JPH09283543A - Die-bonding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To contrive miniaturization of a die-bonding device and reduction in the cost of the device by a method wherein the holding position of a wafer is fixed, an X moving member is provided movably in an X direction and the X member is provided with a push-up tool movably in a Y direction. SOLUTION: A non-defective semiconductor chip (a chip which is not put with a bad mark) is searched for by a camera 17 to recognize the non-defective semiconductor chip. Then, if the non-defective semiconductor chip is found out, a Y moving member 11 and a Y moving member 14a are moved so that a push-up tool 12 and a suction tool 16a for pickup use are respectively positioned on the lower side of the target chip and on the upper side of the target chip. After the members 11 and 14a finish moving, the tool 12 pushes up the chip. Therewith, the tool 16a vacuum-sucks the chip.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a die bonding apparatus,
In particular, the present invention relates to a die bonding apparatus that is small in size, has a simple configuration, and is inexpensive.

[0002]

2. Description of the Related Art FIG. 4 is a schematic plan view showing a schematic configuration of a conventional die bonding apparatus. This configuration will be briefly described.

In the drawing, a is a semiconductor wafer, which is held in a state of being diced by a dicing frame,
The wafer table is mounted on the wafer table movable in the direction (one direction of the plane direction), the Y direction (the plane direction and a direction perpendicular to the X direction), and the θ direction (rotational direction). b is a wafer changer, c is a wafer loader, d is a frame loader,
e is a frame feeder, f is a dispenser, g is a bonding part, and h is a magazine unloader. Reference numeral i denotes an intermediate positioning portion, which is a portion for straightening the position and orientation of the chip by sucking the chip with the suction tool of the bonding portion g and then temporarily placing the chip. After the straightening, the chip is again sucked and bonded. The intermediate positioning part i may not be provided.

The die bonding operation by the present die bonding apparatus will be briefly described. The wafer table is moved so that the chip to be die-bonded on the wafer a is located below the suction portion of the bonding portion g, and the push-up tool located below the suction tool. The chip is pushed up by a suction tool, sucked by a suction tool, then the wafer table on which the wafer a is placed is retracted, and the chip is bonded to the lead frame on the frame feeder e. It has a mechanism of moving a to position the chip to be bonded under the suction tool of the bonding part g.

Each time one chip is bonded, the lead frame is moved by the frame feeder e.
The pitch (so-called 1 frame) was designed to proceed to the magazine unloader side.

[0006]

By the way, the conventional die-bonding apparatus has a big problem that it is necessary to enlarge the equipment. In particular, the wafer tends to have a diameter of 8 inches or more, and the larger the diameter, the larger the equipment must be. This is because the method of moving the wafer by the wafer table to move the chip to be bonded under the suction tool of the bonding section inevitably causes all the chips to be sequentially sucked. This is because it is necessary to make both the stroke in the Y direction and the stroke in the Y direction about twice the diameter of the wafer, and the area of the region to be secured as the moving range of the wafer is proportional to about the square of the diameter.

In the past, the speeding up of the die bonder was pursued, and the importance of avoiding the enlargement of the equipment was not recognized, but the inventor of the present application needs to solve the problem of the enlargement of the equipment. I noticed. This is because, at present, it is necessary to inline die bonding, curing, wire bonding, molding, contour shaping, and inspection, but with such inlining, the area occupied by this entire line is considerably large. This is because each device constituting the line is required to be miniaturized as much as possible, and the die bonding device cannot escape the demand.

On the other hand, in the die-bonding apparatus, the need for speeding up has been diminished along with the tendency to be in-line. This is because the number of wire bonds per chip increases as the number of pins increases, and the wire bonding time per chip tends to be longer than the time required to bond one chip. Increasing the speed of the device will further promote the tendency. Then, it becomes necessary to connect many wire bonding devices to the high-speed die bonding device due to the in-line construction. This inevitably requires a long time for setup change and causes a decrease in the operation rate of the line, which is not a good idea after all. Therefore, it is preferable that the number of wire bonding devices is small in order to be in-line.

Then, even if the speed of the die bonding apparatus is increased, the die bonding apparatus can still play. Therefore, it is meaningless to ignore the takt time of the wire bonding apparatus and speed up the die bonding apparatus. This is the reason why the need for high speed die bonding equipment is diminishing. Therefore, the inventor of the present application recognized the miniaturization of the die bonding apparatus as the most important issue, and made an effort to solve the issue to complete the present invention.

