JP2012045947A - Scribing wheel for forming ceramic substrate scribe line, scribing apparatus and scribing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a scribing wheel, a scribing apparatus and a scribing method which are suitable for forming a scribe line at a ceramic substrate (particularly, a low temperature-fired ceramic substrate) achieving high penetration and having a long life.SOLUTION: A scribing wheel made of material comprising sintered diamond (PCD) is used for the scribe line of a ceramic substrate, In the scribing wheel, a V-shaped blade is formed along the circumferential part of the disk-shaped wheel, the converging angle of the V-shaped blade is 90 to 160°, grooves are regularly formed at the tip of the blade, the depth of the grooves is 3 to 50 μm, the width of the grooves is 15 to 100 μm, the diameter thereof is 1 to 10 mm, the pitch (the value obtained by totalling the length of one groove and the length of one projection remaining by the formation of the groove) is 30 to 180 μm, the length of one groove is larger than the length of one projection.

Description

The present invention particularly relates to a scribing apparatus and a scribing method used for cutting a brittle material substrate such as a low-temperature fired ceramic substrate.

Low-temperature fired ceramics (hereinafter referred to as LTCC) is a substrate fired at a low temperature of about 800 ° C. as a multilayer film in which conductors are wired on a sheet in which an alumina aggregate and a glass material are mixed. In the LTCC substrate, a large number of functional regions are simultaneously formed in a lattice pattern on a single mother substrate, and these functional regions are divided into small substrates for use. Conventionally, a cutting tool is used for dividing the mother substrate, and the mother substrate is divided by mechanical cutting.

As one of the conventional scribing methods for scribing a brittle material substrate, there is a scribing method for scribing from the outside to the outside of the brittle material substrate as disclosed in Patent Document 1. As shown in FIG. 1, the scribing wheel 2 (sometimes called a cutter wheel) is placed at a point slightly outside the end of the brittle material substrate 1, and the lowermost end of the scribing wheel 2 is located above the upper surface of the brittle material substrate 1. Lower it slightly down. Then, scribing is started from the edge of the brittle material substrate 1 by horizontally moving the scribing wheel 2 in the right direction in a state where a predetermined scribe pressure is applied to the scribing wheel 2 and scribes to the other edge of the brittle material substrate 1. It is. This is hereinafter referred to as outer cutting scribe. In the case of external scribe, since the scribe line reaches both ends of the substrate, it is easy to break after scribing, and there is no problem of slipping at the scribe start position, but the scribing wheel is consumed. There is a drawback that it is easy. In particular, when scribing ceramics such as LTCC, the scribing wheel is consumed significantly by cutting off.

There is also a scribing method in which a scribe is made from the inside to the inside of the brittle material substrate and not scribed to the outside. As shown in FIG. 2, the scribing wheel 2 is lowered slightly inside the edge of the brittle material substrate 1, and the scribing wheel 2 is horizontally moved in the right direction in a state where a predetermined downward scribe pressure is applied to the scribing wheel 2. By doing so, scribing is started from the inside of the brittle material substrate 1 and scribed to the inside of the other end. This is hereinafter referred to as “inner scribe”. In the case of internal scribe, the scribing wheel is less likely to wear than in the case of external scribe, but since the scribe line does not reach both ends of the substrate, it tends to be difficult to break after scribing. . In particular, when scribing ceramics such as LTCC, it is difficult to divide by inner cutting. In addition, when the substrate and the product substrate are small (for example, when dividing a substrate of 200 mm or less (especially 100 mm or less) in length or width to obtain a product of 10 mm or less (especially 5 mm or less) by dividing), it is extremely difficult to divide by internal cutting. Become. In addition, the scribe in this specification means that a scribing line (cutting line) is formed by rolling a scribing wheel on a brittle material substrate, and a vertical crack (in the thickness direction) along the scribe line. Cracks extending to the surface).
Japanese Patent No. 3710495

In the conventional scribing apparatus, the scribing is performed by only one of the above-described outer cutting and inner cutting, and a scribing line cannot be formed by combining them.

