CN113644182B - High-speed paster equipment of photoelectric display product - Google Patents
High-speed paster equipment of photoelectric display product Download PDFInfo
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- CN113644182B CN113644182B CN202110886278.3A CN202110886278A CN113644182B CN 113644182 B CN113644182 B CN 113644182B CN 202110886278 A CN202110886278 A CN 202110886278A CN 113644182 B CN113644182 B CN 113644182B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67276—Production flow monitoring, e.g. for increasing throughput
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
Abstract
The invention provides high-speed paster equipment for photoelectric display products, which comprises a display substrate feeding system, a vacuum turret system and a vibration feeding system, wherein the display substrate feeding system comprises: display panel transport module, display panel handling device, display panel fixture, display panel positioner, visual position detection device, paster XY workstation, wherein, the display panel transport module includes: display panel device, display panel transfer device, display panel output device of plugging into, vacuum capstan head system includes: the vacuum turret module, the turret suction nozzle device, the recycling bin device and the linear pressing device correct the position of a wafer product, check the electrical property and the appearance, screen out bad wafers, ensure that the wafers used for the chip mounting of the display screen substrate are all good wafers, and simultaneously realize the production process work of accurate position, high production efficiency and stable product, thereby not only saving equipment and labor cost, but also improving the production efficiency.
Description
Technical Field
The invention relates to the technical field of semiconductors and industrial automation, in particular to high-speed chip mounting equipment for a photoelectric display product.
Background
Photoelectric display product paster equipment is the equipment to LED display screen welding solution. The LED display screen is an electronic display screen formed by three LED microchip dot matrixes of red, green and blue, the display content forms of the screen, such as characters, animations, pictures and videos, are changed in time by the bright red green bulb and the bright green bulb, and the display control of the components is carried out through a modular structure. The LED screen can realize conversion between different forms of multiple information presentation modes, can be used indoors and outdoors, and has incomparable advantages compared with other display screens. The novel LED lamp is developed rapidly and widely applied to various fields by virtue of the characteristics of high brightness intensity, low work power consumption, low voltage requirement, small and exquisite equipment, convenience, long service life, impact resistance, stability and strong external interference resistance. However, the optoelectronic display screen is formed by mounting thousands of red, green and blue LED microchips on a display substrate of an integrated module. The patent discloses a high-speed paster equipment of display product is one kind to thousands of red, green, three kinds of blue LED microchip, the high-speed accurate paster equipment to the display substrate of an integrated module.
According to the first aspect, the die bonder generally adopts two sets of servo motors to drive a set of swing arm structure, transmission parts such as belts, slide rails and splines are needed, the speed is low, the maintenance cost is high, and the service life is short; in the second aspect, the acceleration is high when the swing arm reciprocates, the productivity and efficiency of the equipment are low, and the position accuracy of the adhered wafer is not high; in the third aspect, the wafer position of the produced LED display screen product is inaccurate, the display brightness is not uniform, and the LED display screen product cannot be lightened, is damaged and the like due to the fact that the die bonder can not correct the position of the wafer product before the chip mounting production and confirms the electrical property and the appearance inspection. And the LED display screen products need to be repaired at the later stage, so that the production cost of the products is increased invisibly.
Disclosure of Invention
The purpose of the invention is as follows: the invention aims to provide a novel vacuum turret system structure, which aims to overcome the defects in the prior art, wherein before the LED display screen substrate is pasted and produced, the vacuum turret system and a wafer processing system carry out position correction and electric property and appearance inspection confirmation on wafer products, poor wafer screening is eliminated, good wafers used for pasting and mounting the display screen substrate are ensured, and meanwhile, production process work requirements of accurate position, high production efficiency and stable products are realized. Not only saves equipment and labor cost, but also improves the production efficiency.