That is, the present invention reduces the size of the die bonding apparatus,
The purpose is to reduce the price.

[0011]

The first die bonding apparatus of the present invention has a wafer holding position fixed, an X moving member movably in the X direction, and the X moving member movable in the Y direction. It is characterized in that it is provided with a push-up tool.

Therefore, according to the first die-bonding apparatus of the present invention, since the position of the wafer is fixed, the range of movement of the member on the chip suction side is about the area of the wafer, and the wafer is mounted. Wafer table to be placed in X direction, Y
The size can be significantly reduced as compared with the conventional die bonder in which the moving stroke in the direction must be twice the diameter of the wafer.

The second type of die bonding apparatus of the present invention is X
The X moving member is provided so as to be movable in the direction, and the X moving member is
It is characterized in that the suction tool and the push-up tool are provided so as to be movable on the same axis as seen from above extending in the Y direction.

Therefore, according to the second die bonding apparatus of the present invention, once the position of the X moving member in the X direction is determined, the positioning in the operation of the suction tool and the push-up tool is performed in the Y direction on the X moving member. Only needs to be done.

Therefore, the positioning operation is simple. still,
Compared with the conventional die-bonding apparatus, it is possible to realize a significantly smaller size, and the reason is the same as in the case of the first die-bonding apparatus of the present invention.

A third die bonding apparatus of the present invention has a wafer holding position fixed and an X moving member which is movable in the X direction is provided, and the X moving member is movable on the same axis extending in the Y direction. As described above, a pickup suction tool and a bonding suction tool are provided, and the pickup suction tool and the bonding suction tool of the X moving member move Y.
An intermediate positioning part is fixed at a position corresponding to the lower side of the directional axis, the chip is sucked by the bonding suction tool and then positioned by the intermediate positioning part, and the bonding is performed by the bonding suction tool. It is characterized by

Therefore, according to the third embodiment of the die bonding apparatus of the present invention, since the X moving member is provided with the intermediate positioning portion, it is not necessary to move the X moving member in the X direction to correct the position, and the X moving member is moved. Since the chip can be delivered from the pickup suction tool to the bonding suction tool on the member through the position correction at the intermediate positioning part, it is possible to ensure the required time tact very easily and accurately. Chips can be die-bonded in the correct direction at various positions.

The pickup suction tool and the bonding suction tool are moved on one axis extending in the Y direction when viewed from above, and the intermediate positioning portion is below the axis, so the pickup suction tool is used. The tool and the bonding suction tool do not need to be positioned in the X direction in the operation, and only the operation in the Y direction need be performed, so that the operation and the positioning are simple.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the illustrated embodiments.

FIG. 1 is a perspective view showing a first embodiment of the die bonding apparatus of the present invention.

Reference numeral 1 is a base, 2 is a wafer holding bracket fixed to the base 1, and holds a dicing frame 4 holding a semiconductor wafer 3 in a cantilever manner. 5 is a frame mounting bracket for mounting unbonded lead frames 6, 6, ..., 6 is a bonding frame mounting table 8
The lead frame 6 is placed on the mounting table 8 with the frame mounting bracket for mounting the chip, and the chip is bonded to the lead frame 6. An X moving sub-base (X moving member) 9 is provided so as to be guided by guides 10 and 10 and movable in the X direction. 9a is a back plate at the upper part of the X moving sub-base 9 and 9b is a bottom plate at the lower end of the X moving sub base 9, and a gap 9 is provided between the back plate 9a and the bottom plate 9b.
c. A Y moving member 11 is provided on the bottom plate 9b below the X moving sub-base 9 so as to be movable in the Y direction.
A push-up tool 12 is provided on the Y moving member 11. The push-up tool 12 pushes up the semiconductor chip to be bonded from the lower side of the wafer 3 to assist the pickup by the pickup suction tool (16a) described later. The push-up tool 12 may protrude from the lower part of the wafer 3, and is lowered by about 20 mm at the end of push-up in order to avoid interference once during bonding.

