CN107295758A - Electronic component mounting apparatus and electronic component manufacturing method - Google Patents

Electronic component mounting apparatus and electronic component manufacturing method Download PDF

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Publication number
CN107295758A
CN107295758A CN201610787260.7A CN201610787260A CN107295758A CN 107295758 A CN107295758 A CN 107295758A CN 201610787260 A CN201610787260 A CN 201610787260A CN 107295758 A CN107295758 A CN 107295758A
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CN
China
Prior art keywords
unit
electronic unit
crimp head
electronic
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201610787260.7A
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Chinese (zh)
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CN107295758B (en
Inventor
上岛直人
八木桥俊
内藤健治
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Athlete FA Corp
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Athlete FA Corp
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Publication date
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Publication of CN107295758A publication Critical patent/CN107295758A/en
Application granted granted Critical
Publication of CN107295758B publication Critical patent/CN107295758B/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/166—Alignment or registration; Control of registration

Abstract

The present invention provides electronic component mounting apparatus and electronic component manufacturing method a kind of simple in construction and that be capable of accurately bind electronic components and substrate；Electronic component mounting apparatus (1) has：Keep the crimp head (15) of electronic unit (M), crimp head (15) is carried out lifting moving electronic unit elevating mechanism (3), the workbench (7) that can be moved in X-direction and Y direction and the camera unit of double-view field up and down (17) that can be shot to its upper side and lower side；Also, keep the crimping stations (10) of substrate (P), electronic unit (M) configured to electronic unit tray unit (11) at position of readiness, crimp head (15) is configured crimping head unit (12) at position of readiness, determine crimp head (15) and each unit reference position alignment unit (13) configuration on the same plane of workbench (7).

Description

Electronic component mounting apparatus and electronic component manufacturing method
Technical field
The present invention relates to electronic component mounting apparatus and electronic component manufacturing method.
Background technology
It is known to have a kind of electronic component mounting apparatus and the electronic component manufacturing method using its installation method, the electronics Apparatus for mounting component makes to connect by making the multiple electrodes of electronic unit contact across grafting material with the multiple electrodes of substrate Condensation material melts and solidified, so that electronic unit is bonded on substrate (referring for example to patent document 1 and patent document 2).Specially Electronic component mounting apparatus disclosed in sharp document 2, in the electronic unit elevating mechanism for making to maintain electronic unit in X-direction Upper movement, and make to be maintained at the planar movement in X-direction and Y direction of the substrate on objective table, so that electronic unit After the position alignment of the position of multiple electrodes and the multiple electrodes of substrate, decline electronic unit elevating mechanism, by the ministry of electronics industry Each electrode of part is engaged with each electrode of substrate.
【Prior art literature】
【Patent document】
Patent document 1：JP Publication, JP No. 2011-254032 number
Patent document 2：JP Publication, JP No. 2003-31993 number
The content of the invention
In recent years, the densification of electronic unit is continued to develop, and the electrode size of electronic unit and interelectrode spacing are not It is disconnected to diminish, thus it requires electronic component mounting apparatus copes with the situation.It is attached to by such electronic unit on substrate When, exist this must be asked with the contraposition of the electrode of unprecedented high accuracy management electronic component side and the electrode of substrate-side Topic.In addition, electronic component mounting apparatus possesses crimping stations, electronic unit tray unit and alignment unit etc., still, at these , it is necessary to for driving the drive mechanism of unit when part is independently configured, so as to have device and control complicates this One problem.In addition, for example wanting using an electronic component mounting apparatus come the different a variety of electronic units of installation dimension In the case of, operating personnel must switch crimp head, thus meeting generation device dwell time according to the size of electronic unit every time, So as to there are problems that productivity ratio reduces this.
The present invention is to complete in view of the above problems, its object is to provide in solving the above problems at least one Electronic component mounting apparatus and electronic component manufacturing method.
In order to solve the above problems, electronic component mounting apparatus of the invention passes through the multiple electrodes and base in electronic unit Fusible grafting material is set between the multiple electrodes of plate, the grafting material is heated and melts and solidifies it, so that by electricity The multiple electrodes of subassembly are engaged with the multiple electrodes of substrate, wherein, the electronic component mounting apparatus has：Electronic unit Elevating mechanism, it has the crimp head for keeping electronic unit, and crimp head is carried out lifting moving relative to substrate；Crimping Platform, it keeps substrate；Electronic unit tray unit, it configures electronic unit at position of readiness；Head unit is crimped, it will peace Crimp head on the leading section of crimping stations side loaded on electronic unit elevating mechanism is configured at position of readiness；Alignment unit, its For determining crimp head, electronic unit tray unit and the reference position for crimping head unit；And double-view field camera list up and down Member, it can shoot to the upper side and lower side of the Z-direction perpendicular to plane, and the plane refers to by X-axis and perpendicular to X-axis Y-axis constitute plane；Moreover, crimping stations, crimping head unit, electronic unit tray unit and alignment unit configuration are in work On the same plane of platform.
In addition, on the basis of foregoing invention, being preferably configured with more than two ministrys of electronics industry in electronic unit tray unit Multiple electronic units are arranged with part pallet, electronic unit pallet.
In addition, on the basis of foregoing invention, preferably crimping in head unit and being configured with one or two or more and electronics The sizes of part distinguish corresponding crimp head, also, a selected crimp head is moved into electronic unit lift The lower section in the crimp head retainer portion that structure is provided with, and be attracted in crimp head retainer portion.
In addition, on the basis of foregoing invention, preferred retainer portion of the crimp head to be installed in crimp head retainer portion State configuration towards crimp head retainer portion side is in crimping head unit.
In addition, on the basis of foregoing invention, preferably crimp head is by the ceramic heater with electronic unit absorption hole Constitute.
In addition, on the basis of foregoing invention, preferably alignment unit has：The target glass of translucency, it can be in Y-axis side Move up and with reference mark；Lighting device, it is illuminated to target glass；And calibration camera, it is fixed on work Reference mark is shot on platform and from underface.
In addition, on the basis of foregoing invention, preferably engagement of the double-view field camera unit in electronic unit and substrate up and down When configuration along at position of readiness of the Y direction away from workbench, also, should above and below double-view field camera unit can be in Y-axis side To with moved in Z-direction, and the crimp head or the electronics that is maintained in crimp head of upside can be shot simultaneously in the Z-axis direction The electrode of part and reference mark or the electrode of substrate on the target glass of downside.
In addition, on the basis of foregoing invention, the reference mark being preferably disposed on target glass is disposed on target glass Cross shape marks on the bottom surface of the upper surface of electronic unit elevating mechanism side or the opposite side of the upper surface.
In addition, on the basis of foregoing invention, the preferably upper surface provided with reference mark of target glass or bottom surface configuration exists At the height and position roughly the same with the height of the upper surface of the electronic unit elevating mechanism side of crimping stations.
In addition, on the basis of foregoing invention, reference mark and double-view field camera unit up and down preferably on target glass Shoot part configuration on the same axis in the state of, can by alignment unit and up and down double-view field camera unit while being clapped Take the photograph.
In order to solve the above problems, electronic component manufacturing method of the invention is held using above-mentioned electronic component mounting apparatus OK, it includes：Crimp head is attached to the process in crimp head retainer portion；Electronic unit is adsorbed to the work in crimp head Sequence；Using the electrode of the electrode of double-view field camera unit identification electronic unit and substrate up and down, and judge the electrode of electronic unit There is the process of dislocation-free with the electrode of substrate；The bonding process that electronic unit is engaged with substrate；And electricity will be bonded to The process that the substrate of subassembly is removed.
In addition, on the basis of foregoing invention, preferably also there is calibration procedure, in the calibration procedure, using fixed Calibration camera shoots the reference mark on the target glass that alignment unit is provided with, and is defined as the plane of electronic component mounting apparatus Reference position on direction, and crimp head is determined relative to reference position by double-view field camera unit and alignment unit up and down Position, moreover, during electronic component mounting apparatus works, perform periodically or at any time calibration procedure.
Brief description of the drawings
Fig. 1 is to represent that the electronic unit from the standing place of operating personnel involved by embodiment of the present invention installs dress The sketch being monolithically fabricated when putting.
Fig. 2 is that plane when representing the electronic component mounting apparatus involved by embodiment of the present invention viewed from above is constituted Top view.
Fig. 3 is the stereogram that outline represents the crimp head involved by embodiment of the present invention.
Fig. 4 is to represent to adsorb cuing open for the state of the crimp head involved by embodiment of the present invention using crimp head retainer portion View.
Fig. 5 is to illustrate that the electronic unit involved by embodiment of the present invention is adsorbed on the solid of the state in crimp head Figure.
Fig. 6 is the explanation of the position relationship when electronic unit for representing involved by embodiment of the present invention is engaged with substrate Figure.
