KR20180063842A - Assembly machine with a displacement device for moving a reception device for a carrier with assembly medium - Google Patents

Abstract

An assembly machine (100, 200, 300) to assemble a chip (382) without a housing on a carrier (190) to manufacture electronic parts each including at least one chip arranged in a housing including a hardened porting compound comprises: (a) a chassis (112); (b) a supply device (140) mounted on the chassis (112) to supply a wafer (180) with a plurality of chips (382); (c) a displacement device (170) mounted on the chassis (112); (d) a surface positioning system having a fixed component mounted on the chassis (112) and a movable component; (e) an assembly head (120) mounted on the movable component to pick up a chip (382) from the provided wafer (180) and arrange the picked-up chip (382) in an assembly area (126) on a predetermined assembly position on the received carrier; and (f) a reception device (130) for a carrier to receive the carrier (190) to be assembled. The reception device (130) for a carrier is mechanically connected to the displacement device (170). The reception device (130) for a carrier can be displaced in parallel with a prescribed XY plane extended in an X direction and a Y direction by the displacement device (170). The X direction is perpendicular to the Y direction. The reception device (130) for a carrier includes an integrated support element (132) forming at least an upper portion of the carrier reception device (130). The carrier (190) to be assembled may be placed on the integrated support element (132).

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an assembling machine having a displacement device for moving a carrier accommodating device having an assembling medium.

BACKGROUND OF THE INVENTION [0002] The present invention relates generally to the technical field of electronic component manufacturing. In particular, the present invention relates to an assembling machine for handling chips having no housing in connection with the manufacture of electronic components each comprising at least one chip packaged in a housing and a suitable electrical connection contact capable of electrically contacting the packaged chip, And methods.

In the manufacture of an electronic component having a housing, a (semiconductor) chip with no housing, a so-called "bare die" is assembled on the carrier. With respect to the so-called "embedded wafer level package" (eWLP) process, one or more chips per package are placed below the active surface on the adhesive film on the carrier. Subsequently, a plurality of chips are cast into a plastic material, which later forms a housing. The entire cast product is baked under high pressure and subsequently separated from the carrier or adhesive film. In subsequent process steps, the chips are contacted, optionally electrically connected, and provided with solder balls used as electrical connection contacts. Eventually, the entire processed casting product is sown or otherwise individualized to form individual parts.

Specifically, eWLP is a housing design for integrated circuits where electrical contact contacts are formed on a wafer artificially made of chip and potting compound. Thus, all the processing steps necessary to form the housing on the artificial wafer are carried out. This allows the fabrication of very small and flat housings with excellent electrical and thermal properties at very low manufacturing costs, compared to conventional housing technology using so-called "wire bonding ". With this technique, the parts can be manufactured, for example, as a ball grid array (BGA).

Another known integration method in microelectronics is the manufacture of so-called system-in-package (SiP) modules. In the SIP process, additional components as well as passive and active components are fabricated from a number of (semiconductor) chips, which are placed on the carrier by an assembling process, wherein the carrier is, for example, an epoxy printed circuit board material, Film or metal foil. Arranged chips are incorporated into a housing, often referred to as an IC package, by known structure and connection techniques. The necessary electrical connections between the individual chips can be realized by, for example, bonding wires, and other connection principles are possible, such as conductive thin films or through connections on the side edges of the chip.

eWLP in relation to the process or production of the SIP module, the handling of the housing which does not contain a chip is compared with the generally known surface mount technology (S urface M ount echnologie T) performed by the modified assembly machine. Such an assembling machine includes an assembling head for placing the chips on predetermined carrier positions on respective carriers. In this case, the requirement for position accuracy of the assembly is particularly high. For the current eWLP process and SIP module fabrication, position accuracy or assembly accuracy of 15 [mu] m / 3 or greater is required, where sigma (sigma) is the standard deviation for the assembly position. As the miniaturization of electronic components progresses, it is expected that there will be a higher demand for assembly accuracy in the future.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an assembly machine and method for assembling a semiconductor chip in a carrier, which has no housing, permitting the use of a large carrier simultaneously with high assembly accuracy.

This problem is solved by the object of the independent claim. Preferred embodiments of the invention are set forth in the dependent claims.

According to a first aspect of the present invention there is provided an assembly for assembling a chip into a carrier having no housing which can be used for manufacturing electronic components each comprising at least one chip each disposed in a housing comprising a cured potting compound, The machine is started. The disclosed assembling machine comprises (a) a chassis; (b) a supply device mounted on the chassis for providing a wafer having a plurality of chips; (c) a displacement device mounted on the chassis; (d) a surface positioning system having a fixed component and a movable component mounted on the chassis; (e) an assembly head mounted on the movable component for picking up chips from a provided wafer and placing the picked-up chips within an assembly area on a predetermined assembly position on the received carrier; And (f) a carrier receiving device for receiving a carrier to be assembled. The carrier receiving device is mechanically coupled to the displacement device, and the carrier receiving device is displaceable in parallel with a predetermined XY plane extending in the X and Y directions by the displacement device. The carrier receiving device includes an integral support element forming at least an upper portion of the carrier receiving device, and the carrier to be assembled can be placed on the integral support element.

According to a second aspect of the present invention, a method is disclosed which can be used to assemble a chip into a carrier, particularly with a housing machine according to the first aspect of the present invention. The disclosed method preferably comprises the following steps, which are carried out sequentially in time sequence: (a) providing a wafer with a plurality of chips by a feeding device; (b) positioning and securing the carrier on the upper surface of the integral support element of the carrier receiving device; (c) assembling a chip in a first region of the carrier by an assembly head; (d) displacing the carrier receiving device in parallel with a predetermined XY plane extending in the X and Y directions by the displacement device; And (e) assembling the chip to an additional region of the carrier by the assembly head. In this case, during the time interval between the assembly of the first region and the assembly of the further region, the carrier remains fixed on the upper surface of the integral support element.