Reference numeral 13 denotes an intermediate positioning portion fixed to the X moving sub-base 9, which corrects the position and orientation of the semiconductor chip, and is located outside the moving stroke range of the Y moving member 11, specifically, in FIG. It is provided diagonally to the upper right. The intermediate positioning portion 13 is a pyramid-shaped pocket, and when it is dropped into a chip, the position and the direction are accurately positioned.

The intermediate positioning portion 13 basically serves to prevent the tact from becoming long. That is, as will be seen in the operation description below, the die bonder performs the pickup of the chip and the bonding by different suction tools to shorten the moving stroke of each suction tool so that the tact does not become long. ,for that purpose,
It is necessary that the picked-up chip is placed somewhere and the suction tool for bonding it picks up, that is, relays, but the intermediate positioning portion 13 plays the role of relaying.

However, not only that, the intermediate positioning portion 13 also plays a role of correcting a fine positional deviation picked up by the suction tool. That is, when the chip is sucked by the suction tool, there are many cases where the position and orientation are slightly different depending on the suction method. Then, the deviation may cause a defect. Therefore, even if the chip is picked up by the suction tool, it is not bonded as it is, but is once positioned with extremely high accuracy by the intermediate positioning portion 13, and then the chip is picked up again for bonding to improve the accuracy of the bonding position. Of. If there is a deviation in the suction position of the chip by the suction tool or in the direction of the chip, the intermediate positioning portion 13 will shift the position and direction in the process of falling into the pyramid pocket unless the deviation deviates from a certain range and is large. It will correct the gap.

Reference numerals 14a and 14b denote Y moving members provided on the back plate 9a above the X moving sub-base 9 so as to be movable in the Y direction, and can move independently of each other on the same Y axis when viewed from above. Is provided. Reference numerals 15a and 15b denote Z moving members provided on the Y moving members 14a and 14b, which are provided so as to be movable in the Z direction (vertical direction).
The Z moving member 15a has a pickup suction tool 16a.
And a camera 17 are provided.

The pick-up suction tool 16a vacuum-sucks the semiconductor chip of the wafer 3 and conveys it onto the intermediate positioning portion 13. The camera 17 recognizes the position of a chip and detects a bad mark (a mark attached to a defective chip) (a chip in which a bad mark is detected is naturally die-bonded).

Reference numeral 16b denotes a bonding suction tool attached to the Z moving member 15b.
The chip positioned by being placed on the intermediate positioning portion 13 by a is vacuum-sucked and bonded to a predetermined position of the lead frame on the bonding frame mounting table 8. Reference numeral 18 denotes a dispenser for dropping the adhesive resin in advance onto the chip-bonding position of the lead frame, and is attached to a Z moving member 15c provided on the Y moving member 14b so as to be movable in the Z direction (vertical direction).

The pickup suction tools 16a and 16b attached to the X-moving sub-base 9 are arranged so as to move on one axis extending in the Y direction when viewed from above, and the intermediate positioning portion 13 is also provided. Is located below the axis of the pickup when viewed from above,
Is located at a position where the movement range of the bonding suction tool 16b and the movement range of the bonding suction tool 16b are in contact with each other.

Further, in FIG. 1, the wafer 3 is notched so that the push-up tool 12 therebelow can be seen, and it is easy to give an illusion to the positional relationship between the push-up tool 12 and the wafer 3. The wafer 3 is located below the wafer 3 and is picked up while the wafer 3 is located between the push-up tool 12 and the pickup suction tool 16a. Also,
The die bonding apparatus has various mechanisms such as a transfer mechanism for transferring the lead frame 6 from the bracket 5 to the bonding frame mounting table 8, jigs, and members.
For the sake of convenience, illustrations of those not directly related to the essence of the present invention are omitted.

Next, the operation of the die bonder shown in FIG. 1 will be described. 2A to 2D are perspective views for explaining the operation.

The dicing frame 4 for holding the wafer 3 after dicing is held in a cantilevered state by the wafer holding bracket 2, and one lead frame 6 on the bracket 5 is attached by a transfer mechanism (not shown) to the bonding frame mounting table. 8) Transfer, position and place.
The wafer is set by manually adhering the wafer to the ring and the sheet in advance, but it is also possible to attach an automatic wafer loader as an option and set the wafer automatically. is there.

First, a paste-like adhesive is applied to the lead frame 6 on the bonding frame mounting table 8 at each bonding position (die pad) by the dispenser 18. This is done by teaching performed based on the shape of the lead frame and the like.

