CN106129088A - A kind of display floater and preparation method, display device - Google Patents
A kind of display floater and preparation method, display device Download PDFInfo
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- CN106129088A CN106129088A CN201610581600.0A CN201610581600A CN106129088A CN 106129088 A CN106129088 A CN 106129088A CN 201610581600 A CN201610581600 A CN 201610581600A CN 106129088 A CN106129088 A CN 106129088A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/88—Dummy elements, i.e. elements having non-functional features
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
Abstract
This application provides a kind of display floater and preparation method, display device, in order to reduce flexible base board thermal deformation under high-temperature technology, thus improve the yield of flexible product, and then the cost of reduction flexible product, a kind of display floater that the application provides includes at least one of which flexible compound film and the display layer stacked gradually；Wherein, described flexible compound film includes: heat-sink shell and the main flexible membrane being layered on described heat-sink shell.
Description
Technical field
The application relates to Display Technique field, particularly relates to a kind of display floater and preparation method, display device.
Background technology
Organic EL display panel (Organic Electroluminesence Display, OLED) is relative to liquid crystal
Display screen (Liquid Crystal Display, LCD), has self-luminous, frivolous, wide viewing angle, high brightness, high-contrast, low
The advantage such as driving voltage and quick response is it is considered to be Display Technique of future generation.
Wherein flexible OLED display, due to its low-power consumption, the characteristic such as flexible, durable, answers Wearable device
With bringing far-reaching influence, the constantly infiltration along with individual intelligent terminal is extensively applied by following flexible OLED display.
At present in the manufacturing process of the display floater of flexible OLED display, typically use in hard transparent substrate 1
Make flexible membrane 2, on flexible membrane 2, make display layer 3 the most again (be included on flexible membrane 2 formation thin film transistor backplane layer
(TFT-BP layer) 31, organic luminous layer 32, thin-film encapsulation layer 33), as it is shown in figure 1, before Fig. 1 is the stripping made in prior art
The structural representation of flexible OLED display panel, then peel off hard transparent substrate 1, form flexible OLED display panel, as
Shown in Fig. 2, Fig. 2 is the structural representation of the flexible OLED display panel after the stripping made in prior art.Use this making
Technique makes flexible OLED display panel, and during peeling off hard transparent substrate, flexible membrane is carried out by main use laser
Irradiate so that with the flexible membrane Surface absorption integrating laser carbonization of hard transparent substrate contact, destroy Adhesion Interface between the two, but
Flexible membrane makes flexible membrane be susceptible to thermal deformation with the heat of generation in hard transparent substrate separation process, causes flexible product
Too low at module process section yield, thus cause production cost higher.
Other are needed to use flexible membrane and the flexible product of hard transparent substrate separating technology making, equally exists soft
Property film and hard transparent substrate separation process in the heat that produces make flexible membrane be susceptible to thermal deformation, cause flexible product good
Rate is too low, thus causes the problem that production cost is higher.
Summary of the invention
The embodiment of the present application provides a kind of display floater and preparation method, display device, exists in order to reduce flexible base board
Thermal deformation under high-temperature technology, thus improve the yield of flexible product, and then reduce the cost of flexible product.
A kind of display floater that the embodiment of the present application provides includes at least one of which flexible compound film and the display stacked gradually
Layer；Wherein, described flexible compound film includes: heat-sink shell and the main flexible membrane being layered on described heat-sink shell.
The display floater that the embodiment of the present application provides, including at least one of which flexible compound film stacked gradually and display layer；
Wherein, flexible compound film includes: heat-sink shell and the main flexible membrane being layered on heat-sink shell, due at main flexible membrane away from display layer
Side be provided with heat-sink shell, this heat-sink shell can absorb and be difficult to peeling off the heat produced during hard transparent substrate
Deform upon, therefore, it can reduce flexible base board thermal deformation under high-temperature technology, such that it is able to improve the good of flexible product
Rate, and then reduce the cost of flexible product.
It is preferred that the heat-sink shell that described heat-sink shell is half network；Wherein, described half network is each grid institute
The structure that position is non-hollow out.
Due to the heat-sink shell that heat-sink shell is half network, heat-sink shell stress shape under high-temperature technology so can be reduced
Become, and owing to the contact surface of heat-sink shell Yu main flexible membrane is curved surface, so can reduce Planar Contraction.
It is preferred that the thickness of described heat-sink shell is 3000 angstroms～5000 angstroms.
It is preferred that the material of described heat-sink shell is inorganic siliceous material.
