JP2005104819A - Method and apparatus for cutting laminated glass - Google Patents

Method and apparatus for cutting laminated glass Download PDF

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Publication number
JP2005104819A
JP2005104819A JP2004028370A JP2004028370A JP2005104819A JP 2005104819 A JP2005104819 A JP 2005104819A JP 2004028370 A JP2004028370 A JP 2004028370A JP 2004028370 A JP2004028370 A JP 2004028370A JP 2005104819 A JP2005104819 A JP 2005104819A
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Japan
Prior art keywords
laminated glass
cutting
wavelength region
glass
method
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JP2004028370A
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Japanese (ja)
Inventor
Masaaki Furusawa
Satoshi Jibiki
正明 古沢
聡 地引
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Nippon Sheet Glass Co Ltd
日本板硝子株式会社
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Priority to JP2004028370A priority patent/JP2005104819A/en
Publication of JP2005104819A publication Critical patent/JP2005104819A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/10807Making layered products containing glass and synthetic resin layers; apparatus therefor
    • B32B17/1099After-treatment of the layered product, e.g. cooling
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B17/00Layered products essentially comprising sheet glass, or glass, slag, or like fibres
    • B32B17/06Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material
    • B32B17/10Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin
    • B32B17/1055Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin characterized by the resin layer, i.e. interlayer
    • B32B17/10761Layered products essentially comprising sheet glass, or glass, slag, or like fibres comprising glass as the main or only constituent of a layer, next to another layer of a specific material of synthetic resin characterized by the resin layer, i.e. interlayer containing vinyl acetal

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for cutting laminated glass which enable the laminated glass to efficiently be cut into a prescribed size. <P>SOLUTION: In the cutting method, the laminated glass 10 is set on the glass cutting apparatus 20 and a YAG laser oscillation unit for irradiating an intermediate film comprising film-like polyvinyl butylal (PVB) with laser beam having 1,064 nm wave length (λ) and 15 J/cm<SP>2</SP>energy density is moved in the X direction or the Y direction (biaxial direction) at a speed of 300 mm/sec until the temperature of the intermediate film reaches equal to or above the vaporization temperature and a wheel cutter is moved at the same speed in the same direction as that of the YAG laser oscillation unit to press the outside surface of the glass. In this stage, a vertical crack is produced on the outside surface of the glass and then the laminated glass 10 is broken manually to be cut. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method for cutting laminated glass and a laminated glass cutting apparatus.

  Conventionally, a laminated glass 10 (FIG. 1) including a pair of plate glasses 11 and 12 facing each other and an intermediate film 15 interposed between the plate glasses 11 and 12 is cut as follows by a laminated glass cutting machine. That is, as shown in the flowchart of FIG. 12, the laminated glass 10 is horizontally fixed by a pair of suction cups of a laminated glass cutting machine (step S1201), and the outer side surfaces 13 and 14 of the plate glasses 11 and 12 are placed between the pair of suction cups. In order to make a cut (vertical crack) (glass scribing), the wheel cutter is pressed onto the outer surfaces 13 and 14 with a predetermined pressing force (step S1202), and the laminated glass 10 is manually manned from the plate glass 12 side and the plate glass 11 side in order. By pressing (mechanical bending stress), the vertical cracks generated on the outer surfaces 13 and 14 are extended to divide the glass plates 11 and 12 respectively (step S1203), and then the intermediate film 15 in the cut portion is softened. The laminated glass 10 is heated from the plate glass 12 side by a heater such as an infrared heater (step S1). 04) Further, the intermediate film 15 heated by widening the distance between the pair of suction cups is stretched in the horizontal direction (X direction in FIG. 13) (step S1205), and along the cuts in the outer side surfaces 13 and 14. The intermediate film 15 is manually cut with a cutter (step S1206) (for example, Patent Document 1).

  By the above-described method for cutting laminated glass (steps S1201 to S1206), for example, the laminated glass 10 is cut with a cutting pattern as shown in FIG. 13 to obtain laminated glass l, m, n having a desired size. When doing, put the cut a in the laminated glass 10, cut the laminated glass 10 into b part and c part, rotate b part 90 degrees, put the cut d, e (cutting direction is Y direction), The b part is cut into f part, g part, and h part, and the f part, g part, and h part are rotated by 90 °, respectively, and cuts i, j, and k (the cutting direction is the Y direction) are made.

Moreover, the glass laser cutting which cut | disconnects plate glass with a laser is already well-known (for example, patent document 2 and 3).
JP 7-69663 A Japanese National Patent Publication No. 8-509947 JP-A-9-12327

  However, in the conventional method for cutting laminated glass, there are many steps (steps S1201 to S1206), the cutting efficiency is poor, and the intermediate film 15 needs to be stretched in the X direction. Therefore, the laminated glass 10 is moved in the Y direction (uniaxial). For example, in FIG. 13, there is a problem that the end plates o, p, q remain and the cutting yield is poor. Furthermore, in the conventional method for cutting laminated glass, it is necessary to rotate the cut laminated glass 10 and to heat the laminated glass 10 until the intermediate film 15 becomes soft. There was a problem that cutting efficiency was bad.

