CN209867696U - Wafer laser scribing device - Google Patents
Wafer laser scribing device Download PDFInfo
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- CN209867696U CN209867696U CN201920528646.5U CN201920528646U CN209867696U CN 209867696 U CN209867696 U CN 209867696U CN 201920528646 U CN201920528646 U CN 201920528646U CN 209867696 U CN209867696 U CN 209867696U
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Abstract
The utility model discloses a wafer laser scribing device, fixed laser device that is provided with in the frame, carry thing device, image pickup device, controller, it includes glass vacuum chuck to carry the thing device, glass vacuum chuck's upper surface is equipped with a plurality of endocentric ring channels, establish the bar groove more than two on the ring channel, air vent one is all established to the bottom in ring channel, bar groove. After a wafer is placed in a glass vacuum chuck, a controller is clicked to start a vacuum device to vacuumize a ring-shaped groove and a strip-shaped groove through a first through hole, the uniformity and the stability of the underside of the wafer are guaranteed when the wafer is scribed, the controller controls the X-axis moving mechanism, the Y-axis moving mechanism, the rotating platform and the image pickup device to cooperate to automatically position the wafer, then the wafer is scribed into a preset size through a laser, and the wafer after scribing is taken out. The utility model discloses can also add automatic feeding, get the mechanical device of material next door at the lathe, realize the automatic wafer scribing of higher degree.
Description
Technical Field
The utility model relates to a wafer laser scribing device.
Background
With the coming of the information-oriented era, the industries of electronic information, communication, semiconductor wafer integrated circuits and the like in China are rapidly developed, and China becomes a world large country for manufacturing integrated circuits such as diode wafers, controllable silicon wafers and the like and various wafers. After the single-sided groove corrosion is carried out on the surface of a wafer, the wafer needs to be diced according to the groove, a single P/N mechanism is obtained through the dicing, in order to improve the production efficiency and precision of the dicing of the wafer, generally, equipment with higher automation degree is adopted to realize the dicing of the wafer, but the existing dicing equipment for the wafer is complex in structure and high in cost, and needs a manual auxiliary machine to realize positioning before the dicing of the wafer, so that full-automatic positioning cannot be realized, manpower is wasted, automatic feeding and discharging cannot be realized conveniently, the production efficiency is improved to a greater extent, and in addition, the wafer is unstable when the wafer is diced due to the fact that the vacuum adsorption force on the lower side of the wafer on a bearing table is not uniform enough, so that the dicing precision of the wafer.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model provides a wafer laser scribing device.
The utility model provides a technical scheme that its technical problem adopted is: the utility model provides a wafer laser scribing device, includes the frame, fixed being provided with in the frame be used for the wafer scribing laser device, be used for bearing wait to process the wafer and can carry out the thing device of carrying that the position removed, be used for assisting carry out image pickup device, the controller of automatic positioning with the wafer, laser device, carry thing device, image pickup device all are connected with the controller, carry the thing device including fixing moving mechanism in the frame, the transition dish of being connected with the moving mechanism transmission, with the fixed glass vacuum chuck of transition dish, glass vacuum chuck's upper surface is equipped with a plurality of endocentric ring channels, establish the bar groove of linkage segment or all ring channels on the ring channel, the bar groove is established two above and evenly distributed on the ring channel, the air vent is all established to the bottom in ring channel, bar groove.
Furthermore, the laser device comprises a laser fixed on the frame, a first lens fixed on the frame and forming an included angle with the laser, a focusing mechanism fixed on the frame and capable of being adjusted in the up-down direction, and a laser focusing lens fixed on the focusing mechanism, wherein the laser focusing lens faces the glass vacuum chuck.
Further, the image pickup device comprises an upper imaging mechanism which is fixed on the frame and faces towards the glass vacuum chuck, and a lower imaging mechanism which is fixed on the frame and is positioned below the glass vacuum chuck.
Furthermore, the upper imaging mechanism comprises an upper camera fixed on the frame, a first lens fixed on the frame and arranged on the lower side of the upper camera, and a first annular lamp fixed on the frame and arranged on the lower side of the laser device, wherein the upper camera is connected with the first lens.
Furthermore, the lower imaging mechanism comprises a lower camera fixed on the frame, a second lens fixed on the frame and arranged on the side surface of the lower camera, a second lens fixed on the frame and forming an included angle with the second lens, and a second annular lamp fixed on the frame and arranged on the lower side of the glass vacuum chuck, and the lower camera is connected with the second lens.