The technical scheme is as follows: in order to achieve the purpose, the invention provides the following technical scheme:
the high-speed chip mounting equipment for the photoelectric display products comprises a display substrate feeding system, a vacuum rotating tower system and a vibration feeding system, wherein the display substrate feeding system is connected with the vacuum rotating tower system, the vacuum rotating tower system is connected with the vibration feeding system, the display substrate feeding system comprises a display panel conveying module, a display panel conveying device, a display panel clamping mechanism, a display panel positioning device, a visual position detection device and a chip XY workbench, the display panel conveying module comprises a display panel connecting device, a display panel transfer device and a display panel output device, the display panel clamping mechanism is arranged above the display panel conveying module, the display panel clamping mechanism is connected with the display panel conveying device in a sliding mode, the display panel clamping mechanism can slide along the display panel connecting device and the display panel output device, the visual position detection device is further arranged on the display panel conveying device in a sliding mode, the display panel positioning device is arranged below the visual position detection device, the display panel positioning device is connected to the chip XY workbench, the visual position of the display substrate is visually positioned through the visual position detection device and the chip XY workbench for quick compensation, and a chip mounted on the XY workbench can be lifted.
The vacuum turret system comprises a vacuum turret module, a turret suction nozzle device, a recovered material box device and a linear pressing device, wherein the vacuum turret module comprises a rotary correction device, an electrical property test device, a positioning correction device and a visual appearance detection device which are sequentially adjacent, after a wafer product enters the vacuum turret system, relevant wafers such as rotary correction, electrical property test, positioning correction, visual detection and the like are respectively subjected to a chip mounting pretreatment process, the linear pressing device is arranged below the vacuum turret module, the turret suction nozzle device is arranged below the linear pressing device, the chip mounting XY workbench is arranged below the turret suction nozzle device, wafers provided by the vibration feeding system enter the vacuum turret system through a wafer separation mechanism, after the defective wafers which do not pass through the chip mounting pretreatment process are pressed down through the linear pressing device, the defective wafers do not enter a box mounting process, and enter the recovered material device for recovery through the vacuum turret system to the final stage.
The vibration feeding system comprises a vibration feeding module, an electrostatic elimination device and a wafer separation mechanism, wherein the electrostatic elimination device is arranged above the vibration feeding module, the vibration feeding module is connected with the wafer separation mechanism, and the vibration feeding module is connected with the rotary tower suction nozzle device. The vibratory feed system provides wafer product from the turret nozzle assembly through the wafer separating mechanism into the vacuum turret system.
Optionally, the display substrate feeding system, the vacuum turret system and the vibration feeding system are all installed on the marble working platform. The marble working platform is used, and the marble has the advantages of uniform texture, good stability, high strength and high hardness, and can keep high precision under heavy load.
Optionally, the air purification device and the equipment cabinet are included. The equipment electronic box cabinet is used for providing a power supply when the equipment operates, and the air purifying device is used for purifying gas which is generated in the operation process of the equipment and pollutes the environment.
Optionally, the air purification device and the equipment electronic box cabinet are both arranged below the marble working platform, and the air purification device and the equipment electronic box cabinet are respectively located on two sides. Separately set up air purification device and equipment electronic box rack, when being favorable to preventing the function of air purification device, equipment electronic box rack functions simultaneously, is unfavorable for the heat dissipation of equipment electronic box rack.
Optionally, the vacuum turret system further includes a DD motor and a driving device thereof, and the DD motor and the driving device thereof are disposed in the equipment electrical cabinet.
Several alternatives are also possible, but not as an additional limitation to the above general solution, but merely as a further addition or preference, which alternatives can be combined individually for the above general solution or among several alternatives without technical or logical contradictions.
Has the advantages that: compared with the prior art, the invention has the following advantages:
the utility model discloses a high-speed paster equipment of display product is one kind to thousands of red, green, blue three kinds of LED miniature wafer, and high-speed accurate paster is to the equipment on the display substrate of an integrated module, through implementing this method, gets than the swing arm of traditional solid brilliant equipment and puts, and the vacuum capstan head system structure is used in this system innovation, more effectively promotes precision, efficiency and stability, inspects the wafer before the paster work simultaneously, ensures the display substrate steady quality who produces. Meanwhile, the machine type equipment can adopt multi-machine connection, so that the manual work is saved, and the efficiency is improved; adopt the design of turret formula, relevant module can be increased and decreased wantonly to the intermediate process, if: wafer positioning correction, wafer electrical property test, wafer rotation correction, visual appearance detection and chip mounting working platform. The CCD visual positioning can be adopted, and the rapid compensation can be carried out by combining the XY position, so that the mounting precision of a wafer product on a display substrate of an integrated module is effectively improved.
