WO2008120881A1 - System for vision inspection of semiconductor device - Google Patents

System for vision inspection of semiconductor device Download PDF

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Publication number
WO2008120881A1
WO2008120881A1 PCT/KR2008/001603 KR2008001603W WO2008120881A1 WO 2008120881 A1 WO2008120881 A1 WO 2008120881A1 KR 2008001603 W KR2008001603 W KR 2008001603W WO 2008120881 A1 WO2008120881 A1 WO 2008120881A1
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor device
vision inspection
loaders
trays
vision
Prior art date
Application number
PCT/KR2008/001603
Other languages
French (fr)
Inventor
Ssang-Gun Lim
Sang-Yun Lee
Byeong-Gwon Joo
Dong-Kyu Son
Original Assignee
Intekplus Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intekplus Co., Ltd filed Critical Intekplus Co., Ltd
Publication of WO2008120881A1 publication Critical patent/WO2008120881A1/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302—Contactless testing
    • G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers

Definitions

  • the present invention relates to a vision inspection system, and, more particularly, to a vision inspection system for semiconductor device that is capable of reducing the equipment size of an automatic optical inspection system for semiconductor device, such as memory modules, and increasing the inspection speed.
  • semiconductor device including memory modules, are manufactured through a series of processes and are subjected to precise inspection before shipping. Not only the internal defectiveness of the semiconductor device packages but also microscopic defects on the external appearances of the semiconductor device have a fatal influence on the performance of the semiconductor device. For this reason, the precise inspection includes various kinds of inspection, such as inspection of the external appearances of the semiconductor device using vision cameras, as well as inspection of electric operations of the semiconductor device.
  • the disclosed vision inspection system for semiconductor device includes a loading region (A) disposed in the front of a system body for allowing a loading stacker in which trays having semiconductor device to be visually inspected received therein are stacked to be installed therein, a sorting region (B) disposed in the front of the system body at one side of the loading region (A) for allowing semiconductor device to be sorted into good semiconductor device and defective semiconductor device therein, a cleaning region (C) disposed above the system body for allowing semiconductor device to be visually inspected to be cleaned therein, a vision inspection region (D) for allowing the front and rear surfaces of the semiconductor device cleaned in the cleaning region (C) to be inspected therein, a handling region (E) for allowing a handler, picking up semiconductor device to be visually inspected, to be moved therein, a buffer region (F) for allowing the visually inspected semiconductor device to be put back therein, and a recycling region (G) for allowing empty trays, among trays supplied through the loading region (A), to be transferred
  • an empty tray region for allowing empty trays to be stacked therein are disposed in the front of the system body.
  • the present invention has been made in view of the above problems, and it is an object of the present invention to provide a vision inspection system for semiconductor device that is capable of receiving a tray to be visually inspected and an unloading tray to receive semiconductor device sorted as good products as a result of the vision inspection to the same loader, and distributing the good semiconductor device to a tray stacked in the same loader or a tray stacked in the opposite loader according to the results of the vision inspection, thereby eliminating a necessity to individually provide loaders and unloaders, and therefore, reducing the size of equipment.
  • a vision inspection system for semiconductor device that photographs the surfaces of semiconductor device and automatically determines whether the semiconductor device are defective or not depending upon the photographed results
  • the vision inspection system including a system body, a pair of loaders mounted at opposite sides of the front of the system body, each of the loaders being constructed in a structure in which a plurality of trays having semiconductor device received therein are stacked such that the trays can be moved upward or downward, first and second transfer rails mounted at the rear of the respective loaders in the forward-and-rearward direction to transfer trays in the forward-and-rearward direction, a vision inspectionunit including a pair of vision cameras mounted between the respective transfer rails for photographing the front and rear surfaces of semiconductor device, first and second transfer pickers for picking up semiconductor device to be visually inspected from the trays located on the respective transfer rail and transferring the picked-up semiconductor device through side-to-side horizontal movement, a picker moving unit mounted between the respectivetransfer
  • a vision inspection system for semiconductor device that photographs the surfaces of semiconductor device and automatically determines whether the semiconductor device are defective or not depending upon the photographed results
  • the vision inspection system including a system body, first and second loaders mounted at opposite sides of the front of the system body, each of the loaders being constructed in a structure in which a plurality of trays having semiconductor device received therein are stacked such that the trays can be moved upward or downward, a vision inspection unit including a first vision camera and a second vision camera mounted at the rear of the system body between the respective loaders for photographing the front and rear surfaces of semiconductor device, reject trays mounted between the respective loaders and the vision inspection unit for receiving defective semiconductor device, a picker module mounted at the rear of the respective loaders for picking up semiconductor device to be visually inspected, transferring the picked-up semiconductor device in the forward-and-rearward direction, and sorting and distributing semiconductor device of which the vision inspection is completed to the reject trays or the trays withdrawn from the respective loaders
  • FIG. 1 is a view illustrating the structure of a system for vision insfection of semiconductor device according to a first preferred embodiment of the present invention
  • FIG. 2 is a sectional view illustrating part "A" of FIG. 1;
  • FIG. 3 is a view illustrating the structure of a system for vision insfection of semiconductor device according to a second preferred embodiment of the present invention. Best Mode for Carrying Out the Invention
  • FIG. 1 is a view illustrating the structure of a system for vision insfection of semiconductor device according to a first preferred embodiment of the present invention
  • FIG. 2 is a sectional view illustrating part "A"of FIG. 1.