Fig. 7 represents the alignment unit involved by embodiment of the present invention, wherein, (A) is top view, and (B) is with (A) Profile after A-A cutting line cuttings.
Fig. 8 is the explanation figure for the calibration for representing the electronic component mounting apparatus involved by embodiment of the present invention.
Fig. 9 is the block diagram for the control system that outline represents electronic component mounting apparatus involved by embodiment of the present invention.
Figure 10 is to represent the electronic unit installation side using the electronic component mounting apparatus involved by embodiment of the present invention The flow chart of method and electronic component manufacturing method.
(symbol description)
1 electronic component mounting apparatus
3 electronic unit elevating mechanisms
7 workbench
10 crimping stations
10A upper surfaces (crimping stations)
11 electronic unit tray units
12 crimping head units
13 alignment units
14 (14A, 14B) electronic unit pallets
15 (15A, 15B) crimp heads
16 crimp head retainer portions
About 17 double-view field camera units
18 shoot parts
50 calibration cameras
51 target glass
51A upper surfaces (target glass)
51B bottom surfaces (target glass)
52 lighting devices
65 retainer portions
66 pressure contact portions
68 through holes (electronic unit absorption hole)
80 reference marks
M electronic units
Me electronic units electrode (electrode)
Ms electronic units soldering-tin layer (grafting material)
P substrates
Pe electrode of substrate (electrode)
Ps substrates soldering-tin layer (grafting material)
Embodiment
(being monolithically fabricated for electronic component mounting apparatus 1)
Hereinafter, progress is monolithically fabricated to the electronic component mounting apparatus 1 involved by embodiment of the present invention referring to the drawings Explanation.
Fig. 1 is the sketch being monolithically fabricated when representing the electronic component mounting apparatus 1 from the standing place of operating personnel. In addition, diagram right side is set to X1 directions, left side and is set to X2 directions, upside to be set to Z1 directions, downside and be set to Z2 directions to be said It is bright.Illustrated in addition, Y1 directions, inner side will be set on the outside of paper and be set to Y2 directions.Moreover, X1-X2 is recited as into X-axis, Y1- Y2 is recited as Y-axis, Z1-Z2 and is recited as Z axis.As shown in figure 1, electronic component mounting apparatus 1 has substrate-placing portion 2 and the ministry of electronics industry Part elevating mechanism 3.Substrate-placing portion 2 is used to load substrate P, and the absorption of electronic unit elevating mechanism 3 keeps the electricity engaged with substrate P Subassembly M.Substrate P is, for example, circuit board, and electronic unit M is so-called naked such as semiconductor chip, transistor or diode Chip (bare chip).
Substrate-placing portion 2 is configured with the first drive division of Y-axis 5 on base 4, and X-axis is configured with the first drive division of Y-axis 5 First drive division 6.Moreover, being configured with workbench 7 on the first drive division of X-axis 6.Workbench 7 can be in the first drive division of Y-axis 5 Driving under reciprocate in the Y-axis direction, and can under the driving of the first drive division of X-axis 6 in the X-axis direction come and go move It is dynamic.Although not shown, but the first drive division of Y-axis 5 have Y-axis drive mechanism, the first drive division of X-axis 6 have X-axis drive mechanism.Y-axis Drive mechanism and X-axis drive mechanism are such as ball-screw or linear motor.In the electronic unit elevating mechanism of workbench 7 On the upper surface 8 of 3 sides, crimping stations 10, electronic unit tray unit 11, crimping head unit 12 and alignment unit 13 are arranged respectively At assigned position in the X-axis direction.
Crimping stations 10 are the pedestals for loading substrate P and engaging substrate P with electronic unit M.Electronic unit tray unit 11 Electronic unit pallet 14 is configured at defined position of readiness, wherein, multiple ministrys of electronics industry are arranged with electronic unit pallet 14 Part M.Crimp head 15 is configured at defined position of readiness by crimping head unit 12, wherein, crimp head 15 is used for electronic unit M It is maintained on electronic unit elevating mechanism 3.Crimp head 15, which has, keeps electronic unit M, and electronic unit M is bonded on into substrate P On function.Above-mentioned each unit is from crimping stations 10 according to electronic unit tray unit 11, crimping head unit 12, alignment unit 13 Order configure successively at the assigned position on X2 directions.
In addition, above-mentioned position of readiness refers to when electronic unit M is engaged with substrate P, electronic unit M is adsorbed in crimped Other times beyond when being installed on crimp head retainer portion 16 when first 15, by crimp head 15 etc. carry out the position of configuration support. By making workbench 7 be moved along X-axis and Y direction, so as to by electronic unit tray unit 11, crimping head unit 12 And the position of each unit of alignment unit 13 is configured on the extended line of the axle Zp shown in Fig. 1 or on position of readiness.Axle Zp It is the center of electronic unit elevating mechanism 3.The position of workbench 7 is so that crimping stations 10 are moved on axle Zp extended line Mode is managed.In addition, the shoot part 18 (reference picture 2) of double-view field camera unit 17 can extend into crimping stations 10 and pressure up and down Between joint 15.But, when standby, shoot part 18 is located towards at position of the Y2 directions away from crimping stations 10.
The immovable portion of electronic unit elevating mechanism 3 is fixed on pedestal 20.Pedestal 20 is by a pair vertical with base 4 Post 21 is supported.Electronic component mounting apparatus 1 is set on the ground with base 4 in horizontal state, workbench 7 and pedestal 20 and bottom Seat 4 is parallel, be horizontal.The axle Zp of electronic unit elevating mechanism 3 is vertical with workbench 7.As shown in figure 1, X-axis first is driven Dynamic portion 6 is configured between a pair of posts 21.In addition, electronic unit elevating mechanism 3 configures the X in the space between a pair of posts At direction of principal axis substantial middle position.
Electronic unit elevating mechanism 3 have high-speed moving mechanism 25, as the Piezoelectric Driving portion 26 of low speed travel mechanism with And keep electronic unit M crimp head 15.As shown in figure 1, high-speed moving mechanism 25 have motor 27, ball-screw 28 and Ball-screw nut 29.Ball-screw 28 is connected via connecting portion 30 with the output shaft 31 of motor 27.Ball-screw nut 29 are fixed in the first move portion 32.In addition, ball-screw nut 29 is screwed togather with ball-screw 28.First move portion 32 is via solid The first guide portion 33 for being scheduled on pedestal 20 and be installed on pedestal 20.First guide portion 33 can guide the first move portion 32 Move in the vertical direction.That is, the high-speed moving mechanism 25 with above-mentioned composition can be by the driving of motor 27 The first move portion 32 is set to move in the vertical direction.
High-speed moving mechanism 25 has displacement transducer 34, so as to detect the first move portion 32 in the vertical direction Amount of movement, the amount of movement that makes crimp head 15 move in the vertical direction by high-speed moving mechanism 25.Displacement transducer 34 can be made up of such as linear encoder (linear encoder).
First move portion 32 supports the second move portion 36 via force cell (load cell) 35.In addition, first moves The spring 37 as force application part is configured between the dynamic move portion 36 of portion 32 and second.Spring 37 using the first move portion 32 as by Power portion and apply active force downward to the second move portion 36.Second move portion 36 is via being fixed in the first move portion 32 The second guide portion 38 and be installed in the first move portion 32.Second guide portion 38 can guide the second move portion 36 above and below Side is moved up.That is, the second move portion 36 is supported via the second guide portion 38 in the way of it can move in the vertical direction In the first move portion 32.Second guide portion 38 can use such as crossed roller guide rail (cross roller guide) structure Into.By so constituting, the high rigidity of the second move portion 36 can be maintained in the first move portion 32.Second guide portion 38 Pneumatic type guide rail (air slide guide) can be used.In the case of such constitute, with using crossed roller guide rail phase Than can be high with precision and the second move portion 36 can be supported on the first move portion 32 up or down by the small state of resistance to sliding On.
When applying lifting force to the second move portion 36 from below, the second move portion 36 is relative to the direction of the first move portion 32 Top is moved, so as to measure the lifting force acted in the second move portion 36 by force cell 35.
In the second move portion 36, be sequentially installed with from top (side of the first move portion 32) noise measuring sensor 39, Load cell 40, displacement transducer 41, Piezoelectric Driving portion 26, crimp head retainer portion 16 and crimp head 15.In addition, noise Detection sensor 39, load cell 40 and Piezoelectric Driving portion 26 are configured on axle Zp extended line, i.e., along crimp head 15 Moving direction is arranged above and below.
Piezoelectric Driving portion 26 has the piezoelectric element for omitting diagram, and is applied according to the piezoelectricity put on the piezoelectric element Signal and make crimp head 15 (Z2 directions) be mobile downward.Piezoelectric Driving portion 26 can be in that the deflection of piezoelectric element is direct The structure of crimp head 15 is passed to, can also be in be transmitted after the deflection of piezoelectric element is amplified by displacement enlarger etc. Structure to crimp head 15.
