CN104201283A - Substrate and base plate separation process, sacrificial layer and flexible display device and production process thereof - Google Patents
Substrate and base plate separation process, sacrificial layer and flexible display device and production process thereof Download PDFInfo
- Publication number
- CN104201283A CN104201283A CN201410448021.XA CN201410448021A CN104201283A CN 104201283 A CN104201283 A CN 104201283A CN 201410448021 A CN201410448021 A CN 201410448021A CN 104201283 A CN104201283 A CN 104201283A
- Authority
- CN
- China
- Prior art keywords
- substrate
- sacrifice layer
- fexible film
- display device
- flexible display
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/7806—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate
- H01L21/7813—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices involving the separation of the active layers from a substrate leaving a reusable substrate, e.g. epitaxial lift off
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Disclosed are a substrate and base plate separation process for a flexible display device and the flexible display device and a production process thereof. The substrate and base plate separation process comprises the following steps of step 1, producing a sacrificial layer on a base plate, wherein the sacrificial layer is a carbon elementary substance film; step 2, producing a flexible film substrate on the sacrificial layer; step 3, producing an electronic element on the flexible film substrate; step 4, dissociating the flexible film substrate from the base plate to obtain the flexible display device. The sacrificial layer is the carbon elementary substance film, particularly any one or more than one of an amorphous carbon film, a carbon nanotube film, a graphene thin film, a fullerene thin film or a diamond film. The thickness of the sacrificial layer is 1 to 100 nm. According to the substrate and base plate separation process, the sacrificial layer and the flexible display device and the production process thereof, the carbon elementary substance film serves as the sacrificial layer and accordingly the separation of the substrate and the base plate can be simple, low in cost and rapid and the device performance cannot be affected.
Description
Technical field
The present invention relates to flexible semiconductor thin film technique field, the preparation technology of the flexible display device that particularly relate to substrate and substrate separating technology and the sacrifice layer adopting thereof prepared by a kind of flexible display device, there is this separating technology and by the prepared flexible display device forming of this separating technology.
Background technology
Time prepared by flexible display device, be first on hard substrate, to form fexible film substrate, and then make device on fexible film substrate, finally substrate and fexible film substrate are dissociated and obtain removing the finished product device of substrate.But, there are some defects in this method of the prior art: because flexible substrate tends to and hard substrate directly produces stronger adhesion, therefore fexible film substrate is often easily damaged in the time that hard substrate dissociates flexible substrate film and on electronic device.
In order to overcome the above-mentioned difficulty of dissociating, conventionally between hard substrate and fexible film substrate, insert specific sacrifice layer, utilize sacrifice layer to reduce the adhesion between the two, and the physical stress that in dissociation process, fexible film substrate may be subject to, chemical corrosion equivalent damage are imputed to sacrifice layer.Common sacrificial layer material comprises polysilicon, monocrystalline silicon, silicon nitride, silica, photoresist and metal etc. at present.
Chinese Patent Application No. 201110113872.5, name are called flexible display device and manufacture method thereof and disclose the structure of a kind of heater, sacrifice layer, and sacrifice layer decomposes under heater effect, and substrate is dissociated.But this method complex structure, and the process time is longer.
US Patent No. 20090266471 discloses a kind of silicon nitride sacrifice layer (adhesion layer) of hydrogenation, is irradiated and is made sacrifice layer release hydrogen molecule by laser or ultraviolet ray, produces dissociation effect.This method needs can resistant to elevated temperatures substrate, and to require substrate must be only transparent to specific wavelength, and process costs is high, also easily occurs the problem of light injury.
Number of patent application is 201110330161.3, name is called the method for the preparation of flexible flat device, discloses a kind of cohesive material sacrifice layer, flexible substrate can be adhered on carrier substrate.This method simple and fast, but cohesive material resistance to elevated temperatures, drug resistance are poor, have seriously limited the scope of application of the type substrate.
Due to the special role of sacrifice layer in flexible display apparatus, require sacrifice layer itself not produce excessive adhesion with fexible film substrate, the adhesion between hard substrate, sacrifice layer, fexible film can not the too small disengaging problem to avoid occurring in preparation process simultaneously.
Therefore, for prior art deficiency, provide a kind of sacrifice layer, can effectively reduce the adhesive attraction of fexible film substrate and hard substrate, can facilitate again, low cost, dissociate fast, and it is very necessary not affect device performance.Provide a kind of simultaneously and can facilitate, low cost, realize the technique that flexible display device substrate separates with substrate and the flexible display device that adopts this technique to prepare is very necessary to overcome prior art deficiency fast.
Summary of the invention
The technique that the object of the invention is to avoid the deficiencies in the prior art part and provide a kind of flexible display device substrate to separate with substrate, can be simply, low cost, realize substrate rapidly and separate with substrate.
Above-mentioned purpose of the present invention realizes by following technological means.
Be provided for substrate and substrate separating technology prepared by flexible display device, comprise the steps,
(1) on substrate, prepare sacrifice layer, described sacrifice layer is carbon simple substance membrane;
(2) on sacrifice layer, prepare fexible film substrate;
(3) on fexible film substrate, prepare electronic component;
(4) fexible film substrate is dissociated and obtains finished product flexible display device from substrate.
Above-mentioned carbon simple substance membrane be in amorphous carbon-film, carbon nano-tube film, graphene film, fullerene thin film or diamond like carbon film any one or more than one.
The thickness of above-mentioned sacrifice layer is 1nm-1000nm.
Above-mentioned sacrifice layer is prepared from by any one method in chemical vapour deposition technique, physical vaporous deposition or solution processing method.
Preferably, above-mentioned steps (4) is torn fexible film substrate and sacrifice layer entirety substrate and fexible film substrate to be separated obtained separating the finished product flexible display device after substrate from substrate by mechanics mode.
Another is preferred, and above-mentioned steps (2) is specifically prepared fexible film substrate, makes fexible film substrate cover sacrifice layer forming section cladding completely, in the outside, edge of sacrifice layer, fexible film substrate and substrate contacts;
Described step (4) specifically comprises,
(4.1) along thering is fexible film substrate, sacrifice layer and substrate three-decker stacked position cutting part cladding successively, form line of cut;
(4.2) along line of cut, fexible film substrate is torn to the finished product flexible display device that has obtained separating substrate with sacrifice layer entirety from substrate.
