JP3773201B2

JP3773201B2 - Delivery method and apparatus for workpieces

Info

Publication number: JP3773201B2
Application number: JP2003112951A
Authority: JP
Inventors: 朗山内; 孝志晴
Original assignee: Toray Engineering Co Ltd
Current assignee: Toray Engineering Co Ltd
Priority date: 2003-04-17
Filing date: 2003-04-17
Publication date: 2006-05-10
Anticipated expiration: 2023-04-17
Also published as: JP2004319836A

Description

【０００１】
【発明の属する技術分野】
本発明は、チップやウエハー、各種回路基板等の、基材の表面に金属接合部を有する被接合物同士を接合するに際し、各接合物をトレイ上から接合のための所定位置へと受け渡す方法および装置に関する。
【０００２】
【従来の技術】
たとえば、ボンディングヘッド下のツールに保持した被接合物と、水平移動可能なステージ上のツールに保持した被接合物との間に、上下２視野を有する認識手段を挿入して両被接合物をアライメントし、認識手段を退避させてボンディングヘッドを下降させ被接合物同士を接合するようにした実装装置が知られている。このような実装装置においては、被接合物をトレイ上にセットしておき、該トレイ上から接合すべき被接合物を取り出してツールへと受け渡す方式が採用されることがあり、トレイ上からの受け渡しには別途ローディング機構が設けられることが多い（たとえば、特許文献１）。
【０００３】
接合すべき被接合物をツール上の所定位置に正確に保持させるには、上記受け渡しにも精度が要求されるが、トレイ上から被接合物を取り出すに際し、正確にピックアップできるよう、下方への視野を有する光学認識装置を備えた方式が知られている（たとえば、特許文献２）。また、被接合物をヘッドで吸着保持した後、直接ヘッド上で位置出しを行うようにした方式も知られている（たとえば、特許文献３）。
【０００４】
一方、金属接合部を有する被接合物同士を接合する方法として、シリコンウエハーの接合面同士を接合するに際し、接合に先立って室温の真空中で不活性ガスイオンビームまたは不活性ガス高速原子ビームを照射してスパッタエッチングする、シリコンウエハーの接合法が開示されている（たとえば、特許文献４）。この接合法では、シリコンウエハーの接合面における酸化物や有機物等が上記のビームで飛ばされて活性化された原子で表面が形成され、その表面同士が、原子間の高い結合力によって接合される。したがって、この方法では、基本的に、接合のための加熱を不要化でき、活性化された表面同士を単に接触させるだけで、常温またはそれに近い低温での接合が可能になる。
【０００５】
しかし、この接合法においては、上記のようなエネルギー波によるエッチングにより表面活性化された金属接合部の接合面は、接合されるまでは触れることができない。そのため、表面活性化された被接合物は、たとえば洗浄面に触れないようにアタッチメント等を用いて保持されることになるが、被接合物を保持する為のアタッチメントと保持されるべき被接合物との位置合わせが必要になるという問題を含んでいる。とくに、トレイ上に載せられた被接合物をアタッチメント等を用いて取り出し、ツールへと受け渡す場合、トレイ上での被接合物の位置が決まっていないと、アタッチメントとの位置が合わず、所定の取り出しや受渡しを行うことができないという問題を招く。
【０００６】
さらに、近年とくに、チップの微小化が進み、たとえば０．２ｍｍ角の光素子というような微小チップも出現してきている。このような微小チップを、的確に取り出したり、吸着孔から外れないように精度よくツールに受け渡すには、トレイ上の微小チップと受け渡しツール（またはそれに保持されたアタッチメント）との間の高精度の位置決め、および、受け渡しツール（またはそれに保持されたアタッチメント）とツール（または該ツールに設けられた吸着孔）との間の高精度の位置決めが要求されることになるが、現状の装置では困難である。たとえば、０．２ｍｍ角の微小チップで吸着孔０．１ｍｍの場合、０．１ｍｍの位置ずれが生じると吸着できない。
【０００７】
【特許文献１】
特開平２−２２６７３７号公報（特許請求の範囲、図１）
【特許文献２】
特開２０００−１６４６４０号公報（特許請求の範囲、図１）
【特許文献３】
特開２０００−３４０９９８号公報（特許請求の範囲、図６）
【特許文献４】
特許第２７９１４２９号公報（特許請求の範囲）
【０００８】
【発明が解決しようとする課題】
前述のような、トレイからの被接合物の取り出し、受け渡しを、別途設けられたローディング装置で行う方式には、装置が大がかりになり、装置コストが高くなるという問題がある。また、下方への視野を有する光学認識装置だけを備えた方式では、被接合物の取り出し等の限られた動作に対してしか、位置決めをおこなうことができず、上下のツールに対して被接合物を高精度で受け渡すまでの動作をカバーできない。また、ヘッド上で直接位置出しを行う方式では、ヘッドの機構が複雑になるとともに、トレイから微小チップを取り出す動作等には対応できない。さらに、表面活性化された被接合物、とくに微小な被接合物を、洗浄された接合面に触れずに適切にハンドリングできる装置は見当たらない。
【０００９】
そこで本発明の課題は、このような実情に鑑み、とくにエネルギー波またはエネルギー粒子により金属接合部の接合面を洗浄した被接合物同士を接合するに際し、微小な被接合物であっても的確にかつ高精度で所定のハンドリングを行うことができ、しかも、洗浄され表面活性化された被接合物の接合面に触れることなくトレイ上からの取り出し、ツール側への受け渡しを行うことが可能な、被接合物の受け渡し方法および装置を提供することにある。
【００１０】
【課題を解決するための手段】
上記課題を解決するために、本発明に係る被接合物の受け渡し方法は、エネルギー波またはエネルギー粒子により第１、第２の被接合物の接合面を洗浄した後、両被接合物を不活性ガスまたは大気中で接合する工程において、上方のボンディングヘッド下に配置された第１のツールの下面に保持された第１の被接合物と、下方のステージ上に配置された第２のツールの上面に保持された第２の被接合物との間に、上下２視野を有する２視野の認識手段を挿入して両被接合物をアライメントした後、両被接合物を接合するに際し、まず、少なくとも前記第１の被接合物をその接合面を上方に向けた状態でトレイ上にセットし、該第１の被接合物を反転して前記第１のツールへ受け渡す第１の受け渡しツールおよび前記第２の被接合物を前記第２のツールへ受け渡す第２の受け渡しツールのうち少なくとも第１の受け渡しツールの位置を認識した状態で前記トレイ上の第１の被接合物を前記２視野の認識手段で認識し、第１の受け渡しツールとトレイ上の第１の被接合物の相対位置をアライメントした後、前記第１の受け渡しツールにより第１の被接合物をその接合面に非接触の状態で取り出し第１のツールへ受け渡すことを特徴とする方法からなる。
【００１１】
この被接合物の受け渡し方法においては、前記第２の被接合物も前記トレイ上にセットし、第２の受け渡しツールの位置を認識した状態で前記トレイ上の第２の被接合物を前記２視野の認識手段で認識し、第２の受け渡しツールとトレイ上の第２の被接合物の相対位置をアライメントした後、前記第２の受け渡しツールにより第２の被接合物をその接合面に非接触の状態で取り出し第２のツールへ受け渡すようにすることが好ましい。
【００１４】
また、少なくとも前記第１の受け渡しツールを前記２視野の認識手段に取り付け、該２視野の認識手段の上視野認識手段の位置と第１の受け渡しツールの反転後の位置との相対位置関係を第１のパラメータとして記憶しておき、第１の受け渡しツールに保持した第１の被接合物を第１のツールに受け渡す際に、前記第１のパラメータに基づき前記２視野の認識手段を移動して第１の受け渡しツールの位置を制御した後、保持していた第１の被接合物を第１のツールに受け渡すようにすることができる。
【００１５】
この方式においては、前記第２の受け渡しツールも前記２視野の認識手段に取り付け、該２視野の認識手段の下視野認識手段により第２の被接合物の位置を認識し、前記第２の受け渡しツールと位置認識された第２の被接合物の相対位置をアライメントした後、該第２の被接合物をトレイから第２の受け渡しツールにより取り出し、取り出した第２の被接合物を前記第２のツールに受け渡すようにすることもできる。
【００１６】
そして、前記２視野の認識手段の下視野認識手段の位置と第１の受け渡しツールおよび／または第２の受け渡しツールの位置との相対位置関係を第２のパラメータとして記憶しておき、前記第１の被接合物および／または第２の被接合物をトレイから取り出す際に、前記第２のパラメータに基づき前記２視野の認識手段を移動して第１の受け渡しツールおよび／または第２の受け渡しツールの位置を制御した後、該第１の受け渡しツールおよび／または第２の受け渡しツールにより第１の被接合物および／または第２の被接合物を取り出すようにすることもできる。
【００１７】
本発明に係る被接合物の受け渡し方法においては、前記第１の受け渡しツールおよび／または第２の受け渡しツールが交換可能なアタッチメントを有しており、該アタッチメントにより第１の被接合物および／または第２の被接合物を取り出すようにすることができる。
【００１８】
この場合、交換用アタッチメントを前記ステージ上にセットしておき、アタッチメント交換時に、交換されるべきアタッチメントを前記２視野の認識手段を用いてアライメントした後、該アタッチメントを前記第１の受け渡しツールおよび／または第２の受け渡しツールへ取り出すようにすることができる。
【００１９】
また、本発明に係る被接合物の受け渡し方法においては、第１の被接合物および／または第２の被接合物の接合面洗浄用エネルギー波またはエネルギー粒子としては、たとえば、プラズマ（大気圧プラズマを含む。）、イオンビーム、原子ビーム、ラジカルビーム、レーザなどを用いることができるが、取り扱い易さ、制御の容易性等の面から、プラズマを用いることが好ましく、中でも、Ａｒプラズマを用いることが好ましい。
【００２０】
上記エネルギー波またはエネルギー粒子による洗浄では、金属接合部の接合される全表面で１ｎｍ以上の深さにエッチングすることが好ましい。このような深さ以上にエッチング可能なエネルギー波またはエネルギー粒子の照射により、大気中であっても、金属接合部同士を接合するに必要な表面性状を得ることが可能になる。
【００２１】
本発明に係る接合は、とくに、表面が金、銅、Ａｌ、Ｉｎ、Ｓｎのいずれかにより構成されている金属接合部同士を接合する場合に好適である。たとえば、互いに接合される金属接合部の組み合わせとして、金、銅、Ａｌ、Ｉｎ、Ｓｎのいずれかの同種金属同士、あるいは任意の２つの異種金属同士、あるいは、一方を金とし他方を銅、Ａｌ、Ｉｎ、Ｓｎのいずれかとする組み合わせとすることができる。中でも、金同士の接合の場合、常温でも確実に接合できるようになる。ただし、金同士の接合以外の場合でも（たとえば、金／銅、金／アルミニウム等の接合等）、常温あるいはそれに近い低温での接合を可能とすることができる。また、少なくとも一方の金属接合部を特定の金属、たとえば金で構成する場合、金属接合部を形成する電極等の全体を金で構成することもできるが、表面だけを金で構成することもできる。表面を金で構成するための形態はとくに限定されず、金めっきの形態や金薄膜をスパッタリングや蒸着等により形成した形態を採用すればよい。
【００２２】
また、金属接合部同士の接合に際し、表面同士が良好に密着できるように、少なくとも一方の金属接合部の表面硬度がビッカース硬度Ｈｖで１００以下とされていることが好ましい。たとえば、表面硬度Ｈｖを３０〜７０の範囲内（たとえば、平均Ｈｖを５０）とすることが好ましい。このような低硬度としておくことで、接合圧力印加時に金属接合部の表面が微細に適当に変形し、より密接な接合が可能となる。
【００２３】
本発明に係る被接合物の受け渡し装置は、上方に配置されたボンディングヘッドと、その下方に配置されたステージと、ボンディングヘッド下に配置され第１の被接合物を保持する第１のツールと、ステージ上に配置され第２の被接合物を保持する第２のツールと、第１、第２のツール間に挿入される上下２視野を有する２視野の認識手段と、該２視野の認識手段による認識情報に基づいて第１のツールに保持された第１の被接合物と第２のツールに保持された第２の被接合物とを所定の位置関係にアライメントする手段を有し、エネルギー波またはエネルギー粒子により第１、第２の被接合物の接合面を洗浄し、両被接合物をアライメントした後、両被接合物を不活性ガスまたは大気中で接合する接合装置における、接合面を上方に向けた状態でトレイ上にセットされた被接合物を前記第１、第２のツールに受け渡す装置であって、前記第１の被接合物を反転して前記第１のツールへ受け渡す第１の受け渡しツールと、前記第２の被接合物を前記第２のツールへ受け渡す第２の受け渡しツールを有するとともに、少なくとも第１の受け渡しツールの位置を認識した状態で前記トレイ上の第１の被接合物を認識可能な前記２視野の認識手段を有し、前記第１の受け渡しツールは、該２視野の認識手段による認識情報に基づいて前記第１の受け渡しツールとトレイ上の第１の被接合物の相対位置をアライメントした後、第１の被接合物をその接合面に非接触の状態で取り出し第１のツールへ受け渡すことが可能な手段からなることを特徴とするものからなる。
【００２４】
上記２視野の認識手段としては、第２の受け渡しツールの位置を認識した状態で前記トレイ上の第２の被接合物も認識可能な手段から構成することができ、前記第２の受け渡しツールとしては、該２視野の認識手段による認識情報に基づいて前記第２の受け渡しツールとトレイ上の第２の被接合物の相対位置をアライメントした後、第２の被接合物をその接合面に非接触の状態で取り出し第２のツールへ受け渡すことが可能な手段から構成することができる。
【００２７】
また、少なくとも前記第１の受け渡しツールは前記２視野の認識手段に取り付けられ、該２視野の認識手段の上視野認識手段の位置と第１の受け渡しツールの反転後の位置との相対位置関係を第１のパラメータとして記憶しておき、第１の受け渡しツールに保持した第１の被接合物を第１のツールに受け渡す際に、前記第１のパラメータに基づき前記２視野の認識手段を移動して第１の受け渡しツールの位置を制御した後、保持していた第１の被接合物を第１のツールに受け渡すようにした制御手段を有する構成とすることができる。
【００２８】
この構成においては、前記第２の受け渡しツールも前記２視野の認識手段に取り付けられ、該２視野の認識手段の下視野認識手段により第２の被接合物の位置を認識し、前記第２の受け渡しツールと位置認識された第２の被接合物の相対位置をアライメントした後、該第２の被接合物をトレイから第２の受け渡しツールにより取り出し、取り出した第２の被接合物を前記第２のツールに受け渡すようにした制御手段を有する構成とすることもできる。
【００２９】
また、前記制御手段は、前記２視野の認識手段の下視野認識手段の位置と第１の受け渡しツールおよび／または第２の受け渡しツールの位置との相対位置関係を第２のパラメータとして記憶しておき、前記第１の被接合物および／または第２の被接合物をトレイから取り出す際に、前記第２のパラメータに基づき前記２視野の認識手段を移動して第１の受け渡しツールおよび／または第２の受け渡しツールの位置を制御した後、該第１の受け渡しツールおよび／または第２の受け渡しツールにより第１の被接合物および／または第２の被接合物を取り出すことが可能に構成されている形態とすることができる。
【００３０】
このような本発明に係る被接合物の受け渡し装置においては、前記第１の受け渡しツールおよび／または第２の受け渡しツールが、交換可能な被接合物取り出し用のアタッチメントを有している構成とすることができる。
【００３１】
たとえば、交換用アタッチメントが前記ステージ上にセットされており、アタッチメント交換時に、交換されるべきアタッチメントは前記２視野の認識手段を用いてアライメントした後、該アタッチメントが前記第１の受け渡しツールおよび／または第２の受け渡しツールへ取り出される構成とすることができる。
【００３２】
また、前述の被接合物の受け渡し方法と同様、第１の被接合物および／または第２の被接合物の接合面洗浄用エネルギー波またはエネルギー粒子としてプラズマを用いることができ、とくに、Ａｒプラズマを用いることが好ましい。
【００３３】