Displacement transducer 34 is the sensor for the displacement (amount of movement) for detecting crimp head 15, and its accuracy of detection is about 0.01 μm of rank (level), can use such as capacitive displacement transducer.Capacitive displacement transducer is that possess mutually opposing Fixed electrode (not shown) and movable electrode (not shown), and using two electrodes relative movement caused by electric capacity become The sensor for the amount of movement for changing to measure crimp head 15, wherein, fixed electrode is fixed relative to the second move portion 36, movably The displacement of crimp head 15 of the electrode with being moved under the driving in Piezoelectric Driving portion 26 is accordingly moved.
Load cell 40 is the sensor for detecting the load for putting on crimp head 15 from below, and its accuracy of detection is about 0.01N~5N ranks, can use such as piezoelectric element.Noise measuring sensor 39 is that detection is acted on load cell 40 Noise sensor, its accuracy of detection is identical with load cell 40, and preferably uses and the identical of load cell 40 Sensor.
Second move portion 36 possesses motor 42.From part of the noise measuring sensor 39 untill the crimp head 15 of lower section It is configured to be in integratedly to move, also, by the driving of motor 42, during crimp head 15 can be made using axle Zp as rotation The heart and rotate in the horizontal plane.
In the lower section of the crimping stations 10 of mounting substrate P, provided with electrode Pe (the following notes via crimping stations 10 to substrate P Carry for " electrode of substrate Pe ", reference picture 6) heater 43 that is heated.Base of the crimping stations 10 via heater 43 and below Seat 44 and be fixed on workbench 7, and can be under the driving of the first drive division of Y-axis 5 and the first drive division of X-axis 6 in X1- Moved in X2 directions (X-direction) and Y1-Y2 directions (Y direction).
Then, reference picture 2 is said to each unit of electronic component mounting apparatus 1 configuration in the in-plane direction and constituting It is bright.
Fig. 2 is the vertical view that plane when representing the electronic component mounting apparatus 1 from Fig. 1 upside (Z1 directions) is constituted Figure.In addition, eliminating the diagram of electronic unit elevating mechanism 3 and pedestal 20 in Fig. 2.On the upper surface 8 of workbench 7, in X-axis On from crimping stations 10 towards X2 directions be arranged in sequence with the way of being separated by predetermined distance electronic unit tray unit 11, pressure Connector unit 12 and alignment unit 13.Workbench 7 can be moved up under the driving of the first drive division of X-axis 6 in X1-X2 directions It is dynamic, and can be moved up under the driving of the first drive division of Y-axis 5 in Y1-Y2 side.Fig. 2 is represented by making workbench 7 exist X1-X2 directions and Y1-Y2 directions are moved, so that central shaft, the i.e. axle Zp of crimping stations 10 and electronic unit elevating mechanism 3 The state of alignment.Therefore, in the Y direction of electronic unit tray unit 11, crimping head unit 12 and alignment unit 13 Heart position is configured in the X-axis passed through from axle Zp.
It is placed with substrate P on crimping stations 10, substrate P is with electrode of substrate Pe (reference picture 6) (Z1 directions) upward side Formula is positioned on crimping stations 10.In electronic unit tray unit 11 two electronic unit pallets 14, electronics are configured with along Y direction It is in be arranged with multiple electronic unit M latticedly in component tray 14.In addition, the quantity of electronic unit pallet 14 is not limited to two It is individual or one, it can also be two or more, such as three.In addition, being configured at the ministry of electronics industry in electronic unit pallet 14 Part M with electrode Me (following, be recited as " electronic unit electrode Me ", reference picture 5, Fig. 6) towards downside (electronic unit pallet 14 Bottom side) state and configure.In the example shown in Fig. 2, by the ministry of electronics industry in the Y2 directions in two electronic unit pallets 14 Part pallet is set to electronic unit pallet 14A, and the electronic unit pallet in Y1 directions is set into electronic unit pallet 14B.
Crimp head 15 is placed with crimping head unit 12.Crimp head 15 is prepared with for example large, medium and small with electronic unit M Deng the corresponding a variety of crimp heads of sizes.In the example shown in Fig. 2, two crimp heads 15 are placed with along Y direction, and And, such as corresponding with a large-sized electronic unit M crimp head is set to crimp head 15A, by the electronics with small size Another corresponding part M crimp head is set to crimp head 15B.On crimp head 15 and being installed on electronic unit elevating mechanism 3 On crimp head retainer portion 16 relation, reference picture 3 and Fig. 4 are illustrated afterwards.
Alignment unit 13 have fixed calibration camera 50 on the table 7, target glass (target glass) 51 and Lighting device 52.Target glass 51 can be moved up under the driving of target glass drive mechanism 53 in Y1-Y2 side, lighting device 52 Fix on the table 7.On the structure of alignment unit 13, reference picture 7 is illustrated afterwards.
Double-view field camera unit 17 is configured in the first drive division of Y-axis 5 at the position away from workbench 7 up and down, and position In on the extended line in the Y2 directions passed through from axle Zp.Double-view field camera unit 17 has shoot part 18, shoot part 18 is existed up and down Z axis drive division 55 that Z1-Z2 side is moved up and the drive division of Y-axis second for making shoot part 18 be moved up in Y1-Y2 side 56。
On the Y2 directions leading section of the shoot part 18 of double-view field camera unit 17 up and down, configured side by side along X1-X2 directions There are two video cameras 19A, 19B.Video camera 19A, 19B are, for example, CCD camera etc..Video camera 19A, 19B are configured to：Pass through rib Mirror 81 (reference picture 8) image of the both direction up and down obtained from the through hole 58 as image acquiring unit is divided into X1 directions, X2 directions both direction, and then the image advanced along X1 directions is reflected using speculum 60A and it is injected video camera In 19A, and the image advanced along X2 directions is reflected using speculum 60B and it is injected in video camera 19B.For example, By the image on the downside of video camera 19A acquisitions, pass through the image (reference picture 8) on the upside of video camera 19B acquisitions.Fig. 2 represents to make work For the through hole 58 of image acquiring unit the situation after axle Zp direction is moved is directed away from along Y-axis.Therefore, by making shoot part 18 Towards the movement of Y1 directions, through hole 58 can be made to be alignd with axle Zp.
Then, reference picture 3 and Fig. 4 are illustrated to crimping head unit 12, crimp head 15 and crimp head retainer portion 16.
Fig. 3 is the stereogram for the general configuration for representing crimp head 15.Crimp head 15 have absorption electronic unit M function and Heating grafting material makes the function that it melts.As shown in figure 3, shape of the crimp head 15 in two layers of quadrangular prism stacking, figure is at the middle and upper levels Side is retainer portion 65, and lower layer side is pressure contact portion 66 in figure.Retainer portion 65 is to be adsorbed being fixed to electronic unit elevating mechanism 3 Crimp head retainer portion 16 (reference picture 1) on part (reference picture 4).The central portion of the upper surface 67 of crimp head 15 is provided with use In absorption electronic unit M through hole 68.
Crimp head 15 is formed by ceramic heater.Ceramic heater is alternately laminated and constitute by ceramics and heater, is pressed The electrode 69 (so-called pad electrode (land electrode)) being connected with heater is configured with the upper surface 67 of joint 15. In addition, the pad 70 shown in the chain-dotted line configured at Fig. 3 corner location, represents that crimp head 15 is adsorbed in crimp head retainer portion 16 When the location of crimp head retainer portion 16 adsorption hole 71 (reference picture 4) that is provided with.In addition, through hole 68 is not limited to one It is individual, two or three can also be set.In addition, in the example shown in Fig. 3, electrode 69, which is configured, is clipping through hole 68 in symmetrical Position at, still, electrode 69 is configured according to the electrode structure of ceramic heater.It is crimping below the diagram of pressure contact portion 66 Face 72.
Fig. 4 is the sectional view for the state for representing the absorption of crimp head retainer portion 16 crimp head 15.Crimp head 15 is configured in pressure In the recess 73 that connector unit 12 is provided with, as shown in Fig. 2 being configured with two crimp heads along Y direction in crimping head unit 12 15.The crimp head 15A in the Y2 directions in two crimp heads is different with the size of the crimp head 15B in Y1 directions pressure contact portion 66, But both structures are identical, therefore, crimp head 15 is recited as in figs. 3 and 4 and is illustrated.