It is preferred that the material of described heat-sink shell is silicon nitride.
It is preferred that described display layer includes thin film transistor backplane layer, organic luminous layer and the thin-film package stacked gradually
Layer.
The embodiment of the present application additionally provides a kind of display device, the above-mentioned display floater provided including the embodiment of the present application.
The display device provided due to the embodiment of the present application have employed above-mentioned display floater, and above-mentioned display floater bag
Include at least one of which flexible compound film and display layer stacked gradually；Wherein, flexible compound film includes: heat-sink shell and be layered in heat absorption
Main flexible membrane on layer is owing to being provided with heat-sink shell at main flexible membrane away from the side of display layer, and this heat-sink shell can absorb in stripping
During hard transparent substrate produce heat and be not susceptible to deformation, therefore, it can reduce flexible base board in high temperature work
Thermal deformation under skill, such that it is able to improve the yield of flexible product, and then reduces the cost of flexible product.
The embodiment of the present application additionally provides the preparation method of a kind of display floater, and the method includes:
Hard transparent substrate is formed auxiliary flexible film；
Described auxiliary flexible film is formed at least one of which flexible compound film；Wherein, described flexible compound film includes: heat absorption
Layer and the main flexible membrane being layered on heat-sink shell；
Described flexible compound film is formed display layer；
Separate described hard transparent substrate and described auxiliary flexible film.
The display floater using the method to prepare includes at least one of which flexible compound film and the display layer stacked gradually；Its
In, flexible compound film includes: heat-sink shell and the main flexible membrane being layered on heat-sink shell, due at main flexible membrane away from display layer
Side is provided with heat-sink shell, and this heat-sink shell can absorb the heat produced during peeling off hard transparent substrate and be difficult to send out
Raw deformation, therefore, it can reduce flexible base board thermal deformation under high-temperature technology, such that it is able to improve the yield of flexible product,
And then reduce the cost of flexible product.
It is preferred that described formation heat-sink shell includes:
Deposition heat-sink shell thin film；
Pass sequentially through grid pattern metallization processes for described heat-sink shell thin film and etch partially technique and form half network
Heat-sink shell；Wherein, described half network is the structure that position is non-hollow out at each grid place.
The heat-sink shell that heat-sink shell is half network using the method to be formed, so can reduce heat-sink shell in high temperature work
Stress deformation under skill, and owing to the contact surface of heat-sink shell Yu main flexible membrane is curved surface, Planar Contraction so can be reduced.
It is preferred that the thickness of the described auxiliary flexible film formed is 200 angstroms～500 angstroms.
It is preferred that the 10 of the thickness of the thickness of the described main flexible membrane formed at least described auxiliary flexible film of formation
Times.
On described flexible compound film, display layer is formed it is preferred that described, including: formed thin on described flexible compound film
Film transistor backsheet layer, organic luminous layer and thin-film encapsulation layer.
It is preferred that described separation described hard transparent substrate and described auxiliary flexible film, including:
Use laser that described auxiliary flexible film is irradiated so that described auxiliary flexible film carbonization；
Separate the auxiliary flexible film after described hard transparent substrate and described carbonization.
Accompanying drawing explanation
Fig. 1 is the structural representation of the flexible OLED display panel before the stripping made in prior art；
Fig. 2 is the structural representation of the flexible OLED display panel after the stripping made in prior art；
The structural representation of a kind of display floater that Fig. 3 provides for the embodiment of the present application；
The top view of heat-sink shell in the display floater that Fig. 4 provides for the embodiment of the present application；
The schematic flow sheet of the preparation method of a kind of display floater that Fig. 5 provides for the embodiment of the present application；
The preparation technology schematic flow sheet of the display floater that Fig. 6 (a)～6 (g) provide for the embodiment of the present application.
Detailed description of the invention
The embodiment of the present application provides a kind of display floater and preparation method, display device, exists in order to reduce flexible base board
Thermal deformation under high-temperature technology, thus improve the yield of flexible product, and then reduce the cost of flexible product.
Below in conjunction with the accompanying drawing in the embodiment of the present application, the technical scheme in the embodiment of the present application is carried out clear, complete
Describe, it is clear that described embodiment is only some embodiments of the present application rather than whole embodiments wholely.Based on
Embodiment in the application, it is every other that those of ordinary skill in the art are obtained under not making creative work premise
Embodiment, broadly falls into the scope of the application protection.
It should be noted that thickness and the shape of each layer do not reflect actual proportions in illustrations, purpose simply signal
Teachings herein is described.
