 5, and has a turning center at a height different from the horizontal surface in a state that the horizontal surface is formed by arranging the first holding surface 11 and second holding surface 21 side by side. The turning connection part 7 includes a first turning connection part 45a which connects first end parts of the side parts 3a, 5a of both of the tables, and a second turning connection part 45b which connects second end parts of the side parts 3a, 5a of both of the tables and has a turning center height different from the first turning connection part 45a.SELECTED DRAWING: Figure 5

Description

本発明は、脆性材料基板の分割装置に関し、特に、スクライブ溝が形成された脆性材料基板を分割する装置に関する。   The present invention relates to a brittle material substrate dividing apparatus, and more particularly to an apparatus for dividing a brittle material substrate in which scribe grooves are formed.

ガラス、半導体ウエハ、セラミックス等の脆性材料基板を分断するために用いる分割装置が従来から知られている（特許文献１を参照）。
特許文献１に記載の分割装置は、互いに隙間を隔てて設置された、一対のテーブルを有している。ガラス板は、上面に形成したスクライブ溝が隙間に位置するように、両テーブルにまたがって吸引固定される。
そして、一方のテーブルを隙間と平行な回転中心軸に沿って回動させることで、ガラス板を撓ませて分断する。 2. Description of the Related Art A dividing apparatus used for dividing a brittle material substrate such as glass, semiconductor wafer, or ceramic has been conventionally known (see Patent Document 1).
The dividing apparatus described in Patent Document 1 has a pair of tables that are installed with a gap therebetween. The glass plate is sucked and fixed across both tables so that the scribe groove formed on the upper surface is located in the gap.
And by rotating one table along the rotation center axis parallel to the gap, the glass plate is bent and divided.

特開平４−２８０８２８号公報JP-A-4-280828

一般的にスクライブ溝の深さは一様でなく深い箇所が存在するので、特許文献１に記載の分割装置では、ガラス板を分割するときにはガラス板の分断が一様に進行するのではなく、前述の深い箇所で先にガラス板の分断が完了する。すなわち前述の深い箇所でガラス板の下面まで垂直クラックが到達し、その後は当該箇所を起点としてスクライブ方向にガラス板の分断が進行する。その結果、分断面は屏風状になったり湾曲したりすることになり、その場合は分割された基板の商品価値が低下していた。   In general, since the depth of the scribe groove is not uniform and there is a deep portion, in the dividing apparatus described in Patent Document 1, when the glass plate is divided, the division of the glass plate does not proceed uniformly, The division of the glass plate is completed first at the aforementioned deep portion. That is, a vertical crack reaches the lower surface of the glass plate at the deep portion described above, and thereafter, the glass plate is divided in the scribe direction starting from the portion. As a result, the dividing surface becomes a folding screen or curved, and in this case, the commercial value of the divided substrate is lowered.

本発明の目的は、脆性材料からなる基板の分割を行うに際し、分断面の精度を高めることにある。   An object of the present invention is to increase the accuracy of a sectional surface when a substrate made of a brittle material is divided.

以下に、課題を解決するための手段として複数の態様を説明する。これら態様は、必要に応じて任意に組み合せることができる。   Hereinafter, a plurality of modes will be described as means for solving the problems. These aspects can be arbitrarily combined as necessary.

本発明の一見地に係る基板分割装置は、スクライブ溝が形成された脆性材料からなる基板を分割可能な装置である。基板分割装置は、第１保持テーブルと、第２保持テーブルと、回動連結部とを備えている。
第１保持テーブルは、基板を保持するための第１保持面を有する。
第２保持テーブルは、基板を保持するための第２保持面を有している。第２保持テーブルは、第１保持面と第２保持面が横に並んで水平面を形成することが可能なように、第１保持テーブルと側部同士が隙間を空けて隣接する。
回動連結部は、第１保持テーブルと第２保持テーブルの側部同士を回動自在に連結しており、第１保持面と第２保持面が横に並んで水平面を形成した状態において水平面とは異なる高さに回動中心を有する。
回動連結部は、第１保持テーブルと第２保持テーブルの側部の第１端部同士を連結する第１回動連結部と、第１保持テーブルと第２保持テーブルの側部の第２端部同士を連結している。第２回動連結部は、第１回動連結部と回動中心の高さが異なる。 A substrate dividing apparatus according to an aspect of the present invention is an apparatus capable of dividing a substrate made of a brittle material in which a scribe groove is formed. The substrate dividing apparatus includes a first holding table, a second holding table, and a rotation connecting portion.
The first holding table has a first holding surface for holding the substrate.
The second holding table has a second holding surface for holding the substrate. In the second holding table, the first holding table and the side portions are adjacent to each other with a gap so that the first holding surface and the second holding surface can be formed side by side to form a horizontal plane.
The rotation connecting portion rotatably connects the side portions of the first holding table and the second holding table, and in a state where the first holding surface and the second holding surface are arranged side by side to form a horizontal plane. Has a rotation center at a different height.
The rotation connecting portion includes a first rotation connecting portion that connects the first ends of the side portions of the first holding table and the second holding table, and a second side portion of the first holding table and the second holding table. The ends are connected to each other. The second rotation connection portion is different from the first rotation connection portion in the height of the rotation center.

この基板分割装置では、第１回動連結部が両テーブルの側部の第１端部同士を連結し、第２回動連結部が両テーブルの側部の第２端部同士を連結している。そして、第１連結部の回動中心の高さと第２連結部の回動中心の高さが異なるので、例えば第１保持テーブルと第２保持テーブルの保持面に基板を保持させた状態で第２保持テーブルを第１保持テーブルに対して回動させた場合に、両テーブルの側部の第１端部と第２端部とで基板の変位が異なる。したがって、基板のスクライブ溝は、溝の延びる方向の一方の側から他方の側に向かって分断されていく。その結果、分断面の精度が向上する。   In this substrate dividing apparatus, the first rotation connecting portion connects the first end portions of the side portions of both tables, and the second rotation connecting portion connects the second end portions of the side portions of both tables. Yes. And since the height of the rotation center of the 1st connection part and the height of the rotation center of the 2nd connection part differ, for example in the state where the board was held on the holding surface of the 1st holding table and the 2nd holding table, for example. When the two holding tables are rotated with respect to the first holding table, the displacement of the substrate is different between the first end and the second end of the side portions of both tables. Therefore, the scribe groove of the substrate is divided from one side in the direction in which the groove extends toward the other side. As a result, the accuracy of the sectional surface is improved.

基板分割装置は、回動中心高さ調節機構をさらに備えていてもよい。回動中心高さ調節機構は、第１回動連結部及び第２回動連結部の少なくとも一方の回動中心の高さを調節可能である。
この基板分割装置では、回動中心高さ調節機構によって、第１回動連結部及び第２回動連結部の少なくとも一方の回動中心を適切な位置に変更できる。 The substrate dividing apparatus may further include a rotation center height adjusting mechanism. The rotation center height adjusting mechanism can adjust the height of the rotation center of at least one of the first rotation connection part and the second rotation connection part.
In this substrate dividing apparatus, the rotation center height adjustment mechanism can change the rotation center of at least one of the first rotation connection portion and the second rotation connection portion to an appropriate position.