また、前記エネルギー波またはエネルギー粒子による洗浄により、前記金属接合部が接合される全表面で１ｎｍ以上の深さにエッチングされることが好ましい。
【００３４】
また、接合部に関しては、表面が金、銅、Ａｌ、Ｉｎ、Ｓｎのいずれかにより構成されている金属接合部同士が接合される構成とすることができる。
【００３５】
また、少なくとも一方の金属接合部の表面硬度がビッカース硬度Ｈｖで１００以下とされている構成とすることができる。
【００３６】
【発明の実施の形態】
以下に、本発明の望ましい実施の形態について、図面を参照して説明する。
図１は、本発明の一実施態様に係る被接合物の受け渡し方法を実施するための接合装置の一例を示している。この接合装置１においては、基材の表面に金属接合部２、３を有する第１の被接合物４および第２の被接合物５は、エネルギー波またはエネルギー粒子による洗浄手段としてのプラズマ照射手段８から照射されたプラズマ９によって金属接合部２、３の接合面がエッチングにより洗浄される（洗浄工程）。本実施態様では、真空ポンプ６により減圧され所定の真空度にされたチャンバ７内で、プラズマ９によって金属接合部２、３の接合面がエッチングにより洗浄されるようになっている。さらに、本実施態様では、ポンプ１０によりチャンバ７内にＡｒガスを供給できるようになっており、Ａｒガス雰囲下でプラズマ照射できるようになっている。洗浄された被接合物４、５は、洗浄チャンバ７内から取り出され、接合工程（接合装置部１１）にて、金属接合部２、３同士が、大気中または不活性ガス中で接合される。不活性ガス中で接合する場合には、接合装置部１１の全体がチャンバ（図示略）により、あるいは、接合時に対向保持された両被接合物４、５およびそれらの周囲部がローカルチャンバ（図示略）により、外部雰囲気からシールされ、内部が所定の不活性ガス雰囲気にされればよい。
【００３７】
なお、上記において、被接合物４は、たとえばチップからなり、被接合物５は、例えば基板からなる。ただし、ここでチップとは、たとえば、ＩＣチップ、半導体チップ、光素子、表面実装部品、ウエハーなど種類や大きさに関係なく基板と接合される側の全ての形態のものを指す。この被接合物４上に、金属接合部２として、たとえばバンプが形成されている。また、基板とは、たとえば、樹脂基板、ガラス基板、フィルム基板、チップ、ウエハーなど種類や大きさに関係なくチップと接合される側の全ての形態のものを指す。また、チップと基板は位置を入れ替えてもかまわない。
【００３８】
接合装置部１１では、上記洗浄された被接合物４、５がトレイ１２に載せられた状態で搬送された後、たとえば所定の待機部に一旦載置される。この一旦載置場所１３に載置されたトレイ１２上にセットされた第１の被接合物４が、以下のような認識、アライメント後、第１の受け渡しツール１４により、洗浄された接合面に非接触の状態で取り出され、反転された後、ボンディングヘッド１５の下部に配置された第１のツール１６へ受け渡され、金属接合部２が下方に向けられた形態で第１のツール１６に吸着等によって保持される。一旦載置場所１２に載置されたトレイ１２上にセットされた第２の被接合物５は、以下のような認識、アライメント後、第２の受け渡しツール１７により、洗浄された接合面に非接触の状態で取り出され、反転されずにそのままの姿勢で移送されて、ステージ１８上に配置された第２のツール１９の上面に、金属接合部３が上方に向けられた形態で吸着等によって保持される。本実施態様では、第１のツール１６（ボンディングツール）に加熱手段としてのヒータ２０が内蔵されており、不活性ガス雰囲気中あるいは大気中にて、常温下での接合、加熱下での接合のいずれも可能となっている。
【００３９】
本実施態様では、ボンディングヘッド１５は、加圧手段（図示略）により、第１のツール１６を介して被接合物４を下方に押圧できるようになっており、被接合物５に対して、所定の接合圧力を印加、コントロールできるようになっている。本実施態様では、ボンディングヘッド１５は、上下方向（Ｚ方向）に移動および位置決めできるようになっている。
【００４０】
また、上記被接合物５を保持している第２のツール１９およびステージ１８は、本実施態様では、Ｘ、Ｙ方向の水平方向位置制御、θ方向の回転方向位置制御、および、Ｘ軸、Ｙ軸周りの傾き調整制御により、被接合物４との間の相対位置合わせおよび平行度調整を行うことができるようになっており、金属接合部同士の接合時の隙間のばらつきを小さく抑えることもできるようになっている。この相対位置合わせおよび平行度調整のためのアライメントは、被接合物４、５間に進退可能に挿入される認識手段、たとえば２視野の認識手段２１（たとえば、２視野カメラ）により、被接合物４、５あるいはそれらの保持ツール１６、１９に付された認識マーク（図示略）を読み取り、読み取り情報に基づいて位置や角度の必要な修正を行うことにより、実施される。２視野の認識手段２１は、Ｘ、Ｙ方向、場合によってはＺ方向への位置調整が可能となっている。このアライメントは、本実施態様では主としてステージ１８側で行われるが、ボンディングヘッド１５または第１のツール１６側で行うようにすることも可能であり、両側で行うことも可能である。両側で行う場合には、必要に応じて、ボンディングヘッド１５側については昇降制御だけでなく回転制御および／または平行移動制御を行い、ステージ１７側についても回転制御、平行移動制御および昇降制御などを行うことができ、これら制御形態は必要に応じて任意に組み合わせることが可能である。
【００４１】
本実施態様では、図２にも示すように、第１の受け渡しツール１４および第２の受け渡しツール１７は、２視野の認識手段２１の先端部に取り付けられており、このうち、第１の受け渡しツール１４は回転により上下反転可能に取り付けられている。また、第１の受け渡しツール１４および第２の受け渡しツール１７は、アタッチメント２２を介して、たとえば吸着により被接合物を着脱できるようになっている。アタッチチメント２２は、各被接合物４、５に対応したものが取り付けられ、ステージ１８上には、交換用のアタッチメント２３がセットされている。
【００４２】
本実施態様では、まず、図３に示すように、第１の被接合物４がその接合面を上方に向けてトレイ１２上にセットされた状態でステージ１８が移動され、第１の被接合物４が第１のツール１６の下方に位置するように移動される。この状態で認識手段２１が挿入され、認識情報に基づいて第１のツール１６と第１の被接合物４の位置が認識される。このとき、第１のツール１６の認識位置として、たとえばその吸着孔２４の位置を認識しておくと、第１の被接合物４が微小チップの場合にも、後述の受け渡し時に、第１の被接合物４を吸着孔２４から外れないように第１のツール１６に保持させることが可能になる。そしてこのとき、第１の受け渡しツール１４の位置を認識した状態で、つまり、認識手段２１の先端部に取り付けられた第１の受け渡しツール１４の位置が、認識手段２１に対する相対位置として把握されているとともに、認識手段２１が基準位置から移動されている移動量が把握された状態にて、トレイ１２上の第１の被接合物４の位置が認識手段２１で認識される。したがって、認識手段２１の現在位置、認識手段２１に対する第１の受け渡しツール１４の位置、認識手段２１で読み取られたトレイ１２上の第１の被接合物４の位置が、それぞれ正確に認識されることになる。
【００４３】
この認識情報に基づいて、図４に示すように、認識手段２１が後退されるとともに下降され、それに伴って、第１の受け渡しツール１４およびそれに取り付けられているアタッチメント２２が加工され、第１の被接合物４が精度よくアタッチメント２２に保持される。保持は、たとえば図５に示すように、第１の被接合物４の洗浄された接合面（金属接合部２）に非接触の状態にて、たとえば吸引孔２５を通しての吸着によって行われる。
【００４４】
続いて、アタッチメント２２に第１の被接合物４が吸着保持された状態にて、図６に示すように、認識手段２１およびそれに取り付けられている第１の受け渡しツール１４とアタッチメント２２が下方から上方に向けて反転され、保持されている第１の被接合物４が上下反転される。反転された状態で認識手段２１、第１の受け渡しツール１６、アタッチメント２２が上昇され、保持されている第１の被接合物４が第１のツール１６の下面へと受け渡される。事前に第１のツール１６の位置が同じ２視野の認識手段２１で認識されているので、第１の被接合物４は、第１のツール１６の所定の位置に精度よく受け渡され、微小チップの場合にあっても、たとえば吸着孔２４から外れることなく精度よく受け渡される。
【００４５】
受け渡し後には、図７に示すように、第１の被接合物４が第１のツール１６の所定の位置に精度よく保持された状態で、第１のツール１６とアタッチメント２２が認識手段２１とともに下降され、第１の被接合物４の取り出し、受け渡しが完了する。
【００４６】
このとき、２視野の認識手段２１の上視野認識手段の位置と第１の受け渡しツール１４の反転後の位置との相対位置関係を第１のパラメータとして記憶しておき、第１の受け渡しツール１４に保持した第１の被接合物４を第１のツール１６に受け渡す際に、この第１のパラメータに基づき２視野の認識手段２１を移動して第１の受け渡しツール１４の位置を制御した後、保持していた第１の被接合物４を第１のツール１６に受け渡すようにすれば、より的確に高精度の受け渡しが可能になる。
【００４７】
第２の被接合物５の取り出し、受け渡しは、たとえば図８、図９に示すように行われる。すなわち、第２の受け渡しツール１７も前記２視野の認識手段２１に取り付けられているので、該２視野の認識手段２１の下視野認識手段により第２の被接合物５の位置を認識し（図８）、第２の受け渡しツール１７と位置認識された第２の被接合物５の相対位置をアライメントした後、該第２の被接合物５をトレイ１２からアタッチメント２２を介して第２の受け渡しツール１７に取り出し、取り出した第２の被接合物５を反転させることなく移動させて、第２のツール１９に受け渡すようにすることができる（図９）。
【００４８】
このとき、２視野の認識手段２１の下視野認識手段の位置と第２の受け渡しツール１７の位置との相対位置関係を第２のパラメータとして記憶しておき、第２の被接合物５をトレイ１２から取り出す際に、この第２のパラメータに基づき２視野の認識手段２１を移動して第２の受け渡しツール１７の位置を制御した後、該受け渡しツール１７により被接合物５を取り出すようにすれば、より精度よく取り出すことが可能になる。また、この第２のパラメータに基づき第２のツール１９に第２の被接合物５を受け渡すようにすれば、より的確に高精度の受け渡しが可能になる。
【００４９】
第１の被接合物４が第１のツール１６の所定位置に保持され、第２の被接合物５が第２のツール１９の所定位置に保持された後には、２視野の認識手段２１を用いて両被接合物４、５の相対位置がアライメントされ、ボンディングヘッド１５が下降されて所定の接合が行われる。この接合は、前述の如く大気中あるいは不活性ガス中で行われるが、洗浄された接合面が非接触の状態で表面活性化された状態のまま両被接合物４、５がアライメントされ、その状態で接合が行われるので、常温あるいはそれに近い低温での接合が可能になる。
【００５０】
上記のような認識手段２１を用いた被接合物と受け渡しツールとの間のアライメントは、アタッチメント２２の取り出し、交換にも適用できる。すなわち、アタッチメント交換時に、ステージ１８上にセットされた交換されるべき交換用アタッチメント２３を、２視野の認識手段２１を用いてアライメントした後、該アタッチメント２３を受け渡しツール１４または１７に取り出すようにすれば、アタッチメント２３は高精度で受け渡しツール１４または１７に取り付けられることになる。
【００５１】
このような本発明に係る被接合物の受け渡し方法および装置においては、とくに接合のためのアライメント用に設けられていた２視野の認識手段２１の先端部に受け渡しツール１４、１７が取り付けられ、取り出し、受け渡し機構がコンパクトに構成されているとともに、それら動作のための位置認識に２視野の認識手段２１を利用できるようにしたので、従来トレイから被接合物の取り出しには別途ローディング装置が必要であったが、そのような大がかりな装置が不要になり、装置コストが大幅に低減される。
【００５２】
また、２視野の認識手段２１に対して一定寸法オフセットされて設けられた受け渡しツール１４、１７により被接合物の取り出し、受け渡しを行うようにしたので、高精度の受け渡しが可能になる。また、アタッチメント２２を用いて洗浄された接合面に対し非接触の状態で取り出し、受け渡しを行えるようにしたので、接合に対する悪影響のおそれもない。さらにこの時、被接合物の外形に合わせて吸着等により取り出すことができるので、接合面に触れずに、かつ、被接合物の欠けの問題も生じさせずに、所望の取り出し、受け渡し動作を行わせることができる。
【００５３】
また、エネルギー波またはエネルギー粒子による表面活性化工法では接合面に触れることができない。そのため、洗浄された被接合物は、アタッチメント等により吸着保持して接合用ツールへと受け渡されるが、トレイ上にセットされた被接合物は通常位置が決まっていないため、アタッチメントと位置が合わないことが多い。しかし本発明では、トレイ上から取り出すべき被接合物の位置を認識し、アタッチメントとの相対位置をアライメントした状態で取り出すことができるため、所定の位置関係に決めた状態で精度よく取り出すことができ、その状態から所定のツールへと受け渡すことができるため、ツールへの受け渡し精度も極めて高精度になる。したがって、続いて行われる接合動作も高精度で行われることが可能になり、高い実装精度が確保される。とくに、微小チップに対しても、たとえばツールの吸着孔から外れることなく高精度で受け渡すことが可能になる。前述したように、たとえば０．２ｍｍ角の微小チップで吸着孔が０．１ｍｍであれば、０．１ｍｍ位置がずれると吸着できなくなるが、本発明によれば、このような場合にも確実に所定位置に決めることができるようになる。さらに、高精度に位置が認識されているので、微小チップのハンドリングも確実に行えるようになる。
【００５７】
なお、本発明においては、図１に示したように、被接合物４、５の金属接合部２、３がエネルギー波またはエネルギー粒子としてのたとえばＡｒプラズマにより洗浄され、表面が活性化される。このようなプラズマ洗浄においては、後の接合のために表面異物層を除去し十分に表面活性化するために、金属接合部の接合される全表面で１ｎｍ以上エッチングできるようにプラズマ照射強度、時間を設定することが好ましい。
【００５８】
【発明の効果】
以上説明したように、本発明に係る被接合物の受け渡し方法および装置によれば、金属接合部の接合面を洗浄した被接合物同士を接合するに際し、微小な被接合物であっても精度よくトレイから取り出し所定のツールへと受け渡すことができるようになり、かつ、ハンドリングの容易化、装置のコンパクト化、コストダウンをはかることが可能になる。
【００５９】
また、洗浄された接合面に触れずに確実に接合物を受け渡すことができるので、常温接合等の容易化、量産化をはかることも可能になる。
【図面の簡単な説明】
【図１】本発明の一実施態様に係る接合装置の概略構成図である。
【図２】図１の装置における認識手段および第１および第２の受け渡しツール部の拡大斜視図である。
【図３】図１の装置における第１の被接合物および第１のツールの位置認識を示す拡大部分概略構成図である。
【図４】図３の次の動作を示す概略構成図である。
【図５】アタッチメント部の一例を示す概略構成図である。
【図６】図４の次の動作を示す概略構成図である。
【図７】第１のツールへの受け渡し後の状態を示す概略構成図である。
【図８】図１の装置における第２の被接合物の位置認識を示す拡大部分概略構成図である。
【図９】図８の次の動作を示す概略構成図である。
【符号の説明】
１接合装置
２、３金属接合部
４第１の被接合物
５第２の被接合物
６真空ポンプ
７チャンバ
８プラズマ照射手段
９プラズマ
１０Ａｒガス供給ポンプ
１１接合装置部
１２トレイ
１３一旦載置場所
１４第１の受け渡しツール
１５ボンディングヘッド
１６第１のツール
１７第２の受け渡しツール
１８ステージ
１９第２のツール
２０加熱手段としてのヒータ
２１２視野の認識手段
２２アタッチメント
２３交換用アタッチメント
２４吸着孔
２５吸引孔[0001]
BACKGROUND OF THE INVENTION
In the present invention, when bonding objects to be bonded having a metal bonding portion on the surface of a base material such as a chip, a wafer, and various circuit boards, each bonded object is transferred from the tray to a predetermined position for bonding. It relates to a method and an apparatus.