By implementing the invention, a vacuum turret system structure is innovatively used, before the LED display screen substrate is pasted and produced, the vacuum turret system and the wafer processing system carry out position correction on wafer products, electric property and appearance inspection confirmation are carried out, poor wafer screening is carried out, good wafers used by the pasted and produced LED display screen substrate are ensured, and meanwhile, production process engineering work of accurate position, high production efficiency and stable products is realized. Not only saves equipment and manpower and improves the production efficiency.
Drawings
FIG. 1 is a perspective view of the structure of example 1;
FIG. 2 is a top view structural view of embodiment 1;
FIG. 3 is a front view structural view of embodiment 1;
FIG. 4 is a right side view structural view of embodiment 1;
FIG. 5 is a schematic view of embodiment 1;
FIG. 6 is a flowchart of the apparatus of example 1;
FIG. 7 is a flow chart of the product of example 1.
Reference numerals: the device comprises a display substrate feeding system, a display panel conveying module 11, a display panel docking device 111, a display panel transferring device 112, a display panel outputting device 113, a display panel carrying device 12, a display panel clamping mechanism 13, a display panel positioning device 14, a visual position detecting device 15, a patch XY workbench 16, a vacuum turret system 2, a vacuum turret module 21, a rotation correcting device 211, an electrical property testing device 212, a positioning correcting device 213, a visual appearance detecting device 214, a turret suction nozzle device 22, a reclaimed material box device 23, a linear pressing device 24, a vibration feeding system 3, a vibration feeding module 31, an electrostatic eliminating device 32, a wafer separating mechanism 33, a marble working platform 4, an equipment cabinet 5 and an air purifying device 6.
Detailed Description
The invention will be further described with reference to the following figures and specific examples. It is to be understood that the present invention may be embodied in various forms, and that there is no intention to limit the invention to the specific embodiments illustrated, but on the contrary, the intention is to cover some exemplary and non-limiting embodiments shown in the attached drawings and described below.
It is to be understood that the features listed below for different embodiments may be combined with each other, where technically feasible, to form further embodiments within the scope of the invention. Furthermore, the particular examples and embodiments of the invention described are non-limiting, and various modifications may be made in the structure, steps, and sequence set forth above without departing from the scope of the invention.
Example 1:
the embodiment provides a high-speed pasting device of an optoelectronic display product as shown in fig. 1-4, which comprises a display substrate feeding system 1, a vacuum turret system 2, and a vibration feeding system 3, wherein the display substrate feeding system 1 is connected to the vacuum turret system 2, and the vacuum turret system 2 is connected to the vibration feeding system 3, wherein the display substrate feeding system 1 comprises a display panel conveying module 11, a display panel conveying device 12, a display panel clamping mechanism 13, a display panel positioning device 14, a visual position detecting device 15, and a pasting XY table 16, wherein the display panel conveying module 11 comprises a display panel docking device 111, a display panel transferring device 112, and a display panel output device 113, the display panel clamping mechanism 13 is disposed above the display panel conveying module 11, and the display panel clamping mechanism 13 is slidably connected to the display panel conveying device 12, therefore, the display panel clamping mechanism 13 can slide along the display panel connecting device 111 and the display panel output device 113, when the display substrate is fed in, the display substrate is clamped and conveyed to the display panel conveying device 12 by the display panel clamping mechanism 13 in the display panel transfer device 112 after passing through the display panel connecting device 111, or after the display substrate completes the high-speed pasting process, the display substrate is conveyed to the display panel clamping mechanism 13 by the display panel conveying device 12, is fed into the display panel transfer device 112 through the display panel clamping mechanism 13 and then is fed out through the display panel output device 113, the display panel conveying device 12 is also provided with the visual position detection device 15 in a sliding connection mode, the display panel positioning device 14 is arranged below the visual position detection device 15, the display panel positioning device 14 is connected to the XY pasting workbench 16, through visual position detection device 15 and visual position detection device 15, carry out visual positioning to the display substrate to combine paster XY workstation 16 to carry out rapid compensation, can promote the precision of pasting the wafer at the display substrate of an integrated module.