As shown in figure 4, crimp head 15 with retainer portion 65 upward (side of crimp head retainer portion 16) state configure In the recess 73 of crimping head unit 12, i.e., crimping head unit 12 is placed in the state of the upper surface 67 of pressure contact portion 66 upward In.Crimp head retainer portion 16 is at the position corresponding with the allocation position of four pads 70 shown in Fig. 3 provided with four suctions Attached hole 71.Inserted in addition, being provided with the position corresponding with two electrodes 69 shown in Fig. 3 in through hole 74, the through hole 74 There is the terminal 75 insulated with crimp head retainer portion 16.Terminal 75 is, for example, spring pin connector (spring pin Connector), also, as shown in figure 4, when crimp head retainer portion 16 adsorb crimp head 15 when, the leading section 75A of terminal 75 Contacted with electrode 69, and when being separated in crimp head retainer portion 16 with crimp head 15,69 points of leading section 75A and the electrode of terminal 75 From.In addition, the crimp head 15 formed by ceramic heater can contact conducting there is also electrode 69 is not provided with heater Electrode 69 can also be not provided with crimp head, this ceramic heater.Crimp head retainer portion 16 is provided with and crimped with being arranged at The through hole 76 that through hole 68 on first 15 is connected.Through hole 68,76 is the adsorption hole for adsorbing electronic unit M.
In addition, crimp head 15 is configured at the position of readiness shown in Fig. 2 in other processes beyond bonding process.Logical When crossing mobile work platform 7 and making the arrival axle of crimp head 15 Zp position, crimp head retainer portion 16 is set to decline towards crimp head 15, After being contacted in the bottom surface 77 in crimp head retainer portion 16 with the upper surface 67 of crimp head 15, crimp head 15 is adsorbed and protected in crimp head Hold in frame portion 16.
In addition, electronic component mounting apparatus 1 can for example cut the crimp head 15A being adsorbed in crimp head retainer portion 16 Crimp head 15B is changed to, is explained below.First, mobile work platform 7, when the crimp head 15A's in crimping head unit 12 When position of readiness is reached at axle Zp positions, crimp head 15A is set to decline and desorb, so that crimp head 15A is positioned in into crimping In the recess 73 of head unit 12.Then, workbench 7 is made to be moved towards Y2 directions, when crimp head 15B position of readiness reaches axle Zp Position at when, decline crimp head 15, adsorbed after being contacted in its bottom surface 77 with crimp head 15B upper surface 67.Will pressure Joint 15B is switched to can also switch to step identical during crimp head 15B to enter during crimp head 15A according to by crimp head 15A OK.
In addition, in Fig. 3, Fig. 4 example, crimp head 15 is made up of the retainer portion 65 and pressure contact portion 66 of corner column, But it is also possible to which one or two in retainer portion 65 and pressure contact portion 66 are formed as into cylindrical shape.
Below, reference picture 5 is adsorbed (pickup) electronic unit M situation to crimp head 15 and illustrated.
Fig. 5 is the stereogram to the electronic unit M states being adsorbed in crimp head 15 are illustrated.As shown in Fig. 2 electric In subassembly tray unit 11 two electronic unit pallets 14 are configured with along Y direction.It will match somebody with somebody in two electronic unit pallets 14 Put the electronic unit pallet on Y2 directions and be set to electronic unit pallet 14A, the electronic unit pallet on Y1 directions will be configured It is set to electronic unit pallet 14B.It is in be arranged with multiple electronic unit M latticedly in electronic unit pallet 14A, 14B.Such as Fig. 5 Shown, electronic unit M active face (active surface) Ma sides be (the opposite side in bottom surface 77 in crimp head retainer portion 16 Face) it is formed with electronic unit electrode Me.That is, electronic unit M with electronic unit electrode Me towards downside (electronic unit pallet 14 Bottom side) state configuration.Crimp head 15 is provided with the through hole 68 of electronic unit absorption, so as to vacuum suction electronics Part M.In addition, although not shown, but it is also possible to which the electronic unit adsorption plane in crimp head 15 is to be formed on electrolysis 72 to pass through Cross groove or multiple shallower rectangle adsorption tanks centered on through hole 68 etc., forcefully to adsorb electronic unit M, and reduce the deformation by electronic unit M caused by vacuum suction.
As shown in Fig. 2 electronic unit pallet 14A, 14B is arranged in electronic unit tray unit 11 along Y direction, in electricity Multiple electronic unit M are arranged with subassembly pallet 14A, 14B.Here, being adsorbed for crimp head 15 in electronic unit pallet 14A Electronic unit M situation illustrate.First, workbench 7 is moved in X, Y direction, and make electronic unit pallet 14A It is moved at axle Zp positions, crimp head 15 is declined towards electronic unit pallet 14A, so as to adsorb in multiple electronic unit M One.That is, the electronic unit M adsorption plane Mb for being not configured with electronic unit electrode Me is adsorbed by crimp head 15.Then, according to Electronic unit M configuration, spacing and workbench 7 is moved in X, Y direction, according to regulation order adsorb electronic unit support Electronic unit M in disk 14A, so as to perform the engagement of electronic unit M and substrate P.When in electronic unit pallet 14A without the ministry of electronics industry During part M, workbench 7 is moved in X, Y direction, and electronic unit pallet 14B is moved at axle Zp positions, and according to Identical step absorption electronic unit M during electronic unit pallet 14A.
Fig. 6 is the explanation figure of position relationship when representing the engagement of electronic unit M and substrate P.In addition, Fig. 6 represents electronics Part M engaged with substrate P before state.As shown in fig. 6, substrate P is adsorbed admittedly after the upper surface 10A of crimping stations 10 is placed in It is fixed.On the other hand, electronic unit M is adsorbed on the electrolysis 72 of crimp head 15.In addition, electronic unit M position and substrate P Position alignment so that each electronic unit electrode Me is accurately relative with each electrode of substrate Pe.That is, in the example shown in Fig. 6, Substrate P and electronic unit M center configuration are on the axle Zp of electronic unit elevating mechanism 3 extended line.Electrode of substrate Pe table Face is provided with soldering-tin layer Ps, in addition, electronic unit electrode Me surface is provided with soldering-tin layer Ms.Electronic unit electrode Me and substrate Electrode Pe is configured at the position that can be connected correspondingly.Due to the soldering-tin layer Ms on electronic unit electrode Me thickness and The very thin thickness of soldering-tin layer Ps on electrode of substrate Pe, is tens of μm or so, therefore omits diagram.By making electronic unit electrode Me is contacted and heated with electrode of substrate Pe so that respective soldering-tin layer Ms, Ps fusing, and weldering is made after being pressed with authorized pressure Tin layers Ms, Ps solidify, so as to which electronic unit M is bonded in substrate P.
For electronic unit electrode Me and electrode of substrate Pe, in recent years, the densification of electronic unit is continued to develop, Electronic unit electrode Me electrode size and interelectrode spacing constantly diminishes.Therefore, by electronic unit electrode Me and substrate When electrode Pe is electrically engaged, it is necessary to accurately manage the position on electronic unit electrode Me and electrode of substrate Pe in-plane, Cause each electrode damage or short circuit between electrodes to prevent occurring dislocation.Therefore, it is right in electronic component mounting apparatus 1 Electronic unit electrode Me position and electrode of substrate Pe position carry out high-precision calibration.Hereinafter, reference picture 7 and Fig. 8 are to this Illustrate.
Fig. 7 represents alignment unit 13, wherein, (A) is top view, and (B) is cuing open after the A-A cutting line cuttings in edge (A) Face figure.In addition, illustrated also referring to Fig. 1 and Fig. 2 simultaneously.As shown in (A), (B) in Fig. 7, alignment unit 13 has：It is fixed Calibration camera 50 and lighting device 52 on the table 7, the target glass maintaining part 61 for keeping target glass 51 and make target glass The target glass drive mechanism 53 that maintaining part 61 is moved up in Y1-Y2 side.Calibration camera 50 has camera main-body portion 62 and prism 59, wherein, camera main-body portion 62 is CCD camera etc..Camera main-body portion 62 is connected with prism 59 by lens barrel portion 63.Lighting device Multiple LEDs 64 are annularly configured with 52, also, LED 64 is configured as mainly irradiating target glass 51.In addition, target glass The upper surface 51A provided with reference mark 80 or bottom surface 51B of glass 51 are configured in the side of electronic unit elevating mechanism 3 with crimping stations 10 Upper surface 10A (reference picture 6) the roughly the same height and position of height at.
As shown in (A) in Fig. 7, target glass 51 is provided with reference mark 80.In this example, reference mark 80 is cross Mark.In addition, reference mark 80 is not limited to the mark of cross shape marks or circular or quadrangle etc..In Fig. 7 (B) shown in, reference mark 80 is formed on the upper surface 51A of the Z1 sides of target glass 51.There is translucency in target glass 51, and set In the case of having lighting device 52, it can be clapped using camera main-body portion 62 via configuration in the prism 59 of the underface of target glass 51 Take the photograph reference mark 80.Because target glass 51 has translucency, therefore, even if reference mark 80 to be arranged on to the bottom surface of target glass 51 51B sides, video camera 19A (reference picture 2) that also can be using configuration in the camera unit of double-view field up and down 17 of upper surface 51A sides is clapped Take the photograph reference mark 80.
