CN111370454B - Method for manufacturing stretchable display device and stretchable display device - Google Patents
Method for manufacturing stretchable display device and stretchable display device Download PDFInfo
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- CN111370454B CN111370454B CN202010190955.3A CN202010190955A CN111370454B CN 111370454 B CN111370454 B CN 111370454B CN 202010190955 A CN202010190955 A CN 202010190955A CN 111370454 B CN111370454 B CN 111370454B
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- 238000000034 method Methods 0.000 title claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 239000000758 substrate Substances 0.000 claims abstract description 127
- 239000011148 porous material Substances 0.000 claims abstract description 106
- 238000004806 packaging method and process Methods 0.000 claims abstract description 49
- 230000002093 peripheral effect Effects 0.000 claims abstract description 18
- 238000005538 encapsulation Methods 0.000 claims description 34
- 238000002955 isolation Methods 0.000 claims description 22
- 238000005192 partition Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 239000004417 polycarbonate Substances 0.000 claims description 6
- -1 polyethylene naphthalate Polymers 0.000 claims description 6
- 230000000903 blocking effect Effects 0.000 claims description 4
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 239000012994 photoredox catalyst Substances 0.000 claims description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 235
- 230000004888 barrier function Effects 0.000 description 12
- 238000000059 patterning Methods 0.000 description 12
- 238000000926 separation method Methods 0.000 description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 6
- 229910052760 oxygen Inorganic materials 0.000 description 6
- 239000001301 oxygen Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 239000011521 glass Substances 0.000 description 5
- 238000005530 etching Methods 0.000 description 3
- 238000001704 evaporation Methods 0.000 description 2
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- 239000002346 layers by function Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The invention provides a method for manufacturing a stretchable display device and the stretchable display device, wherein the stretchable display device comprises the following components: the flexible substrate is provided with a plurality of open pore structures, and the flexible substrate is divided into: a plurality of islands distributed in an array and spaced apart from each other, and a plurality of connection bridges connecting adjacent islands; a plurality of display pixel units distributed in an array, wherein at least one display pixel unit is arranged on each island; a plurality of signal wires electrically connected with the display pixel units and arranged on the connecting bridge; and the packaging layer is used for packaging the island and the connecting bridge, covers the island and the multi-film structure of the connecting bridge, and also covers the peripheral side wall of the open pore structure. The manufacturing method of the stretchable display device and the stretchable display device can improve the packaging reliability of the display device, particularly the packaging performance of the side face of the display pixel unit, simplify the process, save the productivity and improve the process yield.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a method for manufacturing a stretchable display device and a stretchable display device.
Background
Currently, flexible display devices are evolving from two-dimensional, variable to three-dimensional, variable forms. To increase the amount of deformability of a flexible display device, a series of open cell structures are typically provided on a flexible substrate, divided into: the island region where the pixel unit is located and the bridge region where the connecting line is located are displayed, so that the display device has the tensile deformation performance. When an external force is applied, deformation mainly occurs in the bridge region, and the display pixel units in the island region basically keep the shape. Since the entire panel is divided into islands distributed in an array by numerous open cell structures, the organic functional layers (common layers) and cathodes of the OLED display device cannot be open, and thus the display cells of the OLED are exposed to the atmosphere at the sidewalls of the open cell structures and fail rapidly.
In the manufacturing process of the OLED stretchable display device, a flexible substrate is usually formed on a glass carrier, then, each film layer (including a display pixel unit, a signal trace and the like) and a packaging layer are sequentially formed on the flexible substrate, finally, the glass substrate is separated from the flexible substrate, and in the separation process, the packaging layer generates cracks on the side wall of the open pore structure, so that water and oxygen can directly erode the OLED display pixel unit, and the reliability is affected.
Disclosure of Invention
The invention aims to provide a manufacturing method of a stretchable display device and the stretchable display device, which can improve the packaging reliability of the display device, particularly the packaging performance of the side face of a display pixel unit, simplify the process, save the productivity and improve the process yield.
The technical scheme provided by the invention is as follows:
a stretchable display device comprising:
a flexible substrate, a plurality of open pore structures are arranged on the flexible substrate, and the open pore structures divide the flexible substrate into: a plurality of islands distributed in an array and spaced apart from each other, and a plurality of connection bridges connecting adjacent islands;
a plurality of display pixel units distributed in an array, wherein at least one display pixel unit is arranged on each island;
a plurality of signal wires electrically connected with the display pixel units and arranged on the connecting bridge;
and the packaging layer is used for packaging the island and the connecting bridge, covers the island and the multi-film structure of the connecting bridge, and also covers the peripheral side wall of the open pore structure.
In the packaging layer covered by the peripheral side walls of the open-pore structure, at least a part of the packaging layer extends to the center of the open-pore structure along the direction parallel to the flexible substrate at the position corresponding to the film layer where the flexible substrate is located, so as to form an in-pore packaging layer part.
