CN114589061B

CN114589061B - Die bonder

Info

Publication number: CN114589061B
Application number: CN202210214332.4A
Authority: CN
Inventors: 赵越; 柯晓玉
Original assignee: Dongguan Yaoye Automation Co ltd
Current assignee: Dongguan Yaoye Automation Co ltd
Priority date: 2022-03-04
Filing date: 2022-03-04
Publication date: 2022-12-16
Anticipated expiration: 2042-03-04
Also published as: CN114589061A

Abstract

The invention relates to the technical field of wafer mounting equipment, in particular to a die bonder, which comprises a machine table, a position adjusting mechanism erected on the machine table, a mounting device and a double-camera positioning device which are respectively connected with an adjusting end of the position adjusting mechanism, and a wafer supply device, a feeding device, a glue supply device and a machining head replacement frame which are respectively arranged on the machine table, wherein the machining head replacement frame stores at least one dispensing head and at least one mounting head, the double-camera positioning device is electrically connected with the position adjusting mechanism, and the position adjusting mechanism is used for driving the mounting device and the double-camera positioning device to move above the wafer supply device, the feeding device, the glue supply device and the machining head replacement frame. The invention respectively carries out visual positioning on the wafer and the product through the double camera shooting positioning devices, has high positioning precision, improves the mounting precision, can complete the processes of dispensing and mounting by one mounting device, and has simple and compact structure and low cost.

Description

Die bonder

Technical Field

The invention relates to the technical field of wafer mounting equipment, in particular to a die bonder.

Background

A die bonder is an apparatus for attaching a wafer to a carrier (product). In the prior art, a die bonder has a dispensing device and a mounting device, and processes of dispensing and mounting are completed through the dispensing device and the mounting device respectively, so that equipment is complex in structure and high in manufacturing cost, a wafer and a carrier are difficult to accurately position, and die bonding precision is poor. Therefore, the drawbacks are obvious, and it is highly desirable to provide a solution.

Disclosure of Invention

In order to solve the above technical problems, an object of the present invention is to provide a die bonder.

In order to achieve the purpose, the invention adopts the following technical scheme:

the utility model provides a die bonder, its includes the board, erect the position adjustment mechanism of board, paste dress device and two camera positioning device that are connected with the adjustment end of position adjustment mechanism respectively and install supplying wafer device, material feeding unit, supplying mucilage binding device and processing head replacement frame in the board respectively, processing head replacement frame stores at least one point and glues head and at least one kind and pastes the dress head, two camera positioning device are connected with position adjustment mechanism electricity, position adjustment mechanism is used for driving and pastes dress device and two camera positioning device and supply the top activity of wafer device, material feeding unit, supplying mucilage binding device and processing head replacement frame.

Further, the mounting device comprises a mounting seat, a rotation adjusting mechanism, a connecting seat, a pressure sensor, a connecting rod, a connecting arm, a magnet, an adjusting knob, a limiting part, a spring and a Hall sensor, the mounting seat is connected with an adjusting end of the position adjusting mechanism, the rotation adjusting mechanism is installed on the mounting seat, the connecting seat is connected with the rotation end of the rotation adjusting mechanism, the pressure sensor is installed on the connecting seat, the connecting rod is lifted and lowered and arranged on the connecting seat, the top of the connecting rod is used for abutting against the input end of the pressure sensor, the bottom of the connecting rod is detachably connected with a dispensing head or a mounting head, the connecting arm is connected with the connecting rod, the magnet is installed on the connecting arm, the adjusting knob is in threaded connection with the connecting seat, the limiting part is arranged on the connecting seat, the Hall sensor is installed on the connecting seat, the magnet is correspondingly arranged with the Hall sensor, the adjusting knob is sleeved outside the pressure sensor and the connecting rod, the adjusting knob is elastically connected with the connecting rod through the spring, and the spring sleeve is arranged outside the pressure sensor and the connecting rod.

Further, the connecting base is provided with an air bearing, and the connecting rod is connected with the connecting base in a lifting mode through the air bearing.

