CN102655100A - Electronic component assembly method and device - Google Patents

Electronic component assembly method and device Download PDF

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Publication number
CN102655100A
CN102655100A CN2012100573339A CN201210057333A CN102655100A CN 102655100 A CN102655100 A CN 102655100A CN 2012100573339 A CN2012100573339 A CN 2012100573339A CN 201210057333 A CN201210057333 A CN 201210057333A CN 102655100 A CN102655100 A CN 102655100A
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CN
China
Prior art keywords
substrate
column
shaped projection
soldering tip
electronic
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Pending
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CN2012100573339A
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Chinese (zh)
Inventor
百濑一久
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AKIM AUTOMATIC EQUIPMENT Co Ltd
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AKIM AUTOMATIC EQUIPMENT Co Ltd
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Publication of CN102655100A publication Critical patent/CN102655100A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/1134—Stud bumping, i.e. using a wire-bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/13144—Gold [Au] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)

Abstract

The invention provides an electronic component assembly method and device, and heat influence during assembly is reduced, and the electronic component is assembled via a column projection in high efficiency. A substrate is heated to be in a temperature higher than normal temperature while a metal column projection is formed on the substrate via a column projection forming device, after the column projection is formed, the state that the temperature of the substrate does not reduce to normal temperature is maintained, and an electronic component sheet is disposed on the column projection of the substrate via a chip jointing machine to perform ultrasonic wave jointing.

Description

Electronic parts mounting method and apparatus for electronic parts assembling
Technical field
The present invention relates to utilizing column-shaped projection (stud bump) employed electronic parts mounting method when assembling electronic unit.
Background technology
In the past, when the assembling electronic unit, extensively utilized column-shaped projection and be electrically connected so that guarantee.This column-shaped projection is one of method that forms fine metal bump.For example use the gold thread of 25 microns of diameters, temporarily form gold goal, and this gold goal is engaged with the electrode part branch of electronic unit, then gold thread is broken off, thereby can form the column-shaped projection of the about 90 microns gold system of diameter through ultrasonic Machining through the discharge heating.If use the thinner metal wire of diameter, then can form more small column-shaped projection.In general, said column-shaped projection is respectively formed on the electrode of semiconductor chip (with reference to patent documentation 1).
When the semiconductor chip that on electrode, is formed with column-shaped projection is installed on the installation base plate, use so-called flip-chip erecting device.In this flip-chip erecting device; Semiconductor chip is moved (handling); With semiconductor chip at its electrode and column-shaped projection towards being configured on the assigned position of installation base plate under the state of downside, and make installation base plate and semiconductor chip engage (with reference to patent documentation 2).
Patent documentation 1: TOHKEMY 2006-278454 communique
Patent documentation 2: TOHKEMY 2001-77593 communique
In existing electronic parts mounting method, have following method: on the electrode of semiconductor chip, form column-shaped projection, afterwards, Yi Bian move this semiconductor chip, Yi Bian this semiconductor chip is installed on the substrate.Its result, the column-shaped projection on the semiconductor chip is in normal temperature state (low-temperature condition).The temperature of column-shaped projection is low more, and its rigidity is high more, therefore, when utilizing column-shaped projection to come bonded substrate and semiconductor chip, exists easily substrate and semiconductor chip are applied such problem of impacting.
On the other hand; If again semiconductor chip is installed on the substrate after the column-shaped projection of semiconductor chip heated; Then have following such problem: repeatedly thermal cycle takes place and makes column-shaped projection self deterioration in this column-shaped projection, or makes semiconductor chip also receive thermal impact.
Summary of the invention
The present invention proposes in view of the above problems, and its purpose is to provide a kind of thermal impact that can reduce when assembling, and can utilize the electronic parts mounting method of the efficient assembling of column-shaped projection electronic unit.
Through present inventor's wholwe-hearted research, above-mentioned purpose can realize through following.
Realize the electronic parts mounting method of the present invention of above-mentioned purpose, it is characterized in that, comprising:
Column-shaped projection forms operation, on one side substrate is heated to be the temperature higher than normal temperature, form device forms metal on said substrate column-shaped projection through column-shaped projection on one side,
Electronic unit sheet installation procedure after forming said column-shaped projection, is kept the state that the temperature that does not make said substrate drops to normal temperature, utilizes the chip join machine on the said column-shaped projection of said substrate, to dispose the electronic unit sheet and carry out ultrasonic wave to engage.
Preferred above-mentioned electronic parts mounting method is characterized in that,
Before said column-shaped projection forms operation, comprise the basal plate preheating operation that in advance said substrate is heated.
Preferred above-mentioned electronic parts mounting method is characterized in that,
After said electronic unit sheet installation procedure, comprising: make said substrate with than putting the substrate slow cool down operation that cold slower temperature decrease speed is dispelled the heat naturally.
Preferred above-mentioned electronic parts mounting method is characterized in that,
Said electronic unit sheet installation procedure comprises:
The board carrying operation; After said column-shaped projection forms operation, in the special time scope, said substrate is formed device from said column-shaped projection be carried to said chip join machine; Wherein, Said special time scope is meant, can keep the time range that the temperature that does not make said substrate drops to the state of normal temperature
Ultrasonic wave engages operation, after the said substrate of carrying, on one side said substrate is heated, said electronic unit sheet is carried out ultrasonic wave on one side and engage.
Preferred above-mentioned electronic parts mounting method is characterized in that,
In the said board carrying operation of said electronic unit installation procedure, the variations in temperature with said substrate be controlled at 20 degree with interior state under, said substrate is formed device from said column-shaped projection is carried to said chip join machine.
Preferred above-mentioned electronic parts mounting method is characterized in that,
In the said board carrying operation of said electronic unit installation procedure; Keep the maintaining part of said substrate to carry out temperature control to being used in the substrate transfer apparatus on one side; Move said substrate on one side, thus said substrate is formed device from said column-shaped projection and be carried to said chip join machine.
Preferred above-mentioned electronic parts mounting method is characterized in that,
Form in the operation at said column-shaped projection, said substrate be heated to more than 80 degree,
In said electronic unit sheet installation procedure, after forming said column-shaped projection, keep under the situation that the temperature that does not make said substrate drops to the state below 60 degree, said electronic unit sheet and said column-shaped projection are carried out the ultrasonic wave joint.
Be used to realize the apparatus for electronic parts assembling of the present invention of above-mentioned purpose, it is characterized in that having:
Column-shaped projection forms device, has the heating plate that substrate is heated to be the temperature higher than normal temperature, and on the said substrate that is heated, forms the column-shaped projection of metal;
The chip join machine after forming said column-shaped projection formation, is kept the state that the temperature that does not make said substrate drops to normal temperature, on the said column-shaped projection of said substrate, disposes the electronic unit sheet and carry out ultrasonic wave to engage.
Preferred above-mentioned apparatus for electronic parts assembling is characterized in that having:
The basal plate preheating device after said substrate heated in advance, is moved into to said column-shaped projection said substrate and is formed device.
Preferred above-mentioned apparatus for electronic parts assembling is characterized in that having:
Substrate slow cool down device, this substrate slow cool down device make the said substrate of taking out of from said chip join machine to dispel the heat than putting the cold decrease speed of temperature slowly naturally.
Preferred above-mentioned apparatus for electronic parts assembling is characterized in that said chip join facility have:
Substrate transfer apparatus drops to the state of normal temperature not make said substrate, said substrate is formed device from said column-shaped projection be carried to said chip join machine;
Engage the pusher side heating plate, said substrate is heated.
Preferred above-mentioned apparatus for electronic parts assembling is characterized in that,
Said substrate transfer apparatus has temperature control equipment, and said temperature control equipment keeps the maintaining part of said substrate to carry out temperature control to being used to.
Preferred above-mentioned apparatus for electronic parts assembling is characterized in that,
Said chip join facility have:
Turntable, being supported for can be that rotating shaft is rotated with the central shaft;
The turntable CD-ROM drive motor is connected with said turntable on its output shaft;
The parts holding unit, circumferentially being provided with of said turntable is a plurality of, is used to keep the electronic unit sheet, and this electronic unit sheet is welded on the cooperation side member;
Parts holding unit guiding device is arranged between said turntable and the said parts holding unit, is used to guide said parts holding unit to move freely on above-below direction with respect to said turntable;
Parts holding unit drive unit is arranged on the upside of said parts holding unit, and, through pushing said parts holding unit, this parts holding unit is moved towards the below,
Said parts holding unit has:
Wave welding head of ultrasonic wave is provided with the suction nozzle that is used to adsorb said electronic unit sheet;
The soldering tip supporting member is supported for said wave welding head of ultrasonic wave and can carries out ultrasonic vibration;
Housing is can be in the enterprising line slip of above-below direction with said soldering tip support member support.
