JP2021008053A - Curved substrate scribing device and dividing system - Google Patents

Abstract

To provide a scribing device that can form a scribe line on a curved brittle material substrate accurately.SOLUTION: A curved substrate scribing device, which forms a scribe line on a curved substrate of brittle materials, comprises a substrate transfer mechanism that transfers the curved substrate while holding the substrate and a scribe mechanism that forms the scribe line on the curved substrate. The scribe mechanism has a scribe head that forms the scribe line on the curved substrate, at a predetermined processing position and a distance sensor that measures a distance between the curved substrate and the sensor. The substrate transfer mechanism is provided so that a distance between a surface of the curved substrate and the scribe head can be adjusted at the processing position on the basis of measurement data on the distance measured by the distance sensor.SELECTED DRAWING: Figure 1

Description

The present invention relates to a curved substrate scribe device and a dividing system used for cutting a curved substrate made of a brittle material such as a glass substrate.

In the process of dividing a curved substrate made of a brittle material such as a glass substrate, conventionally, the cutter wheel is pressed against the surface of the substrate while the curved substrate is placed on a table having a surface along the curved surface of the curved substrate to form a scribing line. It is formed and then divided into the shape of the product by applying an external force along the scribing line to develop cracks from the scribing line.
(See Patent Document 1).

In recent years, the shapes of display panel products such as liquid crystal display panels have been diversified, and the production of display panels of various shapes is increasing.

JP 2017-132684

In the conventional scribe device, it is necessary to prepare a table molded according to the shape of the curved substrate to be processed.

Therefore, an object of the present invention is to provide a scribing device capable of accurately scribing a brittle material substrate having various curved surfaces.

The scribe device for a curved substrate according to the present invention, which has been made to solve the above problems, is a scribe device for a curved substrate that forms a scribe line on a curved substrate made of a brittle material, and transfers the substrate while holding the curved substrate. It is equipped with a mechanism and a scribe mechanism for forming a scribe line on a curved substrate, and the scribe mechanism has a scribe head for forming a scribe line on a curved substrate at a predetermined machining position and a distance sensor for measuring the distance between the curved substrate. However, the substrate transfer mechanism is provided so that the distance between the surface of the curved substrate and the scribe head at the machining position can be adjusted based on the actual measurement data of the distance measured by the distance sensor.

Further, in the curved substrate dividing system according to the present invention made to solve the above problems, a scribing line is formed on a curved substrate made of a brittle material, and stress is applied to the curved substrate on which the scribing line is formed to apply a scribing line. It is a curved board dividing system that divides a curved board along the line, and grips a scribing mechanism that forms a scribing line on the curved board, a board transfer mechanism that holds and transfers the curved board, and a scrap area of the curved board. The scribing mechanism has a scribing head that forms a scribing line on a curved substrate at a predetermined machining position, and a distance sensor that measures the distance to the curved substrate. The substrate transfer mechanism is a brittle material. It has a substrate holding part that holds the substrate, and the substrate transfer mechanism is provided so that the distance between the surface of the curved substrate and the scribing head at the processing position can be adjusted based on the measured distance data measured by the distance sensor. The break mechanism has a grip portion for gripping the scrap material, and the substrate holding portion and the grip portion are provided so as to be relatively close to each other.

According to the scribing device and the dividing system of the present invention, since the distance to the curved substrate is adjustable and held based on the measured data, scribing can be performed while adjusting the distance to the substrate according to the curved surface at the machining position. Therefore, it is possible to scribe a curved substrate having various curved surfaces with high accuracy.

The front schematic view which shows one Embodiment of the scribe apparatus which concerns on this invention. The plan view around the substrate holding head of the scribe apparatus which concerns on this invention. The schematic diagram of the substrate on which the scribe line was formed. The schematic diagram for demonstrating the operation of forming a scribing line using the scribing apparatus which concerns on this invention. The schematic diagram for demonstrating the operation of adjusting the inclination of a substrate by using the scribe apparatus which concerns on this invention. The front schematic view of the division system which combined the scribe apparatus and the break apparatus which concerns on this invention.

