JP2020163602A - Break device of brittle material substrate and parting system - Google Patents

Break device of brittle material substrate and parting system Download PDF

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JP2020163602A
JP2020163602A JP2019063929A JP2019063929A JP2020163602A JP 2020163602 A JP2020163602 A JP 2020163602A JP 2019063929 A JP2019063929 A JP 2019063929A JP 2019063929 A JP2019063929 A JP 2019063929A JP 2020163602 A JP2020163602 A JP 2020163602A
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substrate
brittle material
gripping
scrap
material substrate
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江島谷　彰
Akira Ejimatani
彰 江島谷
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Mitsuboshi Diamond Industrial Co Ltd
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Mitsuboshi Diamond Industrial Co Ltd
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Priority to JP2019063929A priority Critical patent/JP2020163602A/en
Priority to TW109103851A priority patent/TW202035322A/en
Priority to CN202010220948.3A priority patent/CN111747639A/en
Priority to KR1020200036599A priority patent/KR20200115306A/en
Publication of JP2020163602A publication Critical patent/JP2020163602A/en
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • Mechanical Engineering (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

To provide a break device which can efficiently breaks brittle material substrates with end material areas around the product areas.SOLUTION: A break device 1 of brittle material substrate W in which stress is applied to the brittle material substrates W on which scribe lines are formed to divide end material areas from product areas of the brittle material substrates along the scribe lines includes a substrate transfer mechanism 2 for holding and transferring the brittle material substrates W and an end material gripping mechanism 3 for gripping the end material areas of the brittle material substrates, the substrate transfer mechanism 2 has a substrate holding part 222 that holds the brittle material substrates W and a rotating part 221 that rotates the held brittle material substrate W around the axis along the normal of its main surface, and the end material gripping mechanism 3 has a gripping part 310 for gripping the end materials, and the substrate holding part 222 and the gripping part 310 are provided so as to be relatively close to each other.SELECTED DRAWING: Figure 1

Description

本発明は、ガラス基板等の脆性材料基板を分断するために用いる脆性材料基板のブレイク装置及び分断システムに関する。 The present invention relates to a break device and a dividing system for a brittle material substrate used for dividing a brittle material substrate such as a glass substrate.

ガラス基板等の脆性材料基板を分断する加工では、従来、カッターホイールを基板表面に押し付けてスクライブラインを形成し、その後、スクライブラインに沿って外力を印加してスクライブラインから亀裂を進展させることにより、製品の形状に分断している（特許文献１参照）。 In the process of dividing a brittle material substrate such as a glass substrate, conventionally, a cutter wheel is pressed against the substrate surface to form a scribe line, and then an external force is applied along the scribe line to develop a crack from the scribe line. , Divided into product shapes (see Patent Document 1).

近年、液晶ディスプレイパネル等のディスプレイパネル製品の形状は多様化しており、角を曲線にした四角形や曲線のみで構成された形状などのディスプレイパネルの生産が増加している。 In recent years, the shapes of display panel products such as liquid crystal display panels have been diversified, and the production of display panels such as quadrangles with curved corners and shapes composed only of curves is increasing.

WO2002/057192WO2002 / 057192

従来の一般的なブレイク装置では、ブレイクするラインに合わせてテーブル上での基板の位置を変更する必要があった。 In a conventional general breaking device, it is necessary to change the position of the substrate on the table according to the breaking line.

そこで、本発明は、製品領域の周囲に端材領域を有する脆性材料基板を効率よくブレイクできるブレイク装置を提供することを目的とする。 Therefore, an object of the present invention is to provide a break device capable of efficiently breaking a brittle material substrate having a scrap region around a product region.

上記課題を解決するためになされた本発明にかかる脆性材料基板のブレイク装置は、スクライブラインが形成された脆性材料基板に応力を加えて、スクライブラインに沿って脆性材料基板の製品領域から端材領域を分割するブレイク装置であって、脆性材料基板を保持して移送する基板移送機構と、脆性材料基板の端材領域を把持する端材把持機構とを備え、基板移送機構は、脆性材料基板を保持する基板保持部と保持した脆性材料基板をその主面の法線に沿った軸回りに回転させる旋回部を有し、端材把持機構は端材を把持する把持部を有し、基板保持部と把持部とは、相対的に接近離隔可能に設けられている。 The break device for the brittle material substrate according to the present invention, which has been made to solve the above problems, applies stress to the brittle material substrate on which the scrib line is formed, and scraps from the product area of the brittle material substrate along the scrib line. It is a break device that divides a region, and includes a substrate transfer mechanism that holds and transfers the brittle material substrate and an end material gripping mechanism that grips the end material region of the brittle material substrate. The substrate transfer mechanism is a brittle material substrate. It has a substrate holding portion for holding the scrap material and a swivel portion for rotating the held brittle material substrate about an axis along the normal line of the main surface thereof, and the scrap gripping mechanism has a gripping portion for gripping the scrap material and the substrate. The holding portion and the grip portion are provided so as to be relatively close to each other.