Preferred above-mentioned apparatus for electronic parts assembling is characterized in that,
The said parts holding unit drive unit of said chip join machine has first screwdown gear and second screwdown gear,
Said first screwdown gear is depressed said parts holding unit integral body downwards with respect to said turntable,
Said second screwdown gear is depressed said suction nozzle downwards with respect to the said housing of said parts holding unit relatively.
Preferred above-mentioned apparatus for electronic parts assembling is characterized in that,
The said parts holding unit drive unit of said chip join machine is set to and said turntable state independently mutually; And; Said parts holding unit drive unit at least fixed configurations on the position of supplying with said electronic unit sheet from the electronic unit chip supplying device and said electronic unit sheet is welded on the position of said cooperation side member.
Preferred above-mentioned apparatus for electronic parts assembling is characterized in that said chip join facility are useful on the soldering tip tumbler that said wave welding head of ultrasonic wave is rotated.
Preferred above-mentioned apparatus for electronic parts assembling is characterized in that,
The said parts holding unit of said chip join machine has:
The soldering tip force application apparatus applies the power to the top to said soldering tip supporting member;
The soldering tip position detecting device detects the position of said soldering tip supporting member on above-below direction.
Preferred above-mentioned apparatus for electronic parts assembling is characterized in that,
Said soldering tip force application apparatus in the said parts holding unit of said chip join machine has:
Soldering tip side magnet, fixed configurations is on said soldering tip supporting member;
Case side magnet, fixed configurations are on said housing, and is and mutually opposed with said soldering tip side magnet,
Said soldering tip side magnet and said case side magnet apply the power to the top through absorption or repulsion each other to said soldering tip supporting member.
Preferred above-mentioned apparatus for electronic parts assembling is characterized in that, the direction of vibration that the said wave welding head of ultrasonic wave of said chip join machine is set to this wave welding head of ultrasonic wave be exactly said turntable radially.
Preferred above-mentioned apparatus for electronic parts assembling is characterized in that, the said parts holding unit drive unit of said chip join machine is configured to the state configuration that on the radial direction of said turntable, squints with respect to directly over the said parts holding unit.
If adopt the present invention, can access following good effect: the thermal impact when lowering assembling, and can utilize column-shaped projection to come to assemble efficiently electronic unit.
Description of drawings
Fig. 1 is the integrally-built vertical view of the apparatus for electronic parts assembling of expression execution mode of the present invention.
Fig. 2 is the end view that the column-shaped projection of the said apparatus for electronic parts assembling of expression forms device.
Fig. 3 representes that the column-shaped projection that adopts said column-shaped projection formation device to carry out forms the enlarged drawing of operation.
Fig. 4 is the integrally-built front view of the chip join machine of the said apparatus for electronic parts assembling of expression.
Fig. 5 A is the integrally-built end view of the said chip join machine of expression.
(a) of Fig. 5 B is the vertical view of the said chip join machine of expression, and (b) of Fig. 5 B is the figure of the open state of expression turntable (turret).
(a) of Fig. 6 is the cutaway view of the parts holding unit of observed from the side said chip join machine (b), and is the end view of parts holding unit drive unit and parts holding unit guiding device.
(a) of Fig. 7 is the end view of expression wave welding head of ultrasonic wave, and (b) of Fig. 7 is the upward view of expression wave welding head of ultrasonic wave, and (c) of Fig. 7 is the upward view of the vibrational state of expression wave welding head of ultrasonic wave.
The vertical view of the soldering tip tumbler of the arrow I direction observed chip join machine of (a) of Fig. 8 from Fig. 6 (a); (b) of Fig. 8 is the right view of said soldering tip tumbler, the front view of the II-II direction observed said soldering tip tumbler of (c) of Fig. 8 from Fig. 8 (a).
Fig. 9 is that expression utilizes the piezoelectric element of the sliding part mobile device of said chip join machine to make soldering tip rotate the figure of the state that moves with sliding part.
Figure 10 be in the parts holding unit of the said chip join machine of expression utilization the figure of method for detecting position of soldering tip retaining member of magnet.
(a)～(d) of Figure 11 is the electronic unit chip supplying device of said chip join machine and the vertical view of substrate feedway.
Figure 12 is the curve chart of the temperature cycles of the expression wafer substrate that adopts said apparatus for electronic parts assembling.
Wherein, description of reference numerals is following:
10 turntables
20 turntable CD-ROM drive motors
30 parts holding units
40 soldering tip tumblers
50 parts holding unit guiding devices
60 first screwdown gears
70 second screwdown gears
80 parts holding unit drive units
98 electronic unit sheets
100 chip join machines
200 column-shaped projections form device
210 tubules
220 heads
230 wave welding head of ultrasonic wave
240Z axle workbench
The 250X-Y workbench
260 wire clamps
270 gold threads
300 basal plate preheating devices
400 substrate slow cool down devices
500 substrate transfer apparatus
600 substrates are used box
610 wafer substrate
U supplies with the position
The V adsorbed state is confirmed the position
The W welding position
The T cleaning position
Embodiment
Below, with reference to accompanying drawing embodiment of the present invention is described.
Fig. 1 representes the overall structure of the apparatus for electronic parts assembling 900 of execution mode of the present invention.This apparatus for electronic parts assembling 900 has: chip join machine (chip bonder) 100; Column-shaped projection forms device 200; Basal plate preheating device 300; Substrate slow cool down device 400; Substrate transfer apparatus 500; Substrate is with box 600.In addition, accommodate many wafer substrate 610 that are used to install the electronic unit sheet at substrate in box 600.
Substrate transfer apparatus 500 with taking out wafer substrate 610 box 600, and forms carrying wafer substrate 610 between device 200, basal plate preheating device 300, the substrate slow cool down device 400 by the order of the arrow among the figure at chip join machine 100, column-shaped projection from substrate.Specifically, substrate transfer apparatus 500 is used manipulator for carrying wafers, and at the front end of the arm 510 that can carry out multi-stage expansion keeper 520 is installed.Substrate transfer apparatus 500 clamps wafer substrate 610 through keeper 520, and arm 510 is freely stretched and rotation, thereby can wafer substrate 610 be carried to target place.In this keeper 520, be built-in with temperature control heater (temperature control equipment), this temperature control heater carries out temperature control to this keeper 520, the temperature of the wafer substrate 610 when making the temperature of keeper 520 approach to clamp.In addition, in this execution mode, show the structure of whole wafer substrate 610 being carried, but the present invention is not limited thereto, also can utilizes many stylobates plate Handling device through 1 stylobate plate Handling device 500.
Basal plate preheating device 300 has preheating with heating plate 310.This preheating is heated with 310 pairs of contained above that wafer substrate of putting 610 of heating plate, and the temperature that makes wafer substrate 610 is in the scope of for example 80 degree～200 degree, preferably in the scope of 90 degree～180 degree.Be carried to column-shaped projection by the wafer substrate 610 of basal plate preheating device 300 preheatings through substrate transfer apparatus 500 and form device 200.
Shown in the enlarged drawing of Fig. 2, column-shaped projection forms device 200 to have: tubule (capillary) 210; Head 220; Wave welding head of ultrasonic wave 230; Z axle workbench 240; X-Y workbench 250; Wire clamp 260; Bobbin 280, gold thread 270 is used to reel; Heating plate 290; Sparking electrode 295 etc.
Tubule 210 is the hollow needle structure that opening is connected, so that gold thread 270 can insert and connect tubule 210.This tubule 210 remains on the front end of wave welding head of ultrasonic wave 230, makes tubule 210 carry out ultrasonic vibration.Wave welding head of ultrasonic wave 230 is fixed on the head 220, and this head 220 can move up at upper and lower through Z axle workbench 240.In addition, in head 220, be built-in with not illustrated especially ultrasonic vibrator, this ultrasonic vibrator applies ultrasonic vibration to wave welding head of ultrasonic wave 230.Wire clamp 260 is configured in the top of tubule 210, can clamp gold thread 270, makes gold thread 270 produce the tension force of regulation.Bobbin 280 is configured in the top of wire clamp 260, can emit gold thread 270.Sparking electrode 295 disposes with the mode of its front end near tubule 210.If between sparking electrode 295 and tubule 210, apply high voltage source, then between causes discharge, and make by this heat tubule 210 the lower end gold thread 270 fusions and become spherical.