1. 1. Scrivener device 1) Device configuration The configuration of the scribe device according to the present invention will be described with reference to FIG. FIG. 1 is a front schematic view showing an embodiment of a scribe device according to the present invention.

The scribe device 1 is a device that forms a scribe line on the curved surface substrate W. The substrate W is a curved substrate made of a brittle material such as glass, and is, for example, a liquid crystal panel. The scribe device 1 has a substrate transfer mechanism 2, a scribe mechanism 3, and a control unit 4.

The substrate transfer mechanism 2 is a device capable of changing the position, height, inclination, and direction of the substrate W while holding the substrate W. The board transfer mechanism 2 has a robot arm portion 210 and a board holding head 220. The robot arm unit 210 can drive a motor (not shown) to change the position, height, and inclination of the substrate holding head 220.

The substrate holding head 220 has a swivel portion 221 and a substrate holding portion 222. The substrate holding portion 222 vacuum-sucks and holds the substrate W. The swivel portion 221 drives a motor (not shown) to swivel the substrate holding portion 222.

FIG. 2 is a schematic plan view around the substrate holding head 220. As shown in FIG. 2, the substrate holding head 220 can swivel the held substrate W around an axis in a direction substantially perpendicular to its main surface.

The scribe mechanism 3 is a device that forms a scribe line at a predetermined position on the substrate W. The scribe mechanism 3 forms a scribe line on the substrate W held by the substrate transfer mechanism 2.

The scribe mechanism 3 has two scribe heads 310 and a distance sensor 320. The scribe head 310 forms a scribe line on the substrate W by irradiating one surface or both surfaces of the substrate with laser light. The scribe mechanism 3 condenses the irradiated laser light inside the substrate W to form processing marks extending in the thickness direction of the substrate inside the substrate. The distance sensor 320 measures the distance from the substrate W.

The control unit 4 has a processor (for example, CPU), a storage device (for example, ROM, RAM, HDD, SSD, etc.), and various interfaces (for example, A / D converter, D / A converter, communication interface, etc.). It is a computer system. The control unit 4 controls the operation of the substrate transfer mechanism 2 and the scribe mechanism 3 by executing a program stored in the storage unit (corresponding to a part or all of the storage area of the storage device).

2) Scribing method FIG. 3 is a schematic view of a substrate W divided into product shapes using the scribing device 1. On the substrate W, a scribe line S1 along the shape of the product and four scribe lines S2 for dividing the scrap material around the product into four are formed by using the scribe device 1. The product area P is surrounded by the scribe line S1 and is an area in which the offcuts are separated to become a product. The scrap regions D1 to D4 are regions that are separated from the product region P and become scraps along the scribe line S1 and the scribe line S2.

The operation of the scribe device 1 will be described with reference to FIGS. 4 and 5. First, the substrate transfer mechanism 2 uses the substrate holding portion 222 to adsorb and hold the product area P of the substrate W. At this time, it is preferable to suck and hold the convex surface of the curved substrate so that the positions of the suction head 220 and the scribe mechanism 3 do not easily interfere with each other.

The board transfer mechanism 2 drives the robot arm portion 210 to move the board W to a position where the distance sensor 320 of the scribe mechanism 3 can measure the distance from the board. At this time, the direction and inclination of the substrate W are adjusted according to the curved surface shape of the substrate W.

While measuring the distance to the substrate using the distance sensor 320, the substrate transfer mechanism 2 is driven to move and rotate the substrate W. The board transfer mechanism 2 moves the board W so that the measurement position of the distance sensor 320 goes around the scribe line S1 based on the design data of the shape of the board W recorded in advance in the storage unit of the control unit 4. .. As a result, the actual measurement data of the distance between the distance sensor 320 and the substrate W when the substrate W is moved along the scribing line S1 which is the outer shape of the product area P is stored in the storage unit of the control unit 4.

