JP2002033337A - Component-mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a component-mounting device, capable of accurately mounting a component on a prescribed position on a substrate. SOLUTION: A collet 71a sucks and carries the component 3 from a component supply part 4 to a posture correction part 6 and places the component 3 on a relay table 6c. The component 3 is clamped between a positioning part 6a and the positioning part 6b, and the attitude is corrected, so as to make the component end faces 3a and 3b be parallel with respect to a parallel light beam B. A dimension measurement part 9 measures a component length to compute the position deviation amount between a component center position and a component suction position. The collet 72a sucks and carries the component 3, whose attitude is corrected in a prescribed direction from the attitude correction part 6 to a component-mounting part 5. An operation control part corrects the positional deviation amount so as to make the collet 72a mount the component 3 on the prescribed position on the substrate 2. As a result, the component is positioned and mounted accurately, regardless of the positional deviation between the component center position and the component suction position or the dispersion of a component dimension.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting apparatus for mounting a component at a predetermined position on a board.

[0002]

2. Description of the Related Art FIG. 10 is a plan view and a front view schematically showing a main part of a conventional component mounting apparatus.
10B is a component supply unit, FIG. 10B is a posture correction unit, and FIG. 10C is a component mounting unit. As shown in FIG. 10, the conventional component mounting apparatus 101 includes a component supply unit 104.
, A component mounting unit 105, a posture correction unit 106, and a component transport unit 107. Conventional component mounting apparatus 101
Then, when the component supply unit 104 supplies the component 103, the component transport unit 107 picks up the component 103, transports the component 103 to the attitude correction unit 106, and the attitude correction unit 106
Correct the direction and position of. Then, the component transport unit 107 picks up the component 103 again by the posture correction unit 106, transports the component 103 to the component mounting unit 105, and mounts the component 103 at a predetermined position on the board 102. An adhesive is applied on the substrate 102 in advance, and the component 103 is fixed on the substrate 102.

[0003]

However, in the conventional component mounting apparatus 101, when the component 103 is picked up by the posture correction unit 106, the position is shifted between the center position of the component 103 and the picked-up position of the component 103. Position error). In particular, in the conventional component mounting apparatus 101, since the dimensions of the component 103 vary during the manufacturing process, it is difficult to completely correct the position and the direction of the component 103 by the posture correction unit 106, resulting in a displacement. There was something. As a result, there is a possibility that the component 103 may be mounted at a position shifted from a predetermined position on the substrate 102.

[0004] It is an object of the present invention to provide a component mounting apparatus capable of accurately mounting a component at a predetermined position on a substrate.

[0005]

The present invention solves the above-mentioned problems by the following means. Note that the description will be given with reference numerals corresponding to the embodiments of the present invention, but the present invention is not limited to this. The invention according to claim 1 is a component mounting apparatus for mounting a component (3) at a predetermined position on a substrate (2), wherein the component supply unit (4) to which the component is supplied.
A posture correction unit (6) for correcting the posture of the component in a predetermined direction, a component mounting unit (5) for mounting the component on the board, and the component supply unit to the component correction unit. And a component transport unit (7) that sucks and transports the component from the attitude correction unit to the component mounting unit, and the component transport unit transfers the component from the attitude correction unit to the component mounting unit. A dimensional measuring unit (9) for irradiating light to the part whose posture has been corrected in the predetermined direction to measure the dimension (L ₀ ) of the part when transporting, and based on a measurement result of the dimensional measuring unit. A displacement amount calculator (10) for calculating a displacement amount (ΔL) between the center position (P ₁ ) of the component and the suction position (P ₂ ) of the component;
An operation control unit (1) including an operation control unit (11) that corrects the displacement amount and controls the operation of the component transport unit so that the component transport unit mounts the component at a predetermined position on the substrate. ).

