TWI434815B - The method of marking the substrate - Google Patents

Description

Scribe method of bonding substrate

The present invention relates to a method of scribing a bonded substrate in which a score line is formed in advance when the bonded substrate is divided, and more specifically, a cutter wheel (also referred to as a scoring wheel) is formed on both sides of the bonded substrate. The scribing method of the affixed substrate.

Fig. 5 is a cross-sectional view showing a bonded glass substrate used in the manufacture of a liquid crystal panel. In the process of a liquid crystal panel or the like, a mother substrate M (mother substrate) having a large area in which two thin glass substrates G1 and G2 (the second substrate G2 on the front side of the first substrate G1 on the front side) are bonded to the bonding material 11 is used. The article to be manufactured from such a mother substrate M includes a step of dividing into a unit substrate U which becomes each product unit.

The step of breaking into each unit substrate U is generally performed in the flow shown below. First, as shown in FIG. 6, the surface of the first substrate G1 of the mother substrate M is formed with a scribe line S1 in the X direction by the cutter wheel, and secondly, the intersection of the scribe line S2 in the Y direction intersecting with the X direction is formed. Draw. When the plurality of intersecting scribe lines are formed in a lattice shape in the X-Y direction, the mother substrate M is sent to the breaking device, and the breaking bar is pressed from the second substrate G2 side to bend the first substrate G1 along each scribe line. Thereby, the first substrate G1 is broken into each unit substrate U. At this time, since the second substrate G2 is not yet broken, the broken first substrate G1 is fixed to the second substrate G2 by the bonding material 11, and is not separated into each unit substrate U.

Next, as shown in FIG. 7, the second substrate G2 is formed with a scribe line S3 in the X direction, and secondly, a cross scribe line S4 is formed in the Y direction, and then the second substrate G2 is broken by the breaking device. At this time, the mother substrate M is separated into each unit substrate U.

As described above, when the bonded substrate is divided, each of the first substrate G1 and the second substrate G2 is cross-scribed.

As a cutter wheel for forming a score line on the mother substrate M, a cutter wheel 1a (referred to as a common cutter wheel 1a) having a smooth blade leading edge ridge portion 2 as shown in FIG. 8 is used, as shown in FIG. The blade leading edge ridge portion 2 is provided with a notch 3 (groove) to prevent the substrate from slipping and to improve the permeability of the cutter wheel 1b (referred to as a grooved cutter wheel 1b) (see Patent Document 1).

The conventional cutter wheel 1a of the former is formed by grinding the both sides of the blade leading edge ridge portion 2 in order to form the inclined faces on both sides of the blade leading edge ridge portion 2. In the inclined surface, although the unevenness of the ground streaks is formed, it is fine. Generally, the center line average roughness Ra (JIS B 0601-1982) of the blade leading edge ridge portion 2 is 0.4 μm or less. As described above, the leading edge of the conventional cutter wheel 1a is formed with a very smooth ridge line.

Specifically, the slotted cutter wheel 1b of the latter has an "APIO (registered trademark)" cutter wheel manufactured by Samsung Diamond Industries. The grooved cutter wheel 1b is characterized in that the circumferential length of the notch (groove) is shorter than the circumferential length of the projection portion (the ridgeline length between two adjacent notches). For example, in the "APIO" cutter wheel having an outer diameter of 3 mm, the depth of the notch is about 1 μm, and the length of the notch in the circumferential direction is about 4 to 14 μm (so that the length of the protruding portion in the circumferential direction is 14 μm or more).

In addition, as the type of the cutter wheel having the groove, in addition to the above-mentioned "APIO" cutter wheel, there is also a gap for the edge of the blade leading edge to perform the scribe having a higher permeability than the cutter wheel. A grooved cutter wheel having a length in the circumferential direction longer than the circumferential direction of the protruding portion (for example, "Penett (registered trademark)" cutter wheel manufactured by Samsung Diamond Industries, Ltd.). A grooved cutter wheel projection of a type in which the length of the notch in the circumferential direction is longer than the circumferential length of the protruding portion increases the impact of the impact on the substrate, and a deep vertical crack can be formed on the substrate. This type is mainly used for a high-permeability cutter wheel that is used only when the breaking step is used and is broken only by the scoring step, so the breaking method accompanying the breaking step is not used.