Another is preferred, and above-mentioned substrate and substrate separating technology, specifically comprise the steps,
(1) on substrate, prepare sacrifice layer and form the first body;
(2) prepare fexible film substrate, make the outer surface of completely coated described the first body of fexible film substrate form complete cladding;
(3) preparing electronic component near on the fexible film substrate of sacrifice layer one side;
(4) fexible film substrate is dissociated and obtains finished product flexible display device from substrate;
Described step (4) specifically comprises,
(4.1) stacked position cut complete cladding successively along thering is fexible film substrate, substrate, sacrifice layer and fexible film substrate four-layer structure, form line of cut;
(4.2) adopt mechanics mode to make the interfacial separation between sacrifice layer and substrate along line of cut, thereby make electronic component on sacrifice layer, fexible film substrate and fexible film substrate do as a wholely to separate from substrate, obtained separating the finished product flexible display device of substrate.
Another object of the present invention is to avoid the deficiencies in the prior art part and a kind of sacrifice layer that is applicable to the technique that flexible display device substrate separates with substrate is provided, can be simply, low cost, realize substrate rapidly and separate with substrate.
Above-mentioned purpose of the present invention realizes by following technological means.
onthe sacrifice layer of the flexible display device that the substrate of preparing for flexible display device of stating and substrate separating technology use, adopts above-mentioned carbon simple substance membrane as sacrifice layer.
The preparation technology who another object of the present invention is to avoid the deficiencies in the prior art part and provide a kind of flexible display device, can be simply, low cost, realize substrate rapidly and separate with substrate.It is realized by following technological means: separate with substrate separating technology by above-mentioned substrate.
Another object of the present invention is to avoid the deficiencies in the prior art part and a kind of flexible display device is provided, separate with substrate separating technology by above-mentioned substrate, can be simply, low cost, realize substrate rapidly and separate with substrate.
The present invention adopts carbon simple substance membrane as sacrifice layer, carbon simple substance membrane can stop between fexible film substrate and hard substrate and forms strong chemical bond, adhesion between fexible film substrate and substrate is reduced greatly, therefore can simply substrate be dissociated preparing after electronic component.Because carbon simple substance membrane is as sacrifice layer, its light transmission is good, and therefore performance that can image device does not need carbon simple substance membrane to remove, therefore can further simplify technique.In sum, substrate and substrate separating technology that the present invention is prepared for flexible display device, can be simply, low cost, realize substrate rapidly and separate with substrate.
Sacrifice layer provided by the invention, can be simply, low cost, realize substrate rapidly and separate with substrate, and do not affect device performance.
Flexible display device provided by the invention and preparation method thereof, have substrate separate with substrate simple, cost is low, affect fast and not the feature of device performance.
Brief description of the drawings
The present invention is further illustrated to utilize accompanying drawing, but content in accompanying drawing does not form any limitation of the invention.
Fig. 1 is the substrate prepared for flexible display device of the present invention and the schematic diagram of substrate separating technology embodiment 1.
Fig. 2 is the schematic diagram of the structure of part cladding of the present invention.
Fig. 3 is the schematic diagram that the present invention dissociates to part cladding.
Fig. 4 is the schematic diagram that the present invention dissociates to part cladding.
Fig. 5 is the schematic diagram of the structure of cladding of the present invention.
Fig. 6 is the schematic diagram that the present invention dissociates to cladding.
Comprise at Fig. 1 to Fig. 6:
Substrate 100, sacrifice layer 200, fexible film substrate 300,
Part cladding 400, the first body 500, complete cladding 600, line of cut 700.
Embodiment
The invention will be further described with the following Examples.
embodiment 1.
The substrate of preparing for flexible display device and a substrate separating technology, comprise the steps:
(1) on substrate 100, prepare sacrifice layer 200, sacrifice layer 200 is carbon simple substance membrane.
Substrate 100 is hard material, can be glass, metal, plastics and Fiber Materials, also can be for based on above-mentioned material and have the substrate 100 of resilient coating.
Wherein, carbon simple substance membrane in amorphous carbon-film, carbon nano-tube film, graphene film, fullerene thin film or diamond like carbon film any one or more than one.
The thickness of sacrifice layer 200 is 1nm-1000nm, and sacrifice layer 200 is prepared from by any one method in chemical vapour deposition technique, physical vaporous deposition or solution processing method.
(2) on sacrifice layer 200, prepare fexible film substrate 300.
The material of fexible film substrate 300 can be polyimides (Polyimide, PI), PETG (Polyethylene terephthalate, PET), Polyethylene Naphthalate (Polyethylene naphthalate, PEN), Merlon (Polycarbonate, PC), polyether sulfone (Polyethersulfone, PES), polyacrylate (Polyacrylate, PAR), Polyetherimide (Polyetherimide), polyamide (Polyamide, or polyether-ether-ketone (polyetheretherketone PA), PEEK) etc.
Flexible substrate can adopt coating process (coating) to be formed on sacrifice layer 200, comprises the combination of blade coating, spin coating, spraying, dip-coating, silk screen printing and these methods.
The preparation technology of fexible film substrate 300 is general knowledge known in this field, does not repeat them here.
(3) on fexible film substrate 300, prepare electronic component.
On fexible film substrate 300, the electronic component of made comprises: the combination of at least one or more than one in insulating barrier, resistance, electric capacity, inductance, wire, transistor, diode.The concrete form of electronic component and position, annexation can be selected flexibly and arrange according to concrete requirement on devices, do not enumerate at this.
(4) fexible film substrate 300 is dissociated and obtains finished product flexible display device from substrate 100.Specifically by mechanics mode, fexible film substrate 300 is torn and made substrate 100 and fexible film substrate 300 separate the finished product flexible display device that has obtained separating after substrate 100 from substrate 100 with sacrifice layer 200 entirety, as shown in Figure 1.It should be noted that, in the present embodiment, the mechanics mode of indication can be to tear by staff, can be also to tear by manipulator.
Technique of the present invention both can have been brought into play and in flexible display device preparation process, on substrate 100, prepare sacrifice layer 200, finally fexible film substrate 300 is dissociated from substrate 100 having prepared after electronic component, utilize the physical stress that sacrifice layer 200 may be subject to fexible film substrate 300, the feature that chemical corrosion equivalent damage is given to sacrifice layer 200.There is again the convenience of dissociating, simple feature.