また、上記課題を解決するためになされた本発明にかかる脆性材料基板の分断システムは、脆性材料基板にスクライブラインを形成し、スクライブラインが形成された脆性材料基板に応力を加えて、スクライブラインに沿って脆性材料基板の製品領域から端材領域を分割する分断システムであって、脆性材料基板に製品領域から端材領域を分離するためのスクライブラインを形成するスクライブ機構と、脆性材料基板を保持して移送する基板移送機構と、脆性材料基板の端材領域を把持する端材把持機構と、を備え、基板移送機構は、脆性材料基板を保持する基板保持部と保持した脆性材料基板をその主面の法線に沿った軸回りに回転させる旋回部を有し、端材把持機構は端材を把持する把持部を有し、基板保持部と把持部とは、相対的に接近離隔可能に設けられている。 Further, in the brittle material substrate dividing system according to the present invention, which has been made to solve the above problems, a brittle material substrate is formed with a scribing line, and stress is applied to the brittle material substrate on which the brittle material substrate is formed to apply a scribing line. It is a division system that divides the offcut area from the product area of the brittle material substrate along the brittle material substrate, and has a scribing mechanism that forms a scribing line on the brittle material substrate to separate the offcut region from the product area, and a brittle material substrate. The substrate transfer mechanism includes a substrate transfer mechanism for holding and transferring the brittle material substrate and an end material gripping mechanism for gripping the end material region of the brittle material substrate, and the substrate transfer mechanism holds a substrate holding portion for holding the brittle material substrate and a brittle material substrate for holding the brittle material substrate. It has a swivel part that rotates around the axis along the normal line of the main surface, the offcut gripping mechanism has a gripping part that grips the offcut, and the substrate holding part and the gripping part are relatively close to each other. It is provided as possible.

本発明のブレイク装置及び分断システムによれば、基板をその主面の法線の軸回りに回転可能に保持しているので、基板を乗せ換えることなく、製品領域Ｐの周囲の端材領域を効率よく分離することができる。また、端材領域の形状に応じて、基板Ｗの方向及び把持する位置を変更できるため、端材の形状に応じて確実にブレイクできる。 According to the break device and the dividing system of the present invention, the substrate is rotatably held around the axis of the normal of the main surface thereof, so that the scrap area around the product area P can be formed without changing the substrate. It can be separated efficiently. Further, since the direction of the substrate W and the gripping position can be changed according to the shape of the end material region, it is possible to reliably break according to the shape of the end material.

本発明にかかるブレイク装置の一実施形態を示す正面模式図。The front schematic view which shows one Embodiment of the break device which concerns on this invention. 本発明にかかるブレイク装置の基板保持ヘッド周りの平面模式図。The plan view around the substrate holding head of the break device which concerns on this invention. スクライブラインが形成された基板の模式図。The schematic diagram of the substrate on which the scribe line was formed. 本発明にかかるブレイク装置の動作を説明するための模式図。The schematic diagram for demonstrating the operation of the break device which concerns on this invention. 本発明にかかるブレイク装置とスクライブ装置を組み合わせた基板分断システムの正面模式図。The front schematic view of the board dividing system which combined the break device and the scribe device which concerns on this invention.

１．ブレイク装置
１）装置構成
図１に基づいて、本発明に係るブレイク装置の構成を説明する。図１は本発明にかかるブレイク装置の実施形態を示す正面模式図である。 1. 1. Break device 1) Device configuration The configuration of the break device according to the present invention will be described with reference to FIG. FIG. 1 is a front schematic view showing an embodiment of a break device according to the present invention.

ブレイク装置１は、製品の外形に沿ってスクライブラインが形成された基板Ｗを、スクライブラインに沿って分割する装置である。基板Ｗは、ガラス等の脆性材料からなる脆性材料基板であり、例えば液晶パネルである。ブレイク装置１は基板移送機構２と、端材把持機構３と、制御部４とを有する。 The break device 1 is a device that divides a substrate W on which a scribe line is formed along the outer shape of a product along the scribe line. The substrate W is a brittle material substrate made of a brittle material such as glass, and is, for example, a liquid crystal panel. The break device 1 includes a substrate transfer mechanism 2, a scrap gripping mechanism 3, and a control unit 4.