Illustratively, the length of the in-hole encapsulation layer portion in a direction parallel to the flexible substrate is 10-30% of the length of the open-cell structure in a direction parallel to the flexible substrate. Illustratively, a partition groove structure is respectively arranged on the multi-film layer structures of the island and the connecting bridge around the periphery of each open pore structure; the isolating groove structure on the island is a first isolating groove, the isolating groove structure on the connecting bridge is a second isolating groove, and the packaging layer covered on the island covers the side wall of the first isolating groove to form a continuous structure; the packaging layer covered on the connecting bridge covers the side wall of the second isolation groove to form a continuous structure.
Illustratively, at least a portion of the display pixel unit includes:
a first electrode disposed over the flexible substrate;
a light emitting layer disposed over the first electrode;
and a second electrode disposed over the light emitting layer; wherein,
the first isolation groove is opened from the upper surface of the multi-film structure on the island and penetrates at least the light-emitting layer and the film layer where the second electrode is located, so that the film layer including the light-emitting layer and the second electrode is disconnected at the first isolation groove.
Illustratively, each island includes a display pixel region and a non-display region around the display pixel region, and the first isolation groove is disposed in the non-display region;
and at least two first isolation grooves are arranged in the island and adjacent to any side edge of the open pore structure, and one second isolation groove is arranged in the connecting bridge and adjacent to any side edge of the open pore structure.
A method of manufacturing a stretchable display device for manufacturing a stretchable display device as described above, the method comprising:
providing a rigid carrier plate;
forming a laser sacrificial layer on the rigid carrier plate in a region corresponding to an open pore structure of the stretchable display device, wherein a gap is reserved between the laser sacrificial layer and the edge of the region corresponding to the open pore structure;
forming a flexible substrate on the rigid carrier plate, wherein the flexible substrate covers the laser sacrificial layer;
forming an open pore structure, an island, a connecting bridge and a multi-film structure on the island and the connecting bridge on the flexible substrate, forming a buffer layer with a plurality of film layers on the laser sacrificial layer, and disconnecting each film layer in the buffer layer from each film layer on the island and the connecting bridge;
packaging the flexible substrate to form a continuous packaging layer, wherein the continuous packaging layer is of a continuous structure and covers the island, the connecting bridge, the side wall of the open pore structure, the buffer layer and a gap between the open pore structure and the buffer layer;
and separating the flexible substrate from the rigid carrier plate by adopting laser, and removing the buffer layer.
Illustratively, separating the flexible substrate from the rigid carrier plate by laser, and removing the buffer layer, specifically including:
upon removal of the buffer layer, the encapsulation layer at the gap between the open pore structure and the buffer layer is at least partially preserved to form an in-pore encapsulation layer portion.
Illustratively, a gap remains between the laser sacrificial layer and the edge of the region corresponding to the open-pore structure, and the length of the gap in the direction parallel to the flexible substrate is 10-30% of the length of the open-pore structure in the direction parallel to the flexible substrate.
Illustratively, the flexible substrate is made of one or more of the following materials: polyimide PI, polycarbonate PC, polyethylene naphthalate and polyethylene terephthalate;
the laser sacrificial layer is made of one or more of the following materials: amorphous silicon, silicon oxide, silicon nitride, and aluminum oxide.
The beneficial effects brought by the invention are as follows:
the stretchable display device provided by the embodiment of the invention is manufactured by adopting the method, the laser sacrificial layer is arranged between the rigid carrier plate and the flexible substrate in the area corresponding to the open pore structure, and then the flexible substrate and each film layer on the flexible substrate are sequentially manufactured on the laser sacrificial layer, so that a buffer layer can be formed in the open pore structure.
Drawings
Fig. 1 is a schematic plan view showing a stretchable display device provided in an embodiment of the present invention;
fig. 2 is a schematic cross-sectional view showing a stretchable display device according to an embodiment of the present invention;
fig. 3 is a schematic cross-sectional structure diagram of a flexible substrate and a rigid carrier before separation in a manufacturing method of a stretchable display device according to an embodiment of the invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments, which can be made by one of ordinary skill in the art without the need for inventive faculty, are within the scope of the present disclosure, based on the described embodiments of the present disclosure.
Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. Likewise, the terms "a," "an," or "the" and similar terms do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
Before explaining in detail the stretchable display device and the manufacturing method thereof provided by the embodiments of the present invention, it is necessary to explain the following related art:
currently, the planar structure of stretchable display substrates is divided into: island region for placing display pixel unit; a bridge region for wiring the data line and the signal line; and the open pore area is used for realizing the stretching function of the stretchable display substrate. When an external force is applied, deformation mainly occurs in the bridge region, and the display pixel units in the island region basically keep the shape. Since the entire panel is divided into islands distributed in an array by numerous open cell structures, the common layer and cathode of the OLED display device cannot be opened, and thus, the display cells of the OLED are exposed to the atmosphere at the sidewalls of the open cell structures and fail rapidly. In the manufacturing process of the OLED stretchable display device, a flexible substrate is usually formed on a glass carrier, then, each film layer (including a display pixel unit, a signal trace and the like) and a packaging layer are sequentially formed on the flexible substrate, finally, the glass substrate is separated from the flexible substrate, and in the separation process, the packaging layer generates cracks on the side wall of the open pore structure, so that water and oxygen can directly erode the OLED display unit, and the reliability is affected.