[0002]
[Prior art]
For example, a recognition means having two upper and lower visual fields is inserted between a workpiece held by a tool under a bonding head and a workpiece held by a tool on a horizontally movable stage so that both workpieces are inserted. 2. Description of the Related Art There is known a mounting apparatus that performs alignment, retracts a recognition means, and lowers a bonding head to join objects to be joined. In such a mounting apparatus, a method may be adopted in which a workpiece is set on a tray, and a workpiece to be bonded is taken out from the tray and transferred to a tool. In many cases, a separate loading mechanism is provided for delivery (for example, Patent Document 1).
[0003]
In order to accurately hold the workpieces to be joined at a predetermined position on the tool, accuracy is also required for the above-mentioned delivery, but when the workpieces are taken out from the tray, they are moved downward so that they can be accurately picked up. A method including an optical recognition device having a field of view is known (for example, Patent Document 2). Also known is a method in which the object to be bonded is sucked and held by the head and then positioned directly on the head (for example, Patent Document 3).
[0004]
On the other hand, as a method of bonding objects to be bonded having metal bonding portions, when bonding the bonding surfaces of silicon wafers, an inert gas ion beam or an inert gas fast atom beam is used in a vacuum at room temperature prior to bonding. A silicon wafer bonding method in which irradiation and sputter etching are performed is disclosed (for example, Patent Document 4). In this bonding method, oxides, organic substances, and the like on the bonding surface of the silicon wafer are formed by atoms activated by being blown by the beam, and the surfaces are bonded to each other by a high bonding force between the atoms. . Therefore, this method basically eliminates the need for heating for bonding, and enables bonding at a room temperature or a temperature close thereto by simply bringing the activated surfaces into contact with each other.
[0005]
However, in this joining method, the joint surface of the metal joint part surface-activated by the above-described etching by the energy wave cannot be touched until it is joined. Therefore, the surface-activated object to be bonded is held using, for example, an attachment so as not to touch the cleaning surface. However, the attachment for holding the object to be bonded and the object to be held are to be held. And the problem that alignment with is necessary. In particular, when the object to be bonded placed on the tray is taken out using an attachment and transferred to the tool, the position of the object to be bonded on the tray is not determined and the position of the object to be bonded does not match. This results in a problem that it cannot be taken out or delivered.
[0006]
Furthermore, in recent years, chip miniaturization has progressed, and for example, microchips such as 0.2 mm square optical elements have also appeared. High precision between the microchip on the tray and the delivery tool (or the attachment held by it) in order to accurately take out such microchips and deliver them to the tool accurately so as not to be removed from the suction holes. Positioning and high-accuracy positioning between the delivery tool (or the attachment held by the tool) and the tool (or the suction hole provided in the tool) are difficult. It is. For example, in the case of a 0.2 mm square microchip with an adsorption hole of 0.1 mm, it cannot be adsorbed if a positional deviation of 0.1 mm occurs.
[0007]
[Patent Document 1]
JP-A-2-226737 (Claims, FIG. 1)
[Patent Document 2]
JP 2000-164640 A (Claims, FIG. 1)
[Patent Document 3]
JP 2000-340998 (Claims, FIG. 6)
[Patent Document 4]
Japanese Patent No. 2794429 (Claims)
[0008]
[Problems to be solved by the invention]
The method of taking out and transferring the object to be joined from the tray as described above using a loading device provided separately has a problem that the device becomes large and the device cost increases. In addition, in the system including only the optical recognition device having a downward visual field, positioning can be performed only for a limited operation such as removal of an object to be bonded, and bonding to an upper and lower tool is possible. It cannot cover the operation until the object is delivered with high accuracy. Further, the method of directly positioning on the head complicates the head mechanism and cannot cope with the operation of taking out a microchip from the tray. Furthermore, there is no device that can appropriately handle a surface-activated object to be bonded, particularly a minute object to be bonded, without touching the cleaned bonding surface.
[0009]
Therefore, in view of such circumstances, the problem of the present invention is that, even when bonding objects to be bonded, in which the bonding surfaces of the metal bonding portion are cleaned with energy waves or energy particles, are joined to each other, even a minute object to be bonded is accurately obtained. In addition, predetermined handling can be performed with high accuracy, and it is possible to take out from the tray without touching the bonding surface of the cleaned and surface-activated object to be bonded and transfer it to the tool side. An object of the present invention is to provide a method and an apparatus for delivering a workpiece.
[0010]
[Means for Solving the Problems]
In order to solve the above-described problems, the method for delivering a workpiece according to the present invention is to inactivate both workpieces after cleaning the bonding surfaces of the first and second workpieces with energy waves or energy particles. In the step of bonding in gas or air, a first object to be bonded held on the lower surface of the first tool disposed under the upper bonding head and a second tool disposed on the lower stage After aligning both objects to be joined by inserting a two-field recognition means having two upper and lower fields between the second object held on the upper surface, first, when joining both objects, A first delivery tool that sets at least the first workpiece on a tray with its joining surface facing upward, and inverts the first workpiece and delivers it to the first tool; The second object to be joined is the second The second of at least the first first object to be bonded positioned the upper tray while recognizing the delivery tool of the transfer tool passes to the tool Of the two fields of view After recognizing by the recognition means and aligning the relative position of the first delivery tool and the first workpiece on the tray, the first delivery tool causes the first workpiece to contact the joint surface without contact. It is a method characterized in that it is taken out in a state and delivered to the first tool.
[0011]
