CN1259577C - Producing method and arrangement for optical elements mounted with resin film with micro-concave-convex pattern and reflective board - Google Patents
Producing method and arrangement for optical elements mounted with resin film with micro-concave-convex pattern and reflective board Download PDFInfo
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- CN1259577C CN1259577C CN 02106822 CN02106822A CN1259577C CN 1259577 C CN1259577 C CN 1259577C CN 02106822 CN02106822 CN 02106822 CN 02106822 A CN02106822 A CN 02106822A CN 1259577 C CN1259577 C CN 1259577C
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Abstract
The inventions provides a method of manufacturing an optical element provided with micro projecting and recessing patterns which are never softened to collapse in an alignment layer formation step even when a polyimide is used as an alignment layer. A resin thin film 4, having a more over 200 DEG C glass transition temperature, is applied onto a substrate 5. While the temperature of the resin thin film 4 is controlled to be above the glass transition temperature and below the starting temperature or the thermal decomposition, the micro projecting and recessing pattern 40 is formed on the surface of the resin thin film 4 by pressing with molds (3A, 33). Subsequently the temperature of the resin thin film 4 is lowered by cooling to a temperature below the glass transition temperature and the molds (3A, 33) are separated.
Description
Technical field
The present invention relates to a kind of optical element of resin film, the manufacture method and device of reflecting plate of being provided with nick convex pattern.
Background technology
In this manual, the nick convex pattern is the general name of the concaveconvex shape of 1 dimension of the several 100 μ m of depth direction 0.1 μ m-or 2 dimension any widths, length, shape.In addition, reflection-type liquid-crystal display device for the transparent relative substrate with transparency electrode with have the general name that is provided with the device of inclosure liquid crystal material between the active matrix substrate of reflecting surface of nick convex pattern on the surface.
In recent years, liquid crystal indicator is constantly developed in the application of personal computer (PC), TV, word processor, video recorder etc.On the other hand, in order to make further multifunction of such electronic equipment and miniaturization, economize on electricityization, cost degradation etc., developed the reflection-type liquid-crystal display device that does not use back side light but show liquid crystal image by reflection from the light of outside incident.
In such reflection-type liquid-crystal display device, as shown in Figure 19, the reflecting plate 1 that is used for reflection-type liquid-crystal display device be configured in by with in opposite directions transparency electrode of liquid crystal layer 27, on this transparency electrode colorized optical filtering portion and above the relative substrate 28 that constitutes such as watch crystal substrate below, scattered reflection is from the light of relative substrate 28 incidents, is used to enlarge the visible angle that the image of this liquid crystal indicator shows.
The reflecting plate that is used for this liquid crystal indicator as shown in Figure 20, the relative surperficial or surface after this surface forms TFT transistor or liquid crystal drive element etc. of the substrate 5 that forms by glass or resin etc., the resin that finishes substantially by coating polyreaction such as rotation coating etc., form resin film 4, heat this resin film 4 and make its fusing, masterplate (embossed portion) 33 by the nick convex pattern pushes the resin film 4 that is coated on the substrate 5, forms the nick convex pattern.
Yet, even polyreaction is finished substantially and the resin fusing of producing high-molecular, there is not flowability at in-process yet, even, also in film 4, produce stress distribution, accumulate internal stress along with thermmohardening by embossed portion 33 pushings.In addition, as shown in Figure 19, reflecting plate 1 need form alignment films 36 at the upper face side of reflectance coating 26, at this moment, needs about 200 ℃ burn till.
This alignment films 36 is used for liquid crystal molecule is controlled to be arrangement and the degree of tilt that is suitable for the liquid crystal pattern, and essential with the insulation of liquid crystal layer 27 by the reflectance coating 26 that has applied metal.In addition, these alignment films 36 requirements can apply equably, require to have the film strength that can bear grinding step, with the connecting airtight property of ITO film, TFT element, distribution etc., relative matting in used medicine or heat treated stability etc.
As the material that can satisfy these characteristics, used polyimide in the past.This polyimide has the high-fire resistance about 300 ℃, and is transparent and have a high glass transition temperature, with the liquid crystal reaction, do not have compatibility with liquid crystal, and the orientation of liquid crystal is easy, and is good with the connecting airtight property of ITO film, TFT element, distribution etc.
Therefore, as use the unclosed resin of glass transition temperature polyreaction low and that thermotolerance is also low to form the nick convex pattern, apply reflectance coating 26 and carry out sintering, when polyimide is used for alignment films 36, then in the sintering circuit of the alignment films 36 that forms by thermotolerance and the high polyimide of glass transition temperature, there is the impaired problem of nick convex pattern.
Summary of the invention
In view of the foregoing, the object of the present invention is to provide a kind of manufacture method and device with optical element of nick convex pattern with resin film, wherein, the nick convex pattern does not appear because of the softening situation about damaging of resin film even alignment films uses polyimide also can make in alignment films formation operation.
In addition, another object of the present invention is to provide a kind of further optical element with resin film operation, that have the nick convex pattern, the manufacture method and device of reflecting plate simplified.
The invention provides a kind of manufacture method of optical element, the manufacture method of this optical element forms the nick convex pattern by the resin film of the die component pushing substrate surface of the inversion pattern with nick convex pattern on above-mentioned resin film surface; It is characterized in that: lining has the above-mentioned resin film of the glass transition temperature that surpasses 200 ℃ on aforesaid substrate; The temperature of controlling above-mentioned resin film makes it surpass the glass transition temperature of above-mentioned resin film and the thermal decomposition that is lower than above-mentioned resin film begins the temperature of temperature; Be controlled to be to surpass above-mentioned glass transition temperature and be lower than under the state that above-mentioned thermal decomposition begins temperature in temperature and push above-mentioned resin film by above-mentioned die component with above-mentioned resin film; After the temperature of above-mentioned resin film is cooled to be lower than the temperature of above-mentioned glass transition temperature, above-mentioned die component is separated; Thereby form the nick convex pattern on above-mentioned resin film surface by these steps.Then, on above-mentioned nick convex pattern, form reflectance coating and alignment films.
Here, die component is to have the die component that forms the transoid of nick convex pattern portion at least on the resin film surface, can be the punching press formpiston, also can be the roller die of rotating manner.
In addition, optical element refers to that the light that is provided with the resin film with nick convex pattern on the surface at least passes through body.
According to this invention, the nick convex pattern face of die component is pressed on the above-mentioned resin film surface, pushing forms the nick convex pattern on above-mentioned resin film surface, so, can freely the nick convex pattern that residues in the resin film side be formed 3 dimension shapes, the degree of freedom height in addition, can obtain the high nick convex pattern of repeatability.
Because the temperature that control is coated to the resin film on the aforesaid substrate makes it surpass glass transition temperature and is lower than thermal decomposition and begins temperature, so, the strain that spring rate descends terrifically, internal stress produces can not occur and significantly become big situation.Promptly, when becoming than the high temperature of glass transition temperature, the spring rate of material drops to the 1/1000-1/10000 of the spring rate of the temperature lower than glass transition temperature, but owing to form the nick convex pattern with the resin film of glass transition temperature above 200 ℃, so, even the alignment films subsequently forms operation and carries out 200 ℃ sintering, the damage of nick convex pattern also can not appear.
In addition, the invention provides the manufacture method of another optical element, the manufacture method of this optical element forms the nick convex pattern by the resin film of the die component pushing substrate surface of the inversion pattern with nick convex pattern on above-mentioned resin film surface; It is characterized in that: lining does not produce the above-mentioned resin film of polyreaction in fact on aforesaid substrate; The temperature of controlling above-mentioned resin film makes its polyreaction that is lower than above-mentioned resin film begin temperature; In the temperature of the above-mentioned resin film of control it being lower than under the state that above-mentioned polyreaction begins temperature pushes above-mentioned resin film by above-mentioned die component, above-mentioned die component is separated from above-mentioned resin film; Heating above-mentioned resin film makes its temperature surpass the glass transition temperature that above-mentioned polyreaction begins temperature and is lower than above-mentioned resin film; Thereby form the nick convex pattern on above-mentioned resin film surface by these steps.Then, on above-mentioned nick convex pattern, form reflectance coating and alignment films.
According to the present invention, form the nick convex pattern owing to form the above-mentioned resin film that does not carry out polyreaction in fact with the die component pushing, so, even also can in film, not produce stress distribution and accumulate acquisition good fluidity, the nick convex pattern that repeatability is high along with sclerosis makes internal stress by the die component pushing.