According to a second aspect of the present invention, in the component mounting apparatus according to the first aspect, the posture correcting section is configured to detect the parallel light rays (B) emitted by the dimension measuring section from the component end surfaces (3a, 3a).
b) correcting the orientation of the component in a direction in which the component becomes parallel, and the dimension measuring unit emits the parallel light beam to the light emitting unit (9a).
A light receiving unit (9c) for receiving a light beam other than the light beam reflected by the component among the parallel light beams; and a light beam passing through the component end face among the parallel light beams received by the light receiving unit. And a center position measuring unit (9e) for measuring the center position of the component.

[0007] The third aspect of the present invention is the first or second aspect.
In the component mounting device described in the above, when the dimensions of the component vary, the operation control unit may mount the component on the substrate at a predetermined interval (g) based on the component end surface. And a component mounting device for controlling the operation of the component transport unit.

[0008]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 is a plan view of a component mounting apparatus according to an embodiment of the present invention. FIG.
1 is a front view of a component mounting device according to an embodiment of the present invention. FIG. 3 is a side view of the component mounting apparatus according to the embodiment of the present invention. 4A and 4B are a plan view and a front view schematically showing a main part of the component mounting apparatus according to the embodiment of the present invention. FIG. 4A shows a component supply unit, and FIG. FIG. 4C is a dimension measurement unit, and FIG.
(D) is a component mounting part. FIG. 5 is a block diagram of the component mounting apparatus according to the embodiment of the present invention.

The component mounting device 1 is a device for mounting a component 3 at a predetermined position on a substrate 2. The substrate 2 is a lead frame, a package, or the like. The component 3 is an electronic component such as a die (semiconductor chip) obtained by cutting a wafer. As shown in FIGS. 1 to 5, the component mounting apparatus 1 includes a component supply unit 4.
, A component mounting unit 5, a posture correction unit 6, and a component transport unit 7
, An imaging unit 8, a dimension measurement unit 9, and a displacement amount calculation unit 1
0 and an operation control unit 11.

The component supply section 4 is a section to which the component 3 is supplied. As shown in FIGS. 1 to 5, the component supply unit 4 includes a linear table 4a, a linear motor 4b, a position detection unit 4c, and a wafer table 4d. The linear table 4a shown in FIGS.
Position. Linear motor 4b shown in FIGS.
Is a motor that drives the linear table 4a in the Y-axis direction. The position detector 4c shown in FIG.
This is a device that detects the drive position of “a” and outputs a current position signal to the operation control unit 11. Wafer table 4 shown in FIGS.
Reference numeral d denotes a pickup stage on which a wafer sheet (adhesive resin tape) holding the component 3 is mounted, and the component 3 is picked up from the wafer sheet.

The component mounting section 5 is a portion where the component 3 is mounted on the board 2. As shown in FIG. 1, the component mounting section 5 includes a table 5a and a board magazine 5b.
The table 5a is a place stage on which the component 3 is mounted at a predetermined position on the substrate 2. The substrate magazine 5b is a device for automatically replacing the substrate 3.

The posture correcting section 6 is a device for correcting the posture of the component 3 in a predetermined direction. The posture correction unit 6 is configured as shown in FIG.
As shown in (C), the orientation of the component 3 is corrected in a direction in which the component end faces 3a and 3b become parallel to the parallel light beam B emitted by the dimension measuring unit 9. As shown in FIGS. 4 and 5, the posture correcting section 6 includes a positioning section 6 a, 6 b and a relay table 6.
c and a slide drive unit 6d. FIG. 4 (B)
Is a substantially L-shaped member for positioning the component 3, and is fixed on the table 6c. The positioning portion 6b is a member that presses the component 3 toward the positioning portion 6a and sandwiches and positions the component 3 with the positioning portion 6b. The relay table 6c is an intermediate stage arranged between the component supply unit 4 and the component mounting unit 5, as shown in FIG. Slide drive unit 6d shown in FIG.
Is a drive device for sliding the positioning portion 6b in the direction of the arrow on the relay table 6c.

The component transport unit 7 is a device that sucks and transports the component 3 from the component supply unit 4 to the attitude correction unit 6 and sucks and transports the component 3 from the attitude correction unit 6 to the component mounting unit 5. As shown in FIG. 1, the component transport unit 7 includes a first transport unit 7.
1 and a second transport section 72. In this embodiment, since the first transport unit 71 and the second transport unit 72 are driven in the same direction to make the pick-up operation and the place operation independent, the mounting operation can be speeded up.