  In addition, in the conventional method for cutting laminated glass, the presence of cracks in the glass cut surface, division in the bonded state (step S1203), heating of the intermediate film (step S1204), and extension of the intermediate film (step S1205) There was a problem that the quality of the cut surface of the laminated glass was lowered.

  An object of the present invention is to provide a laminated glass cutting method and a laminated glass cutting apparatus that can efficiently cut into a predetermined size.

  In order to achieve the above-mentioned object, the method for cutting laminated glass according to claim 1 is a method for cutting laminated glass comprising a pair of plate glasses facing each other and an intermediate film interposed between the pair of plate glasses. A laser irradiation step of irradiating the intermediate film with laser light in a predetermined wavelength region until the intermediate film reaches an evaporation temperature or higher, and a cutter is provided on the outer surface of the plate glass so as to make a cut in the outer surface of the plate glass. And a pressing step of pressing with the pressing force.

The method for cutting laminated glass according to claim 2 is characterized in that in the method for cutting laminated glass according to claim 1, the laser irradiation step and the pressing step are performed substantially simultaneously.

  The method for cutting laminated glass according to claim 3 is the method for cutting laminated glass according to claim 1 or 2, wherein the plate glass is irradiated with laser light in another predetermined wavelength region until the plate glass reaches a predetermined temperature. And a laser irradiation step.

  The method for cutting laminated glass according to claim 4 is the method for cutting laminated glass according to claim 3, wherein the predetermined temperature is equal to or lower than a softening point of the plate glass.

  The method for cutting laminated glass according to claim 5 is the method for cutting laminated glass according to any one of claims 1 to 4, wherein the laser irradiation step and the other laser irradiation step are performed substantially simultaneously. Features.

  The method for cutting laminated glass according to claim 6 is the method for cutting laminated glass according to any one of claims 1 to 5, wherein the predetermined wavelength region is an ultraviolet wavelength region.

  The method for cutting laminated glass according to claim 7 is the method for cutting laminated glass according to claim 6, wherein the ultraviolet wavelength region is 310 to 410 nm.

  The method for cutting laminated glass according to claim 8 is the method for cutting laminated glass according to any one of claims 3 to 7, wherein the other predetermined wavelength region is an infrared wavelength region.

  The method for cutting laminated glass according to claim 9 is the method for cutting laminated glass according to claim 8, wherein the infrared wavelength region is 1000 to 10600 nm.

The laminated glass cutting method according to claim 10 is the laminated glass cutting method according to any one of claims 6 to 9, wherein the energy density of the laser light in the ultraviolet wavelength region is 5 to 25 J / cm 2. It is characterized by being.

The method for cutting laminated glass according to claim 11 is the method for cutting laminated glass according to any one of claims 8 to 10, wherein the energy density of the laser light in the infrared wavelength region is 300 to 2000 W / cm 2. It is characterized by being.

  The laminated glass cutting device according to claim 12, wherein the laminated glass cutting device cuts a laminated glass comprising a pair of plate glasses opposed to each other and an intermediate film interposed between the pair of plate glasses. Laser irradiation means for irradiating laser light of a predetermined wavelength region along a cutting line, and a cut forming means for making a cut along the cutting line on the outer surface of the plate glass.

  The laminated glass cutting device according to claim 13 is the laminated glass cutting device according to claim 12, wherein the laser irradiation means and the cut forming means operate simultaneously to continuously perform the irradiation of the laser light and the formation of the cut. It is characterized by performing.

  A laminated glass cutting apparatus according to a fourteenth aspect is the laminated glass cutting apparatus according to the twelfth or thirteenth aspect, characterized in that the laser irradiation means includes a lens whose focal distance is the distance from the intermediate film.

  The laminated glass cutting device according to claim 15 is the laminated glass cutting device according to any one of claims 12 to 14, wherein the other predetermined wavelength region is cut along the cutting line on the outer surface of the plate glass. And other laser irradiation means for irradiating the laser beam.

  The laminated glass cutting device according to claim 16 is the laminated glass cutting device according to claim 15, wherein the other laser irradiating means irradiates the surface of the plate glass with laser light of the other predetermined wavelength region. It has the lens of this.

  The laminated glass cutting device according to claim 17 is the laminated glass cutting device according to claim 15 or 16, wherein the laminated glass is scanned with the laser light of the predetermined wavelength region and the laser light of the other predetermined wavelength region. It further comprises scanning means.

  The laminated glass cutting device according to claim 18 is the laminated glass cutting device according to any one of claims 15 to 17, wherein the laser irradiation means and the other laser irradiation means are operated simultaneously, and Irradiation of the laser beam onto the film and irradiation of the laser beam onto the cut are continuously performed.

  As described above in detail, according to the method for cutting laminated glass according to claim 1, the intermediate film is irradiated with laser light in a predetermined wavelength region until the intermediate film reaches the evaporation temperature or higher, so the intermediate film is not stretched. Thus, the intermediate film can be cut, and the laminated glass can be efficiently cut into a predetermined size by biaxial cutting.

  According to the method for cutting laminated glass according to claim 2, the laser irradiation step and the pressing step are performed almost simultaneously, so that the cutting time can be shortened.