The above-mentioned resin film that is used for the 1st invention or the 2nd invention also can contain polyimide (PI) class, polyamide (PA) class or polymethylmethacrylate (PMMA) class.Polyimide is preferably polyimide (PI), polyamide-imides (PAI), polyethers-acid imide all aromatic polyimide such as (PEI).
In the occasion that is PI class or PA class, generally more than 200 ℃ and less than 450 ℃, thermal decomposition begins temperature (temperature of forming obvious deterioration such as decompositions resin properties such as grade) usually more than 300 ℃ to glass transition temperature (flowability uprises, the temperature of significantly softening, lowering viscousity).In addition, polyreaction begins temperature (thermmohardening begins temperature) more than 100 ℃.
In addition, the pushing formation temperature of PI system can be set at above glass transition temperature and be lower than the temperature that thermal decomposition begins temperature, but since temperature when uprising cooling need the time, so, preferably be set in below glass transition temperature+10 ℃.
In addition, by on above-mentioned resin film, carrying out repeatedly the racking of above-mentioned die component repeatedly, can at random dispose the layout of nick convex pattern shape.
In addition, aforesaid substrate being moved relative to above-mentioned die component, the substrate-side collimating marks of being located at the aforesaid substrate side and the reference position of above-mentioned die component side are as one man adjusted, also is effective means of the present invention.According to this technological means, aforesaid substrate is moved relative to above-mentioned die component, thereby the substrate-side collimating marks of being located at the aforesaid substrate side and the reference position of above-mentioned die component side are as one man adjusted, reduce the alignment error of the above-mentioned relatively die component of aforesaid substrate, can obtain the high nick convex pattern of machining precision.
In addition, under atmosphere of inert gases the nick convex pattern being formed at above-mentioned resin film surface, in addition, under less than atmospheric reduced atmosphere the nick convex pattern being formed at above-mentioned resin film surface, also is effective means of the present invention.According to this technological means, because the air that will dispose in advance in the chamber of the manufacturing installation that is used to make optical element is discharged, so, can discharge the airborne oxygen and the impurity that are contained in the chamber, in the atmosphere of the inert gas that cleans, form the nick convex pattern, so, the oxidation that can prevent resin film is with rotten, in addition, can prevent that its impurity is attached to resin film and is fixed on the nick convex pattern in nick convex pattern forming process, can improve the manufacturing qualification rate of optical element.
In addition, the occasion that particularly reduces pressure in making chamber can not enclosed air between die component and resin film, and can form does not have the nick of bubble convex pattern.In addition and since when pressurization bubble as the impact damper effect, so, need to increase plus-pressure.By eliminating bubble, can reduce plus-pressure, so, can reduce the residual stress of nick convex pattern.That is, can improve the qualification rate that optical element is made.
The invention provides a kind of manufacturing installation of optical element, the manufacturing installation of this optical element forms the nick convex pattern by the resin film of the die component pushing substrate surface of the inversion pattern with nick convex pattern on above-mentioned resin film surface; It is characterized in that: have dubber, dubber duplicates direction travel mechanism, and pressing mechanism, this dubber is disposed at above-mentioned die component below and is used for aforesaid substrate is kept, and have according to the temperature information around the aforesaid substrate and control to set point of temperature, the heating arrangement that the resin film on aforesaid substrate surface is heated, this dubber duplicates direction travel mechanism and this dubber is moved at initial position and from this initial position and moves back and forth between the mobile end position of finishing to move, and this pressing mechanism pushes above-mentioned resin film at assigned position with above-mentioned die component; By above-mentioned pressing mechanism above-mentioned die component is pressed on the above-mentioned resin film, forms the nick convex pattern in the surface pushing of above-mentioned resin film.
Here, configurable in dubber to the heating arrangement that the resin film on aforesaid substrate surface heats, in addition, also can heat by isolated heat-releasing device from substrate top, substrate side surfaces side.
In addition, dubber duplicates direction travel mechanism for example is in the left side at the initial position of the dubber that keeps aforesaid substrate occasion, along with it moves to the mobile end position on right side from this initial position, can in this process, the nick convex pattern be formed at resin film, carry out moving on the contrary from the mobile end position, can turn back to initial position.As described above, die component can be the punching press formpiston, also can be the roller die of rotating manner.
According to this invention, the substrate on the dubber moves to the mobile end position from initial position, by the resin film on the die component pushing substrate, forms the nick convex pattern during this period.Therefore, can provide optical element with the good nick convex pattern portion of machining precision.
The invention provides a kind of manufacturing installation of optical element, the manufacturing installation of this optical element forms the nick convex pattern by the resin film of the die component pushing substrate surface of the inversion pattern with nick convex pattern on above-mentioned resin film surface; It is characterized in that: have dubber, pressing mechanism, and pressing mechanism duplicate direction travel mechanism, this dubber is disposed at above-mentioned die component below and is used for aforesaid substrate is kept, and have according to the temperature information around the aforesaid substrate control to set point of temperature, to the heating arrangement that the resin film on aforesaid substrate surface heats, this pressing mechanism pushes above-mentioned resin film at assigned position with above-mentioned die component; This pressing mechanism duplicates direction travel mechanism and this pressing mechanism is moved at initial position and from this initial position and moves back and forth between the mobile end position of finishing to move; By above-mentioned pressing mechanism above-mentioned die component is pressed to above-mentioned resin film, forms the nick convex pattern in the surface pushing of above-mentioned resin film.
Here, it is the occasion that initial position at above-mentioned pressing mechanism for example is in the left side on the resin film of substrate that pressing mechanism duplicates direction travel mechanism, along with it moves to the mobile end position on right side from this initial position, can in this process, the nick convex pattern be formed at resin film, return mobilely from the mobile end position, can turn back to initial position.As described above, die component can be the punching press formpiston, also can be the roller die of rotating manner.In addition, configurable in dubber to the heating arrangement that the resin molding on aforesaid substrate surface heats, in addition, also can heat by isolated heat-releasing device from substrate top, substrate side surfaces side.
According to this invention, pressing mechanism moves to the mobile end position from initial position, by the resin film on the die component pushing substrate, forms the nick convex pattern during this period.Therefore, can provide optical element with the good nick convex pattern portion of machining precision.
In addition, the preferably interior dress heating arrangement of above-mentioned die component ground constitutes.According to this technique device, when being disposed at heating arrangement in the die component, by equally heating this die component substantially with the resin film temperature, the resin film of heating can not cooled off by die component, the pitch time of manufacturing process is certain, can provide machining precision good nick convex pattern portion.
In addition, preferably aforesaid substrate can move along X-axis and Y direction below above-mentioned die component, and can wind the Z axle center steering ground configuration towards above-mentioned die component, can adjust ground, aforesaid substrate position formation by above-mentioned relatively die component.According to this technology, can move aforesaid substrate along X-axis and Y direction relative to above-mentioned die component, in addition, can wind Z axle center steering towards above-mentioned die component, so, can adjust the aforesaid substrate position by above-mentioned relatively die component, thereby machining precision good optical element can be provided.
In addition, above-mentioned die component being formed inversion pattern cylindric that has the nick convex pattern in periphery, above-mentioned die component is rotated on above-mentioned resin film surface, the pushing of nick convex pattern is formed at above-mentioned resin film surface, also is effective means of the present invention.
According to this technique device, because being used in periphery has forming of nick convex pattern die component cylindraceous and forms the nick convex pattern in the resin film pushing that is being formed at substrate surface, so, even in resin film, there is bubble, also can be by the recess of the relief pattern of above-mentioned die component, pushing away bubble in the occasion court direction opposite with its moving direction that resin film moves moves, moving occasion at above-mentioned die component is pushing away above-mentioned bubble towards its moving direction and is moving, the protuberance that has reduced the relief pattern of above-mentioned die component partly damages resin and causes bubble to escape to the outside, situation because of the bubble that residues in the resin film forms the relief pattern shifting ground has improved qualification rate.
In addition, court and the crisscross travel mechanism of the crisscross dubber that above-mentioned dubber is moved that direction is intersected of duplicating of duplicating above-mentioned nick convex pattern are set, can make above-mentioned resin film towards above-mentioned direction and the above-mentioned crisscross formation movably of duplicating by above-mentioned relatively die component, also be effective means of the present invention.