Further, the linking arm runs through the connecting rod radially, magnet is installed in the one end of linking arm, the other end and the connecting seat sliding connection of linking arm.

Further, the connecting seat threaded connection has adjusting bolt, adjusting bolt is connected with the one end that the linking arm is close to magnet via the extension spring.

Furthermore, the connecting seat is provided with a lifting groove, and one end of the connecting arm, which is far away from the magnet, is in rolling contact with the inner wall of the lifting groove through the rolling piece.

Further, two positioner that make a video recording include the mounting bracket of being connected with position adjustment mechanism's adjustment end and install respectively in first camera, second camera, prism and 45 speculums of mounting bracket, first camera and second camera parallel arrangement, the unthreaded hole has been seted up to the mounting bracket, the prism appears in the unthreaded hole and lies in the camera end below of first camera, the prism corresponds the setting with 45 speculums, 45 speculums are located the camera end below of second camera.

Furthermore, the die bonder further comprises a camera calibration mechanism arranged on the machine table, and the camera calibration mechanism is used for calibrating the double-camera positioning device.

Furthermore, the camera calibration mechanism comprises a calibration base installed on the machine table, a third camera installed on the calibration base, a light supplement lamp sleeved outside a lens of the third camera, and a calibration piece located above the lens, wherein a calibration hole is formed in the calibration piece, and the lens of the third camera is arranged upward.

Further, supply the mucilage binding to put including installing in the confession of board glue the seat, set up in the confession that supplies to glue the seat and glue the module, rotate and set up in the confession offset plate that supplies to glue the seat, install in supplying to glue the seat and be used for the drive to supply offset plate pivoted to glue and rotate driver, lid and locate the cover body that supplies the offset plate outer and set up in the scraper that supplies to glue the seat, supply to glue the module and be used for supplying glue to supplying offset plate, the scraper is used for strickling the glue that supplies on the offset plate, the cover body has been seted up and has been dodged the groove and dip in the gluey hole, the scraper stretches to the top that supplies the offset plate suddenly via dodging the groove, it is used for supplying the dispensing head to dip in and supplies the glue on the offset plate to dip in gluey hole.

The invention has the beneficial effects that: in practical application, a glue supply device conveys a wafer to be mounted to a preset position, a position adjusting mechanism drives a mounting device to move to a processing head replacement frame, a glue dispensing head with a required specification is mounted on the mounting device, then the position adjusting mechanism drives the mounting device with the glue dispensing head to move to the glue supply device, the glue dispensing head dips glue supplied by the glue supply device, then the position adjusting mechanism drives the mounting device and a double-camera positioning device to move to a feeding device, the product on the feeding device is shot through the double-camera positioning device firstly, after visual positioning is carried out on the product, the glue dispensing head on the mounting device accurately carries out glue dispensing on the product, then the position adjusting mechanism drives the mounting device to move to the processing head replacement frame, the glue dispensing head on the mounting device is detached to the processing head replacement frame, the mounting head with the required specification is mounted on the mounting device, replacement of the wafer is realized, then the position adjusting mechanism drives the mounting device and the double-camera positioning device to move to the wafer mounting device, the wafer is shot through the double-camera positioning device, the wafer is mounted on the mounting device, the wafer is picked up, and the wafer is picked up and picked up, and the mounted product is picked up. The invention respectively carries out visual positioning on the wafer and the product through the double camera positioning devices, has high positioning precision, improves the mounting precision, can finish the processes of dispensing and mounting by one mounting device, and has simple and compact structure and low cost compared with the dispensing process in the prior art which needs an additional dispensing device.

Drawings

Fig. 1 is a schematic perspective view of the present invention.

Fig. 2 is a schematic perspective view of a mounting device according to the present invention.

Fig. 3 is a cross-sectional view of a dual camera positioning device of the present invention.

Fig. 4 is a schematic perspective view of a glue supply device according to the present invention.

Fig. 5 is a schematic perspective view of the camera calibration mechanism of the present invention.