基板移送機構２は、基板Ｗを保持した状態で基板の位置、高さ、傾斜及び方向を変更することができる装置である。基板移送機構２は、ロボットアーム部２１０と、基板保持ヘッド２２０を有する。ロボットアーム部２１０は、図示しないモータを駆動して、基板保持ヘッド２２０の位置、高さ及び傾斜を変更することができる。 The substrate transfer mechanism 2 is a device capable of changing the position, height, inclination, and direction of the substrate while holding the substrate W. The board transfer mechanism 2 has a robot arm portion 210 and a board holding head 220. The robot arm unit 210 can drive a motor (not shown) to change the position, height, and inclination of the substrate holding head 220.

基板保持ヘッド２２０は、旋回部２２１と基板保持部２２２とを有する。基板保持部２２２は、基板Ｗを真空吸着して保持する。旋回部２２１は、図示しないモータを駆動して基板保持部２２２を旋回させる。 The substrate holding head 220 has a swivel portion 221 and a substrate holding portion 222. The substrate holding portion 222 vacuum-sucks and holds the substrate W. The swivel portion 221 drives a motor (not shown) to swivel the substrate holding portion 222.

図２は、基板保持ヘッド２２０周りの平面模式図である。図２に示すように、基板保持ヘッド２２０は、保持した基板Ｗをその主面の法線方向の軸回りに旋回させることができる。 FIG. 2 is a schematic plan view around the substrate holding head 220. As shown in FIG. 2, the substrate holding head 220 can swivel the held substrate W around the axis in the normal direction of its main surface.

端材把持機構３は、基板Ｗの端部を把持する装置である。端材把持機構３は把持部３１０と移動ベース部３２０とを有する。把持部３１０は図示しないアクチュエータにより開閉可能に設けられており、基板Ｗの端部を挟むように把持部３１０を閉じることにより基板Ｗの端材を把持する。移動ベース部３２０は、図示しないアクチュエータにより把持部３１０を基板移送機構２に対して接近および離隔する方向に移動させる。 The end material gripping mechanism 3 is a device that grips the end portion of the substrate W. The scrap gripping mechanism 3 has a gripping portion 310 and a moving base portion 320. The grip portion 310 is provided so as to be openable and closable by an actuator (not shown), and grips the end material of the substrate W by closing the grip portion 310 so as to sandwich the end portion of the substrate W. The moving base portion 320 moves the grip portion 310 in the direction of approaching and separating from the substrate transfer mechanism 2 by an actuator (not shown).

制御部４は、プロセッサ（例えば、ＣＰＵ）と、記憶装置（例えば、ＲＯＭ、ＲＡＭ、ＨＤＤ、ＳＳＤなど）と、各種インターフェース（例えば、Ａ／Ｄコンバータ、Ｄ／Ａコンバータ、通信インターフェースなど）を有するコンピュータシステムである。制御部４は、記憶部（記憶装置の記憶領域の一部又は全部に対応）に保存されたプログラムを実行することで、基板移送機構２と端材把持機構３の動作制御を行う。 The control unit 4 has a processor (for example, CPU), a storage device (for example, ROM, RAM, HDD, SSD, etc.), and various interfaces (for example, A / D converter, D / A converter, communication interface, etc.). It is a computer system. The control unit 4 controls the operation of the substrate transfer mechanism 2 and the scrap gripping mechanism 3 by executing a program stored in the storage unit (corresponding to a part or all of the storage area of the storage device).

２）ブレイク方法
図３は、ブレイク装置１を用いて製品の形状に分割される基板Ｗの模式図である。基板Ｗには製品の形状に沿ったスクライブラインＳ１と、製品の周りの端材を４分割する４本のスクライブラインＳ２とが形成されている。製品領域Ｐは、スクライブラインＳ１で囲まれており、端材が分離されて製品となる領域である。端材領域Ｄ１〜Ｄ４は、スクライブラインＳ１とスクライブラインＳ２に沿って、製品領域Ｐから分離され端材となる領域である。スクライブラインＳ１及びＳ２は、カッターを用いて亀裂を形成するメカニカル加工や、熱応力による亀裂形成、レーザアブレーションによる溝形成、多光子吸収による加工痕の形成などの各種レーザ加工を含む、任意の方法で形成することができる。 2) Break method FIG. 3 is a schematic view of a substrate W divided into product shapes using the break device 1. The substrate W is formed with a scribe line S1 that follows the shape of the product and four scribe lines S2 that divide the scraps around the product into four parts. The product area P is surrounded by the scribe line S1 and is an area in which the offcuts are separated to become a product. The scrap regions D1 to D4 are regions that are separated from the product region P and become scraps along the scribe line S1 and the scribe line S2. The scribe lines S1 and S2 are arbitrary methods including mechanical processing for forming cracks using a cutter, crack formation by thermal stress, groove formation by laser ablation, and formation of processing marks by multiphoton absorption. Can be formed with.