The first transport unit 71 is a device for sucking and transporting the component 3 from the component supply unit 4 to the attitude correcting unit 6. As shown in FIGS. 1 to 5, the first transport unit 71 includes a collet 71a.
, An arm 71b, a lifting drive unit 71c, a linear table 71d, a linear motor 71e, a position detection unit 71
f, retraction drive 71g, push-up unit 71h
, An under arm 71i, and a lifting drive unit 71j.

The collet 71a is a suction holder for sucking and holding the component 3. Collet 71 shown in FIGS.
a picks up the component 3 from the wafer table 4d and releases the component 3 by suction on the relay table 6c. Arm 71
b is a member that supports the collet 71a. 5 is a device that drives the collet 71a in the vertical direction. The linear table 71d shown in FIGS. 1 and 3 is a positioning device that moves and positions the arm 71b, the under arm 71i, the imaging unit 8, and the like in the X-axis direction. The linear table 71d moves from the component supply unit 4 to the attitude correction unit 6 when the collet 71a sucks the component 3, and returns from the attitude correction unit 6 to the component supply unit 4 when the collet 71a releases the component 3. Linear motor 71e
Is a motor that drives the linear table 71d in the X-axis direction. 5 is a sensor that detects the drive position of the linear table 71d, and outputs a current position signal to the operation control unit 11. The retraction drive 71g shown in FIGS. 1, 3, and 5 is a device that retreats and drives the collet 71a. The reversing drive unit 71g is configured such that the imaging unit 8
Since the collet 71a is in the way when performing the imaging, the collet 71a is driven together with the arm 71b in the Y-axis direction to temporarily retract the collet 71a from the imaging range of the imaging unit 8. The push-up unit 71h shown in FIGS. 1 to 3 is an apparatus for separating the component 3 from the wafer sheet of the wafer table 4d. The push-up unit 71h is shown in FIGS.
As shown in FIG. 3, the collet 71a is located immediately below the position where the component 3 is sucked. The push-up unit 71h includes an ejector pin. When the collet 71a sucks the component 3, the component 3 is pushed up from below the component 3 by the ejector pin, and the component 3 is separated from the wafer sheet. The under arm 71i is a member that supports the push-up unit 71h. 2 is a device that drives the push-up unit 71h in the up-down direction.
When the first transport unit 71 moves from the component supply unit 4 to the posture correction unit 6, the lifting drive unit 71j raises the push-up unit 71h.
In order not to collide with the attitude correction unit 6, and to make the retracted push-up unit 71 h approach the wafer table 4 d when the first transport unit 71 moves from the attitude correction unit 6 to the component supply unit 4. And push-up unit 71h
Is driven up and down.

The second transport section 72 is a device for sucking and transporting the component 3 from the attitude correcting section 6 to the component mounting section 5. As shown in FIGS. 1 to 5, the second transport section 72 includes a collet 72 a
, Arm 72b, lifting drive 72c, linear table 72d, linear motor 72e, position detector 72
f. The second transport unit 72 includes the first transport unit 71
Is a structure of only a part for sucking and conveying the component 3 in the above, and the structure will be briefly described below. 1 and 4
The collet 72a shown in FIG.
Is picked up, and the component 3 is released by the board 2 on the table 5a. The linear table 72d shown in FIG. 1 is a positioning device that moves and positions the arm 72b in the X-axis direction. The linear table 72d includes a collet 72a.
Moves from the posture correction unit 6 to the component mounting unit 5 when the component 3 is sucked, and returns from the component mounting unit 5 to the posture correction unit 6 when the collet 72a releases the component 3 from suction. Linear motor 72e
Is a motor for driving the linear table 72d in the X-axis direction. 5 is a sensor that detects the drive position of the linear table 72d, and outputs a current position signal to the operation control unit 11.

