201235323 六、發明說明： 【發明所屬之技術領域】 本發明係關於分斷貼合基板時，預先形成刻劃線之貼 合基板之刻劃方法，更詳言之係關於使用刀輪（亦稱為刻 劃輪）於貼合基板之兩面分別形成刻劃線之貼合基板之刻 劃方法。 【先前技術】 圖5係於液晶面板之製造使用之貼合玻璃基板之剖面 圖。在液晶面板等之製程係使用2片薄玻璃基板gi、G2(表 側之第一基板G1裡側之第二基板G2 )以接著材丨丨貼合之 大面積之母基板Μ (母基板）。欲從此種母基板μ製造製 品係包含分斷為每一個成為製品單位之單位基板u之步驟。 分斷為每一個單位基板U之步驟一般係以於以下顯示 之流程進行。首先，如圖6所示，對母基板M之第—基板 G1之表面以刀輪在X方向形成刻劃線 與X方向交又之Y方向之刻劃線S2之交叉刻劃 x-γ方向將交叉之複數條刻劃線形成為格子狀後，母基板河 係送往折斷裂置，從第二基板G2側以折斷棒㈣，使第一 基板⑴沿各刻劃線彎曲。藉此，第一基板G1折斷為每一 =位基板u。此時，由於第二基板〇2尚未分斷，故折斷 弟:基板Gi藉由接著材u固著於第二基板⑺，不會分 離為每一個單位基板U。 接著’對第二基板G2如圖7所示同樣形成X方向之刻 201235323 劃線S3’其次’進行形成Y方向之刻劃線S4之交叉刻劃， ^送往折斷裝置折斷第二基板G2。此時，母基板]V[分 離為每一個單位基板u。 如上述，於將貼合基板分斷時，對第一基板G1、第二 基板G2之各基板進行交叉刻劃。 做為為了於母基板M形成刻劃線之刀輪，使用如圖8 所示之具有平滑刀前緣稜線部2之刀㉟“（稱為普通刀輪 1 a )'如圖9所示之於刃前緣棱線部2設缺口 3 (槽）使對 基板不易滑動且提高滲透性之刀輪lb(稱為具槽之刀輪⑹ (參照專利文獻1 )。 前者之普通刀輪U係為了形成刃前緣稜線部2之兩側 之傾斜面而將刃前緣稜線部2之兩側以砥石研削。於傾斜 :雖有研削條痕之凹凸形成但為微細，通常，刃前緣棱線 〇之中心線平均粗度以（瓜8〇6〇1_1982 )為〇4^未 滿°如上述普通刀輪U之刃前緣係形成有非常平滑之棱線 面。 於後者之具槽之刀輪lb具體而言有三星鑽石工業社製 之「API〇(註冊商標）」刀輪。此具槽之刀輪Μ使缺口 (槽）之周方向長度比突起部分之周方向長度（2個鄰接之 缺口之間之棱線長度）短為特徵。例如在輪外& 3賴之 「ΑΡΙ0」刀輪，缺口之深度為程度，缺口之周方向 長度為4〜14Mm程度（因此突起部分之周方向長度為; V in以上)。 又’ ’ ’、 另外，做為具槽之刀輪之種類，除上述之「AMO」刀 201235323 輪以外，亦有以進行比該刀輪更具有高㈣ 之缺口之周方向長度比突起部分 了向長度更長之具槽之刀輪（例如三星鑽：：周 ρ_(註冊商標）」刀輪）。缺口之周方向長二^之 r之周方向長度更長之類型之具槽之刀輪係突：：起 給予之打點衝擊變大，可於基板形成深垂直裂痕基板 型=係於不進行折斷步驟而僅以刻劃步驟分斷：： 局渗透性刀輪，故在伴隨折斷步驟之分斷方法不使用用之 因此，在以於刻劃步驟後伴隨折斷步驟 ::合基板時係利用普通刀輪1掏簡稱為 吏缺口之周方向長度比突起部分之周方向長度短之「A 刀輪（以後簡稱為A型輪lb)其中之一。 專利文獻：國際公開號w〇2〇〇7/〇〇47〇〇公報 【發明内容】 [發明欲解決之課題] 在此，針對以N型輪13與a型輪11}進行之刻劃加工 、寺徵說θ N型輪1 a由於刃前緣棱線加工為平滑，故可 進行於基板形成之刻劃線之槽面遠比以A錄_成者無 蚩;艮之鈿面強度強之優良刻劃加工。反之，關於形成之刻 4之參透性（切槽之深度）、刻劃線形成後之分離性則 比A型輪11)差。因此，在於互相正交之X方向與Y方向 進了交又刻劃之場合，I生有於交點部分刻劃線不能形成 之「交點跳躍」現象產生之場合。產纟「交點跳躍」現象 201235323 之基板沿預定之刻劃線之分斷變困難，成為不良品。此外， 即使在「交點跳躍」現象不發生之場合，分離性亦不充分， 故會產生於折斷時需要施加過大之荷重來分斷之場合，可 能成為基板破損之原因。 相對於此，A型輪lb係於刃前緣棱線形成有缺口，故 刻劃線之滲透性比N型輪la更優良，形成之切槽之深度比 N型輪U深，對基板之卡度（滑動困難度）改善，可進行 於交叉刻劃時之交點部分不易產纟「交點跳躍」現象之刻 劃加工。另一方面，於形成於基板之刻劃線之槽面於A型 輪ib之缺口之角接觸之部分形成小傷痕，故比以n型輪 形成之刻劃線分斷面之端面強度差。在液晶面板之製程之 場合’於基板間封人有液晶’故端面強度之降低係致命的。 如上述，於對基板進行交又刻劃之場合，必須從「交 點跳躍」現象與端面強度之2個觀點選擇最佳之刀輪來加 工’但在使用N型輪la之場合與使用A型輪^之場合各 有優劣。 針對上述問題，本發明係以提供可確實防止在交叉刻 劃之「交點跳躍」!見象之產生且可於貼合基板之分斷面獲 得充分之端面強度之貼合基板之刻劃方法為目的。 此卜本”係以於貼合基板之分斷時藉由保持各分 斷面之端面強度之平衡來雜姓 . 卞衡來維持一定以上之端面強度，避免 形成知面強度弱之分斷面為目的。 [解決課題之手段] 為了解決上述目的，在本發明係㈣如下之技術手 201235323 段。亦即，本發明之貼合基板之刻劃方法係一種貼合基板 之刻劃方法，在將貼合有第—基板與第二基板之貼合基板 ’口互相交叉之第一方向與第二方向分斷時，預先於第一美 :與第二基板之各基板於第一方向與第二方向形成刻： 、.其特徵在於：使用沿圓周稜線交互形成缺口盘突起且 2口之周方向長度比突起之周方向長度短且缺口之節距為 長度之第-刀輪，·及沿圓周稜線交互形成缺口斑突起 讀口之周方向長度比突起之周方向長度短且缺口之節距 比別述第-長度還短之第二刀輪< 2種具槽之刀輪；第一 基板之第一方向係以第—刀輪形成刻劃線；第一基板之第 -方向係以第二刀輪形成刻劃線；第二基板之第二方向係 =第一刀輪形成刻劃線；第二基板之第一方向係以第二刀 輪形成刻劃線。 [發明之效果] 根據本發明之貼合基板之刻劃方法，使用沿圓周棱線 =形成缺口與突起且缺口之周方向長度比突起之周方向 ，紐之2種刀輪。藉此，可進行不易滑動且分離性優良 劃加工。2種類之中，以第—刀輪形成之刻劃線比以第 :刀輪形成之刻劃線因缺口之節距長，故第—刀 =面強度比渗透性優先之加工。反之第二刀輪可進行將 -透性比端面強度優先之加工。根據本發明，形成於第— ^向之刻劃線係第一基板與第二基板之中-方以第-刀輪 :成3方以第二刀輪形成。此外，關於形成於第二方 向之刻劃線亦第―其4 基板與第二基板之中一方以第一刀輪形 201235323 成，另-方以第二刀輪形成。因此，传 二方向之任-方向皆形成各丨條有由第— 方向與第 形成之刻劃線之狀態下分斷刀輪與第二刀輪 一方向皆必定進行一方 ； 。與第二方向之任 之加工。料，第一方二=端面強度強之使用第-刀輪 強度平均化㈣二方向係進行滲透性與端面 弱之刻_成1==此外’沒有只有端*強度 取之刀斷面，故確保端面強度。 在此帛刀輪與第二刀輪係輪徑相同 缺口數比第二刀輪之缺口數小較理想。 刀輪之 -般刻劃之基板之板厚越厚，越有提高切斷時之按壓 何重之必要，因此輪徑係依據刻劃之基板之板厚決定，作 用於第-基板之刻劃的是第一刀輪與第二刀輪雙方，同樣 地用於第二基板之刻劃的是第—刀輪與第二刀輪雙方，故2 種類之輪選擇同徑較理想。在此場合，從與缺口之節距之 關係，當然第一刀輪之缺口數比二刀之缺口數小。 此外，第一刀輪與第二刀輪之缺口數之比為丨/10〜 1/100較理想。 藉由使缺口數之比變化一位以上，即使為具槽之刀 輪’亦可使端面強度或滲透性大幅變化，可凸顯本發明之 特徵》但若使缺口數之比過度增大，一方會成為龐大之缺 口數而輪之製造變困難，故實用上係1/10〜1/100程度較理 想。 具體而言係選擇以第一刀輪之缺口數為5〜50個之範 圍，第二刀輪之缺口數為50〜500個之範圍成為上述比率 201235323 較理想。 缺口之周方向長度為4 此外，使輪徑為2mm〜3: # m二14 # m較理想。 【實施方式] 基於圖式詳細說明本發明之貼合基板之刻劃方法之詳 細。