  • the present invention relates to a vision inspection system that photographs the surfaces of semiconductor device and automatically determines whether the semiconductor device are defective or not depending upon the photographed results.
  • the vision inspection system includes a system body 100, a loader unit 110, a transfer rail unit 120, a vision inspection unit 130, a transfer picker unit 140, a picker moving unit 150, reject trays 160, and a sorting device 170.
  • the loader unit 110 In the loader unit 110 are stacked a plurality of trays 300, in which semiconductor device are received, in a slot fashion.
  • the loader unit 110 includes a pair of loaders, i.e., a first loader 111 and a second loader 112, mounted at opposite sides of the front of the system body 100.
  • each of the loaders 111 and 112 preferably includes a lifting device (not shown) for raising and lowering the trays 300 stacked therein while controlling the heights of the trays 300. Also, although not shown in the drawings, it is obvious that, the vision inspection system according to the first preferred embodiment of the present invention further includes an indexing device for withdrawing a tray located at a predetermined height by each of the lifting device from each of the loaders 111 and 112 or inserting a tray into each of the loaders 111 and 112.
  • the transfer rail unit 120 includes a first transfer rail 121 and a second transfer rail
  • the vision inspection unit 130 includes a pair of vision cameras, i.e., a first vision camera 131 and a second vision camera 132, which are mounted between the first transfer rail 121 and the second transfer rail 122, such that the first vision camera 131 is followed by the second vision camera 132 in the forward- and-rearward direction, for photographing the front and rear surfaces of semiconductor device.
  • a pair of vision cameras i.e., a first vision camera 131 and a second vision camera 132, which are mounted between the first transfer rail 121 and the second transfer rail 122, such that the first vision camera 131 is followed by the second vision camera 132 in the forward- and-rearward direction, for photographing the front and rear surfaces of semiconductor device.
  • the vision inspection system further includes a cleaning unit 180 which includes a first cleaner 181 and a second cleaner 182 for cleaning the semiconductor device before the vision inspection of the semiconductor device is carried out by the first vision camera 131 and the second vision camera 132.
  • a cleaning unit 180 which includes a first cleaner 181 and a second cleaner 182 for cleaning the semiconductor device before the vision inspection of the semiconductor device is carried out by the first vision camera 131 and the second vision camera 132.
  • the transfer picker unit 140 includes a first transfer picker 141 and a second transfer picker 142 which are movable on the system body horizontally from side to side for picking up and transferring semiconductor device from the trays located on the respective transfer rails 121 and 122 such that the vision inspection of the picked-up and transferred semiconductor device can be carried out by the vision inspection unit 130.
  • the picker moving unit 150 includes a first picker mover 151 and a second picker mover 152 which are mounted between the respective transfer rails, such that the first picker mover 151 and the second picker mover 152 extend from side to side, for guiding the side-to-side horizontal movement of the first transfer picker 141 and the second transfer picker 142.
  • the reject trays 160 are mounted at the rear of the respective loaders 111 and 112 between the transfer rails 121 and 122 for receiving semiconductor device determined to be defective.
  • the sorting device 170 serves to sort semiconductor device as semiconductor device to be distributed to the reject trays or semiconductor device to be distributed to the trays 300 withdrawn from the respective loaders 111 and 112 according to the results of the vision inspection through the vision inspection unit 130.
  • the sorting device 170 transfers semiconductor device determined to be defective as a result of the vision inspection to the reject trays 160 and distributes the semiconductor device determined to be defective to the reject trays 160. Also, the sorting device 170 transfers semiconductor device determined to be good as a result of the vision inspection to the trays 300 withdrawn from the respective loaders 111 and 112 and distributes the semiconductor device determined to be good to the trays 300.
  • the good semiconductor device are sorted and distributed to the corresponding trays withdrawn before the vision inspection. Consequently, the respectiveloaders also serve as unloaders as well as loaders.
  • one of the trays is withdrawn from the first loader 111 and transferred to the rear of the first transfer rail 121.
  • the semiconductor device determined to be defective, among the semi- conductor device of which the vision inspection is completed, are distributed to the corresponding reject tray 160 by using the sorting device 170, and the semiconductor device determined to be good are inserted into the first loader 111 in a state in which the good semiconductor device are received in the corresponding tray.
  • the semiconductor device determined to be defective among the semiconductor device received in the tray located on the second transfer rail 122, are distributed to the corresponding reject tray 160, and the semiconductor device determined to be good are inserted into the second loader 112 in a state in which the good semiconductor device are received in the corresponding tray.
  • the defective semiconductor device among the semiconductor device, of which the vision inspection has been carried out, received in the tray located on the first transfer rail, are distributed to the corresponding reject tray 160, and another tray is withdrawn from the first loader 111 such that the empty spaces of the visually inspected tray are filled with good semiconductor device received in the withdrawn tray.
  • the respective loaders mounted at the opposite sides of the system body receive not only trays in which semiconductor device to be inspected are received but also trays in which semiconductor device determined to be good are received. Consequently, the size of the vision inspection system according to the present invention is greatly reduced as compared with a conve ntional vision inspection system including individual loaders and unloaders. Also, the vision inspection process is continuously carried out, and therefore, the inspection speed is increased.
  • the good semiconductor device may be sorted and distributed to the loader opposite to the loader from which the trays are withdrawn before the vision inspection. Consequently, the respective loaders may serve as unloaders with respect to the opposite loaders.
  • one of the trays is withdrawn from the first loader 111 and transferred to the rear of the first transfer rail 121.