The imaging section 8 is an apparatus for imaging the component 3. The imaging unit 8 is a CCD camera or the like that recognizes a center position (suction position) when the collet 71a sucks the component 3 and that recognizes a defective mark displayed on the component 3 in order to prevent suction of a defective product. is there. As shown in FIGS. 1 to 3, the imaging unit 8 is installed at a position where the collet 71 a sucks the component 3 and directly above the push-up unit 71 h. When the imaging unit 8 captures an image of the component 3, the collet 71a
Is in the imaging range and interferes with the imaging of the component 3, so that the retraction driving unit 71g temporarily retracts the collet 71a from the imaging range. The imaging unit 8 outputs the captured image information to the operation control unit 11.

FIG. 6 is a perspective view of a dimension measuring unit of the component mounting apparatus according to the embodiment of the present invention. FIG. 7 is a diagram for explaining a measuring operation of the dimension measuring unit in the component mounting apparatus according to the embodiment of the present invention. When the component transporting unit 7 transports the component 3 from the attitude correcting unit 6 to the component mounting unit 5, the dimension measuring unit 9 irradiates light to the component 3 whose orientation has been corrected in a predetermined direction, and measures the dimension of the component 3. Is a device for measuring
The dimension measuring unit 9 is, for example, a laser length measuring device that irradiates a laser beam to measure the length of the component 3. Dimension measurement unit 9
As shown in FIGS. 5 and 6, the light emitting unit 9a, the slit units 9b and 9d, the light receiving unit 9c, and the center position measuring unit 9e
And As shown in FIG. 6, the dimension measuring unit 9
It is arranged above the posture correction unit 6.

The light emitting section 9a is a device that emits a parallel light beam B. Emitting portion 9a, as shown in FIG. 7, the measurement start position (reference position) toward the P _S to the measurement end position P _E, scans the component end face 3a, the collimated beam B parallel to 3b in the direction A . The slit portion 9b is a rectangular opening that limits the irradiation area of the parallel light beam B irradiated by the light emitting section 9a within a predetermined range (within the opening area). FIG. 7 shows the slit portion 9b.
As shown in (1), one short side overlaps the measurement start position P _S, and the other short side overlaps the measurement end position P _E.

The light receiving portion 9c is a device for receiving light beams other than the light beams reflected by the component 3 among the parallel light beams B emitted by the light emitting portion 9a. The light receiving unit 9c receives the parallel light beam B in synchronization with the scanning timing of the light emitting unit 9a. 9d slit
Is an opening that allows only the parallel light beam B passing through the slit 9b to enter the light receiving portion 9d, and has the same shape as the slit 9b.

The center position measuring unit 9e on the basis of the light passing through the component end face 3a, and 3b of the parallel rays B to the light-receiving portion 9c are received, a device for measuring the component center position P _1. Center position measuring section 9e, based parallel rays B projected image of the component 3 side of the part 3 becomes shadow reflected (dark portion), the distance from the measurement start position P _S to one part end face 3a L _1, calculates the distance L ₂ from the measurement start position P _S to the other part end face 3b to measure this component length L _0.

The displacement calculator 10 calculates the displacement ΔL between the component center position P ₁ and the component suction position P ₂ based on the measurement result of the dimension measuring unit 9. Collet 72a, as shown in FIG. 7, the measurement start position P _S
To pick up the components 3 and elevating operation at a fixed distance L ₃ relative to the distance L ₃ between the measurement start position P _S and the component pickup position P ₂ is a constant value. The displacement calculating unit 10 calculates
Distance L half part length L ₀ (L _0/2) and the distance L ₁ and the measurement start position P _S by adding to component center position P _1
4 as well as calculating a difference between the distance L ₃ and the distance L ₄ calculates, for calculating a positional deviation amount [Delta] L.

The operation control unit 11 shown in FIG. 5 is a central processing unit (CPU) for controlling various operations of the component mounting apparatus 1. The operation control unit 11 controls the operation of the component transport unit 7 by correcting the positional deviation amount ΔL output by the dimension measuring unit 9 so that the component transport unit 7 mounts the component 3 at a predetermined position on the substrate 2. In addition, the operation control unit 11 includes the position detection units 4c, 71
The operation of the linear motors 4b, 71e, and 72e is controlled based on the current position signals output by the f and 72f.
The operation of the elevation drive units 71c and 72c and the slide drive unit 6d is controlled.

