JP4932040B1 - Electronic component assembly method, electronic component assembly apparatus - Google Patents

Abstract

An electronic component is efficiently assembled using stud bumps while reducing the thermal influence during assembly.
A metal chip bump is formed on a substrate by a stud bump forming apparatus while the substrate is heated to a temperature higher than room temperature. After the formation of the stud bump, the substrate is kept in a state where the temperature is not lowered to room temperature. Thus, an electronic component piece was placed on the stud bump of the front plate and ultrasonically bonded.
[Selection] Figure 1

Description

  The present invention relates to an electronic component assembly technique used when an electronic component is assembled using a stud bump.

  Conventionally, when assembling electronic components, stud bumps have been widely used to ensure electrical connection. This stud bump is one method for forming a fine metal bump. For example, using a gold wire with a diameter of 25 microns, a gold ball is once formed by electric discharge heating, this gold ball is joined to an electrode part of an electronic component by ultrasonic assistance, and the gold wire is torn off, so that a diameter of about 90 microns is obtained. Gold stud bumps can be formed. If a metal wire with a smaller diameter is used, a smaller stud bump can be formed. Generally, this stud bump is formed on each electrode of a semiconductor chip (see Patent Document 1).

  When a semiconductor chip having stud bumps formed on electrodes is mounted on a mounting substrate, a so-called flip chip mounting apparatus is used. In this flip chip mounting apparatus, a semiconductor chip is handled, electrodes and stud bumps are directed downward, arranged at predetermined positions on the mounting board, and the mounting board and the semiconductor chip are joined (see Patent Document 2).

JP 2006-278454 A JP 2001-77593 A

  In the conventional electronic component assembly method, stud bumps are formed on the electrodes of the semiconductor chip, and then the semiconductor chip is mounted on the substrate while being handled. As a result, the stud bump on the semiconductor chip is in a normal temperature state (low temperature state). Since the stud bump has higher rigidity as the temperature becomes lower, there has been a problem that when the substrate and the semiconductor chip are joined using the stud bump, an impact is easily applied to the substrate and the semiconductor chip.

  On the other hand, if the stud bump of the semiconductor chip is heated and then mounted on the substrate, the stud bump is subject to multiple thermal cycles and the stud bump itself is deteriorated, or the semiconductor chip is also affected by heat. There was a problem.

  The present invention has been made in view of the above problems, and provides an electronic component assembling technique that makes it possible to efficiently assemble electronic components using stud bumps while reducing the thermal effect during assembly. The purpose is to do.

  The above-mentioned object is achieved by the following means based on the earnest research of the present inventors.

The present means for achieving the above object includes a stud bump forming step of forming a metal stud bump on the substrate by a stud bump forming device while heating the substrate at 80 degrees or more, and at least the stud after the formation of the stud bump. until the electronic component pieces on the bump is arranged to maintain a state of not temperature drop of the substrate to 60 degrees or less, the electronic component pieces arranged ultrasonic bonding on the stud bumps of the substrate by Chippubonda An electronic component assembling method comprising: an electronic component piece mounting step.

  The electronic component assembling method of the above means preferably has a substrate preheating step of preheating the substrate before the stud bump forming step.

  Preferably, the electronic component assembling method of the above means includes a substrate slow cooling step of dissipating the substrate at a slower temperature drop rate than the natural cooling after the electronic component piece mounting step. .

In the electronic component assembling method of the above means, the electronic component piece mounting step includes the step of forming the chip bonder from the stud bump forming device within a time range in which the substrate cannot be lowered to 60 degrees or less after the stud bump forming step. It is preferable that the method includes a substrate transporting step for transporting the substrate to the surface, and an ultrasonic bonding step for ultrasonically bonding the electronic component pieces while heating the substrate after transporting the substrate.

In the substrate transporting step in the electronic component piece mounting step of the electronic component assembling method of the above means, the substrate is transported from the stud bump forming device to the chip bonder with the temperature change of the substrate being suppressed within 20 degrees. It is preferable to be characterized by this.

In the substrate carrying step in the electronic component piece mounting step of the electronic component assembling method of the above means, the substrate is handled while controlling the temperature of the holding portion for holding the substrate in the substrate carrying device, and the stud bump forming device It is preferable that the substrate is transported from the chip bonder to the chip bonder.

The present means for achieving the above object includes a heating plate for heating the substrate to 80 degrees or more, a stud bump forming device for forming a metal stud bump on the heated substrate, and at least the formation of the stud bump since the formation of the stud bump. Until the electronic component piece is arranged on the stud bump, the temperature of the substrate is not lowered to 60 degrees or less , and the electronic component piece is arranged on the stud bump of the substrate to perform ultrasonic bonding. An electronic component assembling apparatus comprising a chip bonder.

  The electronic component assembling apparatus of the above means preferably has a substrate preheating device for heating the substrate in advance and then carrying it into the stud bump forming device.

  The electronic component assembling apparatus of the above means is characterized in that it has a substrate slow cooling device that dissipates the substrate at a gradual temperature drop rate compared with natural cooling, as the substrate carried out from the chip bonder. preferable.

In the electronic component assembling apparatus of the above means, the chip bonder includes a substrate transfer device that transfers the substrate from the stud bump forming device to the chip bonder without lowering the substrate to 60 degrees or less, and a bonder that heats the substrate. It is preferable to have a side heating plate.

  In the electronic component assembling apparatus of the above means, it is preferable that the substrate transport device has a temperature control device that controls the temperature of a holding unit that holds the substrate.

  In the electronic component assembly apparatus according to the above means, a plurality of the chip bonders are provided in a circumferential direction of the turret, a turret supported rotatably around a central axis, a turret drive motor connected to the output shaft. A component holding unit that holds the electronic component piece and welds the electronic component piece to the mating member, and is provided between the turret and the component holding unit, and the component holding unit is attached to the turret. A component holding unit guide device that guides the component holding unit in a vertically movable manner, and a component holding unit driving device that is provided above the component holding unit and moves the component holding unit downward by pressing the component holding unit. The component holding unit is provided with a suction nozzle for sucking the electronic component piece And ultrasonic horn, said a horn support member for supporting the ultrasonic horn ultrasonic oscillatably, a case for slidably supporting said horn support member in the vertical direction, it is preferably characterized in that it comprises.

  In the electronic component assembling apparatus of the above means, the component holding unit driving device of the chip bonder includes a first pressing device and a second pressing device, and the first pressing device moves the entire component holding unit to the turret. It is preferable that the second pressing device presses the suction nozzle relatively downward with respect to the case of the component holding unit.

  In the electronic component assembling apparatus of the above means, the component holding unit driving device of the chip bonder is provided in a state independent of the turret, and at least on the position where the electronic component piece is supplied from the electronic component piece supply device, and It is preferable that the electronic component piece is fixedly disposed on a position where the electronic component piece is welded to the counterpart member.

  In the electronic component assembling apparatus according to the above means, it is preferable that the chip bonder includes a horn rotating device for rotating the ultrasonic horn.

  In the electronic component assembling apparatus of the above means, the component holding unit of the chip bonder includes a horn urging device that urges the horn support member upward, and a horn position detection device that detects a vertical position of the horn support member. It is preferable to include these.