  • Semiconductor device received in the withdrawn tray are transferred by the first transfer picker 131 such that the vision inspection of the semiconductor device can be carried out.
  • the semiconductor device determined to be defective, among the semiconductor device of which the vision inspection is completed, are distributed to the corresponding reject tray 160 by using the sorting device 170, and the tray, of which the semiconductor device have been transferred by the second transfer picker 132, located on the second transfer rail 122, is transferred forward such that the semiconductor device determined to be good are distributed to the transferred tray.
  • the tray having the sorted and distributed semiconductor device received therein is inserted into the first loader 111, and another tray having semiconductor device of which the vision inspection is to be carried out received therein is withdrawn from the first loader 111.
  • the tray withdrawn from the first loader 111 is transferred to the rear of the system body along the first transfer rail 121. At this time, the withdrawn tray is on standby.
  • the defective semiconductor device are distributed to the corresponding reject tray 160, and the good semiconductor device are distributed to a tray withdrawn from the first loader 111. [54] Subsequently, a series of transferring, inspecting, and sorting processes are repeatedly carried out.
  • the respective loaders mounted at the opposite sides of the system body receives not only trays in which semiconductor device to be inspected are received but also trays in which semiconductor device determined to be good are received. Also, the respective loaders serve as unloaders with respect to opposite loaders. Consequently, the size of the vision inspection system according to the present invention is greatly reduced as compared with a conventional vision inspection system including individual loaders and unloaders. Also, the vision inspection process is continuously carried out, and therefore, the inspection speed is increased.
  • FIG. 3 is a view illustrating the structure of a system for vision insfection of semiconductor device according to a second preferred embodiment of the present invention. A detailed description of components of the vision inspection system according to this embodiment identical to those of the vision inspection system shown in FIG. 1 will not be given.
  • the second preferred embodiment of the present invention relates to a vision inspection system that photographs the surfaces of semiconductor device and automatically determines whether the semiconductor device are defective or not depending upon the photographed results.
  • the vision inspection system includes a system body 200, a loader unit 210, a vision inspection unit 220, reject trays 230, a picker module 240, a picker moving unit 250, and a gentry unit 260.
  • the loader unit 210 includes a first loader 211 and a second loader 212 mounted at opposite sides ofthe front of the system body 200.
  • first and second loaders 211 and 212 are stacked a plurality of trays, in which semiconductor device are received, such that the trays can be moved upward or downward.
  • the vision inspection unit 220 includes a pair of vision cameras, i.e., a first vision camera 221 and a second vision camera 222, which are mounted at the rear of the system body between the transfer rails 121 and 122, such that the first vision camera 221 and the second vision camera 222 are arranged side by side, for photographing the front and rear surfaces of semiconductor device.
  • a pair of vision cameras i.e., a first vision camera 221 and a second vision camera 222, which are mounted at the rear of the system body between the transfer rails 121 and 122, such that the first vision camera 221 and the second vision camera 222 are arranged side by side, for photographing the front and rear surfaces of semiconductor device.
  • the reject trays 230 are mounted between the respective loaders 211 and 212 and the respective vision cameras 221 and 222 for receiving semiconductor device determined to be defective.
  • the picker module 240 is mounted at the rear of the loaders 211 and 212 for picking up semiconductor device to be visually inspected, transferring the picked-up semiconductor device in the forward-and-rearward direction, and sorting and distributing semiconductor device of which the vision inspection is completed to the reject trays or the trays withdrawn from the respective loaders 211 and 212.
  • the single picker module is used to transfer and sort the semiconductor device, and therefore, the structure of the vision inspection system is simplified.
  • the picker moving unit 250 is mounted at the rear of the respective loaders 211 and 212, such that the picker moving unit 250 extends in the forward- and-rearward direction, for guiding the forward-and-rearward movement of the picker module 240.
  • the gentry unit 260 is mounted for guiding the side-to-side horizontal movement of the picker moving unit 250 to move the picker module 240 from side to side.
  • the gentry structure is adopted, and the picker module that is capable of simultaneously performing the transferring process and the sorting process is provided, and therefore, the longitudinal size of the vision inspection system is greatly reduced as compared with a conventional vision inspection system constructed in a structure in which vision cameras are mounted at opposite sides of a system body such that one of the vision cameras is followed by the other vision camera in the forward-and-rearward direction.
  • the system for vision insfection of semiconductor device according to the present invention is capable of receiving a tray to be visually inspected and an unloading tray to receive semiconductor device sorted as good products as a result of the vision inspection to the same loader, and distributing the good semiconductor device to a tray stacked in the same loader or a tray stacked in the opposite loader according to the results of the vision inspection.
  • the present invention has the effect of eliminating a necessity to in- dividually provide loaders and unloaders, thereby reducing the size of equipment.
  • the system for vision insfection of semiconductor device according to the present invention is capable of alternately and continuously performing the transfer of the trays and the vision inspection of the trays at the opposite sides of the vision inspection system. Consequently, the present invention has the effect of increasing the inspection speed of the vision inspection system.
  • the system for vision insfection of semiconductor device according to the present invention is constructed in a structure in which the trays stacked in the same loader serve as loading trays to be visually inspected, unloading trays to receive good semiconductor device, and buffer trays to receive good semiconductor device with which empty spaces created by the removal of defective semiconductor device will be filled. Consequently, the present invention has the effect of eliminating a necessity to provide additional buffer regions, thereby reducing the size of equipment.
