CN106514884A - Cutting method and device for brittle substrate - Google Patents
Cutting method and device for brittle substrate Download PDFInfo
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- CN106514884A CN106514884A CN201510569848.0A CN201510569848A CN106514884A CN 106514884 A CN106514884 A CN 106514884A CN 201510569848 A CN201510569848 A CN 201510569848A CN 106514884 A CN106514884 A CN 106514884A
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- cutting
- fragility substrate
- substrate
- fexible film
- fragility
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Abstract
The invention relates to a cutting method and device for a brittle substrate. The brittle substrate comprises a first surface and a second surface opposite to the first surface. The cutting device utilizes the cutting method in order to cut the brittle substrate. The cutting method includes the following steps that the first surface of the brittle substrate is covered with a flexible thin film with the hardness smaller than that of the brittle substrate; and the flexible thin film and the first surface of the brittle substrate are etched along a preset cutting line on the first surface, the flexible thin film is cut through in the etching step, and an etching opening is formed in the first surface of the brittle substrate.
Description
Technical field
The present invention relates to a kind of cutting method and cutting equipment, the particularly cutting method for fragility substrate and cutting set
It is standby.
Background technology
The fragility substrate such as current chip, glass substrate is widely used in the various parts of electronic product.In the fabrication process,
The fragility substrate such as chip, glass substrate is both needed to be cut into application of the reduced size to coordinate various devices.
As illustrated by figures 1 a and 1b, when fragility substrate 9 is cut, fragility substrate 9 is arranged at cutting bed to known cutting method
On 13, and scoring device 11 is opened with the delineation for forming as shown in Figure 2 along the delineation fragility of predetermined cuts line 101 substrate 9
Mouth 103, now, the 9 usual not yet disjunction of fragility substrate.Then again fragility substrate 9 is split into along delineation opening 103
Multiple products.
As shown in Fig. 2 the delineation fragility of scoring device 11 substrate 9 is delineated after opening 103 with being formed, it will produce many
It is attached to after delineation on the surface of fragility substrate 9 from the particle 105 of 9 fragmentation of fragility substrate.When carrying out to fragility substrate 9
During subsequent technique, for example, other delineation openings, bending fragility substrate 9 is delineated to divide fragility substrate 9 or coated other things
When matter is on fragility substrate 9, the part for touching particle 105 is possible to produce defect.
In view of this, how to reduce delineation particle of the fragility substrate postadhesion on fragility substrate is the technology belonging to the present invention
Technical staff's problem demanding prompt solution in field.
The content of the invention
It is an object of the invention to provide a kind of cutting method and cutting equipment for fragility substrate, to reduce delineation fragility
Particle of the substrate postadhesion on fragility substrate.
Fragility substrate includes first surface and the second surface relative with first surface.The cutting method of the present invention includes following
Step：The fexible film that hardness is covered less than fragility substrate is on the first surface of fragility substrate；And along on first surface
Predetermined cuts line delineation fexible film and fragility substrate first surface, the cutting depths be enough to through fexible film in
Delineation opening is formed on the first surface of fragility substrate.
Cutting equipment of the present invention includes cladding system and scoring device.Cladding system covers flexibility of the hardness less than fragility substrate
Thin film is on the first surface of fragility substrate.Scoring device along the predetermined cuts line delineation fexible film on the first surface and
The first surface of fragility substrate, the cutting depths cut through fexible film and form delineation on the first surface of fragility substrate to be opened
Mouthful.
Description of the drawings
Figure 1A is the schematic perspective view of the known cutting method for fragility substrate；
Figure 1B is the cross-sectional schematic of the known cutting method for fragility substrate；
Fig. 2 is the schematic diagram after known cutting method delineation fragility substrate；
Fig. 3 A are the schematic top plan view that the present invention attaches dicing tape to wafer ring；
Fig. 3 B are the schematic top plan view of support plate of the present invention；
Fig. 3 C are the cross-sectional schematic of support plate of the present invention；
Fig. 4 A are that the present invention places schematic top plan view of the fragility substrate on support plate；
Fig. 4 B are that the present invention places cross-sectional schematic of the fragility substrate on support plate；
Fig. 5 A are that the present invention covers schematic top plan view of the fexible film on fragility substrate；
Fig. 5 B are that the present invention covers cross-sectional schematic of the fexible film on fragility substrate；
Fig. 6 A are the schematic top plan view of present invention delineation fragility substrate；
Fig. 6 B are the cross-sectional schematic of present invention delineation fragility substrate；And
Fig. 7 is the schematic diagram of the fragility substrate surface after cutting method of the present invention delineation fragility substrate.