本発明の一見地に係る基板分割装置は、スクライブ溝が形成された脆性材料からなる基板を分割可能な装置である。基板分割装置は、第１保持テーブルと、第２保持テーブルと、回動連結部と、回動中心高さ調節機構とを備えている。
第１保持テーブルは、基板を保持するための第１保持面を有する。
第２保持テーブルは、基板を保持するための第２保持面を有している。第２保持テーブルは、第１保持面と第２保持面が横に並んで水平面を形成することが可能なように、第１保持テーブルと側部同士が隙間を空けて隣接する。
回動連結部は、第１保持テーブルと第２保持テーブルの側部同士を回動自在に連結している。回動連結部は、第１保持面と第２保持面が横に並んで水平面を形成した状態において水平面とは異なる高さに回動中心を有する。
回動中心高さ調節機構は、回動連結部の回動中心の高さを調節可能である。
この基板分割装置では、回動中心高さ調節機構によって、回動連結部の回動中心を適切な位置に変更できる。 A substrate dividing apparatus according to an aspect of the present invention is an apparatus capable of dividing a substrate made of a brittle material in which a scribe groove is formed. The substrate dividing apparatus includes a first holding table, a second holding table, a rotation connecting portion, and a rotation center height adjusting mechanism.
The first holding table has a first holding surface for holding the substrate.
The second holding table has a second holding surface for holding the substrate. In the second holding table, the first holding table and the side portions are adjacent to each other with a gap so that the first holding surface and the second holding surface can be formed side by side to form a horizontal plane.
The rotation connecting portion rotatably connects the side portions of the first holding table and the second holding table. The rotation connecting portion has a rotation center at a height different from the horizontal plane in a state where the first holding surface and the second holding surface are arranged side by side to form a horizontal plane.
The rotation center height adjustment mechanism can adjust the height of the rotation center of the rotation connecting portion.
In this board | substrate division | segmentation apparatus, the rotation center of a rotation connection part can be changed into an appropriate position with a rotation center height adjustment mechanism.

本発明に係る基板分割装置では、脆性材料からなる基板の分割を行うに際し、分断面の精度が高くなる。   In the substrate dividing apparatus according to the present invention, when the substrate made of a brittle material is divided, the accuracy of the dividing surface is increased.

本発明の第１実施形態に係る基板分割装置の上面の平面図。The top view of the upper surface of the board | substrate division | segmentation apparatus which concerns on 1st Embodiment of this invention. 基板分割装置の上に基板を載せた状態を示す基板分割装置の上面の平面図。The top view of the upper surface of the substrate dividing apparatus which shows the state which mounted the board | substrate on the substrate dividing apparatus. 基板分割装置の裏面の平面図。The top view of the back surface of a board | substrate division | segmentation apparatus. 基板分割装置の回動連結部を示すための斜視図。The perspective view for showing the rotation connection part of a board | substrate division | segmentation apparatus. 基板分割装置の分割動作の一状態を示す斜視図。The perspective view which shows one state of the division | segmentation operation | movement of a board | substrate dividing device. 基板分割装置の正面図。The front view of a board | substrate division | segmentation apparatus. 基板分割装置の正面図であり、分割動作の一状態を示す図。It is a front view of a board | substrate division | segmentation apparatus, and is a figure which shows one state of division | segmentation operation | movement. 基板分割装置の正面図であり、分割動作の一状態を示す図。It is a front view of a board | substrate division | segmentation apparatus, and is a figure which shows one state of division | segmentation operation | movement. 回動連結部の高さと基板の変位の関係を示すための模式的正面図。The typical front view for showing the relationship between the height of a rotation connection part, and the displacement of a board | substrate. 回動連結部の高さと基板の変位の関係を示すための模式的正面図。The typical front view for showing the relationship between the height of a rotation connection part, and the displacement of a board | substrate. 回動連結部の高さと基板の変位の関係を示すための模式的正面図。The typical front view for showing the relationship between the height of a rotation connection part, and the displacement of a board | substrate. 回動中心高さ調節機構を示すための断面図。Sectional drawing for showing a rotation center height adjustment mechanism. 図１２の部分拡大図。The elements on larger scale of FIG.

１．第１実施形態
（１）基板分割装置の基本構成
図１〜図３を用いて、基板分割装置１を説明する。基板分割装置１は、脆弱性基板Ｗ（以下、「基板Ｗ」という）を分割するための装置である。基板Ｗは、例えば、単結晶シリコン基板である。図１は、本発明の第１実施形態に係る基板分割装置の上面の平面図である。図２は、基板分割装置の上に基板を載せた状態を示す基板分割装置の上面の平面図である。図３は、基板分割装置の裏面の平面図である。以下、図１〜図３において、紙面左右方向をＸ方向として、紙面上下方向をＹ方向として説明する。また、紙面の下側を「Ｙ方向手前側」とし、紙面の上側を「Ｙ方向奥側」とする。 1. First Embodiment (1) Basic Configuration of Substrate Dividing Device A substrate dividing device 1 will be described with reference to FIGS. The substrate dividing apparatus 1 is an apparatus for dividing a fragile substrate W (hereinafter referred to as “substrate W”). The substrate W is, for example, a single crystal silicon substrate. FIG. 1 is a plan view of the upper surface of the substrate dividing apparatus according to the first embodiment of the present invention. FIG. 2 is a plan view of the upper surface of the substrate dividing apparatus showing a state in which the substrate is placed on the substrate dividing apparatus. FIG. 3 is a plan view of the back surface of the substrate dividing apparatus. Hereinafter, in FIG. 1 to FIG. 3, the left and right direction on the paper surface is assumed to be the X direction, and the vertical direction on the paper surface is assumed to be the Y direction. Further, the lower side of the paper surface is referred to as “Y-direction front side”, and the upper side of the paper surface is referred to as “Y-direction rear side”.

基板分割装置１は、第１保持テーブル３と、第２保持テーブル５と、回動連結部７とを有しており、第１保持テーブル３と第２保持テーブル５は、互いに水平な状態（図６）と、互いに傾いた姿勢（一方が他方に対して上側に傾いた姿勢（図７）、又は下側に傾いた姿勢（図８））とを取ることができる。
この基板分割装置１では、第１保持テーブル３と第２保持テーブル５は、回動連結部７を介して、側部同士が互いに連結されている。したがって、基板分割装置１の構造が簡単になり、したがって基板分割装置の保管、運搬、操作が容易になる。 The substrate dividing apparatus 1 includes a first holding table 3, a second holding table 5, and a rotation connecting portion 7, and the first holding table 3 and the second holding table 5 are in a horizontal state ( 6) and a posture inclined with respect to each other (a posture in which one is inclined upward with respect to the other (FIG. 7) or a posture inclined downward (FIG. 8)).
In the substrate dividing apparatus 1, the first holding table 3 and the second holding table 5 are connected to each other at the side portions via the rotation connecting portion 7. Therefore, the structure of the substrate dividing apparatus 1 is simplified, and thus the substrate dividing apparatus can be easily stored, transported, and operated.