The above-described assembling machine and the above-described method are characterized in that, due to the displacement of the carrier receiving device, different regions of the assembling medium of the carrier placed on the carrier receiving device are moved into the assembling area of the assembling machine, Based on the perception that they can be moved. As a result, a large carrier can be assembled with high assembly accuracy.

 It is also possible that only the carrier is moved on the carrier receiving device in order to continuously insert different areas of the carrier to be assembled (with space overlap in some cases) into the assembly area of the positioning system and assemble the chip there. In the case of a large carrier, in a conventional assembling machine the carrier must be displaced on the carrier receiving device. In this case, the carrier must be unfixed and re-formed after the carrier is displaced. In this case, the mechanical stress of the carrier may appear. In the field of manufacture of electronic components, the resulting inaccurate positioning of the chip on the carrier is unacceptable. This problem does not appear in the assembling machine according to the present invention.

Other embodiments and related advantages will be described below.

Preferably, the X direction, the Y direction and the Z direction are oriented perpendicular to each other. The axes X, Y and / or Z may correspond to the coordinate axes of the Cartesian coordinate system. If the X direction, the Y direction or the Z direction is mentioned, these directions preferably mean directions extending on each coordinate axis of the Cartesian coordinate system or parallel to the coordinate axis.

The expression "mounted" herein means that the first component of the assembly machine may be mounted directly or indirectly to the second component of the assembly machine. Directly "mounted" may include a releasable attachment or non-releasable attachment wherein the two associated components are generally separated from one another only after release of at least one permanent fastening means, e.g., It can also mean what can be done. Mounted "may also mean that the associated components are stationary relative to each other or alternatively arranged movably. The corresponding also applies to the expression" coupled ".

The expression "electronic component" as used herein specifically refers to an electronic component having a housing, including (a) a chip, (b) a housing surrounding the chip, and (c) suitable electrical connection contacts for the chip. An "electronic component" may be a component for a surface mount, commonly referred to as a surface mount component (SMD). Alternatively, the expression "chip" herein refers to a semiconductor chip (bare die) having no housing, which is produced in a manner known in particular from the processed semiconductor wafer by individualization.

Preferably the integral support element is designed such that the carrier to be assembled can be laid flat. This does not mean that the entire lower surface of the carrier must lie flat. Nevertheless, by placing the large side of the carrier to be assembled on the integral support element, the carrier to be assembled can be prevented from being crushed against the integral support element during the process of assembling multiple chips. This is effective when a sufficient surface of the carrier to be assembled is fixed on the integral support element. By eliminating or at least substantially reducing the spatial deformation of the carrier to be assembled, particularly high assembly accuracy can be ensured.

According to one embodiment, the assembly head may include a plurality of holding devices for temporarily accommodating one chip each. The use of so-called multiple assembly heads has the advantage that a plurality of chips can be picked up from the feeding device in a very short time by the assembly head and then these multiple chips can be transported together into the assembly area, . This significantly increases the assembling performance of the assembling machine as compared to the assembling machine with only one single assembling head.

The carrier used may preferably be a metallic carrier plate or a metallic frame on which the assembly medium is disposed or fixed. The assembly medium is preferably a one- or two-sided adhesive film.

In particular, the carrier receiving device is displaceable at least along the X direction by the displacement device.

The displacement device can be designed as a linear drive. The displacement device preferably includes one spindle drive, two rails and one spindle. By the displacement device, the carrier can be displaced in the X direction along the rail by a spindle driven by the spindle drive.

According to one embodiment of the present invention, the integral support element has a larger size than the assembly area of the assembly machine in the X direction. In particular, the integral support element has a size at least n times larger than the assembly area in the X direction and n is greater than 1.2, preferably greater than 1.5, more preferably greater than 2, even more preferably greater than 2.5 , In particular greater than three.

In particular, the integral support element may have a larger size than the assembly area of the assembly machine in the X and Y directions. In particular, the integral support element has a size at least n times larger than the assembly area in the X direction and n is greater than 1.2, preferably greater than 1.5, more preferably greater than 2, even more preferably greater than 2.5 , In particular greater than three. Alternatively or in combination, the integral support element has a dimension at least m times larger than the area of the assembly in the Y direction, m is greater than 1.2, preferably greater than 1.5, more preferably greater than 2, Can be greater than 2.5, in particular greater than 3.

The above-described embodiments enable efficient assembly of a large number of chips into a carrier having a relatively large area, especially in the manufacture of eWLP and SIP modules.

The entire surface of the assembly medium or the corresponding surface of the integral support element is assigned one or more areas on which the assembly takes place. These areas of the assembly medium must be distinguished from the "assembly area" of the assembly machine. However, one or more areas of the assembly medium are divided according to the size of the assembly area of the assembly machine in relation to its size. For example, the surface of the assembly medium having the same size as the assembly area of the positioning system in the Y direction has a size that is twice the assembly area of the assembly machine in the X direction, and two I.e., a first area of the assembly medium and a second area of the assembly medium. The assembly takes place first in the first area of the assembly medium. In this case, the displacement of the carrier receiving device by the displacement device first causes the first area of the assembled medium to spatially coincide with the assembled area of the assembling machine. Once the first area of the assembly medium has been assembled, the second area of the assembly medium can be assembled spatially coincident with the assembly area of the assembly machine by the displacement device. The larger the carrier and assembly media, the more areas are defined for the assembly media. The plurality of assembly media, in particular the sequentially arranged areas to be assembled, are moved and assembled into the assembly area of the assembly machine successively, preferably according to their spatial arrangement, by displacement of the carrier receiving device.

According to one embodiment, the carrier receiving device is displaceable at least along the X direction by a displacement device. As a result, the integral support element having a size larger than the assembly area of the assembling machine in the X direction can be displaced at least in the X direction by the displacement device, and the sequentially arranged areas of the assembly medium to be assembled are successively assembled Can be moved into the area and assembled.