Specific embodiment
Fig. 4 B are refer to, fragility substrate 9 includes first surface 91 and the second surface 92 relative with first surface 91.
Fragility substrate 9 can be the fragility substrate of glass substrate or other such as chip, ceramic substrates etc..The present invention is used for fragility substrate
9 cutting method is comprised the following steps according to tandem, is described in detail as follows.
Such as Fig. 3 A, dicing tape (dicing tape) 313 is fixed in wafer ring (wafer ring) 311.Then, will
Dicing tape 313 is cut along the edge of wafer ring 311, to form support plate 31, as shown in Fig. 3 B and 3C.However,
The present invention can be using the support plate 31 of other forms, it is not limited to illustrated dicing tape 313 and wafer ring in schema
311 combination.
As shown in fig. 4 a and 4b, the second surface 92 of placement fragility substrate 9 is on support plate 31.Wherein, support plate 31
Including wafer ring 311 and fix and tighten the dicing tape 313 in wafer ring 311, the second surface of fragility substrate 9
92 are positioned in the rest area of dicing tape 313.Then, fragility substrate 9 and support plate 31 are positioned over into cutting bed
On 37.Or, first support plate 31 is positioned on cutting bed 37, then the second surface 92 of fragility substrate 9 is placed in load
On plate 31.
As shown in Fig. 5 A and 5B, the fexible film 33 for covering hardness less than fragility substrate 9 is in the first of fragility substrate 9
On surface 91.In this step, fexible film 33 is coated with or is attached on the first surface 91 of fragility substrate 9.
So-called " attaching " is not limited to adhere using sticker, also comprising the form that other adhere to.If fexible film 33 be as
Plastics etc. are also easy to produce the material of electrostatic, and the electrostatic for being possible with fexible film 33 in this step produces adsorption effect, makes
Fexible film 33 is attached on the first surface 91 of fragility substrate 9.Preferably, the thickness of fexible film 33 is less than 20 μm.
The material of fexible film 33 is preferably the material in PVDC, PVC and PE, or other similar materials.
As shown in Fig. 6 A and 6B, when fragility substrate 9 is cut, predetermined cuts line 301 of the first edge on first surface 91
The first surface 91 of delineation fexible film 33 and fragility substrate 9, the cutting depths are enough to through fexible film 33, and
Delineation opening 303 as shown in Figure 7 is formed on the first surface 91 of fragility substrate 9.Fexible film 33 is crisp in delineating
During property substrate 9, the generation of the particle 105 such as Fig. 2 can be reduced.
After delineation forms delineation opening 303, cutting method further includes from the first surface 91 of fragility substrate 9 to tear
The step of opening fexible film 33.The first surface 91 for tearing the fragility substrate 9 exposed by fexible film 33 refer to Fig. 7.
When tearing fexible film 33, particle 105 that is produced when delineating fragility substrate 9 and being attached on fexible film 33 can be taken away.
The step of after delineation forms delineation opening 303 or tearing fexible film 33 from the first surface 91 of fragility substrate 9
Afterwards, cutting method is further included along delineation 303 disjunction fragility substrates 9 of opening, the step of to form multiple products.
By using the cutting method cutting fragility substrate 9 of the present invention, even if after fexible film 33 is torn, fragility substrate
Still it is difficult to adhere to the particle 105 (as shown in Figure 2) as produced by using known techniques delineation fragility substrate 9 on 9.
The cutting equipment for fragility substrate 9 of the present invention includes cladding system (not shown) and scoring device 35.Fragility is served as a contrast
Bottom 9 is the fragility substrate of glass substrate or other such as chip, ceramic substrates etc..Cladding system can be various conventional devices,
To cover fexible film 33 of the hardness less than fragility substrate 9 on the first surface 91 of fragility substrate 9, such as Fig. 5 A
And shown in 5B.Cladding system is to plate or stick fexible film 33 on the first surface 91 of fragility substrate 9.Such as
Fruit fexible film 33 is the material that such as plastics etc. are also easy to produce electrostatic, and cladding system can be using the Electrostatic Absorption of fexible film 33
Effect makes fexible film 33 be attached on the first surface 91 of fragility substrate 9.Preferably, the cladding system is using tool
There is fexible film 33 of the thickness less than 20 μm to be attached.The material of fexible film 33 be preferably PVDC, PVC and
A material in PE, or other similar materials.