Here, adopt the reason of the crisscross travel mechanism of dubber to be, though the nick convex pattern is copied to resin film by above-mentioned die component, but when the position of the substrate that is installed on dubber during from the reference position skew of die component, do not form the nick convex pattern at assigned position, so, need to move towards the direction that the moving direction with die component intersects.As for the such mechanism of purpose, preferably with duplicate above-mentioned nick convex pattern to duplicate direction vertical, but because foozle, so fully vertical technology that need be higher is may not be vertical fully.
According to this technological means, use the crisscross travel mechanism of this dubber, above-mentioned dubber moved and the dubber that moves back and forth between the mobile end position of finishing to move duplicates direction travel mechanism or above-mentioned pressing mechanism is moved and the pressing mechanism that moves back and forth between the mobile end position of finishing to move duplicates direction travel mechanism at initial position and from this initial position at initial position and from this initial position, make dubber duplicate direction and above-mentioned crisscross moving towards above-mentioned, can adjust the initial position of the aforesaid substrate that remains in dubber relative to above-mentioned die component.In addition, in case after forming the nick convex pattern by die component pushing, can move dubber by the crisscross travel mechanism of dubber, at the new nick convex pattern of its next door pushing formation.
In addition, above-mentioned die component is made of with the base portion that keeps this embossed portion the embossed portion that is used at above-mentioned resin film surface pushing formation nick convex pattern, is provided with elastic component between above-mentioned embossed portion and above-mentioned base portion, and this also is an effective means of the present invention.
According to this technological means, can absorb the foozles such as surface undulation of above-mentioned embossed portion and above-mentioned base portion by elastic component, improve the machining precision of nick convex pattern.
In addition, above-mentioned die component forms the embossed portion of nick convex pattern and keeps the roller portion of this embossed portion to constitute pivotally in the pushing of above-mentioned resin film by being used for, and is provided with elastic component between above-mentioned embossed portion and above-mentioned roller portion, and this also is an effective means of the present invention.
According to this technological means, can absorb the foozles such as surface undulation of above-mentioned embossed portion and above-mentioned roller portion by elastic component, improve the machining precision of nick convex pattern.
In addition, using optical devices at least 1 collimating marks observation of above-mentioned pressing mechanism setting, can observe and confirm that at least 1 the collimating marks ground that is disposed at aforesaid substrate constitutes, also is effective means of the present invention;
In addition, at least 1 collimating marks observation optical devices is set below aforesaid substrate, the 2nd collimating marks ground that can observe the 1st collimating marks that is disposed at aforesaid substrate of affirmation at least 1 group and be disposed on the above-mentioned die component constitutes, and also is effective means of the present invention.And, observe with optical devices as above-mentioned collimating marks and to be positioned at the aforesaid substrate below, then also can be in dubber or above-mentioned revolution travel mechanism in or dispose in above-mentioned dubber and the revolution travel mechanism.
According to this technique device, can form the good relief pattern of positional precision.
The invention provides the manufacturing installation of another optical element, the manufacturing installation of this optical element is the resin film by the die component pushing substrate surface of the inversion pattern with nick convex pattern, forms the device of nick convex pattern on above-mentioned resin film surface; It is characterized in that: in having the sealed chamber of exhaust apparatus, dispose dubber, pressing mechanism, travel mechanism, heating arrangement at least, and exhaust apparatus, this dubber is used for aforesaid substrate is kept, this pressing mechanism pushes above-mentioned resin film at assigned position with above-mentioned die component, this travel mechanism makes above-mentioned dubber or above-mentioned die component move when being pressed to above-mentioned die component on the above-mentioned resin film, this heating arrangement controls to set point of temperature, aforesaid substrate is heated according to the temperature information around the aforesaid substrate; Above-mentioned die component carries out nick convex pattern pushing formation action to above-mentioned resin film surface before, the gas in the above-mentioned sealed chamber is discharged by above-mentioned exhaust apparatus.
According to this invention, owing to by above-mentioned exhaust apparatus the gas in the above-mentioned sealed chamber being discharged before the pushing formation action of above-mentioned resin film surface being carried out the nick convex pattern at above-mentioned die component, so, the airborne oxygen and the impurity that are contained in the above-mentioned sealed chamber can be discharged, owing in the atmosphere of the inert gas that cleans, form relief pattern, so, the oxidation that can prevent above-mentioned film is with rotten, and prevent that in the relief pattern forming process this impurity is attached to resin film and is fixed on the relief pattern, so, can improve the manufacturing qualification rate of optical element.
In addition, the invention provides a kind of manufacture method of reflecting plate, this reflecting plate being provided with has nick convex pattern and alignment films (alignment film) and is disposed at resin film on the substrate; It is characterized in that: on aforesaid substrate, form film liquid crystal drive element or distribution connecting portion; Lining has the above-mentioned resin film of the glass transition temperature that surpasses 200 ℃ on aforesaid substrate; The temperature of controlling above-mentioned resin film makes it surpass the glass transition temperature of above-mentioned resin film and the thermal decomposition that is lower than above-mentioned resin film begins temperature; Make it surpass above-mentioned glass transition temperature and be lower than under the state that above-mentioned thermal decomposition begins temperature in the temperature of the above-mentioned resin film of control by the above-mentioned above-mentioned resin film of die component pushing formation with inversion pattern of nick convex pattern; After the temperature of above-mentioned resin film is cooled to be lower than the temperature of above-mentioned glass transition temperature, above-mentioned die component is separated; The polyreaction that the temperature of above-mentioned resin film is heated to above-mentioned resin film begins more than the temperature; Thereby form the nick convex pattern by these steps on above-mentioned resin film surface, then, on above-mentioned nick convex pattern, form reflectance coating and above-mentioned alignment films.
According to the present invention, because the temperature that control is coated to the above-mentioned resin film on the aforesaid substrate makes it surpass 200 ℃ and be lower than glass transition temperature, so, the strain that spring rate descends terrifically, internal stress produces can not occur and significantly become big situation.
In addition, owing to after the above-mentioned resin film of cooling makes its temperature be lower than glass transition temperature, above-mentioned die component is separated, burn till above-mentioned resin film in the temperature that polyreaction begins more than the temperature (for example 230 ℃), afterwards, on above-mentioned nick convex pattern, form reflectance coating and above-mentioned alignment films, so, carrying out 200 ℃ sintering even form operation in alignment films, the nick convex pattern does not damage yet.
In addition, the invention provides the manufacture method of another reflecting plate, this reflecting plate being provided with has nick convex pattern and alignment films and is disposed at resin film on the substrate; It is characterized in that: on aforesaid substrate, form film liquid crystal drive element or distribution connecting portion; On aforesaid substrate, apply the above-mentioned resin film that does not produce polyreaction in fact; The temperature of controlling above-mentioned resin film makes its polyreaction that is lower than above-mentioned resin film begin temperature; In the temperature of the above-mentioned resin film of control it is lower than under the state that above-mentioned polyreaction begins temperature and pushes above-mentioned resin film by above-mentioned die component with inversion pattern of nick convex pattern; Above-mentioned die component is separated from above-mentioned resin film; Heating above-mentioned resin film makes its temperature surpass the glass transition temperature that above-mentioned polyreaction begins temperature and is lower than above-mentioned resin film; Thereby form the nick convex pattern by these steps on above-mentioned resin film surface, then, on above-mentioned nick convex pattern, form reflectance coating and above-mentioned alignment films.
According to the present invention, because the temperature that will be coated on the above-mentioned resin film on the aforesaid substrate controls to and is lower than the temperature that polyreaction begins temperature and pushes formation, so, polymerization reaction take place not in this process, in addition, even pushing leaves embossed portion after forming, spring rate can not hang down the degree that makes the embossing warpage yet, and flowability is not high.Do not need refrigerating work procedure.
In addition, owing to begin temperature and be lower than under the temperature of glass transition temperature to burn till above-mentioned resin film in the polyreaction that surpasses resin, so, at this stage polymerization reaction take place not.Therefore, carry out 200 ℃ sintering even the alignment films in the back forms operation, the nick convex pattern can not damage yet.
Description of drawings
Fig. 1 be form of implementation of the present invention form the key diagram of the relief pattern formation method of nick convex pattern at resin film.
Fig. 2 be the nick convex pattern that on resin film, forms the nick convex pattern of the 1st form of implementation form device want portion's key diagram.
Fig. 3 be the nick convex pattern that on resin film, forms the nick convex pattern of the 2nd form of implementation form device want portion's key diagram.
Fig. 4 be the nick convex pattern that on resin film, forms the nick convex pattern of the 3rd form of implementation form device want portion's key diagram.
Fig. 5 be the nick convex pattern that on resin film, forms the nick convex pattern of the 4th form of implementation form device want portion's key diagram.