According to another embodiment of the present invention, the assembling machine includes a lifting device coupled to the chassis, the lifting device configured to move the integral supporting element along the Z direction relative to the chassis. The Z direction is oriented perpendicular to the XY plane.

By means of the lifting device, a uniform height of the respective assembly plane can be ensured even for carriers of different thicknesses to be assembled, thereby giving a high assembly accuracy. This also applies to the calibration of the assembling machine, which is often required by the marking provided on the surface of the integral support element, and the integral support element can be raised or lowered by the lifting device. Thus, calibration of the assembling machine can be performed with very high accuracy, which gives a particularly high assembly accuracy when the chip is later assembled to the carrier.

According to another embodiment of the present invention, the fastening component is a fixed carrier rail that allows the assembly head to be displaced along the Y direction, the movable component is a displaceable carrier plate with an assembly head mounted thereon, And a carrier plate displaceable along the carrier arm, the carrier plate being displaceable along the X direction.

This advantageously defines a definite assembly area of the surface positioning system and the chips can be mounted in the correct position on the assembly medium.

According to another embodiment of the invention, the assembling machine comprises a transfer device for transferring the carrier along the transfer direction, more preferably over the upper surface of the integral support element along the X direction.

By means of the transfer device, the carrier can be transferred to the integral support element and placed on the integral support element. The carrier can thus be transported with the assembly medium (in part) into the assembly area of the surface positioning system.

According to another embodiment of the present invention, the integral support element comprises a pneumatic interface, whereby a low pressure can be applied onto the lower surface of the carrier. By virtue of the low pressure clamping, the carrier can be held at a predetermined position on the integral support element and therefore in a predetermined position in the assembly machine with very high accuracy and without internal deformation.

Specifically, the carrier to be assembled is sucked on the carrier receiving device or on the integral support element through the pneumatic interface. If a sufficient low pressure is provided to the surface of the carrier contacting the pneumatic interface, it is surely prevented that the carrier slips accidentally. Compared to the releasable fastening of the carrier by means of a known clamping mechanism for a printed circuit board to be assembled into an electronic component with a housing, the aforementioned pneumatic fastening of the carrier to be assembled into a chip without a housing is much more temperature stable Respectively. This is because the various components of the known clamping mechanism have different geometries and thus undergo different thermal expansions, so that the manner of clamping also changes with temperature changes. As a result, known clamping typically displaces at least a portion of the carrier to be assembled into the chip within the assembly machine.

Apart from the above-mentioned temperature stability, the pneumatic fixation is advantageous in that, in a preferred embodiment of the carrier receiving device, compared with conventional clamping, the carrier can be fixed flat on the upper surface of the carrier receiving device or on the integral support element . This can reliably prevent the partial area of the carrier from bending upwards or away from the integral support element. In this context, in the case of lateral clamping, which is commonly used for printed circuit boards to be assembled, bending of each printed circuit board can occur. Thus, bending the carrier down can be prevented by a suitable support pin in a known manner, but undesirable upward bending can be achieved in a simple manner only by pneumatic locking of the carrier to be assembled into a chip without a housing, Because the upper surface of the carrier must be freely accessible for assembly.

Specifically, the carrier receiving device with a pneumatic interface is a vacuum fastening tool that can fasten the carrier to be assembled within the assembling machine. The surface of the carrier can be laid down at the height of the plane of the assembling machine exactly where the chips can be placed in the best and in particular the maximum assembly accuracy.

According to one embodiment, the pneumatic interface may include a groove through which a low pressure produced by the low pressure generating unit may be provided. The low-pressure generating unit may be an external unit in association with the above-described assembling machine and may be a unit that can be pneumatically coupled to the carrier receiving apparatus only. However, the low-pressure generating unit can also be assigned to the assembling machine described above. In particular, in the latter case, the above-described low-pressure generating unit can be used for the generation of a low pressure, for example for synergistic reasons, which is used for temporary acceptance of chips on a so- Is used.

The use of grooves to deliver low pressure to the surface of the carrier has the advantage that the low pressure can be applied along one line rather than just on the point. In this case, the shape and / or length of the groove may be adjusted according to the size and / or mechanical characteristics of the carrier to be assembled with the chip.

The grooves may include a plurality of groove sections connected to each other at one branch point or a plurality of branch points. Also, at least one section of the groove may preferably be a central point of the surface of the carrier receiving device or a circumferential groove extending around the center point of the carrier fixed to the carrier receiving device. Thus, the low pressure can be applied in a substantially symmetrical manner onto the lower surface of the carrier to be assembled. As a result, the carrier to be assembled is subject to mechanical stress only in such a way that it does not receive mechanical stress due to the low pressure or merely neglects it. This also contributes greatly to high assembly accuracy.

In the embodiment described herein of the assembling machine according to the invention, the interaction of the displacing device and the pneumatic interface in particular for securing the carrier is technically desirable. This is because the carrier receiving device itself can be displaced by the displacement device to insert the different areas of the carrier to be assembled (with space overlap in some cases) into the assembly area of the positioning system continuously and to assemble the chip there, This is because the carrier on the receiving device need not be displaced. The pneumatic fixed (multiple, sequential) release and the pneumatic interface eliminate the need for complex reinsertion of the carrier to be assembled. Since the carrier can be provided with a sufficiently low pressure through the pneumatic interface, it is surely prevented that the carrier slips accidentally during the entire assembly process.

According to another embodiment of the present invention, the assembling machine also includes a temperature control device, which is thermally coupled to the integral support element and is designed to maintain the integral support element at least at a substantially constant temperature.

The temperature control device can actively or passively temperature stabilize the integral support element and thus the carrier pneumatically fixed to the integral support element. The passive temperature stabilization can be simply realized in such a manner that a gas or liquid heat exchange medium having a predetermined temperature is formed in the integral support element but at least flows through the channel formed in the carrier receiving device. Since the active temperature stabilization additionally includes temperature feedback from the temperature sensor to the control unit of the temperature control device, the temperature and / or volume flow of the heat exchange medium must be at least partly thermally coupled with the carrier to be assembled, And is preferably always adjusted to a predetermined temperature.