SUMMARY OF THE INVENTION The present invention solves such conventional drawbacks, and an object of the present invention is to enable scribing by combining outer cutting and inner cutting scribe lines.

In order to solve this problem, a scribing apparatus of the present invention is a scribing apparatus for scribing to divide a functional area formed on a brittle material substrate for each functional area into a product substrate. The scribing apparatus is classified into an inner scribe from one side of the brittle material substrate to the inner side of the other side, and an outer scribe from one side of the brittle material substrate to the outer side of the other side. Includes a table on which the brittle material substrate is installed, a scribing head that is provided so as to be movable up and down so as to face the brittle material substrate on the table, and holds a scribing wheel at the tip thereof, and the scribing wheel is used as the brittle material. Moving means for relatively moving the scribe head and the brittle material substrate in a state of being pressed against the surface of the substrate; A recipe data table showing the scribe contents including the line to be processed and the type of the line is stored in advance, the scribe head and the brittle material substrate are relatively moved by the moving means based on the recipe data table, and the scribe head And a controller that performs scribing according to the type of scribing.

In order to solve this problem, a scribing apparatus of the present invention is a scribing apparatus for scribing to divide a functional area formed on a brittle material substrate for each functional area into a product substrate. The type includes an inner scribe from one side of the brittle material substrate to the inner side of the other side, an outer scribe from one side of the brittle material substrate to the outer side of the other side, and the brittle material An inner / outer scribe from one side of the substrate to the outer side of the other side and an outer / inner scribe from the outer side of one side of the brittle material substrate to the inner side of the other side, wherein the scribe device is the brittle material A table on which the substrate is installed and a scribe head which is provided so as to be movable up and down so as to face the brittle material substrate on the table and holds a scribing wheel at the tip thereof. Recipe data indicating scribing contents including a moving means for relatively moving the scribe head and the brittle material substrate in a state where the scribing wheel is pressed against the surface of the brittle material substrate, a line to be scribed, and a type of the scribing line A controller that holds a table in advance and relatively moves the scribe head and the brittle material substrate by the moving means based on the recipe data table, and raises and lowers the scribe head to perform scribe according to the type of scribe. Are provided.

Here, the scribing wheel may be a highly penetrating scribing wheel. Since the high penetration type scribing wheel is easy to bite into the substrate, there is an advantage that the problem of slipping at the scribe start position hardly occurs even if it is cut inside.

In order to solve this problem, in the scribing method of the present invention, the functional region formed on the brittle material substrate is divided into each functional region to obtain a product substrate. A scribing method, wherein the scribing type is an internal scribe that is a scribe from the inside of one side of the brittle material substrate to the inside of the other side, and the other side of the brittle material substrate from the outside of the one side. When making an outer scribe that is a scribe to the outside, a recipe data table showing the scribe line and the scribe contents including the type is held in advance, and the scribe head and the brittle material substrate based on the recipe data table And move the scribing head up and down based on the recipe data table. It is intended to scribe in accordance with the type of live.

In order to solve this problem, in the scribing method of the present invention, the functional region formed on the brittle material substrate is divided into each functional region to obtain a product substrate. A scribing method, wherein the scribing type is an internal scribe that is a scribe from the inside of one side of the brittle material substrate to the inside of the other side, and the other side of the brittle material substrate from the outside of the one side. An outer scribe that is a scribe to the outside, an inner and outer scribe that is a scribe from the inside of one side of the brittle material substrate to the outside of the other side, and the other side from the outside of one side of the brittle material substrate When the scribe up to the inside is set to the scribe inside and outside, a scribe line and a recipe data table showing the scribe contents including the type are clearly displayed. And scribing according to the type of scribe by moving the scribe head and the brittle material substrate relatively based on the recipe data table and moving the scribe head up and down based on the recipe data table. is there.

Here, the brittle material substrate has a functional area formed in a lattice shape, and the inner scribe is performed in a lattice shape so as to be divided into each functional region of the brittle material substrate, and two parallel parallel opposing sides are formed. You may make it scribe along the ridge.