在以下說明之實施形態係如後述，並非於刻劃第一某 板後接著刻劃第-其3 + 彳第―基板而疋先將第一基板移動至折斷穿· =棒:Γ再刻劃第二基板。在折斷處理雖係使用例如 斷之自由度Γ之類型之折斷裝置’但於本發明之實施中折 ，折斷裝置或折斷方法不限於此。此外，# 斷處理在先谁并斜曾^ 此外，折 可。 土板與第二基板之刻劃後才進行亦 之刻劃*係‘1V實施本發明之貼合基板之刻劃方法時使用 y進二置之—實施形態之概略前視圖。 板，以H劃曰加工之對象之母基板"^係貼合有2片玻璃基 成有圖案;aa面板之單位構造體方向排列之方式形 得製品。 由將母基板M分斷為每一個單位構造體可獲 刻劃裳署 旋轉之平4 C具備可在將母基板Μ水平載置之狀態下 之紙面之方。將此平台4支持為可於一方向（垂直於圖i 道5正交移動之軌道5、在平台4之上方橋架於與軌 此導?丨棒方向（圖1之左右方向）之導引棒6、設為可沿 土之刻劃頭7a、7b、可升降地裝著於 201235323 刻劃頭7a、7b之下端之刀具保持具。 此外，於刀具保持具8a安裝有具槽之第一刀輪12，於 刀具保持具8b安裝有具槽之第二刀輪丨3。 第一刀輪12與第二刀輪13皆為「ApI〇」類型，亦即 使位於刃刖緣稜線之槽之周方向長度比突起之周方向長度 短之具槽之刀輪。輪徑雖使為相同，但使第一刀輪12之缺 口數比第二刀輪13之缺口數少，因此刃前緣稜線之缺口枝 節距係使第一刀輪12比第二刀輪13長。 具體而言，例如，使輪徑皆為3mm，缺口之深度為^ //m，使第一刀輪Η之缺口之周方向長度為〜丨 m，缺口數5(因此，缺口之節距1884vm(3mms^/5))， 使第二刀輪13之缺口之周方向長度為4//〇1〜14#爪，缺口 數300 (因此，缺口之節距31心（3ηπη*π/3〇〇))。 此場合之缺口數之比係1/6〇(亦即5個/3〇〇個）。 /其次，針對使用刻劃裝置sc進行之動作說明。圖2、3 係顯示本發明之貼合基板之刻劃方法之加工流程之圖。 於平台4上將母基板Μ載置為使第—基板&朝上且X 方向（第一方向）一致於軌道5之方向。之後，使用第一 刀輪12依序形成X方向之刻劃線s丨（圖2 ( & ))。 接著，使平台4旋轉9〇度，在使γ方向（第二方向） -致於軌道5之方向後，使用第二刀輪13依序形^方向 之刻劃線S 2。此時在與刻割線s !之交又部分雖進行交又刻 :，但由於係使用渗透性較高之第二刀輪π，故「交點跳 躍」現象不會產生（圖2(b))。 10 201235323 接者，將母基板Μ移動至折斷裝置。將母基板Μ反轉 吏第—基板G2朝上，藉由沿先前形成之刻劃線81、以之 裡側將折斷棒從第二基板G2側抵接使基板f曲來將第一基 :反⑴折斷（圖2(e))。此時第—基板⑴雖折斷為每一 個單位基板，❻因各單位基板係接著於第二基板㈤，故不 會分離為零散。 接著，再將母基板厘移動至刻劃裝置SC，將母基板Μ 載置為使第二基板G2朝上且¥方向（第二方向）_致於軌 道5之方向。之後，使用第一刀輪。依序形成丫方向之刻 劃線S3 (圖3 ( a))。 接著，使平台4旋轉90度，在使χ方向（第一方向） -致於轨道5之方向後，使用第二刀輪13依序形成乂方向 之刻㈣S 4。此時在與㈣線s 3之交又部分雖進行交叉刻 劃，但由於係使用滲透性較高之第二刀輪i 3，故「交點跳 躍」現象不會產生（圖3(b))。 接著，再將母基板Μ移動至折斷裝置。將母基板厘反 轉使第-基板G1朝上，藉由沿先前形成之刻劃線& s4 之裡側將折斷棒從第一基板G1側抵接使基板彎曲來將第二 基板G2折斷（圖3 (e))。此時第—基板⑴與第二基板 G2係在貼合之狀態下零散地分離為每一個單位基板。 圖4係顯示以上述流程分斷之單位基板之端面強度之 狀態之示意圖。分斷面係因第—基板12與第二基板Η宜 中-方以第-刀輪12刻劃，另—方以第二刀輪13刻割， 故-方之基板之端面強度以強，另—方之基板之端面強度 201235323 則比該一方之基板之端面強度ei弱。貼合基板全體之端面 強度平均化且藉由端面強度強之側之基板之存在而可確保 為貼。基板之端面強度且可進行「交踮跳躍」現象不會 產生之加工。 在本實施形態雖係於上下基板形成之刻劃線全部成為 同一平面之端面，但即使在為了端子區域之形成而形成段 差面之端面之場合亦可將本發明直接適用。 此外本發明於玻璃基板以外之脆性材料基板亦可 用。 [產業上之可利用性] 本發明之貼合基板之刻自方法可於將玻璃基板等貼合 基板分斷時利用β σ 【圖式簡單說明】 圖1係顯示實施本發明之貼合基板之刻劃方法時使用 之刻劃裝置之一例之前視圖。 圖2係顯示本發明之貼合基板之刻劃方法之加工流 之圖。 係繼圖2之後繼續顯示本發明之貼合基板之刻劃 方法之加工流程之圖。 圖4係顯示使用本發明之貼合基板之刻劃方法分斷之 單位基板之端面強度之狀態之示意圖。 圖5係於液晶面板之製造使用之貼合破璃基板之剖面 12 201235323 圖6係顯示以往之貼合基板之加工流程之圖。 圖7係顯示以往之貼合基板之加工流程之圖。 圖8係顯示普通刀輪之形狀之圖。 圖9係顯示具槽之刀輪之形狀之圖。 【主要元件符號說明】 Μ 貼合基板 G1 第一基板 G2 第二基板 Ε1 強端面強度 Ε2 弱端面強度 S! 第一基板之第一方向（X方向）之刻劃線 s2 第一基板之第二方向（Y方向）之刻劃線 s3 第二基板之第二方向（Y方向）之刻劃線 S4 第二基板之第一方向（X方向）之刻劃線 12 第一刀輪（具槽之刀輪） 13 第二刀輪（具槽之刀輪） 13201235323 VI. Description of the Invention: [Technical Field] The present invention relates to a method of scribing a bonded substrate in which a score line is formed in advance when a bonded substrate is cut, and more specifically relates to the use of a cutter wheel (also referred to as a cutter wheel) A scribing method of forming a affixed bonded substrate on both sides of the bonded substrate for the scribing wheel. [Prior Art] Fig. 5 is a cross-sectional view of a bonded glass substrate used in the manufacture of a liquid crystal panel. In the process of a liquid crystal panel or the like, two thin glass substrates gi and G2 (the second substrate G2 on the back side of the first substrate G1 on the front side) are used as a mother substrate (mother substrate) of a large area to which the material is bonded. The article to be manufactured from such a mother substrate μ includes a step of dividing into a unit substrate u which becomes each product unit. The step of breaking into each unit substrate U is generally performed in the flow shown below. First, as