The temperature stabilization of the carrier to be assembled in connection with precisely maintaining the position of the carrier in the assembling machine is very important in the manufacturing process of the "embedded wafer level process" (eWLP) and the system in package (SiP) module described above Unlike assembling a printed circuit board with SMD components, which often take less than a minute, assembling duration from the wafer to the carrier is typically much longer taking into account a much larger number of chips to be processed to be. Typical assembly durations for assembling chips without housings into a carrier can be from one hour to several hours. As a result, all (even very small) transient changes in the assembly machine and / or the carrier to be assembled directly affect the assembly accuracy.

According to another embodiment, the temperature control device is adapted to control the temperature of the carrier receiving device and, in particular, the integral support element, to a temperature at least 2 Kelvin, preferably at least 4 Kelvin, in particular at least 7 Kelvin lower than the direct ambient temperature of the carrier receiving device And can be designed to cool the carrier receiving device and especially the integral support element. This can ensure that the waste heat of the components of the assembling machine, which cause an undesirable and unavoidable temperature rise in the spatial region below the protective cover of the assembling machine, does not automatically result in an increase in the temperature of the carrier. In particular, by proper setting of the temperature control device, it can be achieved that the carrier has at least approximately the same temperature as the ambient temperature of the assembling machine during assembly. This actually means that the carrier does not experience a temperature change when inserted into the assembly machine and when pulled out of the assembly machine, or only undergoes a negligible temperature change. This increase in temperature will result in a corresponding decrease in assembly accuracy as the spatial dimensions of the carrier during assembly process result in thermal expansion.

The integral support element may have a coefficient of thermal expansion at 20 캜 less than 10 x 10 ^-6 / K, preferably less than 5 x 10 ^-6 / K, more preferably less than 2 x 10 ^-6 / K.

It is only necessary to design the integral support element so that the geometry of the integral support element has a very low temperature dependency in order to ensure an accurate fixation of the position of the carrier even under varying ambient temperatures in the assembly machine described above. This can be done, for example, by the use of suitable materials, such as Invar alloys, which consist of about 64% iron and 36% nickel and have a very low coefficient of thermal expansion in a known manner.

According to one embodiment of the invention, the integral support element can comprise at least two markings, the markings being optically detectable and mounted, in particular outside the spatial area on the upper face of the integral support element, And is provided for receiving a carrier to be assembled.

Based on at least one such marking, the position of the assembled chip for the marking can be determined with great accuracy by appropriate optical measurements. If the position of the relevant marking in the above-described assembling machine is known accurately, the actual position of the assembled chip in the coordinate system of the assembling machine can be accurately determined. Further, if the position of the carrier assembled at least partially in the coordinate system of the assembling machine has been accurately known, the actual position of the assembled chip in the carrier's coordinate system can be determined very accurately. In this position measurement, if a spatial offset between the actual assembly position and the predetermined assembly position is determined, such offset can be compensated at least approximately by appropriate control of movement of the assembly head in a subsequent assembly process.

The precise location of the optically detectable marking can be measured with a high precision optical measuring machine prior to the installation of the carrier receiving device or the components of the carrier receiving device in which the markings are located. In this way, the above-mentioned optical measurement of the assembled position can be carried out with particularly high accuracy.

Spatially locating the two markings outside the area provided for receiving the carrier during operation of the assembly machine has the advantage that the marking (position) can also be measured during assembly of the carrier. Therefore, as described above, it is possible to optically identify the position of the assembly even during the assembly process, which may take, for example, 1 to 2 hours, and to assure uniformly high assembly accuracy.

The integral support element may comprise at least two first marks, the markings being optically detectable, and in particular mounted outside the space area on the upper surface of the integral support element, the space area being adapted to receive a carrier to be assembled Lt; / RTI > The two first markings are arranged along the X direction.

The integral support element may comprise at least two second marks, the markings being detectable optically, and in particular mounted outside the space area on the upper surface of the integral support element, the space area being adapted to receive a carrier to be assembled Lt; / RTI > The two second marks are arranged along the Y direction.

According to one embodiment of the invention, the assembling machine further comprises a camera mounted on the assembly head. The surface positioning system is calibrable by the camera using information detected through at least one of the markings described above. In particular, the assembling machine may further comprise a calibration device, said surface positioning system being calibrable by a calibration device that receives and evaluates the information detected by at least one of the markings described above by the camera.

As described above, if the assembling machine includes a (surface) positioning system mounted on the chassis, and if the camera as well as the assembly head can be positioned by the positioning system, the optical measurement of each pair of markings, Spatial variations in the various components of the positioning system that occur during or during assembly can be detected. This spatial variation can occur particularly due to temperature variations of the individual components of the positioning system.

Specifically, when at least the individual components of the positioning system are deformed, the coordinate system is deformed. By optical position measurement of the corresponding markings assumed to be fixed, the deformation can be determined and compensated by appropriate control of the positioning system at the time of further assembly of the carrier. This allows very high assembly accuracy, which is stable over time, to be achieved, especially when using a bilinear model to determine deformation.

According to another embodiment of the present invention, an assembly machine comprises: (a) an additional supply device for providing an additional wafer having a plurality of chips; (b) picking up a chip from the provided additional wafer, Lt; RTI ID = 0.0 > assembly < / RTI >

According to another embodiment of the present invention, the chip is a chip without a housing.

The assembling machine according to the present invention can be advantageously used particularly in the so-called "embedded wafer level package" (eWLP) process, in which a (semiconductor) chip without a housing, called a "bare die" And assembled on a carrier. In recent years, wafer fabrication and processing have been steadily improved and will continue to improve in the future, so eWLP technology also uses very large wafers, for example, 300 mm in diameter. In the future, wafers having a diameter of, for example, 450 mm for at least silicon will be processed. This means that the assembly area of the assembly machine is often smaller than the assembly surface of the carrier to be assembled, since the carrier to be assembled is also correspondingly large. This is due in particular to the fact that a large carrier is used in such a way.