Therefore, in the case of dividing the bonded substrate by the breaking method with the breaking step after the scribing step, the conventional cutter wheel 1a (hereinafter referred to simply as the N-type wheel 1a) is used, and the circumferential length of the notch is made larger than the circumferential direction of the protruding portion. One of the "APIO" cutter wheels (hereinafter referred to as A-type wheels 1b) of short length.

Patent Document: International Publication No. WO2007/004700

Here, the characteristics of the scribed processing by the N-type wheel 1a and the A-type wheel 1b will be described. Since the N-shaped wheel 1a is smoothed by the blade edge ridge line, it is possible to perform the scribe process in which the groove surface of the scribe line formed by the substrate is much stronger than the end face strength of the A-shaped wheel 1b formed without scratches. On the other hand, the permeability of the scribe line formed (the depth of the grooving) and the separation after the scribe line formation are inferior to those of the A-type wheel 1b. Therefore, in the case where the X direction and the Y direction which are orthogonal to each other are cross-scribed, there is a case where the "intersection jump" phenomenon in which the intersection portion scribe line cannot be formed occurs. It is difficult to break the substrate along the predetermined scribe line when the phenomenon of "intersection jump" occurs, and it becomes a defective product. Further, even in the case where the "intersection jump" phenomenon does not occur, the separation property is insufficient, and thus it is necessary to apply an excessive load to break when breaking, which may cause damage to the substrate.

On the other hand, the A-shaped wheel 1b is formed with a notch in the ridgeline of the leading edge of the blade, so that the permeability of the scribe line is superior to that of the N-type wheel 1a, and the depth of the groove formed is deeper than that of the N-type wheel 1a, and the card for the substrate The degree of difficulty (sliding difficulty) is improved, and it is possible to carry out the scribe process in which the intersection point is less likely to occur at the intersection point when the cross is scribed. On the other hand, a small flaw is formed in a portion of the groove surface of the scribe line formed on the substrate at the corner of the notch of the A-shaped wheel 1b, so that the end face of the scribe line formed by the N-shaped wheel 1a is inferior in strength. . In the case of the process of the liquid crystal panel, liquid crystal is sealed between the substrates, so that the reduction in the end face strength is fatal.

As described above, when the substrate is cross-scribed, it is necessary to select the optimum cutter wheel from the viewpoint of the "intersection jump" phenomenon and the end face strength, but the case where the N-type wheel 1a is used and the A-type wheel are used. There are advantages and disadvantages in the case of 1b.

In view of the above problems, the present invention has an object of providing a method of scribing a bonded substrate which can reliably prevent the occurrence of a "cross-point jump" phenomenon in cross-cutting and which can obtain sufficient end face strength in a cross-section of a bonded substrate.

Further, in the present invention, it is possible to maintain a certain end face strength by maintaining the balance of the end face strengths of the respective cross-sections at the time of breaking the bonded substrate, and to avoid forming a cross-section having a weak end face strength.

In order to solve the above object, the following technical means are employed in the present invention. That is, the scribing method of the bonded substrate of the present invention is a method of scribing a bonded substrate, in which the first substrate and the second substrate are bonded to each other in a first direction and a second direction When dividing, the scribe lines are formed in the first direction and the second direction in advance on the substrates of the first substrate and the second substrate, wherein the gaps and the protrusions are formed alternately along the circumferential ridge lines, and the circumferential length of the notches is larger than the protrusions. a first cutter wheel having a short length in the circumferential direction and a pitch of the notch; and a gap and a protrusion formed alternately along the circumferential ridge line, and the circumferential length of the notch is shorter than the circumferential length of the protrusion and the pitch of the notch is longer than the foregoing a slotted cutter wheel of a second cutter wheel having a short length; a first direction of the first substrate is formed by a first cutter wheel; and a second direction of the first substrate is formed by a second cutter wheel The second substrate is formed with a first scribing wheel to form a scribe line; and the first direction of the second substrate is formed by a second cutter wheel to form a scribe line.