shown in FIG. 6, the surface of the first substrate G1 of the mother substrate M is formed by the intersection of the scribe line in the X direction and the scribe line S2 in the Y direction intersecting the X direction by the cutter wheel. After the intersecting plurality of scribe lines are formed in a lattice shape, the mother substrate is sent to the fractured portion, and the rod (4) is broken from the second substrate G2 side to bend the first substrate (1) along each scribe line. Thereby, the first substrate G1 is broken into each of the = substrate u. At this time, since the second substrate 〇2 has not been broken, the substrate Gi is fixed to the second substrate (7) by the bonding material u, and is not separated into each unit substrate U. Then, the second substrate G2 is formed in the same manner as shown in Fig. 7 in the direction of the X direction 201235323. The scribe line S3' is next erected by the scribe line S4 forming the Y direction, and is sent to the breaking means to break the second substrate G2. At this time, the mother substrate]V [divided into each unit substrate u. As described above, when the bonded substrate is divided, the respective substrates of the first substrate G1 and the second substrate G2 are cross-scribed. As a cutter wheel for forming a score line on the mother substrate M, a blade 35 having a smooth blade leading edge ridge portion 2 (referred to as a common cutter wheel 1 a ) is used as shown in FIG. A cutter wheel 1b (referred to as a grooved cutter wheel (6)) is provided in the blade leading edge ridge portion 2 with a notch 3 (groove) to prevent the substrate from slipping and is improved in permeability (refer to Patent Document 1). In order to form the inclined faces on both sides of the blade leading edge ridge portion 2, the both sides of the blade leading edge ridge portion 2 are ground by vermiculite. The inclination: although the unevenness of the grinding streak is formed, it is fine, usually, the leading edge of the blade The average thickness of the center line of the wire is ((瓜6〇6〇1_1982) is 〇4^不满° As the edge of the blade of the conventional cutter wheel U described above is formed with a very smooth ridge line surface. Specifically, the cutter wheel lb has an "API〇 (registered trademark)" cutter wheel manufactured by Samsung Diamond Industries Co., Ltd. The grooved rim of the groove has a circumferential length of the notch (groove) larger than the circumferential length of the protruding portion (2 The length of the ridge line between the adjacent gaps is short. For example, in the outer wheel & 3 ""0" cutter wheel, the depth of the notch is The length of the notch in the circumferential direction is about 4 to 14 Mm (so the length of the protruding portion in the circumferential direction is V ng or more). Also, ' ' ', in addition, as the type of the grooved cutter wheel, in addition to the above-mentioned "AMO" knife In addition to the 201235323, there is also a grooved cutter wheel (for example, Samsung Diamond:: Zhou ρ_(registered trademark)) which has a longer circumferential length than the cutter wheel and has a longer circumferential length than the projection portion. Wheel). The circumferential direction of the notch is longer than the length of the circumferential direction of the r. The grooved wheel of the type is longer: the impact of the impact is increased, and