Here, the brittle material substrate is formed with a plurality of functional regions, and when the scribe is performed so as to divide the brittle material substrate into functional regions, the brittle material substrate extends along two opposing sides of the brittle material substrate. The outermost scribe may be an outer scribe, and the other scribe may be an inner scribe.

Here, the brittle material substrate is formed with a plurality of functional regions, and when the scribe is performed so as to divide the brittle material substrate into functional regions, the brittle material substrate extends along two opposing sides of the brittle material substrate. One of the outermost scribes is an outer scribe, the other scribe is an inner scribe, and an outer scribe is performed outside the inner scribe along the other of the two sides. You may do it.

Here, the outer scribe scribe line may be formed so as to intersect a scribe line in a direction orthogonal to the outer scribe line among the inner scribe scribe lines.

Here, the scribing wheel may be a highly penetrating scribing wheel.

According to the present invention having such a feature, it is possible to select an internal scribe, an external scribe, or an internal scribe, an external scribe, and an external scribe for each desired scribe line. Increased freedom. Therefore, it is possible to perform a scribe suitable for the dividing step after the scribe. In addition, when the inner scribe is scribed in a lattice shape and the outer scribe is performed in parallel with the two opposite sides from the outer periphery, the peripheral portion can be easily separated by applying a force to the outer scribed line. be able to. Then, after removing the peripheral portion, each functional region can be easily divided into product substrates along the scribe line that is internally scribed. Further, by minimizing the number of lines to be scribed, the effect of minimizing the deterioration of the scribing wheel can be obtained.

FIG. 3 is a schematic perspective view showing an example of the scribing apparatus of the present embodiment. In the scribing apparatus 100, a moving base 101 is held so as to be movable in the y-axis direction along a pair of guide rails 102a and 102b. The ball screw 103 is screwed with the moving table 101. The ball screw 103 is rotated by driving the motor 104, and moves the moving base 101 in the y-axis direction along the guide rails 102a and 102b. A motor 105 is provided on the upper surface of the movable table 101. The motor 105 rotates the table 106 on the xy plane and positions it at a predetermined angle. Here, the brittle material substrate 107 is a low-temperature fired ceramic substrate. The substrate 107 is placed on a table 106 and held by a vacuum suction means (not shown). Two CCD cameras 108a and 108b for imaging the alignment mark of the brittle material substrate 107 are provided on the scriber. Further, positioning pins 109 a and 109 b for positioning the brittle material substrate 107 are provided at two peripheral portions on the table 106.

In the scribe device 100, a bridge 110 is installed by struts 111 a and 111 b along the x-axis direction so as to straddle the moving table 101 and the upper table 106. The bridge 110 holds a scribe head 112 movably by a linear motor 113. The linear motor 113 linearly drives the scribe head 112 along the x-axis direction. A scribing wheel 115 is attached to the tip of the scribe head 112 via a holder 114. The scribe head 112 rolls the scribing wheel 115 while pressing it on the surface of the brittle material substrate with an appropriate load to form a scribe line. As the scribing wheel 115, it is preferable to use a high penetration type scribing wheel shown in Japanese Patent No. 3074153, and this scribing wheel is also used in the embodiment. For example, it is possible to obtain a highly penetrating scribing wheel by forming grooves of a predetermined depth at a predetermined pitch on a cutting edge of a commonly used normal scribing wheel. A commonly used normal scribing wheel is manufactured, for example, by forming a V-shaped blade along the circumference of a disc-shaped wheel. The convergence angle of the V-shaped blade is usually an obtuse angle, and can be, for example, 90 to 160 °, preferably 95 to 150 °, and particularly preferably 100 to 140 °. For example, a V-shaped blade is formed by grinding a disc-shaped wheel along its circumference to form an outer circumference. For example, a V-shaped blade formed by grinding has a fine sawtooth shape derived from a grinding streak. A highly penetrating scribing wheel can be manufactured by regularly forming recesses (grooves) that are larger than the serrated valleys of the cutting edge of a normal scribing wheel. The depth of the groove can be, for example, 2 to 100 μm, preferably 3 to 50 μm, particularly preferably 5 to 20 μm. The width of the groove can be, for example, 10 to 100 μm, preferably 15 to 100 μm, and particularly preferably 20 to 50 μm. For example, in the case of a scribing wheel having a diameter of 1 to 10 mm (particularly 1.5 to 7 mm), the pitch for forming the grooves can be 20 to 250 μm, preferably 30 to 180 μm, and particularly preferably 40 to 80 μm. Here, the pitch refers to a value obtained by adding up the length of one groove in the circumferential direction of the scribing wheel and the length of one protrusion remaining after the formation of the groove. Usually, in the high penetration type scribing wheel, the length of one groove is longer than the length of one protrusion in the circumferential direction of the scribing wheel. As the material of the scribing wheel, sintered diamond (PCD), cemented carbide or the like can be used, but sintered diamond (PCD) is preferable from the viewpoint of the life of the scribing wheel.