Then, calibration of the reference picture 8 to electronic component mounting apparatus 1 is illustrated.
Fig. 8 is the explanation figure for the calibration for representing electronic component mounting apparatus 1.By making workbench 7 be moved up in X, Y direction It is dynamic, and the prism 59 of alignment unit 13 is configured on the axle Zp of electronic unit elevating mechanism 3 extended line.As shown in figure 8, The shoot part of double-view field camera unit 17 above and below being configured between the target glass 51 and electronic unit elevating mechanism 3 of alignment unit 13 18.Shoot part 18 adjusts the height in Z-direction by using Z axis drive division 55, and (is joined using the second drive division of Y-axis 56 According to Fig. 2) move in the Y-axis direction, so as to be inserted between target glass 51 and crimp head 15.Now, double-view field phase up and down The through hole 58 as image acquiring unit of machine unit 17 is located at the top of target glass 51.Then, double-view field camera up and down is utilized Unit 17 shoots the reference mark 80 of the target glass 51 of downside (Z2 sides), and shoots the crimp head 15 of upside (Z1 sides).
As shown in Fig. 2 double-view field camera unit 17 has two video cameras 19A, 19B up and down, as shown in figure 8, through hole 58 inside is configured with prism 81.Video camera 19A obtains the image of the reference mark 80 of target glass 51 via prism 81.Video camera 19B obtains the image of crimp head 15 via prism 81.The reference mark of crimp head 15 can use passing through for electronic unit absorption Through hole 68 (reference picture 5).But, can also be by the mark on electrolysis 72 or the vestige of fixation etc. in addition to through hole 68 It is used as reference mark.The position of the reference mark (through hole 68) of the side of crimp head 15 obtained at the same time and the benchmark of target glass 51 In the case that the position of mark 80 misplaces, because the position on the in-plane of electronic unit elevating mechanism 3 is fixed, because This, the position of the target glass 51 to that can move in the Y-axis direction is corrected, and by the center of the reference mark 80 after correction It is defined as reference position B (reference picture 7).In addition, for the ease of diagram, the video camera 19B expansion shown in Fig. 8 is represented in Y1 On direction, and omit the diagram of speculum 60A, 60B shown in Fig. 2.
Crimping stations 10, electronic unit tray unit 11 and the crimping head unit 12 being fixed on workbench 7 are each other in X, Y Relative position on direction of principal axis immobilizes.Therefore, according to reference position B (i.e. the position of electronic unit elevating mechanism 3) come really Determine the position of each unit, this is defined as " to calibrate ".But, electronic unit M and substrate P may be sent out when being supplied to assigned position Raw dislocation, therefore, makes electronic unit electrode Me position and electrode of substrate Pe position alignment before engagement.In addition, continuous During the engagement for carrying out multiple electronic unit M and substrate P, it is possible to because the influence or the change of repeatable accuracy of temperature change Change etc. and cause each reference mark or each unit etc. to misplace, it is therefore preferable that performing the engagement work of defined joining cycle Above-mentioned calibration is performed after sequence.
Then, contraposition of the reference picture 6 to electronic unit electrode Me and electrode of substrate Pe is illustrated.It is placed in substrate P The assigned position of crimping stations 10, in the state of electronic unit M is adsorbed in crimp head 15, by double-view field phase up and down (not shown) Between the insertion electronic unit M of shoot part 18 and substrate P of machine unit 17, while shooting electrode of substrate Pe and electronic unit electrode Me.Then, electrode of substrate Pe and electronic unit electrode Me dislocation is detected by image procossing, and the dislocation is corrected. The correction of the dislocation is mainly carried out by making workbench 7 be moved in X, Y direction, still, when dislocation occurs in horizontal plane When on interior direction of rotation, rotation position correction can be carried out by being driven motor 42.In addition, electronic unit is pacified Assembling device 1 can return to initial calibration bits after being corrected to electrode of substrate Pe and electronic unit electrode Me dislocation Put and enter next bonding process, alignment correction amount can also be preserved and use the correcting value to the position of each unit Data enter next bonding process after being corrected.In addition, electronic unit electrode Me and electrode of substrate Pe during above-mentioned contraposition Reference mark, it is possible to use the configuration pattern of each electrode, multiple reference electrodes or additional reference marking pattern or fixation Constant injurious surface mark or spot etc., just can be substituted as long as can determine the position of each electrode.
(action of electronic component mounting apparatus 1)
As shown in figure 9, electronic component mounting apparatus 1 discussed above has control unit 90.Then, 9 pairs of electricity of reference picture The control system of subassembly erecting device 1 and action are illustrated.
Fig. 9 is the block diagram for the control system that outline represents electronic component mounting apparatus 1.Control unit 90 is that have to perform signal The CPU and memory of processing etc. computer.Program and the control being stored with memory for controlling electronic component mounting apparatus 1 Data processed.Control unit 90 controls each motor or each drive mechanism according to the information from above-mentioned each sensor or each camera input Action.In this regard, being illustrated based on Fig. 9 referring concurrently to Fig. 7, Fig. 8.
First, pair control system relevant with electronic unit elevating mechanism 3 and action are illustrated.Fig. 1 represents the ministry of electronics industry Part M is attracted in crimp head 15, and the bonding process that is placed on crimping stations 10 of substrate P start before state, i.e. the ministry of electronics industry Part electrode Me and electrode of substrate Pe is accurately positioned the state after (position alignment).First, control unit 90 carries out motor 27 Driving, so as to perform the high speed down maneuver for making crimp head 15 decline at a high speed towards crimping stations 10.Control unit 90 is passed by displacement Sensor 34 detects the down position of crimp head 15, and makes it stop declining after crimp head 15 drops to assigned position.The regulation Position refers to electronic unit electrode Me (including electronic unit soldering-tin layer Ms) and electrode of substrate Pe (including substrate soldering-tin layer Ps) to the greatest extent Possible close but discontiguous position (such as at a distance of 100 μm of positions).In addition, control unit 90 can pass through PID (proportional integral differential, PID) controls and accurately moves crimp head 15 To assigned position.
Control unit 90 is driven Piezoelectric Driving portion 26, so that perform detection electronic unit electrode Me and electrode of substrate Pe The detection operation of the position of contact.Crimp head 15 carries out displacement according to the drive signal put in Piezoelectric Driving portion 26 and (moved It is dynamic), the displacement of crimp head 15 is detected and as displacement transducer signal by displacement transducer 41.Control unit 90 Judge whether electronic unit electrode Me contacts with electrode of substrate Pe according to the load corrector signal of load cell 40.Then, control Portion 90 detects that electronic unit electrode Me has been contacted with electrode of substrate Pe according to the output signal of force cell 35, and passes through position Displacement sensor 34 detects position during contact.Load corrector signal is the vibration that will be detected by noise measuring sensor 39 Voltage signal after noise signal is eliminated Deng caused by, i.e. load corrector signal is to represent to act in crimp head 15 from downside Load signal.Piezoelectric Driving portion 26 makes crimp head 15 decline towards the side of crimping stations 10 and based on the driving from control unit 90 The corresponding distance of displacement of signal.When electronic unit soldering-tin layer Ms is contacted with substrate soldering-tin layer Ps, from the side pair of crimping stations 10 Crimp head 15 applies load.When load corrector signal reaches defined voltage, control unit 90 is judged as electronic unit soldering-tin layer Ms is contacted with substrate soldering-tin layer Ps.In addition, control unit 90 is driven Piezoelectric Driving portion 26 so that load corrector signal reaches Assigned voltage, and the displacement of crimp head 15 (movement) is made by PID control.
Electronic unit electrode Me (electronic unit soldering-tin layer Ms) contacted with electrode of substrate Pe (substrate soldering-tin layer Ps) it is same When, control unit 90 makes to proceed by heating as the crimp head 15 of ceramic heater and the heater 43 of the side of crimping stations 10.Control Portion 90 applies voltage in the state of electronic unit electrode Me is contacted with electrode of substrate Pe to Piezoelectric Driving portion 26, so that from electronics Member electrode Me loads (such as 0.5N) as defined in applying to electrode of substrate Pe.About whether from electronic unit electrode Me to substrate Electrode Pe is applied with defined load, is judged according to above-mentioned load corrector signal.In addition, in electronic unit soldering-tin layer Ms and When substrate soldering-tin layer Ps has melted, the defined load towards the displacement of the side of crimping stations 10 can pass through position as crimp head 15 Displacement sensor 41 is detected.Control unit 90 passes displacement corresponding with the position for being judged as reaching crimp head 15 during specified loads The value of sensor signal is stored in memory as voltage during specified loads.
