CN104362263A - Flexible membrane liner and substrate separation process for producing flexible display device - Google Patents
Flexible membrane liner and substrate separation process for producing flexible display device Download PDFInfo
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- CN104362263A CN104362263A CN201410609069.4A CN201410609069A CN104362263A CN 104362263 A CN104362263 A CN 104362263A CN 201410609069 A CN201410609069 A CN 201410609069A CN 104362263 A CN104362263 A CN 104362263A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention discloses a flexible membrane liner and substrate separation process for producing a flexible display device. The process includes the steps: (1) producing a flexible membrane liner on a carrier substrate, and treating the juncture of the flexible membrane liner and the carrier substrate to enable some regions to become high-adhesion regions and the rest region to become a low-adhesion region; (2) producing an electronic component on the flexible membrane liner over the low-adhesion region; (3) cutting vertically and downwardly from the flexible membrane liner along the periphery of the electronic component to form a cutting line, wherein the low-adhesion region is located under the cutting line; (4) separating the flexible membrane liner from the carrier substrate. The flexible membrane liner is stably attached to the carrier substrate in the subsequent device production process, and the process is simple in liner and substrate separation, low in cost and rapid and causes no damage to the device.
Description
Technical field
The present invention relates to the preparation field of flexible display device, particularly a kind of fexible film substrate of preparing for flexible display device and substrate separating technology.
Background technology
First on hard substrate, form fexible film substrate time prepared by flexible display device, and then make electronic device on fexible film substrate, finally fexible film substrate and substrate being dissociated obtains removing the finished device of substrate.But, there are some defects in this method of the prior art: flexible substrate and substrate need to bear the harsh experiment condition such as Ions Bombardment, chemical corrosion, ultraviolet irradiation, high-temperature process in the preparation process of subsequent electronics, cause the adhesion between substrate and substrate significantly to improve, so by fexible film substrate from very easily damage in hard substrate dissociates flexible substrate film and on electronic device; On the contrary, if the adhesion of fexible film substrate and hard substrate is excessively weak, in the process of making devices, just there will be the problem that fexible film substrate surprisingly departs from.
In order to overcome above-mentioned difficulty of dissociating, usually between hard substrate and fexible film substrate, inserting specific sacrifice layer, utilizing sacrifice layer to reduce or improving adhesion therebetween.However, the balance still more difficult control of adhesion power, find a kind of be applicable to various experiment, production environment separating technology then more difficult.
Summary of the invention
In order to the above-mentioned shortcoming overcoming prior art is with not enough, the object of the present invention is to provide a kind of fexible film substrate of preparing for flexible display device and substrate separating technology, can simply, low cost, realize substrate rapidly and be separated with substrate.
Object of the present invention is achieved through the following technical solutions:
The fexible film substrate prepared for flexible display device and substrate separating technology, comprise the following steps:
(1) on carrier substrate, prepare fexible film substrate, the junction of fexible film substrate and carrier substrate is processed, make the adhesive force between the fexible film substrate in some region and carrier substrate be more than 2dB, formed and highly stick region; Adhesive force between the fexible film substrate in all the other regions and carrier substrate is 0 or 1dB, is formed lowly to stick region;
(2) on the low fexible film substrate sticking overlying regions, electronic component is prepared;
(3) along the periphery of electronic component, cut downwards from fexible film substrate transverse, form line of cut; The below of described line of cut is lowly stick region;
(4) be separated on fexible film substrate and carrier substrate.
Described carrier substrate is hard substrate or composite base plate; Described composite base plate comprises hard substrate and sacrifice layer; Described sacrifice layer is deposited on hard substrate.
The described junction to fexible film substrate and carrier substrate of step (1) processes, and is specially:
Before preparing fexible film substrate, surface roughening process is carried out to some region of carrier substrate surface, make these regions become height after preparing fexible film substrate and stick region.
The described junction to fexible film substrate and carrier substrate of step (1) processes, and is specially:
After carrier substrate is prepared fexible film substrate, highly stick on the fexible film substrate of overlying regions needing to be formed, carry out HTHP hot-pressing processing.