Here, the moving table 101, the guide rails 102a and 102b, the table 106, the motors 104 and 105 for driving them, and the linear motor 113 for moving the scribe head 112 relatively move the scribe head and the brittle material substrate within the plane of the substrate. The moving means to move is comprised.

Next, the configuration of the controller of scribing apparatus 100 according to the present embodiment will be described using a block diagram. FIG. 4 is a block diagram of the controller 120 of the scribing apparatus 100. In this figure, outputs from the two CCD cameras 108 a and 108 b are given to the control unit 122 via the image processing unit 121 of the controller 120. As will be described later, the input unit 123 inputs recipe data for scribing a brittle material substrate. A Y motor drive unit 125, a rotation motor drive unit 126, and a scribe head drive unit 127 are connected to the control unit 122. The Y motor drive unit 125 drives the motor 104, and the rotation motor drive unit 126 drives the motor 105. The control unit 122 controls the position of the table 106 in the y-axis direction based on the recipe data, and controls the rotation of the table 106. The control unit 122 drives the scribe head in the x-axis direction via the scribe head drive unit 127, and the scribing wheel 115 presses the surface of the brittle material substrate with an appropriate load when the scribing wheel 115 rolls. To drive. Further, a monitor 128 and a recipe data holding unit 129 are connected to the control unit 122. The recipe data holding unit 129 holds recipe data for scribing described later. Recipe data is input by the input unit 123 while confirming the input on the monitor 128.

Next, a scribing method for the scribing apparatus according to this embodiment will be described. In this embodiment, scribing is performed by setting the outer scribe shown in FIG. 1 and the inner scribe shown in FIG. 2 for each scribe line. In the case of external scribing, the scribing wheel collides with the edge of the brittle material substrate at the start of scribing, which has the disadvantage that the scribing wheel is likely to deteriorate. However, in the external cutting scribe, a scribe line and a vertical crack extending from the scribe line in the thickness direction of the substrate are formed from end to end of the substrate, and thus the scribe line and the vertical crack are formed over the entire width of the brittle material substrate. In other words, division is easy.

Next, in the case of the internal scribe shown in FIG. 2, the scribing wheel is lowered to the inside of the end portion of the brittle material substrate 107, so that the vertical crack due to the scribe often becomes shallow. Therefore, in this embodiment, a high penetration type blade edge is used as the scribing wheel 115. Therefore, vertical cracks can be penetrated deeply even with internal cutting scribe. In the present embodiment, scribing can be performed by appropriately switching between the outer scribe and the inner scribe for each scribe line.

Next, an example of scribe will be described based on the drawings. FIG. 5 shows a brittle material substrate 107 and 20 functional regions formed in a lattice pattern on the surface. In addition, an alignment mark is formed in advance between each functional area as shown in the figure. Among these, the outer peripheral alignment marks are a to r.