Fig. 6 be the nick convex pattern that on resin film, forms the nick convex pattern of the 5th form of implementation form device want portion's key diagram.
Fig. 7 be the nick convex pattern that on resin film, forms the nick convex pattern of the 6th form of implementation form device want portion's key diagram.
Fig. 8 be the nick convex pattern that on resin film, forms the nick convex pattern of the 7th form of implementation form device want portion's key diagram.
Fig. 9 be the nick convex pattern that on resin film, forms the nick convex pattern of the 8th form of implementation form device want portion's key diagram.
Figure 10 be the nick convex pattern that on resin film, forms the nick convex pattern of the 9th form of implementation form device want portion's key diagram.
Figure 11 wants portion's key diagram for what the nick convex pattern of the 9th embodiment that has the collimating marks observer above reflecting plate formed device.
Figure 12 wants portion's key diagram for what the nick convex pattern of another embodiment of having the collimating marks observer above reflecting plate formed device.
Figure 13 wants portion's key diagram for what the nick convex pattern that has another embodiment of collimating marks observer in the reflecting plate lower side formed device.
Figure 14 is the key diagram that is used to illustrate the observational technique of collimating marks observer.
Figure 15 be the nick convex pattern that forms another embodiment of nick convex pattern at resin film in the atmosphere of inert gases form device want portion's key diagram.
Figure 16 be the nick convex pattern that forms another embodiment of nick convex pattern at resin film in the depressed gas atmosphere form device want portion's key diagram.
Figure 17 is the key diagram that is provided with the substrate of the resin film with nick convex pattern.
Figure 18 is the key diagram that applies the reflecting plate of reflectance coating at nick convex pattern face.
Figure 19 is the key diagram of liquid crystal indicator.
Figure 20 forms the key diagram of the method for existing relief pattern for explanation.
Embodiment
Illustration ground describes the preferred embodiment of the present invention in detail with reference to the accompanying drawings.Be recorded in the component parts of this form of implementation size, material, shape, configuration etc. is not as long as carry out specific record relatively for it, then it does not limit scope of the present invention, only illustrative examples.
Figure 1A-1G be form of implementation of the present invention form the key diagram of the relief pattern formation method of nick convex pattern at resin film.At first, according to Figure 1A-1G the 1st method is described.
Shown in this Figure 1A, forming liquid crystal drive elements T FT or distribution connecting portion 31 at glass substrate 5.Form metal, insulant or semi-conductive film by (cathode) sputtering method or CVD method etc. at substrate 5, apply resist by spin coating method thereon, baking at high temperature makes the resist sclerosis, is exposed by suitable mask by ultraviolet ray, resist after will being exposed by developer solution is removed, by stripper residual resist is removed, once again behind the high-temperature baking, the film of the part that will be not be covered by resist by corrosion is removed, carry out such operation repeatedly, form this connecting portion 31.
Shown in Figure 1A, like that, rotate under the state that is coated on the substrate 5 at the resin film 4 that polyimide thermoplastic resins such as (PI) is made, not polymerization reaction take place.
Shown in Figure 1B, like that,, make resin film 4 polymerizations and softening surpassing that polyreaction begins temperature and glass transition temperature and beginning the temperature heating (for example 360 ℃) of temperature (be preferably glass transition temperature+10 ℃ below) less than thermal decomposition.
Shown in Fig. 1 C, under this state from the resin film 4 of softness by embossed portion 33 pushings or knurling rolls 3A is rotated, behind the pushing resin film 4, resin film 4 is cooled to be lower than the temperature (for example less than 350 ℃) of glass transition temperature,
When shown in Fig. 1 D, like that embossed portion 33 being peeled off, at the copying surface of resin film 4 nick convex pattern 40 as the inversion pattern of embossed portion 33.
This resin 4 for example can use the polyimide PIX-1400 (production code member) of " Hitachi changes into Du Pont's (デ ユ Port Application) (strain) " corporate system.This resin is a thermoplastic resin, and its glass transition temperature is 350 ℃, and it is 450 ℃ that thermal decomposition begins temperature, and it is lower than glass transition temperature that polyreaction begins temperature.
Afterwards, shown in Fig. 1 F, like that, on the pattern 40 of resin 4, pile up metallic films such as Ag, Al by (cathode) sputtering, form reflectance coating 26, coating polyimide dielectric film 36 on this reflectance coating 26 like that shown in Fig. 1 G burns till under 200 ℃, make dielectric film 36 stabilizations, finish reflecting plate 1 thus.
Below, explanation convexes into method at the 2nd nick that resin film forms the nick convex pattern according to Fig. 1.Be with the difference of the 1st method, the 1st method is surpassing that polyreaction begins temperature and glass transition temperature and is beginning the temperature heating of temperature (be preferably glass transition temperature+10 ℃ below) less than thermal decomposition, make resin film 4 polymerizations and softening, by embossed portion 33 or knurling rolls 3A pushing formation nick convex pattern 40, and the 2nd method is after being formed by embossed portion 33 or knurling rolls 3A pushing under the temperature that begins temperature less than polyreaction, make its begin temperature above polyreaction and less than the temperature of glass transition temperature under polymerization.The 1st method is needing refrigerating work procedure by embossed portion 33 or knurling rolls 3A after the embossing operation to resin film 4 pushings, and the 2nd method has been omitted this refrigerating work procedure.
The 1st method has been used thermoplastic resin, and the 2nd method is not limited to thermoplastic resin, also can use " the strange rope of Co., Ltd. (チ Star ソ) " the such thermosetting resin of thermosetting polyamide PIS5001 (production code member) of corporate system.It is 120 ℃ that the polyreaction of this resin begins temperature, and in addition, it is 450 ℃ that thermal decomposition begins temperature, glass transition temperature specific heat kick off temperature height.
Figure 1A is identical with the 1st method.Rotate under the state that is coated on the substrate 5 at resin film 4 thermosetting resin systems such as polyamide (PA)s, the ratio that not polymerization reaction take place, or polyreaction takes place is lower, basically only by the molecular composition that constitutes resin, solid phase also has flowability, and spring rate is lower.
Shown in Figure 1B, like that, resin film 4 is carried out 3-10 minute prebake conditions, make solvent evaporates in the temperature that begins temperature (polyreaction begins temperature) less than thermmohardening (for example 110 ℃).
From the resin film 4 of softness such shown in Fig. 1 C, push, or knurling rolls 3A is rotated by embossed portion 33, pushing resin film 4, this point is identical with the 1st method.
This resin film 4 has the high resiliency rate that can keep duplicating the such degree of shape, is in mobile low state.
Shown in Fig. 1 D like that, when under being lower than the temperature that polyreaction begins temperature (less than 120 ℃), peeling off embossed portion, at the copying surface of resin film 4 nick convex pattern 40 as the inversion pattern of embossed portion.Afterwards, such shown in Fig. 1 E, begin temperature (120 ℃), surpass alignment films (alignment film) 36 (dielectric film) formation temperature (200 ℃) of Fig. 1 G and be lower than under 210 ℃ of glass transition temperature and burn till surpassing polyreaction, make membranous stabilization.It is identical with the 1st method with the operation that alignment films (dielectric film) forms operation (shown in Fig. 1 G) that reflectance coating forms operation (shown in Fig. 1 F).
The 2nd method heats being lower than under the temperature that polyreaction begins temperature, carry out prebake conditions, and carry out embossing and process, so, spring rate height under this state, mobile low, so, even under the state that does not cool off after the embossing fixed processing, pull down embossed portion, also can keep the shape of duplicating of nick convex pattern 40, after the embossing processing, high and by begin temperature in polyreaction less than the sintering temperature of glass transition temperature than resin, polymerization reaction take place is transformed into the spring rate height, mobile low membranous, so, even 200 ℃ of heating down, the shape of nick convex pattern 40 can not damaged yet when forming dielectric film 36.
Fig. 2 be the nick convex pattern that on resin film, forms the nick convex pattern of the 1st form of implementation form device 1A want portion's key diagram.
In the figure, the opaque or transparent substrate 5 that is formed by pottery, glass, plastics, aluminium molybdenum alloy, silicon etc. grinds the two sides, has surface undulation, warpage, the flatness of regulation.Warpage allows at 1mm with interior amount of warpage.In addition, surface undulation be set in the scope of 1mm concavo-convex for several 10 μ m with interior curvature, smoothness be set in the scope of 10 μ m for number 10nm with interior concavo-convex.Substrate 5 also can use the substrate that electron devices such as liquid crystal drive element is formed array-like.