Seeing Fig. 3, a kind of display floater that the embodiment of the present application provides includes at least one of which flexible compound stacked gradually
Film 4 (in Fig. 3, merely illustrating one layer of flexible compound film) and display layer 3；Wherein, described flexible compound film 4 includes: heat-sink shell 41 He
The main flexible membrane 42 being layered on described heat-sink shell.
Owing to being provided with heat-sink shell 41 at main flexible membrane 42 away from the side of display layer 3, this heat-sink shell 41 can absorb
Peel off the heat produced during hard transparent substrate 1 and be not susceptible to deformation, therefore, it can reduce flexible base board at high temperature
Thermal deformation under technique, such that it is able to improve the yield of flexible product, and then reduces the cost of flexible product.
Wherein, the material of heat-sink shell 41 is high temperature resistant and is not susceptible to the material of deformation, and such as inorganic siliceous material is inorganic
Material can be silicon nitride (SiNx), silicon oxide, silicon oxynitride etc., it is preferred that the material of heat-sink shell 41 is silicon nitride.
Main flexible membrane 42 can be polyether sulfone (PES), polyacrylate (PAR), Polyetherimide (PEI), poly-naphthalene diformazan
Acid glycol ester (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl (polyallylate),
Polyimide resin (Polymide, PI), Merlon (PC), Triafol T (TAC), cellulose acetate propionate (CAP)
Or the organic hyaline membrane of insulation that a kind of or combinations thereof in acrylate (acryl) is constituted.
It is preferred that as shown in Figure 3, Figure 4, heat-sink shell 41 is the heat-sink shell of half network；Wherein, described half network
The structure that position is non-hollow out for each grid 411 place.
Wherein, the shape of grid 411 can be rectangle, square, prismatic, circle etc., can set as required, and the application is real
Execute example and be not limited thereof.
Due to the heat-sink shell 41 that heat-sink shell 41 is half network, heat-sink shell 41 so can be reduced under high-temperature technology
Stress deformation, and owing to the contact surface of heat-sink shell 41 with main flexible membrane 42 is curved surface, Planar Contraction so can be reduced.
Certainly, heat-sink shell 41 can also be the heat-sink shell of planar structure, and the embodiment of the present application is also not limited thereof.
It is preferred that as it is shown on figure 3, the thickness h of heat-sink shell 41 is 3000 angstroms～5000 angstroms.
It is preferred that as it is shown on figure 3, display layer 3 includes thin film transistor backplane layer 31, the organic luminous layer 32 stacked gradually
With thin-film encapsulation layer 33.Certainly display layer 3 also can be made up of other film layer, and the embodiment of the present application is not limited to flexible OLED and shows
Showing panel, other flexible product is also suitable.
Based on same inventive concept, the embodiment of the present application additionally provides the preparation method of a kind of display floater, such as Fig. 5 institute
Showing, the method comprises the steps:
S101, in hard transparent substrate formed auxiliary flexible film；
Wherein, hard transparent substrate can be at the bottom of substrate of glass, quartz substrate, crystal base etc..
S102, on auxiliary flexible film formed at least one of which flexible compound film；Wherein, flexible compound film includes: heat-sink shell
With the main flexible membrane being layered on heat-sink shell；
Wherein, the material of heat-sink shell is high temperature resistant and is not susceptible to the material of deformation, such as inorganic siliceous material, inorganic contains
Silicon materials can be silicon nitride, silicon oxide, silicon oxynitride etc., and the thickness of heat-sink shell can be 3000 angstroms～5000 angstroms.
S103, on flexible compound film formed display layer；
S104, separation hard transparent substrate and auxiliary flexible film.
Wherein, auxiliary flexible film and main flexible membrane can be polyether sulfone (PES), polyacrylate (PAR), Polyetherimide
(PEI), PEN (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl
(polyallylate), polyimide resin (PI), Merlon (PC), Triafol T (TAC), cellulose acetate propionate
(CAP) the organic hyaline membrane of insulation that a kind of or combinations thereof or in acrylate (acryl) is constituted.
It is pointed out that the material forming auxiliary flexible film and the material forming main flexible membrane can be identical, it is also possible to
Different.
Include it is preferred that step S102 is formed heat-sink shell:
Deposition heat-sink shell thin film；
Pass sequentially through grid pattern metallization processes for heat-sink shell thin film and etch partially technique and form the heat absorption of half network
Layer；Wherein, half network is the structure that position is non-hollow out at each grid place.