In this method of delivering the article to be joined, the second article to be joined is also set on the tray, and the second article to be joined on the tray is placed in a state where the position of the second delivery tool is recognized. 2 fields of view After recognizing by the recognition means and aligning the relative position of the second delivery tool and the second workpiece on the tray, the second delivery tool causes the second workpiece to contact the joint surface without contact. It is preferable to take it out in a state and transfer it to the second tool.
[0014]
Further, at least the first delivery tool is attached to the recognition means for the two fields of view, and the relative positional relationship between the position of the upper field recognition means of the recognition means for the two fields and the inverted position of the first delivery tool is When the first object stored in the first delivery tool and transferred to the first tool is transferred to the first tool, the recognition means for the two fields of view is moved based on the first parameter. Then, after controlling the position of the first delivery tool, the held first object to be joined can be delivered to the first tool.
[0015]
In this method, the second delivery tool is also attached to the recognition means for the two fields of view, the position of the second object to be joined is recognized by the lower field recognition means of the recognition means for the two fields, and the second delivery tool is recognized. After aligning the relative position of the second workpiece to be recognized with the tool, the second workpiece is transferred from the tray to the second delivery tool. Than It is also possible to take out the second workpiece to be taken out and deliver it to the second tool.
[0016]
And the position of the lower visual field recognition means of the two visual field recognition means and First Delivery tool And / or second delivery tool The relative positional relationship with the position of is stored as a second parameter, First Joined object And / or second object to be joined When taking out the tray from the tray, the recognition means for the two fields of view is moved based on the second parameter. First Delivery tool And / or second delivery tool After controlling the position of the First Delivery tool And / or second delivery tool By First Joined object And / or second object to be joined It is also possible to take out.
[0017]
In the method for delivering an object to be joined according to the present invention, First Delivery tool And / or second delivery tool Has a replaceable attachment, and the attachment First Joined object And / or second object to be joined Can be taken out.
[0018]
In this case, an attachment for replacement is set on the stage, and the attachment to be replaced is aligned using the recognition means for the two visual fields at the time of replacing the attachment. First Delivery tool And / or second delivery tool Can be taken out.
[0019]
Moreover, in the delivery method of the article to be joined according to the present invention, First Joined object And / or second object to be joined For example, plasma (including atmospheric pressure plasma), ion beam, atomic beam, radical beam, laser, etc. can be used as the energy wave or energetic particles for cleaning the bonding surface, but it is easy to handle and control. From the viewpoint of properties and the like, it is preferable to use plasma, and among these, it is preferable to use Ar plasma.
[0020]
In the cleaning with the energy wave or the energy particles, it is preferable to etch to a depth of 1 nm or more on the entire surface where the metal joint portion is joined. By irradiation with energy waves or energetic particles that can be etched to such a depth or more, it is possible to obtain surface properties necessary for joining metal joints even in the atmosphere.
[0021]
The joining according to the present invention is particularly suitable for joining metal joining parts whose surfaces are composed of any of gold, copper, Al, In, and Sn. For example, as a combination of metal joints to be joined together, the same kind of metal of gold, copper, Al, In, or Sn, or any two different kinds of metals, or one of which is gold and the other is copper, Al , In, or Sn. In particular, in the case of bonding between gold, bonding can be reliably performed even at room temperature. However, even in cases other than the bonding of gold (for example, bonding of gold / copper, gold / aluminum, etc.), bonding at room temperature or a temperature close thereto can be made possible. Further, when at least one of the metal joints is made of a specific metal, for example, gold, the entire electrodes and the like forming the metal joint can be made of gold, but only the surface can be made of gold. . The form for configuring the surface with gold is not particularly limited, and a form of gold plating or a form in which a gold thin film is formed by sputtering or vapor deposition may be employed.
[0022]
In addition, it is preferable that the surface hardness of at least one of the metal joint portions is set to 100 or less in terms of Vickers hardness Hv so that the surfaces can be satisfactorily adhered to each other when joining the metal joint portions. For example, the surface hardness Hv is preferably in the range of 30 to 70 (for example, the average Hv is 50). By setting it as such low hardness, the surface of a metal joint part deform | transforms appropriately finely at the time of joining pressure application, and more close joining is attained.
[0023]
A workpiece transfer apparatus according to the present invention includes a bonding head disposed above, a stage disposed below the bonding head, and a first tool disposed below the bonding head and holding the first workpiece. A second tool arranged on the stage and holding the second object to be joined; a two-field recognition means having two upper and lower fields inserted between the first and second tools; and recognition of the two fields Means for aligning the first object held by the first tool and the second object held by the second tool in a predetermined positional relationship based on the recognition information by the means; Bonding in a bonding apparatus for cleaning the bonding surfaces of the first and second objects to be bonded with energy waves or energy particles, aligning both objects to be bonded, and bonding both objects to be bonded in an inert gas or the atmosphere Face up An apparatus for transferring a workpiece set on a tray to the first and second tools in a state where the first workpiece is reversed and transferred to the first tool. A delivery tool, and a second delivery tool for delivering the second workpiece to the second tool, and at least a first delivery tool on the tray in a state where the position of the first delivery tool is recognized. Recognize joints Of the two fields of view Recognizing means, and the first delivery tool comprises 2 fields of view After aligning the relative positions of the first delivery tool and the first object to be joined on the tray based on the recognition information by the recognition means, the first object to be joined is taken out of the joint surface in a non-contact state. It is characterized by comprising means capable of being transferred to one tool.
[0024]