Process using carbon simple substance membrane of the present invention is as sacrifice layer 200, be arranged at the carbon simple substance membrane between fexible film substrate 300 and substrate 100, carbon simple substance membrane can react with the oxygen molecule that penetrates into this interface, and then stop between fexible film substrate 300 and hard substrate 100 and form strong chemical bond, the adhesion between the substrate 100 of fexible film substrate 300 and hard is weakened greatly.And the chemical bond forming between the substrate 100 of carbon simple substance membrane and hard a little less than, the adhesion of the two a little less than.Adhesion between carbon simple substance membrane and fexible film substrate 300 is greater than the adhesion between carbon simple substance membrane and substrate 100.Therefore after device preparation, can just fexible film substrate 300 and sacrifice layer 200 entirety can be torn from the substrate 100 of hard by simply tearing technique, the disengaging that realizes hard substrate 100 obtains cost flexible display device.
Owing to adopting carbon simple substance membrane as sacrifice layer 200, and selected carbon simple substance membrane material is thin transparent, and light transmittance is high, and carbon simple substance membrane is thinner, and the carbon simple substance membrane after dissociating attaches to fexible film substrate 300, can not cause interference to the performance of device.Therefore, do not need, as needing in prior art, sacrifice layer dissociation steps is set especially after substrate dissociates.Therefore method of the present invention does not need to remove the step of sacrifice layer 200, preparation technology's difficulty and complexity are reduced greatly.
Technique of the present invention, have substrate separate with substrate 100 simple, cost is low, affect fast and not the feature of device performance.
embodiment 2.
The substrate of preparing for flexible display device and a substrate separating technology, further feature is identical with embodiment 1, and difference is also have following feature:
The step (2) of the present embodiment is prepared fexible film substrate 300, makes fexible film substrate 300 cover sacrifice layer 200 forming section claddings 400 completely, and prepared structure as shown in Figure 2.Fexible film substrate 300 will cover sacrifice layer 200 completely, and the area of fexible film substrate 300 is greater than the area of sacrifice layer 200, and in the outside, edge of sacrifice layer 200, fexible film substrate 300 directly contacts with substrate 100.This structure can improve fexible film substrate 300 and the adhesive force of sacrifice layer 200 to substrate 100, reduces in device preparation process the flexible substrate probability dissociating that meets accident.After device preparation, can dissociate by the mode of cutting.
The step (4) of the present embodiment is dissociated fexible film substrate 300 to obtain finished product flexible display device from substrate 100, specifically comprises:
(4.1) along thering is fexible film substrate 300, sacrifice layer 200 and substrate 100 three-deckers stacked position cutting part cladding 400 successively, form line of cut 700;
(4.2) adopt mechanics mode to make the interfacial separation between sacrifice layer 200 and substrate 100 along line of cut 700, thereby make electronic component on sacrifice layer 200, fexible film substrate 300 and fexible film substrate do as a wholely to separate from substrate 100, obtained separating the finished product flexible display device of substrate.
Can be as shown in Figure 3, Figure 4, along dotted line cutting part cladding 400, then fexible film substrate 300 and sacrifice layer 200 entirety are torn to the finished product flexible display device after obtaining separating from substrate 100.
Due between carbon simple substance membrane and substrate 100 form chemical bond a little less than, the adhesion of the two a little less than.Therefore in the process of preparation, fexible film substrate 300 and substrate have the phenomenon departing from ahead of time once in a while, cause subsequent step effectively not carry out.
In this embodiment, make fexible film substrate 300 cover sacrifice layer 200 completely, can avoid fexible film substrate 300 and the situation that sacrifice layer 200 departs from ahead of time to occur.Because the fexible film substrate 300 of part cladding 400 has covered sacrifice layer 200 completely, therefore, in sacrifice layer 200 external positions, fexible film substrate 300 directly contacts with substrate 100, and in sacrifice layer 200 positions, sacrifice layer 200 directly contacts with substrate 100.Like this, the position adhesive force that fexible film substrate 300 directly contacts with substrate 100 is large, and fexible film substrate 300 can not depart from early with sacrifice layer 200.After device preparation, part cladding 400 is cut, then along line of cut 700, the electronic component on fexible film substrate 300, sacrifice layer 200 and fexible film substrate is done as a wholely to depart from along substrate 100, now, sacrifice layer 200 positions in line of cut 700, adhesive force between sacrifice layer 200 and substrate 100 is less, therefore can dissociate easily.
Therefore, substrate and substrate separating technology that the present embodiment is prepared for flexible display device, have substrate separate with substrate simple, cost is low, affect fast and not the feature of device performance.
embodiment 3.
The substrate of preparing for flexible display device and a substrate separating technology, further feature is identical with embodiment 1, and difference is also have following feature, and this technique specifically comprises the steps:
(1) on substrate 100, prepare sacrifice layer 200 and form the first body 500.
(2) prepare fexible film substrate 300, make the outer surface of completely coated the first body 500 of fexible film substrate 300 form complete cladding 600, as shown in Figure 5.
(3) prepare electronic component near on the fexible film substrate of sacrifice layer 200 1 sides, referring to the A face in Fig. 5 near the fexible film substrate of sacrifice layer 200 1 sides.(4) fexible film substrate 300 is dissociated and obtains finished product flexible display device from substrate 100.
Step (4) specifically comprises, as shown in Figure 6,
(4.1) stacked position cut complete cladding 600 successively along thering are fexible film substrate 300, substrate 100, sacrifice layer 200 and fexible film substrate 300 four-layer structures, form line of cut 700;
(4.2) adopt mechanics mode to make the interfacial separation between sacrifice layer 200 and substrate 100 along line of cut 700, thereby make electronic component on sacrifice layer 200, fexible film substrate 300 and fexible film substrate do as a wholely to separate from substrate 100, obtained separating the finished product flexible display device of substrate.
Due between carbon simple substance membrane and substrate 100 form chemical bond a little less than, the adhesion of the two a little less than.Therefore in the process of preparation, fexible film substrate 300 and substrate have the phenomenon departing from ahead of time once in a while, cause subsequent step effectively not carry out.