  • the system for vision insfection of semiconductor device adopts the gentry structure and provides the picker module that is capable of simultaneously performing the transferring process and the sorting process. Consequently, the present invention has the effect of reducing the longitudinal size of the vision inspection system as compared with a conventional vision inspection system constructed in a structure in which vision cameras are mounted at opposite sides of a system body such that one of the vision cameras is followed by the other vision camera in the forward-and-rearward direction.

Abstract

The present invention to provide a system for vision insfection of semiconductor device that is capable of receiving a tray to be visually inspected and an unloading tray to receive semiconductor device sorted as good products as a result of the vision inspection to the same loader, and distributing the good semiconductor device to a tray stacked in the same loader or a tray stacked in the opposite loader according to the results of the vision inspection, thereby eliminating a necessity to individually provide loaders and unloaders, and therefore, reducing the size of equipment.

Description

Description
SYSTEM FOR VISION INSPECTION OF SEMICONDUCTOR
DEVICE
Technical Field
[1] The present invention relates to a vision inspection system, and, more particularly, to a vision inspection system for semiconductor device that is capable of reducing the equipment size of an automatic optical inspection system for semiconductor device, such as memory modules, and increasing the inspection speed. Background Art
[2] Semiconductor device, including memory modules, are manufactured through a series of processes and are subjected to precise inspection before shipping. Not only the internal defectiveness of the semiconductor device packages but also microscopic defects on the external appearances of the semiconductor device have a fatal influence on the performance of the semiconductor device. For this reason, the precise inspection includes various kinds of inspection, such as inspection of the external appearances of the semiconductor device using vision cameras, as well as inspection of electric operations of the semiconductor device.
[3] Generally, external defects of semiconductor device, especially defects of ball grid arrays (BGA) and leads, may occur during the assembly of the semiconductor device to a printed circuit board (PCB). Consequently, the inspection of the leads or the balls is very important.
[4] An example of a system for inspecting the external appearances of semiconductor device is disclosed in Korean Patent Registration No. 0663385 entitled "Vision inspection system for semiconductor device, "which has been filed and registered in the name of the applicant of the present application.
[5] The disclosed vision inspection system for semiconductor device includes a loading region (A) disposed in the front of a system body for allowing a loading stacker in which trays having semiconductor device to be visually inspected received therein are stacked to be installed therein, a sorting region (B) disposed in the front of the system body at one side of the loading region (A) for allowing semiconductor device to be sorted into good semiconductor device and defective semiconductor device therein, a cleaning region (C) disposed above the system body for allowing semiconductor device to be visually inspected to be cleaned therein, a vision inspection region (D) for allowing the front and rear surfaces of the semiconductor device cleaned in the cleaning region (C) to be inspected therein, a handling region (E) for allowing a handler, picking up semiconductor device to be visually inspected, to be moved therein, a buffer region (F) for allowing the visually inspected semiconductor device to be put back therein, and a recycling region (G) for allowing empty trays, among trays supplied through the loading region (A), to be transferred to the buffer region (F) therein.
[6] Also, an empty tray region for allowing empty trays to be stacked therein are disposed in the front of the system body.
[7] In the conventional vision inspection system for semiconductor device, however, the loading region where trays to be visually inspected received therein are stacked, the sorting region where semiconductor device are sorted into good semiconductor device and defective semiconductor device according to the results of the vision inspection, and the recycling region where an empty tray is supplied to the buffer region occupy the front and rear of the system body, i.e., work spaces. As a result, the efficient use of the installation space is not expected.
[8] Also, it is required to additionally provide the empty tray region where empty trays, which will be supplied to the trays to receive semiconductor device sorted into good semiconductor device or defective semiconductor device, among the visually inspected semiconductor device, are stacked. As a result, it is difficult to reduce the size of equipment. Disclosure of Invention
Technical Problem
[9] Therefore, the present invention has been made in view of the above problems, and it is an object of the present invention to provide a vision inspection system for semiconductor device that is capable of receiving a tray to be visually inspected and an unloading tray to receive semiconductor device sorted as good products as a result of the vision inspection to the same loader, and distributing the good semiconductor device to a tray stacked in the same loader or a tray stacked in the opposite loader according to the results of the vision inspection, thereby eliminating a necessity to individually provide loaders and unloaders, and therefore, reducing the size of equipment.
[10] It is another object of the present invention to provide a vision inspection system for semiconductor device that is capable of alternately and continuously performing the transfer of the trays and the vision inspection of the trays at the opposite sides of the vision inspection system, thereby increasing the inspection speed of the vision inspection system.
[11] It is another object of the present invention to provide a vision inspection system for semiconductor device constructed ina structure in which the trays stacked in the same loader serve as loading trays to be visually inspected, unloading trays to receive good semiconductor device, and buffer trays to receive good semiconductor device with which empty spaces created by the removal of defective semiconductor device will be filled, thereby eliminating a necessity to provide additional buffer regions, and therefore, reducing the size of equipment.