The described junction to fexible film substrate and carrier substrate of step (1) processes, and is specially:
Before preparing fexible film substrate, some region of carrier substrate surface sputters bonded layer, make these regions become height after preparing fexible film substrate and stick region.
Described surface roughening is treated to sandblasting, Ions Bombardment or chemical reagent corrosion.
Described bonded layer is metallic film or metal-oxide film; Described metal is aluminium, titanium or molybdenum; Described metal oxide is aluminium oxide, indium zinc oxide or cupric oxide.
The material of described hard substrate is glass, metal, plastics or fiber.
The material of described sacrifice layer is silicon nitride, aluminium nitride, gallium nitride or indium nitride.
Described fexible film substrate is thin polymer film; Described polymer is polyimides, PETG, Polyethylene Naphthalate, Merlon, polyether sulfone, polyacrylate, Polyetherimide, polyamide or polyether-ether-ketone.
Compared with prior art, the present invention has the following advantages and beneficial effect:
The fexible film substrate prepared for flexible display device that the present invention proposes and substrate separating technology, adhesion between fexible film substrate and carrier substrate is carried out to the method for differentiation process, region is sticked the low of fexible film substrate, adhesion between fexible film substrate and carrier substrate is less, under regular situation, this fexible film substrate easily dissociates and not damage device from carrier substrate, but easily departs from carrier substrate ahead of time in preparation process; Therefore, stick region at the height of fexible film substrate, present invention enhances the adhesion between fexible film substrate and carrier substrate, thus in preparation process, film integral can firmly be attached on substrate, can not depart from ahead of time.Electronic component is prepared in the low of fexible film substrate and sticks on region, in dissociation process, only need the low region of sticking of electronic component be had to cut out preparation, namely can dissociate smoothly.This separating technology is simple, quick, can not cause negative effect, and cost is low to device performance.
Accompanying drawing explanation
Fig. 1 is the schematic diagram before the fexible film substrate cutting of embodiments of the invention 1.
Fig. 2 is the fexible film substrate of embodiments of the invention 1 schematic diagram when carrying out roughening process.
Fig. 3 is the schematic diagram after the fexible film substrate cutting of embodiments of the invention 1.
Fig. 4 is the schematic diagram of the fexible film substrate of embodiments of the invention 1 when dissociating.
Fig. 5 is the fexible film substrate of embodiments of the invention 2 schematic diagram when carrying out roughening process.
Fig. 6 is the fexible film substrate of embodiments of the invention 3 schematic diagram when carrying out roughening process.
Embodiment
Below in conjunction with embodiment, the present invention is described in further detail, but embodiments of the present invention are not limited thereto.
Embodiment 1
The fexible film substrate prepared for flexible display device of the present embodiment and substrate separating technology, comprise the following steps:
(1) as shown in Figure 1, carrier substrate 100 is prepared fexible film substrate 200, differentiation process is carried out to the junction between fexible film substrate 200 and carrier substrate 100, make the adhesive force between some regional flexibility film-substrate 200 and carrier substrate 100 be more than 2dB, formed and highly stick region 101; Adhesive force between the fexible film substrate in all the other regions and carrier substrate is 0dB or 1dB, is formed lowly to stick region 102.DB is the function unit of industry statement adhesive force, and this formulation standard is formulated by ASTM, and the integer with 0 ~ 5 represents the size of adhesion, wherein the highest adhesive force of 5 representative, and 0 is equivalent to without adhesion.
The present embodiment differentiation process is carried out to the junction between fexible film substrate and carrier substrate, be specially: before preparing fexible film substrate, surface roughening process (as shown in Figure 2) is carried out to some region of carrier substrate surface, makes these regions after preparing fexible film substrate, become height and stick region 101; The optional means of roughening have sandblasting, Ions Bombardment or chemical reagent corrosion.Owing to needing to keep the corresponding low portion smooth sticking region 102 of carrier substrate 100 smooth, before carrying out surface roughening process, mask plate can be set carrier substrate 100 is blocked at the low overlying regions that sticks.