According to another embodiment of the invention, a method is disclosed which is implemented by an integral support element having at least two second markings, wherein the markings are optically detected by a camera mounted on the assembly head, prior to displacement of the carrier receiving device And is mounted on the upper surface of the carrier receiving device, and the two second markings are arranged along the Y direction in the front area of the carrier receiving device. The integral support element also includes at least two additional second marks, which markings can be optically detected by the camera after displacement of the camera and mounted on the upper surface of the carrier receiving device. The two additional second marks are arranged along the Y direction in the rear region of the carrier receiving device. The method includes detecting the second markings and / or additional second markings by the camera, and determining the surface positioning system based on the spatial positions of the second markings and / Further comprising the step of calibrating.

Thereby, the second markings and / or additional second markings can be detected by the camera, and the additional information provided thereby, i.e. the second markings detected by the camera and / or the spatial position of the additional second markings The surface positioning system can be more accurately calibrated.

In this regard, the front region of the carrier receiving device or the rear region of the carrier receiving device is different from the first region or additional region in which the chip is assembled. That is, the chip is not assembled in the front area of the carrier receiving device or in the rear area of the carrier receiving device, so that the detection and subsequent calibration of the second markings by the camera is possible and the markings are not covered by the carrier or assembly medium .

Quot; front "region of the carrier receiving device or the" rear "region of the carrier receiving device should be understood in relation to the displacement direction, which is preferably the X direction. In particular, the first region on the carrier may be disposed "forward" more than the additional region. Therefore, in particular, the arrangement of (i) the front area of the carrier receiving device, (ii) the first area, (iii) the second area and (iv) the rear area of the carrier receiving device are given along the displacement direction in this order.

According to another embodiment of the present invention, the method includes continuing to assemble the chip into the first area by the assembly head, wherein the assembly of the first area is performed prior to the calibration of the surface positioning system, Continues after calibration of the surface positioning system.

In other words, the first region is not fully assembled before the calibration of the surface positioning system during the assembly of the first region. Displacement of the carrier receiving device into the additional area, followed by detection of the additional second marking by the camera and subsequent calibration. After calibration of the surface positioning system, the carrier receiving device is again displaced into the first region. The assembly of the first region is then continued.

In particular, after continuing to assemble the first region (the first region is not fully assembled when continuing the assembly), further displacement of the carrier receiving device, then additional detection of additional second marking by the camera, Additional calibration is performed. After further calibration of the surface positioning system, the carrier receiving device is again displaced into the first region. The assembly of the first area is then continued further.

The calibration of the surface positioning system can be further improved so that the deformation of the positioning system that occurs in the meantime can be detected with a particularly high accuracy and compensated by further calibration, have.

The process including displacement of the carrier receiving device, detection of the additional second marking, subsequent calibration, displacement of the carrier receiving device back into the first area and continuation of the assembly of the first area may be performed at any timing, Or at any frequency during the assembly period of the assembly. The more often the process is performed, the more accurate the assembly can be achieved. In particular, if the process is carried out more frequently, it can be more reliably ascertained whether reformation of the positioning system has occurred and, in some cases, compensation by calibration.

In particular, the timing can be adjusted to the accuracy of the surface positioning system, especially the speed and / or intensity at which deformation of the surface positioning system occurs. The greater the speed and / or intensity at which deformation of the surface positioning system occurs, the higher the timing of the process must be selected. The process, including displacement into the additional area, detection of the additional marking by the camera, subsequent calibration, displacement of the carrier receiving device back into the first area, and continuation of the assembly of the first area, It should be done with a great frequency. In order to detect the probability of deformation of the surface positioning system, in particular a reference measurement can be carried out in advance.

According to another embodiment of the present invention, the assembling of the additional area of the carrier is carried out after continuing to assemble the first area.

In particular, assembling the chip to an additional area of the carrier by the assembly head is only required after the start of assembling the first area. Particularly, the assembling of the chip to the additional area of the carrier by the assembly head is performed only after the first area is fully assembled.

1 is a plan view of an XY plane showing an assembling machine including two wafer feeders and two assembly heads;
Figure 2 is a perspective view of a different mechanism for positioning or displacing the carrier receiving device of the assembling machine shown in Figure 1;
Figures 3a-3d are plan views of an XY plane illustrating a method of assembling a chip to a carrier without a housing implemented by a building machine.
4 is a plan view of an XY plane showing an assembling machine including a transfer device, first and second markings and a pneumatic interface;

Other advantages and features of the present invention are set forth in the following description of the preferred embodiments.

In the following detailed description, features or components of the various embodiments that are identical or at least functionally identical to corresponding features or components of other embodiments are identified by the same reference numerals or the corresponding reference numbers or numerals Are indicated by the same reference numerals in the last two digits. To avoid unnecessary repetition, the features or components already described with reference to the above embodiments will not be described in detail later.

The embodiments described below represent only a limited selection of possible variations of the invention. In particular, since it is possible to combine the features of the individual embodiments in a suitable manner, a number of different embodiments should be considered as being apparent to one of ordinary skill in the art through the variations shown explicitly herein.

It should also be understood that spatial related representations such as "front" and "rear", "upper" and "lower", "left" and "right" . ≪ / RTI > Thus, the space-related expressions can be applied to orientations different from the orientations shown in the drawings. It should be understood, however, that all spatial representations are relative to the orientations shown in the drawings for convenience of explanation, and that the apparatus, components, etc. used herein are not necessarily restrictive because they may have orientations different from those shown in the figures do.