Furthermore, the moving mechanism comprises a rotating platform, an X-axis moving mechanism and a Y-axis moving mechanism, the rotating platform is in transmission connection with the X-axis moving mechanism, the X-axis moving mechanism is in transmission connection with the Y-axis moving mechanism, the transition disc is in transmission connection with the rotating platform, and the Y-axis moving mechanism is fixed on the rack.
Further, the frame includes upper cabinet and lower floor's electronic box, laser device, year thing device, image pickup device, controller are all fixed in upper cabinet, laser device, year thing device, image pickup device, controller all are connected with the electronic box, first window is established in the front of upper cabinet, install the laser shielding plate that can control the promotion on the first window, second window, third window are established respectively to the both sides of upper cabinet, first cabinet door, second cabinet door are installed respectively to second window, third window, the bracket is established in the positive outside of upper cabinet, the wire casing is established to the inboard of upper cabinet.
Furthermore, the side of the rack is provided with a mechanical device for automatic feeding and automatic material taking, the mechanical device is provided with a mechanical arm capable of running to the upper side of the loading device, and the mechanical device is connected with the controller.
Further, still be fixed with piece suction means in the frame, piece suction means is including fixing the connection pad in the frame, fixing the straw on the connection pad, the opening is established to the straw, the opening of straw is towards glass vacuum chuck, be equipped with annular keyway, U type keyway on the connection pad.
Furthermore, a support is arranged in the machine frame, the laser device is fixed on the support, and a reinforcing rib is arranged between the support and the machine frame.
The utility model provides a wafer laser scribing device, after placing the wafer in glass vacuum chuck, click the controller and start, vacuum apparatus through-hole one annular groove, the bar groove evacuation, thereby fix the wafer, guarantee that the wafer downside is adsorbed homogeneity and stability when being scribed, controller control X axle moving mechanism, Y axle moving mechanism moves glass vacuum chuck to under the laser focusing mirror, after controller control rotary platform, image pickup device cooperate the slot of wafer to carry out the automatic positioning, controller control laser starts, scribe the wafer into granule of predetermined size, the piece that the piece suction means produced the scribing is siphoned away, avoid the piece to glue on the wafer and influence its performance, after the wafer scribing is accomplished, controller control X axle moving mechanism, Y axle moving mechanism move the wafer on the glass vacuum chuck out under the laser focusing mirror, and taking out the wafer after dicing. The utility model discloses the upper and lower both sides of arranging glass in at the wafer all are equipped with the camera, can realize carrying out automatic positioning to the front of wafer or the slot of any one side in the back. The utility model discloses can also add automatic feeding, get the mechanical device of material automatically next door at the lathe, realize the automatic wafer scribing of higher degree.
The utility model discloses simple structure, simple to operate.
Drawings
The invention will be further described with reference to the following figures and examples:
fig. 1 is a schematic structural diagram of the present invention;
fig. 2 is a partial schematic view of the present invention;
FIG. 3 is a partial schematic view of another aspect of the present invention;
FIG. 4 is an enlarged view of area A of FIG. 3;
FIG. 5 is a schematic structural view of the transition plate and the glass vacuum chuck of the present invention;
fig. 6 is a schematic mechanism diagram of the laser device, the loading device, the image pickup device, and the frame according to the present invention.
Detailed Description
Referring to fig. 1 to 6, the present invention is implemented as follows: the utility model provides a wafer laser scribing device, includes frame 1, frame 1 includes upper cabinet 11 and lower floor electronic box 12, fixed being provided with in frame 1 is used for the wafer scribing laser device 2, be used for bearing treat the processing wafer and can carry out the thing device 3 of carrying of position removal, be used for assisting carry out automatic positioning's image pickup device 4, controller 5 with the wafer, laser device 2, carry thing device 3, image pickup device 4 all are connected with controller 5, carry thing device 3 including fixing moving mechanism 31 in frame 1, with the transition dish 32 that moving mechanism 31 transmission is connected, with the fixed glass vacuum chuck 33 of transition dish 32.
Laser device 2, year thing device 3, image pickup device 4, controller 5 are all fixed in upper cabinet 11, laser device 2, year thing device 3, image pickup device 4, controller 5 all are connected with electronic box 12, first window 111 is established in the front of upper cabinet 11, install the transparent material's that can control the promotion laser shielding plate 112 on the first window 111, second window 118, the third window 113 of observing, transferring the quick-witted usefulness are established respectively to the both sides of upper cabinet 11, first cabinet door 114, second cabinet door 115 are installed respectively to second window 118, third window 113, and during normal operating, first cabinet door 114, second cabinet door 115 are closed, bracket 116 is established in the front outside of upper cabinet 11, wire casing 117 is established to the inboard of upper cabinet 11. The tray 116 is used to hold a keyboard.