基板分割装置１は、第１保持テーブル３を有している。第１保持テーブル３は、図１〜図３において左側に配置されている。第１保持テーブル３は、Ｘ方向の短辺とＹ方向の長辺とを有する矩形である。
第１保持テーブル３は、第１保持面１１を有している。さらに、第１保持テーブル３は、図６に示すように、内部に第１真空室１３を有している。第１真空室１３と第１保持面１１との間には、図１に示すように、複数の第１吸引孔１５が形成されている。複数の第１吸引孔１５は、基板Ｗを吸着により充分保持できるように、所定領域に設けられている。具体的には、複数の第１吸引孔１５は、Ｘ方向の第２保持テーブル５側に寄って形成されている。つまり、複数の第１吸引孔１５はＸ方向の第２保持テーブル５と反対側の端部に形成されていない。なお、図６は、基板分割装置の正面図である。 The substrate dividing apparatus 1 has a first holding table 3. The first holding table 3 is arranged on the left side in FIGS. The first holding table 3 is a rectangle having a short side in the X direction and a long side in the Y direction.
The first holding table 3 has a first holding surface 11. Furthermore, as shown in FIG. 6, the first holding table 3 has a first vacuum chamber 13 inside. As shown in FIG. 1, a plurality of first suction holes 15 are formed between the first vacuum chamber 13 and the first holding surface 11. The plurality of first suction holes 15 are provided in a predetermined region so that the substrate W can be sufficiently held by suction. Specifically, the plurality of first suction holes 15 are formed closer to the second holding table 5 side in the X direction. That is, the plurality of first suction holes 15 are not formed at the end of the X direction opposite to the second holding table 5. FIG. 6 is a front view of the substrate dividing apparatus.

基板分割装置１は、第２保持テーブル５を有している。第２保持テーブル５は、図１〜図３において右側に配置されている。第２保持テーブル５は、Ｘ方向の短辺とＹ方向の長辺とを有する矩形である。第２保持テーブル５は、第２保持面２１を有している。さらに、第２保持テーブル５は、図６に示すように、内部に第２真空室２３を有している。第２真空室２３と第２保持面２１との間には、図１に示すように、複数の第２吸引孔２５が形成されている。複数の第２吸引孔２５は、基板Ｗを吸着により充分保持できるように、所定領域に設けられている。具体的には、複数の第２吸引孔２５は、Ｘ方向の第１保持テーブル３側に寄って形成されている。つまり、複数の第２吸引孔２５はＸ方向の第１保持テーブル３と反対側の端部に形成されていない。   The substrate dividing apparatus 1 has a second holding table 5. The second holding table 5 is arranged on the right side in FIGS. The second holding table 5 is a rectangle having a short side in the X direction and a long side in the Y direction. The second holding table 5 has a second holding surface 21. Furthermore, as shown in FIG. 6, the second holding table 5 has a second vacuum chamber 23 therein. As shown in FIG. 1, a plurality of second suction holes 25 are formed between the second vacuum chamber 23 and the second holding surface 21. The plurality of second suction holes 25 are provided in a predetermined region so that the substrate W can be sufficiently held by suction. Specifically, the plurality of second suction holes 25 are formed closer to the first holding table 3 side in the X direction. That is, the plurality of second suction holes 25 are not formed at the end of the X direction opposite to the first holding table 3.

基板分割装置１は、回動連結部７を有している。回動連結部７は、第１保持テーブル３と第２保持テーブル５とを互いに回動自在に連結している。より具体的には、回動連結部７は、第１保持テーブル３と第２保持テーブル５の側部同士（後述）を回動自在に連結している。ここでの回動中心は、Ｙ方向と平行に延びる軸である。これにより、第１保持テーブル３と第２保持テーブル５は互いに対して傾動可能である。
図１〜図３に示すように、第１保持テーブル３と第２保持テーブル５は、長辺同士すなわち側部３ａと側部５ａ同士がＸ方向に近接して配置されており、両者のＸ方向間にはＹ方向に延びる隙間３３が確保されている。具体的には、回動連結部７は、側部３ａと側部５ａ同士を連結している。このように第１保持テーブルと第２保持テーブル５は側部３ａと側部５ａ同士が隙間３３を空けて隣接しており、さらには第１保持面１１と第２保持面２１が横に並んで水平面を形成できる。 The substrate dividing apparatus 1 has a rotation connecting portion 7. The rotation connecting part 7 connects the first holding table 3 and the second holding table 5 so as to be rotatable. More specifically, the rotation connecting portion 7 rotatably connects the side portions (described later) of the first holding table 3 and the second holding table 5. The rotation center here is an axis extending parallel to the Y direction. Thereby, the 1st holding table 3 and the 2nd holding table 5 can tilt with respect to each other.
As shown in FIGS. 1 to 3, the first holding table 3 and the second holding table 5 are arranged such that the long sides, that is, the side portions 3 a and the side portions 5 a are close to each other in the X direction. A gap 33 extending in the Y direction is secured between the directions. Specifically, the rotation connection part 7 has connected the side part 3a and the side parts 5a. Thus, the first holding table and the second holding table 5 are adjacent to each other with the gap 3 between the side portions 3a and the side portions 5a, and the first holding surface 11 and the second holding surface 21 are arranged side by side. A horizontal plane can be formed.

図４及び図６を用いて、回動連結部７を詳細に説明する。
さらに詳細に説明すれば、回動連結部７は、第１連結部材４１を有している。第１連結部材４１は、第１保持テーブル３に設けられている。より具体的には、第１連結部材４１は、第１保持テーブル３の側部３ａ付近の下面においてＹ方向に延びる第１部分４１ａと、第１部分４１ａから上方に延びる一対の第２部分４１ｂと、各第２部分４１ｂの上端からＹ方向に互いに接近する側に延びる第３部分４１ｃとを有している。第３部分４１ｃは第１連結部材４１の表面側に配置されている。これにより、第１連結部材４１は第１保持テーブル３に固定されている。さらに、第１連結部材４１は、各第２部分４１ｂの上部から第２保持テーブル５に向かってＸ方向に延びる第１突出部４１ｄを有している。
また、回動連結部７は、第２連結部材４３を有している。第２連結部材４３は、第２保持テーブル５に設けられている。より具体的には、第２連結部材４３は、第２保持テーブル５の側部５ａ付近の下面においてＹ方向に延びる第１部分４３ａと、第１部分４３ａから上方に延びる一対の第２部分４３ｂと、各第２部分４３ｂの上端からＹ方向に互いに接近する側に延びる第３部分４３ｃとを有している。第３部分４３ｃは第２保持テーブル５の表面側に配置されている。これにより、第２連結部材４３は第２保持テーブル５に固定されている。さらに、第２連結部材４３は、各第２部分４３ｂの上部から第１保持テーブル３に向かってＸ方向に延びる第２突出部４３ｄを有している。第１突出部４１ｄと第２突出部４３ｄはＹ方向に近接している。 The rotation connection part 7 is demonstrated in detail using FIG.4 and FIG.6.
More specifically, the rotation connecting portion 7 has a first connecting member 41. The first connecting member 41 is provided on the first holding table 3. More specifically, the first connecting member 41 includes a first portion 41a extending in the Y direction on the lower surface near the side portion 3a of the first holding table 3, and a pair of second portions 41b extending upward from the first portion 41a. And a third portion 41c extending from the upper end of each second portion 41b to the side approaching each other in the Y direction. The third portion 41 c is disposed on the surface side of the first connecting member 41. Thereby, the first connecting member 41 is fixed to the first holding table 3. Further, the first connecting member 41 has a first projecting portion 41 d extending in the X direction from the upper portion of each second portion 41 b toward the second holding table 5.
Further, the rotation connecting portion 7 has a second connecting member 43. The second connecting member 43 is provided on the second holding table 5. More specifically, the second connecting member 43 includes a first portion 43a extending in the Y direction on the lower surface near the side portion 5a of the second holding table 5, and a pair of second portions 43b extending upward from the first portion 43a. And a third portion 43c extending from the upper end of each second portion 43b to the side approaching each other in the Y direction. The third portion 43 c is disposed on the surface side of the second holding table 5. Thereby, the second connecting member 43 is fixed to the second holding table 5. Further, the second connecting member 43 has a second projecting portion 43 d that extends in the X direction from the top of each second portion 43 b toward the first holding table 3. The first protrusion 41d and the second protrusion 43d are close to each other in the Y direction.