In this embodiment, make fexible film substrate 300 cover the outer surface of the first body 500 completely, can avoid fexible film substrate 300 and the situation that sacrifice layer 200 departs from ahead of time to occur.Because fexible film substrate 300 has covered the first body 500 completely, therefore fexible film substrate 300 can effectively stick with substrate 100, can not come off ahead of time.After device preparation, cladding is cut, then adopt mechanics mode to make the interfacial separation between sacrifice layer 200 and substrate 100 along line of cut 700, thereby make the electronic component on sacrifice layer 200, fexible film substrate 300 and fexible film substrate do as a whole from substrate 100 separation, now, sacrifice layer 200 positions in line of cut 700, the adhesive force between sacrifice layer 200 and substrate 100 is less, therefore can dissociate easily.
Therefore, substrate and substrate separating technology that the present embodiment is prepared for flexible display device, have substrate separate with substrate simple, cost is low, affect fast and not the feature of device performance.
embodiment 4.
Sacrifice layer as described in embodiment 1 to 3 any one, for flexible display device preparation, this sacrifice layer 200 is carbon simple substance membrane.Carbon simple substance membrane can be in amorphous carbon-film, carbon nano-tube film, graphene film, fullerene thin film or diamond like carbon film any one or more than one.
The thickness of sacrifice layer 200 is 1nm-1000nm, and sacrifice layer 200 can be prepared from by any one method in chemical vapour deposition technique, physical vaporous deposition or solution processing method.
Preparing in flexible display device process, this sacrifice layer 200 is first prepared on the substrate 100 of hard, and then on sacrifice layer 200, prepare fexible film substrate 300, then on fexible film substrate 300, prepare various electronic components, finally the electronic component on sacrifice layer 200, fexible film substrate 300 and fexible film substrate is made to as a whole and substrate 100 hard and dissociated, obtain finished product flexible display device.
By this sacrifice layer 200, the physics in dissociation process, chemical damage can be transferred to sacrifice layer 200 and can not caused damage to substrate.Adhesive force between this sacrifice layer 200 and fexible film substrate 300 is greater than the adhesive force between sacrifice layer 200 and substrate 100 simultaneously, therefore only need dissociate by simply tearing just to open to realize.Transparent carbon simple substance membrane can not affect the performance of device, and therefore, the sacrifice layer 200 together with fexible film substrate 300 does not need to arrange specially operation and removes sacrifice layer 200, has the simple feature of technique.
embodiment 5.
A preparation technology prepared by flexible display device, has the solution separating process as described in any one in embodiment 1 to 3, comprises the steps:
(1) on substrate 100, prepare sacrifice layer 200, sacrifice layer 200 is carbon simple substance membrane.
Substrate 100 is hard material, can be glass, metal, plastics and Fiber Materials, also can be for based on above-mentioned material and have the substrate 100 of resilient coating.
Wherein, carbon simple substance membrane in amorphous carbon-film, carbon nano-tube film, graphene film, fullerene thin film or diamond like carbon film any one or more than one.
The thickness of sacrifice layer 200 is 1nm-1000nm, and sacrifice layer 200 is prepared from by any one method in chemical vapour deposition technique, physical vaporous deposition or solution processing method.
(2) on sacrifice layer 200, prepare fexible film substrate 300.
The material of fexible film substrate 300 can be polyimides (Polyimide, PI), PETG (Polyethylene terephthalate, PET), Polyethylene Naphthalate (Polyethylene naphthalate, PEN), Merlon (Polycarbonate, PC), polyether sulfone (Polyethersulfone, PES), polyacrylate (Polyacrylate, PAR), Polyetherimide (Polyetherimide), polyamide (Polyamide, or polyether-ether-ketone (polyetheretherketone PA), PEEK) etc.
Flexible substrate can adopt coating process (coating) to be formed on sacrifice layer 200, comprises the combination of blade coating, spin coating, spraying, dip-coating, silk screen printing and these methods.
The preparation technology of fexible film substrate 300 is general knowledge known in this field, does not repeat them here.
(3) on fexible film substrate 300, prepare electronic component.
On fexible film substrate 300, the electronic component of made comprises: in insulating barrier, resistance, electric capacity, inductance, wire, transistor, diode any one or any one more than combination.The concrete form of electronic component and position, annexation can be selected flexibly and arrange according to concrete requirement on devices, do not enumerate at this.
(4) fexible film substrate 300 is dissociated and obtains finished product flexible display device from substrate 100.Specifically the electronic component on sacrifice layer 200, fexible film substrate 300 and fexible film substrate is done as a wholely to tear and make substrate 100 and fexible film substrate 300 separate the finished product flexible display device that has obtained separating after substrate 100 from substrate 100 as staff or manipulator by mechanics mode, as shown in Figure 1.
Preparation technology prepared by flexible display device of the present invention prepares sacrifice layer 200 on substrate 100, finally fexible film substrate 300 is dissociated from substrate 100 having prepared after electronic component, utilize the physical stress that sacrifice layer 200 may be subject to fexible film substrate 300, the feature that chemical corrosion equivalent damage is given to sacrifice layer 200.There is again the convenience of dissociating, simple feature.
Owing to adopting carbon simple substance membrane as sacrifice layer 200, be arranged at the carbon simple substance membrane between fexible film substrate 300 and substrate 100, carbon simple substance membrane can react with the oxygen molecule that penetrates into this interface, and then stop between fexible film substrate 300 and hard substrate 100 and form strong chemical bond, the adhesion between the substrate 100 of fexible film substrate 300 and hard is weakened greatly.And the chemical bond forming between the substrate 100 of carbon simple substance membrane and hard a little less than, the adhesion of the two a little less than.Adhesion between carbon simple substance membrane and fexible film substrate 300 is greater than the adhesion between carbon simple substance membrane and substrate 100.Therefore after device preparation, can just the electronic component on sacrifice layer 200, fexible film substrate 300 and fexible film substrate can be made to the as a whole substrate 100 from hard and tear by simply tearing technique, the disengaging that realizes hard substrate 100 obtains cost flexible display device.
Owing to adopting carbon simple substance membrane as sacrifice layer 200, and selected carbon simple substance membrane material is thin transparent, and light transmittance is high, and carbon simple substance membrane is thinner, and the carbon simple substance membrane after dissociating attaches to fexible film substrate 300, can not cause interference to the performance of device.Therefore, do not need, as needing in prior art, sacrifice layer 200 dissociation steps are set especially after substrate 100 dissociates.Therefore method of the present invention does not need to remove the step of sacrifice layer, preparation technology's difficulty and complexity are reduced greatly.