the deep vertical crack can be formed on the substrate. Without the breaking step, only the scribing step is broken:: the permeating cutter wheel, so the breaking method accompanying the breaking step is not used, so the folding step is followed after the scribing step: when the substrate is combined The conventional cutter wheel 1 is simply referred to as one of the "A cutter wheel (hereinafter referred to simply as the A-type wheel lb) whose length in the circumferential direction of the 吏 notch is shorter than the circumferential length of the projection portion. Patent Document: International Publication No. w〇2 〇〇7/〇〇47〇〇 Gazette [invention [Problem to be Solved by the Invention] Here, for the scribed processing by the N-type wheel 13 and the a-type wheel 11}, the temple θ N-type wheel 1 a is smoothed by the edge of the blade edge, so The groove surface of the scribe line formed by the substrate can be made to be much better than the one with the A recording; the enamel is excellent in the strength of the enamel surface. Conversely, the penetration of the forming moment 4 (the depth of the grooving) ), the separation after the formation of the score line is worse than that of the A-type wheel 11). Therefore, in the case where the X-direction and the Y-direction orthogonal to each other are intersected and scored, the I-score can not be crossed at the intersection point. The occasion of the formation of the "intersection jump" phenomenon. Phenomenon "crossing point jump" phenomenon 201235323 The substrate is difficult to break along the predetermined line and becomes a defective product. Further, even in the case where the "intersection jump" phenomenon does not occur, the separation property is insufficient, and thus it is necessary to apply an excessive load to break when breaking, which may cause damage to the substrate. On the other hand, the A-shaped wheel lb is formed with a notch in the ridgeline of the leading edge of the blade, so the permeability of the scribe line is superior to that of the N-type wheel la, and the depth of the groove formed is deeper than that of the N-type wheel U, and the substrate is The degree of difficulty in sliding (sliding difficulty) is improved, and it is possible to carry out the processing of the phenomenon of "crossing point jump" which is not easy to produce at the intersection point of the cross scribing. On the other hand, a small flaw is formed in a portion of the groove surface of the scribe line formed on the substrate which is in contact with the corner of the notch of the A-shaped wheel ib, so that the end face of the cross-section formed by the n-shaped wheel is inferior in strength. In the case of the process of the liquid crystal panel, the liquid crystal is sealed between the substrates, so that the decrease in the end face strength is fatal. As described above, when the substrate is cross-cut and scribed, it is necessary to select the best cutter wheel from the two viewpoints of the "cross-point jump" phenomenon and the end face strength. However, when the N-type wheel la is used, the type A is used. There are advantages and disadvantages in the case of the round. In view of the above problems, the present invention provides a method for scribing a bonded substrate which can reliably prevent "cross-point jump" in cross-cutting, and which can be used to obtain a sufficient end