Figure 1 shows an assembling machine 100 according to a first embodiment of the present invention. The assembly machine 100 includes a chassis 112 and two positioning surface systems for moving one assembly head 120 and 121 on the chassis 112 are mounted so that the positioning systems And can be displaced within a parallel XY plane. The two surface positioning systems include a carrier rail 114 fixed relative to the chassis 112 as a first component commonly used. The two transverse carrier arms 116, which can be displaced along the Y direction, are mounted on the carrier rail 114 as a second (non-cavity) component. One support arm 116 is assigned to a positioning system and one carrier arm 116 is assigned to another positioning system. The two positioning systems each further include a displaceable carrier plate 118, which can be mounted on each carrier arm 116 and displaced along the X direction. On the two carrier plates 118, the mounting head 120 or 121 is mounted by means of a fixed threaded portion.

The assembly machine 100 also includes two wafer supply devices, one wafer supply device 140 and an additional wafer supply device 141. In other embodiments not shown, other types of feed devices (e.g., belts or magazine feeders) may be used instead of at least one wafer feed device. By means of each of the two wafer supply devices 140 and 141, the wafer 180 can be moved from the wafer reservoir (not shown in FIG. 1) into the providing area, (120, 121). Preferably, the assembly heads 120, 121 are so-called multiple assembly heads each including a plurality of suction pipettes shown in a small circle in FIG. One chip can be temporarily picked up by the suction pipette, respectively. According to the embodiment shown here, the suction pipettes can be individually displaced along the Z-direction perpendicular to the plane of the drawing, and thus perpendicular to the Y-direction and perpendicular to the X-direction. Alternatively, other head topologies may be used, e. G. Collect & Place revolver heads.

The chips picked up by the respective assembly heads 120 and 121 are transferred into the assembly area 126 by appropriate control of the associated surface positioning system and the chips in the assembly area are positioned at a predetermined assembly location on the carrier 190 to be assembled .

The assembly machine 100 with two assembly heads 120 and 121 and two feeders 140 and 141 is configured such that the two assembly heads 120 and 121 are in turn respectively associated with respective associated feeders 140 and 141 To be picked up from the carrier 190 to be assembled. As a result, the assembling performance can be greatly increased. In this regard, the expression "assembly performance" means the number of chips that can be picked up by the two assembly heads 120, 121 and placed on the carrier 190 within a given unit time, do.

The assembly machine 100 also includes a carrier receiving device 130 having an integral support element 132.

The carrier receiving device 130 is mechanically coupled to the displacement device 170. For this reason, the carrier receiving device 130 can be displaced in parallel with the XY plane by the displacement device 170. [

The integral support element 132 can be accurately moved and positioned by the displacement of the carrier receiving device 130 parallel to the XY plane by the displacement device 170, The defined area is laid down in the assembly area 126 in a precisely defined manner after the fixation of the carrier 190.

As can be seen from Fig. 1, the assembly medium 192 placed on the integral support element 132 in particular has a size larger than the assembly area 126 in the X direction. By means of the displacement device 170, the integral support element 132 can be displaced in a precisely sequential manner, so that it is also possible to assemble the large carrier 190 with high assembly accuracy.

2 shows in a perspective view a different mechanism for positioning or displacement of the integral support element 132 of the assembly machine shown in Fig. Figure 2 shows a transfer device 260 that can transfer the carrier 190 to be assembled onto the support element 132 and transfer the at least partially assembled carrier 190 from the support element again. The transfer device includes a belt drive 262 in the embodiment shown in FIG. The displacement device 170 includes a spindle drive 272, two rails 276 and a spindle 274. By the displacement device 170 the carrier 190 can be displaced in the X direction along the rail 276 using a spindle 274 driven by a spindle drive 272.

Figure 2 shows the lifting device 284 of the assembly machine mounted on the chassis 122. [ The lifting device 284 is configured to move the integral support element 132 along the Z-direction oriented perpendicular to the plane defined by the integral support element. Lifting device 284 includes two lifting cylinders 288, and only one of lifting cylinders 288 is shown in FIG. The two lifting cylinders 288 can be moved up and down synchronously. Lifting cylinders 288 are mounted with respective lifting elements 286. Lifting elements 286 are elongated in the X direction. On the lifting elements 286, the rails 276 of the displacement device 170 are mounted.

3A, 3B, 3C and 3D illustrate the method steps for assembling the assembly media 192 of the carrier 190, wherein the assembly media 192 has a size larger than the assembly area 126 in the X direction, . 3A, after provision and fixing of the carrier 190, the chip 382 is first assembled to the first area 394a of the assembly media 192 of the carrier 190. As shown in Fig. 3B, after the chip 382 is assembled in the first area 394a, the carrier receiving device 130 is accurately displaced along the X direction by the displacement device 170, The second non-assembled region 394b of the first assembly 392 lies exactly within the assembly area 126. [ 3C, the chip 382 is assembled to the second region 394b of the assembly medium 192. As shown in FIG. As shown in FIG. 3D, after fully assembled, the carrier 190 can be unfixed and the carrier 190 can be transported from the integral support element 132.

In the embodiment of the assembly machine 400 shown in Figure 4, the transfer of the carrier 190 onto the integral support element 132 and from the integral support element 132 is carried out by the transfer device 260, In the conveying direction T corresponding to the X direction. According to the embodiment shown in FIG. 2, the transfer device 260 includes two conveyor belts guided through two grooves of the integral support element 132.

To secure the carrier 190, the carrier receiving device 130 is provided on its upper surface with a pneumatic interface 433, which is designed as a circumferential groove extending around the center of the integral support element 132, ). A low pressure is generated in the groove 433 by a vacuum generating unit (not shown), so that the flat lower surface of the carrier 190 is sucked into the integral support element 132. [

The temperature control device 438 thermally coupled to the integral support element 132 maintains the integral support element 132 at least at a substantially constant temperature.