Carrier substrate 100 is hard substrate, and thickness is 1-2000 micron, can be glass, metal, plastics and Fiber Materials; Carrier substrate 100 can be also composite base plate, namely on hard substrate basis, deposits one deck sacrifice layer again, and sacrificial layer thickness is 1-500 micron, can be silicon nitride, aluminium nitride, gallium nitride or indium nitride.
Fexible film substrate 200 thickness is 1-500 micron, material can be polyimides (Polyimide, PI), PETG (Polyethylene terephthalate, PET), Polyethylene Naphthalate (Polyethylene naphthalate, PEN), Merlon (Polycarbonate, PC), polyether sulfone (Polyethersulfone, PES), polyacrylate (Polyacrylate, PAR), Polyetherimide (Polyetherimide), polyamide (Polyamide, or polyether-ether-ketone (polyetheretherketone PA), PEEK) etc.
About the preparation method of carrier substrate, sacrifice layer and fexible film substrate, be all industry routine techniques means, do not repeat them here.
(2) as shown in Figure 1, the low fexible film substrate 200 sticked above region 102 makes electronic component 300.Electronic component can be insulating barrier, resistance, electric capacity, inductance, wire, transistor, diode and combination thereof.The concrete form of electronic component and position, annexation can be selected flexibly according to concrete requirement on devices and arrange, and do not enumerate at this, its preparation method is also industry routine techniques means, does not repeat them here.
(3) along the periphery of electronic component 300, at fexible film substrate 200, lowly stick region 102 and the equitant position of carrier substrate 100, cut vertically downward from fexible film substrate 200 surface, form line of cut 201; The below of described line of cut is lowly stick region 102; As shown in Figure 3.
Cutting mode specifically can select cutting machine cutting, laser cutting, ion etching, plasma bombardment.
(4) as shown in Figure 4, will fexible film substrate 200 and carrier substrate 100 be separated, separate mode specifically can select cylinder or manipulator to be dissociated from substrate 100 by fexible film substrate 200.
After the present embodiment carries out surface roughening process to carrier substrate 100, surface area is increased, and can form tiny gully and hole.In the process preparing fexible film substrate 200, polymer precursor solution can infiltrate through these gullies and hole, solution cured complete after, the contact area of fexible film substrate 200 and carrier substrate 100, and the resistance that increase film-substrate 200 departs from carrier substrate 100 by the part that fexible film substrate 200 extends to gully and hole, be equivalent to improve adhesion.
The substrate prepared for flexible display device of the present embodiment and substrate separating technology, have that substrate is separated with substrate simply, cost is low, fast and do not affect the feature of device performance.
Embodiment 2
The fexible film substrate prepared for flexible display device of the present embodiment and substrate separating technology, further feature is identical with embodiment 1, what difference was step (1) carries out differentiation process to the junction between fexible film substrate and carrier substrate, specifically in the following way:
After carrier substrate 100 is prepared fexible film substrate 200, needing to be formed on the high fexible film substrate 200 sticked above region 101, carry out HTHP hot-pressing processing with thermal probe, as shown in Figure 5.
After the present embodiment is heat-treated fexible film substrate, polymer flexibility film-substrate interval strand near glass transition temperature (350 DEG C ~ 500 DEG C) starts mobile, side reaction phenomenon is aggravated, hydroxyl on such as polyimides at high temperature can form covalent bond with the silicon dioxide in glass carrier substrate, improves adhesion.
The substrate prepared for flexible display device of the present embodiment and substrate separating technology, have that substrate is separated with substrate simply, cost is low, fast and do not affect the feature of device performance.
Embodiment 3
The fexible film substrate prepared for flexible display device of the present embodiment and substrate separating technology, further feature is identical with embodiment 1, what difference was step (1) carries out differentiation process to the junction between fexible film substrate and carrier substrate, specifically in the following way:
Before preparing fexible film substrate 200, some region on carrier substrate 100 surface sputters bonded layer 400, make these regions after preparing fexible film substrate, become height and stick region 101, as shown in Figure 6.