Technique of the present invention, have substrate separate with substrate simple, cost is low, affect fast and not the feature of device performance.
embodiment 6.
A preparation technology prepared by flexible display device, further feature is identical with embodiment 5, and difference is also have following feature:
The step (2) of the present embodiment is prepared fexible film substrate 300, makes fexible film substrate 300 cover sacrifice layer 200 forming section claddings 400 completely, and prepared structure as shown in Figure 2.Fexible film substrate 300 will cover sacrifice layer 200 completely, and the area of fexible film substrate 300 is greater than the area of sacrifice layer 200, and in the outside, edge of sacrifice layer 200, fexible film substrate 300 directly contacts with substrate 100.This structure can improve fexible film substrate 300 and the adhesive force of sacrifice layer 200 to substrate 100, reduces the probability departing from.After device preparation, can dissociate by the mode of cutting.
The step (4) of the present embodiment is dissociated fexible film substrate 300 to obtain finished product flexible display device from substrate 100, specifically comprises:
(4.1) along thering is fexible film substrate 300, sacrifice layer 200 and substrate 100 three-deckers stacked position cutting part cladding 400 successively, form line of cut 700;
(4.2) along line of cut 700, the electronic component on sacrifice layer 200, fexible film substrate 300 and fexible film substrate is done as a wholely to tear from substrate 100 the finished product flexible display device that has obtained separating substrate 100.
Can be as shown in Figure 3, Figure 4, along dotted line cutting part cladding 400, then fexible film substrate 300 and electronic component entirety on sacrifice layer 200 and fexible film substrate are torn to the finished product flexible display device after obtaining separating from substrate 100.
Due between carbon simple substance membrane and substrate 100 form chemical bond a little less than, the adhesion of the two a little less than.Therefore in the process of preparation, fexible film substrate 300 and substrate have the phenomenon departing from ahead of time once in a while, cause subsequent step effectively not carry out.
In this embodiment, make fexible film substrate 300 cover sacrifice layer 200 completely, can avoid fexible film substrate 300 and the situation that sacrifice layer 200 departs from ahead of time to occur.Because the fexible film substrate 300 of part cladding 400 has covered sacrifice layer 200 completely, therefore, in sacrifice layer 200 external positions, fexible film substrate 300 directly contacts with substrate 100, and in sacrifice layer 200 positions, sacrifice layer 200 directly contacts with substrate 100.Like this, the position adhesive force that fexible film substrate 300 directly contacts with substrate 100 is large, and fexible film substrate 300 can not depart from early with sacrifice layer 200.After device preparation, part cladding 400 is cut, then along line of cut 700, the electronic component on sacrifice layer 200, fexible film substrate 300 and fexible film substrate is done as a wholely to depart from along substrate 100, now, sacrifice layer 200 positions in line of cut 700, adhesive force between sacrifice layer 200 and substrate 100 is less, therefore can dissociate easily.
Therefore, preparation technology prepared by the flexible display device of the present embodiment, have substrate separate with substrate simple, cost is low, affect fast and not the feature of device performance.
embodiment 7.
The substrate of preparing for flexible display device and a substrate separating technology, further feature is identical with embodiment 5, and difference is also have following feature, and this technique specifically comprises the steps:
(1) on substrate 100, prepare sacrifice layer 200 and form the first body 500.
(2) prepare fexible film substrate 300, make the outer surface of completely coated the first body 500 of fexible film substrate 300 form complete cladding 600, as shown in Figure 5.
(3) on the close fexible film substrate 300 of sacrifice layer 200 1 sides---be to prepare electronic component on the A face in Fig. 5.
(4) fexible film substrate 300 is dissociated and obtains finished product flexible display device from substrate 100.
Step (4) specifically comprises, as shown in Figure 6,
(4.1) stacked position cut complete cladding 600 successively along thering are fexible film substrate 300, substrate 100, sacrifice layer 200 and fexible film substrate 300 four-layer structures, form line of cut 700;
(4.2) along line of cut 700, the electronic component on sacrifice layer 200, fexible film substrate 300 and fexible film substrate is done as a wholely to separate from substrate 100 the finished product flexible display device that has obtained separating substrate 100.
Due between carbon simple substance membrane and substrate 100 form chemical bond a little less than, the adhesion of the two a little less than.Therefore in the process of preparation, fexible film substrate 300 and substrate have the phenomenon departing from ahead of time once in a while, cause subsequent step effectively not carry out.
In this embodiment, make fexible film substrate 300 cover the outer surface of the first body 500 completely, can avoid fexible film substrate 300 and the situation that sacrifice layer 200 departs from ahead of time to occur.Because fexible film substrate 300 has covered the first body 500 completely, therefore fexible film substrate 300 can effectively stick with substrate 100, can not come off ahead of time.After device preparation, cladding is cut, then along line of cut 700, fexible film substrate 300 is departed from along substrate 100 together with sacrifice layer 200, now, sacrifice layer 200 positions in line of cut 700, adhesive force between sacrifice layer 200 and substrate 100 is less, therefore can dissociate easily.
Therefore, the preparation technology of the present embodiment flexible display device, have substrate separate with substrate simple, cost is low, affect fast and not the feature of device performance.
embodiment 8.
Prepare a kind of flexible TFT and drive backboard 1a to verify effect of the present invention, concrete preparation process is as follows:
First, select the substrate 100 of glass substrate 100 as hard, before preparing sacrifice layer 200, first glass substrate 100 is cleaned.
(1) utilize chemical vapour deposition technique, prepare amorphous carbon simple substance membrane as sacrifice layer 200.Concrete, strengthen in chemical vapor deposition device at capacity plate antenna type radio frequency plasma, hard substrates material is placed on the anode electrode of ground connection, pass into the mist of methane and hydrogen as reacting gas, until form the amorphous carbon simple substance membrane of 50 nanometers, after complete, carry out annealing in process.
(2) on sacrifice layer 200, prepare polyimide substrate.Concrete, on sacrifice layer 200, apply polyamide acid solution, adopt the first blade coating mode of spin coating again.Apply complete after, hard substrate 100 is sent in the baking oven of N2 atmosphere to polyamic acid just body film be cured film forming.