A first optically detectable structure 436a and a second optically detectable structure 436b are provided in the outer region of the carrier 190 for the approximate positioning or centering of the carrier 190 on the integral support element 132. [ As shown in FIG. According to the embodiment shown here, the optically detectable structures are each formed by simple holes 436a, 436b. Two first optically detectable structures 436a are mounted on the left or right side of the carrier 190 with respect to the transport direction T. [ A second optically detectable structure 436b is mounted in the upper portion in Fig. 4 and in front of the carrier 190 in relation to the transport direction T. Fig. In another embodiment, not shown here in the assembly machine, a further second optically detectable structure is mounted in the middle of the assembly media 192 of the carrier 190 in relation to the lower and Y direction in Fig.

The used carrier is a carrier 190, which may be a metal plate or preferably a metal frame, on which the assembly medium 192 is mounted or on which the assembly medium 192 is secured. The assembly medium 192 is preferably a one- or two-sided adhesive film. Assembly of the chip 382 into the assembly media 192 is accomplished by suitable positioning of the assembly head 120 in a known manner and by a chip holding device 122 formed as a suction pipette along the Z direction oriented perpendicularly to the XY plane As shown in FIG.

The centering of the carrier 190 on the integral support element 132 is based on optical measurements of the positions of the first and / or second optically detectable structures 436a, 436b. According to the embodiment shown here, a camera 450 mounted on the movable assembly head 120 is used. By appropriate control of the surface positioning system not shown in FIG. 4, the camera 450 can be placed in an appropriate manner over each first or second optically detectable structure 436a, 436b to be measured. In this measurement, if the position of the camera 450 in the coordinate system of the assembling machine 100 or the surface positioning system is known accurately, the coordinates of the carrier 190 in the coordinate system of the assembling machine 100 are determined by the camera 450 Can be determined by appropriate image evaluation of the image.

Since the second optically detectable structure 436b is mounted on the carrier 190 at the top in FIG. 4 and in the center in relation to the assembly medium 192 along the Y direction, in the case of the large carrier 190, The camera 450 mounted on the head 120 can not be easily placed on the structure 436b to be measured due to the limited displacement possibility of the assembly head 120. [ However, also in the assembly medium 192, which is mounted on the carrier 190 or the carrier by the displacement device 170, and which is larger than the assembly area 126 in the X-direction and is fixed within the carrier, The centering of the carrier 190 on the second optically detectable structure 132 may be accomplished by optical measurement of the position of the second optically detectable structure 436b. The carrier receiving device 130 is displaced along the X direction so that the second optically detectable structure 436b can be reached by the assembly head 120 having the camera 450 . The camera 450 can be accurately positioned on the optically detectable structure 436b to be measured and the centering of the carrier 190 can be made based on position information obtained by the structure 436b to be measured.

Alternatively or in combination, the first markings 434a and / or the second markings 434b may define a relative position of the carrier 190 relative to these first markings 434a and / or the second markings 434b Can be used to determine optically. All these markings are formed or mounted on or on the support element 132 according to the embodiment.

Also, the first markings 434a or the second markings 434b can serve to measure and calibrate the surface positioning system. By measuring and evaluating the position of the chip 382 disposed on the carrier 190 for at least two of the first markings 434a and the second marks 434b the chip 382 can be positioned on the carrier 190 The erroneous positioning of the chip 382 can be reliably detected. The surface positioning system can be correspondingly re-calibrated and thus erroneous positioning can be compensated. Initial calibration or recalibration is possible, regardless of whether the chip 382 is assembled to the carrier 190, for example, using a calibration plate having its own markings.

Preferably, at least one first marking 434a and at least one second marking 434b are used for measurement. In this case, two cameras 450 that can be mounted on the assembly head 120 can be used. In this case, the two cameras 450 are preferably vertically aligned with each other. This allows simultaneous detection of one or more first markings 434a and one or more second markings 434b.

The two first marks 434a are mounted offset from one another in the left hand side of the carrier 190 on the one hand in FIG. 4 and on the right hand side and in the X direction on the other hand. The two second marks 434b are mounted offset from each other in the Y direction and "above" with respect to the carrier in Fig. In addition, the two additional second marks are mounted offset from each other in the Y direction relative to the carrier 190 "below " based on the viewing direction of FIG. The two second marks 434b arranged "above " in FIG. 4 are arranged" forward " Two additional second marks 434b, arranged "below" in Fig. 4, are disposed "rearward" relative to the X direction.

The carrier receiving device 130 can be displaced along the X direction by the displacement device 170 so that a "lower" second marking 434b or an "upper" second marking 434b, depending on the position of the carrier receiving device, Can be reached and detected by the assembly head 120 having the camera 450. [ This allows a particularly accurate calibration of the assembly position of the chip 382 to be made because it is not only by the first marking 434a but also by all of the first markings 434a perpendicular to the connection line between the first marks 434a 2 marking 434b. Therefore, even in the case of the large carrier 190 having a plurality of assembly positions, all the assembling positions of the chips 382 can be measured. By proper calibration of the surface positioning system, high assembly accuracy can be permanently ensured.

The word " comprises "does not exclude other elements, and" a "does not exclude a plurality. In addition, elements described in connection with the different embodiments may be combined. The reference signs in the claims should not be construed as limiting the claims.