On the substrate 5 with the rotation of the thickness about 100 μ m coating polyimide (PI), polyamide (PA), polyamide-imides (PAI), polyethers-Ya acid amides (PEI), polymethylmethacrylate (PMMA) resin film 4 that is etc. substantially of 0.1 μ m-substantially.The embossed portion 33 that is disposed at resin film 4 tops is formed by materials such as metal materials such as Ni, AL, SUS, Cu, pottery, glass, silicon, resins.This embossed portion 33 also can form relief pattern on the surface of sheet material by direct engraving, burn into printing etc.The resin that is used for resin film 4 is not limited to above-mentioned resin.For example also can use novolac resin or phenolic resinoid etc.
This embossed portion 33 is fixed in base portion 38.The embossed portion 33 of pushing shaping resin film 4 remains in pressing mechanism 2, simultaneously, applies pressure about the thousands of MPa of several MPa-by pressing mechanism 2.Pressing mechanism 2 uses the hydraulic mechanism pressurization, but in addition also can use the bounce of air operated mechanism, high resiliency spring, the restoring force of marmem etc.
Because this 1st form of implementation constitutes like this, so, by substrate 5 is fixedly remained in dubber 7, the relief pattern of embossed portion 33 is pressed to resin film 4 by pressing mechanism 2, can on resin film 4, form the nick convex pattern.
Fig. 3 be the nick convex pattern that on resin film, forms the nick convex pattern of the 2nd form of implementation form device 1B want portion's key diagram.Be with the difference of the form of Fig. 2, synthetic rubber or corrugated sheet metal are set or by its elastic body that constitutes 10 between base portion 38 and embossed portion 33, even there are making errors such as surface undulation at base portion 38, embossed portion 33 etc., also it can be absorbed, thus but manufacturing dimension precision good optical element.
Fig. 4 be the nick convex pattern that on resin film, forms the nick convex pattern of the 3rd form of implementation form device 1C want portion's key diagram.Be with the difference of the form of Fig. 2, used to form knurling rolls 3A cylindraceous.
Wherein, the knurling rolls 3A of pushing shaping resin film 4 can be remained in pressing mechanism 2 freely to rotate, simultaneously, apply pressure about several MPa～thousands of MPa by pressing mechanism 2.Pressing mechanism 2 uses the hydraulic mechanism pressurization, but in addition also can use the bounce of air operated mechanism, high resiliency spring, the restoring force of marmem etc.
Because this 3rd form of implementation constitutes like this, so, when substrate 5 fixedly being remained in dubber 7 and right-hand when left moves from scheming to go up, make the relief pattern pushing resin film 4 of knurling rolls 3A by pressing mechanism 2, simultaneously, knurling rolls 3A is turned round toward the clockwise direction, on resin film 4, form nick convex pattern 40.This 3rd form of implementation is not to make resin film 4 but make knurling rolls 3A move by side to the opposing party's side from a side certainly yet.
The 3rd form of implementation is owing to make the surface of knurling rolls 3A pushing resin film 4, so, push the surface of resin film 4 by the recess 3a of knurling rolls 3A, even in resin film 4, have bubble, also can push this bubble by the recess 3a of knurling rolls 3A it is moved towards direction opposite with the moving direction of resin film 4, reduce the resin part and destroy the situation that makes bubble escape to the outside, nick convex pattern 40 shifting grounds be formed by bubble by knurling rolls protuberance 3b.
Fig. 5 be the nick convex pattern that on resin film, forms the nick convex pattern of the 4th form of implementation form device 1D want portion's key diagram.Be the formation of knurling rolls portion with the difference of the 3rd form of implementation of Fig. 4.That is, the roller body 32 be connected with pressing mechanism 2 is set, between this roller body 32 and knurling rolls portion 13, is folded with the elastic component that the thin plate 11 made by metal or resin constitutes.In addition,, also resin or synthetic rubber can be disposed between roller body 32 and the knurling rolls portion 13, in addition, also can use the absorbing structure of enclosing liquid, gel etc. as substituting of thin plate 11.
According to this form of implementation, establish elastic component owing to can between roller body 32 and knurling rolls portion 13, press from both sides, so, even, also it can be absorbed manufacturing dimension precision good optical element in making errors such as generation surface undulation such as knurling rolls portion 13, roller bodies 32.
Fig. 6 be the nick convex pattern that on resin film, forms the nick convex pattern of the 5th form of implementation form device 1E want portion's key diagram.Be with the difference of the 1st form of implementation of Fig. 2, be loaded in the 6B of heating part in the base portion 38, in addition, be loaded in the dubber 7 temperature of may command resin film 4 in the 6A of heating part.
In addition, the heating part 6A that configuration can be heated substrate 5 along the whole zone of cardinal principle in dubber 7.Around substrate 5, dispose temperature sensor 15A.This temperature sensor 15A can dispose a plurality of around substrate 5, utilizes the mean value of the temperature at this position to control.
This heating part 6A and above-mentioned heating part 6B can be controlled to be set point of temperature ground by temperature control part 20 according to the temperature information that is disposed at substrate 5 temperature sensor 15A on every side and constitute.
Because this 5th form of implementation constitutes like this, so, substrate 5 fixedly is remained in dubber 7, by pressing mechanism 2 relief pattern of embossed portion 33 is pressed to resin film 4, thereby on resin film 4 formation nick convex pattern.
Because this 5th form of implementation is according to the temperature of the temperature information control resin film 4 that is disposed at the temperature sensor around the substrate 5, so, the machining precision good optical element of nick convex pattern can be made.
Fig. 7 be the nick convex pattern that forms the nick convex pattern at resin film of the 6th form of implementation form device 1F want portion's key diagram.Be with the difference of the 3rd form of implementation of Fig. 4, configuration heating part 16C in forming knurling rolls cylindraceous portion 13, built-in heating part 6A in dubber 7, can carry out temperature by temperature control part 20 and control this heating part 16C, 6A, in process, resin film 4 be heated by knurling rolls portion 13 pushing resin films 4.
The 6th form of implementation can heat the 13 ground configuration heating part 16C of this knurling rolls portion from interior all sides in knurling rolls portion 13 inside, and in addition, heating part 6A is configured in the dubber 7.These heating parts are controlled according to the detected temperatures of temperature sensor 15B by temperature control part 20.The well heater of these heating parts can use heating wire, high-power lamp, ceramic heater etc.By these well heaters the heat distribution of resin film 4 being become controls equably.
In addition, though do not illustrate in the drawings, in fact in addition, also the thermal insulation material of use and heating part 16C, 6A thermal insulation in dubber 7, knurling rolls portion and pressing mechanism 2, travel mechanism 8 in addition, is provided with cooling bodies such as water-cooled, air cooling.
The 6th form of implementation is owing to push the surface of resin films 4 with knurling rolls portion 13, so, push the surface of resin film 4 by the recess 3a of knurling rolls portion 13, even in resin film 4, have bubble, also can push away this bubble towards the direction opposite and move, reduce the resin part and crush the situation that makes bubble escape to the outside, nick convex pattern 40 shifting grounds be formed by bubble by knurling rolls protuberance 3b by the recess 3a of knurling rolls portion 13 with the moving direction of resin film 4.
Fig. 8 be the nick convex pattern that on resin film, forms the nick convex pattern of the 7th form of implementation form device 1G want portion's key diagram.Be with the difference of the 6th form of implementation of Fig. 7, keep the pressing mechanism 2A of knurling rolls 3A in the process of pushing resin film 4, can move up and down, simultaneously, the 8A of travel mechanism mounting on the knurling rolls revolving shaft direction 8B of travel mechanism, can be moved towards knurling rolls revolving shaft direction.In addition, well heater 6A, 16C have been omitted for convenience of description.
The 7th form of implementation constitutes owing to such, so, by in dubber 7 moving process, pressing mechanism 2A being moved up and down and as 40a, 40b, 40c, 40d, forming the nick convex pattern by suitable amount with appropriate intervals.Therefore, can be regularly or at random dispose the nick convex pattern.
Fig. 9 be the nick convex pattern that on resin film, forms the nick convex pattern of the 8th form of implementation form device 1H want portion's key diagram.
Be that with the difference of the 7th form of implementation of Fig. 8 the embossed portion 3B of pushing shaping resin film 4 remains on the pressing mechanism 2, simultaneously, apply pressure about several MPa～thousands of MPa by pressing mechanism 2.Can constitute pressing mechanism 2 up or down.For convenience of description, well heater 6A, 16C have been omitted.