Heating plate 290 is installed on X-Y workbench 250, uploads at this heating plate 290 and put wafer substrate 610.Thereby, through temperature maintenance the target temperature 80 degree～200 degree scopes in of this heating plate 290 with wafer substrate 610.
Shown in Fig. 3 (a), with regard to column-shaped projection forms device 200, after the lower end of tubule 210 forms gold goal 270A through fusion gold thread 270, as Fig. 3 (b) through making tubule 210 declines, with gold goal 270A by being pressed on the wafer substrate 610.At this moment, tubule 210 is vibrated, make gold goal 270A and wafer substrate 610 carry out ultrasonic wave and engage through ultrasonic wave.And then, such shown in Fig. 3 (c), clamp gold threads 270 through utilizing wire clamp 260, and wire clamp 260 is mentioned to the top, make between gold goal 270A and the gold thread 270 and break off, thereby form the column-shaped projection 270B of gold.Through this step, Yi Bian forming device 200, column-shaped projection utilize X-Y workbench 250 that wafer substrate 610 is moved, Yi Bian on whole zone, form a plurality of column-shaped projection 270B in order.During this period, also through heating plate 290 with the temperature maintenance of wafer substrate 610 in the temperature higher than normal temperature.
The wafer substrate 610 of having accomplished the formation of column-shaped projection 270B is carried to chip join machine 100 by substrate transfer apparatus 500.This handling time is set shortly, in 20 seconds, thereby the temperature of wafer substrate 610 is not almost descended, and can temperature decline be controlled in 20 degree.Thus, can avoid the temperature of wafer substrate 610 to reach normal temperature or below 60 degree.
Shown in the overall structure of Fig. 4 and Fig. 5 A, chip join machine 100 has: turntable 10; Turntable CD-ROM drive motor 20; Parts holding unit 30; Soldering tip tumbler 40; Portion's product holding unit guiding device 50; Parts holding unit drive unit 80; Drive unit base station 90 disposes parts holding unit drive unit 80 and turntable CD-ROM drive motor 20; Foot 95 keeps this drive unit base station 90.In addition, at this, come the position of attract electrons parts sheet 98 to be called the suction nozzle that utilizes parts holding unit 30 33 and supply with position U, the position that adsorbed electronic unit sheet 98 is welded on the wafer substrate 610 is called welding position W.
Carry to put and on the X-Y direction, move, supply with position U and be supplied to by the electronic unit chip supplying device 89 that constitutes by the X-Y workbench at the electronic unit sheet 98 on the pallet 96.Electronic unit sheet 98 in the location of supplying with position U through to carry out down: be based on the view data of the captured electronic component sheet 98 of the supply location confirmation camera 92 of top configuration, master control part (omitting diagram) moves electronic unit chip supplying device 89 on the X-Y direction.
Welding position W is positioned at a roughly opposite side with electronic unit chip supplying device 89 (the phase difference part that has 180 degree along the rotation mobile route of turntable 10) across the main shaft of chip join machine 100.Be provided with year a heating plate 97 of putting wafer substrate 610 and the substrate feedway 88 that this heating plate 97 is moved at this on the X-Y direction.88 pairs of substrate feedwaies carry the wafer substrate 610 of putting on heating plate 97 and position.This location is through carrying out to get off: the view data of the wafer substrate 610 that camera 94 is captured is confirmed in the welding position that is based on top configuration, and master control part (omitting diagram) moves substrate feedway 88 on the X-Y direction.
In supply position U on the rotation mobile route of parts holding unit 30 and the way of welding position W (is from supplying with the phase difference part that position U begins to have 90 degree at this), be provided with the absorption position affirmation camera of parts holding unit 30 being taken from downside 93.93 pairs of absorption of absorption position affirmation camera remain on the angle of the electronic unit sheet 98 on the suction nozzle 33 and take, and the view data that photographs is sent to master control part.Then, master control part makes soldering tip tumbler 40 begin action based on this view data, comes suction nozzle 33 is rotated control, so that make electronic unit sheet 98 be the angle of regulation.At this, will be called adsorbed state to the position of confirming by the adsorbed state (angle) of the electronic unit sheet 98 of suction nozzle 33 adsorbed maintenances and confirm position V.
In addition, (is the phase difference part that W begins to have 90 degree from the welding position at this) is provided with cleaning device 98 in the way of welding position W on the rotation mobile route of parts holding unit 30 and supply position U.Cleaning device 98 comes this front end of automated cleaning through the front end butt with suction nozzle 33.Thereby, can be during supplying with operation or weld job on welding position W or the supply position U at parts holding unit 30, the suction nozzle 33 of cleaning miscellaneous part holding unit 30 is safeguarded.In addition, at this, will be called cleaning position T through the position that 98 pairs of suction nozzles 33 of this cleaning device clean.
As above-mentioned, chip join machine 100 is carried the suction nozzle 33 that is arranged on the parts holding unit 30 through revolving-turret 10 according to the order of supplying with position U, adsorbed state affirmation position V, welding position W, cleaning position T.
Turntable 10 is for being the discoideus member of polygonal shapes such as disc-shape, pentagon or hexagon.Turntable 10 is a rotating shaft with the central shaft of self, is supported for and can rotates by turntable CD-ROM drive motor 20 with coaxial state.Its result, turntable 10 is rotated with the rotation of turntable CD-ROM drive motor 20 linkedly.In addition, turntable 10 is not limited to above-mentioned shape, for example also can be for having a plurality of star-like or starfish types that are the protuberance (arm) that radial outstanding mode forms with the outer peripheral face from cylinder laterally etc.
Turntable CD-ROM drive motor 20 uses DD motor (directly CD-ROM drive motor), carries out the location of turntable 10 on direction of rotation with the high angle precision.
Shown in Fig. 5 B (a), this turntable CD-ROM drive motor 20 is fixed on the drive unit base station 90 of top.This drive unit base station 90 is remained and can freely swing by foot 95.Therefore, when safeguarding turntable 10, shown in Fig. 5 B (b), swing to the top with respect to foot 95, make turntable 10 integral body open towards the top through making drive unit base station 90.
At circumferentially a plurality of uniformly-spaced to be provided with (is 4 at this) parts holding unit 30 of turntable 10, and have wave welding head of ultrasonic wave 32 at the downside of parts holding unit 30, this wave welding head of ultrasonic wave 32 has suction nozzle 33.In addition, this parts holding unit 30 is to be configured in the periphery of turntable 10 to the outstanding mode in the radial direction outside.So, a plurality of parts holding units 30 circumferentially between guaranteed space S.Its result, the supply location confirmation camera 92 of configuration above supply position U is looked accurate the opportunity that does not have parts holding unit 30, takes electronic unit chip supplying device 89 from the top via space S, carries out the location of electronic unit sheet 98.Likewise; The welding position of configuration confirms that there is not the opportunity of parts holding unit 30 in camera 94 glance standards above the W of welding position; Take wafer substrate 610 via space S; Come the column-shaped projection 270B that on wafer substrate 610, forming etc. is detected, so that electronic unit sheet 98 is welded on accurately on the position.
In addition, parts holding unit 30 is being configured under the inboard situation of turntable 10 radial directions, the formation opening waits and guarantees that same space S gets final product on turntable 10.That is, can make turntable 10 jagged to guarantee space S.
Parts holding unit 30 usefulness suction nozzles 33 adsorb and keep electronic unit sheet 98, or by the ultrasonic vibration of wave welding head of ultrasonic wave 32 with electronic unit sheet 98 ultrasonic bonding (ultrasonic wave joint) of adsorbed maintenance on wafer substrate 610.This suction nozzle 33 is formed with in inside and sucks path 33A, and is connected with not illustrated especially vacuum pump.Vacuum pump makes the front end of suction nozzle 33 produce negative pressure via sucking path 33A.Thus, suction nozzle 33 attract electrons parts sheet 33A.
As shown in Figure 6, parts holding unit 30 has: housing 31; Wave welding head of ultrasonic wave 32, soldering tip supporting member 34; Soldering tip force application apparatus 36; Soldering tip position detecting device 38.Wave welding head of ultrasonic wave 32 is supplied with by ultrasonic oscillator (omit diagram) has the for example signal of telecommunication of the frequency of 60kHZ frequency band, and is mechanical vibrational energy with this electrical signal conversion.