Wherein, grid pattern metallization processes refer to by resist coating, expose, the technique such as development forms lattice.
Etch partially the technique thing that refers to will not to be etched and be etched to perforation, but retain certain thickness (general retain 5%～
60%), non-hollow out i.e. it is etched to.
The thickness of the auxiliary flexible film formed in step S101 can beIt is preferred that formed is auxiliary
The thickness helping flexible membrane is
It is preferred that 10 times of the thickness of the thickness of the main flexible membrane formed at least auxiliary flexible film of formation.
It is preferred that step S103 is formed on flexible compound film display layer, including: on flexible compound film, form thin film
Transistor backsheet layer, organic luminous layer and thin-film encapsulation layer.
It is preferred that step S104 separates hard transparent substrate and auxiliary flexible film, including:
Use laser that auxiliary flexible film is irradiated so that auxiliary flexible film carbonization；
Separate the auxiliary flexible film after hard transparent substrate and carbonization.
Below to use silicon nitride material to make heat-sink shell, polyimide resin (PI) is used to make auxiliary flexible film and master
As a example by flexible membrane, illustrate the preparation technology stream of the display floater that the embodiment of the present application provides in conjunction with accompanying drawing 6 (a)～6 (g)
Journey.
Step one, see Fig. 6 (a), hard transparent substrate 01 is coated with one layer of PI liquid, after baking-curing, form the
One PI film 02, as auxiliary flexible film；
Wherein, the thickness of a PI film 02 isThe temperature of baking-curing PI liquid is T0.
Step 2, see Fig. 6 (b), utilize plasma enhanced chemical vapor deposition (Plasma Enhanced
Chemical Vapor Deposition, PECVD) at the surface of a PI film 02 one layer of silicon nitride (SiNx) film layer 03 of deposition；
Wherein, the thickness of silicon nitride film layer 03 can beThe temperature of silicon nitride film layer 03
For T1.
Step 3, see Fig. 6 (c), for silicon nitride film layer 03, grid pattern metallization processes can be passed through and (such as, be coated with photoetching
Glue, expose, the technique such as development) form the mask 04 of network；
Step 4, see Fig. 6 (d), for silicon nitride film layer 03, utilize mask 04 to perform etching by etching partially technique,
And remove mask 04 after etching, form the silicon nitride film layer 05 of half network, as heat-sink shell；
Wherein, half network is the structure that position is non-hollow out at each grid 06 place；The degree of depth of etching such as may be used
Think the 75% of silicon nitride film layer 03 height.
Step 5, see Fig. 6 (e), the silicon nitride film layer 05 of half network is coated with one layer of PI liquid, solid through overbaking
The 2nd PI film 07 is formed, as main flexible membrane after change；
Wherein, the thickness of the 2nd PI film 07 is at least 10 times of thickness of a PI film 02；The temperature of baking-curing PI liquid
Degree is T2.
It should be noted that the silicon nitride film layer 05 of half network and the 2nd PI film 07 constitute flexible compound film, if needing
Layer flexible composite membrane to be made, can continue to make flexible compound film on the 2nd PI film 07, make follow-up each flexible compound
The step of film is similar to the making step (i.e. step 2 is to step 5) of above-mentioned flexible compound film, and difference is above-mentioned flexible compound
The making step of film is to carry out on auxiliary flexible film, and the making step of follow-up each flexible compound film is soft current master
Carrying out on property film, both do not repeat them here identical step.
Step 6, see Fig. 6 (f), the 2nd PI film 07 is formed thin film transistor backplane layer 08, organic luminous layer 09 and
Thin-film encapsulation layer 010；
Wherein, form thin film transistor backplane layer 08, organic luminous layer 09 and thin-film encapsulation layer 010 is all existing skill
Art, therefore do not repeat them here.
It should be noted that temperature T0 of use, the relation between T1, T2 are in flexible compound film production technique: T0 >=
T1 >=T2, the display layer made on the basis of this flexible compound film (includes thin film transistor backplane layer, organic luminous layer and thin film
Encapsulated layer) temperature conditions that used is all not above T2, in other words, the temperature used during making display floater
Degree is that gradually successively decrease or constant.
Step 7, from hard transparent substrate 01 away from the side of a PI film 02, use laser that the oneth PI film 02 is carried out
Irradiate so that PI film 02 carbonization, separate the PI film after hard transparent substrate 01 and carbonization, obtain display floater, as
Shown in Fig. 6 (g).