Next, as shown in FIG. 2A, the X moving sub-base 9 is moved to position the camera 17 on one chip row, and the X moving sub-base 9 is locked there. Then, the camera 17 is searched for non-defective semiconductor chips (chips without bad marks),
recognize.

Next, when a non-defective chip is found, the Y moving member 11 and the Y moving member 14a are moved so that the push-up tool 12 and the pickup suction tool 16a are located below and above the target chip. . After the completion of the movement, the push-up tool 12 pushes up the chip, and the pickup suction tool 16a vacuum-sucks the chip, as shown in FIG. 2 (B).

Next, as shown in FIG. 2C, the pickup suction tool 16a carries the chip onto the intermediate positioning portion 13. Specifically, the Z moving member 15a moves upward,
The Y moving member 14a moves in the Y direction to position the pickup suction tool 16a on the intermediate positioning portion 13, and the Z moving member 15a moves downward to lower the chip to a position just above the intermediate positioning portion 13. , Reduce the vacuum suction force. Then, the chip falls on the intermediate positioning portion 13 and is positioned.

The pick-up suction tool 16a is moved immediately above the next non-defective chip when the chip is placed on the intermediate positioning portion 13. Similarly, the push-up tool 12 can be moved under the same non-defective chip. Then, the pickup suction tool 16a picks up the new chip.

After the pickup suction tool 16a finishes the pickup, the bonding suction tool 16b is moved onto the intermediate positioning portion 13 and, as shown in FIG. 2 (D), the positioned chips thereon. Adsorb. On the other hand, the X moving sub-base 9 moves in the X direction so that the bonding suction tool 16b can be positioned at the die bonding position of the lead frame. The bonding suction tool 16 moves in the X direction and the Y moving member 14 moves.
When it reaches the die bonding position due to the movement of b, die bonding is performed. It should be noted that the present die bonding apparatus is also capable of scrubbing.

When the die bonding is completed, the next non-defective chip is searched by the camera 17 with the pickup by the pick-up suction tool 16a (however, the pick-up suction tool 16a is currently in front of the non-defective chip to be searched). In order to prepare for a non-defective chip), the X moving sub-base 9 moves in the X direction, and the pickup suction tool 16a drops the chip currently picked up into the intermediate positioning portion 13.

Thereafter, the above operation is repeated. When die bonding for one lead frame is completed by repeating this operation cycle, the lead frame 6 is sent to the next step (curing step of passing through a paste cure furnace) by a pusher cylinder (not shown).

By the way, the length of the lead frame is usually 1
It is about 50 to 250 mm, and the X movement sub-base 9 has the same movable range and can sufficiently cope with an 8-inch wafer, and when the movable range is set to 250 mm, a 10-inch wafer can be obtained. Correspondence is also possible.

According to this die bonder, a compact die bonder of 400 mm × 700 mm, which is the smallest class in the industry, can be realized as an automatic die bonder, and the space efficiency can be remarkably improved by about 8 times as much as the conventional one.
In-line time takt (wire bonding 1-2
In order not to violate the stupidity of shortening it,
Since it is not necessary to use many actuators (motors, cylinders), the price can be reduced to about 1/5 of the conventional price.

If the actuator is not frequently used, the structure is simple and the number of failures is small, so that the maintenance cost can be reduced, the number of operation switches can be reduced, and the operation is easy. Training will enable in-line operation and management.

Further, since it did not impose the foolishness of making the tact time faster, it was not necessary to lengthen the curing furnace in the next step of bonding, and the total length of the inline was not lengthened. I'm done. Also, since the whole inline can be downsized, the management range of the worker is inevitably narrowed, the work efficiency is improved, and the quality of management is also greatly improved.

Since the tact time is not unduly lengthened, the number of times of setup occurrence is reduced and the operating rate per facility can be increased by about 15%.

[0045]

[Modification] FIGS. 3A and 3B are perspective views showing another modification of the die bonding apparatus shown in FIG.

In the die bonding apparatus shown in FIG. 3A, the intermediate positioning portion 13 is removed from the X moving sub base 9, and the base 1 is removed.
The positional relationship with respect to is fixed.

The die-bonding apparatus shown in FIG. 3B eliminates the intermediate positioning portion 13 itself, and does not provide a pickup suction tool and a bonding suction tool, but uses one suction tool 16 to perform pickup and bonding. In this die bonder,
A dispenser 18 and a camera 17 are attached to one Y moving member 14.
And the suction tool 16 is attached.