Next, the operation of the scribing apparatus according to this embodiment will be described with reference to a flowchart. First, as shown in FIG. 6, an overhang amount is set in advance before scribing to create a recipe data table. As described above, the types of scribes include inner cut and outer cut scribe, and the amount of overhang between the outer cut and the inner cut is set in advance. In S11, as shown in FIG. 1, an overhang amount OH1 at the start of cutting and an end overhang amount OH2 are set. Here, the amount of overhang refers to the distance from the edge of the substrate to the lowered or raised position of the scribe head. In the case of cutting off, the overhang amount is set to a positive value. For example, when the start overhang amount and the end overhang amount are set to +5 mm, respectively, the scribing wheel is lowered 5 mm from the edge of the board and the scribing wheel is raised 5 mm outside the board edge. And can be cut off. In S12, as shown in FIG. 2, the start overhang amount OH3 and the end overhang amount OH4 for the inner cut are set. In the case of an internal cut, the overhang amount is set to a negative value. For example, when the start overhang amount and the end overhang amount are set to -2 mm, respectively, scribing starts from a position 2 mm inside from the end of the substrate, and the scribing ends within 2 mm from the end of the substrate. , Can be an inside scribe.

Next, in S13, a recipe data table is created. For example, as shown in FIG. 7, the recipe data table is a table in which a scribe line, a scribe method, and a pitch are set. In this data table, the inner scribes between the alignment marks a-f of the brittle material substrate 107 shown in FIG. 5 and between the alignment marks rg, qh, pi, and oj in parallel therewith. Is set. Further, an outer scribe along the scribe line OS1, an inner scribe between the alignment marks ao, bn... Fj, and an outer scribe along the scribe line OS2 are set. .

As a scribe method, either 0, 1, or 2 is set. Here, the scribing method 0 indicates an inner cut, and the scribing between the alignment marks a-f and the alignment marks r-g, the q-h, the p-i, and the o-j in parallel therewith. In scribing or the like, the scribing method is set to zero. The scribing method 1 is an outer cutting and shows a case where no alignment mark is used. The scribing method 2 is an outer cutting, which is a case of performing an original alignment based on the alignment mark. As will be described later, the scribing method 2 can be set in the case of the outer cutting for the brittle material substrate in which the alignment mark is provided in advance for the outer cutting.

Furthermore, the pitch indicates the amount of parallel movement from the scribe reference line in mm. The reference line refers to a line connecting a pair of alignment marks or an edge of the substrate. Usually, in the internal cutting scribe, the line connecting the alignment marks becomes a reference line when the scribe is performed as it is, so the pitch may be zero. Therefore, the pitch is set to 0 in the internal scribe between the alignment marks af, rg... Oj, ao, bn. Further, for the outer cutting of the scribing method 1, the deviation amount from the end of the substrate, which is the reference line, is indicated by, for example, mm. In the recipe data table of FIG. 7, the scribe line OS1 for cutting is set to the scribe method 1, and the pitch is set to 5 mm which is a deviation amount from the reference line. For the scribe OS 2 that is cut off, the scribing method 1 and the pitch are set to -5 mm.

Here, by setting the absolute value of the amount of overhang of the inner cut smaller than the absolute value of the pitch of the outer cut, the inner cut scribe line orthogonal to the outer cut scribe line can intersect with the outer cut scribe line. . For example, in the case described above, the absolute value of the overhang amount of the inner cut scribe is 2, and the absolute value of the pitch of the outer cut scribe is 5, so that the r− between the alignment marks af as shown in FIG. The scribe line between g can be made to intersect with the scribe lines OS1 and OS2.

Now, the operation of scribing after creating the scribing execution recipe data table in this way will be described with reference to the flowchart of FIG. First, the brittle material substrate 107 is placed on the table 106 in accordance with the positioning pins 109 a and 109 b on the table 106. When scribe is started, data of one scribe line is read from the recipe data table held in advance in S21. For example, in the case of the recipe data table shown in FIG. 7, a line passing through the alignment mark af is read. In S22, the scribe line is set at the position of the reference line + pitch. In this case, the line connecting the alignment marks becomes the reference line, and the pitch is 0. Therefore, the line connecting the alignment marks becomes the scribe line as it is. Therefore, the control unit 122 moves the table 106 in the y-axis direction, and rotates the table 106 as necessary. The scribe head 112 is positioned so that a scribe line can be formed when the scribe head 112 is moved to the x-axis by the linear motor 113.