[12] It is a further object of the present invention to provide a vision inspectionsystem for semiconductor device that adopts the gentry structure and provides the picker module that is capable of simultaneously performing the transferring process and the sorting process, thereby reducing the longitudinal size of the vision inspectionsystem as compared with a conventional vision inspection system constructed in a structure in which vision cameras are mounted at opposite sides of a system body such that one of the vision cameras is followed by the other vision camera in the forward-and-rearward direction. Technical Solution
[13] In accordance with one aspect of the present invention, the above and other objects can be accomplished by the provision of a vision inspection system for semiconductor device that photographs the surfaces of semiconductor device and automatically determines whether the semiconductor device are defective or not depending upon the photographed results, the vision inspection system including a system body, a pair of loaders mounted at opposite sides of the front of the system body, each of the loaders being constructed in a structure in which a plurality of trays having semiconductor device received therein are stacked such that the trays can be moved upward or downward, first and second transfer rails mounted at the rear of the respective loaders in the forward-and-rearward direction to transfer trays in the forward-and-rearward direction, a vision inspectionunit including a pair of vision cameras mounted between the respective transfer rails for photographing the front and rear surfaces of semiconductor device, first and second transfer pickers for picking up semiconductor device to be visually inspected from the trays located on the respective transfer rail and transferring the picked-up semiconductor device through side-to-side horizontal movement, a picker moving unit mounted between the respectivetransfer rails for guiding the side-to-side horizontal movement of the respective transfer pickers, reject trays mounted at the rear of the respective loaders between the respective transfer rails for receiving defective semiconductor device, and a sorting device for sorting and distributing semiconductor device of which the vision inspection is completed to the reject trays and trays withdrawn from the respective loaders.
[14] In accordance with another aspect of the present invention, there is provided a vision inspection system for semiconductor device that photographs the surfaces of semiconductor device and automatically determines whether the semiconductor device are defective or not depending upon the photographed results, the vision inspection system including a system body, first and second loaders mounted at opposite sides of the front of the system body, each of the loaders being constructed in a structure in which a plurality of trays having semiconductor device received therein are stacked such that the trays can be moved upward or downward, a vision inspection unit including a first vision camera and a second vision camera mounted at the rear of the system body between the respective loaders for photographing the front and rear surfaces of semiconductor device, reject trays mounted between the respective loaders and the vision inspection unit for receiving defective semiconductor device, a picker module mounted at the rear of the respective loaders for picking up semiconductor device to be visually inspected, transferring the picked-up semiconductor device in the forward-and-rearward direction, and sorting and distributing semiconductor device of which the vision inspection is completed to the reject trays or the trays withdrawn from the respective loaders, a picker moving unit mounted at the rear of the respective loaders for guiding the forward-and-rearward movement of the picker module, and a gentry unit for guiding the side-to-side horizontal movement of the picker moving unit to move the picker module from side to side. Brief Description of the Drawings
[15] The above and other objects, features and other advantages of the present invention will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:
[16] FIG. 1 is a view illustrating the structure of a system for vision insfection of semiconductor device according to a first preferred embodiment of the present invention;
[17] FIG. 2 is a sectional view illustrating part "A" of FIG. 1; and
[18] FIG. 3 is a view illustrating the structure of a system for vision insfection of semiconductor device according to a second preferred embodiment of the present invention. Best Mode for Carrying Out the Invention
[19] Now, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
[20] FIG. 1 is a view illustrating the structure of a system for vision insfection of semiconductor device according to a first preferred embodiment of the present invention, and FIG. 2 is a sectional view illustrating part "A"of FIG. 1.
[21] Referring to these drawings, the present invention relates to a vision inspection system that photographs the surfaces of semiconductor device and automatically determines whether the semiconductor device are defective or not depending upon the photographed results. The vision inspection system includes a system body 100, a loader unit 110, a transfer rail unit 120, a vision inspection unit 130, a transfer picker unit 140, a picker moving unit 150, reject trays 160, and a sorting device 170.
[22] In the loader unit 110 are stacked a plurality of trays 300, in which semiconductor device are received, in a slot fashion. The loader unit 110 includes a pair of loaders, i.e., a first loader 111 and a second loader 112, mounted at opposite sides of the front of the system body 100.
[23] In the first preferred embodiment of the present invention, although not shown concretely in the drawings, each of the loaders 111 and 112 preferably includes a lifting device (not shown) for raising and lowering the trays 300 stacked therein while controlling the heights of the trays 300. Also, although not shown in the drawings, it is obvious that, the vision inspection system according to the first preferred embodiment of the present invention further includes an indexing device for withdrawing a tray located at a predetermined height by each of the lifting device from each of the loaders 111 and 112 or inserting a tray into each of the loaders 111 and 112.
[24] The transfer rail unit 120 includes a first transfer rail 121 and a second transfer rail
122 which are mounted at the rear of the respective loaders 111 and 112 such that the withdrawn trays 300 can be transferred in the forward- and-rearward direction on the respective transfer rails 121 and 122.
[25] The vision inspection unit 130 includes a pair of vision cameras, i.e., a first vision camera 131 and a second vision camera 132, which are mounted between the first transfer rail 121 and the second transfer rail 122, such that the first vision camera 131 is followed by the second vision camera 132 in the forward- and-rearward direction, for photographing the front and rear surfaces of semiconductor device.
[26] Preferably, the vision inspection system according to the first preferred embodiment of the present invention further includes a cleaning unit 180 which includes a first cleaner 181 and a second cleaner 182 for cleaning the semiconductor device before the vision inspection of the semiconductor device is carried out by the first vision camera 131 and the second vision camera 132.
[27] In other words, when foreign matter, such as fine dust or pollutants, sticks to the surface of a semiconductor device, the semiconductor device concerned may be determined to be defected due to the foreign matter. For this reason, it is preferred to remove the foreign matter sticking to the surface of the semiconductor device using the cleaning unit, thereby eliminating factors causing inspection errors.