100 assembly machine
112 chassis
114 first component / fixed carrier rail
116 second component / displaceable carrier arm
118 third component / displaceable carrier plate
120 assembly head
121 Additional Assembly Head
122 Chip Holding Device / Suction Pipette
126 Assembly area
130 carrier receiving device
132 Integrated Support Elements
140 wafer feeder
141 Additional Wafer Feeder
170 displacement device
180 wafer
190 carrier
192 assembly media
260 Feeding device
262 Belt Drive
T Feed direction
272 Spindle drive
274 Spindle
276 rails
284 Lifting devices
286 Lifting elements
288 Lifting cylinder
382 chips
394a First area to be assembled
394b Second area to be assembled
433 Pneumatic Interface / Circular Groove
434a first marking
434b second marking
436a first optically detectable structure / hole
436b second optically detectable structure / hole
438 Temperature control unit
450 cameras

Claims (18)

An assembly machine for assembling a chip (382) without a housing to a carrier (190) for manufacturing an electronic component, each component including at least one chip disposed in a housing containing a cured potting compound, (100, 300, 400)
A chassis 112;
A supply device (140) mounted to the chassis (112) for providing a wafer (180) having a plurality of chips (382);
A displacement device 170 mounted on the chassis 112;
A surface positioning system having a fixed component and a movable component mounted to the chassis;
An assembly head mounted on the movable component for picking up a chip from the provided wafer and picking up the chip and placing the picked-up chip within the assembly area on a predefined assembly location on the carrier, (120); And
And a carrier receiving device (130) for receiving the carrier (190) to be assembled,
The carrier receiving device 130 is mechanically coupled to the displacement device 170,
The carrier receiving device 130 is displaceable parallel to a predetermined XY plane extending in the X and Y directions by the displacement device 170. The X direction is perpendicular to the Y direction,
The carrier receiving device 130 includes an integral support element 132 forming at least the top of the carrier receiving device 130 and the carrier 190 to be assembled can be placed on the integral support element 132 With assembly machine. The assembly machine of claim 1, wherein the integral support element (132) has a size greater than the assembly area (126) in the X direction. The assembly machine according to claim 2, wherein the carrier receiving device (130) is displaceable along the X direction at least by the displacement device (170). 4. The assembly machine according to any one of claims 1 to 3, wherein the assembly machine includes a lifting device (284) coupled to the chassis (112), the lifting device (284) Direction relative to the chassis (112), the Z-direction being oriented perpendicular to the XY-plane. 5. The assembly according to any one of the preceding claims, wherein the securing component is a fixed carrier rail (114) that allows the assembly head (120) to displace along the Y direction, Wherein the surface positioning system further comprises a carrier arm (116) displaceable on the carrier rail (114), wherein the displaceable carrier plate (118) along the carrier arm Is displaceable along the X direction. 6. The assembly machine according to any one of claims 1 to 5, further comprising a transfer device (260) for transferring the carrier (190) on the upper surface of the integral support element (132) along the X direction Including, assembling machine. 7. An assembly according to any one of the preceding claims, wherein the integral support element (132) comprises a pneumatic interface (433, 533) capable of applying a low pressure to the upper surface of the carrier (190) . 8. A method according to any one of claims 1 to 7, wherein said assembling machine further comprises a temperature control device (438), said temperature control device being thermally coupled to said integral support element (132) (132) at least at a substantially constant temperature. 9. A method according to any one of claims 1 to 8, characterized in that the integral support element (132) has a density of less than 10 x ^10-6 / K, preferably less than 5 x ^10-6 / K, ^{Having a} thermal expansion coefficient of less than 2 x 10 < ^-6 > / K. 10. A device according to any one of the preceding claims, characterized in that the integral support element (132) comprises at least two first marks (434a), the markings being optically detectable and in particular the integral support element ), Said space region being provided for receiving a carrier (190) to be assembled, said two first marks (434a) being disposed along said X direction. 11. Device according to any one of the preceding claims, characterized in that the integral support element (132) comprises at least two second marks (434b), the markings being optically detectable and in particular the integral support element ), Said space region being provided for receiving a carrier (190) to be assembled, said two second markings (434b) being disposed along said Y direction. 12. The assembly machine according to any one of claims 1 to 11, further comprising a camera (450) mounted to the assembly head (120)
Wherein the surface positioning system is calibrated by the camera (450) using information detected through the at least two markings (434a, 434b). The assembly machine according to any one of claims 1 to 12,
An additional supply device (141) for providing an additional wafer (180) comprising a plurality of chips (382); And
Further comprising an additional assembly head (121) for picking up the chip (382) from the additional wafer (180) provided and placing the picked chip (382) on a predetermined assembly position on the carrier (190) machine. A method for assembling a chip (382) having no housing to a carrier (190) with an assembling machine (100, 300, 500), in particular an assembling machine according to any one of claims 1 to 13,
Providing a wafer (180) having a plurality of chips (382) by a feeder (140);
Positioning and securing the carrier (190) on the upper surface of the integral support element (132) of the carrier receiving device (130);
Assembling the chip 382 in the first region 394a of the carrier 190 by the assembly head 120 of the surface positioning system;
Displacing the carrier receiving device 130 in parallel with a predetermined XY plane extending in the X and Y directions by the displacement device 170; And
Assembling the chip 382 into an additional region 394b of the carrier 190 by the assembly head 120 wherein the assembly of the first region 394a and the additional region 394b , The carrier (190) is held stationary on the upper surface of the integral support element (132). 15. The method of claim 14, wherein the chip is a chip (382) without a housing. 16. The method according to claim 14 or 15,
The integrated support element 132 includes at least two second marks 434b that can be optically detected by the camera 450 prior to displacement of the carrier receiving device 130 and the carrier acceptance The second marking 434b is disposed on the front surface of the carrier receiving device 130 along the Y direction,
The integrated support element 132 includes at least two additional second marks 434b which can be optically detected by the camera 450 after displacement of the camera 450 and the carrier receiving device And the two additional second marks 434b are disposed on the rear surface of the carrier receiving device 130 along the Y direction,
The method
Detecting the second markings 434b and / or the additional second marks 434b by the camera 450,
Further comprising calibrating the surface positioning system based on the spatial position of the second marking (434b) and / or the additional second marking (434b) detected by the camera (450). 17. The method of claim 16, further comprising continuing to assemble the chip (382) into the first region (394a) with the assembly head (120)
Assembly of the first region 394a is effected prior to calibration of the surface positioning system,
Continuing the assembly takes place after the calibration of the surface positioning system. 18. The method of claim 17,
Wherein assembling the additional region (394a) of the carrier (190) occurs after continuing to assemble the first region (394b).

Images