After this setting is completed, the scribing method is read in S23, and either inner cutting or outer cutting is selected. In the case of the inner cut, the process proceeds to step S24 to perform the inner cut scribe. In this case, the scribing is started from the position of the start overhang amount OH3 of the preset inner cutting scribe. Thereby, as shown in FIG. 2 mentioned above, scribing can be started from the inside of the brittle material substrate. Then, scribing is performed to the end position set by the end overhang amount OH4, and the scribing head is raised to finish scribing. In step S26, it is checked whether or not all the scribes in the recipe data table have been completed. If the scribe has not been completed, the process returns to step S21 and the same processing is repeated. Thus, scribing can be performed sequentially based on a preset recipe data table.

After completing the inner cut scribe of af, rg,..., Oj based on the recipe data table, the process proceeds to the outer cut scribe line OS1. In this case, the motor 105 is driven to rotate the table 106 by 90 °. In this case, a scribe line OS1 with an inner line of 5 mm parallel to the side of the substrate is cut off. Since the scribing method is 1, the scribing operation (scribing head lowering) is started from the outside of the brittle material substrate by the start overhang amount OH1 of the outer cut, and the brittle material substrate of the end overhang amount OH2 is started. Perform the scribe operation to the outside and raise the scribe head. Next, the inner scribe operation of the scribe lines ao, bn,. Further, the scribe line OS2 is subjected to outer scribe similarly to OS1. Accordingly, the brittle material substrate 107 shown in FIG. 5 can be scribed along a desired line. Since the scribing is finished, the process is finished.

Now, the division after the scribe line shown in FIG. 5 is formed will be described. First, as shown in FIG. 9A, the ridges of the substrate are removed along the two outer scribe lines OS1 and OS2. In this way, since the scribe lines af, rg,..., Oj are scribed to the end of the substrate, the brittle material substrate can be easily formed along these lines as shown in FIG. It can be divided into elongated shapes. Furthermore, after dividing | segmenting in this way, it can divide | segment further along scribe line ao, bn ... fj, and it can be set as a square-shaped product brittle material board | substrate (product LTCC board | substrate).

In this embodiment, the outer scribe line is defined as a scribe line that is shifted by a pitch parallel to the edge of the substrate, but there is an immediately preceding inner scribe line fj like the scribe line OS2. In this case, the position of the outer scribe line may be determined by setting an interval from this line. Also for the outer cutting, an alignment mark may be provided on the brittle material substrate in advance, and the outer cutting scribe may be executed based on the alignment mark.

In this embodiment, the outer-cut scribe lines OS1 and OS2 and the inner-cut scribe line perpendicular thereto are crossed. For this reason, after dividing the outer ridge along the outer-cut scribe line, the substrate can be easily divided along the scribe line perpendicular thereto. Since the outer cut and the inner cut can be arbitrarily set for each scribe line, they can be appropriately selected in consideration of facilitating division after scribing, extending the life of the scribing wheel, and the like. For example, all the scribes in either direction may be cut off. However, if the outer cutting scribe is minimized, damage to the blade edge can be reduced.

For example, as shown in FIG. 10A, for a brittle material substrate 107a having nine functional regions, two outer scribes parallel to the two opposing left and right sides of the brittle material substrate 107a among the scribe lines dividing each functional region. The lines OS3 and OS4 may be cut out and scribed. In FIG. 10A, the brittle material substrate 107a can be divided as it is by the lattice-shaped inner scribe lines and the two outer scribe lines OS3 and OS4 parallel to the two sides, and the two inner scribe lines are omitted. can do.

Further, as shown in FIG. 10B, another brittle material substrate 107b, one of the two scribe lines parallel to the two opposite sides of the scribe line dividing the functional region, in this case, only the right side is cut out and the scribe line OS3 is cut. Another outer-cut scriber OS5 may be provided outside the inner-cut scribe along the other side.

In this embodiment, the moving means moves the table in the y-axis direction, rotates the table, and moves the scribe head in the x-axis direction. Instead of this, the table may be moved in the x-axis and y-axis directions as the moving means, and the scribe head may be moved in the x-axis and y-axis directions.

In this embodiment, the brittle material substrate is a low-temperature fired ceramic substrate, but the present invention can also be applied to a glass substrate used for a liquid crystal panel or the like or other substrates.