  In the electronic component assembling apparatus of the above means, the horn biasing device in the component holding unit of the chip bonder includes a horn side magnet fixedly arranged on the horn support member side, and the horn side magnet facing the case. A case-side magnet fixedly disposed on the side, and the horn-side magnet and the case-side magnet are attracted or repelled to each other to urge the horn support member upward. Is preferred.

  In the electronic component assembling apparatus of the above means, it is preferable that the ultrasonic horn of the chip bonder is provided so that the vibration direction of the ultrasonic horn is the radial direction of the turret.

  In the electronic component assembling apparatus of the above means, the component holding unit driving device of the chip bonder is disposed in a state offset in the radial direction of the turret with respect to the component holding unit. Is preferred.

  According to the present invention, it is possible to achieve an excellent effect that it is possible to efficiently assemble an electronic component using a stud bump while reducing the thermal influence during assembly.

It is a top view which shows the whole structure of the electronic component assembly apparatus which concerns on embodiment of this invention. It is a side view which shows the stud bump formation apparatus of the electronic component assembly apparatus. It is an enlarged view which shows the stud bump formation process by the same stud bump formation apparatus. It is a front view which shows the whole structure of the chip bonder of the same electronic component assembly apparatus. It is a side view which shows the whole structure of the same chip bonder. It is the figure which shows the open state of (a) top view and (b) turret of the chip bonder. (A) (b) It is sectional drawing which looked at the component holding unit of the chip bonder from the side, and the side view of a component holding unit drive device and a component holding unit guide device. (A) It is a side view of an ultrasonic horn, (b) It is a bottom view of an ultrasonic horn, (c) It is a bottom view which shows the vibration state of an ultrasonic horn. (A) is a top view of the horn rotation device of the chip bonder seen from the direction of arrow I in FIG. 6 (a), (b) is a right side view of the horn rotation device, and (c) is a view of FIG. It is the front view of the horn rotation apparatus seen from the arrow II-II direction in a). It is a figure which shows the state which moves the slider for horn rotation with the piezoelectric element of the slider moving apparatus of the same chip bonder. It is a figure which shows the position detection method of the horn holding member using the magnet in the component holding unit of the chip bonder. (A)-(d) is a top view of the electronic component piece supply apparatus and board | substrate supply apparatus of the chip bonder. It is a graph which shows the temperature cycle of the wafer board | substrate by the same electronic component assembly apparatus.

  Embodiments of the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 shows an overall configuration of an electronic component assembling apparatus 900 according to an embodiment of the present invention. The electronic component assembling apparatus 900 includes a chip bonder 100, a stud bump forming apparatus 200, a substrate preheating device 300, a substrate slow cooling device 400, a substrate transporting device 500, and a substrate cassette 600. The substrate cassette 600 accommodates a plurality of wafer substrates 610 on which electronic component pieces are mounted.

  The substrate transfer device 500 takes out the wafer substrate 610 from the substrate cassette 600 and transfers it between the chip bonder 100, the stud bump forming device 200, the substrate preheating device 300, and the substrate slow cooling device 400 in the order of the arrows in the drawing. Specifically, the substrate transfer apparatus 500 is a wafer transfer robot, and a holder 520 is mounted on the tip of an arm 510 that expands and contracts in multiple stages. The substrate transport apparatus 500 can transport the wafer substrate 610 to a target location by clamping the wafer substrate 610 with the holder 520 and freely extending and contracting and rotating the arm 510. The holder 520 incorporates a temperature control heater (temperature control device), and the temperature is controlled so that the temperature of the holder 520 approximates the temperature of the wafer substrate 610 at the time of clamping. In the present embodiment, the structure in which all the wafer substrates 610 are transferred by one substrate transfer device 500 is shown. However, the present invention is not limited to this, and a plurality of substrate transfer devices may be used. good.

  The substrate preheating apparatus 300 includes a preheating heating plate 310. The preheating heating plate 310 heats the wafer substrate 610 placed thereon, for example, within a range of 80 degrees to 200 degrees, and preferably within a range of 90 degrees to 180 degrees. The wafer substrate 610 preheated by the substrate preheating device 300 is transferred to the stud bump forming device 200 by the substrate transfer device 500.

  In the stud bump forming apparatus 200, as shown in an enlarged view in FIG. 2, a capillary 210, a head 220, an ultrasonic horn 230, a Z-axis table 240, an XY table 250, a wire clamper 260, and a gold wire 270 are wound. A bobbin 280, a heating plate 290, a discharge electrode 295, and the like are provided.

  The capillary 210 has a hollow needle structure with an opening extending vertically, and a gold wire 270 is inserted therethrough. The capillary 210 is held at the tip of the ultrasonic horn 230, and the capillary 210 vibrates ultrasonically. The ultrasonic horn 230 is fixed to the head 220 that moves in the vertical direction by the Z-axis table 240. Note that an ultrasonic vibrator (not shown) is built in the head 220, and this ultrasonic vibrator applies ultrasonic vibration to the ultrasonic horn 230. The wire clamper 260 is disposed above the capillary 210 and clamps the gold wire 270 to generate a predetermined tension on the gold wire 270. The bobbin 280 is disposed above the wire clamper 260 and has a structure for feeding out the gold wire 270. The discharge electrode 295 is arranged so that the tip thereof is close to the capillary 210. When a high voltage power source is applied between the discharge electrode 295 and the capillary 210, a discharge occurs between them, and the heat causes the gold wire 270 at the lower end of the capillary 210 to melt and form a ball.

  A heating plate 290 is mounted on the XY table 250, and a wafer substrate 610 is placed on the heating plate 290. Accordingly, the wafer substrate 610 is maintained at a target temperature within a range of 80 degrees to 200 degrees by the heating plate 290.

  As shown in FIG. 3A, the stud bump forming apparatus 200 forms the gold ball 270A by melting the gold wire 270 at the lower end of the capillary 210, and then forms the capillary 210 as shown in FIG. The gold ball 270A is pressed against the wafer substrate 610 by being lowered. At this time, the capillary 210 is ultrasonically vibrated, so that the gold ball 270A and the wafer substrate 610 are ultrasonically bonded. Further, as shown in FIG. 3C, the gold wire 270 is clamped by the wire clamper 260, and the wire clamper 260 is pulled upward, whereby the gold ball 270A and the gold wire 270 are torn off, and the gold stud bump 270B. Is formed. By this procedure, the stud bump forming apparatus 200 sequentially forms a large number of stud bumps 270B over the entire area while moving the wafer substrate 610 on the XY table 250. During this time, the wafer substrate 610 is maintained at a temperature higher than the normal temperature by the heating plate 290.

  The wafer substrate 610 on which the formation of the stud bumps 270B has been completed is transferred to the chip bonder 100 by the substrate transfer device 500. This transfer time is set to be short within 20 seconds, and the temperature of the wafer substrate 610 during transfer is hardly reduced, and the temperature drop can be kept within 20 degrees. As a result, it is possible to avoid the wafer substrate 610 from reaching room temperature or below 60 degrees.