Bonded layer thickness is between 1 ~ 300 micron, and concrete material is metallic film, optional aluminium, titanium or molybdenum film; Bonded layer also can be metal-oxide film, optional aluminium oxide, indium zinc oxide or CuO film.Bonded layer is by direct current or exchange sputtering, is deposited as film by target as sputter to carrier substrate.
Because the low region of sticking of the corresponding fexible film substrate of carrier substrate does not need to deposit bonded layer, so bonded layer needs graphical.Concrete, can arrange mask plate block this Component Vectors substrate at the low overlying regions that sticks before sputtering bonded layer, target like this only can be deposited on height and stick in region; Photoetching process can also be adopted to carry out graphically.
For polyimide flex film-substrate, its presoma is polyamic acid, the bonded layer of acid material to metal or metal oxide has corrosiveness, can form metal complex in hot amidation process, thus strengthens the adhesion of bonded layer and fexible film substrate.On the other hand, because bonded layer adopts sputtering mode to be deposited on carrier substrate, ion bombardment effects in sputter procedure can to a certain degree roughening carrier substrate surface, and the situation in similar embodiment 1, improves the adhesion of bonded layer and carrier substrate equally.Thus, the adhesion of fexible film substrate and carrier substrate is strengthened.
The substrate prepared for flexible display device of the present embodiment and substrate separating technology, have that substrate is separated with substrate simply, cost is low, fast and do not affect the feature of device performance.
Embodiment 4
The present embodiment is prepared a kind of flexible TFT and is driven backboard ia to verify effect of the present invention, and preparation process is as follows:
(1) first, select glass carrier substrate as carrier substrate, first carrier substrate is cleaned.
(2) above carrier substrate, set up the metal mask plate customized in advance, wherein, the low part of sticking region of corresponding fexible film substrate is blocked completely by mask plate.Use sand-blasting machine that material spray Vertical dimension mask is sprayed, sand-blasting abrasive can select glass sand, silastomer husky etc. and the material of carrier substrate material proximate.
(3), after sandblasting, the high part of sticking region of the corresponding fexible film substrate of carrier substrate realizes surface roughening, again cleans carrier substrate.
(4) on carrier substrate, polyimide flex film-substrate is prepared.Concrete, carrier substrate applies polyamide acid solution, adopts the mode of first blade coating spin coating again, until glass baseplate surface is all covered by dissolution homogeneity.Apply complete after, carrier substrate is sent into N
2in the baking oven of atmosphere, film forming is cured to the first body film of polyamic acid, forms solid-state fexible film substrate.
(5), on fexible film substrate, TFT drive circuit is prepared at the low fexible film substrate sticking overlying regions.
(6) along the periphery of TFT drive circuit, with cutting machine in the low position of sticking region and carrier substrate overlap of fexible film substrate, cut downwards from fexible film substrate transverse, avoid being cut to carrier substrate, form line of cut; The below of described line of cut is lowly stick region.
(7) finally fexible film substrate is directly torn from carrier substrate.
In order to contrast effect, different being of preparing another flexible TFT driving backboard ib, ib and ia unique does not carry out the process of any adhesion differentiation, and polyimide flex film-substrate is directly prepared in glass carrier upper surface of base plate.In the process making drive circuit, can see that there are the phenomenons such as obvious tilting, bubbling at polyimide film edge, the severe jamming normal making of device.
Visible, the present invention has that substrate is separated with substrate simply, cost is low, fast and do not affect the feature of device performance.
Embodiment 5
The present embodiment is prepared a kind of flexible TFT and is driven backboard iia to verify effect of the present invention, and preparation process is as follows:
(1) first, select glass substrate as carrier substrate, first carrier substrate is cleaned.
(2) on carrier substrate, polyimide flex film-substrate is prepared.Concrete, carrier substrate applies polyamide acid solution, adopts the mode of first blade coating spin coating again, until carrier substrate surface is all covered by dissolution homogeneity.Apply complete after, carrier substrate is sent into N
2in the baking oven of atmosphere, film forming is cured to the first body film of polyamic acid, forms solid-state fexible film substrate.