図４を用いて、ブレイク装置１の動作を説明する。まず、基板移送機構２は、基板保持部２２２を用いて、基板Ｗの製品領域Ｐを吸着保持する。 The operation of the break device 1 will be described with reference to FIG. First, the substrate transfer mechanism 2 uses the substrate holding portion 222 to adsorb and hold the product region P of the substrate W.

次いで、基板移送機構２は、ロボットアーム部２１０を駆動して、端材把持機構３が端材領域Ｄ１を把持可能な位置に基板Ｗを移動し、端材把持機構３が端材領域Ｄ１を把持する。このとき、端材領域Ｄ１の形状に応じて、基板Ｗの方向及び位置を調整する。 Next, the substrate transfer mechanism 2 drives the robot arm portion 210 to move the substrate W to a position where the scrap material gripping mechanism 3 can grip the scrap material region D1, and the scrap material gripping mechanism 3 moves the scrap material region D1. To grasp. At this time, the direction and position of the substrate W are adjusted according to the shape of the scrap region D1.

基板把持機構３は、移動ベース部３２０を駆動して、把持部３１０を基板移送機構２から離隔する方向に移動させることにより、製品領域Ｐから端材領域Ｄ１を分離する。 The substrate gripping mechanism 3 separates the scrap region D1 from the product region P by driving the moving base portion 320 to move the grip portion 310 in a direction away from the substrate transfer mechanism 2.

端材把持機構３は、把持部３１０を開いて端材領域Ｄ１を下方に落下させる。 The end material gripping mechanism 3 opens the gripping portion 310 and drops the end material region D1 downward.

次に、旋回部２２１は、基板保持部２２２を旋回させて、端材領域Ｄ２が端材把持機構３に対向するように基板Ｗの方向を変える。このとき、端材領域Ｄ２の形状に応じて、ロボットアーム部２１０を駆動して、把持部３１０に対する基板Ｗの方向及び位置を調整する。 Next, the swivel portion 221 swivels the substrate holding portion 222 to change the direction of the substrate W so that the end material region D2 faces the end material gripping mechanism 3. At this time, the robot arm portion 210 is driven to adjust the direction and position of the substrate W with respect to the grip portion 310 according to the shape of the scrap region D2.

以後、端材領域Ｄ１の分離と同様の動作を繰り返すことにより、端材領域Ｄ２〜Ｄ４を製品領域Ｐから分離する。 After that, the scrap regions D2 to D4 are separated from the product region P by repeating the same operation as the separation of the scrap region D1.

本発明のブレイク装置によれば、基板をその主面の法線の軸回りに回転可能に保持しているので、基板を乗せ換えることなく、製品領域Ｐの周囲の端材領域を効率よく分離することができる。また、端材領域の形状に応じて、基板Ｗの方向及び把持する位置を変更できるため、端材の形状に応じて確実にブレイクできる。 According to the break device of the present invention, since the substrate is rotatably held around the axis of the normal of the main surface thereof, the scrap region around the product region P is efficiently separated without changing the substrate. can do. Further, since the direction of the substrate W and the gripping position can be changed according to the shape of the end material region, it is possible to reliably break according to the shape of the end material.

なお、上記実施例では、基板移送機構２から離隔する方向に把持部３１０を移動させることによりブレイクを実行したが、これに代えて、ロボットアーム部２１０を駆動して基板保持ヘッド２２０を端材把持機構３から離隔する方向に移動させることにより、製品領域Ｐから各端材領域Ｄ１〜Ｄ４を分離することとしてもよい。この場合、把持部３１０を固定して、移動ベース部３２０を省略できる。 In the above embodiment, the break is executed by moving the grip portion 310 in the direction away from the substrate transfer mechanism 2, but instead, the robot arm portion 210 is driven to use the substrate holding head 220 as a scrap material. The scrap regions D1 to D4 may be separated from the product region P by moving the grip mechanism 3 in a direction away from the grip mechanism 3. In this case, the grip portion 310 can be fixed and the moving base portion 320 can be omitted.