In view of the above technical problems, embodiments of the present invention provide a method for manufacturing a stretchable display device and a stretchable display device manufactured by using the method, which can improve packaging reliability of the stretchable display device, particularly packaging performance of a side surface of a display pixel unit, simplify a process, save productivity, and improve a process yield.
The stretchable display device provided by the embodiment of the invention is manufactured by adopting the manufacturing method of the stretchable display device provided by the embodiment of the invention, the encapsulation layer on the peripheral side wall of the open pore structure can be ensured to be complete and free of cracks, so that the encapsulation reliability is ensured, and the method has the advantages of simplifying the process, saving the productivity and improving the process yield. The structure of the stretchable display device provided by the embodiment of the invention is described below.
Fig. 1 to 2 are schematic structural views of an exemplary embodiment of a stretchable display device manufactured by the method for manufacturing a stretchable display device according to the present invention. As shown in fig. 1 and 2, a stretchable display device provided in an exemplary embodiment of the present invention includes:
a flexible substrate 100, wherein a plurality of open-cell structures 200 are arranged on the flexible substrate 100, and the open-cell structures 200 divide the flexible substrate 100 into: a plurality of islands 300 distributed in an array and spaced apart from each other, and a plurality of connection bridges 400 connecting adjacent islands 300;
a plurality of display pixel units distributed in an array, at least one display pixel unit being disposed on each island 300;
a plurality of signal wires 500 electrically connected to the display pixel units and disposed on the connection bridge 400;
and an encapsulation layer 600 encapsulating the island 300 and the connection bridge 400, wherein the encapsulation layer 600 covers the multi-film structure of the island 300 and the connection bridge 400 and also covers the peripheral side walls of the open-pore structure 200.
The package layer 600 of the stretchable display device provided by the invention not only can cover the multi-film structure on the island 300 and the connection bridge 400 (i.e. cover the display pixel units on the island 300 and the signal wires 500 on the connection bridge 400), but also can cover the peripheral side walls of the open pore structure 200, that is, package the side surfaces of the display pixel units on the island 300, thereby preventing water and oxygen from corroding the display pixel units on the island 300 from the side surfaces of the open pore structure 200, and further improving the package reliability of the stretchable display device.
The encapsulation layer 600 in the stretchable display device needs to encapsulate the peripheral sides of the open cell structure 200, and the following problems may occur when using the conventional manufacturing method of the stretchable display device:
the manufacturing process of the conventional stretchable display device using the related art is as follows:
firstly, forming a flexible substrate on a rigid carrier plate; then forming a plurality of film layers such as an open pore structure, a display pixel unit and a signal wiring on the flexible substrate; then, packaging is carried out, and a packaging layer is required to be formed on the side face and the bottom face of the open pore structure; finally, the flexible substrate and the rigid carrier are separated, but when the flexible substrate and the rigid carrier are separated, the packaging layer at the open pore structure can generate cracks, so that the open pore structure penetrates through the whole display device, the packaging layer at the bottom surface of the open pore structure is in direct contact with the rigid carrier, and when the flexible substrate and the rigid carrier are separated, the packaging layer cracks at the open pore structure can be directly generated at the side surface of the open pore structure, so that water and oxygen directly erode the side surface of the display pixel unit, and the reliability result is poor.
In the present invention, in order to form the encapsulation layer 600 on the peripheral sidewall of the open-pore structure 200 of the stretchable display device and to avoid the crack of the encapsulation layer 600 on the peripheral sidewall of the open-pore structure 200, the method comprises the following steps:
step S1, providing a rigid carrier 700;
step S2, forming a laser sacrificial layer 810 on the rigid carrier 700 in a region corresponding to the open-pore structure 200 of the stretchable display device, wherein a gap is reserved between the laser sacrificial layer 810 and the edge of the region corresponding to the open-pore structure 200;
step S3, forming a flexible substrate 100 on the rigid carrier plate 700, wherein the flexible substrate 100 covers the laser sacrificial layer 810;
step S4, forming an open-pore structure 200, an island 300, a connecting bridge 400 and a multi-film structure on the island 300 and the connecting bridge 400 on the flexible substrate 100, and forming a buffer layer 800 with a plurality of film layers on the laser sacrificial layer 810, wherein each film layer in the buffer layer 800 is disconnected from each film layer on the island 300 and the connecting bridge 400;
step S5, packaging the flexible substrate 100 to form a continuous packaging layer 600, wherein the continuous packaging layer 600 is a continuous structure and covers the islands 300, the connection bridges 400, the side walls of the open pore structure 200, the buffer layer 800 and the gaps d between the open pore structure 200 and the buffer layer 800;
step S6, separating the flexible substrate 100 from the rigid carrier plate 700 by using laser, and removing the buffer layer 800.