(3) then on polyimide film substrate, prepare TFT drive circuit.
(4) finally polyimide film is directly torn from substrate 100.
For contrast effect, to prepare another flexible TFT and drive backboard 1b, different unique from 1a of 1b are not prepare sacrifice layer 200, but directly on hard substrate 100, prepare polyimide film substrate.In the time tearing polyimide film substrate, there is obvious crackle in film, and macroscopic damage has also appearred in TFT device accordingly.
Visible, the present invention have substrate separate with substrate simple, cost is low, affect fast and not the feature of device performance.
embodiment 9.
Prepare a kind of flexible AMOLED panel 2a, drive backboard and OLED luminescent device containing TFT.
Select the substrate 100 of stainless steel metal substrate 100 as hard, before preparing sacrifice layer 200, first substrate 100 is cleaned.
(1) utilize solution processing method, prepare carbon nano-tube film sacrifice layer 200.Concrete, carbon nanotube powder is joined in dispersion liquid, to carry out stir process fully loose, obtain carbon nano tube dispersion liquid; Adopt suction funnel suction filtration carbon nano tube dispersion liquid to carry out deposition processes, obtain the carbon nano-tube deposit that is attached to filter membrane, water washes away dispersant, finally carbon nano-tube deposit is combined to remove filter membrane with substrate 100, obtains carbon nano-tube film.
(2) on sacrifice layer 200, prepare PETG substrate, make the completely coated sacrifice layer 200 forming section claddings 400 of PETG substrate.Concrete, on sacrifice layer 200, apply PETG solution, when coating, allow solution overflow, cover metal substrate 100.Apply complete after, hard substrate 100 is sent in the baking oven of N2 atmosphere and is cured film forming.
(3) on PETG substrate, prepare TFT drive circuit and OLED device.
(4) on PETG substrate, cut out the profile of target board, substrate is torn from substrate 100.
For example contrast effect, prepare another flexible AMOLED panel 2b, different unique from 2a of 2b are not prepare sacrifice layer 200, directly on hard substrate 100, prepare PETG substrate.In the film-substrate of tearing, there is obvious crackle in film, and macroscopic damage has also appearred in TFT and OLED device accordingly.
Visible, the present invention have substrate separate with substrate simple, cost is low, affect fast and not the feature of device performance.
embodiment 10.
Prepare a kind of flexible AMOLED panel 3a, drive backboard and OLED luminescent device containing TFT.
First select metal substrate 100 as hard substrate 100, before preparing sacrifice layer 200, first substrate 100 is cleaned.
(1) utilize solution processing method, prepare graphene film sacrifice layer 200, form the first body 500.Concrete, first prepare graphene oxide as a kind of colloidal solution, be coated in metal substrate 100 surfaces, utilize the reducing power of metal substrate 100 to make it change in situ Graphene into, in the evaporation of solvent progress, Graphene generation self assembly forms graphene film.
(2) prepare Polyethylene Naphthalate substrate, make completely coated the first body 500 of this Polyethylene Naphthalate substrate.Concrete, substrate 100 is immersed in Polyethylene Naphthalate solution together with sacrifice layer 200, after a period of time, take out, send in the baking oven of N2 atmosphere and be cured film forming.The Polyethylene Naphthalate substrate obtaining has covered whole substrate 100 and sacrifice layer 200.
(3) on Polyethylene Naphthalate substrate, prepare TFT drive circuit and OLED device.
(4) on Polyethylene Naphthalate substrate, cut out the profile of target board, substrate is torn from substrate 100.
For contrast effect, comparative example 3b is set, different unique from 3a of 3b are not prepare sacrifice layer 200, directly on hard substrate 100, prepare Polyethylene Naphthalate substrate.In the film-substrate of tearing, there is obvious crackle in film, and macroscopic damage has also appearred in TFT and OLED device accordingly.
Visible, the present invention have substrate separate with substrate simple, cost is low, affect fast and not the feature of device performance.
Finally should be noted that; above embodiment is only in order to illustrate technical scheme of the present invention but not limiting the scope of the invention; although the present invention is explained in detail with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify or be equal to replacement technical scheme of the present invention, and not depart from essence and the scope of technical solution of the present invention.
Claims (10)
1. the substrate of preparing for flexible display device and substrate separating technology, is characterized in that: comprise the steps,
(1) on substrate, prepare sacrifice layer, described sacrifice layer is carbon simple substance membrane;
(2) on sacrifice layer, prepare fexible film substrate;
(3) on fexible film substrate, prepare electronic component;
(4) fexible film substrate is dissociated and obtains finished product flexible display device from substrate.
2. substrate according to claim 1 and substrate separating technology, is characterized in that: described carbon simple substance membrane be in amorphous carbon-film, carbon nano-tube film, graphene film, fullerene thin film or diamond like carbon film any one or more than one.
3. substrate according to claim 1 and substrate separating technology, is characterized in that: the thickness of described sacrifice layer is 1nm-1000nm.
4. substrate according to claim 3 and substrate separating technology, is characterized in that: described sacrifice layer is prepared from by any one method in chemical vapour deposition technique, physical vaporous deposition or solution processing method.
5. according to the substrate described in claim 1 to 4 any one and substrate separating technology, it is characterized in that: described step (4) is torn fexible film substrate and sacrifice layer entirety substrate and fexible film substrate to be separated obtained separating the finished product flexible display device after substrate from substrate by mechanics mode.
6. according to the substrate described in claim 1 to 4 any one and substrate separating technology, it is characterized in that:
Described step (2) is specifically prepared fexible film substrate, makes fexible film substrate cover sacrifice layer forming section cladding completely, in the outside, edge of sacrifice layer, fexible film substrate and substrate contacts;
Described step (4) specifically comprises,
(4.1) along thering is fexible film substrate, sacrifice layer and substrate three-decker stacked position cutting part cladding successively, form line of cut;
(4.2) along line of cut, fexible film substrate is torn to the finished product flexible display device that has obtained separating substrate with sacrifice layer entirety from substrate.