the above 2 fields of view The recognizing means can be configured from a means capable of recognizing the second object to be joined on the tray in a state where the position of the second delivery tool is recognized. As the second delivery tool, 2 fields of view After aligning the relative positions of the second delivery tool and the second object to be joined on the tray based on the recognition information by the recognition means, the second object to be joined is taken out of the joint surface in a non-contact state. It can be composed of means that can be transferred to two tools.
[0027]
Further, at least the first delivery tool is attached to the two-field recognition means, and the relative positional relationship between the position of the upper-field recognition means of the two-field recognition means and the inverted position of the first delivery tool is determined. When the first object stored in the first parameter and held by the first delivery tool is delivered to the first tool, the recognition means for the two fields of view is moved based on the first parameter. Then, after controlling the position of the first delivery tool, it is possible to have a control means for delivering the held first object to be joined to the first tool.
[0028]
In this configuration, the second delivery tool is also attached to the recognition means for the two visual fields, and the position of the second object to be joined is recognized by the lower visual recognition means of the two visual field recognition means, After aligning the relative position of the second workpiece to be recognized with the delivery tool, the second workpiece is transferred from the tray to the second delivery tool. Than It can also be configured to have a control means that takes out the second workpiece to be taken out and delivers it to the second tool.
[0029]
Further, the control means includes a position of the lower visual field recognition means of the two visual field recognition means and First Delivery tool And / or second delivery tool The relative positional relationship with the position of is stored as a second parameter, First Joined object And / or second object to be joined When taking out the tray from the tray, the recognition means for the two fields of view is moved based on the second parameter. First Delivery tool And / or second delivery tool After controlling the position of the First Delivery tool And / or second delivery tool By First Joined object And / or second object to be joined It can be set as the form comprised so that it can take out.
[0030]
In such a workpiece transfer apparatus according to the present invention, First Delivery tool And / or second delivery tool However, it can be set as the structure which has the attachment for taking out the to-be-joined thing to be replaced.
[0031]
For example, a replacement attachment is set on the stage, and when replacing the attachment, the attachment to be replaced is aligned using the recognition means for the two fields of view, and then the attachment is First Delivery tool And / or second delivery tool It can be configured to be taken out.
[0032]
In addition, like the above-mentioned delivery method of the object to be joined, First Joined object And / or second object to be joined Plasma can be used as the energy wave or energetic particles for cleaning the bonding surface, and it is particularly preferable to use Ar plasma.
[0033]
Further, it is preferable that the entire surface to which the metal joint portion is bonded is etched to a depth of 1 nm or more by cleaning with the energy wave or energy particles.
[0034]
Moreover, regarding a junction part, the metal junction part by which the surface is comprised by either gold | metal | money, copper, Al, In, and Sn can be made into the structure joined.
[0035]
Moreover, it can be set as the structure by which the surface hardness of at least one metal junction part is set to 100 or less by Vickers hardness Hv.
[0036]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows an example of a joining apparatus for carrying out a method for delivering an object to be joined according to an embodiment of the present invention. In the bonding apparatus 1, the first bonded object 4 and the second bonded object 5 having the metal bonded portions 2 and 3 on the surface of the base material are plasma irradiation means as cleaning means using energy waves or energy particles. The joint surfaces of the metal joints 2 and 3 are cleaned by etching with the plasma 9 irradiated from 8 (cleaning step). In the present embodiment, the bonding surfaces of the metal bonding portions 2 and 3 are cleaned by etching in the chamber 7 that is depressurized by the vacuum pump 6 and has a predetermined degree of vacuum. Furthermore, in this embodiment, Ar gas can be supplied into the chamber 7 by the pump 10, and plasma irradiation can be performed in an Ar gas atmosphere. The cleaned objects 4 and 5 are taken out from the cleaning chamber 7, and the metal bonding parts 2 and 3 are bonded to each other in the atmosphere or in an inert gas in the bonding process (bonding device unit 11). . In the case of bonding in an inert gas, the entire bonding apparatus unit 11 is formed by a chamber (not shown), or both objects to be bonded 4 and 5 held opposite to each other at the time of bonding and their surrounding parts are formed by a local chamber (not shown). (Omitted) may be sealed from the external atmosphere, and the inside may be a predetermined inert gas atmosphere.
[0037]
In the above description, the object to be bonded 4 is made of, for example, a chip, and the object to be bonded 5 is made of, for example, a substrate. Here, the term “chip” refers to all forms on the side to be bonded to the substrate regardless of the type and size, such as an IC chip, a semiconductor chip, an optical element, a surface mount component, and a wafer. For example, bumps are formed on the workpiece 4 as the metal bonding portion 2. Moreover, a board | substrate refers to the thing of all the forms of the side joined to a chip | tip irrespective of a kind and magnitude | size, such as a resin substrate, a glass substrate, a film substrate, a chip | tip, a wafer, for example. Further, the positions of the chip and the substrate may be interchanged.
[0038]
In the bonding apparatus unit 11, the cleaned objects to be bonded 4 and 5 are transported in a state of being placed on the tray 12, and then temporarily mounted on, for example, a predetermined standby unit. The first workpiece 4 set on the tray 12 once placed on the placement place 13 is recognized and aligned as described below, and then the first delivery tool 14 cleans the joined surface. After being taken out in a non-contact state and inverted, it is transferred to the first tool 16 disposed below the bonding head 15, and the metal joint 2 is directed downward to the first tool 16. It is held by adsorption or the like. The second workpiece 5 once set on the tray 12 once placed on the placement place 12 is subjected to non-bonding on the cleaned joint surface by the second delivery tool 17 after the following recognition and alignment. It is taken out in a contact state, transferred without being inverted, and is transferred as it is, and is attracted to the upper surface of the second tool 19 disposed on the stage 18 by suction or the like with the metal joint 3 facing upward. Retained. In this embodiment, the first tool 16 (bonding tool) incorporates a heater 20 as a heating means, and can be used for bonding at normal temperature or heating in an inert gas atmosphere or in the air. Both are possible.