The storage section 12 is a memory for storing correction data for correcting the positional deviation amount ΔL according to the component shape. The storage unit 12 stores a correction value or the like for correcting the output signal because the output signal of the light receiving unit 11c changes depending on whether the component shape is a square or a circle. The storage unit 12 stores the position shift amount Δ
When correcting L, correction data is output as needed. In this embodiment, the positional deviation amount Δ
In order to correct L with high accuracy, the mounting speed can be improved.

Next, the operation of the component mounting apparatus according to the embodiment of the present invention will be described. FIG. 8 is a flowchart for explaining the operation of the component mounting apparatus according to the embodiment of the present invention. In step (hereinafter, referred to as S) 100, the component supply unit 4 supplies the component 3. The part 3 is divided into a plurality of parts by a dicing device (not shown).
It is mounted on the wafer table 4d. When the operation control unit 11 drives and controls the linear motor 4b, the linear table 4
a transports the part 3 to the supply position. When the operation control unit 11 controls the driving of the linear motors 4b and 71c, the linear table 4a moves in the Y-axis direction and the linear table 71d moves in the X-axis direction, and the component 3 is moved to a predetermined position in the XY plane. Positioned. The operation control unit 11
Based on the image information output by the imaging unit 8, it is determined whether the component 3 is good or defective, and the center position of the component 3 is recognized.

In S200, the first transport section 71 sucks the component 3. When the ejector pins provided in the push-up unit 71h push up the component 3 to separate the wafer sheet from the component 3, the operation control unit 11 causes the elevation drive unit 71 to move.
c is driven and controlled. As a result, as shown in FIG. 4A, the collet 71a descends, sucks the component 3, and rises to a predetermined height.

In step S300, the first transport unit 71 transports the component 3 from the component supply unit 4 to the attitude correcting unit 6. The operation control unit 11 drives and controls the linear motor 71e based on the current position signal output from the position detection unit 71f so that the linear table 71d drives to the target position, and moves the linear table 71d to the posture correction unit 6. And stop. When the operation control unit 11 drives and controls the elevation drive unit 71c, the collet 71a descends and places the component 3 on the relay table 6c as shown in FIG. 4B.

In S400, the posture correction unit 6
Correct the posture of the player. The drive control unit 11 is a slide drive unit 6
When the driving of d is controlled, the positioning section 6b slides on the relay table 6c. As a result, as shown in FIGS. 4B and 6, the component 3 is sandwiched between the positioning portion 6a and the positioning portion 6b, and the component end surfaces 3a and 3b become parallel to the parallel light beam B. The posture of No. 3 is corrected.

In S500, the second transport section 72 sucks the component 3. When the operation control section 11 drives and controls the elevation drive section 72c, as shown in FIGS. 4C and 6, the collet 72a descends and sucks the component 3 whose posture has been corrected in a predetermined direction. Then, the collet 72a moves up to a position where the light emitting unit 9a and the light receiving unit 9c face each other.

In step S600, the dimension measuring unit 9 sets the component 3
Measure the dimensions of As shown in FIG. 7, the measurement start position P
To scan the collimated light beam B toward the measurement end position P _E of _S, the drive control unit 11 controls the operation of the light emitting portion 9a.
As a result, the center position measuring unit 9e measures the component length L _0.

In step S700, the displacement amount calculating unit 10
Calculates the displacement amount ΔL. Position shift amount calculation unit 10
Calculates the positional deviation amount ΔL between the component center position P ₃ and the component suction position P ₂ based on the measurement result of the dimension measuring unit 9.

In S800, the second transport section 72 transports the component 3 from the attitude correction section 6 to the component mounting section 5. The operation control unit 11 drives and controls the linear motor 72e based on the current position signal output from the position detection unit 72f so that the linear table 72d drives to the target position, and moves the linear table 72d to the component mounting unit 5. And stop.