Electronic unit soldering-tin layer Ms and substrate are welded by the heating of crimp head 15 (ceramic heater) and heater 43 Tin layers Ps is heated, so that it starts fusing.Control unit 90 is according to the change of load corrector signal and displacement transducer signal Change amount and the displacement (deflection of crimp head 15) measuring position of the crimp head 15 when specified loads, and judge the shifting Whether dynamic distance (deflection of crimp head 15) reaches predetermined distance (such as 1 μm).Equivalent to the potential difference of deflection now It is stored in memory.When being judged as that electronic unit soldering-tin layer Ms and substrate soldering-tin layer Ps have melted, control unit 90 makes pressure Joint 15 stops declining and keeps its position.That is, when being judged as that electronic unit soldering-tin layer Ms and substrate soldering-tin layer Ps have melted, Make to put on the voltage in Piezoelectric Driving portion 26 and keep constant.
Control unit 90 starts to perform the ministry of electronics industry melted in the state of crimp head 15 stops declining and keeps its position Part soldering-tin layer Ms and substrate soldering-tin layer Ps cooling action.The cooling action is performed in the following way, i.e.,：Stop to crimp head 15 (ceramic heaters) and heater 43 are powered, and are led in the cooling tube 45 (reference picture 1) possessed to crimping stations 10 Enter air, so as to be cooled down to electronic unit M and substrate P.Thus, the electronic unit soldering-tin layer Ms and substrate scolding tin melted Layer Ps is cooled and starts solidification.Control unit 90 performs the servo-actuated action of thermal contraction, and the thermal contraction is servo-actuated action and referred to：Drive piezoelectricity Dynamic portion 26 is driven, so that crimp head 15 is followed the thermal contraction of the scolding tin of cooling and declined.In addition, control unit 90 makes pressure While the progress thermal contraction of joint 15 is servo-actuated action, pass through temperature sensor detection electronics soldering-tin layer Ms (not shown) and base Boards solder layer Ps temperature.When detecting temperature and having reached the temperature that scolding tin fully solidifies, control unit 90 releases crimp head 15 Attraction to electronic unit M, and be driven motor 27 and make (Z1 sides) movement upward of crimp head 15, so as to terminate Joint action.
As shown in Figure 1 and Figure 2, substrate-placing portion 2 has the first drive division of Y-axis 5, the first drive division of X-axis 6 and workbench 7.Control unit 90 is driven the first drive division of Y-axis 5 and the first drive division of X-axis 6, so that workbench 7 is in X, Y direction It is mobile.Crimping stations 10, electronic unit tray unit 11, crimping head unit 12 and correction unit 13 are fixed with workbench 7.Cause This, crimping stations 10, electronic unit tray unit 11, crimping head unit 12 and correction unit 13 are as workbench 7 is together in X, Y Moved on direction of principal axis.Image of the control unit 90 according to double-view field camera unit 17 up and down and captured by calibration camera 50 and make work Platform 7 is moved to defined plan-position.Described " defined plan-position " refers to herein：Electronic unit M and substrate P engagement Position, the absorption electronic unit of crimp head 15 M position, the absorption crimp head 15 of crimp head retainer portion 16 (crimp head 15A, 15B) Position, calibration when target glass 51 the position of reference mark 80 etc..
The electronic unit electrode Me for the electronic unit M that 90 pairs of control unit is adsorbed in crimp head 15 is with being adsorbed in crimping stations 10 On the electrode of substrate Pe dislocation of substrate P be corrected.Control unit 90 is shot simultaneously using double-view field camera unit 17 up and down Electronic unit electrode Me and electrode of substrate Pe, and by the first drive division of Y-axis 5 and the first drive division of X-axis 6 according to the figure obtained Picture, is accordingly corrected with electronic unit electrode Me and electrode of substrate Pe degree of misalignment to electrode of substrate Pe position. In addition, when electronic unit electrode Me and electrode of substrate Pe rotation position misplaces, control unit 90 carries out motor 42 Driving, so as to be corrected to electronic unit electrode Me rotation position.
Then, the control to double-view field camera unit 17 up and down is illustrated.Double-view field camera unit up and down shown in Fig. 2 17 configurations are at position of readiness.Control unit 90 is driven the second drive division of Y-axis 56, so that shoot part 18 is moved to regulation Position.The assigned position refers to above-mentioned correction position, shooting electronic unit electrode Me and electrode of substrate Pe position.Shoot part 18 Height and position (position in Z-direction) in calibration and when shooting electronic unit electrode Me and electrode of substrate Pe is different.Control Portion 90 processed is driven Z axis drive division 55 so that when shoot part 18 is moved to calibration and shoot electronic unit electrode Me and During electrode of substrate Pe at suitable height and position.
Then, the control to alignment unit 13 is illustrated.Alignment unit 13 shown in Fig. 2 is configured at position of readiness. Control unit 90 is driven target glass drive mechanism 53, so that the reference mark 80 of target glass 51 is moved in the Y-axis direction The position that can be extremely shot using calibration camera 50.Then, control unit 90 shoots reference mark 80 using calibration camera 50, and really Determine reference position B ((A) in reference picture 7).In addition, control unit 90 lights lighting device 52 before shooting and when shooting, and Extinguish after shooting terminates.
(electronic component mounting method and electronic component manufacturing method)
Figure 10 is electronic component mounting method and the electronic unit manufacturer for representing to perform using electronic component mounting apparatus 1 The flow chart of method.Electronic component mounting apparatus 1 has been had been carried out based on the calibration illustrated by Fig. 7 and Fig. 8.It is used as beginning installation procedure Substrate P is placed at the assigned position of crimping stations 10 by preceding preparatory process, operating personnel with defined posture.Substrate P is inhaled It is attached to be fixed on crimping stations 10.Then, operating personnel pacify electronic unit pallet 14A, 14B for being equipped with multiple electronic unit M In electronic unit tray unit 11.Then, crimp head 15A, 15B is arranged on the regulation of crimping head unit 12 by operating personnel At position.In addition, on crimp head 15A, 15B, there is a situation where to be fitted into a crimp head and install two identical types Crimp head situation.
Electronic component mounting apparatus 1 comes into effect installation procedure after above-mentioned preparation terminates.First, by crimp head 15 are attached in crimp head retainer portion 16 (step S10).The selection of crimp head 15 and towards crimp head retainer portion 16 Install, be controlled by the program being stored in control unit 90.In this, it is assumed that selection crimp head 15A.Specifically, work is made Make platform 7 to move, so that crimp head 15A is moved at the assigned position immediately below crimp head retainer portion 16.Then, make Crimp head retainer portion 16 declines towards crimp head 15A and adsorbs crimp head 15A.Then, rise to crimp head 15 defined Stop after height and position.
Then, electronic unit M (step S20) is adsorbed using crimp head 15.Specifically, move workbench 7, from And make one in the multiple electronic unit M being equipped in electronic unit pallet 14A (or electronic unit pallet 14B) to be moved to pressure At assigned position immediately below joint 15.Then, crimp head 15 is declined towards electronic unit M and adsorb electronic unit M.From many The absorption of an electronic unit M order and crimp head is selected in individual electronic unit M, passes through the program being stored in control unit 90 It is controlled.The crimp head 15 for being adsorbed with electronic unit M is set to stop after rising to defined height and position.
Then, the electrode of substrate Pe and the electronic unit of upside on the downside of the shooting simultaneously of double-view field camera unit 17 up and down are passed through Electrode Me, recognizes the position (step S30) of each electrode.Position and base of the control unit 90 according to the electronic unit electrode Me photographed Plate electrode Pe position, and judge whether both occur to misplace (step S40) by image processing program.When being judged as not occurring During dislocation ("No"), crimp head 15 is set to decline towards substrate P, so that electronic unit M is engaged (step S50) with substrate P.At this In bonding process, after electronic unit M is contacted with substrate P, the crimp head 15 and crimping stations 10 as ceramic heater are utilized The heater 43 of side melts electronic unit soldering-tin layer Ms and substrate soldering-tin layer Ps, and because displacement caused by fusing and Displacement load is reached after setting, cools and solidifies electronic unit soldering-tin layer Ms and substrate soldering-tin layer Ps.Then, control unit 90 makes Crimp head 15 stops after rising to defined height and position.Then, by operating personnel or by automatic equipment from crimping stations 10 It is upper to remove the substrate P (step S60) for being bonded to electronic unit M.After step S60 terminates, electronic unit M is made and is engaged with substrate P Attachment.