Next, the substrate transfer mechanism 2 drives the robot arm unit 210 to move the substrate W to a position where the scribing mechanism 3 can scribble. At this time, the direction and inclination of the substrate W are adjusted according to the curved surface shape of the substrate W.

While irradiating the substrate W with a laser by the scribe mechanism 3, the substrate transfer mechanism 2 is driven to move and rotate the substrate W. As shown in FIG. 4, the substrate transfer mechanism 2 moves the substrate W so that the scribe line S1 is formed in a desired shape while the laser irradiation position (machining position) F is fixed. At this time, the control unit 4 adjusts the distance between the scribe head 310 and the substrate W based on the actual measurement data of the substrate W stored in the storage unit. As a result, the scribe line S1 which is the outer shape of the product area P is formed at a predetermined position. The broken line in FIG. 4 indicates the position of the scribe line S1 before the scribe line is formed.

At this time, as shown in FIG. 5, the substrate transfer mechanism 2 of the substrate W so that the scribing line S1 extends in the thickness direction of the substrate in the direction perpendicular to the tangent line at the laser irradiation position (machining position) F. The inclination of the substrate W is adjusted according to the curved surface. Instead of adjusting the inclination of the substrate so that the scribe line extends in the thickness direction of the substrate in the direction perpendicular to the tangent of the substrate W, the surface of the substrate W has a predetermined inclination. A scribe line may be formed.

Similar to the scribe line S1, each scribe line S2 also changes the position and direction of the substrate W while irradiating the laser using the scribe mechanism 3 and adjusting the inclination of the substrate W using the substrate transfer mechanism 2. Is formed by.

According to the scribe device 1 of the present invention, since the inclination of the substrate W can be changed and the substrate W is rotatably held around an axis substantially perpendicular to the main surface thereof, a scribe line can be provided for substrates having various curved surfaces. Can be formed. Further, since it is not necessary to move the scribe head, it is possible to suppress a decrease in machining accuracy due to fluctuations in the laser irradiation position (machining position) caused by the movement of the scribe head.

In the above embodiment, the distance from the scribe line S1 is measured, but the distance from the scribe line S2 may also be measured.

In the above embodiment, when forming the scribe line, the control unit 4 adjusts the distance between the scribe head 310 and the substrate W based on the measured data of the substrate W stored in the storage unit. Processing data obtained by correcting the data with actual measurement data may be used.

In the above embodiment, the scribing line is formed by irradiating a laser beam to form a machining mark extending in the thickness direction of the substrate inside the substrate, but instead of this, a crack is used using a cutter. It can be formed by any method such as mechanical processing for forming a surface, crack formation by thermal stress, and other laser processing such as groove formation by laser ablation.

When the scribe line is formed by laser processing, only one scribe head 310 may be provided.

When a scribing line is formed on the substrate W by pressing the cutter against the substrate W, both sides may be pressed so as to sandwich the substrate W with two cutters, or the cutter and the substrate may be pressed on one surface of the substrate. A backup roll may be provided on the other surface and pressed by the cutter and the backup roll.

2. 2. Dividing system The configuration of the dividing system of the present invention will be described with reference to FIG. FIG. 5 is a front schematic view of the dividing system 11. The division system 11 is a scribe device 1 to which a break mechanism 5 is added. In the division system 11, the control unit 4 also controls the operation of the break mechanism 5.

The break mechanism 5 is a device that grips the end portion of the substrate W. The break mechanism 5 has a grip portion 510 and a moving base portion 520. The grip portion 510 is provided so as to be openable and closable by an actuator (not shown), and the end material of the substrate W is gripped by closing the grip portion 510 so as to sandwich the end portion of the substrate W. The moving base portion 520 moves the grip portion 510 in the direction of approaching and separating from the substrate transfer mechanism 2 by an actuator (not shown).