In S900, the second transport section 72 mounts the component 3 at a predetermined position on the substrate 2. When the operation control unit 11 controls the operation of the linear motor 72e so as to correct the target position by the displacement amount ΔL, the linear table 72d moves in the X-axis direction to correct the displacement amount ΔL. As a result, when the operation control section 11 drives and controls the elevation drive section 72c to lower the collet 72a, the component 3 is mounted at a predetermined position on the substrate 2.

FIG. 9 is a view for explaining the mounting operation when the dimensions of the components vary in the component mounting apparatus according to the embodiment of the present invention. As shown in FIG. 9, the dimensions of the component 3 vary due to a displacement or the like when the dicing apparatus cuts the wafer. The dimension measuring section 9 calculates the component length L ₀₁ ,
L ₀₂ and L ₀₃ are measured, and the positional deviation amounts ΔL ₀₁ , ΔL ₀₂ , and ΔL ₀₃ are calculated for each of the components 3 by the positional deviation amount calculating unit 10.
Is calculated. The operation control unit 11 calculates the displacement amount Δ
The drive of the linear motor 72e is controlled so as to correct L ₀₁ , ΔL ₀₂ , and ΔL ₀₃ . As a result, the component 3 is mounted on the board 2 with a mounting interval g based on the component end face 3a regardless of the variation in the dimensions of the component 3.

The component mounting apparatus according to the embodiment of the present invention has the following effects. (1) In this embodiment, by irradiating light to the component 3 posture is corrected in the predetermined direction, and calculates the position displacement amount ΔL between the component center position P ₁ and the component suction position P _2, the substrate 2 The position shift amount ΔL is corrected so that the component 3 is mounted at the upper predetermined position. For this, and if the adsorbed parts 3 at a position shifted from the component center position P _1, even if there are variations in individual size of the parts 3, part 3 to a predetermined position on the substrate 2
Can be positioned with high accuracy, and the mounting accuracy can be improved.

(2) In this embodiment, the orientation of the component 3 is corrected so that the component end faces 3a and 3b become parallel to the parallel light beam B, and the component end faces 3a and 3
component center position P ₁ on the basis of the light passing through the b is measured. As a result, since the posture of the component 3 is corrected in a predetermined direction before measuring the dimensions of the component 3, the structure of the device can be simplified and the mounting speed can be improved.

(3) In this embodiment, when there is a variation in the dimensions of the component 3, the component transport section 72 is mounted such that the component 3 is mounted on the board 2 at a predetermined interval g based on the component end surface 3a. Is controlled by the operation control unit 11. For example,
Scanning semiconductor elements used in copiers and the like must be mounted on a sensor substrate so that the intervals between the elements are uniform. Thus, when the mounting position accuracy relative to the component center position P ₁ rather than the component end face 3a is required, even if there are variations in the size of the part 3, it is possible to improve the mounting accuracy.

The present invention is not limited to the embodiment described above, but various modifications or changes can be made as described below, and these are also within the scope of the present invention. (1) In this embodiment, a die bonding apparatus for mounting a die on a lead frame or the like has been described as an example.
The present invention can also be applied to a chip mounter for mounting a molded chip on a printed circuit board. Further, in this embodiment, the component 3 is sandwiched and positioned between the positioning portion 6a and the positioning portion 6b. However, the component 3 may be positioned by suctioning the component 3 with a nozzle or the like.

(2) In this embodiment, the first transport unit 71 performs the pick-up operation, and the second transport unit 72 performs the place operation. However, these operations may be performed by a single transport device. In this embodiment, the mounting position of the component 3 in the X-axis direction is corrected. However, two dimension measuring units 9 are installed to measure the length and width of the component 3, and the X-axis direction and the component 3 are measured. The mounting position in the Y-axis direction may be corrected.

[0040]

As described above, according to the present invention, a part whose posture is corrected in a predetermined direction is irradiated with light,
Calculates the amount of misalignment between the center position of the component and the pick-up position of the component, and corrects the amount of misalignment so that the component is mounted at a predetermined position on the board. Can be installed.