A support 13 is arranged in the machine frame 1, the laser device 2 is fixed on the support 13, a reinforcing rib 14 is arranged between the support 13 and the machine frame 1, the laser device 2 is more stably fixed on the machine frame 1 due to the design of the reinforcing rib 14, and the precision of laser scribing is ensured.
When the manual work stands on the front surface of the machine tool for operation, the laser shielding plate 112 made of the transparent material is pushed to the side surface, the picking and placing action and the related observation action of the wafer can be carried out, and when laser scribing is carried out, the laser shielding plate 112 made of the transparent material is moved to the middle of the first window 111, so that the laser can be prevented from generating adverse effects on people. The first cabinet door 114 and the second cabinet door 115 are closed under a normal state, and the first cabinet door 114 or the second cabinet door 115 can be opened to facilitate debugging and observation of the machine. Various electric wires and air pipes in the machine can be arranged in the wire groove 117.
The moving mechanism 31 comprises a rotating platform 311 which can drive the glass vacuum chuck 33 to rotate, an X-axis moving mechanism 312 which can drive the glass vacuum chuck 33 to move in the X direction, and a Y-axis moving mechanism 313 which can drive the glass vacuum chuck 33 to move in the Y direction, wherein the rotating platform 311 is in transmission connection with the X-axis moving mechanism 312, the X-axis moving mechanism 312 is in transmission connection with the Y-axis moving mechanism 313, the transition disc 32 is in transmission connection with the rotating platform 311, and the Y-axis moving mechanism 313 is fixed on the rack 1.
The X-axis moving mechanism 312 and the Y-axis moving mechanism 313 can drive the rotating platform 311, the transition disk 32 and the glass vacuum chuck 33 to move in the direction X, Y. The rotary platform 311 can drive the transition disc 32 and the glass vacuum chuck 33to rotate 360 degrees.
The upper surface of glass vacuum chuck 33 is equipped with a plurality of concentric ring channels 34, establish the strip groove 35 of coupling part or whole ring channel 34 on the ring channel 34, three and evenly distributed are established on ring channel 34 in strip groove 35, a plurality of air vent one 36 are all established to the bottom in ring channel 34, strip groove 35, glass vacuum chuck 33 side is equipped with air vent two 37, air vent one 36 communicates with each other with air vent two 37, air vent two 37 are connected with vacuum device 38.
After the wafer is placed on the glass vacuum chuck 33, the vacuum device 38 vacuumizes the annular groove 34 and the strip-shaped groove 35 through the first through hole, so that the wafer is fixed, and the uniformity and stability of the wafer lower side adsorption when the wafer is scribed are ensured.
The laser device 2 comprises a laser 21 fixed on the frame 1, a first lens 22 fixed on the frame 1 and forming an included angle of 45 degrees with the laser 21, a focusing mechanism 23 fixed on the support 13 and capable of being adjusted in the up-down direction, and a laser focusing lens 24 fixed on the focusing mechanism 23, wherein the laser focusing lens 24 faces the glass vacuum chuck 33. The laser focusing mirror 24 and the focusing mechanism 23 are arranged on the upper side of the glass vacuum chuck 33.
The pulse width of the laser 21 is in nanosecond level, the light wavelength is 355nm or 1064nm, the average power is 15-50W, the pulse width is 1ns-200ns, and the frequency is 1KHz-500 KHz.
The focusing mechanism 23 can adjust the laser focusing lens 24 in the vertical direction, so as to ensure that the laser emitted by the laser 21 can efficiently scribe the wafer. The laser emitted by the laser 21 is reflected by the first lens 22 and then vertically enters the laser focusing mirror 24, and the wafer is diced by passing through the annular light source.
After the wafer is placed on the glass vacuum chuck 33, the center point of the wafer substantially coincides with the center point of the glass vacuum chuck 33, the X-axis moving mechanism 312 and the Y-axis moving mechanism 313 drive the rotary platform 311, the transition plate 32 and the glass vacuum chuck 33 to move in the direction X, Y to the position right below the laser focusing mirror 24, and the center point of the glass vacuum chuck 33 coincides with the center point of the laser focusing mirror 24. After the wafer is diced, the X-axis moving mechanism 312 and the Y-axis moving mechanism 313 drive the rotary platform 311, the transition disk 32 and the glass vacuum chuck 33 to move out of the position right below the laser focusing mirror 24 in the direction X, Y.