Based on same inventive concept, the embodiment of the present application additionally provides a kind of display device, carries including the embodiment of the present application
The above-mentioned display floater of confession.
In sum, in the technical scheme that the embodiment of the present application provides, display floater includes at least one of which stacked gradually
Flexible compound film and display layer；Wherein, flexible compound film includes: heat-sink shell and the main flexible membrane being layered on heat-sink shell, due to
At main flexible membrane, the side of display layer being provided with heat-sink shell, this heat-sink shell can absorb in the mistake peeling off hard transparent substrate
The heat that produces in journey and be not susceptible to deformation, therefore, it can reduce flexible base board thermal deformation under high-temperature technology, thus can
To improve the yield of flexible product, and then reduce the cost of flexible product.
Obviously, those skilled in the art can carry out various change and the modification essence without deviating from the application to the application
God and scope.So, if these amendments of the application and modification belong to the scope of the application claim and equivalent technologies thereof
Within, then the application is also intended to comprise these change and modification.
Claims (13)
1. a display floater, it is characterised in that include at least one of which flexible compound film and the display layer stacked gradually；Wherein,
Described flexible compound film includes: heat-sink shell and the main flexible membrane being layered on described heat-sink shell.
Display floater the most according to claim 1, it is characterised in that described heat-sink shell is the heat-sink shell of half network；
Wherein, described half network is the structure that position is non-hollow out at each grid place.
Display floater the most according to claim 1 and 2, it is characterised in that the thickness of described heat-sink shell be 3000 angstroms～
5000 angstroms.
Display floater the most according to claim 3, it is characterised in that the material of described heat-sink shell is inorganic siliceous material.
Display floater the most according to claim 4, it is characterised in that the material of described heat-sink shell is silicon nitride.
Display floater the most according to claim 1 and 2, it is characterised in that described display layer includes the thin film stacked gradually
Transistor backsheet layer, organic luminous layer and thin-film encapsulation layer.
7. a display device, it is characterised in that include the display floater described in the arbitrary claim of claim 1～6.
8. the preparation method of a display floater, it is characterised in that the method includes:
Hard transparent substrate is formed auxiliary flexible film；
Described auxiliary flexible film is formed at least one of which flexible compound film；Wherein, described flexible compound film includes: heat-sink shell and
The main flexible membrane being layered on heat-sink shell；
Described flexible compound film is formed display layer；
Separate described hard transparent substrate and described auxiliary flexible film.
Method the most according to claim 8, it is characterised in that described formation heat-sink shell includes:
Deposition heat-sink shell thin film；
Pass sequentially through grid pattern metallization processes for described heat-sink shell thin film and etch partially technique and form the heat absorption of half network
Layer；Wherein, described half network is the structure that position is non-hollow out at each grid place.
Method the most according to claim 8 or claim 9, it is characterised in that the thickness of the described auxiliary flexible film of formation is 200
Angstrom～500 angstroms.
11. methods according to claim 10, it is characterised in that the thickness of the described main flexible membrane of formation is at least formed
10 times of thickness of described auxiliary flexible film.
12. methods according to claim 8 or claim 9, it is characterised in that described formation on described flexible compound film shows
Layer, including: on described flexible compound film, form thin film transistor backplane layer, organic luminous layer and thin-film encapsulation layer.
13. methods according to claim 8 or claim 9, it is characterised in that described separation described hard transparent substrate is auxiliary with described
Help flexible membrane, including:
Use laser that described auxiliary flexible film is irradiated so that described auxiliary flexible film carbonization；
Separate the auxiliary flexible film after described hard transparent substrate and described carbonization.
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| CN108963101B (en) * | 2017-11-30 | 2022-08-26 | 广东聚华印刷显示技术有限公司 | Release layer for manufacturing flexible display device and composite substrate |
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| CN109461379A (en) * | 2018-09-28 | 2019-03-12 | 昆山国显光电有限公司 | Display panel and display device |
| TWI777129B (en) * | 2019-02-04 | 2022-09-11 | 美商惠普發展公司有限責任合夥企業 | Electronic display devices |
| CN111628110A (en) * | 2020-06-24 | 2020-09-04 | 京东方科技集团股份有限公司 | Display module and display device |
| WO2021259018A1 (en) * | 2020-06-24 | 2021-12-30 | 京东方科技集团股份有限公司 | Display module and display device |
| US11917859B2 (en) | 2020-06-24 | 2024-02-27 | Chengdu BOE Optoe ctroni Technology Co., Ltd. | Display module and display device |
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