回動連結部７は、さらに具体的には、第１突出部４１ｄと第２突出部４３ｄを連結するＹ方向の手前側の第１回動連結部４５ａと、Ｙ方向奥側の第２回動連結部４５ｂとを有している。第１回動連結部４５ａ及び第２回動連結部４５ｂは、それぞれ、第１突出部４１ｄと第２突出部４３ｄを回動自在に連結する回動ピンを有している。
以上に述べたように、回動連結部７は、Ｙ方向に離れた第１回動連結部４５ａと第２回動連結部４５ｂとを有している。つまり、図１に示すように、第１回動連結部４５ａが第１保持テーブル３及び第２保持テーブル５のそれぞれの第１端部３Ａ及び第１端部５Ａ同士を連結し、第２回動連結部４５ｂが第１保持テーブル３及び第２保持テーブル５のそれぞれの第２端部３Ｂ及び第２端部５Ｂ同士を連結している。第１回動連結部４５ａの第１回動中心軸Ｏ１及び第２回動連結部４５ｂの第２回動中心軸Ｏ２は、同一の直線上に配置されており、第１保持面１１と第２保持面２１が横に並んで水平面を形成した状態において第１保持面１１及び第２保持面２１の下方に位置している。なお、第１回動中心軸Ｏ１及び第２回動中心軸Ｏ２は、図１の平面視で明らかなように、Ｙ方向に平行しており、さらに両者のＸ方向位置は一致している。 More specifically, the rotary connecting portion 7 includes a first rotary connecting portion 45a on the near side in the Y direction that connects the first protruding portion 41d and the second protruding portion 43d, and a second turn on the far side in the Y direction. And a dynamic connecting portion 45b. Each of the first rotation connection portion 45a and the second rotation connection portion 45b has a rotation pin that rotatably connects the first protrusion 41d and the second protrusion 43d.
As described above, the rotation connecting portion 7 includes the first rotation connecting portion 45a and the second rotation connecting portion 45b that are separated in the Y direction. That is, as shown in FIG. 1, the first rotation connecting portion 45 a connects the first end portions 3 </ b> A and the first end portions 5 </ b> A of the first holding table 3 and the second holding table 5 to each other. The dynamic connecting portion 45b connects the second end 3B and the second end 5B of the first holding table 3 and the second holding table 5, respectively. The first rotation center axis O 1 of the first rotation connection part 45 a and the second rotation center axis O 2 of the second rotation connection part 45 b are arranged on the same straight line, and the first holding surface 11. The second holding surface 21 is positioned below the first holding surface 11 and the second holding surface 21 in a state where a horizontal plane is formed side by side. The first rotation center axis O 1 and the second rotation center axis O 2, as is evident in plan view in FIG. 1, it is parallel to the Y direction and X-direction position of both coincide Yes.

図３に示すように、複数のボルト５９によって、第１保持テーブル３と第１連結部材４１が固定され、さらに、第２保持テーブル５と第２連結部材４３とが固定されている。なお、ボルト５９の数及び位置はこの実施形態に限定されない。さらに、保持テーブルと連結部材との固定はボルトに限定されない。   As shown in FIG. 3, the first holding table 3 and the first connecting member 41 are fixed by a plurality of bolts 59, and the second holding table 5 and the second connecting member 43 are fixed. The number and position of the bolts 59 are not limited to this embodiment. Furthermore, the fixing between the holding table and the connecting member is not limited to the bolt.

（２）分割動作
図４〜図８を用いて、基板分割装置１による基板Ｗの分割動作を説明する。図５は、基板分割装置の分割動作の一状態を示す斜視図である。図７及び図８は、基板分割装置の正面図であり、分割動作の一状態を示す図である。
最初に、第１保持テーブル３及び第２保持テーブル５の上に基板Ｗを載置する。このとき、図４及び図６に示すように、第１保持テーブル３と第２保持テーブル５とが、１枚の基板Ｗに対して同一の載置面を有するように配置されている。第１保持テーブル３は設置床面（図示せず）の上に配置され固定されている。第２保持テーブル５は、前述したように第１保持テーブル３に対して傾動可能に連結されている。基板Ｗの上面には、スクライブ溝Ｓが予め形成されている。スクライブ溝Ｓは、基板Ｗの中心を直線状に延びる溝である。スクライブ溝Ｓの形成方法は従来例と同一であり、剪断応力又は引張応力が高い部分が基板Ｗのブレイクポイントとなる。 (2) Dividing Operation The dividing operation of the substrate W by the substrate dividing apparatus 1 will be described with reference to FIGS. FIG. 5 is a perspective view showing one state of the dividing operation of the substrate dividing apparatus. 7 and 8 are front views of the substrate dividing apparatus, showing one state of the dividing operation.
First, the substrate W is placed on the first holding table 3 and the second holding table 5. At this time, as shown in FIGS. 4 and 6, the first holding table 3 and the second holding table 5 are arranged so as to have the same placement surface with respect to one substrate W. The first holding table 3 is arranged and fixed on an installation floor (not shown). As described above, the second holding table 5 is connected to the first holding table 3 so as to be tiltable. On the upper surface of the substrate W, a scribe groove S is formed in advance. The scribe groove S is a groove extending linearly at the center of the substrate W. The method for forming the scribe groove S is the same as that of the conventional example, and a portion where the shear stress or tensile stress is high becomes a break point of the substrate W.