In the present embodiment, the inner scribe and the outer scribe can be selected for each scribe line. However, the present invention is not limited to this. An inner / outer scribe line in which a start portion of one scribe line is internally cut and an end portion is externally cut may be used. Similarly, an outer / inner scribe line in which a start portion of one scribe line is an outer cut and an end portion is an inner cut may be used. In this case, four types of scribing methods can be selected: inner cutting, outer cutting, inner / outer cutting, and outer / inner cutting.

Further, in the present embodiment, alignment is performed using an alignment mark for each inner scribe line, but the pitch from one alignment mark or the pitch from the immediately preceding scribe line is set to set the position of the scribe line. You may make it decide.

Furthermore, in this embodiment, the start overhang amount and the end overhang amount are set for each inner cut and outer cut scribe, and the overhang amount is determined based on the data. However, the overhang amount is determined for each scribe line. It is also possible to set and scribe based on it.

The present invention can be widely used in a process of forming a scribe line on a ceramic substrate such as a low-temperature fired ceramic substrate or a brittle material substrate such as a glass substrate.

It is a figure which shows the external cutting scribe of a brittle material board | substrate. It is a figure which shows the internal cutting scribe of a brittle material board | substrate. It is a perspective view which shows the scribing apparatus by this Embodiment. It is a block diagram which shows the controller of this Embodiment. It is a figure which shows the brittle material board | substrate before scribing by this Embodiment. It is a flowchart which shows creation of the overhang amount before a scribe, and a recipe data table. It is a figure which shows an example of a recipe data table. It is a flowchart which shows the scribing operation | movement of the scribing apparatus by this Embodiment. It is a figure which shows the division | segmentation method of the brittle material board | substrate after scribe. It is a figure which shows the division | segmentation method of the brittle material board | substrate after scribe. It is a figure which shows the other example of the brittle material board | substrate before scribing by this Embodiment. It is a figure which shows the other example of the brittle material board | substrate before scribing by this Embodiment.

DESCRIPTION OF SYMBOLS 100 Scribe 101 Moving platform 102a, 102b Guide rail 103 Ball screw 104, 105 Motor 106 Table 107, 107a, 107b Brittle material board 108a, 108b CCD camera 109a, 109b Positioning pin 110 Bridge 111a, 111b Post 112 Scribe head 113 Linear motor 114 Holder 115 Scribing wheel 120 Controller 121 Image processing unit 122 Control unit 123 Input unit 124 Y motor driving unit 126 Rotating motor driving unit 127 Scribe head driving unit 128 Monitor 129 Recipe data holding unit

Claims (12)