  4 and 5A, the chip bonder 100 includes a turret 10, a turret drive motor 20, a component holding unit 30, a horn rotating device 40, a component holding unit guide device 50, and a component holding. The unit drive device 80 is configured to include a drive device base 90 on which the component holding unit drive device 80 and the turret drive motor 20 are arranged, and a leg portion 95 on which the drive device base 90 is held. Here, a position where the electronic component piece 98 is sucked by the suction nozzle 33 of the component holding unit 30 is called a supply position U, and a position where the sucked electronic component piece 98 is welded to the wafer substrate 610 is called a welding position W. I will decide.

  The electronic component piece 98 placed on the tray 96 is moved in the XY direction by the electronic component piece supply device 89 constituted by an XY table and supplied to the supply position U. The electronic component piece 98 is positioned at the supply position U based on the image data of the electronic component piece 98 photographed by the supply position confirmation camera 92 disposed above, by the main control unit (not shown). This is done by moving 89 in the XY direction.

  The welding position W is located on the substantially opposite side to the electronic component piece supply device 89 (a place having a phase difference of 180 degrees along the rotational movement path of the turret 10) across the main axis of the chip bonder 100. There are provided a heating plate 97 on which the wafer substrate 610 is placed, and a substrate supply device 88 for moving the heating plate 97 in the XY direction. The substrate supply device 88 positions the wafer substrate 610 placed on the heating plate 97. This positioning is performed by the main controller (not shown) moving the substrate supply device 88 in the XY directions based on the image data of the wafer substrate 610 photographed by the welding position confirmation camera 94 disposed above. Is called.

  In the middle of the supply position U and the welding position W on the rotational movement path of the component holding unit 30 (here, a place having a phase difference of 90 degrees from the supply position U), a suction position for photographing the component holding unit 30 from below. A confirmation camera 93 is provided. The suction position confirmation camera 93 photographs the angle of the electronic component piece 98 sucked and held by the suction nozzle 33 and transmits the shot image data to the main control unit. Then, based on the image data, the main control unit operates the horn rotation device 40 to control the rotation of the suction nozzle 33 so that the electronic component piece 98 has a predetermined angle. A position where the suction state (angle) of the electronic component piece 98 sucked and held by the suction nozzle 33 is confirmed is referred to as a suction state confirmation position V here.

  A cleaning device 98 is provided in the middle of the welding position W and the supply position U on the rotational movement path of the component holding unit 30 (here, a place having a phase difference of 90 degrees from the welding position W). The cleaning device 98 automatically cleans the tip when the tip of the suction nozzle 33 comes into contact therewith. Therefore, while the component holding unit 30 is performing the supply operation or the welding operation at the welding position W or the supply position U, it is possible to perform maintenance by cleaning the suction nozzles 33 of the other component holding units 30. Become. A position where the suction nozzle 33 is cleaned by the cleaning device 98 is referred to herein as a cleaning position T.

  As described above, the chip bonder 100 conveys the suction nozzle 33 provided in the component holding unit 30 in the order of the supply position U, the suction state confirmation position V, the welding position W, and the cleaning position T by rotating the turret 10. Can be done.

  The turret 10 is a disk-shaped member having a disk shape or a polygonal shape such as a pentagon or a hexagon. The turret 10 is rotatably supported by the turret drive motor 20 in a coaxial state with its own central axis as a rotation axis. As a result, the turret 10 rotates in conjunction with the rotation of the turret drive motor 20. The turret 10 is not limited to the shape described above. For example, the turret 10 is a star or starfish having a plurality of convex portions (arms) formed so as to protrude radially outward from the outer peripheral surface of the cylinder. Even a mold or the like is preferable.

  The turret drive motor 20 uses a DD motor (direct drive motor), and positions the turret 10 in the rotational direction with high angular accuracy.

  As shown in FIG. 5B (a), the turret drive motor 20 is fixed to the upper drive device base 90. The drive device base 90 is swingably held by a leg portion 95. Accordingly, when maintaining the turret 10, as shown in FIG. 5B (b), the entire turret 10 is opened upward by swinging the drive device base 90 upward with respect to the leg portion 95. .

  A plurality of (four in this case) component holding units 30 are provided at equal intervals in the circumferential direction of the turret 10, and an ultrasonic horn 32 having a suction nozzle 33 is provided on the lower side. The component holding unit 30 is arranged on the outer periphery of the turret 10 so as to protrude radially outward. In this way, the space S is secured between the circumferential directions of the plurality of component holding units 30. As a result, the supply position confirmation camera 92 arranged above the supply position U takes an image of the electronic component piece supply device 89 from above through the space S at the timing when the component holding unit 30 does not exist. The piece 98 is positioned. Similarly, the welding position confirmation camera 94 disposed above the welding position W captures the wafer substrate 610 through the space S at the timing when the component holding unit 30 does not exist, and is formed on the wafer substrate 610. The detected stud bump 270B and the like are detected, and the electronic component piece 98 is welded to the correct position.

  In the case where the component holding unit 30 is arranged on the inner side in the radial direction of the turret 10, a similar space S may be secured by forming an opening in the turret 10. That is, the turret 10 may be cut out to secure the space S.

  The component holding unit 30 sucks and holds the electronic component piece 98 with the suction nozzle 33 or ultrasonically welds the ultrasonic component horn 32 to the wafer substrate 610 by ultrasonic vibration of the ultrasonic horn 32 (ultrasonic bonding). To do. The suction nozzle 33 has a suction path 33A formed therein, and is connected to a vacuum pump (not shown). The vacuum pump generates a negative pressure at the tip of the suction nozzle 33 via the suction path 33A. Thereby, the suction nozzle 33 sucks the electronic component piece 33A.

  As shown in FIG. 6, the component holding unit 30 includes a case 31, an ultrasonic horn 32, a horn support member 34, a horn urging device 36, and a horn position detection device 38. The ultrasonic horn 32 is supplied with an electric signal having a frequency of, for example, 60 kHz band by an ultrasonic oscillator (not shown), and converts it into mechanical vibration energy.

  A housing portion 31 </ b> A inside the case 31 houses a shaft portion 34 </ b> C of a horn support member 34, a horn urging device 36, and a horn position detection device 38 which will be described later. Furthermore, a sliding passage 31B is formed in the case 31, and the shaft portion 34C of the horn support member 34 is slidably inserted. The housing space 31A and the sliding passage 31B are formed in communication with each other, and the sliding passage 31 is provided with a support member 35 that supports the shaft portion 34C to be slidable in the vertical direction and to be rotatable about the shaft. ing. In this embodiment, a ball bearing is used as the support member 35. The support members 35 are provided at two locations on the sliding passage 31B. As a result, the horn support member 34 can move with respect to the case 31 both in the vertical direction and in the rotational direction. A case-side magnet fixing portion 31D for fixing the case-side magnet 36B to the case 31 is provided below the accommodation space 31A.