[28] The transfer picker unit 140 includes a first transfer picker 141 and a second transfer picker 142 which are movable on the system body horizontally from side to side for picking up and transferring semiconductor device from the trays located on the respective transfer rails 121 and 122 such that the vision inspection of the picked-up and transferred semiconductor device can be carried out by the vision inspection unit 130. [29] The picker moving unit 150 includes a first picker mover 151 and a second picker mover 152 which are mounted between the respective transfer rails, such that the first picker mover 151 and the second picker mover 152 extend from side to side, for guiding the side-to-side horizontal movement of the first transfer picker 141 and the second transfer picker 142.
[30] The reject trays 160 are mounted at the rear of the respective loaders 111 and 112 between the transfer rails 121 and 122 for receiving semiconductor device determined to be defective.
[31] The sorting device 170 serves to sort semiconductor device as semiconductor device to be distributed to the reject trays or semiconductor device to be distributed to the trays 300 withdrawn from the respective loaders 111 and 112 according to the results of the vision inspection through the vision inspection unit 130.
[32] In other words, the sorting device 170 transfers semiconductor device determined to be defective as a result of the vision inspection to the reject trays 160 and distributes the semiconductor device determined to be defective to the reject trays 160. Also, the sorting device 170 transfers semiconductor device determined to be good as a result of the vision inspection to the trays 300 withdrawn from the respective loaders 111 and 112 and distributes the semiconductor device determined to be good to the trays 300.
[33] In the system for vision insfection of semiconductor device according to the first preferred embodiment of the present invention, the good semiconductor device are sorted and distributed to the corresponding trays withdrawn before the vision inspection. Consequently, the respectiveloaders also serve as unloaders as well as loaders.
[34] More specifically, one of the trays is withdrawn from the first loader 111 and transferred to the rear of the first transfer rail 121.
[35] Semiconductor device received in the withdrawn tray are transferred by the first transfer picker 131 such that the vision inspection of the semiconductor device can be carried out.
[36] Subsequently, one of the trays is withdrawn from the second loader 112 and transferred to the rear of the second transfer rail 122. At this time, the tray is on standby.
[37] When the vision inspection of the semiconductor device received in the tray located on the first transfer rail 121is completed, the semiconductor device are put back on the corresponding tray, and the tray is transferred forward. Subsequently, the semiconductor device received in the tray located on the second transfer rail 122 are transferred by the second transfer picker 132 such that the vision inspection of the semiconductor device can be carried out.
[38] At this time, the semiconductor device determined to be defective, among the semi- conductor device of which the vision inspection is completed, are distributed to the corresponding reject tray 160 by using the sorting device 170, and the semiconductor device determined to be good are inserted into the first loader 111 in a state in which the good semiconductor device are received in the corresponding tray.
[39] Subsequently, another tray having semiconductor device of which the vision inspection is to be carried out received therein is withdrawn from the first loader 111 and transferred to the rear of the system body along the first transfer rail 121. At this time, the withdrawn tray is on standby.
[40] When the vision inspection of the semiconductor device received in the tray located on the second transfer rail 122 is completed, the tray is transferred forward. Subsequently, the vision inspection of the semiconductor device received in the tray locate d on the first transfer rail 121 is carried out.
[41] At this time, the semiconductor device determined to be defective, among the semiconductor device received in the tray located on the second transfer rail 122, are distributed to the corresponding reject tray 160, and the semiconductor device determined to be good are inserted into the second loader 112 in a state in which the good semiconductor device are received in the corresponding tray.
[42] Subsequently, the defective semiconductor device, among the semiconductor device, of which the vision inspection has been carried out, received in the tray located on the first transfer rail, are distributed to the corresponding reject tray 160, and another tray is withdrawn from the first loader 111 such that the empty spaces of the visually inspected tray are filled with good semiconductor device received in the withdrawn tray.
[43] Subsequently, a series of transferring, sorting, and inspecting processes are repeatedly carried out, and when the visually inspected trays have empty spaces created by the removal of defective semiconductor device, the empty spaces of the visually inspected trays are filled with good semiconductor device received in the trays stacked in the corresponding loaders. Consequently, the trays in the same loader serve as loading trays, unloading trays, and buffer trays.
[44] In the system for vision insfection of semiconductor device according to one aspect of the present invention, as described above, the respective loaders mounted at the opposite sides of the system body receive not only trays in which semiconductor device to be inspected are received but also trays in which semiconductor device determined to be good are received. Consequently, the size of the vision inspection system according to the present invention is greatly reduced as compared with a conve ntional vision inspection system including individual loaders and unloaders. Also, the vision inspection process is continuously carried out, and therefore, the inspection speed is increased. [45] In the system for vision insfection of semiconductor device according to the first preferred embodiment of the present invention, on the other hand, the good semiconductor device may be sorted and distributed to the loader opposite to the loader from which the trays are withdrawn before the vision inspection. Consequently, the respective loaders may serve as unloaders with respect to the opposite loaders.
[46] More specifically, one of the trays is withdrawn from the first loader 111 and transferred to the rear of the first transfer rail 121. Semiconductor device received in the withdrawn tray are transferred by the first transfer picker 131 such that the vision inspection of the semiconductor device can be carried out.
[47] Subsequently, one of the trays is withdrawn from the second loader 112 and transferred to the rear of the second transfer rail 122. At this time, the withdrawn tray is on standby.