図９に示すように、基板Ｗはそのスクライブ溝Ｓが分割装置の１のＸ方向の中央位置に位置（隙間３３の上）になるように、基板Ｗを第１保持テーブル３及び第２保持テーブル５にまたがらせて配置する。このとき、スクライブ溝ＳはＹ方向に平行になる。
この状態で第１真空室１３及び第２真空室２３の真空吸引が行われ、基板Ｗが第１保持テーブル３及び第２保持テーブル５上に吸着される。 As shown in FIG. 9, the substrate W is held by the first holding table 3 and the second holding so that the scribe groove S is positioned at the center position in the X direction of the dividing device 1 (above the gap 33). It is placed across the table 5. At this time, the scribe groove S is parallel to the Y direction.
In this state, vacuum suction of the first vacuum chamber 13 and the second vacuum chamber 23 is performed, and the substrate W is adsorbed onto the first holding table 3 and the second holding table 5.

次に、図５及び図８に示すように、例えば作業者が第２保持テーブル５を手でつかんで時計方向に回動させ、第１保持テーブル３に対して下方に傾くように移動させる。すると、基板Ｗはスクライブ溝Ｓに沿って切断が進む。しかも第１保持テーブル３及び第２保持テーブル５の第１回動中心軸Ｏ１及び第２回動中心軸Ｏ２の中心は、水平状態の第１保持面１１及び第２保持面２１の下方位置に位置しているので、折られた基板Ｗの切断面は互いに離れ、したがって切粉が基板Ｗの切断面同士が当接することはない。
次に、図８に示すように、第２保持テーブル５を作業者が手でつかんで反時計方向に回動させ、第１保持テーブル３に対して上方に傾くように移動させる。すると、基板Ｗはスクライブ溝Ｓに沿って切断が進む。 Next, as shown in FIGS. 5 and 8, for example, the operator grasps the second holding table 5 with his hand and rotates it clockwise to move the second holding table 5 so as to tilt downward. Then, the cutting of the substrate W proceeds along the scribe groove S. Moreover, the centers of the first rotation center axis O 1 and the second rotation center axis O 2 of the first holding table 3 and the second holding table 5 are below the first holding surface 11 and the second holding surface 21 in the horizontal state. Since the cut surfaces of the folded substrate W are separated from each other, the cut surfaces of the substrate W do not come into contact with each other.
Next, as shown in FIG. 8, the operator holds the second holding table 5 by hand and rotates it counterclockwise, so that the second holding table 5 is tilted upward with respect to the first holding table 3. Then, the cutting of the substrate W proceeds along the scribe groove S.

図９〜図１１を用いて、上記の動作をさらに詳細に説明する。図９〜図１１は、回動連結部の高さと基板の変位の関係を示すための模式的正面図である。
図９〜図１１に示すように、第１回動中心軸Ｏ１と、第２回動中心軸Ｏ２は高さが異なるように設定されている。なお、第１回動中心軸Ｏ１と第２回動中心軸Ｏ２の高さ位置の違いは、説明の便宜のために誇張して描かれている。
具体的には、図９に示すように、第２回動中心軸Ｏ２が第１回動中心軸Ｏ１より下側に配置されて、つまり、第１保持面１１及び第２保持面２１からより遠くに離れている。
例えば、基板Ｗの厚みが０．２ｍｍの場合は、基板Ｗの下面と第１回動中心軸Ｏ１との距離は１．３ｍｍであり、基板Ｗの下面と第２回動中心軸Ｏ２との距離は１．８ｍｍである。基板Ｗの下面と第１回動中心軸Ｏ１との距離は、０．５〜２．０ｍｍの範囲にあり、さらに好ましくは０．１〜３．０ｍｍの範囲にある。また、基板Ｗの下面と第２回動中心軸Ｏ２との距離は、０．６〜２．５ｍｍの範囲にあり、さらに好ましくは０．１〜３．５ｍｍの範囲にある。 The above operation will be described in more detail with reference to FIGS. 9 to 11 are schematic front views for illustrating the relationship between the height of the rotation connecting portion and the displacement of the substrate.
As shown in FIGS. 9 to 11, the first rotation center axis O 1, second rotation center axis O 2 has been set differently heights. The first rotation center axis O 1 and the difference of the second height position of the rotation center axis O 2 is exaggerated for convenience of explanation.
Specifically, as shown in FIG. 9, the second rotation center axis O 2 is disposed below the first rotation center axis O 1 , that is, the first holding surface 11 and the second holding surface 21. Farther away.
For example, when the thickness of the substrate W is 0.2 mm, the distance between the lower surface of the substrate W and the first rotation center axis O 1 is 1.3 mm, and the lower surface of the substrate W and the second rotation center axis O 2. The distance to is 1.8 mm. The distance between the lower surface of the substrate W and the first rotation center axis O 1 is in the range of 0.5 to 2.0 mm, more preferably in the range of 0.1 to 3.0 mm. Further, the distance between the lower surface of the substrate W and the second rotation center axis O 2 is in the range of 0.6 to 2.5 mm, more preferably in the range of 0.1 to 3.5 mm.

この場合、第１保持テーブル３と第２保持テーブル５の第１保持面１１及び第２保持面２１に基板Ｗを搭載した状態で第２保持テーブル５を第１保持テーブル３に対して第１回動中心軸Ｏ１及び第２回動中心軸Ｏ２が位置している側に回動させた場合に、第１保持テーブル３及び第２保持テーブル５の側部３ａ、５ａの第１端部３Ａ、５Ａと第２端部３Ｂ、５Ｂとで基板Ｗの第２保持テーブル５によって保持された部分の変位が異なる。したがって、基板Ｗのスクライブ溝Ｓは、スクライブ溝Ｓの延びる方向の一方の側から他方の側に向かって分断されていく。その結果、分断面の精度が向上する。 In this case, the second holding table 5 is first with respect to the first holding table 3 with the substrate W mounted on the first holding surface 11 and the second holding surface 21 of the first holding table 3 and the second holding table 5. when the rotation center axis O 1 and the second rotation center axis O 2 is rotated to the side which is located, the sides 3a of the first holding table 3 and the second holding table 5, the first end of 5a The displacement of the portion held by the second holding table 5 of the substrate W is different between the portions 3A and 5A and the second end portions 3B and 5B. Therefore, the scribe groove S of the substrate W is divided from one side in the extending direction of the scribe groove S toward the other side. As a result, the accuracy of the sectional surface is improved.

図１０を用いて、より具体的に説明する。図１０では、第２保持テーブル５において第１端部５Ａの位置を実線で示し、第２端部５Ｂの位置を破線で示している。この場合、第２保持テーブル５の側部５ａの移動量が、Ｙ方向奥側に向かうほど大きくなる。つまり、第２端部５Ｂの移動量が第１端部５Ａの移動量より大きくなる。また、前記の角度が大きくなるにつれ、その傾向が強まる。なお、図１０では、第２端部５Ｂの位置と第１端部５Ａとの移動量の差異を明確にするため、第２端部５Ｂの移動量は誇張して描かれている。
この結果、基板ＷのＹ方向奥側縁が基板Ｗの分断の開始点となり、Ｙ方向奥側から手前側へと連続して基板Ｗの分断が進展してゆく。このブレイク法では、分断の開始点が１点のため、基板Ｗに作用させる分断力の大きさは、従来のブレイク法と比べると、格段に低くなる。また、ブレイク端面、すなわち分断面はきれいに仕上がり、従来技術で述べたような基板Ｗの分断端面の不具合は発生しない。 This will be described more specifically with reference to FIG. In FIG. 10, in the second holding table 5, the position of the first end 5A is indicated by a solid line, and the position of the second end 5B is indicated by a broken line. In this case, the amount of movement of the side portion 5a of the second holding table 5 increases as it moves toward the back in the Y direction. That is, the movement amount of the second end portion 5B is larger than the movement amount of the first end portion 5A. In addition, the tendency increases as the angle increases. In FIG. 10, the movement amount of the second end portion 5B is exaggerated in order to clarify the difference in the movement amount between the position of the second end portion 5B and the first end portion 5A.
As a result, the rear edge of the substrate W in the Y direction becomes the starting point of the division of the substrate W, and the division of the substrate W progresses continuously from the rear side in the Y direction to the front side. In this break method, since the starting point of the division is one point, the magnitude of the division force applied to the substrate W is significantly lower than that in the conventional break method. Further, the break end face, that is, the divided section is finished finely, and the problem of the divided end face of the substrate W as described in the prior art does not occur.