Axial region 34C, soldering tip force application apparatus 36, the soldering tip position detecting device 38 of the soldering tip supporting member of stating after in the accommodation space 31A of the inside of housing 31, accommodating 34.And then, in housing 31, being formed with slip path 31B, the axial region 34C of soldering tip supporting member 34 can be slidably inserted into and connect slip path 31B.In addition, accommodation space 31A and slip path 31B are connected, and in slip path 31B, are provided with supporting member 35, and this supporting member 35 is supported for axial region 34C can on above-below direction, to slide and can center on the axle center and rotates.In this execution mode, use ball bearing as supporting member 35.This supporting member 35 is arranged on two places up and down among the slip path 31B.Thus, soldering tip supporting member 34 can be all movable at above-below direction and direction of rotation with respect to housing 31.In addition, be provided with at the downside of accommodation space 31A and be used for case side magnet 36B is fixed on the case side magnet fixed part 31D on the housing 31.
Like (a) of Fig. 7 and (b), observe from the arrow I direction (above-below direction) of Fig. 6, the soldering tip main part 32X of wave welding head of ultrasonic wave 32 is roughly rectangular shape, and attenuates near the central part of length direction.In addition, the suction nozzle 33 of wave welding head of ultrasonic wave 32 forms from end face is outstanding downwards in the approximate center of the part that attenuates.On soldering tip main part 32X, 4 places of symmetry are formed with laminal connecting portion 32B on length direction and Width, and then, on this connecting portion 32B, form fixed part 32A.This fixed part 32A is fixed on the soldering tip installation portion 34A of soldering tip supporting member 34.Therefore, wave welding head of ultrasonic wave 32 only is connected on the soldering tip installation portion 34A of soldering tip supporting member 34 with fixed part 32A, on other parts, does not come in contact.Especially; On node (note) part of soldering tip main part 32X in becoming ultrasonic vibration; Keep through laminal connecting portion 32B, the vibration attenuation that is therefore caused by connecting portion 32B does not almost have, thereby can positively carry out the ultrasonic vibration based on the signal of telecommunication of input.For example; If the signal of telecommunication of the frequency of regulation inputs to wave welding head of ultrasonic wave 32 from ultrasonic oscillator; Then shown in Fig. 7 (c), soldering tip main part 32X goes up and continuous shaking in the face vertical with the absorption direction at the left and right directions (arrow B, C direction) of this figure by the strain of connecting portion 32B.In addition, on soldering tip main part 32X, being formed with the position of connecting portion 32B, is exactly the desired location of the point of vibration (amplitude) minimum under vibration mode.
In addition, in this execution mode, wave welding head of ultrasonic wave 32 shape near suction nozzle 33, attenuating, and then, with the circumferential vertical direction of turntable 10 on carry out ultrasonic vibration mode set.That is the mode that, is in the radial direction of turntable 10 with the length direction of wave welding head of ultrasonic wave 32 disposes.Its result, owing to form rich space in the circumferential front and back along turntable 10 of suction nozzle 33, so for example can also be along the more parts holding unit 30 of the circumferential configuration of turntable 10.In addition, as said, when the supply location confirmation camera 92 of configuration or welding position confirm that camera 94 is taken above this turntable 10, if wave welding head of ultrasonic wave 32 extends on radial direction and then can not cause obstruction.That is, supply with location confirmation camera 92 or welding position and confirm that camera 94 when not existing, carries out image recognition to the electronic component sheet on wafer substrate 610 or the pallet 96 98 at the wave welding head of ultrasonic wave 32 (parts holding unit 30) that upwards moves in week through turntable 10.
Return Fig. 6, soldering tip supporting member 34 has: above-mentioned axial region 34C and the soldering tip installation portion 34A that forms continuously in the lower end of this axial region 34C.Soldering tip installation portion 34A expands with respect to axial region 34C diametrically.In addition, the upper end side (second screwdown gear, 70 sides) at soldering tip supporting member 34 has to the inboard expansion board 34D that extends of the radial direction of turntable 10.The upper surface of this expansion board 34D becomes the compression zone 34B that is depressed by second screwdown gear 70.Like this, through being configured in the expansion board 34D that extends on the radial direction, can make parts holding unit drive unit 80 offset configuration on radial direction.In addition, be provided with soldering tip side magnet fixed part 34D, with the fixing soldering tip side magnet 36A of soldering tip force application apparatus 36 at the downside of compression zone 34B (expansion board 34D).On the lateral surface of soldering tip installation portion 34A, be provided with the holding section 34E of the roughly L shaped shape that fastens with soldering tip tumbler 40.
Soldering tip force application apparatus 36 has: soldering tip side magnet 36A and the case side magnet 36B that disposes at this soldering tip side magnet 36A downside.Soldering tip side magnet 36A forms ring-type, inserts the axial region 34C that is connected with soldering tip supporting member 34, and is fixed on the projection that midway forms of soldering tip supporting member 34.This projection becomes soldering tip side magnet fixed part.Case side magnet 36B forms ring-type; The state that has the slit with the axial region 34C with respect to soldering tip supporting member 34 is inserted the axial region 34C that is connected with soldering tip supporting member 34; And be fixed on the case side magnet fixed part 31C, this case side magnet fixed part 31C is formed among the accommodation space 31A of housing 31.Soldering tip side magnet 36A and case side magnet 36B with identical magnetic pole against each other (for example the S utmost point and S extremely relatively or the N utmost point extremely relative with N) mode dispose.Repel each other between soldering tip side magnet 36A and the case side magnet 36B.By this repulsive force, soldering tip supporting member 34 with respect to housing 31 by to the upside application of force and magnetic suspension.
The changes of magnetic field of 38 pairs of soldering tip sides of soldering tip position detecting device magnet 36A or case side magnet 36B detects and converts into the signal of telecommunication.In addition, in this execution mode, use Hall element as soldering tip position detecting device 38.In Fig. 6, soldering tip position detecting device 38 is arranged on the mode that approaches soldering tip side magnet 36A on the sidewall of accommodation space 31A of housing 31.Shown in Figure 10 (a), with regard to soldering tip side magnet 36A, the S utmost point and the N utmost point polarize on above-below direction, and magnetic field B acts on soldering tip position detecting device 38.The Strength Changes of the magnetic field X of 38 pairs of horizontal directions of soldering tip position detecting device detects.Shown in Figure 10 (b),, then, therefore can detect its change in location as quick as thought owing to the intensity that acts on the magnetic field B of soldering tip position detecting device 38 changes if soldering tip side magnet 36A rises.Like this, 38 pairs of soldering tip position detecting devices based on the variable in distance between itself and the soldering tip side magnet 36A and the field variation that takes place detect, and convert this variation into the signal of telecommunication.In addition, soldering tip position detecting device 38 sends to master control part (omitting diagram) with the signal of telecommunication.Master control part can detect soldering tip supporting member 34 with respect to the variation in altitude of housing 31 at above-below direction based on the signal of telecommunication that receives from soldering tip position detecting device 38.Its result in when welding, can clock like precision ground detects whole parts holding unit 30 declines and make electronic unit sheet 98 touch the moment of wafer substrate 610 of sening as an envoy to.
Use Fig. 8 that soldering tip tumbler 40 is described.(a) of Fig. 8 is that (b) of Fig. 8 is the right view of this soldering tip tumbler 40 from the plane graph of the observed soldering tip tumbler 40 of arrow I direction of Fig. 6, the front view of II-II direction observed this soldering tip tumbler 40 of (c) of Fig. 8 from Fig. 8 (a).
Soldering tip tumbler 40 rotates soldering tip supporting member 34 through soldering tip is rotated with sliding part about 42 (the arrow D of Fig. 8 (a) or E direction) slip, and wherein, soldering tip rotates and engages with the holding section 34E of soldering tip supporting member 34 with sliding part 42.Its result makes suction nozzle 33 in perpendicular to the face of absorption direction, rotate (the arrow F of Fig. 8 (a) or G direction).Soldering tip tumbler 40 has: above-mentioned soldering tip rotates with sliding part 42; Sliding part bracing or strutting arrangement 44 is supported for the soldering tip rotation can be free to slide from a side with sliding part 42; Sliding part mobile device 46 makes soldering tip rotate with sliding part 42 and in the face perpendicular to the absorption direction, slides with sliding part bracing or strutting arrangement 44 interlocks; Slide positions checkout gear 48, the slippage that soldering tip is rotated with sliding part 42 detects.