  According to the method for cutting laminated glass according to claim 3, since the plate glass is irradiated with laser light of another predetermined wavelength region until the plate glass reaches another predetermined temperature, the glass can be cut by thermal stress cutting. Therefore, a good cut surface free from a compression fracture layer and cracks can be obtained.

  According to the method for cutting laminated glass according to claim 4, since the predetermined temperature is equal to or lower than the softening point of the plate glass, the plate glass can be prevented from being softened.

  According to the method for cutting laminated glass according to claim 5, since the laser irradiation step and the other laser irradiation steps are performed almost simultaneously, the cutting time can be shortened.

  According to the method for cutting laminated glass according to the seventh aspect, since the ultraviolet wavelength region is 310 to 410 nm, the laser light absorption rate of the intermediate film can be made larger than the laser light absorption rate of the glass.

  According to the method for cutting a laminated glass according to claim 9, since the infrared wavelength region is 1000 to 10600 nm, the laser light absorption rate of the glass can be increased, and the oscillation efficiency can be improved and the cost can be reduced. it can.

According to the method for cutting laminated glass according to claim 10, since the energy density of the laser beam in the predetermined wavelength region is 5 to 25 J / cm 2 , the intermediate film can be more efficiently formed without damaging the glass surface. It can heat up more than evaporation temperature, and can shorten cutting time still more reliably.

According to the method for cutting laminated glass according to claim 11, since the energy density of the laser light in the other predetermined wavelength region is 300 to 2000 W / cm 2 , the glass can be heated to a predetermined temperature or less, and the thermal stress is further increased. By efficiently generating the glass, the glass can be reliably cut in a short time.

  According to the laminated glass cutting device of claim 12, the intermediate film is irradiated with laser light of a predetermined wavelength region along the cutting line, and a cut is made along the cutting line on the outer surface of the plate glass. It can be cut with high accuracy.

  According to the laminated glass cutting apparatus of the thirteenth aspect, the laser irradiation means and the cut forming means operate simultaneously to continuously perform the laser light irradiation and the cut formation, so that the cutting time can be shortened.

  According to the laminated glass cutting device of claim 14, since the laser irradiation means has a lens whose focal length is the distance from the intermediate film, the energy density of the laser light on the glass surface is set to the energy of the laser light in the intermediate film. The density can be made smaller than the density, thereby preventing the glass surface from being damaged.

  According to the laminated glass cutting device of claim 15, since the laser beam in the other predetermined wavelength region is irradiated to the cut along the cutting line on the outer surface of the plate glass, the glass can be cut by thermal stress cutting, Therefore, a good cut surface free from a compression fracture layer and cracks can be obtained.

  According to the laminated glass cutting device of the sixteenth aspect, since the other laser irradiation means has the other lens for irradiating the surface of the plate glass with the laser beam of another predetermined wavelength region, The energy density can be made smaller than the energy density of the laser beam on the surface of the glass, so that the intermediate film can be prevented from being damaged.

  According to the laminated glass cutting device of the seventeenth aspect of the present invention, the laminated glass cutting device further includes scanning means for scanning the laminated glass with the laser light of the predetermined wavelength region and the laser light of the other predetermined wavelength region. It can irradiate along.

  According to the laminated glass cutting device of claim 18, the laser irradiation means and the other laser irradiation means are operated simultaneously to continuously irradiate the intermediate film with the laser beam and irradiate the cut with the laser beam. Therefore, the cutting time can be shortened.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a view showing a laminated glass to be cut by the laminated glass cutting method according to the first and second embodiments of the present invention.

  In FIG. 1, a laminated glass 10 includes a pair of plate glasses 11 and 12 facing each other and an intermediate film 15 interposed between the pair of plate glasses 11 and 12.

  The plate glasses 11 and 12 are made of a float plate glass having a thickness of 3 mm, and the intermediate film 15 is made of a film-like PVB (polyvinyl butyral) having a thickness of 1 mm.

  FIG. 2 is a front view of a laminated glass cutting device that executes the method for cutting laminated glass according to the first embodiment of the present invention, and FIG. 3 is a plan view of the laminated glass cutting device of FIG.

  2 and 3, the laminated glass cutting device 20 is disposed so as to face a pair of laminated glass placing members 21 for placing the laminated glass 10 horizontally through the laminated glass 10 held horizontally. Two laminated glass cutting portions A are provided.

  These laminated glass cutting parts A have a pair of screws 22 arranged in the X direction, a pair of ball screw nuts 23 respectively screwed to the pair of screws 22, and a pair of ball screw nuts 23 that are rotatable at both ends. A bridge frame 24 to be held and a pair of motors 25 attached to both ends of the bridge frame 24 and driving the belt in synchronization with the pair of ball screw nuts 23 are provided.

  The laminated glass cutting part A also includes a screw 26 arranged in the Y direction on the bridge frame 24, a ball screw nut 27 screwed into the screw 26, and a cutter head that rotatably holds the ball screw nut 27. 28, a YAG laser oscillation device 50 as a laser irradiating unit attached to the periphery of the cutter head 28 so that the position at the time of glass cutting precedes the cutter head 28, and the cutter head 28 and the YAG laser oscillation device 50 are vertically arranged. A cutter head holding mechanism 31 that holds the shaft rotatably is provided, and a motor 29 that is attached to the cutter head 28 and drives the ball screw nut 27 as a belt.