face strength in a cross-section of a bonded substrate. purpose. This type of cloth is used to maintain the balance of the strength of the end faces of the respective cross-sections when the bonded substrates are separated. The balance is used to maintain a certain end face strength and avoid the formation of a cross-section with a weak facet. [Means for Solving the Problem] In order to solve the above object, the present invention is based on the following technical hand 201253323. That is, the scribing method of the bonded substrate of the present invention is a method of scribing a bonded substrate, When the first direction and the second direction intersecting each other with the first substrate and the second substrate, the first substrate and the second substrate are in the first direction and the second direction. Forming: a feature of: forming a notch disc protrusion along the circumferential ridge line and having a length in the circumferential direction of the slit is shorter than a circumferential length of the protrusion and a pitch of the notch is a length of the cutter wheel, and a circumferential ridge line Interacting to form a second cutter wheel whose length in the circumferential direction of the notch spot projection is shorter than the circumferential length of the protrusion and the pitch of the notch is shorter than the first-length of the other description; 2 kinds of grooved cutter wheels; The first direction is the first The cutter wheel forms a score line; the first direction of the first substrate is formed by the second cutter wheel; the second direction of the second substrate is the first cutter wheel forming the score line; the first direction of the second substrate The second scribing wheel is formed with a scribe line. [Effect of the Invention] According to the scribed method of the bonded substrate of the present invention, the circumferential ridge line is used to form the notch and the protrusion, and the circumferential length of the notch is larger than the circumferential direction of the protrusion. There are two types of cutter wheels in New Zealand, which makes it easy to slide and has excellent separation. In the two types, the score line formed by the first cutter wheel is smaller than the score formed by the first cutter wheel. The pitch is long, so the first knife = surface strength is better than the permeability first processing. Conversely, the second cutter wheel can perform the process of preferentially transmissive than the end face strength. According to the invention, the line is formed in the first The first substrate and the second substrate are formed by a first-cutter wheel: three sides are formed by a second cutter wheel. Further, the scribe line formed in the second direction is also the fourth substrate and the second substrate. One of them is formed by the first cutter wheel shape 201235323, and the other side is formed by the second cutter wheel. The direction of the two directions - the direction is formed by the direction in which the first direction and the first line are drawn, and the direction of the cutting wheel and the second cutting wheel must be one direction; and the second direction is allowed Processing, material, first square two = strong end face strength using the first cutter wheel intensity average (four) two direction system for permeability and end face