２．基板分断システム
図５に基づいて、本発明の脆性材料基板の分断システムの構成を説明する。図５は、分断システム１１の正面模式図である。分断システム１１は、ブレイク装置１にスクライブ機構５を追加したものである。分断システム１１において、制御部４は、スクライブ機構５の動作制御も行う。 2. Substrate splitting system The configuration of the brittle material substrate splitting system of the present invention will be described with reference to FIG. FIG. 5 is a front schematic view of the division system 11. The division system 11 is a break device 1 to which a scribe mechanism 5 is added. In the division system 11, the control unit 4 also controls the operation of the scribe mechanism 5.

スクライブ機構５は、基板Ｗの所定の位置にスクライブラインを形成する装置である。スクライブ機構５は、基板移送機構２によって保持された状態の基板Ｗにスクライブラインを形成する。 The scribe mechanism 5 is a device that forms a scribe line at a predetermined position on the substrate W. The scribe mechanism 5 forms a scribe line on the substrate W held by the substrate transfer mechanism 2.

スクライブ機構５は、２つのスクライブヘッド５１０を有し、スクライブヘッド５１０は、基板の1つの面または両面にレーザ光を照射することにより、基板Ｗにスクライブラインを形成する。 The scribe mechanism 5 has two scribe heads 510, and the scribe head 510 forms a scribe line on the substrate W by irradiating one surface or both surfaces of the substrate with laser light.

なお、スクライブヘッド５１０は、レーザ照射に代えて、カッターを基板Ｗに押圧することにより基板Ｗにスクライブラインを形成する構成としてもよい。この場合、２つのカッターで基板Ｗの両面を押圧することとしてもよいし、基板の一方の面にカッター、基板の他方の面にバックアップロールを設け、カッターとバックアップロールとで基板Ｗを挟むように押圧することとしてもよい。 The scribe head 510 may be configured to form a scribe line on the substrate W by pressing a cutter against the substrate W instead of laser irradiation. In this case, both sides of the substrate W may be pressed by two cutters, or a cutter is provided on one surface of the substrate and a backup roll is provided on the other surface of the substrate so that the substrate W is sandwiched between the cutter and the backup roll. It may be pressed against.

分断システム１１は、基板保持ヘッド２２０で保持した基板Ｗを、まずスクライブ機構５を用いてスクライブラインを形成し、次いで基板把持機構３を用いてブレイクする。 In the dividing system 11, the substrate W held by the substrate holding head 220 is first formed into a scribe line by using the scribe mechanism 5, and then broken by using the substrate gripping mechanism 3.

この実施形態によれば、基板移送機構２で基板を保持したまま、スクライブ及びブレイクを連続して実行できる。 According to this embodiment, scribe and break can be continuously executed while the substrate is held by the substrate transfer mechanism 2.

本発明は、脆性材料基板を分断する装置に適用することができる。 The present invention can be applied to an apparatus for dividing a brittle material substrate.

Ｗ 基板
１ ブレイク装置
１１ 分断システム
２ 基板移送機構
２１０ ロボットアーム部
２２０ 基板保持ヘッド
２２１ 旋回部
２２２ 基板保持部
３ 端材把持機構
３１０ 把持部
３２０ 移動ベース部
４ 制御部
５ スクライブ機構
５１０ スクライブヘッド W Board 1 Breaking device 11 Dividing system 2 Board transfer mechanism 210 Robot arm part 220 Board holding head 221 Swivel part 222 Board holding part 3 Scrap gripping mechanism 310 Gripping part 320 Moving base part 4 Control part 5 Scribing mechanism 510 Scribing head

Claims (5)