Fig. 6 is a schematic perspective view of a machining head exchange rack according to the present invention.

Description of reference numerals:

1. a machine platform; 2. a mounting device; 21. a mounting seat; 22. a rotation adjustment mechanism; 23. a connecting seat; 24. a pressure sensor; 25. a connecting rod; 26. a mounting head; 27. a connecting arm; 28. a magnet; 29. adjusting a knob; 30. a stopper; 31. a Hall sensor; 32. a spring; 33. an air bearing; 34. a rolling member; 35. a lifting groove; 36. adjusting the bolt; 37. a tension spring; 3. a position adjustment mechanism; 4. a double camera positioning device; 41. a mounting frame; 42. a first camera; 43. a second camera; 44. a prism; 45. a 45 ° mirror; 46. a light hole; 5. a wafer supply device; 6. a feeding device; 7. a glue supply device; 71. a glue supply seat; 72. a glue supply module; 73. a glue supply disc; 74. a glue supply rotation driver; 75. a cover body; 76. a scraper; 77. an avoidance groove; 78. dipping glue holes; 79. a lift drive; 8. a machining head replacement rack; 81. a dispensing storage tank; 82. mounting a storage tank; 9. a camera calibration mechanism; 91. a calibration seat; 92. a third camera; 93. a lens; 94. a light supplement lamp; 95. a calibration member; 96. calibrating the hole; 97. a focus adjustment driver; 98. an adjusting member.

Detailed Description

In order to facilitate understanding of those skilled in the art, the present invention is further described below with reference to the following examples and the accompanying drawings, which are not intended to limit the present invention.

As shown in fig. 1 to 6, the die bonder provided by the present invention includes a machine table 1, a position adjusting mechanism 3 erected on the machine table 1, a mounting device 2 and a dual camera positioning device 4 respectively connected to an adjusting end of the position adjusting mechanism 3, and a wafer supplying device 5, a feeding device 6, a glue supplying device 7 and a processing head replacing rack 8 respectively installed on the machine table 1, wherein the processing head replacing rack 8 stores at least one dispensing head and at least one mounting head 26, the dual camera positioning device 4 is electrically connected to the position adjusting mechanism 3, and the position adjusting mechanism 3 is used for driving the mounting device 2 and the dual camera positioning device 4 to move above the wafer supplying device 5, the feeding device 6, the glue supplying device 7 and the processing head replacing rack 8; in particular, the dual camera-positioning device 4 has at least two different magnifications.

In practical application, the glue supply device 7 conveys a product to be mounted with a wafer to a preset position, the position adjusting mechanism 3 drives the mounting device 2 to move to the processing head replacement frame 8, so that the mounting device 2 is provided with a dispensing head with a required specification, then the position adjusting mechanism 3 drives the mounting device 2 with the dispensing head to move to the glue supply device 7, the dispensing head dips glue supplied by the glue supply device 7, then the position adjusting mechanism 3 drives the mounting device 2 and the double-camera positioning device 4 to move to the feeding device 6, firstly the double-camera positioning device 4 shoots a product on the feeding device 6, so as to perform visual positioning on the product, then the dispensing head on the mounting device 2 accurately shoots the product, then the mounting device 2 is driven by the position adjusting mechanism 3 to move to the processing head replacement frame 8, the dispensing head on the mounting device 2 is detached to the processing head replacement frame 8, then the mounting head 26 with a required specification is mounted on the mounting device 2, so as to realize replacement of the product, then the wafer is mounted on the mounting device 2, then the wafer is moved to the wafer is picked up by the dispensing head 2, and then the wafer is picked up by the dispensing head 2, and the wafer is accurately shot by the dispensing head, and the wafer is picked up by the dispensing head, and then the wafer is picked up by the mounting device 2, and positioned by the wafer mounting device 2, and the wafer is accurately shot by the wafer mounting device 2, and then the wafer is picked up by the wafer mounting device 2, and adjusted by the wafer mounting device 2, and the wafer is picked up by the wafer mounting device 2, and then the wafer mounting device 2, and the wafer is picked up by the wafer mounting device, and the wafer is picked up by the wafer mounting device 2, and the wafer is picked up by the wafer mounting device, and moved to the wafer mounting device 2, and adjusted by the wafer mounting device, and then the wafer mounting device, and adjusted by the wafer mounting device, and then the wafer mounting device 2, and the wafer is completed. According to the invention, the wafer and the product are respectively visually positioned through the double camera positioning devices 4, the positioning precision is high, the mounting precision is improved, and the dispensing head and the mounting head 26 can be replaced, so that one mounting device 2 can complete the dispensing and mounting processes.