  As shown in FIG. 4, the cutter head 28 includes a wheel cutter 40 (FIG. 5) (cut forming means) made of a grindstone for making a cut in the laminated glass 10, and the wheel cutter 40 on the outer surfaces 13 and 14 of the laminated glass 10. A pneumatic cylinder device 41 that presses with a predetermined pressing force and a wheel cutter electric motor 42 that rotates the wheel cutter 40 via a power transmission mechanism 43 are provided.

  The laminated glass cutting part A is further connected to a pair of motors 25, a motor 29, a pneumatic cylinder device 41, a cutter head holding mechanism 31, and a wheel cutter electric motor 42, respectively. 29, a pneumatic cylinder device 41, a cutter head holding mechanism 31, and a control device 30 for controlling the operation of the wheel cutter electric motor 42, respectively.

  The laminated glass cutting device 20 operates as follows.

  The pair of motors 25 are operated synchronously under the control of the control device 30, whereby the pair of ball screw nuts 23 are rotated synchronously, and both ends of the bridge frame 24 are also moved in the X direction synchronously, The ball screw nut 27 is rotated by the operation of the motor 29 under the control of the control device 30, and the cutter head 28 moves in the Y direction. Further, the wheel cutter electric motor 42 is operated by the control of the control device 30 to drive the wheel cutter 40 to rotate. When the cutter head 28 moves to the site where the cut 1 is to be made, the control device 30 operates the pneumatic cylinder device 41 to lower the wheel cutter 40 and press it against the outer surfaces 13 and 14 of the laminated glass 10 with a predetermined pressing force. As a result, the outer surfaces 13 and 14 of the laminated glass 10 are cut along the shape to be cut.

  Hereinafter, the cutting method of the laminated glass which concerns on the 1st Embodiment of this invention is demonstrated.

  FIG. 6 is a flowchart showing a method for cutting laminated glass according to the first embodiment of the present invention.

In FIG. 6, first, the laminated glass 10 is set in the laminated glass cutting device 20 (step S601). A YAG laser oscillation device 50 that irradiates a laser beam having a wavelength (λ) of 355 nm, an energy density of 15 J / cm 2 , an output of 16 W, a pulse energy of 400 μJ / pulse, a pulse width of 12 ns, and a repetition pulp number of 40 kHz is set in the X direction or the Y direction ( It is moved at a speed of 300 mm / sec (biaxial direction) (step S602), and is moved at the same speed and speed of 300 mm / sec as the YAG laser oscillation device 50 so that the wheel cutter 40 presses the outer surfaces 13 and 14 ( Step S603). In step S <b> 603, vertical cracks are generated on the outer surfaces 13 and 14. Thereafter, the laminated glass 10 is manually split and the laminated glass 10 is cut.

  According to the first embodiment, since the intermediate film 15 is irradiated with the laser beam until the intermediate film 15 reaches the evaporation temperature or higher, the intermediate film 15 can be cut without stretching the intermediate film 15. By cutting the laminated glass 10 biaxially (X direction, Y direction), the cutting yield, which was conventionally about 70% (FIG. 13), can be reduced to about 85% (FIG. 7).

  In the first embodiment, the laser irradiation step and the pressing step are performed almost simultaneously. However, the present invention is not limited to this, and the pressing step may be performed after the laser irradiation step, or the laser is performed after the pressing step. An irradiation step may be performed.

  In this 1st Embodiment, although the wheel cutter 40 is pressed on the glass surfaces 13 and 14, it is not limited to the wheel cutter 40, The cut | interruption 1 can be made into the glass surfaces 13 and 14. FIG. Anything can be used.

  In the first embodiment, the wheel cutter 40 is run at the same speed as the YAG laser oscillation device 50, but the present invention is not limited to this.

  In the first embodiment, the plate glasses 11 and 12 have a thickness of 3 mm. However, the thickness is not limited to this, and may be a plate glass having another thickness, for example, 2 to 19 mm.

  In the first embodiment, the plate glasses 11 and 12 are made of float plate glass, but are not limited thereto, for example, template glass, frosted glass imparted with a function of diffusing light by surface treatment, Alternatively, tempered glass, plate glass provided with functions such as heat ray absorption, ultraviolet ray absorption, and heat ray reflection, or a combination thereof may be used.

  Moreover, about the composition of plate glass 11 and 12, soda silicate glass (soda lime silica glass), borosilicate glass, aluminosilicate glass, and various crystallized glass may be sufficient.

  In the first embodiment, the intermediate film 15 is made of film-like PVB (polyvinyl butyral) having a thickness of 1 mm. However, the present invention is not limited to this, and other thicknesses, for example, 0. The intermediate film 15 having a thickness of 38 to 2.29 mm may be used, and any shape and material may be used as long as the intermediate film 15 can be bonded to the glass plates 11 and 12.