[0039]
In the present embodiment, the bonding head 15 can press the workpiece 4 downward via the first tool 16 by pressurizing means (not shown). A predetermined bonding pressure can be applied and controlled. In this embodiment, the bonding head 15 can be moved and positioned in the vertical direction (Z direction).
[0040]
In the present embodiment, the second tool 19 and the stage 18 holding the workpiece 5 are controlled in the horizontal position control in the X and Y directions, the rotational position control in the θ direction, and the X axis. By adjusting the tilt adjustment around the Y-axis, it is possible to perform relative position adjustment and parallelism adjustment with the workpiece 4 and to suppress variations in gaps at the time of joining metal joints to each other. You can also. The alignment for the relative alignment and the parallelism adjustment is performed by a recognition means, for example, a two-view recognition means 21 (for example, a two-view camera) inserted so as to be movable back and forth between the articles 4 and 5. 4, 5 or the recognition marks (not shown) attached to the holding tools 16 and 19 are read, and the position and angle are corrected as necessary based on the read information. The two-view recognition means 21 can be adjusted in position in the X and Y directions, and in some cases in the Z direction. In this embodiment, this alignment is mainly performed on the stage 18 side, but can also be performed on the bonding head 15 or the first tool 16 side, or on both sides. When performing on both sides, if necessary, not only the elevation control on the bonding head 15 side but also the rotation control and / or translation control are performed, and the rotation control, translation control and elevation control are performed on the stage 17 side as well. These control modes can be arbitrarily combined as necessary.
[0041]
In this embodiment, as shown in FIG. 2, the first delivery tool 14 and the second delivery tool 17 are attached to the distal end portion of the recognition means 21 for two fields of view, and among these, the first delivery tool 21 The tool 14 is attached so as to be turned upside down by rotation. In addition, the first delivery tool 14 and the second delivery tool 17 can attach and detach the object to be joined, for example, by suction through the attachment 22. Attachments 22 corresponding to the articles 4 and 5 are attached, and a replacement attachment 23 is set on the stage 18.
[0042]
In this embodiment, first, as shown in FIG. 3, the stage 18 is moved in a state where the first workpiece 4 is set on the tray 12 with the joining surface facing upward, and the first workpiece is joined. The object 4 is moved so as to be positioned below the first tool 16. The recognition means 21 is inserted in this state, and the positions of the first tool 16 and the first workpiece 4 are recognized based on the recognition information. At this time, if the position of the suction hole 24 is recognized as the recognition position of the first tool 16, for example, even when the first workpiece 4 is a microchip, the first tool 16 may be used at the time of delivery described later. The workpiece 4 can be held by the first tool 16 so as not to be detached from the suction hole 24. And at this time, the first delivery tool 14 The first delivery tool attached to the tip of the recognition means 21 in a state where the position of the recognition means 21 is recognized. 14 Is recognized as a relative position with respect to the recognizing means 21 and the movement amount of the recognizing means 21 being moved from the reference position is grasped. The position is recognized by the recognition means 21. Therefore, the current position of the recognition means 21 and the first delivery tool for the recognition means 21 14 And the position of the first workpiece 4 on the tray 12 read by the recognition means 21 are accurately recognized.
[0043]
Based on this recognition information, as shown in FIG. 4, the recognition means 21 is retracted and lowered, and accordingly, the first delivery tool 14 And the attachment 22 attached to it is processed, and the 1st to-be-joined object 4 is hold | maintained at the attachment 22 with sufficient precision. For example, as shown in FIG. 5, the holding is performed by suction through, for example, the suction hole 25 in a non-contact state with the cleaned bonding surface (metal bonding portion 2) of the first workpiece 4.
[0044]
Subsequently, as shown in FIG. 6, the first delivery tool attached to the recognition means 21 in the state where the first object 4 is attracted and held on the attachment 22. 14 The attachment 22 is inverted from below to above, and the first object 4 to be held is inverted upside down. In the inverted state, the recognition means 21, the first transfer tool 16, and the attachment 22 are raised, and the held first object 4 is transferred to the lower surface of the first tool 16. Since the position of the first tool 16 is recognized in advance by the recognition means 21 having the same two fields of view, the first object to be joined 4 is accurately transferred to a predetermined position of the first tool 16 and is minute. Even in the case of a chip, for example, the chip is delivered with high accuracy without being detached from the suction hole 24.
[0045]
After the delivery, as shown in FIG. 7, the first tool 16 and the attachment 22 together with the recognition means 21 are in a state where the first workpiece 4 is accurately held at a predetermined position of the first tool 16. Then, the first workpiece 4 is taken out and delivered.
[0046]
At this time, the relative positional relationship between the position of the upper visual field recognition means of the two visual field recognition means 21 and the position after the inversion of the first delivery tool 14 is stored as a first parameter, and the first delivery tool 14 is stored. When transferring the first workpiece 4 held in the first position to the first tool 16, the position of the first transfer tool 14 is controlled by moving the two-field recognition means 21 based on the first parameter. Thereafter, if the first object 4 to be held is transferred to the first tool 16, it can be transferred more accurately and accurately.
[0047]
The second workpiece 5 is taken out and delivered, for example, as shown in FIGS. That is, since the second delivery tool 17 is also attached to the two-field recognition means 21, the position of the second workpiece 5 is recognized by the lower-field recognition means 21 of the two-field recognition means 21 (FIG. 8) After aligning the relative position of the second workpiece 5 whose position has been recognized with the second delivery tool 17, the second workpiece 5 is transferred from the tray 12 via the attachment 22 to the second delivery. It can be taken out to the tool 17 and moved without reversing the taken out second article 5 to be transferred to the second tool 19 (FIG. 9).
[0048]