  As shown in FIGS. 7A and 7B, the horn body 32X of the ultrasonic horn 32 has a substantially rectangular parallelepiped shape as viewed from the direction of arrow I (vertical direction) in FIG. The neighborhood is in a tight shape. The ultrasonic horn 32 has a suction nozzle 33 projecting downward from the end surface at the approximate center of the constricted portion. The horn body 32X is formed with thin plate-like connecting portions 32B at four locations in the longitudinal direction and the width direction, and further, a fixing portion 32A is formed on the connecting portion 32B. The fixing portion 32A is fixed to the horn mounting portion 34A of the horn support member 34. Therefore, the ultrasonic horn 32 is connected to the horn mounting portion 34A of the horn support member 34 only by the fixing portion 32A, and is not in contact with other portions. In particular, the horn main body 32X is held by a thin plate-like connecting portion 32B at a portion that becomes a node in ultrasonic vibration, so that there is almost no vibration attenuation by the connecting portion 32B, and an ultrasonic wave based on an input electric signal is superposed. Sound wave vibration can be reliably performed. For example, when an electrical signal having a predetermined frequency is input from the ultrasonic oscillator to the ultrasonic horn 32, the horn main body 32X is shown in FIG. 7C due to elastic deformation of the connecting portion 32B. Vibrates continuously in the left-right direction (arrow B, C direction) and in the plane perpendicular to the suction direction. In addition, the position where the connection part 32B in the horn main-body part 32X is formed is set to the point where the vibration (amplitude) is the smallest in the vibration mode.

  In the present embodiment, the ultrasonic horn 32 has a constricted shape near the suction nozzle 33, and is further arranged to vibrate ultrasonically in a direction perpendicular to the circumferential direction of the turret 10. That is, the ultrasonic horn 32 is arranged so that the longitudinal direction thereof faces the radial direction of the turret 10. As a result, a marginal space is formed before and after the circumferential direction of the turret 10 in the suction nozzle 33, so that, for example, more component holding units 30 can be arranged along the circumferential direction of the turret 10. Further, as already described, when the supply position confirmation camera 92 and the welding position confirmation camera 94 arranged above the turret 10 take an image, the ultrasonic horn 32 extends in the radial direction so that it does not become an obstacle. . That is, while the ultrasonic horn 32 (component holding unit 30) that moves in the circumferential direction by the supply position confirmation camera 92, the welding position confirmation camera 94, and the turret 10 does not exist, the electronic component pieces 98 on the tray 96 The image of the wafer substrate 610 is recognized.

  Returning to FIG. 6, the horn support member 34 includes the above-described shaft portion 34 </ b> C and a horn attachment portion 34 </ b> A that is continuously formed at the lower end of the shaft portion 34 </ b> C. The horn mounting portion 34A extends in the radial direction with respect to the shaft portion 34C. In addition, an extension plate 34 </ b> D extending toward the radially inner side of the turret 10 is provided on the upper end side (second pressing device 70 side) of the horn support member 34. The upper surface of the expansion plate 34 </ b> D serves as a pressure receiving portion 34 </ b> B that is pressed by the second pressing device 70. Thus, by arranging the extension plate 34 </ b> D extending in the radial direction, the component holding unit driving device 80 can be arranged offset in the radial direction. A horn side magnet fixing portion 34D is provided below the pressure receiving portion 34B (expansion plate 34D), and the horn side magnet 36A of the horn biasing device 36 is fixed. On the outer surface of the horn attachment portion 34A, a substantially L-shaped engagement portion 34E that engages with the horn rotation device 40 is provided.

  The horn urging device 36 includes a horn side magnet 36A and a case side magnet 36B disposed below the horn side magnet 36A. The horn side magnet 36 </ b> A is formed in an annular shape, is inserted into the shaft portion 34 </ b> C of the horn support member 34, and is fixed to a protrusion formed in the middle of the horn support member 34. This protrusion becomes a horn side magnet fixing portion. The case-side magnet 36B is formed in an annular shape and is inserted in a state having play with respect to the shaft portion 34C of the horn support member 34, and at the case-side magnet fixing portion 31C formed in the housing space 31A of the case 31. It is fixed. The horn side magnet 36A and the case side magnet 36B are arranged so that the same magnetic poles face each other (for example, the S pole and the S pole or the N pole and the N pole face each other). The horn side magnet 36A and the case side magnet 36B repel each other. Due to this repulsive force, the horn support member 34 is biased upward with respect to the case 31 and magnetically levitated.

  The horn position detection device 38 detects a magnetic field change of the horn side magnet 36A or the case side magnet 36B and converts it into an electric signal. In the present embodiment, a hall element is used as the horn position detection device 38. In FIG. 6, the horn position detection device 38 is provided on the side wall of the housing space 31A of the case 31 so as to be close to the horn side magnet 36A. As shown in FIG. 10A, in the horn side magnet 36A, the S pole and the N pole are vertically polarized, and the magnetic field B acts on the horn position detector 38 side. The horn position detector 38 detects a change in the intensity of the magnetic field X in the horizontal direction. As shown in FIG. 10B, when the horn side magnet 36A is raised, the strength of the magnetic field B acting on the horn position detecting device 38 changes, so that the change in position can be detected very quickly. In this way, the horn position detection device 38 detects a magnetic field fluctuation based on a change in the distance from the horn side magnet 36A, and converts the change into an electrical signal. The horn position detection device 38 transmits an electrical signal to a main control unit (not shown). Based on the electrical signal received from the horn position detector 38, the main control unit can detect the vertical fluctuation of the horn support member 34 with respect to the case 31. As a result, at the time of welding, the entire component holding unit 30 is lowered, and the moment when the electronic component piece 98 contacts the wafer substrate 610 can be detected very accurately.

  The horn rotation device 40 will be described with reference to FIG. FIG. 8A is a plan view of the horn rotation device 40 as viewed from the direction of arrow I in FIG. 6, and FIG. 8B is a right side view of the horn rotation device 40. FIG. These are the front views of the horn rotation apparatus 40 seen from the arrow II-II direction in Fig.8 (a).

  The horn rotation device 40 slides the horn rotation slider 42 engaged with the engagement portion 34E of the horn support member 34 to the left and right (in the direction of arrow D or E in FIG. 8A), thereby moving the horn support member 34. Rotate. As a result, the suction nozzle 33 is rotated in the plane perpendicular to the suction direction (in the direction of arrow F or G in FIG. 8A). The horn rotation device 40 sucks the horn rotation slider 42 in conjunction with the horn rotation slider 42, the slider support device 44 that slidably supports the horn rotation slider 42 from one side, and the slider support device 44. A slider moving device 46 that slides in a plane perpendicular to the direction and a slider position detecting device 48 that detects the sliding amount of the horn rotating slider 42 are configured.

  The horn rotation slider 42 is a substantially C-ring shaped plate member. The horn rotation slider 42 has a support surface 42A and a driven surface 42B. The support surface 42 </ b> A is a part that contacts the bearing 44 </ b> A in the slider support device 44.

  The driven surface 42 </ b> B of the horn rotation slider 42 abuts on a convex portion 47 </ b> A formed on the piezoelectric element 47 of the slider moving device 46. Accordingly, the horn rotation slider 42 is sandwiched between the bearing 44A and the convex portion 47A. The convex portion 47A of the piezoelectric element 47 slides the driven surface 42B of the horn rotation slider 42 by the frictional resistance therebetween.