By adopting the method to manufacture the stretchable display device provided by the embodiment of the invention, the laser sacrificial layer 810 is arranged in the area corresponding to the open pore structure 200 between the rigid carrier plate 700 and the flexible substrate 100, and then the flexible substrate 100 and each film layer on the flexible substrate 100 are sequentially manufactured on the laser sacrificial layer 810, so that the buffer layer 800 can be formed in the open pore structure 200, and the laser sacrificial layer 810 of the buffer layer 800 is positioned between the flexible substrate 100 and the rigid carrier plate 700 in the open pore structure 200, so that when the rigid carrier plate 700 is separated from the flexible substrate 100, the buffer layer 800 has larger absorptivity to laser when the laser sacrificial layer 810 is separated from the rigid carrier plate 700, and is more difficult than the flexible substrate 100, the buffer layer 800 can provide a stress concentration area, so that separation occurs near the side surface of the buffer layer 800 at the stress concentration position and is far away from the peripheral side wall of the open pore structure 200, thereby avoiding separation cracks from generating on the peripheral side wall of the open pore structure 200, and further improving the reliability of the side packaging of the peripheral side wall of the open pore structure 200, further simplifying the reliability of the stretchable display device, and particularly improving the reliability of the packaging process, and the reliability of the display device, and improving the packaging yield.
In addition, in the method for manufacturing a stretchable device according to the present invention, a buffer layer 800 is formed in the open-pore structure 200, and the buffer layer 800 is a multi-film structure formed by patterning a laser sacrificial layer 810 while forming each film on the flexible substrate 100, for example: as shown in fig. 3, the buffer layer 800 includes: the flexible substrate 100 formed on the laser sacrificial layer 810, the barrier layer 820 formed on the flexible substrate 100, the flat layer 830 formed on the flexible substrate 100, the second electrode layer 840 formed on the flat layer 830, and the like, wherein the flexible substrate 100 layer in the buffer layer 800 and the flexible substrate 100 on the island 300 and the connection bridge 400 are formed by the same patterning process, the barrier layer 820 in the buffer layer 800 and the barrier layer 820 on the island 300 and the connection bridge 400 are formed by the same patterning process, the flat layer 830 in the buffer layer 800 and the flat layer 830 on the island 300 and the connection bridge 400 are formed by the same patterning process, and the second electrode layer 840 in the buffer layer 800 and the second electrode 840 on the island 300 are formed by the same patterning process. Because the area ratio of the open pore structure 200 in the display device is 10-20% in the related art, by adopting the above scheme, in the stretchable display device provided by the embodiment of the invention, when the film layer is perforated, the buffer layer 800 part of each film layer can not be perforated, so that the productivity of large-area perforation can be avoided in the process.
The stretchable device provided by the present invention is described in detail below.
In an exemplary embodiment, as shown in fig. 2, at least a portion of the encapsulation layer 600 covered by the peripheral side walls of the open-pore structure 200 extends toward the center of the open-pore structure 200 in a direction parallel to the flexible substrate 100 at a position corresponding to the film layer where the flexible substrate 100 is located, so as to form an in-pore encapsulation layer portion 600a.
In the above-mentioned scheme, in the method for manufacturing the stretchable display device, before the rigid carrier 700 is separated from the flexible substrate 100 by laser, the buffer layer 800 is disposed in the area where the open hole structure 200 of the rigid carrier 700 is located, and then the flexible substrate 100 is covered on the buffer layer 800 of the rigid carrier 700, and since the separation difficulty of the laser sacrificial layer 810 of the buffer layer 800 and the rigid carrier 700 is greater than that of the flexible substrate 100 and the rigid carrier 700, separation cracks may occur on the side surface of the buffer layer 800 and far away from the side wall of the open hole structure 200, so that a portion of the package layer 600 between the side wall of the open hole structure 200 and the side surface of the buffer layer 800 is reserved, and the portion 600a of the package layer 600 is formed on the side wall of the open hole structure 200, that is, on the side surface of the display pixel unit of the island 300, so that the effective package distance L0 is increased, and the reliability time, high temperature and high humidity test is performed. In the high temperature and high humidity test, the length of the in-hole encapsulation layer portion 600a in the direction parallel to the flexible substrate 100 (i.e., the effective encapsulation distance L0 can be extended) is 50 μm in an environment where the temperature is 60 ℃ and the humidity is 90% rh, and the performance is kept for about 500hrs/.
In an exemplary embodiment, the length L0 of the in-hole encapsulation layer portion 600a in a direction parallel to the flexible substrate 100 is 10 to 30% of the length of the open-pore structure 200 in a direction parallel to the flexible substrate 100.