At this time, the relative positional relationship between the position of the lower visual field recognition means of the two visual field recognition means 21 and the position of the second delivery tool 17 is stored as a second parameter, and the second object 5 is placed in the tray. When removing from 12, the recognition means 21 of two fields of view is moved based on the second parameter to control the position of the second delivery tool 17, and then the workpiece 5 is taken out by the delivery tool 17. If it is, it will become possible to take out more accurately. In addition, if the second workpiece 5 is delivered to the second tool 19 based on the second parameter, delivery with higher accuracy can be performed more accurately.
[0049]
After the first workpiece 4 is held at a predetermined position of the first tool 16 and the second workpiece 5 is held at a predetermined position of the second tool 19, the recognition means 21 for two fields of view is set. The relative positions of the objects to be bonded 4 and 5 are aligned using the bonding head 15, and the bonding head 15 is lowered to perform predetermined bonding. This bonding is performed in the atmosphere or in an inert gas as described above, and both the objects to be bonded 4 and 5 are aligned while the cleaned bonding surface is surface-activated in a non-contact state. Since bonding is performed in a state, bonding at room temperature or a temperature close to that is possible.
[0050]
The alignment between the object to be joined and the delivery tool using the recognition means 21 as described above can be applied to the removal and replacement of the attachment 22. That is, at the time of replacing the attachment, the replacement attachment 23 to be replaced set on the stage 18 is aligned using the two-field recognition means 21, and then the attachment 23 is transferred to the delivery tool 14 or 17. In this case, the attachment 23 is attached to the delivery tool 14 or 17 with high accuracy.
[0051]
In such a method and apparatus for delivering an object to be joined according to the present invention, delivery tools 14 and 17 are attached to the distal end portion of the two-field recognition means 21 provided for alignment, particularly for joining, and taken out. Since the delivery mechanism is compactly configured and the two-field recognition means 21 can be used for position recognition for these operations, a separate loading device is required to take out the object to be joined from the conventional tray. However, such a large-scale apparatus is not necessary, and the apparatus cost is greatly reduced.
[0052]
In addition, since the workpieces are taken out and delivered by the delivery tools 14 and 17 provided with a fixed offset with respect to the recognition means 21 for the two fields of view, delivery with high accuracy becomes possible. Further, since the joining surface cleaned using the attachment 22 is taken out in a non-contact state and can be delivered, there is no possibility of adverse effects on the joining. Further, at this time, since it can be taken out by adsorption or the like according to the outer shape of the object to be joined, a desired take-out and delivery operation can be performed without touching the joining surface and without causing a problem of chipping of the object to be joined. Can be done.
[0053]
Further, the surface activation method using energy waves or energy particles cannot touch the joint surface. Therefore, the cleaned object to be bonded is sucked and held by an attachment or the like and delivered to the bonding tool.However, the position of the object to be bonded set on the tray is not determined, so the position of the object to be aligned is aligned. Often not. However, in the present invention, the object to be joined to be taken out from the tray is removed. position Can be taken out in a state where the relative position with respect to the attachment is aligned, so that it can be taken out accurately in a state determined in a predetermined positional relationship, and can be transferred from that state to a predetermined tool. , Delivery accuracy to the tool is also extremely high. Therefore, the subsequent joining operation can be performed with high accuracy, and high mounting accuracy is ensured. In particular, even a microchip can be delivered with high accuracy without detaching from the suction hole of the tool, for example. As described above, for example, if the suction hole is 0.1 mm with a small tip of 0.2 mm square, the suction cannot be performed when the position is shifted by 0.1 mm. The predetermined position can be determined. Furthermore, since the position is recognized with high accuracy, the microchip can be handled reliably.
[0057]
In the present invention, as shown in FIG. 1, the metal joints 2 and 3 of the objects 4 and 5 are cleaned by, for example, Ar plasma as energy waves or energy particles, and the surface is activated. In such plasma cleaning, in order to remove the surface foreign material layer for subsequent bonding and to sufficiently activate the surface, the plasma irradiation intensity and time can be etched so that the entire surface to which the metal bonding portion is bonded can be etched by 1 nm or more. Is preferably set.
[0058]
【The invention's effect】
As described above, according to the method and apparatus for delivering an object to be bonded according to the present invention, when bonding the objects to be bonded after cleaning the bonding surfaces of the metal bonding portions, even if the objects are very small, It can be often taken out from the tray and transferred to a predetermined tool, and handling can be facilitated, the apparatus can be made compact, and the cost can be reduced.
[0059]
In addition, since the bonded product can be reliably delivered without touching the cleaned bonded surface, it is possible to facilitate room temperature bonding or the like and achieve mass production.
[Brief description of the drawings]
FIG. 1 is a schematic configuration diagram of a bonding apparatus according to an embodiment of the present invention.
2 is an enlarged perspective view of recognition means and first and second delivery tool portions in the apparatus of FIG. 1; FIG.
3 is an enlarged partial schematic configuration diagram showing position recognition of a first object to be joined and a first tool in the apparatus of FIG. 1; FIG.
FIG. 4 is a schematic configuration diagram showing the next operation of FIG. 3;
FIG. 5 is a schematic configuration diagram illustrating an example of an attachment unit.
6 is a schematic configuration diagram showing the next operation of FIG. 4; FIG.
FIG. 7 is a schematic configuration diagram showing a state after delivery to the first tool.
8 is an enlarged partial schematic configuration diagram showing position recognition of a second object to be joined in the apparatus of FIG.
FIG. 9 is a schematic configuration diagram showing the next operation of FIG. 8;
[Explanation of symbols]
1 Joining device
2, 3 Metal joint
4 First object to be joined
5 Second object to be joined
6 Vacuum pump
7 Chamber
8 Plasma irradiation means
9 Plasma
10 Ar gas supply pump
11 Bonding equipment
12 trays
13 Place once
14 First delivery tool
15 Bonding head
16 First tool
17 Second delivery tool
18 stages
19 Second tool
20 Heater as heating means
21 Two field of view recognition means
22 Attachment
23 Replacement attachment
24 Adsorption hole
25 Suction hole