(3) use thermal probe in the high part of sticking region of corresponding fexible film substrate, HTHP hot-pressing processing is carried out to fexible film substrate surface.The temperature of thermal probe is 400 DEG C, and average compressing time controls at 20 seconds, and whole process ensures that Overheating Treatment is all carried out in high region of sticking.
(4), on fexible film substrate, low sticking in region prepares TFT drive circuit.
(5) along the periphery of TFT drive circuit, cut in the low position of sticking region and carrier substrate overlap of fexible film substrate with cutting machine, cut vertically downward from fexible film substrate surface, avoid being cut to carrier substrate.
(6) last fexible film substrate is directly torn from carrier substrate.
In order to contrast effect, different being of preparing another flexible TFT driving backboard ib, ib and ia unique does not carry out the process of any adhesion differentiation, after polyimide flex film-substrate is prepared on glass carrier substrate, directly prepares TFT drive circuit.In the process making drive circuit, can see that there are the phenomenons such as obvious tilting, bubbling at polyimide film edge, the severe jamming normal making of device.
Visible, the present invention has that substrate is separated with substrate simply, cost is low, fast and do not affect the feature of device performance.
Embodiment 6
The present embodiment prepares a kind of flexible AMOLED panel iiia, drives backboard and OLED luminescent device containing TFT.
(1) select metal substrate as carrier substrate, before preparing sacrifice layer, first substrate is cleaned.
(2) adopt direct current sputtering to sputter one deck aluminium oxide bonded layer at carrier substrate surface, average thickness is 100 microns.
(3) on bonded layer, one deck positive photoresist is applied.Utilize the mask plate customized in advance, irradiate the corresponding low photoresist sticking region, the low photoresist sticking region dissolves.The corresponding low bonded layer sticking region of acid etching liquid is used to etch.Clean after etching, and take out the photoresist of remainder., complete the graphical of bonded layer.
(4) Polyethylene Naphthalate fexible film substrate is prepared.Concrete, adopt the mode of dip-coating, allow dissolution homogeneity cover carrier substrate surface and bonded layer.Apply complete after, send into N
2film forming is cured in the baking oven of atmosphere.
(5) on fexible film substrate, TFT drive circuit and OLED is prepared.
(6) in TFT drive circuit and OLED periphery, with cutting machine in the low position of sticking region and carrier substrate overlap of fexible film substrate, cut vertically downward from fexible film substrate surface, avoid being cut to carrier substrate, form line of cut; The below of described line of cut is lowly stick region.
(7) last fexible film substrate is directly torn from carrier substrate.
In order to contrast effect, arrange comparative example iiib, unique different being of iiib and iiia does not carry out the process of any adhesion differentiation, and Polyethylene Naphthalate fexible film substrate is directly prepared in metallic carrier upper surface of base plate.In the process making drive circuit, can see that Polyethylene Naphthalate film edge has the phenomenons such as obvious tilting, bubbling, the severe jamming normal making of device.
Visible, the present invention has that substrate is separated with substrate simply, cost is low, fast and do not affect the feature of device performance.
Above-described embodiment is the present invention's preferably execution mode; but embodiments of the present invention are not limited by the examples; change, the modification done under other any does not deviate from Spirit Essence of the present invention and principle, substitute, combine, simplify; all should be the substitute mode of equivalence, be included within protection scope of the present invention.
Claims (10)
1. the fexible film substrate prepared for flexible display device and substrate separating technology, is characterized in that, comprise the following steps:
(1) on carrier substrate, prepare fexible film substrate, the junction of fexible film substrate and carrier substrate is processed, make the adhesive force between the fexible film substrate in some region and carrier substrate be more than 2dB, formed and highly stick region; Adhesive force between the fexible film substrate in all the other regions and carrier substrate is 0 or 1dB, is formed lowly to stick region;
(2) on the low fexible film substrate sticking overlying regions, electronic component is prepared;
(3) along the periphery of electronic component, cut downwards from fexible film substrate transverse, form line of cut; The below of described line of cut is lowly stick region;
(4) be separated on fexible film substrate and carrier substrate.