The length of the in-hole encapsulation layer 600a in the direction parallel to the flexible substrate 100 is not limited thereto, and the length L0 thereof may be determined by parameters such as the material of the laser sacrificial layer 810, the length of the buffer layer 800 in the direction parallel to the flexible substrate 100, the gap d between the side surface of the buffer layer 800 and the side wall of the open-pore structure 200, and when the gap d between the buffer layer 800 and the open-pore structure 200 is 10-30% of the length L of the open-pore structure 200 in the direction parallel to the flexible substrate 100, the continuous integrity of the encapsulation layer on the side surface of the open-pore structure in the direction perpendicular to the flexible substrate may be maintained, thereby ensuring the reliability of encapsulation.
Further, as shown in fig. 2 and 3, in an exemplary embodiment, a partition groove structure is provided on the multi-film layer structures of the islands 300 and the connection bridges 400, respectively, around the periphery of each of the open-pore structures 200; and the isolating slot structure on the island 300 is a first isolating slot 910, the isolating slot structure on the connecting bridge 400 is a second isolating slot 920, and the encapsulation layer 600 covered on the island 300 covers the side wall of the first isolating slot 910 to form a continuous structure; the encapsulation layer 600 covered on the connection bridge 400 covers the sidewalls of the second isolation trench 920 to form a continuous structure.
By adopting the above scheme, the partition groove structure is arranged around the open pore structure 200, so that the light emitting layer of the display pixel unit on the island 300 is disconnected at the edge of the open pore structure 200, thereby ensuring the packaging reliability.
In an exemplary embodiment, as shown in fig. 2, at least part of the display pixel unit includes:
a first electrode 801 disposed over the flexible substrate 100;
a light emitting layer 802 disposed over the first electrode;
and a second electrode 840 disposed over the light emitting layer; wherein,
the first isolation groove 910 is opened from the upper surface of the multi-film structure on the island 300 and penetrates at least the light emitting layer and the film layer where the second electrode 840 is located, so that the film layer including the light emitting layer and the second electrode 840 is broken at the first isolation groove 910.
With the above-mentioned scheme, the stretchable display device provided by the embodiment of the invention may be an OLED stretchable display device, and the display pixel unit may include the first electrode 801, the organic light emitting layer 802 and the second electrode 840, where the partition groove structure on the island 300, that is, the first partition groove 910, in order to ensure the side packaging property of the display pixel unit, at least the light emitting layer and the second electrode 840 are disconnected in the first partition groove 910.
Further, in an exemplary embodiment, the stretchable display device may further include: a barrier layer 820 (barrier) formed on the flexible substrate, e.g., SIN, SIO, etc., for improving the resistance of the display device to oxygen and water; AND an active layer (P-Si) 807, a Gate layer 1 (Gate 1) 804, a Gate layer 2 (Gate 2), an Interlayer Insulating Layer (ILD) 805, a Source Drain (SD) 806, a planarization layer 830 (PLN), a first electrode layer (AND) 801, a Pixel Defining Layer (PDL) 803, a support layer (PS), AND the like formed over the barrier layer 820. Further, in an exemplary embodiment, the flexible substrate 100 is made of one or more of the following materials: polyimide PI, polycarbonate PC, polyethylene naphthalate and polyethylene terephthalate; the laser sacrificial layer 810 is made of one or more of the following materials: amorphous silicon, silicon oxide, silicon nitride, and aluminum oxide.
The opening size of the first isolation groove 910 is smaller than the groove bottom size, that is, the first isolation groove 910 has a groove body structure with a wide top and a narrow bottom, so that a film layer formed by subsequent evaporation in the first isolation groove 910 can be formed, for example: the OLED light emitting layer and common electrode (organic functional layer) are disconnected at the first barrier groove 910, blocking the path of water oxygen intrusion. The partition groove structure can be obtained by etching an inorganic layer and an organic layer or by etching a metal layer, for example: the isolation trench structure is not limited to the above, and may be formed by using the barrier layer 820 and the flat layer 830 (sin+pln), or formed by using the barrier layer 820 and the flexible substrate 100 (sin+pi), or formed by using a source drain metal layer (SD), or the like.
Further, as shown in fig. 2, in an exemplary embodiment, each of the islands 300 includes a display pixel region and a non-display region located around the display pixel region, and the first partition groove 910 is provided in the non-display region; and at least two of the first blocking grooves 910 provided adjacent to either side of the open-cell structure 200 in the island 300, and one of the second blocking grooves 920 provided adjacent to either side of the open-cell structure 200 in the connecting bridge 400.
With the above solution, in order to better package the display pixel unit on the island 300, and combine the factors such as the structural space of the island 300 and the connection bridge 400, at least two first isolation grooves 910 are provided in the island 300, and one second isolation groove 920 is provided on the connection bridge 400.
It will be understood that, in practical applications, only one first isolation groove 910 may be provided on the island 300, or a plurality of first isolation grooves 910 may be provided, which is not limited thereto.