図１１は、第１回動中心軸Ｏ１及び第２回動中心軸Ｏ２を基板Ｗの上面よりも上側に配置し、第２保持テーブル５を第１保持テーブル３に対して第１回動中心軸Ｏ１及び第２回動中心軸Ｏ２が位置している側に回動させた例を示している。なお、この場合、基板Ｗを第１保持テーブル３及び第２保持テーブル５に載置したときに、スクライブ溝は基板Ｗの下面に形成されている。
具体的には、第２回動中心軸Ｏ２が第１回動中心軸Ｏ１より上側に配置されて、つまり、第１保持面１１及び第２保持面２１からより遠くに離れている。 In FIG. 11, the first rotation center axis O 1 and the second rotation center axis O 2 are arranged above the upper surface of the substrate W, and the second holding table 5 is moved to the first holding table 3 first time. An example is shown in which the moving center axis O 1 and the second rotation center axis O 2 are rotated to the side where they are located. In this case, the scribe groove is formed on the lower surface of the substrate W when the substrate W is placed on the first holding table 3 and the second holding table 5.
Specifically, the second rotation center axis O 2 is disposed above the first rotation center axis O 1 , that is, is further away from the first holding surface 11 and the second holding surface 21.

例えば、基板Ｗの厚みが０．２ｍｍの場合は、基板Ｗの上面と第１回動中心軸Ｏ１との距離は１．３ｍｍであり、基板Ｗの上面と第２回動中心軸Ｏ２との距離は１．８ｍｍである。基板Ｗの上面と第１回動中心軸Ｏ１との距離は、０．５〜２．０ｍｍの範囲にあり、さらに好ましくは０．１〜３．０ｍｍの範囲にある。また、基板Ｗの上面と第２回動中心軸Ｏ２との距離は、０．６〜２．５ｍｍの範囲にあり、さらに好ましくは０．１〜３．５ｍｍの範囲にある。 For example, when the thickness of the substrate W is 0.2 mm, the distance between the upper surface of the substrate W and the first rotation center axis O 1 is 1.3 mm, and the upper surface of the substrate W and the second rotation center axis O 2. The distance to is 1.8 mm. The distance between the upper surface of the substrate W and the first rotation center axis O 1 is in the range of 0.5 to 2.0 mm, more preferably in the range of 0.1 to 3.0 mm. The distance between the upper surface and the second rotation center axis O 2 of the substrate W is in the range of 0.6～2.5Mm, more preferably in the range of 0.1～3.5Mm.

図１１では、第２保持テーブル５において第１端部５Ａの位置を実線で示し、第２端部５Ｂの位置を破線で示している。この場合、第２保持テーブル５の側部５ａの移動量が、Ｙ方向奥側に向かうほど大きくなる。つまり、第２端部５Ｂの移動量が第１端部５Ａの移動量より大きくなる。また、前記の角度が大きくなるにつれ、その傾向が強まる。なお、図１１では、第２端部５Ｂの位置と第１端部５Ａとの移動量の差異を明確にするため、第２端部５Ｂの移動量は誇張して描かれている。   In FIG. 11, in the second holding table 5, the position of the first end 5A is indicated by a solid line, and the position of the second end 5B is indicated by a broken line. In this case, the amount of movement of the side portion 5a of the second holding table 5 increases as it moves toward the back in the Y direction. That is, the movement amount of the second end portion 5B is larger than the movement amount of the first end portion 5A. In addition, the tendency increases as the angle increases. In FIG. 11, the movement amount of the second end portion 5B is exaggerated in order to clarify the difference in the movement amount between the position of the second end portion 5B and the first end portion 5A.

この結果、基板ＷのＹ方向奥側縁が基板Ｗの分断の開始点となり、Ｙ方向奥側から手前側へと連続して基板Ｗの分断が進展してゆく。このブレイク法では、分断の開始点が１点のため、基板Ｗに作用させる分断力の大きさは、従来のブレイク法と比べると、格段に低くなる。また、ブレイク端面、すなわち分断面はきれいに仕上がり、従来技術で述べたような基板Ｗの分断端面の不具合は発生しない。   As a result, the rear edge of the substrate W in the Y direction becomes the starting point of the division of the substrate W, and the division of the substrate W progresses continuously from the rear side in the Y direction to the front side. In this break method, since the starting point of the division is one point, the magnitude of the division force applied to the substrate W is significantly lower than that in the conventional break method. Further, the break end face, that is, the divided section is finished finely, and the problem of the divided end face of the substrate W as described in the prior art does not occur.

（３）回動中心高さ調節機構
図１２及び図１３を用いて、回動連結部７の回動中心の高さを調整可能な回動中心高さ調節機構５１を説明する。図１２は、回動中心高さ調節機構を示すための断面図である。図１３は、図１２の部分拡大図である。回動中心高さ調節機構５１によって、回動連結部７の回動中心を適切な位置に変更できる。
図１２に示すように、回動中心高さ調節機構５１は、第１回動連結部４５ａの高さを変更するための第１調節機構５１ａと、第２回動連結部４５ｂの高さを変更するための第２調節機構５１ｂとを有している。なお、図１２では、第１保持テーブル３における第１調節機構５１ａ及び第２調節機構５１ｂを示している。ただし、図示していないが、第２保持テーブル５にも同様に第１調節機構５１ａ及び第２調節機構５１ｂが設けられている。 (3) Rotation center height adjustment mechanism The rotation center height adjustment mechanism 51 which can adjust the height of the rotation center of the rotation connection part 7 is demonstrated using FIG.12 and FIG.13. FIG. 12 is a cross-sectional view for illustrating a rotation center height adjusting mechanism. FIG. 13 is a partially enlarged view of FIG. The rotation center height adjustment mechanism 51 can change the rotation center of the rotation connecting portion 7 to an appropriate position.
As shown in FIG. 12, the rotation center height adjustment mechanism 51 has the height of the first adjustment mechanism 51a for changing the height of the first rotation connection part 45a and the height of the second rotation connection part 45b. A second adjusting mechanism 51b for changing. In FIG. 12, the first adjustment mechanism 51a and the second adjustment mechanism 51b in the first holding table 3 are shown. Although not shown, the second holding table 5 is similarly provided with a first adjustment mechanism 51a and a second adjustment mechanism 51b.