The vacuum turret system 2 comprises a vacuum turret module 21, a turret suction nozzle device 22, a reclaimed material box device 23 and a linear pressing device 24, wherein the vacuum turret module 21 comprises a rotation correction device 211, an electrical property test device 212, a positioning correction device 213 and a visual appearance detection device 214, the rotation correction device 211, the electrical property test device 212, the positioning correction device 213 and the visual appearance detection device 214 are sequentially adjacent, after a wafer product enters the vacuum turret system 2, relevant wafers are subjected to chip pre-processing procedures such as rotation correction, electrical property test, positioning correction and visual detection, the linear pressing device 24 is arranged below the vacuum turret module 21, the turret suction nozzle device 22 is arranged below the linear pressing device 24, the chip XY workbench 16 is arranged below the turret suction nozzle device 22, the wafers provided by the vibration feeding system 3 enter the vacuum turret system 2 through a wafer separation mechanism 33, and after the defective wafers which do not pass through the chip pre-processing procedure are pressed down through the linear pressing device 24, the defective wafers enter the reclaimed material box device 23 through the vacuum turret system 2 to be reclaimed.
The vibration feeding system 3 comprises a vibration feeding module 31, an electrostatic eliminating device 32 and a wafer separating mechanism 33, wherein the electrostatic eliminating device 32 is arranged above the vibration feeding module 31, the vibration feeding module 31 is connected with the wafer separating mechanism 33, and the vibration feeding module 31 is connected with the turret suction nozzle device 22. The vibratory feed system 3 provides wafer products from the turret suction nozzle assembly 22 through the wafer detachment mechanism 33 into the vacuum turret system 2. The display substrate feeding system 1, the vacuum turret system 2 and the vibration feeding system 3 are all installed on a marble working platform 4. The marble working platform 4 is used, and has the advantages of uniform marble texture, good stability, high strength and high hardness, and can keep high precision under heavy load. Also comprises an air purification device 6 and an equipment electric cabinet 5. The equipment electrical cabinet 5 is used for providing power supply when the equipment is operated, and the air purifying device 6 is used for purifying gas which is generated during the operation of the equipment and pollutes the environment. Air purification device 6 and equipment electronic box rack 5 all set up in the below of marble work platform 4, and air purification device 6 and equipment electronic box rack 5 are located both sides respectively. Separately set up air purification device 6 and equipment electronic box rack 5, when being favorable to preventing the function of air purification device 6, equipment electronic box rack 5 functions simultaneously, is unfavorable for the heat dissipation of equipment electronic box rack 5. The vacuum turret system 2 further comprises a DD motor and a driving device thereof, and the DD motor and the driving device thereof are disposed in the equipment electrical cabinet 5. By implementing the invention, the structure of the vacuum turret system 2 is innovatively used, before the LED display screen substrate is pasted and produced, the vacuum turret system 2 and the wafer processing system carry out position correction on wafer products, check and confirm electrical property and appearance, screen bad wafers, ensure that the pasted and used wafers on the display screen substrate are good wafers, and simultaneously realize the production process work of accurate position, high production efficiency and stable products. Not only saves equipment and manpower, but also improves the production efficiency.
The implementation principle of the invention is as follows: firstly, the display substrate feeding system 1 and the vibration feeding system 3 simultaneously feed, the display substrate feeding system 1 provides a display substrate, and the vibration feeding system 3 provides a wafer product, in the display substrate feeding system 1, the display substrate firstly enters through the display panel connection device 111, although the display panel connection device 111, the display panel transfer device 112, and the display panel output device 113 are in the same display panel conveying module 11, the display substrate cannot form a passage only through the three devices, that is, the display panel connection device 111 cannot directly reach the display panel output device 113 through the display panel transfer device 112. Get into from display panel interfacing apparatus 111, reach display panel transfer device 112, display panel fixture 13 will be located the display panel of display panel transfer device 112 and carry out the centre gripping this moment to drive this display substrate and move and carry out visual detection and location to visual position detection device 15 and display panel positioner 14, can be in next step carry out more accurate going on when carrying out the paster compensation on paster XY workstation 16, promote the precision of whole paster.