The method for manufacturing the stretchable display device provided by the embodiment of the invention is used for manufacturing the stretchable display device provided by the embodiment of the invention, and comprises the following steps:
step S1, providing a rigid carrier 700;
step S2, forming a laser sacrificial layer 810 on the rigid carrier 700 in a region corresponding to the open-pore structure 200 of the stretchable display device, wherein a gap d is reserved between the laser sacrificial layer 810 and the edge of the region corresponding to the open-pore structure 200;
step S3, forming a flexible substrate 100 on the rigid carrier plate 700, wherein the flexible substrate 100 covers the laser sacrificial layer 810;
step S4, forming an open-pore structure 200, an island 300, a connecting bridge 400 and a multi-film structure on the island 300 and the connecting bridge 400 on the flexible substrate 100, and forming a buffer layer 800 with a plurality of film layers on the laser sacrificial layer 810, wherein each film layer in the buffer layer 800 is disconnected from each film layer on the island 300 and the connecting bridge 400;
step S5, as shown in fig. 3, encapsulating the flexible substrate 100 to form a continuous encapsulation layer 600, where the continuous encapsulation layer 600 is a continuous structure and covers the islands 300, the connection bridges 400, the sidewalls of the open-pore structure 200, the buffer layer 800, and the gap d between the open-pore structure 200 and the buffer layer 800;
step S6, separating the flexible substrate 100 from the rigid carrier 700 by using laser, and removing the buffer layer 800, thereby obtaining the stretchable display device shown in fig. 2.
In the step S1, the rigid carrier 700 may be a glass carrier or a carrier made of other rigid materials;
in the step S2, the laser sacrificial layer 810 is formed on the rigid carrier 700, where the laser sacrificial layer 810 may have a relatively large absorptivity to laser light, and the laser sacrificial layer 810 may be formed in a region corresponding to the open-pore structure 200 of the stretchable display device by patterning, for example, patterning such as etching or evaporation, and a gap d is reserved between the laser sacrificial layer 810 corresponding to each open-pore structure 200 and an edge of the region corresponding to the open-pore structure 200, and a length of the reserved gap d in a direction parallel to the flexible substrate is 10-30% of a length L of the open-pore structure in a direction parallel to the flexible substrate, so that a continuous integrity of the encapsulation layer on the side of the open-pore structure in a direction perpendicular to the flexible substrate may be maintained, thereby ensuring reliability of encapsulation.
By adopting the method to manufacture the stretchable display device provided by the embodiment of the invention, the laser sacrificial layer 810 is arranged in the area corresponding to the open pore structure 200 between the rigid carrier 700 and the flexible substrate 100, and then the flexible substrate 100 and each film layer on the flexible substrate 100 are sequentially manufactured on the laser sacrificial layer 810, so that the buffer layer 800 can be formed in the open pore structure 200, and the laser sacrificial layer 810 of the buffer layer 800 is positioned between the flexible substrate 100 and the rigid carrier 700 in the open pore structure 200, so that when the rigid carrier 700 is separated from the flexible substrate 100, the buffer layer 800 has larger absorptivity to laser compared with the rigid carrier 700, and is more difficult to separate from the flexible substrate 100, the buffer layer 800 can provide a stress concentration area, so that separation occurs at the stress concentration position near the side surface of the buffer layer 800 and is far away from the peripheral side wall of the open pore structure 200, thereby avoiding separation from generating the peripheral side wall of the open pore structure 200, and protecting the side surface packaging reliability of the peripheral side wall of the open pore structure 200, thereby improving the packaging reliability of the stretchable display device, in particular the reliability of the pixel, and improving the packaging process reliability, and the yield.
In addition, in the method for manufacturing a stretchable device according to the present invention, a buffer layer 800 is formed in the open-pore structure 200, and the buffer layer 800 is a multi-film structure formed by patterning a laser sacrificial layer 810 while forming each film on the flexible substrate 100, for example: as shown in fig. 3, the buffer layer 800 includes: the flexible substrate 100 layer formed on the laser sacrificial layer 810, the barrier layer 820 formed on the flexible substrate 100 layer, the flat layer 830 formed on the flexible substrate 100 layer, the second electrode 840 layer formed on the flat layer 830, etc., wherein the flexible substrate 100 layer in the buffer layer 800 and the flexible substrate 100 on the island 300 and the connection bridge 400 are formed by the same patterning process, the barrier layer 820 in the buffer layer 800 and the barrier layer 820 on the island 300 and the connection bridge 400 are formed by the same patterning process, the flat layer 830 in the buffer layer 800 and the flat layer 830 on the island 300 and the connection bridge 400 are formed by the same patterning process, and the second electrode 840 layer in the buffer layer 800 and the second electrode 840 on the island 300 are formed by the same patterning process. Because the area ratio of the open pore structure 200 in the display device is 10-20% in the related art, by adopting the above scheme, in the stretchable display device provided by the embodiment of the invention, when the film layer is perforated, the buffer layer 800 part of each film layer can not be perforated, so that the productivity of large-area perforation can be avoided in the process.