7. according to the substrate described in claim 1 to 4 any one and substrate separating technology, it is characterized in that: specifically comprise the steps,
(1) on substrate, prepare sacrifice layer and form the first body;
(2) prepare fexible film substrate, make the outer surface of completely coated described the first body of fexible film substrate form complete cladding;
(3) preparing electronic component near on the fexible film substrate of sacrifice layer one side;
(4) fexible film substrate is dissociated and obtains finished product flexible display device from substrate;
Described step (4) specifically comprises,
(4.1) stacked position cut complete cladding successively along thering is fexible film substrate, substrate, sacrifice layer and fexible film substrate four-layer structure, form line of cut;
(4.2) adopt mechanics mode to make the interfacial separation between sacrifice layer and substrate along line of cut, thereby make electronic component on sacrifice layer, fexible film substrate and fexible film substrate do as a wholely to separate from substrate, obtained separating the finished product flexible display device of substrate.
8. the sacrifice layer of the flexible display device that the substrate of preparing for flexible display device as claimed in any of claims 1 to 7 in one of claims and substrate separating technology use, is characterized in that: adopt if the carbon simple substance membrane in claim 1 to 4 is as sacrifice layer.
9. a preparation technology for flexible display device, is characterized in that: separate with substrate separating technology by the substrate as described in claim 1 to 7 any one.
10. a flexible display device, is characterized in that: separate with substrate separating technology by the substrate by as described in claim 1 to 7 any one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410448021.XA CN104201283A (en) | 2014-09-04 | 2014-09-04 | Substrate and base plate separation process, sacrificial layer and flexible display device and production process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410448021.XA CN104201283A (en) | 2014-09-04 | 2014-09-04 | Substrate and base plate separation process, sacrificial layer and flexible display device and production process thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104201283A true CN104201283A (en) | 2014-12-10 |
Family
ID=52086548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410448021.XA Pending CN104201283A (en) | 2014-09-04 | 2014-09-04 | Substrate and base plate separation process, sacrificial layer and flexible display device and production process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104201283A (en) |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104868054A (en) * | 2015-04-28 | 2015-08-26 | 吉林建筑大学 | Method for fixing flexible material substrate by utilizing photoresist |
| CN106514884A (en) * | 2015-09-09 | 2017-03-22 | 三星钻石工业股份有限公司 | Cutting method and device for brittle substrate |
| CN106920817A (en) * | 2015-12-22 | 2017-07-04 | 三星显示有限公司 | The display device for manufacturing the method for display device and being manufactured using the method |
| CN108878507A (en) * | 2017-05-12 | 2018-11-23 | 美国亚德诺半导体公司 | Gallium nitride devices suitable for high frequency and high power applications |
| CN108962761A (en) * | 2018-06-05 | 2018-12-07 | 信利半导体有限公司 | A kind of COF preparation method |
| CN109133046A (en) * | 2018-10-17 | 2019-01-04 | 东南大学 | A method of graphene is shifted using fullerene |
| CN109166881A (en) * | 2018-07-25 | 2019-01-08 | 深圳市华星光电半导体显示技术有限公司 | Flexible display apparatus and preparation method thereof |
| CN109638178A (en) * | 2018-12-05 | 2019-04-16 | 武汉华星光电半导体显示技术有限公司 | Display device structure and manufacturing method |
| CN109786551A (en) * | 2019-01-04 | 2019-05-21 | 无锡第六元素电子薄膜科技有限公司 | A kind of preparation method of the substrate for being used to prepare flexible OLED and flexibility OLED |
| CN109830458A (en) * | 2019-02-15 | 2019-05-31 | 长江存储科技有限责任公司 | Wafer support structure and forming method thereof |
| JP2019144347A (en) * | 2018-02-19 | 2019-08-29 | 株式会社Ｓｃｒｅｅｎホールディングス | Manufacturing method of display device |
| CN110534647A (en) * | 2019-08-28 | 2019-12-03 | 云谷（固安）科技有限公司 | Flexible substrate, display base plate and display panel |
| CN110867533A (en) * | 2019-11-28 | 2020-03-06 | 华中科技大学 | Polyimide film stripping method based on multilayer graphene as sacrificial layer |
| CN111370454A (en) * | 2020-03-18 | 2020-07-03 | 京东方科技集团股份有限公司 | Stretchable display device and method of manufacturing the same |
| CN111446363A (en) * | 2020-04-09 | 2020-07-24 | 西安交通大学 | Self-supporting three-dimensional self-assembly magnetoelectric composite film structure and preparation method thereof |
| CN111785672A (en) * | 2020-06-02 | 2020-10-16 | 芜湖长信科技股份有限公司 | Flexible touch screen separation method |
| TWI726384B (en) * | 2019-03-11 | 2021-05-01 | 日商東芝記憶體股份有限公司 | Substrate separation method, semiconductor memory device manufacturing method, and substrate separation device |
| WO2021093104A1 (en) * | 2019-11-14 | 2021-05-20 | Tcl华星光电技术有限公司 | Preparation method for flexible display panel, material of sacrificial layer, and preparation method therefor |
| US11211573B2 (en) | 2018-08-02 | 2021-12-28 | Kunshan Go-Visionox Opto-Electronics Co., Ltd. | Manufacturing methods for flexible display screens and composite substrates for flexible display screens |
| US11355598B2 (en) | 2018-07-06 | 2022-06-07 | Analog Devices, Inc. | Field managed group III-V field effect device with epitaxial back-side field plate |
-
2014
- 2014-09-04 CN CN201410448021.XA patent/CN104201283A/en active Pending
Cited By (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104868054A (en) * | 2015-04-28 | 2015-08-26 | 吉林建筑大学 | Method for fixing flexible material substrate by utilizing photoresist |
| CN106514884A (en) * | 2015-09-09 | 2017-03-22 | 三星钻石工业股份有限公司 | Cutting method and device for brittle substrate |
| CN106920817A (en) * | 2015-12-22 | 2017-07-04 | 三星显示有限公司 | The display device for manufacturing the method for display device and being manufactured using the method |
| CN106920817B (en) * | 2015-12-22 | 2022-05-17 | 三星显示有限公司 | Method of manufacturing display device and display device manufactured using the same |