2. the fexible film substrate prepared for flexible display device according to claim 1 and substrate separating technology, it is characterized in that, described carrier substrate is hard substrate or composite base plate; Described composite base plate comprises hard substrate and sacrifice layer; Described sacrifice layer is deposited on hard substrate.
3. the fexible film substrate prepared for flexible display device according to claim 1 and 2 and substrate separating technology, it is characterized in that, the described junction to fexible film substrate and carrier substrate of step (1) processes, and is specially:
Before preparing fexible film substrate, surface roughening process is carried out to some region of carrier substrate surface, make these regions become height after preparing fexible film substrate and stick region.
4. the fexible film substrate prepared for flexible display device according to claim 1 and 2 and substrate separating technology, it is characterized in that, the described junction to fexible film substrate and carrier substrate of step (1) processes, and is specially:
After carrier substrate is prepared fexible film substrate, highly stick on the fexible film substrate of overlying regions needing to be formed, carry out HTHP hot-pressing processing.
5. the fexible film substrate prepared for flexible display device according to claim 1 and 2 and substrate separating technology, it is characterized in that, the described junction to fexible film substrate and carrier substrate of step (1) processes, and is specially:
Before preparing fexible film substrate, some region of carrier substrate surface sputters bonded layer, make these regions become height after preparing fexible film substrate and stick region.
6. the fexible film substrate prepared for flexible display device according to claim 3 and substrate separating technology, it is characterized in that, described surface roughening is treated to sandblasting, Ions Bombardment or chemical reagent corrosion.
7. the fexible film substrate prepared for flexible display device according to claim 5 and substrate separating technology, it is characterized in that, described bonded layer is metallic film or metal-oxide film; Described metal is aluminium, titanium or molybdenum; Described metal oxide is aluminium oxide, indium zinc oxide or cupric oxide.
8. the fexible film substrate prepared for flexible display device according to claim 2 and substrate separating technology, it is characterized in that, the material of described hard substrate is glass, metal, plastics or fiber.
9. the fexible film substrate prepared for flexible display device according to claim 2 and substrate separating technology, it is characterized in that, the material of described sacrifice layer is silicon nitride, aluminium nitride, gallium nitride or indium nitride.
10. the fexible film substrate prepared for flexible display device according to claim 1 and substrate separating technology, it is characterized in that, described fexible film substrate is thin polymer film; Described polymer is polyimides, PETG, Polyethylene Naphthalate, Merlon, polyether sulfone, polyacrylate, Polyetherimide, polyamide or polyether-ether-ketone.
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Cited By (8)
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| CN104934371A (en) * | 2015-03-09 | 2015-09-23 | 友达光电股份有限公司 | Flexible display panel and manufacturing method thereof |
| CN107195658A (en) * | 2017-05-25 | 2017-09-22 | 上海天马微电子有限公司 | Flexible base board and preparation method thereof |
| CN108336227A (en) * | 2018-01-19 | 2018-07-27 | 云谷（固安）科技有限公司 | Substrat structure of display screen and preparation method thereof, display screen, flexible display apparatus and preparation method thereof |
| CN108346612A (en) * | 2017-01-25 | 2018-07-31 | 元太科技工业股份有限公司 | The manufacturing method of flexible electronic device |
| CN108962761A (en) * | 2018-06-05 | 2018-12-07 | 信利半导体有限公司 | A kind of COF preparation method |
| WO2019080241A1 (en) * | 2017-10-27 | 2019-05-02 | 武汉华星光电半导体显示技术有限公司 | Display panel motherboard and method for cutting display panel motherboard |
| CN110739337A (en) * | 2019-10-24 | 2020-01-31 | 云谷（固安）科技有限公司 | Flexible substrate, display panel and preparation method of display panel |
| CN110993568A (en) * | 2019-10-25 | 2020-04-10 | 京东方科技集团股份有限公司 | Display device manufacturing method and display device |
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