weak moment _ into 1 == in addition 'no only end * strength taken from the knife section Therefore, it is ensured that the end face strength is the same. The number of notches of the same diameter of the second cutter wheel is smaller than the number of notches of the second cutter wheel. The thicker the thickness of the substrate of the cutter wheel, the thicker the It is necessary to increase the weight of the pressing when cutting, so the wheel diameter is determined according to the thickness of the scribed substrate, and the first and second cutter wheels are used for the first substrate, and the same applies. The second substrate is characterized by both the first cutter wheel and the second cutter wheel, so that the selection of the same type of wheel is ideal. In this case, of course, from the relationship with the pitch of the notch, the number of notches of the first cutter wheel is smaller than the number of notches of the second knife. Further, the ratio of the number of notches of the first cutter wheel to the second cutter wheel is preferably 丨/10 to 1/100. By changing the ratio of the number of notches by one or more, even if it is a grooved cutter wheel 'the end face strength or permeability can be greatly changed, the characteristics of the present invention can be highlighted, but if the ratio of the number of notches is excessively increased, one side It will become a huge number of gaps and it will become difficult to manufacture. Therefore, it is ideal for 1/10 to 1/100. Specifically, it is preferable that the number of the notches of the first cutter wheel is 5 to 50, and the number of the notches of the second cutter wheel is 50 to 500, which is preferable as the above ratio 201235323. The length of the notch in the circumferential direction is 4. In addition, the wheel diameter is 2 mm to 3: #m二14# m is ideal. [Embodiment] The details of the scribing method of the bonded substrate of the present invention will be described in detail based on the drawings. In the embodiment described below, as will be described later, the first substrate is not scribed after the first plate is scribed, and the first substrate is first moved to the broken substrate. The second substrate. In the breaking process, a breaking device of a type such as a degree of freedom of breaking is used, but in the practice of the present invention, the folding device or the breaking method is not limited thereto. In addition, the #断处理 precedes who is inclined and then has it. The scribing of the earth plate and the second substrate is performed as follows: "1V is a schematic front view of the embodiment in which the sculpt method of the bonded substrate of the present invention is used." In the board, the mother substrate of the H-shaped object is bonded with two glass bases in a pattern; and the unit structure of the aa panel is arranged in the direction of the product. By dividing the mother substrate M into each unit structure, it is possible to obtain a plan to rotate the flat 4 C with a paper surface that can be placed horizontally with the mother substrate 。. Supporting the platform 4 as a guide bar that can be orthogonally moved in a direction (the axis 5 perpendicular to the path i of the figure i, and the bridge 4 in the direction of the guide bar in the direction of the bar (the left and right direction of FIG. 1) 6. It is set as a tool