| US11508821B2 (en) | 2017-05-12 | 2022-11-22 | Analog Devices, Inc. | Gallium nitride device for high frequency and high power applications |
| CN108878507A (en) * | 2017-05-12 | 2018-11-23 | 美国亚德诺半导体公司 | Gallium nitride devices suitable for high frequency and high power applications |
| JP2019144347A (en) * | 2018-02-19 | 2019-08-29 | 株式会社Ｓｃｒｅｅｎホールディングス | Manufacturing method of display device |
| CN108962761A (en) * | 2018-06-05 | 2018-12-07 | 信利半导体有限公司 | A kind of COF preparation method |
| US11355598B2 (en) | 2018-07-06 | 2022-06-07 | Analog Devices, Inc. | Field managed group III-V field effect device with epitaxial back-side field plate |
| CN109166881B (en) * | 2018-07-25 | 2020-09-29 | 深圳市华星光电半导体显示技术有限公司 | Flexible display device and preparation method thereof |
| CN109166881A (en) * | 2018-07-25 | 2019-01-08 | 深圳市华星光电半导体显示技术有限公司 | Flexible display apparatus and preparation method thereof |
| WO2020019566A1 (en) * | 2018-07-25 | 2020-01-30 | 深圳市华星光电半导体显示技术有限公司 | Flexible display apparatus and preparation method therefor |
| US11211573B2 (en) | 2018-08-02 | 2021-12-28 | Kunshan Go-Visionox Opto-Electronics Co., Ltd. | Manufacturing methods for flexible display screens and composite substrates for flexible display screens |
| CN109133046A (en) * | 2018-10-17 | 2019-01-04 | 东南大学 | A method of graphene is shifted using fullerene |
| CN109133046B (en) * | 2018-10-17 | 2021-08-10 | 东南大学 | Method for transferring graphene by utilizing fullerene |
| CN109638178A (en) * | 2018-12-05 | 2019-04-16 | 武汉华星光电半导体显示技术有限公司 | Display device structure and manufacturing method |
| US11196029B2 (en) | 2018-12-05 | 2021-12-07 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Display structure and manufacturing method thereof |
| CN109786551A (en) * | 2019-01-04 | 2019-05-21 | 无锡第六元素电子薄膜科技有限公司 | A kind of preparation method of the substrate for being used to prepare flexible OLED and flexibility OLED |
| CN109830458A (en) * | 2019-02-15 | 2019-05-31 | 长江存储科技有限责任公司 | Wafer support structure and forming method thereof |
| TWI726384B (en) * | 2019-03-11 | 2021-05-01 | 日商東芝記憶體股份有限公司 | Substrate separation method, semiconductor memory device manufacturing method, and substrate separation device |
| CN110534647A (en) * | 2019-08-28 | 2019-12-03 | 云谷（固安）科技有限公司 | Flexible substrate, display base plate and display panel |
| CN110534647B (en) * | 2019-08-28 | 2023-12-26 | 云谷（固安）科技有限公司 | Flexible substrate, display substrate and display panel |
| WO2021093104A1 (en) * | 2019-11-14 | 2021-05-20 | Tcl华星光电技术有限公司 | Preparation method for flexible display panel, material of sacrificial layer, and preparation method therefor |
| CN110867533B (en) * | 2019-11-28 | 2021-05-18 | 华中科技大学 | Polyimide film stripping method based on multilayer graphene as sacrificial layer |
| CN110867533A (en) * | 2019-11-28 | 2020-03-06 | 华中科技大学 | Polyimide film stripping method based on multilayer graphene as sacrificial layer |
| CN111370454A (en) * | 2020-03-18 | 2020-07-03 | 京东方科技集团股份有限公司 | Stretchable display device and method of manufacturing the same |
| CN111370454B (en) * | 2020-03-18 | 2023-12-29 | 京东方科技集团股份有限公司 | Method for manufacturing stretchable display device and stretchable display device |
| CN111446363B (en) * | 2020-04-09 | 2022-05-20 | 西安交通大学 | Self-supporting three-dimensional self-assembly magnetoelectric composite film structure and preparation method thereof |
| CN111446363A (en) * | 2020-04-09 | 2020-07-24 | 西安交通大学 | Self-supporting three-dimensional self-assembly magnetoelectric composite film structure and preparation method thereof |
| CN111785672A (en) * | 2020-06-02 | 2020-10-16 | 芜湖长信科技股份有限公司 | Flexible touch screen separation method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104201283A (en) | Substrate and base plate separation process, sacrificial layer and flexible display device and production process thereof | |
| TWI445626B (en) | Method for fabricating a flexible device | |
| JP6537263B2 (en) | Peeling method | |
| JP5357675B2 (en) | Release layer material, substrate structure including the same, and method for manufacturing the same | |
| TWI647099B (en) | Glass laminate and method of manufacturing electronic device | |
| CN103456900B (en) | The manufacture method of flexible display apparatus | |
| JP5796449B2 (en) | Manufacturing method of electronic device, manufacturing method of carrier substrate with resin layer | |
| WO2016050017A1 (en) | Flexible display substrate manufacturing method and flexible display substrate motherboard | |
| WO2012021197A2 (en) | Method of manufacturing electronic devices on both sides of a carrier substrate and electronic devices thereof | |
| JP6943249B2 (en) | Laminated body, manufacturing method of electronic device, manufacturing method of laminated body | |
| WO2013021560A1 (en) | Method for manufacturing flexible device | |
| KR102475698B1 (en) | Manufacturing method of laminated board and electronic device | |
| KR20130003997A (en) | Separation-combination method of carrier substrate and slim glass | |
| CN106129088A (en) | A kind of display floater and preparation method, display device | |
| WO2015098888A1 (en) | Glass laminate body, and method for manufacturing electronic device | |
| JP2014111365A (en) | Glass film laminate and method for manufacturing electronic/electric device | |
| CN104201096B (en) | One kind dissociation agent, solution separating process, flexible display device prepares and its preparation technology | |
| CN104362263A (en) | Flexible membrane liner and substrate separation process for producing flexible display device | |
| JP5898949B2 (en) | Method for manufacturing flexible device | |
| TW201429709A (en) | Glass laminate and manufacturing method therefor, and support base with silicone resin layer | |
| CN109087936A (en) | A kind of preparation method of flexible display substrates | |
| CN104362077A (en) | Liner and substrate separation process and flexible display device and manufacturing process thereof | |
| KR101947070B1 (en) | Method of fabricating display device using flexible film | |
| JP6136910B2 (en) | Manufacturing method of glass laminate and manufacturing method of electronic device | |
| WO2016026208A1 (en) | Manufacturing method of flexible display and flexible display |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20141210 |