The push-up tool 12 is moved to the X movement sub-base 9
It is also possible to provide a stage that moves in the X direction and the Y direction on the side of the base 1 instead of fixing the push-up tool 12 to the stage.

As described above, the die bonding apparatus of the present invention can be implemented in various forms.

[0050]

According to the first aspect of the die bonding apparatus of the present invention, since the wafer is fixed, the range of movement of the member on the chip suction side is about the area of the wafer, and the wafer is mounted. The size of the wafer table can be remarkably reduced as compared with the conventional die bonder in which the X-direction and Y-direction movement strokes of the wafer table must be twice the diameter of the wafer.

According to the second die bonding apparatus of the present invention, once the position of the X moving member in the X direction is determined,
Positioning in the operation of the suction tool and the push-up tool need only be performed in the Y direction on the X moving member.

Therefore, the positioning operation is simple. still,
The reason why the size can be significantly reduced as compared with the conventional die bonder is the same as in the case of the first die bonder of the present invention.

According to the third die bonding apparatus of the present invention, since the intermediate positioning portion is provided on the X moving sub-base,
When correcting the position, it is not necessary to move the X moving sub-base in the X direction, and the chip can be transferred from the pickup suction tool to the bonding suction tool on the X movement sub base through the position correction at the intermediate positioning portion. The required time tact can be ensured extremely easily, and the chip can be die-bonded in the correct direction at the correct position.

The pickup suction tool and the bonding suction tool are arranged to move on one axis extending in the Y direction when viewed from above, and the intermediate positioning portion is below the axis, so the pickup suction tool is used. The tool and the bonding suction tool do not need to be positioned in the X direction in the operation, and only the operation in the Y direction need be performed, so that the operation and the positioning are simple.

[Brief description of drawings]

FIG. 1 is a perspective view showing a first embodiment of a die bonding apparatus of the present invention.

2A to 2D are perspective views for explaining the operation of the die bonding apparatus shown in FIG.

FIG. 3A and FIG. 3B are perspective views showing different modified examples of the die bonding apparatus.

FIG. 4 is a perspective view showing a conventional example of a die bonding apparatus.

[Explanation of symbols]

1 ... Base, 2 ... Wafer support means, 3 ... Wafer, 6 ... Lead frame, 9 ... X moving member (X moving sub-base), 12 ... Push-up tool, 13.
..Intermediate positioning part, 16a ... Suction tool for pickup, 16b ... Suction tool for bonding.

Claims (3)

[Claims] 1. A chip that constitutes a wafer is pushed up from below by a push-up tool and sucked by a suction tool from above,
In a die-bonding device that repeats the operation of conveying the sucked chips to a position to be bonded and bonding them one by one, the wafer holding position is fixed, and an X moving member is provided so as to be movable in the X direction. A die-bonding device, wherein the X moving member is provided with a push-up tool that is movable in the Y direction. 2. A chip constituting a wafer is pushed up from below by a push-up tool and sucked from above by a suction tool,
In a die-bonding device that repeats the operation of conveying the sucked chips to a position where they should be bonded and bonding them one by one, the wafer holding position is fixed, and an X moving member is provided so as to be movable in the X direction. A die-bonding apparatus, wherein the X moving member is provided with a suction tool and a push-up tool that extend in the Y direction and can move on the same axis line when viewed from above. 3. A chip constituting a wafer is pushed up from below by a push-up tool and sucked from above by a suction tool,
In a die-bonding device that repeats the operation of conveying the sucked chips to the bonding position and performing the bonding to die-bond the chips one by one, the wafer holding position is fixed, and an X moving member is provided so as to be movable in the X direction. The X moving member is provided with a pickup suction tool and a bonding suction tool so as to be movable on the same axis line extending in the Y direction, and the pickup suction tool and the bonding suction tool of the X movement member move. The intermediate positioning portion is fixed at a position corresponding to the lower side of the Y-direction axis line, the chip is sucked by the bonding suction tool and conveyed to the intermediate positioning portion for positioning, and the positioned chip is sucked for bonding. Use tools to transfer to the bonding position on the bond stage and bond Die bonding apparatus characterized by comprising in the so that.