The image pickup device 4 includes an upper imaging mechanism 41 fixed to the frame 1 and facing the glass vacuum chuck 33, and a lower imaging mechanism 42 fixed to the frame 1 and located below the glass vacuum chuck 33.
The upper imaging mechanism 41 includes an upper camera 411 fixed on the frame 1, a first lens 412 fixed on the frame 1 and disposed under the upper camera 411, and a first ring light 413 fixed on the frame 1 and disposed under the laser device 2, wherein the upper camera 411 is connected to the first lens 412. The model of the upper camera 411 is an industrial camera MVC1000MF-M00V 0033. The first ring-shaped lamp 413 is provided as a hollow ring-shaped lamp tube and emits light in a ring shape.
The first ring light 413 provides light to the upper camera 411, and the light passes through the laser focusing lens 24 and enters the first lens 412 so that the upper camera 411 can clearly observe the groove position on the upper side of the wafer.
The laser emitting center of the laser 21 and the center of the first lens 22 are on the same horizontal line, the centers of the upper camera 411, the first lens 412, the first lens 22 and the laser focusing lens 24 are on the same vertical line, and the centers of the first annular lamp 413 are on the same vertical line.
After the wafer is placed on the glass vacuum chuck 33, a program in the controller 5 is clicked, the controller 5 controls the X-axis moving mechanism 312 and the Y-axis moving mechanism 313 to drive the rotating platform 311, the transition disk 32 and the glass vacuum chuck 33 to move to a position right below the laser focusing mirror 24 in the direction X, Y, and at this time, the centers of the glass vacuum chuck 33 and the first ring-shaped lamp 413, the center of the upper camera 411, the center of the first lens 22, the center of the first lens 412 and the center of the laser focusing mirror 24 are on the same vertical line. When the upper camera 411 detects that there is a groove on the upper side of the wafer, the program in the controller 5 controls the rotating platform 311 to drive the transition disk 32 and the glass vacuum chuck 33 to rotate for a plurality of times by corresponding angles according to the position of the groove of the wafer observed by the upper imaging mechanism 41 until the line of the groove of the wafer is consistent with the laser track set inside the laser 21, and then the controller 5 controls the laser 21 to emit laser to scribe the wafer according to the position of the groove.
The lower imaging mechanism 42 includes a lower camera 421 fixed on the frame 1, a second lens 422 fixed on the frame 1 and disposed on a side of the lower camera 421, a second lens 423 fixed on the frame 1 and forming an included angle of 45 ° with the second lens 422, and a second annular lamp 424 fixed on the frame 1 and disposed on a lower side of the glass vacuum chuck 33, wherein the lower camera 421 is connected with the second lens 422. The lower camera 421 is an industrial camera MVC1000MF-M00V 0033. The second annular lamp 424 is provided as a hollow annular lamp tube and emits annular light.
The X-axis moving mechanism 312, the Y-axis moving mechanism 313, the rotary platform 311, and the transition plate 32 are provided with three through holes 321 corresponding to the glass vacuum chuck 33 to ensure that the second ring-shaped light 424 can irradiate the lower side of the wafer.
The center of the second lens 422, the center of the lower camera 421 and the center of the second lens 423 are on the same horizontal line, and the center of the second lens 423, the center of the second annular lamp 424 and the center of the second lens 422 are on the same vertical line. And the center of the second lens 423, the center of the second ring-shaped lamp 424, the center of the second lens 422, the center of the upper camera 411, the center of the first lens 412, the center of the first lens 22, and the center of the laser focusing mirror 24, the centers of the first ring-shaped lamps 413 being on the same vertical line.
The controller 5 drives the rotating platform 311, the transition disc 32 and the glass vacuum chuck 33 to move in the direction X, Y to the position right below the laser focusing mirror 24 by the X-axis moving mechanism 312 and the Y-axis moving mechanism 313, and at this time, the glass vacuum chuck 33, the center of the first annular lamp 413, the center of the upper camera 411, the center of the first lens 22, the center of the first lens 412, the center of the laser focusing mirror 24, the center of the second lens 423 and the center of the second annular lamp 424 are on the same vertical line.