holder which can be used to draw the head 7a, 7b along the soil, and can be lifted and lowered at the lower end of the 201235323 scribe head 7a, 7b. In addition, the first knife with the groove is mounted on the tool holder 8a. The wheel 12 has a grooved second cutter rim 3 mounted on the cutter holder 8b. Both the first cutter wheel 12 and the second cutter wheel 13 are of the "ApI" type, even at the circumference of the groove of the edge of the blade edge. The grooved cutter wheel has a groove length shorter than the circumferential direction of the protrusion. Although the wheel diameter is the same, the number of notches of the first cutter wheel 12 is smaller than the number of notches of the second cutter wheel 13, so the edge of the blade edge is The notch branch pitch makes the first cutter wheel 12 longer than the second cutter wheel 13. Specifically, for example, the wheel diameter is 3 mm, and the depth of the notch is ^ //m, so that the circumference of the first cutter wheel is notched. The length of the direction is ~丨m, the number of notches is 5 (thus, the pitch of the notch is 1884vm (3mms^/5)), so that the circumferential length of the notch of the second cutter wheel 13 is 4//〇1~ 14# claw, the number of notches is 300 (thus, the pitch of the notch is 31 hearts (3ηπη*π/3〇〇)). The ratio of the number of notches in this case is 1/6〇 (that is, 5/3〇〇) Next, the operation of the scribing device sc will be described. Fig. 2 and Fig. 3 are diagrams showing the processing flow of the scribing method of the bonded substrate of the present invention. The mother substrate Μ is placed on the platform 4 so that The substrate & upwards and the X direction (first direction) coincide with the direction of the track 5. Thereafter, the X-direction scribe line s (Fig. 2 (&)) is sequentially formed using the first cutter wheel 12. , the platform 4 is rotated by 9 degrees, and after the γ direction (second direction) is caused to the direction of the track 5, the second cutter wheel 13 is used to sequentially form the direction mark S 2 . Although the secant line s! is part of the intersection and engraving: but because the second knives π with higher permeability are used, the phenomenon of "crossing point jump" will not occur (Fig. 2(b)). 10 201235323 Receiver Moving the mother substrate 至 to the breaking device. The mother substrate Μ is reversed 吏 the first substrate G2 faces upward, and the broken bar is removed from the second substrate by the previously formed scribe line 81 The G2 side abuts the substrate f to bend the first base: the reverse (1) (Fig. 2(e)). At this time, the first substrate (1) is broken into each unit substrate, and the unit substrate is followed by the second substrate. (5), so it will not be separated into scattered. Next, the mother substrate PCT is moved to the scribing device SC, and the mother substrate Μ is placed such that the second substrate G2 faces upward and the ¥ direction (second direction) _ to the track 5 Then, use the first cutter wheel to form the scribe line S3 in the 丫 direction (Fig. 3 (a)). Next, rotate the platform 4 by 90 degrees, so that the χ direction (first direction) After the direction of the track 5, the second cutter wheel 13 is used to sequentially form the fourth direction S4. At this time, although the intersection with the (four) line s 3 is cross-cut, but the second cutter