Soldering tip rotates and uses sliding part 42 for roughly being the annular board member of C.Soldering tip rotates with sliding part 42 has supporting surface 42A and by drive surface 42B.Supporting surface 42A become with sliding part bracing or strutting arrangement 44 in the contacted position of bearing 44A.
In addition, soldering tip rotates being connected by drive surface 42B and the protuberance 47A that on the piezoelectric element 47 of sliding part mobile device 46, forms with sliding part 42.Therefore, soldering tip rotates with sliding part 42 by bearing 44A and protuberance 47A clamping.The protuberance 47A of piezoelectric element 47 utilizes to make by drive surface 42B with the frictional resistance by between the drive surface 42B of sliding part 42 with the soldering tip rotation and slides.
Sliding part bracing or strutting arrangement 44 has: bearing 44A such as ball bearing, leaf spring 44B, housing screw 44C, leaf spring fixed station 44D, pillow block 44E, retainer shaft 44F, pedestal 41.
Pedestal 41 is square tubular, and inside accommodates the piezoelectric element 47 of sliding part mobile device 46.This pedestal 41 is provided with two pillow block 44E, 44E.Maintain retainer shaft 44F at said pillow block 44E, the last state of 44E with separation.Retainer shaft 44F is provided with bearing 44A.
Leaf spring fixed station 44D is arranged on the substantial middle place of pedestal 41.Leaf spring 44B is fixed on the leaf spring fixed station 44D through two housing screw 44C, 44C.Retainer shaft 44F is pressed to pillow block 44E thruster by the elastic force of leaf spring 44B.
Say that at length retainer shaft 44F is set to can move up at the upper and lower of Fig. 8 (c) with respect to pillow block 44E.Through utilizing leaf spring 44B that retainer shaft 44F is pressed to pillow block 44E thruster, bearing 44A is rotated with the sliding part 42 side application of forces to soldering tip.Its result, soldering tip rotates and is sandwiched by the protuberance 47A of sliding part mobile device 46 and bearing 44A with sliding part 42.Its result, as long as protuberance 47A does not move, then soldering tip rotates and just is in the state that can not slide with sliding part 42.In addition, constitute so-called pressing device by leaf spring 44B, housing screw 44C and leaf spring fixed station 44D.
Sliding part mobile device 46 has piezoelectric element 47, and this piezoelectric element 47 is supported on the pedestal 41 and can vibrates.Say that at length this piezoelectric element 47 is built-in with a pair of piezoelectric element sheet 47B, and each piezoelectric element sheet 47B is applied the periodic voltage of the 90 degree phase places that staggered each other.
Piezoelectric element 47 is provided with to soldering tip and rotates with the outstanding protuberance 47A of sliding part 42 directions.As if the voltage that applies the phase difference with 90 degree for two above-mentioned piezoelectric element sheet 47B, then as shown in Figure 9, this protuberance 47A moves to be rotated at a high speed along elliptic orbit.And this direction of rotation can suitably be reversed.If utilize the elliptic orbit of this protuberance 47A, soldering tip is rotated with sliding part 42 on two directions about Fig. 9, move.
According to above result, through piezoelectric element 47 is imported periodically variable positive voltage or negative voltage continuously, slide, thereby make suction nozzle 33 rotate the angle of regulation thereby soldering tip is rotated with sliding part 42.
In addition, as shown in Figure 8, soldering tip tumbler 40 has the slide positions checkout gear 48 that is made up of magnet 48A and Hall element 48B.Magnet 48A is arranged on soldering tip and rotates with on the sliding part 42, and Hall element 48B is arranged on the pedestal 41.Magnet 48A is relative with Hall element 48B, rotates with sliding part 42 under the situation that right and left moves up at soldering tip, and the distance between magnet 48A and the Hall element 48B changes, thus the also change of magnetic field around the Hall element 48B.Hall element 48B detects this field variation and converts the signal of telecommunication into and sends to master control part (omitting diagram).Master control part is based on the signal of telecommunication that receives from Hall element 48B, and the sliding position that soldering tip is rotated with sliding part 42 detects.Master control part is based on detected positional information, and the control soldering tip rotates with sliding part 42 and moves up at right and left.In addition, be used for making power supply and the circuit etc. of Hall element 49B and piezoelectric element 47 actions to be installed in the substrate box 49 that is fixed on the pedestal 41.
Return Fig. 6, parts holding unit guiding device 50 is arranged between turntable 10 and the parts holding unit 30.This parts holding unit guiding device 50 is direct acting devices, comprising: guide rail 52 sets in turntable 10 peripheries along the vertical direction; Sliding body 54 engages also and can slide with guide rail 52; Workbench 56 is fixed on this sliding body 54; Parts holding unit top force application apparatus 58, always with this workbench 56 to the top application of force.
Workbench 56 is the tabular component of L type, on the one side of L type, is fixed with the housing 31 of parts holding unit 30, on another side, is formed with and is used for the compression zone 56A that depressed by first screwdown gear 60.Therefore, if the pushing member 68 of first screwdown gear 60 is depressed the compression zone 56A of workbench 56, then with workbench 56 and whole parts holding unit 30 guiding downwards together.
Parts holding unit top force application apparatus 58 be with this workbench 56 with respect to turntable 10 always to the device of the top application of force.Say that at length parts holding unit top force application apparatus 58 has: urceolus 58A, be fixed in the upper surface of turntable 10; Compression spring 58C, configuration between turntable 10 and workbench 56; Shaft component 58B, keeping should compression spring 58C.The upper end of shaft component 58B is fixed on the workbench 56, and the lower end can be slidably inserted into the inside of urceolus 58A.In addition, for compression spring 58C, an end is connected on the turntable 10, and the other end is connected on the workbench 56, and is compressive state.Therefore, compression spring 58C to workbench 56 to the top application of force.Thus, only otherwise be endowed external force from parts holding unit drive unit 80, parts holding unit 30 just always up side be inactive state.
Parts holding unit drive unit 80 has: first screwdown gear 60 and second screwdown gear 70.In addition, parts holding unit drive unit 80 is installed on the drive unit base station 90.Said parts holding unit drive unit 80 be configured in respectively at the state that squints on the radial direction absorption position U and welding position W above.In addition, in this execution mode, through to the inboard offset configuration parts of radial direction holding unit drive unit 80, thus make parts holding unit 30 directly over space opening.Its result for example, can avoid 80 pairs of shooting directions of supplying with location confirmation camera 92 of parts holding unit drive unit to interfere.
First screwdown gear 60 has: motor 62, cam 64, the second screwdown gear guide 66, pushing member 68.
The second screwdown gear guide 66 is a direct acting device, comprises that guide rail 66A, sliding body 66B, workbench 66C, cam bear member 66D.Guide rail 66A is arranged on the guide rail installation portion 90A of drive unit base station 90 along the vertical direction.Engaging has sliding body 66B on guide rail 66A, and sliding body 66B can slide.On sliding body 66B, be fixed with workbench 66C.In addition, on workbench 66C, be fixed with second screwdown gear 70, cam bears member 66D and pushing member 68.
Cam 64 is the flat cam on the output shaft 62A that is fixed on motor 62, bears member 66D at certain position that rotates a circle and cam and connects, and bears member 66D thereby depress cam.Therefore, first screwdown gear 60 bears member 66D and depresses workbench 66C through depressing cam.
Pushing member 68 is the rod member that is provided with the following side-prominent mode to workbench 66C.This pushing member 68 is depressed the compression zone 56A that on the workbench 56 of parts holding unit guiding device 50, forms.Therefore, pushing member 68 can be depressed workbench 56 with whole parts holding unit 30.
The voice coil motor 74 that second screwdown gear 70 has the base station 76 on the workbench 66C that is fixed on first screwdown gear 60 and on base station 76, fixes.Voice coil motor 74 can move the output shaft 72 in the front setting with predefined pressure (active force) according to the voltage of being imported.The output shaft 72 of voice coil motor 74 is configured in the top of the compression zone 34B of soldering tip supporting member 34, and wherein soldering tip supporting member 34 is arranged on portion's product holding unit 30.Therefore, voice coil motor 74 can descend through making output shaft 72, with the expansion board 34D that tries hard to recommend pressure-welding head supporting member 34 (compression zone 34B) of any size.In addition, as having narrated, owing to make expansion board 34D to the inboard expansion of radial direction, thus its result, can be to the inboard offset configuration voice coil motor 74 of radial direction.