スクライブラインが形成された脆性材料基板に応力を加えて、前記スクライブラインに沿って前記脆性材料基板の製品領域から端材領域を分割する脆性材料基板のブレイク装置であって、
前記脆性材料基板を保持して移送する基板移送機構と、
前記脆性材料基板の前記端材領域を把持する端材把持機構と、を備え、
前記基板移送機構は、前記脆性材料基板を保持する基板保持部と、保持した前記脆性材料基板をその主面の法線に沿った軸回りに回転させる旋回部とを有し、
前記端材把持機構は前記端材を把持する把持部を有し、
前記基板保持部と前記把持部とは、相対的に接近離隔可能に設けられている、ブレイク装置。 A breaker for a brittle material substrate, which applies stress to a brittle material substrate on which a scribe line is formed to divide a scrap region from a product region of the brittle material substrate along the scribe line.
A substrate transfer mechanism that holds and transfers the brittle material substrate, and
A scrap gripping mechanism for gripping the scrap region of the brittle material substrate is provided.
The substrate transfer mechanism has a substrate holding portion for holding the brittle material substrate and a swivel portion for rotating the held brittle material substrate about an axis along the normal of the main surface thereof.
The scrap gripping mechanism has a grip portion for gripping the scrap.
A break device in which the substrate holding portion and the grip portion are provided so as to be relatively close to each other. 前記端材把持機構は、前記把持部を前記基板移送機構に対して接近離隔する方向に移動させる移動ベース部をさらに有する、請求項１に記載のブレイク装置。 The break device according to claim 1, wherein the scrap gripping mechanism further includes a moving base portion for moving the gripping portion in a direction of approaching and separating from the substrate transfer mechanism. 前記基板移送機構は、基板保持部を前記端材把持機構に対して接近離隔する方向に移動可能に設けられている、請求項１に記載のブレイク装置。 The break device according to claim 1, wherein the substrate transfer mechanism is provided so that the substrate holding portion can be moved in a direction of approaching and separating from the scrap gripping mechanism. 前記基板保持部は、前記脆性材料基板の前記製品領域を吸着して保持するように設けられている、請求項１〜３のいずれかに記載の溝加工ツール。 The groove processing tool according to any one of claims 1 to 3, wherein the substrate holding portion is provided so as to attract and hold the product region of the brittle material substrate. 脆性材料基板にスクライブラインを形成し、前記スクライブラインが形成された前記脆性材料基板に応力を加えて、前記スクライブラインに沿って前記脆性材料基板の製品領域から端材領域を分割する脆性材料基板の分断システムであって、
前記脆性材料基板に前記製品領域から前記端材領域を分離するための前記スクライブラインを形成するスクライブ機構と、
前記脆性材料基板を保持して移送する基板移送機構と、
前記脆性材料基板の前記端材領域を把持する端材把持機構と、を備え、
前記基板移送機構は、前記脆性材料基板を保持する基板保持部と保持した前記脆性材料基板をその主面の法線に沿った軸回りに回転させる旋回部とを有し、
前記端材把持機構は前記端材を把持する把持部を有し、
前記基板保持部と前記把持部とは、相対的に接近離隔可能に設けられている、分断システム。 A brittle material substrate is formed by forming a scribing line on the brittle material substrate, and stress is applied to the brittle material substrate on which the scribing line is formed to divide a scrap region from a product region of the brittle material substrate along the brittle material substrate. It is a division system of
A scribe mechanism for forming the scribe line on the brittle material substrate to separate the scrap region from the product region.
A substrate transfer mechanism that holds and transfers the brittle material substrate, and
A scrap gripping mechanism for gripping the scrap region of the brittle material substrate is provided.
The substrate transfer mechanism has a substrate holding portion that holds the brittle material substrate and a swivel portion that rotates the held brittle material substrate about an axis along the normal of its main surface.
The scrap gripping mechanism has a grip portion for gripping the scrap.
A division system in which the substrate holding portion and the grip portion are provided so as to be relatively close to each other.
JP2019063929A 2019-03-28 2019-03-28 Break device of brittle material substrate and parting system Abandoned JP2020163602A (en)

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TW109103851A TW202035322A (en) 2019-03-28 2020-02-07 Separating device and dividing system for brittle material substrate capable of dividing a trimmed edge area from a product area of a brittle material substrate along a scribe line
CN202010220948.3A CN111747639A (en) 2019-03-28 2020-03-25 Cutting device and cutting system for brittle material substrate
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CN114378817A (en) * 2021-12-30 2022-04-22 南京熊猫电子股份有限公司 Robot panel-severing control method for liquid crystal glass substrate

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US7131562B2 (en) 2001-01-17 2006-11-07 Mitsuboshi Diamond Industrial Co., Ltd. Scribing and breaking apparatus, system therefor, and scribing and breaking method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114378817A (en) * 2021-12-30 2022-04-22 南京熊猫电子股份有限公司 Robot panel-severing control method for liquid crystal glass substrate
CN114378817B (en) * 2021-12-30 2023-12-05 南京熊猫电子股份有限公司 Robot board breaking control method for liquid crystal glass substrate

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