In the first embodiment, the laser irradiation unit is configured only by the YAG laser oscillation device 50, and the laser light emitted from the YAG laser oscillation device 50 is directly irradiated on the laminated glass 10. However, the present invention is not limited to this. Instead, as shown in FIG. 8, the laser irradiation unit may be composed of a YAG laser oscillation device 50, a mirror 81, and a lens 82. Here, a lens having a focal length (for example, 100 mm) as the distance from the intermediate film 15 is used as the lens 82. As a result, the laser beam can be focused on the intermediate film 15. When the laser beam is focused on the intermediate film 15, the laser beam having an energy density of 5 to 25 J / cm 2 emitted from the YAG laser oscillation device 50 has an energy density of 5 to 12.7 J / cm 2 in the intermediate film. whereas the 2, can be an energy density at the surface of the glass 11 is reduced and 0.7~1.3J / cm 2, to prevent the damage to the surface of the glass 11.

In the first embodiment, the YAG laser oscillation device 50 is used. However, the present invention is not limited to this. For example, a YVO 4 laser oscillation device may be used.

  In the first embodiment, the YAG laser oscillation device 50 and the wheel cutter 40 are moved in the X direction or the Y direction (biaxial direction) at a speed of 300 mm / sec. And the laminated glass 10 may be moved in the X direction or the Y direction (biaxial direction), and the moving speed is not limited to 300 mm / sec.

  Next, a method for cutting a laminated glass according to the second embodiment of the present invention will be described.

  FIG. 9 is a perspective view of a laminated glass cutting device that executes the method for cutting laminated glass according to the second embodiment of the present invention.

  In FIG. 9, a laminated glass cutting device 90 places a laminated glass 10 on top and moves a laser beam in an ultraviolet wavelength region (wavelength 355 nm) with an output of 6 W, which is not shown in the drawing and moves in a direction indicated by an arrow. The YAG laser oscillation device 91 (laser irradiation means) that oscillates, the mirror 98 that reflects the laser light emitted from the YAG laser oscillation device 91, and the reflected laser light are irradiated around the thickness center of the intermediate film 15 as a focal point. A condensing lens 92 (lens) having a focal length f of 100 mm, a wheel cutter 93 (cut forming means) made of WC (tungsten carbide) for cutting the laminated glass 10, and a wheel cutter 93. A pneumatic cylinder device 94 that presses the outer surfaces 13 and 14 of the laminated glass 10 with a predetermined pressing force, and an infrared wavelength region (wavelength 1060). nm), a carbon dioxide laser oscillation device 95 (other laser irradiation means) that oscillates the laser light at an output of 100 W, a beam expander 96 that increases the cutting efficiency of the laser light emitted from the carbon dioxide laser oscillation device 95, and a laser beam It includes a reflecting mirror 99 and a cylindrical lens 97 (other lens) provided so that the reflected laser light is irradiated with a 25 × 1 mm elliptical Z formed on the surfaces of the glass plates 11 and 12.

  Laminated glass 10 has a high transmittance in the visible light wavelength region (S in FIG. 10). Further, the glass plates 11 and 12 (T in FIG. 10) and the intermediate film 15 exhibit substantially the same optical characteristics in the visible light wavelength region (U in FIG. 10). Therefore, it is inappropriate to process the laminated glass 10 with laser light in the visible wavelength region. Therefore, it is preferable to process the laminated glass 10 with laser light in a region other than the visible light wavelength region. Specifically, it is preferable to process the intermediate film 15 with laser light in the ultraviolet wavelength region and to process the plate glasses 11 and 12 with laser light in the wavelength region of 300 nm or less or the infrared wavelength region.

  In the processing of the intermediate film 15, among the laser light in the ultraviolet wavelength region, laser light in a wavelength region of 310 to 410 nm in which the laser light absorption rate of the intermediate film 15 is larger than the laser light absorption rate of the plate glasses 11 and 12 is preferable. Furthermore, a laser beam having a wavelength region of 330 to 395 nm in which the difference between the laser beam absorption rate of the plate glasses 11 and 12 and the laser beam absorption rate of the intermediate film 15 is 50% or more of the entire laser beam is more preferable. Only processing can be performed efficiently.

  In the case of laser light in the ultraviolet wavelength region or wavelength region of 300 nm or less or in the infrared wavelength region, the absorptivity of the glass plates 11 and 12 is increased and the energy of the laser light is absorbed by the glass plates 11 and 12. Not suitable for 15 processing.

  On the other hand, in the processing of the plate glasses 11 and 12, laser light in the infrared wavelength region is suitable, and among laser light in the infrared wavelength region, laser light in the wavelength region of 1000 to 10600 nm is more suitable. This is because laser light in an ultraviolet wavelength region having a wavelength region of 300 nm or less (for example, a fourth harmonic YAG laser (wavelength 266 nm), a KrF excimer laser (wavelength 255 nm)) is converted into a laser beam in an infrared wavelength region (for example, a fundamental wave YAG laser). This is because the oscillation efficiency is low and the device for oscillating it is expensive as compared with the carbon dioxide laser (wavelength 10600 nm).

  The YAG laser oscillation device 91 outputs laser light having a wavelength of 355 nm. This output laser light is reflected by the mirror 98, then passes through the condenser lens 92, and is irradiated so as to focus on the vicinity of the thickness center of the intermediate film.