  The slider support device 44 includes a bearing 44A such as a ball bearing, a leaf spring 44B, a presser screw 44C, a leaf spring fixing base 44D, a shaft base 44E, a holding shaft 44F, and a base 41. .

  The pedestal 41 is configured in a rectangular tube shape, and the piezoelectric element 47 of the slider moving device 46 is accommodated therein. The pedestal 41 is provided with two shafts 44E and 44E. The shafts 44E and 44E have a structure in which a holding shaft 44F is held in a detachable state. A bearing 44A is provided on the holding shaft 44F.

  The leaf spring fixing base 44 </ b> D is provided substantially at the center of the base 41. The leaf spring 44B is fixed to the leaf spring fixing base 44D by two holding screws 44C and 44C. The holding shaft 44F is pressed against the shaft base 44E by the elastic force of the leaf spring 44B.

  Specifically, the holding shaft 44F is provided so as to be movable in the vertical direction in FIG. 8C with respect to the shaft base 44E. The bearing 44A is urged toward the horn rotation slider 42 by pressing the holding shaft 44F toward the shaft 44E with the leaf spring 44B. As a result, the horn rotation slider 42 is sandwiched between the convex portion 47A of the slider moving device 46 and the bearing 44A. As a result, as long as the convex portion 47A does not move, the horn rotation slider 42 cannot slide. The leaf spring 44B, the holding screw 44C, and the leaf spring fixing base 44D constitute a so-called pressing device.

  The slider moving device 46 includes a piezoelectric element 47 supported on the pedestal 41 side so as to vibrate. Specifically, the piezoelectric element 47 includes a pair of piezoelectric element pieces 47B, and applies periodic voltages that are 90 degrees out of phase with each other.

  The piezoelectric element 47 is provided with a convex portion 47A that protrudes toward the horn rotation slider 42. When a voltage having a phase difference of 90 degrees is applied to the two piezoelectric element pieces 47B described above, as shown in FIG. 9, the convex portion 47A rotates at high speed along an elliptical orbit. This direction of rotation can be reversed as appropriate. If the elliptical orbit of the convex portion 47A is used, the horn rotation slider 42 can be moved in both the left and right directions in FIG.

  As a result, by continuously inputting periodically changing positive voltage or negative voltage to the piezoelectric element 47, the suction nozzle 33 can be rotated by a predetermined angle by sliding the horn rotation slider 42. .

  As shown in FIG. 8, the horn rotation device 40 includes a slider position detection device 48 that includes a magnet 48A and a Hall element 48B. The magnet 48A is provided on the horn rotation slider 42 side, and the Hall element 48B is provided on the pedestal 41 side. The magnet 48A and the hall element 48B are opposed to each other. When the horn rotation slider 42 moves in the left-right direction, the distance between the magnet 48A and the hall element 48B changes and the magnetic field around the hall element 48B also changes. The Hall element 48B detects this magnetic field fluctuation, converts it into an electrical signal, and transmits it to a main control unit (not shown). The main control unit detects the slide position of the horn rotation slider 42 based on the electrical signal received from the Hall element 48B. The main control unit controls the horn rotation slider 42 to move in the left-right direction based on the detected position information. A power source, a circuit, and the like for operating the Hall element 49B and the piezoelectric element 47 are housed in a substrate box 49 fixed to the pedestal 41.

  Returning to FIG. 6, the component holding unit guide device 50 is provided between the turret 10 and the component holding unit 30. The component holding unit guide device 50 includes a rail 52 arranged in the vertical direction on the outer periphery of the turret 10, a slide main body 54 slidably engaged with the rail 52, and a table 56 fixed to the slide main body 54. And a linear motion device having a component holding unit upper biasing device 58 that constantly biases the table 56 upward.

  The table 56 is an L-shaped plate member, and the case 31 of the component holding unit 30 is fixed to one surface of the L-shape, and the pressure receiving portion 56A that is pushed down by the first pressing device 60 on the other surface. Is formed. Therefore, when the pressing member 68 of the first pressing device 60 pushes down the pressure receiving portion 56 </ b> A of the table 56, the entire component holding unit 30 is guided downward together with the table 56.

  The component holding unit upward biasing device 58 is a device that constantly biases the table 56 upward with respect to the turret 10. Specifically, the component holding unit upper biasing device 58 includes an outer cylinder 58A fixed to the upper surface of the turret 10, a compression spring 58C disposed between the turret 10 and the table 56, and a shaft that holds the compression spring 58C. It has a member 58B. The upper end of the shaft member 58B is fixed to the table 56 side, and the lower end is slidably inserted into the outer cylinder 58A. The compression spring 58 </ b> C is in contact with the turret 10 at one end and is in contact with the table 56 at the other end, and is disposed in a compressed state. Therefore, the compression spring 58C biases the table 56 upward. As a result, the component holding unit 30 is always stationary at the upper side unless an external force from the component holding unit driving device 80 is applied.

  The component holding unit driving device 80 includes a first pressing device 60 and a second pressing device 70. The component holding unit driving device 80 is mounted on the driving device base 90. The component holding unit driving device 80 is disposed in the radially offset state above the suction position U and the welding position W, respectively. In the present embodiment, the component holding unit driving device 80 is offset inward in the radial direction, so that a space directly above the component holding unit 30 is opened. As a result, for example, the component holding unit driving device 80 can be prevented from interfering with the imaging direction of the supply position confirmation camera 92.

  The first pressing device 60 includes a motor 62, a cam 64, a second pressing device guide mechanism 66, and a pressing member 68.

  The second push-down device guide mechanism 66 is a linear motion device that includes a rail 66A, a slide body 66B, a table 66C, and a cam receiving member 66D. The rail 66A is provided on the rail mounting portion 90A of the drive device base 90 in the vertical direction. The slide body 66B is slidably engaged with the rail 66A. A table 66C is fixed to the slide body 66B. Further, a second pressing device 70, a cam receiving member 66D, and a pressing member 68 are fixed to the table 66C.

  The cam 64 is a flat cam fixed to the output shaft 62A of the motor 62. The cam 64 abuts on the cam receiving member 66D at an arbitrary position of one rotation and pushes down the cam receiving member 66D. Accordingly, the first push-down device 60 pushes down the table 66C by pushing down the cam receiving member 66D.

  The pressing member 68 is a bar-like member provided so as to protrude below the table 66C. The pressing member 68 pushes down the pressure receiving portion 56 </ b> A formed on the table 56 of the component holding unit guide device 50. Therefore, the pressing member 68 can push down the entire component holding unit 30 together with the table 56.

  The second pressing device 70 includes a base 76 fixed to the table 66 </ b> C of the first pressing device 60 and a voice coil motor 74 fixed to the base 76. The voice coil motor 74 can move the output shaft 72 provided on the tip side with a preset pressure (biasing force) according to the input voltage. The output shaft 72 of the voice coil motor 74 is disposed on the pressure receiving portion 34 </ b> B of the horn support member 34 provided in the component holding unit 30. Therefore, the voice coil motor 74 can press the expansion plate 34 </ b> D (pressure receiving portion 34 </ b> B) of the horn support member 34 with an arbitrary force by lowering the output shaft 72. As already described, the expansion plate 34D is expanded radially inward, and as a result, the voice coil motor 74 can be offset and disposed radially inward.