[48] When the vision inspection of the semiconductor device received in the tray located on the first transfer rail 121 is completed, the semiconductor device are put back on the corresponding tray, and the tray is transferred forward. Subsequently, the semiconductor device received in the tray located on the second transfer rail 122 are transferred by the second transfer picker 132 such that the vision inspection of the semiconductor device can be carried out.
[49] At this time, the semiconductor device determined to be defective, among the semiconductor device of which the vision inspection is completed, are distributed to the corresponding reject tray 160 by using the sorting device 170, and the tray, of which the semiconductor device have been transferred by the second transfer picker 132, located on the second transfer rail 122, is transferred forward such that the semiconductor device determined to be good are distributed to the transferred tray.
[50] The tray having the sorted and distributed semiconductor device received therein is inserted into the first loader 111, and another tray having semiconductor device of which the vision inspection is to be carried out received therein is withdrawn from the first loader 111.
[51] Subsequently, the tray withdrawn from the first loader 111 is transferred to the rear of the system body along the first transfer rail 121. At this time, the withdrawn tray is on standby.
[52] When the vision inspection of the semiconductor device received in the tray located on the second transfer rail 122 is completed, the vision inspection of the semiconductor device received in the tray located on the first transfer rail 121 is commenced.
[53] Subsequently, the tray located on the second transfer rail 122 is transferred forward.
The defective semiconductor device are distributed to the corresponding reject tray 160, and the good semiconductor device are distributed to a tray withdrawn from the first loader 111. [54] Subsequently, a series of transferring, inspecting, and sorting processes are repeatedly carried out.
[55] In the system for vision insfection of semiconductor device according to another aspect of the present invention, as described above, the respective loaders mounted at the opposite sides of the system body receives not only trays in which semiconductor device to be inspected are received but also trays in which semiconductor device determined to be good are received. Also, the respective loaders serve as unloaders with respect to opposite loaders. Consequently, the size of the vision inspection system according to the present invention is greatly reduced as compared with a conventional vision inspection system including individual loaders and unloaders. Also, the vision inspection process is continuously carried out, and therefore, the inspection speed is increased.
[56] Furthermore, in the preferred embodiments of the prevent invention, it is possible to fill the empty spaces of the visually inspected tray, created by the removal of the defective semiconductor device, with good semiconductor device supplied from the tray stacked in the same loader, without the provision of buffer trays for filling the empty spaces of the visually inspected tray with good semiconductor device. Consequently, it is not necessary to provide additional buffer regions, and therefore, it is possible to reduce the size of equipment and sort semiconductor device without reducing the inspection speed.
[57] FIG. 3 is a view illustrating the structure of a system for vision insfection of semiconductor device according to a second preferred embodiment of the present invention. A detailed description of components of the vision inspection system according to this embodiment identical to those of the vision inspection system shown in FIG. 1 will not be given.
[58] Referring to FIG. 3, the second preferred embodiment of the present invention relates to a vision inspection system that photographs the surfaces of semiconductor device and automatically determines whether the semiconductor device are defective or not depending upon the photographed results. The vision inspection system includes a system body 200, a loader unit 210, a vision inspection unit 220, reject trays 230, a picker module 240, a picker moving unit 250, and a gentry unit 260.
[59] The loader unit 210 includes a first loader 211 and a second loader 212 mounted at opposite sides ofthe front of the system body 200. In each of the first and second loaders 211 and 212 are stacked a plurality of trays, in which semiconductor device are received, such that the trays can be moved upward or downward.
[60] The vision inspection unit 220 includes a pair of vision cameras, i.e., a first vision camera 221 and a second vision camera 222, which are mounted at the rear of the system body between the transfer rails 121 and 122, such that the first vision camera 221 and the second vision camera 222 are arranged side by side, for photographing the front and rear surfaces of semiconductor device.
[61] In front of the respective vision cameras 221 and 222 are mounted cleaners 270 for cleaning the surfaces of semiconductor device.
[62] The reject trays 230 are mounted between the respective loaders 211 and 212 and the respective vision cameras 221 and 222 for receiving semiconductor device determined to be defective.
[63] The picker module 240 is mounted at the rear of the loaders 211 and 212 for picking up semiconductor device to be visually inspected, transferring the picked-up semiconductor device in the forward-and-rearward direction, and sorting and distributing semiconductor device of which the vision inspection is completed to the reject trays or the trays withdrawn from the respective loaders 211 and 212.
[64] In the second embodiment of the present invention, as described above, the single picker module is used to transfer and sort the semiconductor device, and therefore, the structure of the vision inspection system is simplified.
[65] Meanwhile, the picker moving unit 250 is mounted at the rear of the respective loaders 211 and 212, such that the picker moving unit 250 extends in the forward- and-rearward direction, for guiding the forward-and-rearward movement of the picker module 240. The gentry unit 260 is mounted for guiding the side-to-side horizontal movement of the picker moving unit 250 to move the picker module 240 from side to side.
[66] In the second embodiment of the present invention, as described above, the gentry structure is adopted, and the picker module that is capable of simultaneously performing the transferring process and the sorting process is provided, and therefore, the longitudinal size of the vision inspection system is greatly reduced as compared with a conventional vision inspection system constructed in a structure in which vision cameras are mounted at opposite sides of a system body such that one of the vision cameras is followed by the other vision camera in the forward-and-rearward direction.
[67]
Industrial Applicability
[68] The system for vision insfection of semiconductor device according to the present invention is capable of receiving a tray to be visually inspected and an unloading tray to receive semiconductor device sorted as good products as a result of the vision inspection to the same loader, and distributing the good semiconductor device to a tray stacked in the same loader or a tray stacked in the opposite loader according to the results of the vision inspection.