より詳細には、第１調節機構５１ａは、第１保持テーブル３の第１端部３Ａに対する第１回動連結部４５ａの回動中心高さを調節するための機構である。第１調節機構５１ａは、調節ボルト６１を有している。調節ボルト６１は、第１実施形態のボルト５９と入れ替えて利用可能である。
調節ボルト６１は、図１３に示すように、頭部６１ａと、首部６１ｂと、ネジ部６１ｃと、先端部６１ｄとを有している。頭部６１ａは、第１連結部材４１の第１部分４１ａの下面に着座している。首部６１ｂは、第１部分４１ａの穴４１ｅ内に回転自在に挿入されている。ネジ部６１ｃは、第１保持テーブル３のネジ穴３ｄに螺合している。ネジ部６１ｃの両端は、第１保持テーブル３の両主面から突出している。さらに、ネジ部６１ｃの先端は、第３部分４１ｃの下面に当接している。 More specifically, the first adjustment mechanism 51a is a mechanism for adjusting the rotation center height of the first rotation connection part 45a with respect to the first end 3A of the first holding table 3. The first adjustment mechanism 51 a has an adjustment bolt 61. The adjustment bolt 61 can be used by replacing the bolt 59 of the first embodiment.
As shown in FIG. 13, the adjustment bolt 61 has a head portion 61a, a neck portion 61b, a screw portion 61c, and a tip portion 61d. The head 61 a is seated on the lower surface of the first portion 41 a of the first connecting member 41. The neck portion 61b is rotatably inserted into the hole 41e of the first portion 41a. The screw part 61 c is screwed into the screw hole 3 d of the first holding table 3. Both ends of the screw portion 61 c protrude from both main surfaces of the first holding table 3. Furthermore, the tip of the screw portion 61c is in contact with the lower surface of the third portion 41c.

上記の構成によって、調節ボルト６１によるネジ穴３ｄに対する螺合深さが変化すれば、第１連結部材４１の第１突出部４１ｄに対する第１保持テーブル３の第１端部３Ａの高さが変化し、その結果、第１回動連結部４５ａの高さが変化する。
第１調節機構５１ａは、さらに、抜け止めボルト６３を有している。抜け止めボルト６３は、先端部６１ｄに螺合している。
第１調節機構５１ａは、さらに、固定ナット６５を有している。固定ナット６５は、第１保持テーブル３の表面に着座しており、さらにネジ部６１ｃに螺合している。 With the above configuration, when the screwing depth of the adjustment bolt 61 with respect to the screw hole 3d is changed, the height of the first end 3A of the first holding table 3 with respect to the first protrusion 41d of the first connecting member 41 is changed. As a result, the height of the first rotation connecting portion 45a changes.
The first adjustment mechanism 51 a further has a retaining bolt 63. The retaining bolt 63 is screwed into the tip portion 61d.
The first adjustment mechanism 51a further includes a fixing nut 65. The fixing nut 65 is seated on the surface of the first holding table 3, and is further screwed into the screw portion 61c.

以下、第１調節機構５１ａの高さ調整動作を説明する。
最初に、固定ナット６５を調節ボルト６１に対して緩める。
続いて、調節ボルト６１を螺合して、第１保持テーブル３の高さを調整する。
最後に、固定ナット６５を調節ボルト６１に対して締め付ける。
以上の調整動作により、第１回動連結部４５ａの高さを調節して、所望の位置に維持できる。 Hereinafter, the height adjustment operation of the first adjustment mechanism 51a will be described.
First, the fixing nut 65 is loosened with respect to the adjusting bolt 61.
Subsequently, the adjustment bolt 61 is screwed to adjust the height of the first holding table 3.
Finally, the fixing nut 65 is tightened against the adjustment bolt 61.
By the adjustment operation described above, the height of the first rotation connecting portion 45a can be adjusted and maintained at a desired position.

回動中心高さ調節機構５１によって、第１回動連結部４５ａ及び第２回動連結部４５ｂを変更することで、第１回動中心軸Ｏ１及び第２回動中心軸Ｏ２の高さを前記実施形態のように設定できる。また、回動中心高さ調節機構５１によって、第１回動中心軸Ｏ１及び第２回動中心軸Ｏ２の高さを基板Ｗの厚み、ブレイク向き等の条件に従って調節できる。
例えば、回動中心軸は基板Ｗの下面より上方に配置するようにできる。また、回動中心高さ調節機構５１によって、第１回動中心軸Ｏ１及び第２回動中心軸Ｏ２の高さを一致させることもできる。 The rotation center height adjustment mechanism 51, by changing the first pivotal connecting portion 45a and the second pivot coupling portion 45b, the first rotation center axis O 1 and the second rotation center axis O 2 high This can be set as in the above embodiment. Further, by the rotation center height adjustment mechanism 51 can adjust the height of the first rotation center axis O 1 and the second rotation center axis O 2 thickness of the substrate W, in accordance with the terms of the break-facing like.
For example, the rotation center axis can be arranged above the lower surface of the substrate W. In addition, the heights of the first rotation center axis O 1 and the second rotation center axis O 2 can be matched by the rotation center height adjusting mechanism 51.

高さ調節機構（上記実施形態では、調節ボルト６１）の数及び位置は特に限定されない。
高さ調節機構の構成は特に限定されない。 The number and positions of the height adjusting mechanisms (in the above embodiment, the adjusting bolts 61) are not particularly limited.
The configuration of the height adjustment mechanism is not particularly limited.

２．他の実施形態
以上、本発明の複数の実施形態について説明したが、本発明は上記実施形態に限定されるものではなく、発明の要旨を逸脱しない範囲で種々の変更が可能である。特に、本明細書に書かれた複数の実施形態及び変形例は必要に応じて任意に組み合せ可能である。
（１）基板Ｗを保持テーブルに保持する方法は真空吸着に限定されない。基板がガラスであり、その表面に樹脂が成膜されている場合は、静電吸着によっても固定することができる。その他、上方から押圧保持する手段を備えたテーブル、粘着テーブル等他の基板保持テーブルを用いてもよい。
（２）テーブルを傾動させる方法は手動に限定されない。例えば、傾動機構を介してテーブルを傾動させてもよい。傾動機構は、モータの回転力又は流体シリンダを用いて傾動テーブルを所定角だけ回動するものであってもよく、アームやリンクを介して手動でテーブルを回動するものであってもよい。 2. Other Embodiments Although a plurality of embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention. In particular, a plurality of embodiments and modifications described in this specification can be arbitrarily combined as necessary.
(1) The method of holding the substrate W on the holding table is not limited to vacuum suction. When the substrate is made of glass and a resin film is formed on the surface thereof, it can be fixed also by electrostatic adsorption. In addition, you may use other board | substrate holding tables, such as a table provided with the means to hold | press and hold from upper direction, an adhesive table.
(2) The method of tilting the table is not limited to manual operation. For example, the table may be tilted via a tilting mechanism. The tilting mechanism may be one that rotates the tilting table by a predetermined angle using the rotational force of the motor or a fluid cylinder, or may be one that manually rotates the table via an arm or a link.