  As shown in FIG. 6A, the component holding unit driving device 80 pushes down the entire component holding unit 30 by the first pressing device 60. Then, at the moment when the electronic component piece 98 comes into contact with the wafer substrate 610, the horn holding member 34 moves upward relative to the case 31. When the horn holding member 34 moves relatively upward with respect to the case 31, the horn position detection device 38 detects the movement very quickly and transmits an electric signal to the main control unit (not shown), and the first pressing device. 60 is stopped. In this embodiment, since the horn holding member 34 is magnetically levitated by the magnetic force (repulsive force of the horn side magnet 36A and the case side magnet 36B), an extremely small external force is applied to the horn holding member 34. Even in the case, the relative movement with respect to the case 31 can be performed quickly. Therefore, the impact on the wafer substrate 610 and the stud bump 270B can be mitigated by the magnetic levitation by the magnet and the position detection using the magnet, while making the magnet compact.

  After the relative movement of the horn holding member 34 is detected by the horn position detection device 38, the output shaft 72 of the voice coil motor 74 of the second pressing device 70 is lowered. A predetermined pressing force is applied to the pressure receiving portion 34 </ b> B of the horn support member 34 by the output shaft 72 of the voice coil motor 74. As this pressing force, for example, the force is linearly increased starting from 0 at first, and finally applied to 4 Newton [N]. Accordingly, a predetermined pressing force is applied to the suction nozzle 33 fixed to the horn support member 34, and the electronic component piece 98 can be pressed against the stud bump 270B with a predetermined pressure. In conjunction with the increase in the pressing force, the amplitude of the ultrasonic vibration is also increased linearly from 0, so that the electronic component piece 98 and the stud bump 270B are stably welded. The pressing force of the horn support member 34 by the voice coil motor 74 can be arbitrarily set by the voltage input to the voice coil motor 74.

  <Welding operation>

  Next, the operation of the mounting process of the electronic component piece 98 by the chip bonder 100 will be described with reference to FIG. FIG. 11 illustrates a case where the chip bonder 100 includes six component holding units 30.

  In FIG. 11A, the component holding unit at the supply position U is defined as a component holding unit 30A, and the component holding units 30B to 30F are defined clockwise based on this. A position advanced by 60 degrees relative to the supply position U is an adsorption state confirmation position V, and a position advanced further by 120 degrees is a welding position W. The position further advanced by 60 degrees is the cleaning position T.

  First, the electronic component piece supply device 89 moves the electronic component piece 98 to a predetermined supply position U. At this time, the main control unit (not shown) images the position of the electronic component piece 98 supplied by the electronic component piece supply device 89 by the supply position confirmation camera 92, and based on the taken image data, the electronic component piece. It is determined whether 98 is supplied to a predetermined position. When determining that the electronic component piece 98 is displaced from the predetermined supply position U, the main control unit controls the electronic component piece supply device 89 to move the electronic component piece 98 to the predetermined supply position U. Note that the imaging of the electronic component piece 98 by the supply position confirmation camera 92 is executed at a timing when the component holding units 30B to 30F do not exist above.

  As shown in FIG. 11A, the chip bonder 100 sucks and holds the electronic component piece 98 supplied to the supply position U by the suction nozzle 33 of the component holding unit 30A. After the suction holding is completed, the turret 10 is further rotated by 60 degrees to transport the electronic component piece 98 of the component holding unit 30A to the suction state confirmation position V (see FIG. 11B). Then, the main control unit photographs the suction angle of the electronic component piece 98 conveyed to the suction state confirmation position V from below with the suction position confirmation camera 93. The main control unit determines whether or not the electronic component piece 98 is deviated from a predetermined angle based on the captured image data. When the main control unit (not shown) determines that the holding angle of the electronic component piece 98 is deviated from a predetermined angle, the main control unit (not shown) drives the horn rotating device 40 and rotates the suction nozzle 33 to rotate the angle of the electronic component piece 98. Adjust.

  At this time, the chip bonder 100 sucks and holds the next electronic component piece 98 supplied to the supply position U by the electronic component piece supply device 89 by the suction nozzle 33 of the component holding unit 30B.

  The chip bonder 100 further rotates the turret 10 by 120 degrees, and the electronic component piece 98 sucked and held by the suction nozzle 33 of the component holding unit 30 </ b> A is supplied to the welding position W by the substrate supply device 88. It is transported upward (see FIG. 11C). The main control unit photographs the position of the stud bump 270B of the wafer substrate 610 supplied by the substrate supply device 88 by the welding position confirmation camera 94, and the stud bump 270B is set to the predetermined welding position W based on the photographed image data. It is determined whether or not it is arranged in the area. When the main control unit determines that the stud bump 270 </ b> B is deviated from the predetermined welding position W, the main control unit controls the substrate supply device 88 to move the wafer substrate 610. Note that imaging of the stud bump 270B by the welding position confirmation camera 94 is executed at a timing when the component holding units 30B to 30F do not exist above. In this state, the electronic component piece 98 of the component holding unit 30A and the stud bump 270B are ultrasonically bonded.

  At this time, as described above, the main control unit photographs the electronic component piece 98 of the component holding unit 30C with the suction position confirmation camera 93 at the suction state confirmation position V, whereby the angle of the electronic component piece 98 is obtained. Inspect and adjust. In the component holding unit 30 </ b> D, the electronic component piece 98 supplied to the supply position U by the electronic component piece supply device 89 is sucked.

  After that, as shown in FIG. 11D, the chip bonder 100 further rotates the turret 10 by 60 degrees, and conveys the component holding unit 30A after the ultrasonic welding operation to the cleaning position T. At the cleaning position T, the tip of the suction nozzle 33 is cleaned by polishing or the like as necessary. Since the tip of the suction nozzle 33 tends to be biased and worn by ultrasonic welding, smoothness deteriorates when a predetermined number of welding operations are performed. Therefore, by periodically cleaning in this way, the tip is always kept horizontal. This cleaning operation may be performed every time, but is preferably performed at a preset cycle. Even while the suction nozzle 33 of the component holding unit 30A is being cleaned, the component holding unit 30B can ultrasonically weld the electronic component piece 98 to the wafer substrate 610 at the welding position W.

  Thereafter, the chip bonder 100 repeatedly performs the same operation as described above for the component holding units 30 </ b> B to 30 </ b> F, and performs ultrasonic welding of the electronic component piece 98 to the wafer substrate 610.

  In the chip bonder 100, after the electronic component pieces 98 are ultrasonically bonded to all the stud bumps 270 </ b> B of the wafer substrate 610, the wafer substrate 610 is transferred to the substrate slow cooling device 400 by the substrate transfer device 500. The substrate slow cooling apparatus 400 includes a slow cooling heating plate 410. The heating plate 410 for slow cooling lowers the temperature at a cooling rate slower than natural cooling while applying heat to the wafer substrate 610 placed thereon. This suppresses a rapid temperature drop when the wafer substrate 610 is cooled. The wafer substrate 610 that has been slowly cooled to the room temperature by the substrate slow cooling device 400 is collected by the substrate transport device 500 into the substrate cassette 600.