  The carbon dioxide laser oscillation device 95 outputs laser light having a wavelength of 10600 nm. The output laser light is expanded by the beam expander 96 in order to increase the cutting efficiency. This expanded laser beam is reflected by the mirror 99, then passes through the cylindrical lens 97, and is irradiated so as to form an ellipse of 25 × 1 mm (Z in FIG. 9) on the surface of the plate glass 11 and 12. The When irradiating the plate glasses 11 and 12 with a laser beam having a wavelength of 10600 nm, the temperature of the plate glasses 11 and 12 is controlled within a range that does not exceed the softening point. The formed cut (crack) is extended and the glass is cut.

  Hereinafter, a method for cutting laminated glass according to the second embodiment of the present invention will be described.

  FIG. 11 is a flowchart showing a cutting method according to the second embodiment of the present invention.

  In FIG. 11, first, the laminated glass 10 is set in the laminated glass cutting device 90 (step S1101), and a small break (crack) is formed at the edge of the sheet glass so that the wheel cutter 93 presses the outer side surfaces 13 and 14. (Step S1102). Next, a laser beam having a wavelength of 355 nm is irradiated on the intermediate film 15 and a laser beam having a wavelength of 10600 nm is irradiated on the glass plates 11 and 12 so that the laser beam scans the cutting line simultaneously and continuously (step S1103). By this irradiation, the intermediate film is cut by the laser beam having a wavelength of 355 nm, and cracks formed on the outer surfaces 13 and 14 are extended by the laser beam having a wavelength of 10600 nm. Along the continuous crack formed by the extension of the crack, the laminated glass 10 is cut by pressing from the opposite surface of the plate glass 11 and 12 surface where the continuous crack is formed (step S1104).

  According to the second embodiment, since the glass is cut by thermal stress cutting rather than mechanical cutting by a glass cutter, a good cut surface free from a compression fracture layer and cracks can be obtained.

  In the second embodiment, laser irradiation in the ultraviolet wavelength region and laser irradiation in the infrared wavelength region are performed simultaneously and continuously. However, the present invention is not limited to this, and laser light irradiation in the ultraviolet wavelength region is performed. The laser beam in the infrared wavelength region may be irradiated later, and the laser beam in the ultraviolet wavelength region may be irradiated after the laser beam irradiation in the infrared wavelength region.

  In the second embodiment, the YAG laser oscillation device 91 is used as the laser irradiation means and the carbon dioxide laser oscillation device 95 is used as the other laser irradiation means, but the present invention is not limited to this.

It is a figure which shows the laminated glass which should be cut | disconnected by the cutting method of the laminated glass which concerns on embodiment of this invention. It is a front view of the laminated glass cutting device which performs the cutting method of the laminated glass which concerns on the 1st Embodiment of this invention. It is a top view of the laminated glass cutting device 20 of FIG. It is a front view of the cutter head 28 of FIG. FIG. 5 is a partially cutaway perspective view of the wheel cutter 40 of FIG. 4. It is a flowchart which shows the cutting method of the laminated glass which concerns on the 1st Embodiment of this invention. It is a figure which shows an example of the cutting pattern of the laminated glass 10 cut | disconnected by the cutting method of FIG. It is a schematic diagram which shows the modification of the laser irradiation part in the laminated glass cutting device 20 of FIG. It is a perspective view of the laminated glass cutting device which performs the cutting method of the laminated glass which concerns on the 2nd Embodiment of this invention. It is a graph which shows the spectral characteristics of the laminated glass 10 of FIG. 1, and the plate glass 11 and 12 in FIG. It is a flowchart which shows the cutting method of the laminated glass which concerns on the 2nd Embodiment of this invention. It is a flowchart which shows the cutting method of the conventional laminated glass. It is a figure which shows an example of the cutting pattern of the laminated glass cut | disconnected by the conventional cutting method.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Laminated glass 11 Plate glass 12 Plate glass 13 Outer side surface 14 Outer side surface 15 Intermediate film 20 Laminated glass cutting device 40 Wheel cutter 50 YAG laser oscillation device

Claims (18)