This 8th form of implementation constitutes owing to such, so, by substrate 5 is fixedly remained in dubber 7, make the relief pattern of embossed portion 3B push resin film 4 by pressing mechanism 2, thereby form nick convex pattern 40 on resin film 4 (a～d).
In addition, the 8th form of implementation can form the nick convex pattern with appropriate intervals by suitable amount by dubber 7 is moved as 40a, 40b, 40c, 40d under the state that pressing mechanism 2 is rising.Therefore, can be regularly or at random form the nick convex pattern.
Figure 10 be the nick convex pattern that on resin film, forms the nick convex pattern of the 9th form of implementation form device 1I want portion's key diagram, the improvement example of Fig. 8 is shown.Be with the difference of the 7th form of implementation of Fig. 8, substrate gyratory directions adjusting mechanism 16A is set between dubber 7A and substrate 5, simultaneously, disposed to have and can read on the substrate 5 or the collimating marks of the collimating marks on the resin film 4 is observed with optical devices 21 (the pressing mechanism 2B of a～d).
Therefore, vacuum suction substrate 5 on substrate gyratory directions adjusting mechanism 16A, but also can be fixed by other maintenance means such as electrostatic attractions.
Substrate gyratory directions adjusting mechanism 16A remains on the dubber 7A pivotally, and unshowned in the drawings position configuration control lever, by operating this control lever, fixing operation and fixedly the allow rotating releasing of releasing on dubber 7A that can be fixed in dubber 7A are operated.
In addition, unshowned in the drawings position configuration fine tuning dish, by operating this fine tuning dish, can make substrate gyratory directions adjusting mechanism 16A revolution, use the sign 16a that is located at substrate gyratory directions adjusting mechanism 16A and be located at the roughly target that revolution amount that amount of movement mark 7a on the dubber 7A forms substrate 5 is adjusted.
In this form of implementation, substrate gyratory directions adjusting mechanism 16A is arranged at 5 of dubber 7A and substrates, be not limited thereto but get involved the position that substrate gyratory directions adjusting mechanism 16A is set.For example, also can be arranged on the bottom of the knurling rolls revolving shaft direction 8B of travel mechanism.
In addition, observing with optical devices 21 (the position configuration lighting source that a～d) is corresponding in substrate gyratory directions adjusting mechanism 16 with collimating marks.On the other hand, be provided with on pressing mechanism 2B and observe by collimating marks that (a～d) reads the viewport 2B (a～d) of the substrate 5 lip-deep collimating marks of being located at resin film 4 belows with optical devices 21.
Below, according to Figure 11 collimating marks is described.When being example with the color liquid crystal display arrangement, collimating marks 5a, the 5b, 22,22 that is shown in Figure 11 A, 11B is used to make not shown chromatic filter layer to be provided with the position consistency of the liquid crystal drive element 31 that is formed at substrate 5.
Situation shown in Figure 11 A is, at substrate 5 the recess 5a that collimating marks is used is set, 5b, surface at this substrate 5 forms metal film with the (cathode) sputtering method, apply resist with spin coating method thereon, baking at high temperature, make the resist sclerosis, use ultraviolet ray to suitable mask exposure, the resist after will being exposed by developer solution is removed, once again after the baking at high temperature, remove the film of unlapped part by corrosion, residual resist is removed, carry out such operation repeatedly by stripper, form liquid crystal drive elements 31 such as TFT, afterwards, at the surface of substrate 5 rotation coated with resins film 4A, resin film 4A invades recess 5a, 5b.
In addition,, form liquid crystal drive element 31 and collimating marks 22,22 such as TFT by said method on the surface of substrate 5 in the occasion shown in Figure 11 B, afterwards, at the surface of substrate 5 rotation coated with resins film 4B.
Figure 11 D is from the right-hand substrate gyratory directions adjusting mechanism 16A that watches of Figure 10 and the signal pie graph between the pressing mechanism 2B.
Illustrate that according to Figure 10 the nick convex pattern of the 9th form of implementation of such formation forms the action of device 1I below.
(a～d) observes from collimating marks and observes with the optical devices 21 (projection image of the collimating marks of a～d) by viewport 2B, when the position of the above-mentioned collimating marks of being located at substrate 5 is observed when staggering with the reference position of optical devices 21 (a-d) from collimating marks, move to adjust knurling rolls revolving shaft direction 8B of travel mechanism and/or substrate gyratory directions adjusting mechanism 16A, make dislocation from the said reference position in specified reference value.
In addition, dubber 7A is moved towards right-hand initial position, make assigned position of pressing mechanism 2B decline, simultaneously,, make dubber 7A simultaneously, form nick convex pattern 40a, 40b, 40c towards moving left by authorised pressure pushing resin film 4 at this initial position.
After carrying out the 1st time the left lateral of dubber 7A, pressing mechanism 2B rises, and returns to initial position, by knurling rolls revolving shaft direction travel mechanism 15 make the 8A of travel mechanism on the figure by front side shifting ormal weight, simultaneously, make dubber 7 revert to the initial position on right side.Then, make pressing mechanism 2B drop to assigned position once more, simultaneously, by authorised pressure pushing resin film 4 on one side make dubber 7 towards move left on one side, form nick convex pattern 40d.
In this form of implementation, use 4 collimating marks to observe with optical devices 21 (a-d), but also can use 1 or 2 collimating marks observation optical devices 21, drive knurling rolls revolving shaft direction 8B of travel mechanism or the 8A of travel mechanism, obtain the position of collimating marks, move to adjust substrate gyratory directions adjusting mechanism 16, make skew from the said reference position in the stipulated standard value.
In addition, in this form of implementation,, but also can utilize ccd video camera etc. to carry out the observation of monitor picture to viewport 2Ba～2Bd projection calibration mark.
In addition, for collimating marks, though can directly itself process by wet etching, dry etching, sandblast processing, embossing processing etc. to substrate 5, but also can form the film of metal, insulator, resin etc. on substrate 5 surfaces by (cathode) sputtering, rotation coating, evaporation, CVD etc., its face be processed by wet etching, dry etching, sandblast processing, embossing processing etc.
In addition, in this form of implementation, collimating marks is formed at the surface of substrate 5, but also can with relief pattern portion collimating marks be set at the position beyond the collimating marks portion of knurling rolls 3A, on the surface of substrate 5, form other collimating marks portion corresponding, utilize collimating marks to observe and observe this collimating marks portion with optical devices 21 with collimating marks 5a, 5b or 22.
In Figure 12, as substituting of knurling rolls 3A, used the embossed portion 3B that in Fig. 9, uses, other formation is identical with Figure 10.Therefore, by (a～d) observes from collimating marks and observes with the optical devices 21 (projection image of the collimating marks of a～d) from viewport 2B, as the above-mentioned collimating marks 2B that is located at substrate 5 (when the relative calibration mark of a～d) is observed with the reference position skew of optical devices 21 (a-d), then removable adjustment knurling rolls revolving shaft direction travel mechanism 15 and/or substrate gyratory directions adjusting mechanism 16A make from the skew of said reference position to be in the stipulated standard value.
Then, dubber 7A is moved to right-hand initial position, make pressing mechanism 2 drop to assigned position, behind authorised pressure pushing resin film 4, make dubber 7A, form nick convex pattern 40a, 40b, 40c towards moving left at this initial position.
After the court that carries out the 1st time dubber 7A moves left, pressing mechanism 2 rises, and revert to initial position, makes the forward side shifting ormal weight of the 8A of travel mechanism on the figure by the knurling rolls revolving shaft direction 8B of travel mechanism, simultaneously, make dubber 7A revert to the initial position on right side.Then, make pressing mechanism 2 drop to assigned position once more, simultaneously,, make dubber 7, form relief pattern 40d towards moving left with authorised pressure pushing resin film 4.Similarly form the nick convex pattern later on.
Below, the relief pattern that has another embodiment of collimating marks observer according to Figure 13 explanation in the reflecting plate lower side forms device.Be that with the difference of Figure 10 pressing mechanism 2B uses substrate gyratory directions adjusting mechanism 16A, dubber 7A in Figure 10, and in Figure 13, uses pressing mechanism 2C, substrate gyratory directions adjusting mechanism 16B, dubber 7B.The knurling rolls 3A that is disposed pivotally by pressing mechanism 2C is provided with collimating marks 3c, 3d on the outside that forms the nick convex pattern.Substrate 5 remains in substrate gyratory directions adjusting mechanism 16B, cuts on this substrate gyratory directions adjusting mechanism 16B and establishes through hole 16Ba, 16Ba, keeps collimating marks to observe with optical devices 29Aa, 29Ab in this through hole 16Ba, 16Ba configuration.Dispose optical detection device on this collimating marks is observed with optical devices 29Aa, 29Ab, this optical detection device is connected to monitor by not shown computing machine.