As shown in Fig. 6 A and 6B, predetermined cuts line 301 of the scoring device 35 to edge on first surface 91 delineates soft
Property thin film 33 and fragility substrate 9 first surface 91, this scribing steps be enough to make cutting depths through fexible film 33,
And delineation opening 303 as shown in Figure 7 is formed on the first surface 91 of fragility substrate 9.
Cutting equipment can further include tear-off device (not shown).Tear-off device can be with viscous with more strongly adherent instrument
It is attached and remove the thin film 33, eliminated with electrostatic remove device thin film 33 is blown into removing after electrostatic, with chuck by thin film
33 folders are removed, or other various conventional devices, to be formed after delineation opening 303 in the delineation of scoring device 33, are served as a contrast from fragility
The first surface 91 at bottom 9 tears fexible film 33, to expose the first surface 91 and delineation opening 303 of fragility substrate 9,
As shown in Figure 7.
Cutting equipment preferably further comprises apparatus for placing (not shown).Apparatus for placing can be various conventional devices, with
Before cladding system covers fexible film 33 on the first surface 91 of fragility substrate 9, the second of fragility substrate 9 is placed
Surface 92 on support plate 31, as shown in fig. 4 a and 4b.Support plate 31 includes wafer ring 311 and fixes and tighten in crystalline substance
Dicing tape 313 in loop 311.Apparatus for placing 31 places the second surface 91 of fragility substrate 9 in dicing tape 313
On, and fragility substrate 9 and support plate 31 be positioned on cutting bed 37.However, the present invention can be using the load of other forms
Plate 31, it is not limited to the combination of illustrated dicing tape 313 with wafer ring 311 in schema.
Cutting equipment further includes break-up device (not shown).Break-up device can occur to disjunction for bending fragility substrate 9
Device, thrust (stamping) device, or various other conventional devices, with along delineation opening 313 disjunction fragility substrates 9,
Form multiple products.
Summary highly preferred embodiment of the present invention, the cutting method and cutting equipment of the present invention have advantages below：1. in
After delineation fragility substrate 9, can effectively suppress the generation of particle 105.If 2. using the quiet of fexible film 33 itself
Electrical characteristics, then do not require the use of sticker, you can fexible film 33 is fitted with fragility substrate 9.3. fexible film 33
Material easily obtain, can be and general house wrap film identical material.4., for existing scribing process, change
Less.5. cut on fexible film 33, will not fill in the groove of the break bar of scoring device 35.6. scribing process
After end, easily fexible film 33 is removed and remains clean.
Symbol description
9 fragility substrates
11 scoring devices
13 cutting beds
31 support plates
33 fexible films
35 scoring devices
37 cutting beds
91 first surfaces
92 second surfaces
101 predetermined cuts lines
103 delineation openings
105 particles
301 predetermined cuts lines
303 delineation openings
311 wafer rings
313 dicing tapes
Claims (20)
1. a kind of cutting method for fragility substrate, wherein described fragility substrate include first surface and with the first surface
Relative second surface, the cutting method are comprised the following steps：
A () covers fexible film of the hardness less than the fragility substrate on the first surface of the fragility substrate；
And
B predetermined cuts line of the () edge on the first surface delineates the institute of the fexible film and the fragility substrate
First surface is stated, cutting depths are enough to through the fexible film and on the first surface of the fragility substrate
Form delineation opening.
2. cutting method according to claim 1, wherein after the step (b), the cutting method is further wrapped
Include following steps：
C () tears the fexible film from the first surface of the fragility substrate.
3. cutting method according to claim 2, wherein plate in the step (a) or attach the fexible film in
On the first surface of the fragility substrate.
4. cutting method according to claim 3, utilizes the electrostatic of the fexible film attached wherein in the step (a)
The fexible film on the first surface of the fragility substrate.
5. cutting method according to claim 2, the thickness of wherein described fexible film are less than 20 μm.
6. cutting method according to claim 2, the material of wherein described fexible film be selected from PVDC, PVC and
The group constituted by PE.