In addition, the step S6 specifically includes:
upon removal of the buffer layer 800, the encapsulation layer 600 at the gap d between the open structure 200 and the buffer layer 800 is at least partially preserved to form an in-hole encapsulation layer portion 600a.
In the above-mentioned scheme, in the method for manufacturing the stretchable display device, before the rigid carrier 700 is separated from the flexible substrate 100 by laser, the buffer layer 800 is disposed in the area where the open hole structure 200 of the rigid carrier 700 is located, and then the flexible substrate 100 is covered on the buffer layer 800 of the rigid carrier 700, and since the separation difficulty of the laser sacrificial layer 810 of the buffer layer 800 from the rigid carrier 700 is greater than that of the flexible substrate 100 from the rigid carrier 700, separation cracks may occur on the side surface of the buffer layer 800 and far from the side wall of the open hole structure 200, and therefore, a portion of the encapsulation layer 600 between the side wall of the open hole structure 200 and the side surface of the buffer layer 800 is remained, and the remained portion of the encapsulation layer 600 forms the in-hole encapsulation layer portion 600a on the side wall of the open hole structure 200, that is, on the side surface of the display pixel unit of the island 300. In the above-mentioned scheme, the effective packaging distance L0 can be increased by the packaging layer at the gap between the open-pore structure 200 and the buffer layer 800, so that the integrity and stability of the side packaging layer of the open-pore structure can be maintained, and further the packaging reliability and the product reliability can be improved. In the high temperature and high humidity test, the open cell structure 200 and the buffer layer 800 were tested in an environment with a temperature of 60 ℃ and a humidity of 90% rh, in which the gap distance (i.e., the effective package distance L0 can be extended) was 50 μm, and the performance was maintained for about 500hrs/.
Illustratively, the length of the gap d reserved between the laser sacrificial layer 810 and the edge of the region corresponding to the open-pore structure 200 in the direction parallel to the flexible substrate is 10-30% of the length L of the open-pore structure in the direction parallel to the flexible substrate.
The length of the gap in the direction parallel to the flexible substrate 100 is not limited thereto, and may be determined by parameters such as the material of the laser sacrificial layer 810, the length of the buffer layer 800 in the direction parallel to the flexible substrate 100, the gap d between the side surface of the buffer layer 800 and the side wall of the open pore structure 200, and the like, and when the length of the gap d between the buffer layer 800 and the open pore structure 200 in the direction parallel to the flexible substrate is 10 to 30% of the length of the open pore structure in the direction parallel to the flexible substrate, the continuous integrity of the encapsulation layer on the side surface of the open pore structure in the direction perpendicular to the flexible substrate may be maintained, thereby ensuring the reliability of encapsulation.
In addition, it should be noted that the stretchable device provided by the embodiment of the invention is suitable for a single-layer PI film display device and is also suitable for a double-layer PI film display device.
The following points need to be described:
(1) The drawings of the embodiments of the present disclosure relate only to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.
(2) In the drawings for describing embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced for clarity, i.e., the drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
(3) The embodiments of the present disclosure and features in the embodiments may be combined with each other to arrive at a new embodiment without conflict.
The foregoing is merely specific embodiments of the disclosure, but the protection scope of the disclosure is not limited thereto, and the protection scope of the disclosure should be subject to the claims.
Claims (9)
1. A method of manufacturing a stretchable display device, the method comprising:
providing a rigid carrier plate;
forming a laser sacrificial layer on the rigid carrier plate in a region corresponding to the open pore structure of the stretchable display device, wherein a gap is reserved between the laser sacrificial layer and the edge of the region corresponding to the open pore structure, and the laser sacrificial layer has high absorptivity to laser;
forming a flexible substrate on the rigid carrier plate, wherein the flexible substrate covers the laser sacrificial layer;
forming an open pore structure, an island, a connecting bridge and a multi-film structure on the island and the connecting bridge on the flexible substrate, forming a buffer layer with a plurality of film layers on the laser sacrificial layer, and disconnecting each film layer in the buffer layer from each film layer on the island and the connecting bridge;
packaging the flexible substrate to form a continuous packaging layer, wherein the continuous packaging layer is of a continuous structure and covers the island, the connecting bridge, the side wall of the open pore structure, the buffer layer and a gap between the open pore structure and the buffer layer;
separating the flexible substrate from the rigid carrier plate by laser, and removing the buffer layer, wherein the buffer layer comprises: the device comprises a flexible substrate formed on a laser sacrificial layer, a blocking layer formed on the flexible substrate, a flat layer formed on the flexible substrate, and a second electrode layer formed on the flat layer.