Claims

After the bonding surfaces of the first and second objects to be bonded are cleaned with energy waves or energy particles, in the step of bonding both objects to be bonded in an inert gas or the atmosphere, the first is disposed below the upper bonding head. Two vertical fields of view are provided between the first object held on the lower surface of the first tool and the second object held on the upper surface of the second tool arranged on the lower stage. After the two field-of-view recognition means are inserted to align both objects to be joined, when joining both objects, the tray is first placed with at least the first object to be joined facing upward. A first delivery tool that is set on top and inverts the first workpiece and delivers it to the first tool, and a second delivery that delivers the second workpiece to the second tool. At least the first of the tools The first object to be bonded on the tray while recognizing the position of the tool is recognized by the recognition means of the 2-field, the alignment of the relative positions of the first transfer tool and the first object to be bonded on the tray Then, the first article to be joined is taken out by the first delivery tool in a non-contact state to the joining surface and delivered to the first tool.

The second object to be joined is also set on the tray, and the second object to be joined on the tray is recognized by the recognition means for the two visual fields in a state where the position of the second delivery tool is recognized, After aligning the relative positions of the second delivery tool and the second workpiece on the tray, the second delivery tool takes out the second workpiece in a non-contact state with the second delivery tool to the second tool. The delivery method of the article to be joined according to claim 1, wherein delivery is performed.

At least the first delivery tool is attached to the two-field recognition means, and the relative positional relationship between the position of the upper-field recognition means of the two-field recognition means and the inverted position of the first delivery tool is set to the first When the first object that is stored as a parameter and is held by the first delivery tool is delivered to the first tool, the recognition means for the two fields of view is moved based on the first parameter to move the first object. The method for delivering a workpiece to be joined according to claim 1 or 2, wherein after the position of one delivery tool is controlled, the held first workpiece is delivered to the first tool .

The second delivery tool is also attached to the recognition means for the two fields of view, and the position of the second workpiece is recognized by the lower field recognition means of the recognition means for the two fields, and the position of the second delivery tool is recognized. After aligning the relative positions of the second objects to be joined, the second objects to be joined are taken out of the tray by the second delivery tool, and the taken-out second objects to be joined are delivered to the second tool. 4. The method for delivering an object to be joined according to claim 3 .

The relative positional relationship between the position of the lower visual field recognition means of the two visual field recognition means and the position of the first delivery tool and / or the second delivery tool is stored as a second parameter, and the first object is received. The position of the first delivery tool and / or the second delivery tool by moving the recognition means for the two fields of view based on the second parameter when taking out the joined product and / or the second workpiece from the tray. 5. The method for transferring the object to be bonded according to claim 3 or 4, wherein the first object to be bonded and / or the second object to be bonded is taken out by the first transfer tool and / or the second transfer tool after the control is performed. .

The first transfer tool and / or the second transfer tool has a replaceable attachment, and the first object and / or the second object is taken out by the attachment. 5. The method for delivering an object to be joined according to any one of 5 above.

An exchange attachment is set on the stage, and when the attachment is exchanged, the attachment to be exchanged is aligned using the recognition means of the two fields of view, and then the attachment is attached to the first delivery tool and / or the second The delivery method of the joined object according to claim 6 , wherein the delivery object is taken out to a delivery tool .

The method for delivering a bonded object according to any one of claims 1 to 7 , wherein plasma is used as an energy wave or energy particles for cleaning the bonding surface of the first bonded object and / or the second bonded object .

9. The method for delivering an object to be bonded according to claim 8 , wherein Ar plasma is used as the energy wave or energy particle .

The method for transferring an object to be bonded according to any one of claims 1 to 9 , wherein etching is performed to a depth of 1 nm or more on the entire surface to which the metal bonding portion is bonded by cleaning with the energy wave or energy particles .

The delivery method of the to-be-joined object in any one of Claims 1-10 which joins the metal junction parts in which the surface is comprised by either gold | metal | money, copper, Al, In, and Sn .

The method for delivering an object to be joined according to any one of claims 1 to 11 , wherein the surface hardness of at least one of the metal joints is set to 100 or less in terms of Vickers hardness Hv .

A bonding head disposed above, a stage disposed below, a first tool disposed below the bonding head and holding a first object to be bonded, and a second object to be bonded disposed on the stage The first tool based on the recognition information by the two field recognition means, and the second field recognition means having two upper and lower fields of view inserted between the first and second tools. Means for aligning the held first object to be bonded and the second object to be bonded held by the second tool in a predetermined positional relationship, and by means of energy waves or energy particles, the first and second After cleaning the bonding surfaces of the objects to be bonded and aligning both objects to be bonded, set them on the tray with the bonding surfaces facing upward in a bonding apparatus that bonds both objects to be bonded in an inert gas or air. The bonded object A device for delivering to the first and second tools, the first delivery tool for inverting the first article to be delivered to the first tool, and the second article to be joined. The second visual field recognizing means having a second handing tool for handing over to the second tool and capable of recognizing the first object to be joined on the tray in a state where the position of the first handing tool is recognized at least. And the first delivery tool aligns the relative positions of the first delivery tool and the first object to be joined on the tray based on the recognition information by the recognition means for the two fields of view, A device for transferring an object to be bonded comprising means capable of taking out the object to be bonded in a non-contact state to the bonding surface and transferring it to the first tool.

The means for recognizing the two fields of view comprises means for recognizing the second object to be joined on the tray in a state where the position of the second handing tool is recognized, and the second handing tool is configured to recognize the second field of view. After aligning the relative positions of the second delivery tool and the second object to be joined on the tray based on the recognition information by the recognizing means, the second object to be joined is taken out from the joining surface in a non-contact state. 14. The apparatus for transferring an object to be joined according to claim 13, comprising means capable of transferring to two tools.

At least the first delivery tool is attached to the recognition means for the two fields of view, and the relative positional relationship between the position of the upper field recognition means of the recognition means for the two fields and the inverted position of the first delivery tool is the first. When the first object held by the first delivery tool is delivered to the first tool, the recognition means for the two fields of view is moved based on the first parameter. 15. The apparatus for transferring an object to be bonded according to claim 13 or 14, further comprising control means configured to transfer the held first object to be bonded to the first tool after controlling the position of the first transfer tool. .

The second delivery tool is also attached to the recognition means for the two fields of view, and the position of the second object to be joined is recognized by the lower field recognition means of the recognition means for the two fields, and the position of the second delivery tool is recognized. After aligning the relative position of the second object to be joined, the second object to be joined is taken out from the tray by the second delivery tool, and the second object to be taken out is received by the second tool. 16. The apparatus for transferring an object to be joined according to claim 15 , further comprising control means adapted to transfer.

The control means stores the relative positional relationship between the position of the lower visual field recognition means of the two visual field recognition means and the position of the first delivery tool and / or the second delivery tool as a second parameter, When taking out the first object and / or the second object from the tray, the first visualizing tool and / or the second handing tool and / or the second object are moved by moving the recognition means for the two fields of view based on the second parameter. after controlling the position of the delivery tool, it is taken out first object to be bonded and / or the second object to be bonded is configured to be by the first transfer tool and / or the second transfer tool The apparatus for transferring an object to be joined according to claim 15 or 16.

The said 1st delivery tool and / or the 2nd delivery tool have the attachment for taking out the to-be-joined thing to be joined, The delivery apparatus of the to-be-joined object in any one of Claims 13-17 .

A replacement attachment is set on the stage, and when the attachment is replaced, the attachment to be replaced is aligned using the recognition means for the two fields of view, and then the attachment is the first delivery tool and / or the second 19. The device for transferring a workpiece according to claim 18 , wherein the device is taken out to a transfer tool .

The apparatus for transferring an object to be bonded according to any one of claims 13 to 19, wherein plasma is used as energy waves or energy particles for cleaning the bonding surface of the first object to be bonded and / or the second object to be bonded.

21. The apparatus for transferring an object to be bonded according to claim 20, wherein Ar plasma is used as the energy wave or energy particle .

The apparatus for transferring an object to be bonded according to any one of claims 13 to 21, wherein the entire surface to which the metal bonding portion is bonded is etched to a depth of 1 nm or more by cleaning with the energy wave or energy particles .

The device for transferring an object to be bonded according to any one of claims 13 to 22 , wherein metal bonding portions whose surfaces are made of any one of gold, copper, Al, In, and Sn are bonded to each other.

The device for transferring an object to be joined according to any one of claims 13 to 23, wherein the surface hardness of at least one of the metal joints is 100 or less in terms of Vickers hardness Hv .