The second ring-shaped lamp 424 provides light to the lower camera 421, and the light is reflected by the second lens 423 and enters the first lens 412, so that the lower camera 421 can clearly observe the groove position on the lower side of the wafer. When the lower camera 421 detects that there is a groove on the lower side of the wafer, the program in the controller 5 controls the rotating platform 311 to drive the transition disk 32 and the glass vacuum chuck 33 to rotate for a plurality of times by corresponding angles according to the position of the groove of the wafer observed by the lower imaging mechanism 42 until the line of the groove of the wafer is consistent with the laser track set inside the laser 21, and then the controller 5 controls the laser 21 to emit laser to scribe the wafer according to the position of the groove.
Still be fixed with piece suction means 7 on frame 1, piece suction means 7 is including fixing connection pad 71 on frame 1, fixing suction pipe 72 on connection pad 71, with the suction pipe 72 be connected fix suction means 77 on frame 1, opening 73 is established to suction pipe 72, opening 73 of suction pipe 72 is towards glass vacuum chuck 33. The connecting disc 71 is provided with an annular key groove 74 and a U-shaped key groove 75, the connecting disc 71 is fixed on the rack 1 through screws in the annular key groove 74 and the U-shaped key groove 75, and the design of the annular key groove 74 and the U-shaped key groove 75 facilitates machine debugging and installation.
When debris is generated during laser scribing, the debris enters the suction pipe 72 through the opening 73 and is collected by the suction device 77, so that the debris is prevented from being stuck to the wafer to influence the performance of the wafer.
The utility model discloses in: after a wafer is placed on a glass vacuum chuck 33, a program of a controller 5 is clicked, a ring-shaped groove 34 and a strip-shaped groove 35 are vacuumized by a vacuum device 38 through a first through hole, so that the wafer is fixed, the uniformity and stability of the wafer under the wafer during scribing are guaranteed, the controller 5 controls an X-axis moving mechanism 312 and a Y-axis moving mechanism 313 to move the glass vacuum chuck 33 to the position right below a laser focusing mirror 24, the center of the laser focusing mirror 24 of the wafer is basically aligned, then the controller 5 automatically controls a rotary platform 311, an image pickup device 4, the X-axis moving mechanism 312 and the Y-axis moving mechanism 313 to be matched with a groove of the wafer for automatic positioning, and then the controller 5 controls a laser 21 to start, and the wafer is scribed into particles with a preset size. And the chip suction mechanism 7 sucks away chips generated by scribing, so that the chips are prevented from being adhered to the wafer to influence the performance of the wafer, and after the wafer scribing is finished, the controller 5 controls the X-axis moving mechanism 312 and the Y-axis moving mechanism 313 to move so as to move the wafer on the glass vacuum chuck 33 out of the position right below the laser focusing mirror 24, and the wafer subjected to scribing is taken out. The utility model discloses the upper and lower both sides of arranging glass in at the wafer all are equipped with the camera, can realize carrying out automatic positioning to the front of wafer or the slot of any one side in the back.
Further: the side of the rack 1 is provided with a mechanical device 6 for automatic feeding and automatic material taking, the mechanical device 6 is provided with a manipulator 61 capable of moving to the upper side of the loading device 3, and the mechanical device 6 is connected with the controller 5. The manipulator 61 can realize the actions of automatically feeding the wafer to the glass vacuum chuck 33 and automatically taking the wafer from the glass vacuum chuck 33, thereby realizing the automatic wafer scribing with higher degree.
Claims (10)
1. A wafer laser scribing device comprises a rack (1) and is characterized in that a laser device (2) for scribing a wafer, a carrying device (3) for carrying the wafer to be processed and moving the wafer in position, an image pickup device (4) for assisting the wafer to be automatically positioned and a controller (5) are fixedly arranged on the rack (1), the laser device (2), the carrying device (3) and the image pickup device (4) are all connected with the controller (5), the carrying device (3) comprises a moving mechanism (31) fixed on the rack (1), a transition disc (32) in transmission connection with the moving mechanism (31) and a glass vacuum chuck (33) fixed with the transition disc (32), a plurality of concentric annular grooves (34) are formed in the upper surface of the glass vacuum chuck (33), and strip-shaped grooves (35) of a connecting part or all the annular grooves (34) are formed in the annular grooves (34), the strip-shaped groove (35) is provided with more than two air holes (36) which are uniformly distributed on the annular groove (34) and are respectively provided with an air hole I (36) at the bottoms of the annular groove (34) and the strip-shaped groove (35).
2. The wafer laser scribing device according to claim 1, wherein said laser device (2) comprises a laser (21) fixed on the frame (1), a first lens (22) fixed on the frame (1) and forming an included angle with the laser (21), a focusing mechanism (23) fixed on the frame (1) and adjustable in the up-down direction, and a laser focusing lens (24) fixed on the focusing mechanism (23), said laser focusing lens (24) facing the glass vacuum chuck (33).