When being judged as misplacing in step s 40 ("Yes"), into alignment correction process (step S45).Control unit 90 calculate offset direction and offset.Then, according to offset direction and offset mobile work platform 7, so that correction substrate is electric Pole Pe position (step S45).When electronic unit electrode Me rotation position and electrode of substrate Pe rotation position misplace When, crimp head 15 is rotated and is made electronic unit electrode Me position and electrode of substrate Pe position alignment, subsequently into Step S50 bonding process.Judge whether to misplace again alternatively, it is also possible to after alignment correction (step S45) increase Process (step S40).
In addition, electronic component mounting apparatus 1 is led because of the influence of temperature change or vibration etc. during operation sometimes Initial calibration is caused to occur small deviation.It is therefore preferable that implementing calibration during operation.For example, by the step shown in Figure 10 In the case that rapid S10~step S60 is as a cycle, by being calibrated again after n cycle is repeated, height can be continued Engaged to precision.
Electronic component mounting apparatus 1 discussed above be by multiple electronic unit electrode Me in electronic unit M with Fusible grafting material i.e. soldering-tin layer is set between multiple electrode of substrate Pe of substrate P, and to electronic unit soldering-tin layer Ms and Substrate soldering-tin layer Ps, which carries out heating, makes it melt and solidify, so that by electronic unit M multiple electronic unit electrode Me and substrate P Multiple electrode of substrate Pe engagement electronic component mounting apparatus.Electronic component mounting apparatus 1 has electronic unit elevating mechanism 3, the electronic unit elevating mechanism 3 has the crimp head 15 for keeping electronic unit M, and crimp head 15 is carried out relative to substrate P Lifting moving.In addition, electronic component mounting apparatus 1 has：Keep the crimping stations 10 of substrate P, configure electronic unit M standby Electronic unit tray unit 11 at position, will be attached to electronic unit elevating mechanism 3 the side of crimping stations 10 leading section pressure Joint 15 configure crimping head unit 12 at position of readiness, determine crimp head 15 and each unit reference position alignment unit 13 and the camera unit of double-view field up and down 17 that the upper side and lower side of the Z-direction perpendicular to plane can be shot, and And, crimping stations 10, crimping head unit 12, electronic unit tray unit 11 and alignment unit 13 are configured in the same of workbench 7 In plane (upper surface 8 of workbench).
As described above, in electronic component mounting apparatus 1, crimping stations 10, electronic unit tray unit 11, crimping head unit 12 and alignment unit 13 configure on the same plane (upper surface 8 of workbench) of workbench 7.Therefore, by making workbench 7 Move, crimping stations 10 and above-mentioned each unit can be made to be moved in X, Y direction.Due to need not be for crimping stations 10 and upper State each unit and the drive mechanism for making it be moved in X-direction and Y direction is set respectively, therefore, it is possible to simplify electronic unit The structure of erecting device 1 and reduce cost.Further, since crimping stations 10, electronic unit tray unit 11, crimping head unit 12 with And the position relationship of alignment unit 13 and workbench 7 immobilizes, therefore, it is possible to accurately to crimping stations 10 and above-mentioned each list Member is positioned, so as to realize the structure for easily improving electronic unit M and the joining accuracy of substrate P.
In addition, more than two electronic unit pallets 14 are configured with electronic unit tray unit 11, the electronic unit support Multiple electronic unit M are arranged with disk 14.By configuring more than two electronic unit pallets 14, for example, it is being configured at the ministry of electronics industry After the engagement of electronic unit M in part pallet 14A terminates, the electronics being configured in electronic unit pallet 14B can be then carried out The engagement of part.In addition, during the engagement of electronic unit M in electronic unit pallet 14B, can be to electronic unit pallet list Electronic unit pallet 14A of the supply filled with electronic unit M in member 11, therefore, it is possible to be carried out continuously electronic unit M incessantly With the engagement of substrate P.
In addition, being configured with one or two or more right respectively with electronic unit M sizes in crimping head unit 12 The crimp head 15 answered, a selected crimp head 15 is moved into the crimp head being arranged on electronic unit elevating mechanism 3 and protected The lower section in frame portion 16 is held, and is attracted in crimp head retainer portion 16.
Crimp head 15 corresponding with the electronic unit M of coalesced object size is being moved into crimp head retainer portion 16 just Lower section, and be attracted in crimp head retainer portion 16.Because the action is carried out automatically under the control of control unit 90, thus Will not occur to occur when crimp head 15 is attached in crimp head retainer portion 16 manually in the engagement of electronic unit M and substrate P Dislocation equal error., can be automatic according to the program of control unit 90 in addition, in the case where possessing two kinds of crimp heads 15A, 15B Ground switches to crimp head 15B from crimp head 15A (vice versa).In addition, the species of crimp head 15 is not limited to two kinds, can also Increase to three kinds etc..
In addition, crimp head 15 has the retainer portion 65 being attached in crimp head retainer portion 16 and meets electronic unit M Be bonded to the pressure contact portion 66 on aforesaid substrate P, also, crimp head 15 with retainer portion 65 towards the side of crimp head retainer portion 16 shape State is configured.So, compared with the situation that crimp head 15 is arranged in crimping head unit 12 with the state of the side of pressure contact portion 66 upward, by It can be mounted in crimp head retainer portion 16 in crimp head 15 need not be overturn, therefore not need turning device, so as to Enough simplify device.
In addition, crimp head 15 as electronic unit absorption with the ceramic heater of the through hole 68 in hole by with being constituted.Make For the composition of crimp head 15, for example, retainer portion 65 can be formed as to ceramic heater or pressure contact portion 66 is formed as into pottery Porcelain heater.But, by the way that crimp head 15 is integrally formed into ceramic heater, composition can be simplified and ceramic heater is improved Thermal capacity, so as to improve the heat transfer efficiency towards electronic unit M.
In addition, alignment unit 13 has：It can move in the Y-axis direction and the translucency target glass with reference mark 80 51st, the lighting device 52 that is illuminated to target glass 51 and fixed enter on the table 7 and from the underface of reference mark 80 The calibration camera 50 that row is shot, wherein, the workbench 7 can by X-axis and perpendicular to the X-axis the plane that constitutes of Y-axis it is upper State and moved in X-direction and above-mentioned Y direction.
In the case of such constitute, due to that can be clapped using fixed calibration camera 50 on the table 7 from underface Take the photograph reference mark 80, it is thus possible to the position of reference mark 80 is correctly obtained, so as to determine correct reference position B.
In addition, double-view field camera unit 17 is configured remote along Y direction in the engagement of electronic unit M and substrate P up and down At position of readiness from workbench 7, and it can be moved in Y direction and Z-direction, and can in the Z-axis direction simultaneously The electrode i.e. electronic unit electrode Ms of crimp head 15 or the electronic unit being maintained in crimp head 15 on the upside of shooting and under The reference mark 80 of the target glass 51 of side or the electrode of substrate are electrode of substrate Ps.
Double-view field camera unit 17 can shoot the reference object of upside and the reference object of downside simultaneously up and down, and can Moved in Y, Z-direction, without the drive mechanism of X-direction, thus, it is possible to simplify composition.Moreover, energy during calibration The reference mark 80 of the target glass 51 of crimp head 15 and downside on the upside of enough shootings simultaneously, in the engagement of electronic unit M and substrate P When can shoot simultaneously upside electronic unit electrode Me and downside electrode of substrate Pe, so as to accurately carry out respectively Alignment correction or contraposition.
In addition, the reference mark 80 being arranged on target glass 51 is disposed on the electronic unit elevating mechanism 3 of target glass 51 Cross shape marks on the bottom surface 51B of the upper surface 51A or upper surface 51A of side opposite side.By by the shape of reference mark 80 As cross shape marks, it will can a little be set as reference position at central crossbar portion.Further, since target glass 51 has thoroughly Photosensitiveness, thus reference mark 80 can be shot from the both sides of side and following side above target glass 51.
In addition, the upper surface 51A provided with reference mark 80 or bottom surface 51B of target glass 51 are configured in the electricity with crimping stations 10 At the roughly the same height and position of the upper surface 10A of the side of subassembly elevating mechanism 3 height, and substrate P is placed in crimping stations On 10 upper surface 10A.Therefore, by making the height and position of the height and position of target glass 51 and the upper surface 10A of crimping stations 10 It is roughly the same, it can exclude in calibration and produce error because of both differences in height in the positioning of the when of engagement.In addition, upper State in viewpoint, the thickness of substrate P can be ignored.
In addition, in the reference mark 80 being arranged on target glass 51 and the shoot part 18 of double-view field camera unit 17 up and down In the state of (through hole 58) configuration on the same axis, electronic component mounting apparatus 1 can be by alignment unit 13 and double up and down Visual field camera unit 17 is shot simultaneously.In the case of such constitute, due to fixation in alignment unit 13 can be passed through Calibration camera 50 shoots fixed reference mark 80 in the downside of double-view field camera unit 17 up and down, so that it is determined that the pressure of upside The position (position alignment for making its position and reference mark 80) of joint 15, therefore, it is possible to realize electronic unit M and substrate P High accuracy engagement.