According to the scribed method of the bonded substrate of the present invention, two types of cutter wheels are formed which alternately form notches and projections along the circumferential ridge line and have a length in the circumferential direction of the notch shorter than the circumferential length of the projection. Thereby, it is possible to perform scribe processing which is not easy to slide and has excellent separation property. Among the two types, the score line formed by the first cutter wheel is longer than the pitch formed by the second cutter wheel because the pitch of the notch is long, so that the first cutter wheel can perform the process of preferentially matching the end face strength to the permeability. Conversely, the second cutter wheel can perform processing that prioritizes permeability more than end face strength. According to the invention, one of the first substrate and the second substrate formed in the first direction is formed by the first cutter wheel, and the other is formed by the second cutter wheel. Further, regarding the scribe line formed in the second direction, one of the first substrate and the second substrate is formed by the first cutter wheel, and the other is formed by the second cutter wheel. Therefore, in any one of the first direction and the second direction, each of the ones having the scribe line formed by the first cutter wheel and the second cutter wheel is separated, in the first direction and the second direction. In either direction, it is necessary to perform the processing using the first cutter wheel with strong strength of one of the end faces of the substrate. That is, the first direction and the second direction are averaging the permeability and the end face strength to achieve a balance. In addition, there is no cross section formed by the scribe line with only weak end face strength, so the end face strength is ensured.

Here, the first cutter wheel and the second cutter wheel have the same wheel diameter, and the number of notches of the first cutter wheel is smaller than the number of notches of the second cutter wheel.

Generally, the thicker the thickness of the substrate is, the more it is necessary to increase the pressing load at the time of cutting. Therefore, the wheel diameter is determined according to the thickness of the scribed substrate, but the first substrate is scribed first. Both the cutter wheel and the second cutter wheel are similarly used for the second substrate to scribe the first cutter wheel and the second cutter wheel, so that the two types of wheels are preferably the same diameter. In this case, from the relationship with the pitch of the notch, of course, the number of notches of the first cutter wheel is smaller than the number of notches of the second cutter.

Further, the ratio of the number of notches of the first cutter wheel to the second cutter wheel is preferably from 1/10 to 1/100.

By changing the ratio of the number of notches by one or more, even if it is a grooved cutter wheel, the end face strength or permeability can be greatly changed, and the characteristics of the present invention can be highlighted. However, if the ratio of the number of notches is excessively increased, one of them will become a large number of notches, and the manufacture of the wheel becomes difficult. Therefore, it is practically 1/10 to 1/100.

Specifically, it is preferable that the number of the notches of the first cutter wheel is in the range of 5 to 50, and the number of the notches of the second cutter wheel is 50 to 500.

Further, the wheel diameter is 2 mm to 3 mm, and the circumferential length of the notch is preferably 4 μm to 14 μm.

The details of the scribing method of the bonded substrate of the present invention will be described in detail based on the drawings. In the embodiment described below, as will be described later, the second substrate is not scribed after the first substrate is scribed, but the first substrate is first moved to the breaking device and then broken, and then the second substrate is scribed. In the breaking process, for example, a breaking device of a type in which the breaking bar is pressed is used. However, in the practice of the present invention, the degree of freedom of breaking is large, and the breaking device or the breaking method is not limited thereto. Further, the breaking process may be performed after the first substrate and the second substrate are first scribed.

Fig. 1 is a schematic front view showing an embodiment of a scoring apparatus used in carrying out the scribing method of the bonded substrate of the present invention.

In the mother substrate M to be subjected to the scribing process, two glass substrates are bonded to each other, and a pattern is formed so that the unit structures of the liquid crystal panel are arranged in the XY direction, and the mother substrate M is divided into each unit structure. The product is available in the body.