Shown in Fig. 6 (a), parts holding unit drive unit 80 is depressed parts holding unit 30 integral body through first pressing device 60.And in the moment that electronic unit sheet 98 and wafer substrate 610 connect, soldering tip retaining member 34 relatively moves to the top with respect to housing 31.If soldering tip retaining member 34 relatively moves to the top with respect to housing 31, then soldering tip position detecting device 38 detects this as quick as thought and moves, and the signal of telecommunication is sent to master control part (omitting diagram), and first pressing device 60 is stopped.In addition; In this execution mode; Soldering tip retaining member 34 is magnetic suspension state by magnetic force (repulsive force between soldering tip side magnet 36A and the case side magnet 36B); Even therefore soldering tip retaining member 34 is being applied under the situation of minimum external force, it is relatively moved with respect to housing 31 apace.Therefore,, can constitute the structure of extremely miniaturization based on magnetic suspension that utilizes magnet to produce and the position probing that the magnetic force that utilizes this magnet carries out, and mitigation impact that wafer substrate 610 and column-shaped projection 270B are caused.
After detecting relatively moving of soldering tip retaining member 34, the output shaft 72 of the voice coil motor 74 of second screwdown gear 70 is descended through soldering tip position detecting device 38.By the output shaft 72 of voice coil motor 74, the compression zone 34B of soldering tip supporting member 34 is applied the pushing force of regulation.For example apply as follows as this pushing force: since the 0 linear pushing force that increases, finally reach 4 newton " N " at first.Thus, give the pushing force of regulation, can electronic unit sheet 98 be pressed on the column-shaped projection 270B with the pressure of regulation to suction nozzle 33 fixing on soldering tip supporting member 34.With the increase interlock of this pushing force, the amplitude of ultrasonic vibration is also increased since 0 linearity, thereby electronic unit sheet 98 is welded with column-shaped projection 270B mutually.In addition, the pushing force that 74 pairs of soldering tip supporting members 34 of voice coil motor apply can be set arbitrarily according to the voltage that inputs to voice coil motor 74.
< welding action >
Next, with reference to Figure 11, the action of the installation procedure of the electronic unit sheet 98 that carries out through chip join machine 100 is described.In addition, in this Figure 11, illustration on chip join machine 100, have a situation of 6 parts holding units 30.
In addition, in (a) of Figure 11, will be in the parts holding unit of supplying with position U and be defined as parts holding unit 30A, and as benchmark by being defined as parts holding unit 30B～30F clockwise.Become adsorbed state and confirm position V with respect to supplying with the advanced position of 60 degree of position U, confirm that from adsorbed state V the readvanced position of 120 degree in position becomes welding position W.From the welding position W readvance 60 the degree the position become cleaning position T.
At first, electronic unit chip supplying device 89 makes electronic unit sheet 98 move to the supply position U of regulation.At this moment; Master control part (omitting diagram) is through supplying with location confirmation camera 92; Position to the electronic unit sheet 98 supplied with by electronic unit chip supplying device 89 is taken, and judges whether electronic unit sheet 98 is supplied with on the position of regulation based on the view data that photographs.Master control part departs under the situation of supply position U of regulation being judged to be electronic unit sheet 98, and control electronic unit chip supplying device 89 makes electronic unit sheet 98 move to the supply position U of regulation.In addition, be to look standard not exist carry out the opportunity of parts holding unit 30B～30F up through the shooting of supplying with 92 pairs of electronic unit sheets 98 of location confirmation camera.
Shown in Figure 11 (a), chip join machine 100 adsorbs by the suction nozzle 33 of parts holding unit 30A and keeps being supplied to the electronic unit sheet 98 supplying with on the U of position.After absorption keep to be accomplished, further make turntable 10 rotations 60 degree, the electronic component sheet 98 of parts holding unit 30A is carried to adsorbed state confirms position V (with reference to (b) of Figure 11).Then, master control part confirms that through absorption position camera 93 confirms that to being carried to adsorbed state the absorption angle of the electronic unit sheet 98 of position V takes from downside.Master control part is based on the view data that photographs, and judges that electronic unit sheet 98 is whether from the angle deviating of regulation.Master control part (omitting diagram), drives soldering tip tumbler 40 suction nozzle 33 is rotated under the situation of the angle deviating of regulation in the maintenance angle that is judged to be electronic unit sheet 98, adjusts the angle of electronic unit sheet 98.
In addition, at this moment, chip join machine 100 adsorbs maintenance and is supplied to the next electronic unit sheet of supplying with on the U of position 98 by electronic unit chip supplying device 89 through the suction nozzle 33 of parts holding unit 30B.
Chip join machine 100 further makes turntable 10 rotations 120 degree; With the electronic unit sheet 98 of the suction nozzle 33 adsorbed maintenances of parts holding unit 30A, be carried to by substrate feedway 88 and supply with directly over the wafer substrate on the W of welding position 610 (with reference to (c) of Figure 11).Master control part is confirmed camera 94 through the welding position; The position of column-shaped projection 270B on the wafer substrate 610 that substrate feedway 88 is supplied with is taken; And, judge whether column-shaped projection 270B is configured on the welding position W of regulation based on the view data that photographs.Master control part departs under the situation of welding position W of regulation being judged to be column-shaped projection 270B, and control basal plate feedway 88 moves wafer substrate 610.In addition, the welding position confirms that the shooting of 94 couples of column-shaped projection 270B of camera is to look standard not exist carry out the opportunity of parts holding unit 30B～30F up.Under this state, the electronic component sheet of parts holding unit 30A 98 is carried out ultrasonic wave with column-shaped projection 270B engage.
In addition, at this moment,, confirm on the V of position that master control part is taken through the electronic unit sheet 98 of confirming 93 pairs of parts holding units of camera 30C with absorption position, checks and adjust the angle of electronic unit sheet 98 at adsorbed state with above-mentioned same.In addition, parts holding unit 30D adsorbs being supplied with at the electronic unit sheet of supplying with on the U of position 98 by electronic unit chip supplying device 89.
Afterwards, shown in Figure 11 (d), chip join machine 100 further makes turntable 10 rotations 60 degree, and the parts holding unit 30A that has accomplished the ultrasonic bonding operation is carried to cleaning position T.On this cleaning position T, as required, clean through the front end that grinds etc. suction nozzle 33.Because the front end of suction nozzle 33 is easily because of uneven wear takes place in ultrasonic bonding, therefore, if carry out the weld job of stipulated number, then smoothness can variation.Therefore, handle, front end always is maintained level through such cleaned at regular intervals.In addition, though this cleaning operation can all be carried out at every turn, preferably carry out with the predefined cycle.In addition, even carry out in the process of cleaning at the suction nozzle 33 to parts holding unit 30A, parts holding unit 30B also can be connected on 98 supersonic weldings of electronic unit sheet on the wafer substrate 610 on the W of welding position.
Afterwards, chip join machine 100 carries out and above-mentioned same action parts holding unit 30B～30F repeatedly, comes electronic unit sheet 98 and wafer substrate 610 are carried out ultrasonic bonding.
In chip join machine 100, for whole column-shaped projection 270B of wafer substrate 610 all ultrasonic wave engage after the electronic unit sheet 98, through substrate transfer apparatus 500 this wafer substrate 610 is carried to substrate slow cool down device 400.This substrate slow cool down device 400 has slow cool down with heating plate 410.This slow cool down heats carrying the wafer substrate 610 of putting above that with heating plate 410 on one side, with than natural cooling slow cooling rate reduce temperature on one side.Temperature takes place sharply to descend when having suppressed cooling wafer substrate 610 thus.By substrate slow cool down device 400 slow cool downs and reach the wafer substrate 610 of normal temperature, return to substrate with in the box 600 through substrate transfer apparatus 500.
Next, with reference to the temperature cycles curve of the wafer substrate 610 of Figure 12, the assembly method of the electronic unit that is undertaken by this apparatus for electronic parts assembling 900 is described.
At first,, come wafer substrate 610 is heated in advance, make temperature begin to rise from normal temperature through basal plate preheating device 300 as the basal plate preheating operation.Its result, shown in temperature cycles curve A-B of Figure 12, wafer substrate 610 is heated to target temperature till.Carrying out between warming up period, another wafer substrate 610 before this wafer substrate 610 is present in column-shaped projection and forms in the operation (afterwards stating), has therefore not only shortened the circulation timei of assembling, can also carry out preheating with slow rate of rise in temperature.Through temperature is changed reposefully, can make the bulk temperature of wafer substrate 610 distribute maintenance always evenly.For example, with regard to the wafer substrate of pyroelectricity materials such as lithium tantalate material, if temperature distributing disproportionation is even; Or the bulk temperature pace of change is big; Or the big temperature difference of local generation, then, can break owing to the difference of thermal expansion or by the surface charge change that pyroelectric effect produces.Glass substrate too.Therefore, through slow preheating as this execution mode, suppressed the breakage of wafer substrate 610.Its result, for example the thickness of wafer substrate also can be for below the 1mm, even below the 0.4mm.Therefore, if come to heat lentamente, then can improve the rate of finished products of assembly process through this basal plate preheating operation.In addition, the target temperature of preferred wafer substrate 610 is more than 80 degree.