3. The wafer laser scribing apparatus according to claim 1, wherein said image pick-up device (4) comprises an upper imaging mechanism (41) fixed to the frame (1) and facing the glass vacuum chuck (33), and a lower imaging mechanism (42) fixed to the frame (1) and located below the glass vacuum chuck (33).
4. A laser scribing device for wafers as claimed in claim 3, wherein said upper imaging mechanism (41) comprises an upper camera (411) fixed to the frame (1), a first lens (412) fixed to the frame (1) and disposed under the upper camera (411), and a first ring light (413) fixed to the frame (1) and disposed under the laser device (2), said upper camera (411) being connected to the first lens (412).
5. The wafer laser scribing apparatus according to claim 3, wherein said lower imaging mechanism (42) comprises a lower camera (421) fixed on the frame (1), a second lens (422) fixed on the frame (1) and disposed at a side of the lower camera (421), a second lens (423) fixed on the frame (1) and forming an angle with the second lens (422), and a second ring lamp (424) fixed on the frame (1) and disposed at a lower side of the glass vacuum chuck (33), wherein said lower camera (421) is connected to the second lens (422).
6. The wafer laser scribing device according to claim 1, wherein the moving mechanism (31) comprises a rotating platform (311), an X-axis moving mechanism (312) and a Y-axis moving mechanism (313), the rotating platform (311) is in transmission connection with the X-axis moving mechanism (312), the X-axis moving mechanism (312) is in transmission connection with the Y-axis moving mechanism (313), the transition disk (32) is in transmission connection with the rotating platform (311), and the Y-axis moving mechanism (313) is fixed on the frame (1).
7. The wafer laser scribing device according to claim 1, wherein the rack (1) comprises an upper cabinet (11) and a lower electric box (12), the laser device (2), the object carrying device (3), the image pickup device (4) and the controller (5) are all fixed in the upper cabinet (11), the laser device (2), the object carrying device (3), the image pickup device (4) and the controller (5) are all connected with the electric box (12), a first window (111) is arranged on the front surface of the upper cabinet (11), a laser shielding plate (112) capable of being pushed left and right is installed on the first window (111), a second window (118) and a third window (113) are respectively arranged on two sides of the upper cabinet (11), a first cabinet door (114) and a second cabinet door (115) are respectively installed on the second window (118) and the third window (113), and a bracket (116) is arranged on the outer side of the front surface of the upper cabinet (11), the inner side of the upper layer cabinet (11) is provided with a wire groove (117).
8. The wafer laser scribing device according to claim 1, wherein a mechanical device (6) for automatic feeding and automatic material taking is arranged on the side surface of the frame (1), the mechanical device (6) is provided with a manipulator (61) capable of moving to the upper side of the carrying device (3), and the mechanical device (6) is connected with the controller (5).
9. The wafer laser scribing device according to claim 1, wherein a debris suction mechanism (7) is further fixed on the frame (1), the debris suction mechanism (7) comprises a connecting disc (71) fixed on the frame (1) and a suction pipe (72) fixed on the connecting disc (71), the suction pipe (72) is provided with an opening (73), the opening (73) of the suction pipe (72) faces the glass vacuum chuck (33), and the connecting disc (71) is provided with an annular key slot (74) and a U-shaped key slot (75).
10. A laser scribing device for wafers as in claim 1, wherein said frame (1) is internally provided with a support (13), said laser device (2) is fixed on said support (13), and a reinforcement rib (14) is provided between said support (13) and said frame (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920528646.5U CN209867696U (en) | 2019-04-18 | 2019-04-18 | Wafer laser scribing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920528646.5U CN209867696U (en) | 2019-04-18 | 2019-04-18 | Wafer laser scribing device |
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| CN209867696U true CN209867696U (en) | 2019-12-31 |
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| CN201920528646.5U Active CN209867696U (en) | 2019-04-18 | 2019-04-18 | Wafer laser scribing device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112934725A (en) * | 2021-02-23 | 2021-06-11 | 深圳市智立方自动化设备股份有限公司 | Automatic chip appearance detection equipment and control method thereof |
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2019
- 2019-04-18 CN CN201920528646.5U patent/CN209867696U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112934725A (en) * | 2021-02-23 | 2021-06-11 | 深圳市智立方自动化设备股份有限公司 | Automatic chip appearance detection equipment and control method thereof |
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