Meanwhile, in the vibration feeding system 3, the wafer product is supplied through the vibration feeding module 31, then the static electricity of the wafer product supplied through the vibration feeding module 31 is eliminated through the static electricity eliminating device 32, so that errors are prevented, the precision of the wafer product in the subsequent mounting operation is improved, and then the wafer product is separated from the vibration feeding system 3 through the wafer separating mechanism 33 and enters the vacuum turret system 2.
In the vacuum turret system 2, the wafer products separated by the wafer separating mechanism 33 are connected and adsorbed by the turret suction nozzle device 22, enter the vacuum turret module 21 to inspect the wafer products, and sequentially pass through the rotation correcting device 211, the electrical property testing device 212, the positioning correcting device 213 and the visual appearance detecting device 214, so that the quality of the wafers mounted on the produced display substrates is ensured to be stable, and the modules for inspecting the wafers in the middle can be increased or decreased arbitrarily, such as wafer positioning correcting, wafer electrical property testing, wafer rotation correcting, visual appearance detecting and mounting working platform. After the wafer inspection is finished, the process of mounting the display substrate is started, and when the display substrate is conveyed to the position below the turret suction nozzle device 22 of the vacuum tower system 2 through the XY workbench device, the equipment performs high-speed mounting work. When the chip of the wafer product is fully arranged with the display substrate, the XY table device moves the display substrate out of the vacuum turret system 2, the display panel conveying device 12 grabs the substrate by the clamping mechanism and sends the substrate to the transfer device, and the display panel transfer device 112 is connected with the display panel output device 113 to convey the display substrate finished with the chip production to the next process. Meanwhile, the display panel handling device 12 takes a new display substrate from the docking device through the clamping mechanism to continue the previous operation.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that various changes and modifications can be made by those skilled in the art without departing from the spirit of the invention, and these changes and modifications are all within the scope of the invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (5)
1. A high-speed paster device of photoelectric display products is characterized by comprising a display substrate feeding system, a vacuum turret system and a vibration feeding system, wherein the display substrate feeding system is connected with the vacuum turret system, and the vacuum turret system is connected with the vibration feeding system;
the vacuum turret system comprises a vacuum turret module, a turret suction nozzle device, a recycled material box device and a linear pressing device, wherein the vacuum turret module comprises a rotation correcting device, an electrical property testing device, a positioning correcting device and a visual appearance detecting device, the rotation correcting device, the electrical property testing device, the positioning correcting device and the visual appearance detecting device are sequentially adjacent, the linear pressing device is arranged below the vacuum turret module, the turret suction nozzle device is arranged below the linear pressing device, and the patch XY workbench is arranged below the turret suction nozzle device;
the vibration feeding system comprises a vibration feeding module, an electrostatic elimination device and a wafer separation mechanism, wherein the electrostatic elimination device is arranged above the vibration feeding module, and the vibration feeding module is connected with the wafer separation mechanism.
2. The high-speed sheet mounting device for photoelectric display products of claim 1, wherein the display substrate feeding system, the vacuum turret system and the vibration feeding system are all mounted on a marble working platform.
3. The high-speed patch device of claim 1, comprising an air cleaning device and a cabinet of an electrical equipment box.
4. The high-speed patch device of claim 3, wherein the air purification device and the equipment cabinet are disposed below the marble work platform, and the air purification device and the equipment cabinet are disposed at two sides respectively.
5. The high-speed sheet mounting apparatus for electro-optical display products according to claim 3, wherein said vacuum turret system further comprises a DD motor and its driving device, said DD motor and its driving device being disposed in said apparatus cabinet.
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| CN202110886278.3A CN113644182B (en) | 2021-08-03 | 2021-08-03 | High-speed paster equipment of photoelectric display product |
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| CN202110886278.3A CN113644182B (en) | 2021-08-03 | 2021-08-03 | High-speed paster equipment of photoelectric display product |
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| CN113644182A CN113644182A (en) | 2021-11-12 |
| CN113644182B true CN113644182B (en) | 2023-01-03 |
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| CN116246991B (en) * | 2023-05-12 | 2023-07-11 | 深圳市诺泰芯装备有限公司 | Method and device for positioning chip product by edge |
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