2. The method according to claim 1, wherein the separating the flexible substrate from the rigid carrier plate by laser and removing the buffer layer, in particular comprises:
upon removal of the buffer layer, the encapsulation layer at the gap between the open pore structure and the buffer layer is at least partially preserved to form an in-pore encapsulation layer portion.
3. The method of claim 2, wherein a length of a gap reserved between the laser sacrificial layer and an edge of a region corresponding to the open-pore structure in a direction parallel to the flexible substrate is 10-30% of a length of the open-pore structure in a direction parallel to the flexible substrate.
4. The method of claim 1, wherein the step of determining the position of the substrate comprises,
the flexible substrate is made of one or more of the following materials: polyimide PI, polycarbonate PC, polyethylene naphthalate and polyethylene terephthalate;
the laser sacrificial layer is made of one or more of the following materials: amorphous silicon, silicon oxide, silicon nitride, and aluminum oxide.
5. A stretchable display device manufactured by the method of any of claims 1-4, comprising:
a flexible substrate, a plurality of open pore structures are arranged on the flexible substrate, and the open pore structures divide the flexible substrate into: a plurality of islands distributed in an array and spaced apart from each other, and a plurality of connection bridges connecting adjacent islands;
a plurality of display pixel units distributed in an array, wherein at least one display pixel unit is arranged on each island;
a plurality of signal wires electrically connected with the display pixel units and arranged on the connecting bridge;
the packaging layer is used for packaging the island and the connecting bridge, covers the multi-film structure of the island and the connecting bridge, and also covers the peripheral side wall of the open pore structure;
and at least one part of the packaging layer covered by the peripheral side walls of the open pore structure extends to the center of the open pore structure along the direction parallel to the flexible substrate at the position corresponding to the film layer where the flexible substrate is positioned so as to form an in-hole packaging layer part.
6. The stretchable display device of claim 5, wherein the stretchable display is further configured to stretch the display,
the length of the encapsulation layer part in the hole in the direction parallel to the flexible substrate is 10-30% of the length of the open-pore structure in the direction parallel to the flexible substrate.
7. The stretchable display device of claim 5, wherein the stretchable display is further configured to stretch the display,
a partition groove structure is respectively arranged on the multi-film layer structures of the island and the connecting bridge around the periphery of each open pore structure; the isolating groove structure on the island is a first isolating groove, the isolating groove structure on the connecting bridge is a second isolating groove, and the packaging layer covered on the island covers the side wall of the first isolating groove to form a continuous structure; the packaging layer covered on the connecting bridge covers the side wall of the second isolation groove to form a continuous structure.
8. The stretchable display device of claim 7, wherein the stretchable display is further configured to stretch the display,
at least part of the display pixel unit comprises:
a first electrode disposed over the flexible substrate;
a light emitting layer disposed over the first electrode;
and a second electrode disposed over the light emitting layer; wherein,
the first isolation groove is opened from the upper surface of the multi-film structure on the island and penetrates at least the light-emitting layer and the film layer where the second electrode is located, so that the film layer including the light-emitting layer and the second electrode is disconnected at the first isolation groove.
9. The stretchable display device of claim 8, wherein the stretchable display is further configured to stretch the display,
each island comprises a display pixel area and a non-display area positioned at the periphery of the display pixel area, and the first partition groove is arranged in the non-display area;
and at least two first isolation grooves are arranged in the island and adjacent to any side edge of the open pore structure, and one second isolation groove is arranged in the connecting bridge and adjacent to any side edge of the open pore structure.
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| CN111799392A (en) * | 2020-07-17 | 2020-10-20 | 京东方科技集团股份有限公司 | Display panel, display device and manufacturing method |
| CN113838371B (en) * | 2020-08-21 | 2022-12-27 | 友达光电股份有限公司 | Stretchable pixel array substrate |
| CN112038389A (en) * | 2020-09-16 | 2020-12-04 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display device |
| CN112331077B (en) * | 2020-11-04 | 2022-11-04 | 京东方科技集团股份有限公司 | Display panel, manufacturing method and stretchable display device |
| CN112562515B (en) * | 2020-12-18 | 2022-10-14 | 云谷（固安）科技有限公司 | Stretchable display panel and display device |
| CN112669710A (en) * | 2020-12-30 | 2021-04-16 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN113013361A (en) * | 2021-02-26 | 2021-06-22 | 京东方科技集团股份有限公司 | Stretchable display substrate and manufacturing method thereof |
| CN113270467B (en) * | 2021-05-27 | 2023-10-17 | 武汉华星光电半导体显示技术有限公司 | Display panel and preparation method thereof |
| CN113724590A (en) * | 2021-08-24 | 2021-11-30 | 武汉华星光电半导体显示技术有限公司 | Stretchable display panel |
| CN113936557A (en) * | 2021-10-15 | 2022-01-14 | 业成科技（成都）有限公司 | Display device |
| CN117898040A (en) * | 2022-08-16 | 2024-04-16 | 京东方科技集团股份有限公司 | Display panel, stretchable display panel and display device |
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