wheel i 3 with higher permeability is used, the phenomenon of "intersection jump" does not occur (Fig. 3(b)). . Next, the mother substrate is moved to the breaking device. The mother substrate is reversed so that the first substrate G1 faces upward, and the second substrate G2 is broken by bending the substrate by abutting the break bar from the side of the first substrate G1 along the back side of the previously formed scribe line & s4 (Figure 3 (e)). At this time, the first substrate (1) and the second substrate G2 are separated into each unit substrate in a state of being bonded. Fig. 4 is a view showing the state of the end face strength of the unit substrate which is broken by the above-described flow. The section is characterized in that the first substrate 12 and the second substrate are cut by the first cutter wheel 12, and the other is cut by the second cutter wheel 13, so that the end face strength of the substrate is strong. On the other hand, the end face strength 201235323 of the substrate is weaker than the end face strength ei of the substrate of the one side. The end faces of the entire bonded substrate are averaged and secured by the presence of the substrate on the side where the end face strength is strong. The strength of the end face of the substrate can be processed without the phenomenon of "crossover jump". In the present embodiment, the scribe lines formed on the upper and lower substrates are all end faces of the same plane. However, the present invention can be directly applied to the case where the end faces of the step faces are formed for the formation of the terminal regions. Further, the present invention can also be used as a substrate for a brittle material other than a glass substrate. [Industrial Applicability] The method for bonding a substrate according to the present invention can be used for the separation of a bonded substrate such as a glass substrate by β σ. [FIG. 1 shows a bonded substrate embodying the present invention. A front view of one of the scoring devices used in the scoring method. Fig. 2 is a view showing the processing flow of the scribing method of the bonded substrate of the present invention. Next, the process flow of the scribing method of the bonded substrate of the present invention is continued after Fig. 2 . Fig. 4 is a view showing the state of the end face strength of the unit substrate which is cut by the scribing method of the bonded substrate of the present invention. Fig. 5 is a cross section of a laminated glass substrate used for manufacturing a liquid crystal panel. 12 201235323 Fig. 6 is a view showing a processing flow of a conventional bonded substrate. Fig. 7 is a view showing a processing flow of a conventional bonded substrate. Fig. 8 is a view showing the shape of a conventional cutter wheel. Figure 9 is a diagram showing the shape of a grooved cutter wheel. [Description of main component symbols] 贴 Fitting substrate G1 First substrate G2 Second substrate Ε1 Strong end face strength Ε2 Weak end face strength S! First substrate first direction (X direction) scribe line s2 First substrate second Direction (Y direction) scribe line s3 Second direction of the second substrate (Y direction) scribe line S4 Second direction of the second substrate (X direction) scribe line 12 First cutter wheel (with groove Knife wheel) 13 Second cutter wheel (slotted cutter wheel) 13