After preheating is accomplished; Form operation as column-shaped projection; Make wafer substrate 610 move to column-shaped projection and form device 200, on one side wafer substrate 610 heating are maintained target temperature (than the high temperature of normal temperature), a plurality of column-shaped projection 270B on whole zone, formed on one side successively.Therefore, shown in temperature cycles curve B-C of Figure 12, during column-shaped projection forms operation, wafer substrate 610 is maintained target temperature.After column-shaped projection forms the operation completion, be transferred to electronic unit sheet installation procedure.
Say that at length electronic unit sheet installation procedure has the board carrying operation and ultrasonic wave engages operation.In the board carrying operation, after column-shaped projection forms operation, this wafer substrate 610 is dropped in the time range of the such state of normal temperature can keeping, wafer substrate 610 is formed device 200 from column-shaped projection be carried to chip join machine 100.At this moment, preferably the temperature slippage is maintained Min., therefore fast as far as possible carrying is very important.The mode that does not preferably become below 60 degree with the temperature of wafer substrate 610 is carried, and more preferably carries with the mode that does not become below 80 degree.Though not special diagram for the temperature that suppresses accurately in the carrying descends, also can be provided with heating plate on substrate transfer apparatus 500.After the carrying of wafer substrate 610 is accomplished, engage in the operation at ultrasonic wave, on one side wafer substrate 610 is heated, the positioning of electrode with column-shaped projection 270B and electronic unit sheet 98 comes both are carried out the ultrasonic wave joint on one side.
Promptly; In this electronic unit sheet installation procedure; Through column-shaped projection being formed the wafer substrate 610 of device 200, be carried to chip join machine 100 the temperature slippage is controlled at 20 degree as early as possible with interior state, and continue 610 heating of this wafer substrate; Keep the state that does not make temperature drop to normal temperature, and electronic unit sheet 98 is installed by chip join machine 100.Therefore; Shown in temperature cycles curve C-D of Figure 12; Owing in electronic unit sheet installation procedure, also make wafer substrate 610 maintain target temperature; So can keep column-shaped projection 270B not produce the state of the stress that causes by variations in temperature, column-shaped projection 270B carried out ultrasonic wave with electronic unit sheet 98 engage.Its result when ultrasonic wave engages, can relax the external force that puts on the wafer substrate 610.
In addition, after electronic unit sheet installation procedure is accomplished, be transferred to substrate slow cool down operation, make wafer substrate 610 to dispel the heat than putting cold slow temperature decrease speed naturally through substrate slow cool down device 400.Its result, shown in temperature cycles curve D-E of Figure 12, the temperature of wafer substrate 610 descends.As narrating, change reposefully through the temperature that makes wafer substrate 610, can make the bulk temperature of wafer substrate 610 distribute maintenance always evenly, and suppress the breakage of wafer substrate 610.
More than; If adopt the apparatus for electronic parts assembling 900 of this execution mode; Then, suppress wafer substrate 610 and become normal temperature, prevent to give repeatedly thermal cycle wafer substrate 610 and column-shaped projection 270B through forming operation from column-shaped projection during the electronic unit sheet installation procedure.Its result, owing to can reduce the thermal stress that on wafer substrate 610 and column-shaped projection 270B, applies, thus can improve the quality of electronic unit.And then; With regard to the substrate transfer apparatus 500 of carrying wafer substrate 610; Mounting temperature control heater (temperature control equipment) on the keeper 520 that keeps wafer substrate 610; Through when keeper 520 is contacted with wafer substrate 610, reducing both temperature differences, suppress wafer substrate 610 parts and cooled off and breakage takes place.
For example; As if being applied, wafer substrate 610 comprises the normal temperature state in interior repeatedly thermal cycle; The metal wiring that then on the surface of wafer substrate 610, forms easy deteriorations such as (being used to form the base electrode of column-shaped projection 270B), or cause wafer substrate 610 damaged probability to rise by variations in temperature.In addition, place a little while at normal temperatures, then on the surface of column-shaped projection 270B, can form oxide-film, thereby the quality that the ultrasonic wave after making it easily engages descends if will accomplish the wafer substrate 610 of column-shaped projection formation operation.If will improve quality, then also can require oxide-film to remove operation, that is, before electronic unit sheet installation procedure, already oxidised column-shaped projection 270B is carried out plasma treatment, remove this oxide-film.
On the other hand; In the apparatus for electronic parts assembling 900 of this execution mode, owing to before the surface of column-shaped projection 270B forms oxide-film, directly electronic unit sheet 98 is carried out ultrasonic wave and engage; Therefore can omit oxide-film and remove operation, thus the productivity of significantly improving.
And then in this apparatus for electronic parts assembling 900, chip join machine 100 is a turntable structure, upwards disposes a plurality of suction nozzles 33 in the week of turntable 10.Its result can carry out the supply of electronic unit sheet 98 extremely at high speed and electronic unit sheet 98 is installed in the operation of wafer substrate 610.Its result directly is carried to chip join machine 100 even wafer substrate 610 is formed device 200 from column-shaped projection, also can reduce both actuation cycle time differences, therefore makes the assembling work high efficiency.
In addition, in processes such as adsorption operation that carries out electronic unit sheet 98 or weld job, can also carry out the maintenance of suction nozzle 33 at the cleaning position T of chip join machine 100.Its result owing to can reduce the movable dwell time of chip join machine 100, therefore, even between column-shaped projection formation device 200 and chip join machine 100, work continuously, also can suppress the decline of running efficiency.
In addition, with regard to this chip join machine 100, with parts holding unit drive unit 80 with respect to turntable 10 independently fixed configurations at the upside of supplying with position U and welding position W.Therefore, there is no need parts holding unit drive unit 80 to be set one by one, thereby can alleviate the weight of turntable 10 corresponding to whole parts holding units 30.Its result owing to can reduce the inertia (inertia) of turntable 10, therefore can improve the rotation degree of turntable.
And then the soldering tip force application component 36 of chip join machine 100 utilizes repulsive force or the attraction between soldering tip side magnet 36A and the case side magnet 36B to make soldering tip supporting member 34 to the top magnetic suspension.Its result with the contrast of utilizing spring to wait to keep, can utilize less external force to make soldering tip supporting member 34 fast moving.Therefore, when electronic unit sheet 98 is contacted with column-shaped projection 270B, can the impact of absorption on wafer substrate 610.Be employed in the concentrated column-shaped projection 270B that forms of wafer substrate 610 sides; And when on column-shaped projection 270B, continuously the method for electronic unit sheet 98 being installed; Utilize the above-mentioned magnetic suspension structure of the chip join machine 100 of this execution mode; Make the impact that acts on the wafer substrate 610 become minimum, this helps to improve the quality of electronic unit.
Especially, with regard to this chip join machine 100, use soldering tip position detecting device 38, come to detect accurately the position of soldering tip supporting member 34 with respect to housing 31 with Hall element.Its result can high accuracy and detect apace moment of absorption keeps on suction nozzle 33 electronic unit sheet 98 and the preceding end in contact of column-shaped projection 270B.
In addition, wave welding head of ultrasonic wave 32 disposes with the mode of on the radial direction of turntable 10, carrying out ultrasonic vibration.Therefore, on turntable 10, improve circumferential space efficiency, thereby can increase the number of configured of wave welding head of ultrasonic wave 32.
Electronic parts mounting methods of the present invention etc. are applicable to the various operations of assembling electronic unit.

Claims (20)

1. an electronic parts mounting method is characterized in that, comprising:
Column-shaped projection forms operation, on one side substrate is heated to be the temperature higher than normal temperature, form device forms metal on said substrate column-shaped projection through column-shaped projection on one side,
Electronic unit sheet installation procedure after forming said column-shaped projection, is kept the state that the temperature that does not make said substrate drops to normal temperature, utilizes the chip join machine on the said column-shaped projection of said substrate, to dispose the electronic unit sheet and carry out ultrasonic wave to engage.