In this embodiment, the mounting device 2 includes a mounting base 21, a rotation adjusting mechanism 22, a connecting base 23, a pressure sensor 24, a connecting rod 25, a connecting arm 27, a magnet 28, an adjusting knob 29, a limiting member 30, a spring 32, and a hall sensor 31, the mounting base 21 is connected to an adjusting end of the position adjusting mechanism 3, the rotation adjusting mechanism 22 is installed on the mounting base 21, the connecting base 23 is connected to a rotation end of the rotation adjusting mechanism 22, the pressure sensor 24 is installed on the connecting base 23, the connecting rod 25 is lifted and lowered and is disposed on the connecting base 23, the top of the connecting rod 25 is used for abutting against an input end of the pressure sensor 24, the bottom of the connecting rod 25 is detachably connected with a dispensing head or a mounting head 26, the connecting arm 27 is connected to the connecting rod 25, the magnet 28 is installed on the connecting arm 27, the adjusting knob 29 is in threaded connection with the connecting base 23, the limiting member 30 is disposed on the connecting base 23, the limiting member 30 is used for limiting the connecting arm 27, the hall sensor 31 is installed on the connecting base 23, the magnet 28 is disposed corresponding to the hall sensor 31, the adjusting knob 29 is disposed outside the pressure sensor 24 and the connecting rod 25, the adjusting knob 29 is disposed outside the spring 32.

In practical application, in the process that the mounting head 26 presses and mounts the wafer on the dispensed product, the mounting head 26 receives a reverse acting force of the product, the reverse acting force causes the connecting rod 25 to move upwards relative to the connecting seat 23 and compress the spring 32, the upward connecting rod 25 applies the reverse acting force to the input end of the pressure sensor 24, and the pressure sensor 24 detects the reverse acting force, so that the mounting force (downward pressure) can be measured; meanwhile, the connecting rod 25 moving upwards drives the connecting arm 27 and the magnet 28 to move upwards synchronously, the magnet 28 moves relative to the hall sensor 31, the magnet 28 and the hall sensor 31 work cooperatively to measure the displacement of the connecting rod 25, a software system is used for calculating the displacement, the mounting force and the like to determine a relation curve of the compression amount and the elasticity of the spring 32, the adjusting knob 29 is controlled according to the relation curve, the elasticity of the spring 32 is adjusted by lifting the adjusting knob 29 relative to the connecting seat 23, and therefore accurate regulation and control of the mounting force (the pressing force) can be achieved. When the elastic force of the spring 32 is adjusted to a desired magnitude, that is, the mounting force reaches a desired magnitude, the relative position between the magnet 28 and the hall sensor 31 is at a zero value, and the connecting arm 27 abuts against the limiting member 30. In addition, the rotation adjusting mechanism 22 drives the connecting seat 23 to rotate the mounting head 26, so as to adjust the angle of the wafer picked up by the mounting head 26. This subsides dress device 2 can carry out accurate regulation and control to the size of pasting dress power, and it is convenient to adjust, can satisfy different subsides dress demands, has improved the quality of subsides dress, and the angularly adjustable of subsides dress head 26 can adjust the angle of wafer, has guaranteed the precision and the accuracy of subsides dress.

In this embodiment, the connecting base 23 is provided with an air bearing 33, and the connecting rod 25 is connected with the connecting base 23 in a lifting manner through the air bearing 33. This structural design is guaranteeing that connecting rod 25 can be under the circumstances that connecting seat 23 goes up and down relatively, and frictional resistance reduces to minimumly to ensure that the precision remains stable throughout.

