JP2016003181A5 - - Google Patents

Claims (10)

A scribing method for forming a scribe line on a brittle material substrate including a first surface and a second surface relative to the first surface, wherein the scribing method comprises:
(A) setting a plurality of planned dividing lines extending along each of at least a first direction and a second direction not parallel to the first direction on the first surface of the brittle material substrate; ,
(B) The scribing unit scribes along a plurality of planned dividing lines and applies a variable load to the scribe unit, thereby forming at least one first scribe line in the first direction. And forming at least one second scribe line in a second direction intersecting the first scribe line, and
The at least one first scribe line and the at least one second scribe line intersect to form at least one intersection;
(C) The load applied to the scribe unit when forming the at least one first scribe line is P1 when the scribe unit is not in the vicinity of the at least one intersection, and the scribe unit Is in the vicinity of the at least one intersection, the load is M1;
(D) The load applied to the scribe unit when scribing the at least one second scribe line is P2 when the scribe unit is not in the vicinity of the at least one intersection, and the scribe unit And the load when M is in the vicinity of the at least one intersection is M2, and
(E) A scribing method for a brittle material substrate in which both M1 and M2 are at least smaller than P1 and P2 and not 0.   The brittle material substrate scribing method according to claim 1, wherein P1 = P2.   The brittle material substrate scribing method according to claim 1, wherein P1> P2.   The brittle material substrate scribing method according to claim 1, wherein P1 <P2.   The region near the intersection is a rhombus region defined by two intersecting first scribe lines and parallel lines separated from the second scribe line by 0.2 mm to 1.0 mm. The brittle material substrate scribing method described.   The brittle material substrate scribing method according to claim 1, wherein the brittle material substrate has a thickness of 0.025 to 40 mm.   The brittle material substrate scribing method according to claim 6, wherein the brittle material substrate is a liquid crystal substrate having a thickness of 0.3 to 0.7 mm.   The brittle material substrate scribing method according to claim 1, wherein the range of P1 and P2 is between 0.05 MPa and 0.11 MPa.   The brittle material substrate scribing method according to claim 1, wherein the range of M1 is between 0.05 MPa and 0.07 MPa, and the range of M2 is between 0.05 MPa and 0.09 MPa.   A brittle material substrate scribing apparatus for scribing a brittle material substrate by the brittle material substrate scribing method according to claim 1.