  Next, an electronic component assembling method by the electronic component assembling apparatus 900 will be described with reference to the temperature cycle of the wafer substrate 610 in FIG.

  First, as a substrate preheating process, the wafer substrate 610 is preheated by the substrate preheating apparatus 300 to raise the temperature from room temperature. As a result, the wafer substrate 610 is heated to a target temperature, as shown in a temperature cycle AB in FIG. During the preheating, another wafer substrate 610 preceding this wafer substrate 610 is present in the stud bump formation process (described later), so the assembly cycle time is shortened but relatively slowly. It is possible to preheat at a temperature rise rate of By making the temperature change gentle, the entire temperature distribution of the wafer substrate 610 can always be made uniform. For example, if the temperature distribution of a pyroelectric material such as a lithium tantalate material becomes uneven, the overall temperature change rate is large, or a large temperature difference occurs, the difference in thermal expansion Or it breaks due to surface charge fluctuations due to the pyroelectric effect. The same applies to glass substrates. Therefore, the wafer substrate 610 is prevented from being damaged by slowly preheating as in the present embodiment. As a result, for example, the wafer substrate can have a thickness of 1 mm or less, and further 0.4 mm or less. Therefore, if the substrate is preheated slowly, the yield of the assembly process can be increased. The target temperature of wafer substrate 610 is preferably 80 degrees or higher.

  When preheating is completed, as a stud bump forming process, the wafer substrate 610 is moved to the stud bump forming apparatus 200, and the wafer substrate 610 is heated and maintained at a target temperature (a temperature higher than normal temperature), and the plurality of stud bumps 270B are spread over the entire area. Are formed sequentially. Accordingly, as shown in the temperature cycle BC of FIG. 12, the wafer substrate 610 is maintained at the target temperature during the stud bump forming process. When the stud bump formation process is completed, the process proceeds to the electronic component piece mounting process.

  Specifically, the electronic component piece mounting process includes a substrate transport process and an ultrasonic bonding process. In the substrate transporting process, after the stud bump forming process, the wafer substrate 610 is transported from the stud bump forming apparatus 200 to the chip bonder 100 within a time range in which the wafer substrate 610 can be maintained in a state where it is not lowered to room temperature. At this time, since it is preferable to keep the temperature drop amount to a minimum, it is important to transport as quickly as possible. Desirably, the wafer substrate 610 is transferred so as not to be less than 60 degrees, more preferably not to be less than 80 degrees. Although not particularly illustrated, a heating plate can also be installed in the substrate transfer device 500 in order to suppress a temperature drop during transfer with high accuracy. In the ultrasonic bonding step, after the completion of the transfer of the wafer substrate 610, the electrodes of the stud bump 270B and the electronic component piece 98 are positioned and ultrasonically bonded while heating the wafer substrate 610.

  That is, in this electronic component piece mounting step, the wafer substrate 610 of the stud bump forming apparatus 200 is quickly transported to the chip bonder 100 in a state where the temperature drop is suppressed to within 20 degrees, and the heating of the wafer substrate 610 is continued. The electronic component piece 98 is mounted by the chip bonder 100 while maintaining a state where the temperature is not lowered to room temperature. Therefore, as shown in the temperature cycle CD in FIG. 12, the wafer substrate 610 is maintained at the target temperature even in the electronic component piece mounting step, and thus the stud bump 270B is not subjected to stress due to temperature change. The electronic component piece 98 can be ultrasonically bonded as it is. As a result, the external force applied to the wafer substrate 610 can be reduced during ultrasonic bonding. Also,

  After the electronic component piece mounting process is completed, the process proceeds to a substrate slow cooling process, and the substrate slow cooling apparatus 400 dissipates heat from the wafer substrate 610 at a slower temperature drop rate than natural cooling. As a result, as shown in the temperature cycle DE in FIG. 12, the temperature of the wafer substrate 610 decreases. As described above, by moderately changing the temperature of the wafer substrate 610, the entire temperature distribution of the wafer substrate 610 can always be made uniform, and damage to the wafer substrate 610 can be suppressed.

  As described above, according to the electronic component assembling apparatus 900 of this embodiment, the wafer substrate 610 and the stud bump 270 </ b> B are suppressed by suppressing the wafer substrate 610 from being at room temperature from the stud bump forming process to the electronic component piece mounting process. In contrast, a plurality of thermal cycles are prevented from being applied. As a result, since the thermal stress applied to the wafer substrate 610 and the stud bump 270B can be reduced, the quality of the electronic component can be improved. Further, in the substrate transfer apparatus 500 that transfers the wafer substrate 610, a temperature control heater (temperature control device) is mounted on a holder 520 that holds the wafer substrate 610, and the holder 520 and the wafer substrate 610 come into contact with each other. By reducing the temperature difference between the two, it is possible to prevent the wafer substrate 610 from being locally cooled and damaged.

  For example, when a plurality of thermal cycles including a normal temperature state are applied to the wafer substrate 610, metal wiring (base electrode for forming the stud bump 270B) formed on the surface of the wafer substrate 610 is likely to deteriorate. The probability that the wafer substrate 610 is damaged due to the temperature change is increased. In addition, if the wafer substrate 610 that has completed the stud bump formation process is left at room temperature for a while, an oxide film is formed on the surface of the stud bump 270B, and the quality of the subsequent ultrasonic bonding is likely to deteriorate. In order to improve the quality, there is a possibility that an oxide film removing process of removing the oxide film by plasma processing the oxidized stud bump 270B before the electronic component piece mounting process may be required.

  On the other hand, in the electronic component assembling apparatus 900 of this embodiment, the electronic component piece 98 is directly ultrasonically bonded before the oxide film is formed on the surface of the stud bump 270B. And productivity can be dramatically increased.

  Further, in this electronic component assembling apparatus 900, the chip bonder 100 has a turret structure, and a plurality of ultrasonic nozzles 33 are arranged in the circumferential direction of the turret 10. As a result, the supply of the electronic component piece 98 and the operation of mounting the electronic component piece 98 on the wafer substrate 610 can be performed at a very high speed. As a result, even if the wafer substrate 610 is directly transferred from the stud bump forming apparatus 200 to the chip bonder 100, the difference in the operation cycle time between the two becomes small, so that the assembly work can be made efficient.

  It is also possible to perform maintenance of the suction nozzle 33 at the cleaning position T of the chip bonder 100 while the electronic component piece 98 is being suctioned or welded. As a result, since the movable stop time of the chip bonder 100 can be reduced, even if the stud bump forming apparatus 200 and the chip bonder 100 are continuously operated, it is possible to suppress a decrease in operating efficiency.

  In the chip bonder 100, the component holding unit driving device 80 is fixedly arranged on the upper side of the supply position U and the welding position W independently from the turret 10. Therefore, it is not necessary to provide the component holding unit driving devices 80 one by one so as to correspond to all the component holding units 30, and the weight of the turret 10 can be reduced. As a result, the inertia of the turret 10 can be reduced, so that the degree of rotation of the turret can be improved.