The scribing device SC is provided with a platform 4 that can be rotated in a state in which the mother substrate M is horizontally placed, and the platform 4 is supported as a rail 5 that can be moved in one direction (perpendicular to the paper surface of FIG. 1) on the platform 4 The guide bar 6 in the direction in which the bridge is orthogonal to the track 5 (the left-right direction in FIG. 1) is formed as a base 7a, 7b which can be moved along the guide bar 6 and can be lifted and lowered. The cutter holders 8a, 8b at the lower ends of the scribe heads 7a, 7b.

Further, a grooved first cutter wheel 12 is attached to the tool holder 8a, and a grooved second cutter wheel 13 is attached to the tool holder 8b.

Both the first cutter wheel 12 and the second cutter wheel 13 are of the "APIO" type, and even a grooved cutter wheel having a length in the circumferential direction of the groove of the blade leading edge ridge is shorter than the circumferential direction of the projection. Although the wheel diameter is the same, the number of notches of the first cutter wheel 12 is smaller than the number of the notches of the second cutter wheel 13, so that the notch pitch of the blade leading edge ridge is such that the first cutter wheel 12 is smaller than the second cutter wheel 13 long.

Specifically, for example, the wheel diameter is 3 mm, the depth of the notch is 1 μm, and the length of the notch of the first cutter wheel 12 is 4 μm to 14 μm, and the number of notches is 5 (thus, the pitch of the notch is 1884 μm (3 mm*). π/5)), the length of the notch of the second cutter wheel 13 is 4 μm to 14 μm, and the number of notches is 300 (thus, the pitch of the notch is 31 μm (3 mm * π / 300)).

The ratio of the number of gaps in this case is 1/60 (that is, 5/300).

Next, an explanation will be given of the operation performed by the scribing device SC. 2 and 3 are views showing a processing flow of a scribing method of the bonded substrate of the present invention.

The mother substrate M is placed on the stage 4 such that the first substrate G1 faces upward and the X direction (first direction) coincides with the direction of the track 5. Thereafter, the scribe line S1 in the X direction is sequentially formed using the first cutter wheel 12 (FIG. 2(a)).

Next, the stage 4 is rotated by 90 degrees, and after the Y direction (second direction) is aligned with the direction of the track 5, the second direction wheel 13 is used to sequentially form the scribe line S2 in the Y direction. At this time, although the intersection with the score line S1 is crossed, the second cutter wheel 13 having a high permeability is used, so that the "intersection jump" phenomenon does not occur (Fig. 2(b)).

Next, the mother substrate M is moved to the breaking device. The mother substrate M is reversed so that the second substrate G2 faces upward, and the first substrate G1 is broken by bending the substrate by abutting the break bar from the side of the second substrate G2 along the back side of the previously formed scribe lines S1 and S2. (Fig. 2(c)). At this time, the first substrate G1 is broken into each unit substrate, but since each unit substrate is followed by the second substrate G2, it is not separated.

Next, the mother substrate M is moved to the scribing device SC, and the mother substrate M is placed such that the second substrate G2 faces upward and the Y direction (second direction) coincides with the direction of the track 5. Thereafter, the scribe line S3 in the Y direction is sequentially formed using the first cutter wheel 12 (FIG. 3(a)).

Next, the stage 4 is rotated by 90 degrees, and after the X direction (first direction) is made to coincide with the direction of the rail 5, the X-direction scribe line S4 is sequentially formed using the second cutter wheel 13. At this time, although the intersection with the score line S3 is crossed, the second cutter wheel 13 having a high permeability is used, so that the "intersection jump" phenomenon does not occur (Fig. 3(b)).

Next, the mother substrate M is moved to the breaking device. The mother substrate M is reversed so that the first substrate G1 faces upward, and the second substrate G2 is broken by bending the substrate by abutting the break bar from the side of the first substrate G1 along the back side of the previously formed scribe lines S3, S4. (Fig. 3(c)). At this time, the first substrate G1 and the second substrate G2 are loosely separated into each unit substrate in a state of being bonded.