This collimating marks observation in the occasion that has above the visual field of adjustment amount, also can remain in dubber 7B side with optical devices 29Aa, 29Ab.In addition, collimating marks is observed also can be shown in Figure 14 A like that with optical devices, can observe the position configuration collimating marks observation optical devices 29B that affirmation is disposed at the collimating marks 3c of knurling rolls 3A outer peripheral face, detect the light of incidents by the collimating marks 22 of substrate 5 sides.In addition, also can be as shown in Figure 13, the configuration collimating marks is observed with optical devices 5 below substrate, detect the light of incident as shown in Figure 14B like that by school mark 3c from the outside of resin film 4, in addition, also can be as Figure 14 C by directly over collimating marks 22 make from collimating marks and observe light with optical devices 29B in collimating marks 3c reflection, detect this reflected light.
Below, illustrate that the nick convex pattern of the Figure 13 that constitutes like this forms the action of device.
Observe the projection image of observing the collimating marks of using optical devices 29Aa, 29Ab from collimating marks by above-mentioned monitor, when the above-mentioned collimating marks 22 of being located at substrate 5 staggers with the reference position of optical devices 29Aa, 29Ab with the collimating marks observation, move and adjust knurling rolls revolving shaft direction 8B of travel mechanism and/or substrate gyratory directions adjusting mechanism 16B, the skew that makes relative said reference position is in the stipulated standard value.
Then, 7B moves to initial position with dubber, makes pressing mechanism 2C drop to assigned position at this initial position, simultaneously, on one side with authorised pressure pushing resin film 4, dubber 7B is moved on one side, forms relief pattern by knurling rolls 3A is rotated.
In this form of implementation, used 2 collimating marks to observe with optical devices 29Aa, 29Ab, but also can use 1 or 4 collimating marks observation optical devices, drive knurling rolls revolving shaft direction 8B of travel mechanism or the 8A of travel mechanism, obtain the offset of collimating marks, 16B moves adjustment to substrate gyratory directions adjusting mechanism, makes from the skew of said reference position to be in the stipulated standard value.
Figure 15 be the nick convex pattern that forms another embodiment of nick convex pattern on the resin film in atmosphere of inert gases form device want portion's key diagram.As shown in the drawing, configuration replication platform 7 in the chamber 23 that constitutes airtightly can keep applying the substrate 5 of resin film 4 with pulling down at this dubber 7.On resin film 4, can move up and down and move left and right ground configuration pressing mechanism 2, embossed portion 3B is installed in Figure 15 A on this pressing mechanism 2, knurling rolls 3A is installed in Figure 15 B pivotally.
Gas ground configuration exhaust portion 24 in chamber 23 can be discharged this chamber 23.At these exhaust portion 24 configuration scavenger fans, drum pump etc., can discharge the gas in the chamber 23 to a certain degree.In addition, the gas of regulation can be sent to and dispose cleaning part 25 in the chamber 23 at chamber 23.At this cleaning part 25 as with N
2, inert gas such as Ar is sent to the device of the pilot-gas flow of mechanism's configuration quality flow controller in the chamber 23, APC valve etc.This cleaning part 25 is connected to as the gas bomb of the supply source of not shown inert gas or gas purification device.
This form of implementation of Gou Chenging will be rotated the substrate 5 that has applied resin film 4 and will be fixed on the dubber 7 like this.Then, make exhaust portion 24 actions, the air in the chamber 23 is discharged.After the action that stops exhaust portion 24, make cleaning part 25 actions, inert gas is imported in the chamber 23.Afterwards, under the situation of Figure 15 B, on one side move it the right side with authorised pressure pushing resin film on one side by the initial position that makes the left side of pressing mechanism 2 in the chamber 23, thus relief patterns formed at resin film 4.
According to this form of implementation, in advance by the air in the exhaust portion 24 discharge chambers 23, so, the airborne oxygen and the impurity that are contained in the chamber 23 are discharged, in the atmosphere of the inert gas that cleans, form the nick convex pattern, so, the oxidation that can prevent resin film 4 is with rotten, in addition, can prevent in the process that forms the nick convex pattern this impurity be attached on the resin film 4 and be fixed on nick protruding on, can improve the manufacturing qualification rate of optical element.
But this form of implementation move left and right ground constitutes pressing mechanism 2, but also can utilize travel mechanism 8 that dubber 7 is moved certainly, in addition, also can utilize substrate gyratory directions adjusting mechanism 16A or 16B.
Figure 16 be the nick convex pattern that forms the nick convex pattern on the resin film in atmosphere of inert gases form device want portion's key diagram.Be with the difference of Figure 15,, in chamber 23, make optical element with subatmospheric reduced atmosphere as substituting of atmosphere of inert gases.
Dispose drum pump, turbopump, diffusion pump etc. in the exhaust portion 24 that is connected in chamber 23, can make the pressure in the chamber 23 is 10
-3～10
-7Torr ground carries out exhaust.In addition, can be at chamber 23 by cleaning part 25 with N
2, inert gas such as Ar is sent in the chamber 23, but also can makes optical element under the state that does not import inert gas.
According to this form of implementation, because in advance by the air in the exhaust portion 24 discharge chambers 23, so, the airborne oxygen and the impurity that are contained in the chamber can be discharged formation nick convex pattern in the inert gas atmosphere of cleaning.
In addition, the occasion that particularly in chamber, reduces pressure, owing to also gasifying easily, moisture discharges, so, can not enclose air between die component and resin film 4, the impurity that can prevent to swim in nick convex pattern forming process, water vapour etc. are attached to resin film 4 and are fixed in the nick convex pattern.
In addition, the oxidation that can prevent resin film 4 is with rotten, and can form does not have the nick of bubble convex pattern.Since bubble when pressurization as the impact damper effect, so, need to increase plus-pressure.By eliminating bubble, can reduce plus-pressure, so, can reduce the residual stress of nick convex pattern.That is, can improve the qualification rate that optical element is made.
According to above-mentioned form of implementation, can on the resin film 4 on the substrate 5 as shown in Figure 17, form the nick convex pattern.The optical element that is provided with the resin film 4 of the nick convex pattern with such acquisition passes through suitably selected nick convex pattern shape, the material of resin film 4, the material of substrate 5 etc., for example can be used as optical storage media, Fresnel lens, microlens array, optical waveguides etc. such as transparent diffraction grating substrate, holographic, CD.
In addition, by (cathode) sputtering, evaporation etc. high reflectance bings such as Al, Ag, Al alloy, Ag alloy are formed reflectance coating 26 about long-pending 2000 , then can make reflecting plate as shown in Figure 18 at the nick convex pattern face of such substrate.
At this moment, between above-mentioned reflectance coating 26 and resin film 4, form the lamination of film indirectly such as Tr, Cr, Si, promptly in advance above-mentioned indirect film is coated on the nick convex surface, form above-mentioned reflectance coating 26 then, can improve the connecting airtight property of resin film and reflectance coating.
This reflecting plate can be used as optical elements such as holographic, Fresnel reflecting mirror, micro reflector array.In addition, form above-mentioned reflectance coating 26 by metallic film, the mode that the resin film of being made by for example transparent polyimide of dielectric film and acrylic resin etc. applies with rotation makes its flattening surface and seals, thereby as the electrode base board of the liquid crystal indicator of STN etc.
Figure 19 is the figure that is used to illustrate a form of implementation of liquid crystal indicator.Substrate 5 forms for example liquid crystal drive element 31 of TFT etc. by moulding such as alkali-free glass or high-fire resistance resins on the surface.
The reflecting plate of Figure 18 is not limited to reflection-type liquid-crystal display device, also can be used for other reflection display device.In addition, though not shown among the figure, in fact also can be used for reducing the so-called semitransparent liquid crystal display that the energy of back side light source, the place beyond the liquid crystal board are taken into incident light.
In addition, here illustrated relief pattern is formed at the surface of reflecting plate, the reflecting plate of the surface reflection type that incident light reflected on each concavo-convex surface, but also can be the reflecting plate of the backside reflection type that forms substrate by glass and transparent resin etc., incident light reflected by the nick convex pattern that is formed at substrate back.