（３）スクライブ溝の形成箇所は前記実施形態に限定されない。例えば、スクライブ溝は基板の下面に形成されていてもよいし、基板の上面と下面に形成されていてもよい。
（４）基板は、単結晶シリコン基板に限定されない。基板は、単板のガラス、合わせガラス、半導体ウエハ、セラミック基板を含んでいる。なお、液晶パネルのように合わせガラス基板の場合、交互のブレイク動作で上下の基板を交互に分断することができ、しかも基板を反転する工程も不要なため、作業効率が大幅に向上する。
（５）回動中心高さ調節機構は前記実施形態に限定されない。例えば、回動中心高さ調節機構は、保持テーブルと連結部材との間に配置するシムの枚数又は厚みを変更する構成でもよい。 (3) The formation part of a scribe groove is not limited to the said embodiment. For example, the scribe groove may be formed on the lower surface of the substrate, or may be formed on the upper and lower surfaces of the substrate.
(4) The substrate is not limited to a single crystal silicon substrate. The substrate includes a single plate glass, a laminated glass, a semiconductor wafer, and a ceramic substrate. Note that in the case of a laminated glass substrate such as a liquid crystal panel, the upper and lower substrates can be alternately divided by alternating break operations, and the process of reversing the substrates is not necessary, so that the working efficiency is greatly improved.
(5) The rotation center height adjusting mechanism is not limited to the above embodiment. For example, the rotation center height adjusting mechanism may be configured to change the number or thickness of shims arranged between the holding table and the connecting member.

本発明は、スクライブ溝が形成された脆性材料からなる基板を分割する装置に広く適用できる。   The present invention can be widely applied to an apparatus for dividing a substrate made of a brittle material in which a scribe groove is formed.

１ ：基板分割装置
３ ：第１保持テーブル
３Ａ ：第１端部
３Ｂ ：第２端部
３ａ ：側部
５ ：第２保持テーブル
５Ａ ：第１端部
５Ｂ ：第２端部
５ａ ：側部
７ ：回動連結部
１１ ：第１保持面
１３ ：第１真空室
１５ ：第１吸引孔
２１ ：第２保持面
２３ ：第２真空室
２５ ：第２吸引孔
３３ ：隙間
４１ ：第１連結部材
４３ ：第２連結部材
Ｗ ：脆弱性基板 1: substrate dividing device 3: first holding table 3A: first end 3B: second end 3a: side 5: second holding table 5A: first end 5B: second end 5a: side 7 : Rotating connecting part 11: first holding surface 13: first vacuum chamber 15: first suction hole 21: second holding surface 23: second vacuum chamber 25: second suction hole 33: gap 41: first connecting member 43: Second connecting member W: Vulnerable substrate

Claims (3)

スクライブ溝が形成された脆性材料からなる基板を分割可能な基板分割装置であって、
前記基板が保持される第１保持面を有する第１保持テーブルと、
前記基板が保持される第２保持面を有しており、前記第１保持面と前記第２保持面が横に並んで水平面を形成することが可能なように、前記第１保持テーブルと側部同士が隙間を空けて隣接する第２保持テーブルと、
前記第１保持テーブルと前記第２保持テーブルの前記側部同士を回動自在に連結しており、前記第１保持面と前記第２保持面が横に並んで水平面を形成した状態において前記水平面とは異なる高さに回動中心を有する回動連結部とを備え、
前記回動連結部は、前記第１保持テーブルと前記第２保持テーブルの前記側部の第１端部同士を連結する第１回動連結部と、前記第１保持テーブルと前記第２保持テーブルの前記側部の第２端部同士を連結しており前記第１回動連結部と回動中心の高さが異なる第２回動連結部とを有している、
基板分割装置。 A substrate dividing apparatus capable of dividing a substrate made of a brittle material in which a scribe groove is formed,
A first holding table having a first holding surface on which the substrate is held;
The first holding table and the side have a second holding surface on which the substrate is held, and the first holding surface and the second holding surface can be horizontally aligned to form a horizontal plane. A second holding table adjacent to each other with a gap therebetween;
The side surfaces of the first holding table and the second holding table are rotatably connected to each other, and the horizontal surface is formed in a state where the first holding surface and the second holding surface are arranged side by side. A rotation connecting portion having a rotation center at a different height from
The rotating connecting portion includes a first rotating connecting portion that connects first end portions of the side portions of the first holding table and the second holding table, the first holding table, and the second holding table. The second end portions of the side portions are connected to each other, and the first rotation connection portion and the second rotation connection portion having different rotation center heights are provided.
Substrate dividing device. 前記第１回動連結部及び前記第２回動連結部の少なくとも一方の回動中心の高さを調節可能な回動中心高さ調節機構をさらに備えている、請求項１に記載の基板分割装置。   2. The substrate division according to claim 1, further comprising a rotation center height adjustment mechanism capable of adjusting a height of a rotation center of at least one of the first rotation connection portion and the second rotation connection portion. apparatus. スクライブ溝が形成された脆性材料からなる基板を分割可能な基板分割装置であって、
前記基板が保持される第１保持面を有する第１保持テーブルと、
前記基板が保持される第２保持面を有しており、前記第１保持面と前記第２保持面が横に並んで水平面を形成することが可能なように、前記第１保持テーブルと側部同士が隙間を空けて隣接する第２保持テーブルと、
前記第１保持テーブルと前記第２保持テーブルの前記側部同士を回動自在に連結しており、前記第１保持面と前記第２保持面が横に並んで水平面を形成した状態において前記水平面とは異なる高さに回動中心を有する回動連結部とを備え、
前記回動連結部の回動中心の高さを調節可能な回動中心高さ調節機構と、
備えている、基板分割装置。 A substrate dividing apparatus capable of dividing a substrate made of a brittle material in which a scribe groove is formed,
A first holding table having a first holding surface on which the substrate is held;
The first holding table and the side have a second holding surface on which the substrate is held, and the first holding surface and the second holding surface can be horizontally aligned to form a horizontal plane. A second holding table adjacent to each other with a gap therebetween;
The side surfaces of the first holding table and the second holding table are rotatably connected to each other, and the horizontal surface is formed in a state where the first holding surface and the second holding surface are arranged side by side. A rotation connecting portion having a rotation center at a different height from
A rotation center height adjustment mechanism capable of adjusting the height of the rotation center of the rotation connecting portion;
A substrate dividing apparatus.
JP2016065997A 2016-03-29 2016-03-29 Substrate dividing device Pending JP2017177453A (en)

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CN108162068A (en) * 2018-01-29 2018-06-15 广东利元亨智能装备有限公司 A kind of board separating device and scoreboard charging equipment
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KR20190128990A (en) 2018-05-09 2019-11-19 미쓰보시 다이야몬도 고교 가부시키가이샤 Apparatus for dividing substrate
KR20210102858A (en) 2020-02-12 2021-08-20 미쓰보시 다이야몬도 고교 가부시키가이샤 Dividing mechanism of brittle material substrate

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