In this embodiment, the connecting arm 27 penetrates through the connecting rod 25 in the radial direction and is vertically arranged, the magnet 28 is installed at one end of the connecting arm 27, the other end of the connecting arm 27 is slidably connected with the connecting seat 23, the connecting seat 23 is provided with a lifting groove 35, and one end of the connecting arm 27 far away from the magnet 28 is in rolling contact with the inner wall of the lifting groove 35 through a rolling element 34; preferably, the rolling elements 34 are rollers or bearings. This structural design reduces frictional resistance, has improved the job stabilization nature of linking arm 27 and connecting rod 25 to hall sensor 31's detection precision has been improved.

In this embodiment, the connecting seat 23 is screwed with an adjusting bolt 36, and the adjusting bolt 36 is connected with one end of the connecting arm 27 close to the magnet 28 via a tension spring 37. Through knob adjusting bolt 36 for adjusting bolt 36 can go up and down relatively connecting seat 23, and adjusting bolt 36 that goes up and down drives linking arm 27 through extension spring 37 and goes up and down, and the linking arm 27 that goes up and down drives connecting rod 25 and goes up and down to carry and draw linking arm 27, in order to eliminate the self gravity of linking arm 27 and connecting rod 25, is favorable to improving the stability of pasting dress power.

Specifically, the bottom of the connecting rod 25 is provided with a mounting hole, and the mounting head 26 or the dispensing head is mounted in the mounting hole; this structural design, the dismouting and the maintenance of the head of being convenient for subsides dress 26 or dispensing head and connecting rod 25, the change of the head of also being convenient for subsides dress 26 and dispensing head.

In this embodiment, the double-camera positioning device 4 includes an installation frame 41 connected to the adjustment end of the position adjustment mechanism 3, and a first camera 42, a second camera 43, a prism 44, and a 45 ° reflector 45 respectively installed on the installation frame 41, the first camera 42 and the second camera 43 are arranged in parallel, the installation frame 41 is provided with a light hole 46, the prism 44 is exposed from the light hole 46 and located below the camera end of the first camera 42, the prism 44 and the 45 ° reflector 45 are arranged correspondingly, and the 45 ° reflector 45 is located below the camera end of the second camera 43.

In practical application, a workpiece (product or wafer) is located below an optical hole 46, light reflected by the workpiece is transmitted to a camera end of a first camera 42 through the optical hole 46 and a prism 44, the first camera 42 performs shooting and visual positioning on the workpiece, meanwhile, the light reflected by the workpiece is irradiated to the camera end of a second camera 43 through the optical hole 46, the prism 44 and a 45-degree reflecting mirror 45, the second camera 43 performs shooting and visual positioning on the workpiece, the workpiece is visually positioned through the two cameras, accuracy of visual positioning is improved, and preferably, the magnification ratios of the first camera 42 and the second camera 43 are different, cameras with different magnification ratios can be used for shooting and visual positioning according to different workpieces, and the visual positioning precision is high, the universality and compatibility are good, the practicability is strong, the application range is wide, the structure is simple, and the production and use costs are low.

In this embodiment, the die bonder further includes a camera calibration mechanism 9 installed on the machine table 1, where the camera calibration mechanism 9 is configured to calibrate the dual camera positioning device 4. When the machine is adjusted or before the workpiece is visually positioned, the position adjusting mechanism 3 drives the double-camera positioning device 4 to move to the camera calibration mechanism 9, and the double-camera positioning device 4 is calibrated and calibrated through the camera calibration mechanism 9, so that the precision of the workpiece visual positioning performed by the double-camera positioning device 4 is ensured.

In this embodiment, the camera calibration mechanism 9 includes a calibration base 91 installed on the machine table 1, a third camera 92 installed on the calibration base 91, a light supplement lamp 94 sleeved outside a lens 93 of the third camera 92, and a calibration piece 95 located above the lens 93, where the calibration piece 95 is provided with a calibration hole 96, and the lens 93 of the third camera 92 is disposed upward.