A V-shaped blade is formed along the circumference of the disc-shaped wheel, the convergence angle of the V-shaped blade is 90 to 160 °, and grooves are regularly formed in the blade edge. The depth is 3 to 50 μm, the width of the groove is 15 to 100 μm, the diameter is 1 to 10 mm, the pitch (the length of one groove in the circumferential direction of the scribing wheel, and the formation of the groove The total length of one remaining protrusion) is 30 to 180 μm, and the length of one groove is longer than the length of one protrusion in the circumferential direction, and the material is sintered diamond ( A scribing wheel for forming a ceramic substrate scribe line (PCD). The scribing wheel for forming a ceramic substrate scribe line according to claim 1, wherein the ceramic substrate is a low-temperature fired ceramic substrate. A scribing device for scribing to divide a functional region formed on a ceramic substrate into product substrates by dividing each functional region,
The scribe type is an internal scribe from the inside of one side of the ceramic substrate to the inside of the other side, and an external scribe from the outside of one side of the ceramic substrate to the outside of the other side,
The scribing device is
A table on which the ceramic substrate is installed;
A scribing head provided so as to be movable up and down so as to face the ceramic substrate on the table, and holding the scribing wheel according to claim 1 at a tip thereof,
A moving means for moving the scribing head and the ceramic substrate in a state that the scribing wheel is pressed on the surface of the ceramic substrate,
A recipe data table indicating the scribe lines and the scribe contents including the type of the scribe line is previously held, and the scribe head and the ceramic substrate are relatively moved by the moving unit based on the recipe data table, and the scribe head And a controller that performs scribing according to the type of scribing by moving up and down. A scribing device for scribing to divide a functional region formed on a ceramic substrate into product substrates by dividing each functional region,
The type of the scribe, and the inner cutting scribing to the inside of the other side than the inner one side of the ceramic substrate, and an outer cutting scribing to the outside of the other side than the outer side of the ceramic substrate, the ceramic Inside and outside scribe from one side of the substrate to the outside of the other side, and outside and inside scribe from one side of the ceramic substrate to the inside of the other side,
The scribing device is
A table on which the ceramic substrate is installed;
A scribing head provided so as to be movable up and down so as to face the ceramic substrate on the table, and holding the scribing wheel according to claim 1 at a tip thereof,
A moving means for moving the scribing head and the ceramic substrate in a state that the scribing wheel is pressed on the surface of the ceramic substrate,
A recipe data table indicating the scribe lines and the scribe contents including the type of the scribe line is previously held, and the scribe head and the ceramic substrate are relatively moved by the moving unit based on the recipe data table, and the scribe head And a controller that performs scribing according to the type of scribing by moving up and down. The scribing apparatus according to claim 3 or 4 , wherein the ceramic substrate is a low-temperature fired ceramic substrate . In order to divide the functional region formed on the ceramic substrate into each functional region to obtain a product substrate, the scribing method is used for scribing by using a vertically movable scribing head holding the scribing wheel at the tip. There,
The type of scribe is divided into an inner scribe which is a scribe from one side of the brittle material substrate to an inner side of the other side, and an outer scribe which is a scribe from one outer side of the ceramic substrate to the outer side of the other side. When cutting and scribing,
A recipe data table indicating the scribe lines and the scribe contents including the type is stored in advance.
A scribing method in which the scribing head and the ceramic substrate are relatively moved based on the recipe data table, and the scribing head is moved up and down based on the recipe data table to perform scribing according to the type of scribing. In order to divide the functional region formed on the ceramic substrate into each functional region to obtain a product substrate, the scribing method is used for scribing by using a vertically movable scribing head holding the scribing wheel at the tip. There,
Scribing the type, the inner cutting scribing than the inner one side of the ceramic substrate is a scribing to inside other side, the outer cutting a scribe to the outside of the other side than the outer side of the ceramic substrate scribing and the inner and outer cutting scribing a scribe than the inner one side of the ceramic substrate to the outer other side, outside the cutting scribing a scribe to the inside of the other side than the outer side of the ceramic substrate And when
A recipe data table showing the scribe line and the scribe contents including its type is stored in advance,
A scribing method in which the scribing head and the ceramic substrate are relatively moved based on the recipe data table, and the scribing head is moved up and down based on the recipe data table to perform scribing according to the type of scribing. The ceramic substrate is a functional area formed in a lattice shape,
The inner cutting scribe is performed in a lattice shape so as to be divided into each functional region of the ceramic substrate,
The scribing method according to claim 6 or 7 , wherein the outer scribing is performed along the opposite parallel ridges. The ceramic substrate is formed with a plurality of functional regions,
When performing scribing so as to divide the ceramic substrate into functional areas, the outermost scribe along two opposing sides of the ceramic substrate is an outer scribe, and the other scribe is an inner scribe. Item 8. The scribing method according to Item 6 or 7 . The ceramic substrate is formed with a plurality of functional regions,
When performing scribing to divide the ceramic substrate into functional areas, one of the outermost scribes along the two opposing sides of the ceramic substrate is an outer scribe, and the other scribe is internally cut. The scribing method according to claim 6 or 7, wherein scribing is performed and outer cutting scribe is performed outside the inner cutting scribe along the other side of the two sides. Scribe line of the outer cutting scribing, of scribe lines in said cutting scribing any one of claims 8 to 10 which is formed so as to cross the direction of the scribe lines perpendicular to the scribe line of the outer cutting The scribing method described. The scribing method according to any one of claims 6 to 11 , wherein the ceramic substrate is a low-temperature fired ceramic substrate .