In the dividing system 11, the substrate W held by the substrate suction portion 220 is first formed into a scribe line by using the scribe mechanism 3, and then the scrap region is separated (breaked) by using the break mechanism 5.

Next, the operation of the break using the break mechanism 5 will be described. First, the substrate transfer mechanism 2 uses the substrate holding portion 222 to adsorb and hold the product area P of the substrate W.

Next, the substrate transfer mechanism 2 drives the robot arm portion 210 to move the substrate W to a position where the break mechanism 5 can grip the end material region D1, and the break mechanism 5 grips the end material region D1. At this time, the direction, position, and inclination of the substrate W are adjusted according to the shape of the scrap region D1.

The break mechanism 5 separates the scrap region D1 from the product region P by driving the movement base portion 520 and moving the grip portion 510 in a direction away from the substrate transfer mechanism 2.

Next, the break mechanism 5 opens the grip portion 510 and drops the end material region D1 downward.

Next, the swivel portion 221 swivels the substrate holding portion 222 to change the direction of the substrate W so that the end material region D2 faces the break mechanism 5. At this time, the robot arm portion 210 and the swivel portion 221 are driven to adjust the direction, inclination, and position of the substrate W according to the shape of the scrap region D2.

After that, the scrap regions D2 to D4 are separated from the product region P by repeating the same operation as the separation of the scrap region D1.

According to this division system, scribing and breaking can be continuously executed while the substrate W is held by the substrate transfer mechanism 2.

The present invention can be applied to an apparatus for dividing a curved substrate of a brittle material.

W Board 1 Scribe device 11 Dividing system 2 Board transfer mechanism 210 Robot arm part 220 Board holding head 221 Swivel part 222 Board holding part 3 Scribe mechanism 310 Scribe head 320 Distance sensor 4 Control part 5 Break mechanism 510 Gripping part 520 Moving base part

Claims (5)

A scribe device for curved substrates that forms scribing lines on curved substrates made of brittle materials.
A substrate transfer mechanism that holds and transfers the curved substrate, and
A scribe mechanism for forming a scribe line on the curved substrate is provided.
The scribe mechanism has a scribe head that forms a scribe line on the curved substrate at a predetermined processing position, and a distance sensor that measures a distance between the curved substrate.
The substrate transfer mechanism is a scribe device provided so as to be able to adjust the distance between the surface of the curved substrate and the scribe head at the processing position based on the actual measurement data of the distance measured by the distance sensor. The scribe device according to claim 1, wherein the substrate transfer mechanism has a holding portion for holding the curved substrate and a swivel portion for rotating the held brittle material substrate about an axis substantially perpendicular to the main surface thereof. The scribe device according to claim 1, wherein the scribe mechanism forms processing marks extending in the thickness direction of the curved substrate by condensing laser light inside the curved substrate. The scribe device according to any one of claims 1 to 3, wherein the substrate holding portion is provided so as to attract the convex surface of the curved substrate. A curved substrate dividing system in which a scribe line is formed on a curved substrate made of a brittle material, stress is applied to the curved substrate on which the scribe line is formed, and the curved substrate is divided along the scribe line.
A scribe mechanism that forms a scribe line on the curved substrate,
A substrate transfer mechanism that holds and transfers the curved substrate, and
A break mechanism for gripping a scrap area of the curved substrate is provided.
The scribe mechanism has a scribe head that forms a scribe line on the curved substrate at a predetermined processing position, and a distance sensor that measures a distance between the curved substrate.
The substrate transfer mechanism has a substrate holding portion for holding the brittle material substrate.
The substrate transfer mechanism is provided so that the distance between the surface of the curved substrate and the scribe head at the processing position can be adjusted based on the actual measurement data of the distance measured by the distance sensor.
The break mechanism has a grip portion that grips the scrap material.
A division system in which the substrate holding portion and the grip portion are provided so as to be relatively close to each other.

Images