2. electronic parts mounting method as claimed in claim 1 is characterized in that, before said column-shaped projection forms operation, comprises the basal plate preheating operation that in advance said substrate is heated.
3. according to claim 1 or claim 2 electronic parts mounting method is characterized in that, after said electronic unit sheet installation procedure, comprises making said substrate with than putting the substrate slow cool down operation that cold slower temperature decrease speed is dispelled the heat naturally.
4. like each described electronic parts mounting method in the claim 1 to 3, it is characterized in that said electronic unit sheet installation procedure comprises:
The board carrying operation; After said column-shaped projection forms operation, in the special time scope, said substrate is formed device from said column-shaped projection be carried to said chip join machine; Wherein, Said special time scope is meant, can keep the time range that the temperature that does not make said substrate drops to the state of normal temperature
Ultrasonic wave engages operation, after the said substrate of carrying, on one side said substrate is heated, said electronic unit sheet is carried out ultrasonic wave on one side and engage.
5. component mounting method as claimed in claim 4; It is characterized in that; In the said board carrying operation of said electronic unit installation procedure; The variations in temperature with said substrate be controlled at 20 degree with interior state under, said substrate is formed device from said column-shaped projection is carried to said chip join machine.
6. like claim 4 or 5 described component mounting methods; It is characterized in that; In the said board carrying operation of said electronic unit installation procedure; Keep the maintaining part of said substrate to carry out temperature control to being used in the substrate transfer apparatus on one side,, thus said substrate is formed device from said column-shaped projection and be carried to said chip join machine Yi Bian move said substrate.
7. like each described electronic parts mounting method in the claim 1 to 6, it is characterized in that,
Form in the operation at said column-shaped projection, said substrate be heated to more than 80 degree,
In said electronic unit sheet installation procedure, after forming said column-shaped projection, keep under the situation that the temperature that does not make said substrate drops to the state below 60 degree, said electronic unit sheet and said column-shaped projection are carried out the ultrasonic wave joint.
8. apparatus for electronic parts assembling is characterized in that having:
Column-shaped projection forms device, has the heating plate that substrate is heated to be the temperature higher than normal temperature, and on the said substrate that is heated, forms the column-shaped projection of metal;
The chip join machine after forming said column-shaped projection, is kept the state that the temperature that does not make said substrate drops to normal temperature, on the said column-shaped projection of said substrate, disposes the electronic unit sheet and carry out ultrasonic wave to engage.
9. apparatus for electronic parts assembling as claimed in claim 8 is characterized in that, has the basal plate preheating device, after said substrate is heated in advance, said substrate is moved into to said column-shaped projection formation device.
10. like claim 8 or 9 described apparatus for electronic parts assembling; It is characterized in that; Have substrate slow cool down device, this substrate slow cool down device makes the said substrate of taking out of from said chip join machine to dispel the heat than putting cold slower temperature decrease speed naturally.
11., it is characterized in that said chip join facility have like each described apparatus for electronic parts assembling in the claim 8 to 10:
Substrate transfer apparatus drops to the state of normal temperature not make said substrate, said substrate is formed device from said column-shaped projection be carried to said chip join machine;
Engage the pusher side heating plate, said substrate is heated.
12. apparatus for electronic parts assembling as claimed in claim 11 is characterized in that, said substrate transfer apparatus has temperature control equipment, and said temperature control equipment keeps the maintaining part of said substrate to carry out temperature control to being used to.
13. like each described apparatus for electronic parts assembling in the claim 8 to 12, it is characterized in that,
Said chip join facility have:
Turntable, being supported for can be that rotating shaft is rotated with the central shaft,
The turntable CD-ROM drive motor, its output shaft is connected with said turntable,
The parts holding unit, circumferentially being provided with of said turntable is a plurality of, is used to keep the electronic unit sheet, and this electronic unit sheet is welded on the cooperation side member,
Parts holding unit guiding device is arranged between said turntable and the said parts holding unit, is used to guide said parts holding unit to move freely on above-below direction with respect to said turntable,
Parts holding unit drive unit is arranged on the upside of said parts holding unit, through pushing said parts holding unit, this parts holding unit is moved towards the below;
Said parts holding unit has:
Wave welding head of ultrasonic wave is provided with the suction nozzle that is used to adsorb said electronic unit sheet;
The soldering tip supporting member is supported for said wave welding head of ultrasonic wave and can carries out ultrasonic vibration;
Housing is can be in the enterprising line slip of above-below direction with said soldering tip support member support.
14. apparatus for electronic parts assembling as claimed in claim 13 is characterized in that,
The said parts holding unit drive unit of said chip join machine has first screwdown gear and second screwdown gear,
Said first screwdown gear is depressed said parts holding unit integral body downwards with respect to said turntable,
Said second screwdown gear is depressed said suction nozzle downwards with respect to the said housing of said parts holding unit.
15. like claim 13 or 14 described apparatus for electronic parts assembling; It is characterized in that; The said parts holding unit drive unit of said chip join machine is set to and said turntable state independently mutually; And said parts holding unit drive unit fixed configurations is at least supplied with on the position of said electronic unit sheet and said electronic unit sheet is welded on the position on the said cooperation side member at the electronic unit chip supplying device.
16., it is characterized in that said chip join facility are useful on the soldering tip tumbler that said wave welding head of ultrasonic wave is rotated like each described apparatus for electronic parts assembling in the claim 13 to 15.
17., it is characterized in that the said parts holding unit of said chip join machine has like each described apparatus for electronic parts assembling in the claim 13 to 16:
The soldering tip force application apparatus applies the power to the top to said soldering tip supporting member;
The soldering tip position detecting device detects the position of said soldering tip supporting member on above-below direction.
18. apparatus for electronic parts assembling as claimed in claim 17 is characterized in that,
Said soldering tip force application apparatus in the said parts holding unit of said chip join machine has:
Soldering tip side magnet, fixed configurations on said soldering tip supporting member,
Case side magnet, fixed configurations are on said housing, and is and mutually opposed with said soldering tip side magnet;
Said soldering tip side magnet and said case side magnet apply the power to the top through attracting each other or repelling to said soldering tip supporting member.
19. like each described apparatus for electronic parts assembling in the claim 13 to 18, it is characterized in that, the direction of vibration that the said wave welding head of ultrasonic wave of said chip join machine is set to this wave welding head of ultrasonic wave be exactly said turntable radially.
20. like each described apparatus for electronic parts assembling in the claim 13 to 19; It is characterized in that the said parts holding unit drive unit of said chip join machine is configured to the state that on the radial direction of said turntable, squints with respect to directly over the said parts holding unit.
CN2012100573339A 2011-02-28 2012-02-28 Electronic component assembly method and device Pending CN102655100A (en)

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JP2011041594A JP4932040B1 (en) 2011-02-28 2011-02-28 Electronic component assembly method, electronic component assembly apparatus
JP2011-041594 2011-02-28

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103681407A (en) * 2012-09-13 2014-03-26 株式会社日立高新技术仪器 Die bonder and bonding method
CN106817666A (en) * 2017-03-18 2017-06-09 歌尔股份有限公司 The welding tooling and welding method of motor vibrator
CN108198776A (en) * 2016-12-02 2018-06-22 先进装配系统有限责任两合公司 Assembly machine for a mobile device with a mobile carrier receptacle

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Publication number Priority date Publication date Assignee Title
JP2001060602A (en) * 1999-08-23 2001-03-06 Fuji Electric Co Ltd Flip-chip mounting structure and manufacture thereof
JP4353845B2 (en) * 2004-03-31 2009-10-28 富士通株式会社 Manufacturing method of semiconductor device
JP2010118534A (en) * 2008-11-13 2010-05-27 Mitsubishi Electric Corp Semiconductor device and method of manufacturing same

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103681407A (en) * 2012-09-13 2014-03-26 株式会社日立高新技术仪器 Die bonder and bonding method
CN103681407B (en) * 2012-09-13 2016-09-07 捷进科技有限公司 Chip engagement machine and joint method
CN108198776A (en) * 2016-12-02 2018-06-22 先进装配系统有限责任两合公司 Assembly machine for a mobile device with a mobile carrier receptacle
CN106817666A (en) * 2017-03-18 2017-06-09 歌尔股份有限公司 The welding tooling and welding method of motor vibrator
CN106817666B (en) * 2017-03-18 2019-08-27 歌尔股份有限公司 The welding tooling and welding method of motor vibrator

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Application publication date: 20120905