Reflection-type liquid-crystal display device with reflecting plate 1 of such formation can be used for the demonstration of electronic equipments such as mobile phone and light current power type wireless device.
This form of implementation not only can be applicable to above-mentioned electronic equipment, and also can be applicable to electronic notebook certainly, notebook computer, portable type TV etc. carry information terminal.
As described above, according to the present invention, because the temperature that will be coated to the resin film on the aforesaid substrate controls to above glass transition temperature and begins the temperature of temperature less than thermal decomposition, form the nick convex pattern, so, even alignment films afterwards forms operation and carries out 200 ℃ sintering, the nick convex pattern can not damage yet.
Claims (10)
1. the manufacture method of an optical element, the resin film by the die component pushing substrate surface of the inversion pattern with nick convex pattern forms the nick convex pattern on above-mentioned resin film surface; It is characterized in that: the step of the above-mentioned resin film that being included in is covered on the aforesaid substrate has the glass transition temperature that surpasses 200 ℃; The temperature of controlling above-mentioned resin film makes it surpass the glass transition temperature of above-mentioned resin film and the thermal decomposition that is lower than above-mentioned resin film begins the step of temperature; Be controlled as in the temperature of above-mentioned resin film and surpass above-mentioned glass transition temperature and to be lower than the step that pushes above-mentioned resin film under the state that above-mentioned thermal decomposition begins temperature by above-mentioned die component; After the temperature of above-mentioned resin film is cooled to be lower than the temperature of above-mentioned glass transition temperature, make above-mentioned die component separation steps;
Form the nick convex pattern by above-mentioned steps on above-mentioned resin film surface;
Then, on above-mentioned nick convex pattern, form reflectance coating and alignment films.
2. the manufacture method of optical element according to claim 1 is characterized in that: the racking that carries out repeatedly above-mentioned die component on above-mentioned resin film repeatedly.
3. the manufacture method of optical element according to claim 1 is characterized in that: aforesaid substrate is moved relative to above-mentioned die component, make the substrate-side collimating marks of being located at the aforesaid substrate side be adjusted into consistent with the reference position of above-mentioned die component side.
4. the manufacture method of optical element according to claim 1 is characterized in that: the nick convex pattern is formed at above-mentioned resin film surface under atmosphere of inert gases.
5. the manufacture method of optical element according to claim 1 is characterized in that: the nick convex pattern is formed at above-mentioned resin film surface under subatmospheric reduced atmosphere.
6. the manufacture method of an optical element, the resin film by the die component pushing substrate surface of the inversion pattern with nick convex pattern forms the nick convex pattern on above-mentioned resin film surface; It is characterized in that: comprising: lining does not produce the step of the above-mentioned resin film of polyreaction in fact on aforesaid substrate; The temperature of controlling above-mentioned resin film makes its polyreaction that is lower than above-mentioned resin film begin the step of temperature; Be controlled as being lower than under the state that above-mentioned polyreaction begins temperature in the temperature of above-mentioned resin film and push above-mentioned resin film, make above-mentioned die component then from above-mentioned resin film separation steps by above-mentioned die component; Heating above-mentioned resin film makes its temperature surpass the step that above-mentioned polyreaction begins temperature and is lower than the glass transition temperature of above-mentioned resin film;
Form the nick convex pattern by above-mentioned steps on above-mentioned resin film surface;
Then, on above-mentioned nick convex pattern, form reflectance coating and alignment films.
7. the manufacture method of optical element according to claim 6 is characterized in that: the racking that carries out repeatedly above-mentioned die component on above-mentioned resin film repeatedly.
8. the manufacture method of optical element according to claim 6 is characterized in that: aforesaid substrate is moved relative to above-mentioned die component, make the substrate-side collimating marks of being located at the aforesaid substrate side be adjusted into consistent with the reference position of above-mentioned die component side.
9. the manufacture method of optical element according to claim 6 is characterized in that: the nick convex pattern is formed at above-mentioned resin film surface under atmosphere of inert gases.
10. the manufacture method of optical element according to claim 6 is characterized in that: the nick convex pattern is formed at above-mentioned resin film surface under subatmospheric reduced atmosphere.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001056693A JP3876631B2 (en) | 2001-03-01 | 2001-03-01 | Optical element provided with resin thin film having micro uneven pattern, manufacturing method and apparatus of reflector |
| JP056693/2001 | 2001-03-01 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610006626 Division CN1811492A (en) | 2001-03-01 | 2002-03-01 | Optical element provided with resin thin film with micro projecting and recessing pattern, method and device for manufacturing reflection plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1374550A CN1374550A (en) | 2002-10-16 |
| CN1259577C true CN1259577C (en) | 2006-06-14 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02106822 Expired - Fee Related CN1259577C (en) | 2001-03-01 | 2002-03-01 | Producing method and arrangement for optical elements mounted with resin film with micro-concave-convex pattern and reflective board |
| CN 200610006626 Pending CN1811492A (en) | 2001-03-01 | 2002-03-01 | Optical element provided with resin thin film with micro projecting and recessing pattern, method and device for manufacturing reflection plate |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610006626 Pending CN1811492A (en) | 2001-03-01 | 2002-03-01 | Optical element provided with resin thin film with micro projecting and recessing pattern, method and device for manufacturing reflection plate |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3876631B2 (en) |
| CN (2) | CN1259577C (en) |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4307137B2 (en) * | 2003-04-21 | 2009-08-05 | 日本電産コパル株式会社 | Light guide member, surface light source device including the light guide member, liquid crystal display device including the light guide member as a surface light source, and method for processing the light guide member |
| JP2005251566A (en) * | 2004-03-04 | 2005-09-15 | Nidec Copal Corp | Light guide plate, surface light emitting device using light guide plate, and manufacturing method of light guide plate |
| KR100707990B1 (en) | 2005-03-04 | 2007-04-16 | (주)포스미디어 | Apparatus for manufacturing optical plate |
| CN100401158C (en) * | 2005-09-05 | 2008-07-09 | 奇菱科技股份有限公司 | High molecular optical components with mini-pattern and method for manufacturing same |
| JP2007171542A (en) * | 2005-12-22 | 2007-07-05 | Canon Electronics Inc | Nd filter for optical diaphragm and optical diaphragm device provided with nd filter |
| JP4059518B2 (en) * | 2006-01-31 | 2008-03-12 | キヤノン株式会社 | Method for producing electrophotographic photosensitive member |
| CN101379439B (en) * | 2006-01-31 | 2011-08-10 | 佳能株式会社 | Electronic photographing photosensitive component, processing cartridge, and electronic photographing device |
| JP2012128137A (en) * | 2010-12-15 | 2012-07-05 | Seiko Epson Corp | Reflection type screen and method for manufacturing reflection type screen |
| EP2804747B1 (en) * | 2012-01-16 | 2022-07-13 | DDP Specialty Electronic Materials US 9, LLC | Optical article and method of forming |
| CN102621611B (en) * | 2012-04-26 | 2014-11-12 | 成都菲斯特科技有限公司 | Making method of Multifunctional composite brightening grating |
| CN102768441B (en) * | 2012-07-31 | 2015-07-01 | 青岛海信电器股份有限公司 | Method and device for processing orientation layer of liquid crystal display |
| CN106585149A (en) * | 2015-12-26 | 2017-04-26 | 日本Sk化研株式会社 | Film forming method |
| JP2021502230A (en) * | 2017-09-07 | 2021-01-28 | トランジションズ オプティカル リミテッドＴｒａｎｓｉｔｉｏｎｓ Ｏｐｔｉｃａｌ Ｌｉｍｉｔｅｄ | Coating systems for coating optical substrates, their methods, and coated optical substrates |
| CN109870255B (en) * | 2017-12-05 | 2023-09-12 | 北京佰为深科技发展有限公司 | Fabry-Perot sensor and manufacturing method thereof |
| CN110426267A (en) * | 2019-07-04 | 2019-11-08 | 齐鲁理工学院 | Safe compressive membrane-transferring device and its application |
-
2001
- 2001-03-01 JP JP2001056693A patent/JP3876631B2/en not_active Expired - Fee Related
-
2002
- 2002-03-01 CN CN 02106822 patent/CN1259577C/en not_active Expired - Fee Related
- 2002-03-01 CN CN 200610006626 patent/CN1811492A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN1374550A (en) | 2002-10-16 |
| JP2002258017A (en) | 2002-09-11 |
| CN1811492A (en) | 2006-08-02 |
| JP3876631B2 (en) | 2007-02-07 |
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