  1.   In a method for cutting a laminated glass comprising a pair of plate glasses opposed to each other and an intermediate film interposed between the pair of plate glasses, a laser having a predetermined wavelength region is applied to the intermediate film until the intermediate film reaches an evaporation temperature or higher. A method for cutting laminated glass, comprising: a laser irradiation step for irradiating light; and a pressing step for pressing a cutter on the outer surface of the plate glass with a predetermined pressing force so as to make a cut in the outer surface of the plate glass. .
  2.   The method for cutting laminated glass according to claim 1, wherein the laser irradiation step and the pressing step are performed substantially simultaneously.
  3.   The method for cutting laminated glass according to claim 1, further comprising: another laser irradiation step of irradiating the plate glass with laser light of another predetermined wavelength region until the plate glass reaches a predetermined temperature.
  4.   The method for cutting laminated glass according to claim 3, wherein the predetermined temperature is equal to or lower than a softening point of the plate glass.
  5.   The method for cutting laminated glass according to any one of claims 1 to 4, wherein the laser irradiation step and the other laser irradiation step are performed substantially simultaneously.
  6.   The method for cutting laminated glass according to any one of claims 1 to 5, wherein the predetermined wavelength region is an ultraviolet wavelength region.
  7.   The method for cutting laminated glass according to claim 6, wherein the ultraviolet wavelength region is 310 to 410 nm.
  8.   8. The method for cutting laminated glass according to claim 3, wherein the other predetermined wavelength region is an infrared wavelength region.
  9.   The method for cutting laminated glass according to claim 8, wherein the infrared wavelength region is 1000 to 10600 nm.
  10. Energy density of the laser beam of the ultraviolet wavelength region, the cutting method of the laminated glass according to any one of claims 6-9, characterized in that a 5~25J / cm 2.
  11. 11. The method for cutting laminated glass according to claim 8, wherein the energy density of the laser light in the infrared wavelength region is 300 to 2000 W / cm 2 .
  12.   In a laminated glass cutting apparatus for cutting a laminated glass comprising a pair of plate glasses facing each other and an intermediate film interposed between the pair of plate glasses, laser light in a predetermined wavelength region is applied to the intermediate film along a cutting line. A laminated glass cutting apparatus, comprising: a laser irradiation means for irradiating; and a cut forming means for making a cut along the cutting line on an outer surface of the plate glass.
  13.   13. The laminated glass cutting device according to claim 12, wherein the laser irradiation unit and the cut forming unit operate simultaneously to continuously perform the irradiation of the laser light and the formation of the cut.
  14.   The laminated glass cutting apparatus according to claim 12 or 13, wherein the laser irradiation means includes a lens having a focal length that is a distance from the intermediate film.
  15.   15. The apparatus according to claim 12, further comprising: another laser irradiation unit that irradiates a laser beam having another predetermined wavelength region at a cut along the cutting line on the outer surface of the plate glass. Laminated glass cutting device.
  16.   16. The laminated glass cutting device according to claim 15, wherein the other laser irradiation means includes another lens for irradiating the surface of the plate glass with the laser beam having the other predetermined wavelength region.
  17.   The laminated glass cutting device according to claim 15 or 16, further comprising a scanning unit that scans the laminated glass with the laser light of the predetermined wavelength region and the laser light of the other predetermined wavelength region.
  18.   16. The laser irradiation unit and the other laser irradiation unit are operated simultaneously to continuously irradiate the intermediate film with laser light and irradiate the cut with laser light. The laminated glass cutting device according to any one of 17.
JP2004028370A 2003-09-10 2004-02-04 Method and apparatus for cutting laminated glass Withdrawn JP2005104819A (en)

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WO2007111398A1 (en) * 2006-03-24 2007-10-04 K-Eng Co., Ltd. Glass cutting apparatus with bending member and method using thereof
JP2009515758A (en) * 2005-11-18 2009-04-16 ジョンソン コントロールズ インテリアズ ゲーエムベーハー アンド カンパニー カーゲー Method, components and apparatus for producing a weakened zone for opening an airbag outlet, in particular a predetermined breaking point
WO2011117006A1 (en) * 2010-03-22 2011-09-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Process and apparatus for separating individual panes from a laminated glass sheet
CN102531369A (en) * 2010-12-13 2012-07-04 三星钻石工业股份有限公司 Breaking method for bonding substrate
CN102557421A (en) * 2010-11-05 2012-07-11 三星钻石工业股份有限公司 Method for scribing laminated substrate
KR20140075765A (en) 2011-10-07 2014-06-19 브이 테크놀로지 씨오. 엘티디 Device for laser-machining glass substrate
EP3006205A1 (en) * 2011-05-13 2016-04-13 Nippon Electric Glass Co., Ltd Method for cutting laminate, method for processing laminate, and device and method for cutting brittle plate-like object
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US9815144B2 (en) 2014-07-08 2017-11-14 Corning Incorporated Methods and apparatuses for laser processing materials
US9850159B2 (en) 2012-11-20 2017-12-26 Corning Incorporated High speed laser processing of transparent materials
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
US10144093B2 (en) 2013-12-17 2018-12-04 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10173916B2 (en) 2013-12-17 2019-01-08 Corning Incorporated Edge chamfering by mechanically processing laser cut glass
US10233112B2 (en) 2013-12-17 2019-03-19 Corning Incorporated Laser processing of slots and holes
US10252931B2 (en) 2015-01-12 2019-04-09 Corning Incorporated Laser cutting of thermally tempered substrates
US10280108B2 (en) 2013-03-21 2019-05-07 Corning Laser Technologies GmbH Device and method for cutting out contours from planar substrates by means of laser
US10335902B2 (en) 2014-07-14 2019-07-02 Corning Incorporated Method and system for arresting crack propagation
US10377658B2 (en) 2016-07-29 2019-08-13 Corning Incorporated Apparatuses and methods for laser processing
US10421683B2 (en) 2013-01-15 2019-09-24 Corning Laser Technologies GmbH Method and device for the laser-based machining of sheet-like substrates
US10522963B2 (en) 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
US10525657B2 (en) 2015-03-27 2020-01-07 Corning Incorporated Gas permeable window and method of fabricating the same
US10526234B2 (en) 2014-07-14 2020-01-07 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US10688599B2 (en) 2018-01-18 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines

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JP2009515758A (en) * 2005-11-18 2009-04-16 ジョンソン コントロールズ インテリアズ ゲーエムベーハー アンド カンパニー カーゲー Method, components and apparatus for producing a weakened zone for opening an airbag outlet, in particular a predetermined breaking point
WO2007111398A1 (en) * 2006-03-24 2007-10-04 K-Eng Co., Ltd. Glass cutting apparatus with bending member and method using thereof
WO2011117006A1 (en) * 2010-03-22 2011-09-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Process and apparatus for separating individual panes from a laminated glass sheet
CN102557421A (en) * 2010-11-05 2012-07-11 三星钻石工业股份有限公司 Method for scribing laminated substrate
CN102531369A (en) * 2010-12-13 2012-07-04 三星钻石工业股份有限公司 Breaking method for bonding substrate
EP3006205A1 (en) * 2011-05-13 2016-04-13 Nippon Electric Glass Co., Ltd Method for cutting laminate, method for processing laminate, and device and method for cutting brittle plate-like object
US9446566B2 (en) 2011-05-13 2016-09-20 Nippon Electric Glass Co., Ltd. Laminate, method for cutting laminate, method for processing laminate, and device and method for cutting brittle plate-like object
US10279568B2 (en) 2011-05-13 2019-05-07 Nippon Electric Glass Co., Ltd. Laminate, method for cutting laminate, method for processing laminate, and device and method for cutting brittle plate-like object
KR20140075765A (en) 2011-10-07 2014-06-19 브이 테크놀로지 씨오. 엘티디 Device for laser-machining glass substrate
US9850159B2 (en) 2012-11-20 2017-12-26 Corning Incorporated High speed laser processing of transparent materials
US10421683B2 (en) 2013-01-15 2019-09-24 Corning Laser Technologies GmbH Method and device for the laser-based machining of sheet-like substrates
US10280108B2 (en) 2013-03-21 2019-05-07 Corning Laser Technologies GmbH Device and method for cutting out contours from planar substrates by means of laser
US10611668B2 (en) 2013-12-17 2020-04-07 Corning Incorporated Laser cut composite glass article and method of cutting
US9850160B2 (en) 2013-12-17 2017-12-26 Corning Incorporated Laser cutting of display glass compositions
US10597321B2 (en) 2013-12-17 2020-03-24 Corning Incorporated Edge chamfering methods
US10144093B2 (en) 2013-12-17 2018-12-04 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10173916B2 (en) 2013-12-17 2019-01-08 Corning Incorporated Edge chamfering by mechanically processing laser cut glass
US10179748B2 (en) 2013-12-17 2019-01-15 Corning Incorporated Laser processing of sapphire substrate and related applications
US9701563B2 (en) 2013-12-17 2017-07-11 Corning Incorporated Laser cut composite glass article and method of cutting
US10233112B2 (en) 2013-12-17 2019-03-19 Corning Incorporated Laser processing of slots and holes
US10442719B2 (en) 2013-12-17 2019-10-15 Corning Incorporated Edge chamfering methods
US9676167B2 (en) 2013-12-17 2017-06-13 Corning Incorporated Laser processing of sapphire substrate and related applications
US9815730B2 (en) 2013-12-17 2017-11-14 Corning Incorporated Processing 3D shaped transparent brittle substrate
US10293436B2 (en) 2013-12-17 2019-05-21 Corning Incorporated Method for rapid laser drilling of holes in glass and products made therefrom
US10392290B2 (en) 2013-12-17 2019-08-27 Corning Incorporated Processing 3D shaped transparent brittle substrate
US10183885B2 (en) 2013-12-17 2019-01-22 Corning Incorporated Laser cut composite glass article and method of cutting
US9815144B2 (en) 2014-07-08 2017-11-14 Corning Incorporated Methods and apparatuses for laser processing materials
US10611667B2 (en) 2014-07-14 2020-04-07 Corning Incorporated Method and system for forming perforations
US10526234B2 (en) 2014-07-14 2020-01-07 Corning Incorporated Interface block; system for and method of cutting a substrate being transparent within a range of wavelengths using such interface block
US10335902B2 (en) 2014-07-14 2019-07-02 Corning Incorporated Method and system for arresting crack propagation
US10047001B2 (en) 2014-12-04 2018-08-14 Corning Incorporated Glass cutting systems and methods using non-diffracting laser beams
US10252931B2 (en) 2015-01-12 2019-04-09 Corning Incorporated Laser cutting of thermally tempered substrates
US10525657B2 (en) 2015-03-27 2020-01-07 Corning Incorporated Gas permeable window and method of fabricating the same
US10377658B2 (en) 2016-07-29 2019-08-13 Corning Incorporated Apparatuses and methods for laser processing
US10522963B2 (en) 2016-08-30 2019-12-31 Corning Incorporated Laser cutting of materials with intensity mapping optical system
US10626040B2 (en) 2017-06-15 2020-04-21 Corning Incorporated Articles capable of individual singulation
US10688599B2 (en) 2018-01-18 2020-06-23 Corning Incorporated Apparatus and methods for laser processing transparent workpieces using phase shifted focal lines

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