[Brief description of the drawings]

FIG. 1 is a plan view of a component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a front view of the component mounting apparatus according to the embodiment of the present invention.

FIG. 3 is a side view of the component mounting apparatus according to the embodiment of the present invention.

4A and 4B are a plan view and a front view schematically showing a main part of the component mounting apparatus according to the embodiment of the present invention, wherein FIG. 4A is a component supply unit, FIG. (C) is a dimension measuring unit, and (D) is a component mounting unit.

FIG. 5 is a block diagram of the component mounting apparatus according to the embodiment of the present invention.

FIG. 6 is a perspective view of a dimension measuring unit of the component mounting apparatus according to the embodiment of the present invention.

FIG. 7 is a diagram for explaining a measuring operation of a dimension measuring unit in the component mounting apparatus according to the embodiment of the present invention.

FIG. 8 is a flowchart for explaining the operation of the component mounting apparatus according to the embodiment of the present invention.

FIG. 9 is a view for explaining a mounting operation when there is a variation in dimensions of components in the component mounting apparatus according to the embodiment of the present invention.

10A and 10B are a plan view and a front view schematically showing a main part of a conventional component mounting apparatus, wherein FIG. 10A is a component supply unit,
(B) is a posture correction unit, and (C) is a component mounting unit.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Substrate 3 Component 3a, 3b Component end surface 4 Component supply part 5 Component mounting part 6 Attitude correction part 7 Component transfer part 71 First transfer part 72 Second transfer part 9 Dimension measurement part 9a Light emission part 9c Light reception part 9e Center position measurement unit 10 Position shift amount calculation unit 11 Operation control unit B Parallel rays L ₀ , L ₀₁ , L ₀₂ , L ₀₃ Component length ΔL, ΔL ₀₁ , ΔL ₀₂ , ΔL ₀₃ Position shift amount P ₁ Component center position P ₂ Parts adsorption position g Mounting interval

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Sadao Sano 5289 Nagatsuta-cho, Midori-ku, Yokohama-shi, Kanagawa Prefecture Sodick Nagatsuda Office (72) Inventor Kazuo Sato 4-4-2 Nishitenma, Kita-ku, Osaka-shi, Osaka No. F-term in Taiwa Hoyu Co., Ltd. (reference) 5E313 AA03 AA11 CC04 EE02 EE03 EE24 FF06 FF33 5F031 CA13 FA02 FA12 GA23 KA02 KA11 MA35 5F047 FA08 FA14 FA73

Claims (3)

[Claims] 1. A component mounting apparatus that mounts a component at a predetermined position on a substrate, a component supply unit to which the component is supplied, an attitude correction unit that corrects an attitude of the component in a predetermined direction, and the substrate. A component mounting unit on which the component is mounted, and a component that sucks and conveys the component from the component supply unit to the posture correcting unit, and suctions and conveys the component from the posture correcting unit to the component mounting unit. A transport unit, and when the component transport unit transports the component from the attitude correction unit to the component mounting unit, irradiates light to the component whose orientation has been corrected in the predetermined direction and measures the dimension of the component. A dimension measuring unit that performs, a displacement calculating unit that calculates a displacement between a center position of the component and a suction position of the component based on a measurement result of the dimension measuring unit; At a predetermined position on the substrate The serial parts to be worn, the component mounting apparatus comprising, an operation control unit which controls the operation of the component conveying unit by correcting the positional deviation amount. 2. The component mounting apparatus according to claim 1, wherein the posture correction unit corrects a posture of the component in a direction in which a component end face is parallel to a parallel light beam emitted by the dimension measurement unit, A light-emitting unit that irradiates the parallel light beam; a light-receiving unit that receives a light beam other than the light beam reflected by the component of the parallel light beam; and a component of the parallel light beam that the light-receiving unit receives. A center position measuring unit for measuring a center position of the component based on a light beam passing through the end face. 3. The component mounting apparatus according to claim 1, wherein the operation control unit is configured to, when there is variation in the dimensions of the component, leave a predetermined interval based on the component end surface to form the substrate. Controlling the operation of the component transport unit so as to mount the component on the component mounting device.