  Furthermore, the horn urging member 36 of the chip bonder 100 magnetically levitates the horn support member 34 upward by the repulsive force or attractive force of the horn side magnet 36A and the case side magnet 36B. As a result, it is possible to quickly move the horn support member 34 with a small external force as compared with the case where it is held by a spring or the like. Therefore, when the electronic component piece 98 is brought into contact with the stud bump 270B, it is possible to absorb an impact acting on the wafer substrate 610. In the case of a method in which stud bumps 270B are collectively formed on the wafer substrate 610 side and the electronic component pieces 98 are continuously mounted thereon, the magnetic levitation structure of the chip bonder 100 according to the present embodiment acts on the wafer substrate 610. Making the impact to be extremely small greatly contributes to improving the quality of electronic components.

  In particular, the chip bonder 100 detects the position of the horn support member 34 with respect to the case 31 with high accuracy using a horn position detection device 38 having a Hall element. As a result, the moment when the electronic component piece 98 sucked and held by the suction nozzle 33 contacts the tip of the stud bump 270B can be detected with high accuracy and speed.

  Further, the ultrasonic horn 32 is arranged so as to vibrate ultrasonically in the radial direction of the turret 10. Therefore, since the space efficiency in the circumferential direction is increased on the turret 10, the number of ultrasonic horns 32 can be increased.

  The electronic component assembling method and the like of the present invention can be applied to various processes for assembling electronic components.

DESCRIPTION OF SYMBOLS 10 Turret 20 Turret drive motor 30 Component holding unit 40 Horn rotating device 50 Component holding unit guide device 60 First pressing device 70 Second pressing device 80 Component holding unit driving device 98 Electronic component piece 100 Chip bonder 200 Stud bump forming device 210 Capillary 220 Head 230 Ultrasonic horn 240 Z-axis table 250 XY table 260 Wire clamper 270 Gold wire 300 Substrate preheating device 400 Substrate annealing device 500 Substrate transport device 600 Substrate cassette 610 Wafer substrate U supply position V Adsorption state confirmation position W Welding Position T Cleaning position

Claims (19)

A stud bump forming step of forming a metal stud bump on the substrate by a stud bump forming device while heating the substrate to 80 degrees or more;
After the formation of the stud bump, at least until the electronic component piece is arranged on the stud bump, the substrate is maintained in a state where the temperature is not lowered to 60 degrees or less, and the chip bonder is used to place the substrate on the stud bump of the substrate. An electronic component piece mounting process in which electronic component pieces are arranged and ultrasonically bonded,
An electronic component assembling method characterized by comprising: Before the stud bump forming step, it has a substrate preheating step of preheating the substrate,
The electronic component assembling method according to claim 1. After the electronic component piece mounting step, it has a substrate gradual cooling step of radiating the substrate at a moderate temperature drop rate compared to natural cooling.
The electronic component assembling method according to claim 1 or 2. The electronic component piece mounting step includes:
Substrate transporting step for transporting the substrate from the stud bump forming device to the chip bonder within a time range in which the state in which the substrate is not lowered to 60 degrees or less can be maintained after the stud bump forming step;
An ultrasonic bonding step of ultrasonically bonding the electronic component piece while heating the substrate after transporting the substrate,
The electronic component assembling method according to claim 1. In the substrate transfer step in the electronic component piece mounting step, the substrate is transferred from the stud bump forming device to the chip bonder in a state where the temperature change of the substrate is suppressed to within 20 degrees,
The electronic component assembling method according to claim 4. In the substrate transfer step in the electronic component piece mounting step, the substrate is handled while controlling the temperature of a holding unit for holding the substrate in the substrate transfer device, and the substrate is transferred from the stud bump forming device to the chip bonder. It is characterized by
The electronic component assembling method according to claim 4 or 5. A stud bump forming device for forming a metal stud bump on the heated substrate having a heating plate for heating the substrate to 80 degrees or more;
After the formation of the stud bump, at least until the electronic component piece is arranged on the stud bump, the temperature of the substrate is not lowered to 60 degrees or less, and the electronic component piece is formed on the stud bump of the substrate. A chip bonder for ultrasonic bonding by placing
An electronic component assembling apparatus characterized by comprising: It has a substrate preheating device for preheating the substrate and then carrying it into the stud bump forming device.
The electronic component assembly apparatus according to claim 7. The substrate carried out from the chip bonder has a substrate slow cooling device that radiates heat from the substrate at a moderate temperature drop rate compared to natural cooling.
The electronic component assembly apparatus according to claim 7 or 8. The chip bonder is
A substrate transfer device for transferring the substrate from the stud bump forming device to the chip bonder without lowering the substrate to 60 degrees or less;
It has a bonder side heating plate for heating the substrate,
The electronic component assembly apparatus according to claim 7. The substrate transport device includes a temperature control device that controls the temperature of a holding unit that holds the substrate.
The electronic component assembling apparatus according to claim 10. The chip bonder is
A turret supported rotatably about a central axis as a rotation axis;
A turret drive motor having the turret connected to an output shaft;
A component holding unit that is provided in a plurality in the circumferential direction of the turret, holds an electronic component piece, and welds the electronic component piece to a counterpart member
A component holding unit guide device which is provided between the turret and the component holding unit and guides the component holding unit movably in the vertical direction with respect to the turret;
A component holding unit driving device which is provided on the upper side of the component holding unit and moves the component holding unit downward by pressing the component holding unit;
With
The component holding unit is
An ultrasonic horn provided with a suction nozzle for sucking the electronic component piece;
A horn support member that supports the ultrasonic horn so as to be capable of ultrasonic vibration; and
A case for slidably supporting the horn support member in the vertical direction;
Characterized by comprising,
Electronic assembly according to any one of claims 7 to 11. The component holding unit driving device of the chip bonder includes a first pressing device and a second pressing device,
The first pressing device is configured to press the entire component holding unit downward with respect to the turret;
The second pressing device is characterized in that the suction nozzle is pressed downward relative to the case of the component holding unit.
The electronic component assembly apparatus according to claim 12. The component holding unit driving device of the chip bonder is provided in a state independent of the turret, at least on the position where the electronic component piece is supplied from the electronic component piece supply device, and the electronic component piece as the counterpart member It is fixedly arranged on the position to be welded,
The electronic component assembly apparatus according to claim 12 or 13. The chip bonder is
It comprises a horn rotating device that rotates the ultrasonic horn,
The electronic component assembly apparatus according to claim 12. The component holding unit of the chip bonder is
A horn biasing device for biasing the horn support member upward;
A horn position detection device for detecting the position of the horn support member in the vertical direction;
Characterized by comprising,
The electronic component assembly apparatus according to claim 12. The horn biasing device in the component holding unit of the chip bonder is
A horn side magnet fixedly arranged on the horn support member side,
Facing the horn side magnet, and a case side magnet fixedly arranged on the case side,
The horn-side magnet and the case-side magnet urge the horn support member upward by attracting or repelling each other,
The electronic component assembly apparatus according to claim 16. The ultrasonic horn of the chip bonder is provided so that the vibration direction of the ultrasonic horn is the radial direction of the turret,
The electronic component assembly apparatus according to claim 12. The component holding unit driving device of the chip bonder is disposed in a state offset in the radial direction of the turret with respect to the component holding unit.
The electronic component assembling apparatus according to claim 12.

Images