[69] Consequently, the present invention has the effect of eliminating a necessity to in- dividually provide loaders and unloaders, thereby reducing the size of equipment.
[70] Also, the system for vision insfection of semiconductor device according to the present invention is capable of alternately and continuously performing the transfer of the trays and the vision inspection of the trays at the opposite sides of the vision inspection system. Consequently, the present invention has the effect of increasing the inspection speed of the vision inspection system.
[71] Also, the system for vision insfection of semiconductor device according to the present invention is constructed in a structure in which the trays stacked in the same loader serve as loading trays to be visually inspected, unloading trays to receive good semiconductor device, and buffer trays to receive good semiconductor device with which empty spaces created by the removal of defective semiconductor device will be filled. Consequently, the present invention has the effect of eliminating a necessity to provide additional buffer regions, thereby reducing the size of equipment.
[72] Furthermore, the system for vision insfection of semiconductor device according to the present invention adopts the gentry structure and provides the picker module that is capable of simultaneously performing the transferring process and the sorting process. Consequently, the present invention has the effect of reducing the longitudinal size of the vision inspection system as compared with a conventional vision inspection system constructed in a structure in which vision cameras are mounted at opposite sides of a system body such that one of the vision cameras is followed by the other vision camera in the forward-and-rearward direction.
[73] Although the preferred embodiments of the present invention have been disclosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope and spirit of the invention as disclosed in the accompanying claims.
[74]

Claims

Claims
[1] A system for vision insfection of semiconductor device that photographs the surfaces of semiconductor device and automatically determines whether the semiconductor device are defective or not depending upon the photographed results, the vision inspection system comprising: a system body; a pair of loaders mounted at opposite sides of the front of the system body, each of the loaders being constructed in a structure in which a plurality of trays having semiconductor device received therein are stacked such that the trays can be moved upward or downward; first and second transfer rails mounted at the rear of the respective loaders in the forward-and-rearward direction to transfer trays in the forward- and-rearward direction; a vision inspection unit including a pair of vision cameras mounted between the respective transfer rails for photographing the front and rear surfaces of semiconductor device; first and second transfer pickers for picking up semiconductor device to be visually inspected from the trays located on the respective transfer rail and transferring the picked-up semiconductor device through side-to-side horizontal movement; a picker moving unit mounted between the respective transfer rails for guiding the side-to-side horizontal movement of the respective transfer pickers; reject trays mounted at the rear of the respective loaders between the respective transfer rails for receiving defective semiconductor device; and a sorting device for sorting and distributing semiconductor device of which the vision inspection is completed to the reject trays and trays withdrawn from the respective loaders.
[2] The vision inspection system according to claim 1, further comprising: a cleaning unit mounted in front of the vision inspection unit for cleaning the surfaces of semiconductor device before the vision inspection of the semiconductor device.
[3] The vision inspection system according to claim 1 or 2, wherein the respective loaders distribute good semiconductor device to a tray belonging to the corresponding loader from which the tray is withdrawn before the vision inspection, whereby the respective loaders serve as both loaders and unloaders.
[4] The vision inspection system according to claim 1 or 2, wherein the respective loaders distribute good semiconductor device to a tray belonging to the loader opposite to the corresponding loader from which the tray is withdrawn before the vision inspection, whereby the respective loaders serve as unloaders with respect to the opposite loaders.
[5] A system for vision insfection of semiconductor device that photographs the surfaces of semiconductor device and automatically determines whether the semiconductor device are defective or not depending upon the photographed results, the vision inspection system comprising: system body; first and second loaders mounted at opposite sides of the front of the system body, each of the loaders being constructed in a structure in which a plurality of trays having semiconductor device received therein are stacked such that the trays can be moved upward or downward; a vision inspection unit including a first vision camera and a second vision camera mounted at the rear of the system body between the respective loaders for photographing the front and rear surfaces of semiconductor device; reject trays mounted between the respective loaders and the vision inspection unit for receiving defective semiconductor device; a picker module mounted at the rear of the respective loaders for picking up semiconductor device to be visually inspected, transferring the picked-up semiconductor device in the forward-and-rearward direction, and sorting and distributing semiconductor device of which the vision inspection is completed to the reject trays or the trays withdrawn from the respective loaders; a picker moving unit mounted at the rear of the respective loaders for guiding the forward-and-rearward movement of the picker module; and a gentry unit for guiding the side-to-side horizontal movement of the picker moving unit to move the picker module from side to side.
[6] The vision inspection system according to claim 5, further comprising: a cleaning unit mounted in front of the vision inspection unit for cleaning the surfaces of semiconductor device before the vision inspection of the semiconductor device.
[7] The vision inspection system according to claim 5 or 6, wherein the respective loaders distribute good semiconductor device to a tray belonging to the corresponding loader from which the tray is withdrawn before the vision inspection, whereby the respective loaders serve as both loaders and unloaders.
[8] The vision inspection system according to claim 5 or 6, wherein the respective loaders distribute good semiconductor device to a tray belonging to the loader opposite to the corresponding loader from which the tray is withdrawn before the vision inspection, whereby the respective loaders serve as unloaders with respect to the opposite loaders.
PCT/KR2008/001603 2007-03-30 2008-03-21 System for vision inspection of semiconductor device WO2008120881A1 (en)

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