In practical application, when the dual camera positioning device 4 moves to the camera calibration mechanism 9, the camera end of the first camera 42, the light hole 46, and the calibration hole 96 are disposed corresponding to the lens 93 of the third camera 92, and the first camera 42, the second camera 43, and the third camera 92 identify the calibration hole 96 at the same time, so that not only the first camera 42, the second camera 43, and the third camera 92 can be calibrated for eliminating errors between the cameras, but also the distance between the mounting device 2 and the dual camera positioning device 4 can be calibrated.

Specifically, the calibration base 91 is provided with a focal length adjusting driver 97 for driving the lens 93 to ascend and descend, and the focal length adjusting driver 97 may be an air cylinder; the lens 93 of the third camera 92 is driven to move up and down by the focus adjustment driver 97 to adjust the focus of the third camera 92.

Specifically, the calibration member 95 is slidably connected to the calibration seat 91, and the calibration member 95 is fixed to the calibration seat 91 via an adjusting member 98. In practical application, the position of the calibration member 95 is adjusted by the adjusting member 98 to adjust the position of the calibration hole 96, so that the adjustment is convenient.

In this embodiment, supply mucilage binding 7 including install in the confession of board 1 glue base 71, set up in the confession of supplying of glue base 71 glue module 72, rotate and set up in the confession of supplying glue base 71 glue dish 73, install in supplying glue base 71 and be used for the drive to supply that glue dish 73 pivoted supplies to glue and rotate driver 74, lid and locate and supply the outer cover body 75 of glue dish 73 and set up in the scraper 76 that supplies glue base 71, supply to glue module 72 and be used for supplying glue to supplying glue dish 73, scraper 76 is used for strickling the glue that supplies on the glue dish 73, cover body 75 has been seted up and has been dodged groove 77 and dip in gluey hole 78, scraper 76 is via dodging groove 77 to the top that supplies glue dish 73, gluey hole 78 is used for supplying the point to glue the head and dips in the glue that supplies to dip in and supply to glue on the glue dish 73, it can adopt the motor to supply to glue to rotate driver 74.

In practical application, the glue supply module 72 supplies glue to the glue supply tray 73, the glue supply rotation driver 74 drives the glue supply tray 73 to rotate, and the scraper 76 scrapes the glue on the rotating glue supply tray 73, so that the glue amount on the glue supply tray 73 is uniform, the glue supply amount is ensured, and the glue dispensing quality is improved.

Specifically, the glue supplying base 71 is provided with a lifting driver 79, the lifting driver 79 can be an air cylinder, the scraper 76 is slidably connected with the glue supplying base 71, and the scraper 76 is arranged at a lifting end of the lifting driver 79. In practical applications, the lifting driver 79 drives the scraper 76 to lift and lower so as to adjust the distance between the scraper 76 and the glue supplying tray 73, thereby adjusting the glue supplying amount of the glue supplying tray 73 to meet the requirements of different glue supplying amounts.

Specifically, the processing head replacement frame 8 is provided with a plurality of dispensing storage grooves 81 and a plurality of mounting storage grooves 82, the dispensing storage grooves 81 are used for storing or replacing dispensing heads, and the mounting storage grooves 82 are used for storing or replacing mounting heads 26. The dispensing storage tanks 81 are used for storing or replacing a plurality of dispensing heads with different specifications, and the mounting storage tanks 82 are used for storing or replacing a plurality of mounting heads 26 with different specifications; this structural design for paste dress device 2 can select the dispensing head and the subsides head 26 of different specifications according to the subsides dress demand of difference, and the commonality is good, and application range is wide, and the practicality is strong.

All the technical features in the embodiment can be freely combined according to actual needs.

The above embodiments are preferred implementations of the present invention, and besides, the present invention can be implemented in other ways, and any obvious substitutions without departing from the concept of the present invention are within the protection scope of the present invention.