Fig. 4 is a view showing the state of the end face strength of the unit substrate which is broken by the above-described flow. In the cross-section, one of the first substrate 12 and the second substrate 13 is scribed by the first cutter wheel 12, and the other is scribed by the second cutter wheel 13. Therefore, the strength of the end face of one of the substrates is strong, and the other substrate is The end face strength is weaker than the end face strength E1 of the one of the substrates. The strength of the end face of the entire bonded substrate is averaged, and the presence of the substrate on the side where the end face strength is strong can ensure the processing of the end face strength of the bonded substrate and the occurrence of the "intersection jump" phenomenon.

In the present embodiment, the scribe lines formed on the upper and lower substrates are all end faces of the same plane. However, the present invention can be directly applied to the case where the end faces of the step faces are formed for the formation of the terminal regions.

Further, the present invention can also be used as a brittle material substrate other than a glass substrate.

[Industrial availability]

The scribing method of the bonded substrate of the present invention can be utilized when the bonded substrate such as a glass substrate is cut.

M. . . Bonding substrate

G1. . . First substrate

G2. . . Second substrate

E1. . . Strong end face strength

E2. . . Weak end face strength

S ₁ . . . Marking of the first direction of the first substrate (X direction)

S ₂ . . . Marking the second direction (Y direction) of the first substrate

S ₃ . . . Marking the second direction (Y direction) of the second substrate

S ₄ . . . Marking the first direction (X direction) of the second substrate

12. . . First cutter wheel (slotted cutter wheel)

13. . . Second cutter wheel (slotted cutter wheel)

Fig. 1 is a front elevational view showing an example of a scoring apparatus used in carrying out the scribing method of the bonded substrate of the present invention.

Fig. 2 is a view showing the processing flow of the scribing method of the bonded substrate of the present invention.

Fig. 3 is a view showing the processing flow of the scribing method of the bonded substrate of the present invention, continued from Fig. 2;

Fig. 4 is a view showing a state of the end face strength of the unit substrate which is cut by the scribing method of the bonded substrate of the present invention.

Fig. 5 is a cross-sectional view showing a bonded glass substrate used in the manufacture of a liquid crystal panel.

Fig. 6 is a view showing a processing flow of a conventional bonded substrate.

Fig. 7 is a view showing a processing flow of a conventional bonded substrate.

Fig. 8 is a view showing the shape of a conventional cutter wheel.

Figure 9 is a diagram showing the shape of a grooved cutter wheel.

M. . . Bonding substrate

G1. . . First substrate

G2. . . Second substrate

U. . . Unit substrate

11. . . Subsequent

Claims (4)

A method for scribing a bonded substrate, wherein the first substrate and the second substrate are separated in a first direction and a second direction in which the first substrate and the second substrate are bonded to each other Each of the substrates forms a scribe line in the first direction and the second direction, wherein the notches and the protrusions are alternately formed along the circumferential ridge line, and the circumferential length of the notch is shorter than the circumferential length of the protrusion and the pitch of the notch is the first length a first cutter wheel; and two grooves having a second cutter wheel that alternately form a notch and a projection along the circumferential ridge line and have a length in the circumferential direction of the notch shorter than a circumferential length of the protrusion and a pitch of the notch shorter than the first length a first wheel of the first substrate is formed by a first cutter wheel; the second direction of the first substrate is formed by a second cutter wheel; and the second direction of the second substrate is A cutter wheel forms a score line; the first direction of the second substrate forms a score line with the second cutter wheel. The method for marking a bonded substrate according to claim 1, wherein the first cutter wheel and the second cutter wheel have the same wheel diameter, and the number of notches of the first cutter wheel is smaller than the number of notches of the second cutter wheel. The method for scoring a bonded substrate according to claim 2, wherein the ratio of the number of notches of the first cutter wheel to the second cutter wheel is 1/10 to 1/100. The method for scoring a bonded substrate according to the third aspect of the patent application, wherein the wheel diameter is 2 mm to 3 mm, and the circumferential length of the notch is 4 μm to 14 μm.