7. cutting method according to claim 2, wherein described fragility substrate are glass substrate.
8. cutting method according to claim 2, wherein before the step (a), the cutting method is further included
Following steps：
(a-0) second surface of the placement fragility substrate is on support plate.
9. cutting method according to claim 8, wherein described support plate include wafer ring and fixation and tighten in the crystalline substance
Dicing tape in loop, and the step (a-0) is the second surface for placing the fragility substrate in described
On dicing tape.
10. cutting method according to claim 2, wherein after the step (c) or the step (b), the cutting
Method is further comprising the steps：
D () delineates fragility substrate described in opening disjunction along described, to form multiple products.
A kind of 11. cutting equipments for fragility substrate, wherein described fragility substrate include first surface and with the first surface
Relative second surface, the cutting equipment include：
Fexible film of the hardness less than the fragility substrate is covered in described the first of the fragility substrate by cladding system
On surface；And
Scoring device, predetermined cuts line of the edge on the first surface delineate the fexible film and the fragility substrate
The first surface, cutting depths is enough to through the fexible film and in described the first of the fragility substrate
Delineation opening is formed on surface.
12. cutting equipments according to claim 11, wherein described cutting equipment are further included：
Tear-off device, tears the fexible film from the first surface of the fragility substrate.
13. cutting equipments according to claim 12, wherein described cladding system plate or attach the fexible film in
On the first surface of the fragility substrate.
14. cutting equipments according to claim 13, wherein described cladding system are attached using the electrostatic of the fexible film
In the fexible film on the first surface of the fragility substrate.
15. cutting equipments according to claim 12, the thickness of wherein described fexible film are less than 20 μm.
16. cutting equipments according to claim 12, the material of wherein described fexible film be selected from PVDC, PVC and
The group constituted by PE.
17. cutting equipments according to claim 12, wherein described fragility substrate are glass substrate.
18. cutting equipments according to claim 12, wherein described cutting equipment are further included：
Apparatus for placing, the second surface of the placement fragility substrate is on support plate.
19. cutting equipments according to claim 18, wherein described support plate include wafer ring and fixation and tighten in described
Dicing tape in wafer ring, and the apparatus for placing is the second surface for placing the fragility substrate in institute
State on dicing tape.
20. cutting equipments according to claim 12, wherein described cutting equipment are further included：
Break-up device, along fragility substrate described in the delineation opening disjunction, to form multiple products.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510569848.0A CN106514884A (en) | 2015-09-09 | 2015-09-09 | Cutting method and device for brittle substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510569848.0A CN106514884A (en) | 2015-09-09 | 2015-09-09 | Cutting method and device for brittle substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106514884A true CN106514884A (en) | 2017-03-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510569848.0A Pending CN106514884A (en) | 2015-09-09 | 2015-09-09 | Cutting method and device for brittle substrate |
Country Status (1)
| Country | Link |
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| CN (1) | CN106514884A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102617029A (en) * | 2011-01-27 | 2012-08-01 | 三星钻石工业股份有限公司 | A method for scribing a brittle material substrate |
| CN103240806A (en) * | 2012-02-06 | 2013-08-14 | 奇景光电股份有限公司 | Wafer cutting method |
| CN104201283A (en) * | 2014-09-04 | 2014-12-10 | 广州新视界光电科技有限公司 | Substrate and base plate separation process, sacrificial layer and flexible display device and production process thereof |
| CN104511973A (en) * | 2013-09-30 | 2015-04-15 | 三星钻石工业股份有限公司 | Method and apparatus for breaking brittle material substrate |
-
2015
- 2015-09-09 CN CN201510569848.0A patent/CN106514884A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102617029A (en) * | 2011-01-27 | 2012-08-01 | 三星钻石工业股份有限公司 | A method for scribing a brittle material substrate |
| CN103240806A (en) * | 2012-02-06 | 2013-08-14 | 奇景光电股份有限公司 | Wafer cutting method |
| CN104511973A (en) * | 2013-09-30 | 2015-04-15 | 三星钻石工业股份有限公司 | Method and apparatus for breaking brittle material substrate |
| CN104201283A (en) * | 2014-09-04 | 2014-12-10 | 广州新视界光电科技有限公司 | Substrate and base plate separation process, sacrificial layer and flexible display device and production process thereof |
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Application publication date: 20170322 |
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