Claims

1. A die bonder is characterized in that: the double-camera positioning device is electrically connected with the position adjusting mechanism, and the position adjusting mechanism is used for driving the surface mounting device and the double-camera positioning device to move above the wafer supplying device, the feeding device, the glue supplying device and the processing head replacing frame;

the mounting device comprises a mounting seat, a rotation adjusting mechanism, a connecting seat, a pressure sensor, a connecting rod, a connecting arm, a magnet, an adjusting knob, a limiting part, a spring and a Hall sensor, wherein the mounting seat is connected with an adjusting end of a position adjusting mechanism, the rotation adjusting mechanism is arranged on the mounting seat, the connecting seat is connected with the rotating end of the rotation adjusting mechanism, the pressure sensor is arranged on the connecting seat, the connecting rod is arranged on the connecting seat in a lifting manner, the top of the connecting rod is used for abutting against the input end of the pressure sensor, the bottom of the connecting rod is detachably connected with a dispensing head or a mounting head, the connecting arm is connected with the connecting rod, the magnet is arranged on the connecting arm, the adjusting knob is in threaded connection with the connecting seat, the limiting part is arranged on the connecting seat and used for limiting the connecting arm, the Hall sensor is arranged on the connecting seat, the magnet is arranged corresponding to the Hall sensor, the adjusting knob is sleeved outside the pressure sensor and the connecting rod, the adjusting knob is elastically connected with the connecting rod through the spring, and the spring is sleeved outside the pressure sensor and the connecting rod;

the die bonder further comprises a camera shooting calibration mechanism arranged on the machine table, and the camera shooting calibration mechanism is used for calibrating the double camera shooting positioning devices.

2. The die bonder as claimed in claim 1, wherein: the connecting seat is provided with an air bearing, and the connecting rod is connected with the connecting seat in a lifting way through the air bearing.

3. The die bonder of claim 1, wherein: the linking arm runs through the radial of connecting rod, magnet is installed in the one end of linking arm, the other end and the connecting seat sliding connection of linking arm.

4. The die bonder of claim 3, wherein: the adjusting bolt is connected with one end, close to the magnet, of the connecting arm through the tension spring.

5. The die bonder as claimed in claim 3, wherein: the connecting seat is provided with a lifting groove, and one end of the connecting arm, which is far away from the magnet, is in rolling contact with the inner wall of the lifting groove through the rolling piece.

6. The die bonder as claimed in claim 1, wherein: two positioner that make a video recording include the mounting bracket of being connected with position adjustment mechanism's adjustment end and install respectively in first camera, second camera, prism and 45 speculums of mounting bracket, first camera and second camera parallel arrangement, the unthreaded hole has been seted up to the mounting bracket, the prism exposes in the unthreaded hole and lies in the camera end below of first camera, the prism corresponds the setting with 45 speculums, 45 speculums lie in the camera end below of second camera.

7. The die bonder of claim 1, wherein: the camera shooting calibration mechanism comprises a calibration base arranged on the machine table, a third camera arranged on the calibration base, a light supplement lamp sleeved outside a lens of the third camera and a calibration piece located above the lens, wherein the calibration piece is provided with a calibration hole, and the lens of the third camera is arranged upwards.

8. The die bonder as claimed in claim 1, wherein: the glue supply device comprises a glue supply base, a glue supply module, a rotary glue supply disc, a glue supply rotary driver, a cover, a scraper, a glue supply hole and a glue dispensing head, wherein the glue supply base is arranged on a machine table, the glue supply module is arranged on the glue supply disc, the rotary glue supply rotary driver and the cover are arranged on the glue supply base, the cover is used for driving the glue supply disc to rotate, the cover is arranged on the glue supply base and used for driving the glue supply disc to rotate, the cover is arranged on the glue supply base, the cover is used for supplying glue to the glue supply disc, the cover is provided with a glue dispensing hole, the scraper stretches to the top of the glue supply disc through the glue dispensing hole, and the glue dispensing hole is used for dispensing the glue dispensing head to dispense glue on the glue supply disc.