The electronic component mounting method and electronic component manufacturing method performed using electronic component mounting apparatus 1 is included：Will Process that crimp head 15 is attached in crimp head retainer portion 16, the process that electronic unit M is adsorbed in crimp head 15, utilize The electrode of the identification of double-view field camera unit 17 electronic unit is the electrode i.e. electrode of substrate of electronic unit electrode Me and substrate up and down Pe process, judge process that whether electronic unit electrode Me and electrode of substrate Pe misplace, by electronic unit M and substrate P The bonding process of engagement and the process for removing the substrate P for being bonded to electronic unit M.According to the electronic component mounting method And electronic component manufacturing method, it can efficiently realize the engagement of positional precision height and the high electronic unit M of quality and substrate P.
In addition, electronic component mounting method and electronic component manufacturing method also include calibration procedure, the calibration procedure refers to： The reference mark 80 for the target glass 51 that alignment unit 13 is provided with is shot using fixed calibration camera 50, and is defined as the ministry of electronics industry The reference position B of the in-plane of part erecting device 1, and it is relative by double-view field camera unit 17 and alignment unit 13 up and down Determine the position of crimp head 15 in reference position B, also, preferably during the work of electronic component mounting apparatus 1 periodically or Calibration procedure is performed at any time.
Electronic component mounting apparatus 1 can cause initial school because of the influence of temperature change or vibration etc. during operation Small deviation occurs for standard.It is therefore preferable that implementing calibration procedure during operation.For example, (will walked from crimp head installation procedure Rapid S10)~the substrate P that is bonded to electronic unit removal process (step S60) be set to a cycle in the case of, by anti- Calibrated again after performing n cycle again, so as to continue accurately to be engaged.
In addition, the present invention is not limited to above-mentioned embodiment, done in the range of it can realize the purpose of the present invention Deformation, improvement etc. be also included in the present invention.For example, in the above-described embodiment, by operating personnel by electronic unit pallet 14 are arranged in electronic unit tray unit 11 or remove electronic unit pallet 14 from electronic unit tray unit 11, still, It can also be configured to set electronic unit pallet feed unit to be installed or removed.Alternatively, it is also possible to make installation and removal In one automation.Similarly, substrate P is also to be placed on by operating personnel on crimping stations 10, but it is also possible to be configured to set Put substrate feed unit and substrate P is placed on crimping stations 10.
In addition, in the above-described embodiment, electronic unit tray unit 11, crimping head unit 12 and the phase of alignment unit 13 Configured successively on X2 directions for crimping stations 10.The configuration sequence is true according to the frequency of use and haul distance of each unit Determine so as to most efficiently drive each unit, still, the configuration sequence is not limited to this, can suitably be set.
In addition, in the above-described embodiment, crimp head 15 is formed as into ceramic heater, but it is also possible to by crimp head Be formed as ultrasonic bonding instrument., for example can also will be a variety of ultrasonic bonding using in the case of ultrasonic bonding instrument Instrument is configured in ultrasonic bonding tool unit, and is automatically mounted into crimp head retainer portion.

Claims (12)

1. a kind of electronic component mounting apparatus, it between the multiple electrodes of electronic unit and the multiple electrodes of substrate by setting Fusible grafting material, the grafting material is heated and melts and solidifies it, so that by the multiple electrodes of the electronic unit Engaged with the multiple electrodes of the substrate,
The electronic component mounting apparatus is characterised by having：
Electronic unit elevating mechanism, it has the crimp head for keeping the electronic unit, and makes the crimp head relative to institute State substrate and carry out lifting moving；
Crimping stations, it keeps the substrate；
Electronic unit tray unit, it configures the electronic unit at position of readiness；
Head unit is crimped, it is by the pressure on the leading section of the crimping stations side of the electronic unit elevating mechanism Joint arrangement is at position of readiness；
Alignment unit, it is used for the base for determining the crimp head, the electronic unit tray unit and the crimping head unit Level is put；And
Double-view field camera unit up and down, it can shoot to the upper side and lower side of the Z-direction perpendicular to plane, wherein, The plane refers to by X-axis and perpendicular to the plane that constitutes of Y-axis of the X-axis；
Moreover, the crimping stations, the crimping head unit, the electronic unit tray unit and alignment unit configuration exist On the same plane of workbench.
2. electronic component mounting apparatus as claimed in claim 1, it is characterised in that
It is configured with more than two electronic unit pallets, the electronic unit pallet and arranges in the electronic unit tray unit There are multiple electronic units.
3. electronic component mounting apparatus as claimed in claim 1 or 2, it is characterised in that
One is configured with the crimping head unit or two or more corresponding with the sizes difference of the electronic unit The crimp head, also, a selected crimp head is moved into the pressure that the electronic unit elevating mechanism is provided with The lower section in joint carrier portion, and be attracted in the crimp head retainer portion.
4. electronic component mounting apparatus as claimed any one in claims 1 to 3, it is characterised in that
The crimp head has the retainer portion being attached in crimp head retainer portion and is bonded to the electronic unit described Pressure contact portion on substrate, also, the crimp head with the retainer portion towards the state of the crimp head retainer portion side and Configuration.
5. the electronic component mounting apparatus as described in claim 3 or 4, it is characterised in that
The crimp head with electronic unit absorption with the ceramic heater in hole by being constituted.
6. the electronic component mounting apparatus as any one of claim 1 to 5, it is characterised in that
The alignment unit has：
The target glass of translucency, it can be moved and with reference mark in the Y-axis direction；
Lighting device, it is illuminated to the target glass；And
Calibration camera, it is fixed on the table and shoots the reference mark from underface, wherein, the workbench can be Moved in X-direction and Y direction by X-axis and in the plane that constitutes of Y-axis of the X-axis.
7. electronic component mounting apparatus as claimed in claim 6, it is characterised in that
The double-view field camera unit up and down in the engagement of the electronic unit and the substrate configuration along the Y direction At position of readiness away from the workbench, also, the double-view field camera unit up and down can be in the Y direction and described Moved in Z-direction, and the crimp head of upside can be shot in the Z-direction simultaneously or the crimp head is maintained at On the electrode of electronic unit and the reference mark or the electrode of the substrate on the target glass of downside.
8. electronic component mounting apparatus as claimed in claim 7, it is characterised in that
The reference mark being arranged on the target glass is disposed on the electronic unit elevating mechanism of the target glass Cross shape marks on the bottom surface of the opposite side of the upper surface of side or the upper surface.
9. the electronic component mounting apparatus as any one of claim 6 to 8, it is characterised in that
The upper surface or the bottom surface provided with the reference mark of the target glass, are configured in the institute with the crimping stations State at the roughly the same height and position of height of the upper surface of electronic unit elevating mechanism side.
10. the electronic component mounting apparatus as any one of claim 6 to 9, it is characterised in that
Exist in the reference mark being arranged on the target glass and the shoot part configuration of the double-view field camera unit up and down In the state of on same axle, can simultaneously it be shot by the alignment unit and the double-view field camera unit up and down.
11. a kind of electronic component manufacturing method, the electronic component mounting apparatus any one of its usage right requirement 1 to 10 And perform, the electronic component manufacturing method is characterised by, including：
Crimp head is attached to the process in crimp head retainer portion；
The electronic unit is adsorbed to the process in the crimp head；
The process for recognizing the electrode of the electronic unit and the electrode of the substrate using double-view field camera unit up and down；
Judge that the electrode of the electronic unit and the electrode of the substrate have the process of dislocation-free；
The bonding process that the electronic unit is engaged with the substrate；And
The process that the substrate for being bonded to the electronic unit is removed.
12. electronic component manufacturing method as claimed in claim 11, it is characterised in that
Also there is calibration procedure, in the calibration procedure, the target that alignment unit is provided with is shot using fixed calibration camera Reference mark on glass, and the reference position being defined as on the in-plane of the electronic component mounting apparatus, and pass through institute Double-view field camera unit and the alignment unit determine the position of the crimp head relative to the reference position above and below stating,
Moreover, during the electronic component mounting apparatus works, performing periodically or at any time the calibration procedure.
CN201610787260.7A 2016-03-30 2016-08-31 Electronic component mounting apparatus and electronic component manufacturing method Active CN107295758B (en)

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CN114430655A (en) * 2020-10-29 2022-05-03 爱立发株式会社 Electronic component bonding apparatus

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JP6691197B1 (en) * 2018-12-12 2020-04-28 エイチアンドセオン カンパニー リミテッドＨ＆ｃｅｏｎ ｃｏ．， ｌｔｄ． Heater assembly

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JP6681241B2 (en) 2020-04-15

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