TWI521555B - Terminal engaging device - Google Patents

Description

Terminal joint

The present invention relates to a terminal engaging device for joining a terminal to a workpiece.

As a multilayer ceramic capacitor for surface mounting of an electronic component, a surface mounting method in which an external electrode is soldered to a wiring board is used.

However, due to the stress generated by the difference in thermal expansion coefficient between the wiring substrate and the electronic component, or the stress generated by the deflection of the wiring substrate, a laminated capacitor composed of ceramics in particular may cause a problem that the body is cracked or external. The electrode is peeled off from the body.

In order to solve this problem, a method has been previously employed in which a terminal member (hereinafter referred to as a metal terminal) made of a metal plate having elasticity is opposed to an external electrode on both sides, and the terminal member is attached to the laminated ceramic. The external electrodes on both sides of the capacitor are mounted on the wiring board, thereby mitigating the impact on the electronic component.

As a method of bonding a metal terminal to an external electrode of an electronic component, a soldering method is generally used.

As a method of attaching a lead terminal to an external electrode without using solder, for example, a method has been proposed in which a lead terminal is bonded to an external electrode using a conductive adhesive; and the lead is formed by a spot welding method or a pressure bonding method. The terminal is bonded to the external electrode; and the external electrode and the metal terminal are directly diffusion-bonded by heating and energization in a state where the external electrode is brought into contact with the metal terminal.

The electronic component, for example, a multilayer ceramic capacitor for surface mounting is in the form of a rectangular parallelepiped, prismatic or cylindrical wafer.

Therefore, in terms of manufacturing equipment, it is difficult to manufacture using the above-described method previously proposed, and it is difficult to maintain a large amount of electronic parts with metal terminals with stable quality, and it is difficult to sufficiently satisfy the metal terminals attached to electronic equipment such as computers or mobile devices. The demand for electronic parts.

Therefore, for a manufacturing apparatus capable of providing an electronic component for surface mounting with stable quality and productivity, an indexing disk method of rotating in a horizontal plane has been studied as a transfer method of a workpiece for surface mounting. A workpiece having a wafer shape such as a chip coil or a chip capacitor of an electronic component (for example, refer to JP 1997-306772 A).

The apparatus of the indexing disc disclosed in JP1997-306772A is a device for transporting a wafer core, and the apparatus is provided with a jig at a peripheral portion thereof, and the jig is formed to be oppositely formed at both ends in a direction parallel to an opposing direction of the electrodes. The wafer core having the above electrode rotates the indexing disk while the workpiece is held by the jig, thereby transferring the workpiece including the wafer core.

Next, the workpiece is subjected to various steps of processing operations by various working devices provided around the indexing disk.

However, the indexing disk disclosed in JP1997-306772A has a tendency to expand in the plane by the entire apparatus including the working device because it is rotated in the horizontal plane and various working devices are provided around it. In particular, a peripheral portion of the indexing plate is provided with a jig for holding the workpiece by the jig, and therefore, the device for holding the workpiece by the jig itself is also disposed around the indexing plate.

Further, in the manufacturing apparatus for the electronic component with the metal terminal, it is necessary to separately transport the multilayer ceramic capacitor and the metal terminal, and it is necessary to join the laminated ceramic capacitor and the metal terminal, and to provide the processing in a horizontal plane. The equipment or means of the operation further increases the area occupied by the entire device including the device for holding the ceramic capacitor or the terminal such as the above-mentioned jig.

Further, in order to bond the pair of electrodes to both ends of the workpiece via the paste-like bonding material, it is necessary to prevent the shape change due to the self-weight of the bonding material itself, and to ensure uniformity of the bonding materials applied to both ends of the workpiece. Sexually, a pair of terminals are equally joined to both sides of the workpiece.

An object of the present invention is to provide a terminal joining device capable of manufacturing electronic components for surface mounting with stable quality and productivity.

According to an aspect of the present invention, there is provided a terminal joining device including: a workpiece indexing disk that is rotatable in a vertical plane about a horizontal rotating shaft, and is capable of supporting a workpiece a bonding material coating means for applying the bonding material to both sides of the workpiece supported by the workpiece indexing plate in the direction of the rotation axis; and a terminal conveying means for conveying the pair of terminals to the workpiece indexing plate And both sides of the workpiece coated with the bonding material on both sides, and a bonding means for pressing one of the pair of terminals conveyed by the terminal transfer means to the both sides of the workpiece to which the bonding material is applied, and heating The pair of terminals are joined to the workpiece.

10‧‧‧Terminal joint device

11‧‧‧Workpiece indexing plate

11a‧‧‧ Body Department

11b‧‧‧Flange

11c‧‧‧ gap

11d‧‧‧Pit hole

11e‧‧‧1st cross hole

11f‧‧‧Handle

12‧‧‧Abutment

13, 112‧‧‧ board

14‧‧‧Workpiece transport motor

16‧‧‧1st extended rotation axis

16a‧‧‧Mounting screws

17‧‧‧1st support member

18‧‧‧Plywood for workpieces

18a‧‧‧Air tank for workpiece

18b, 77b‧‧‧ coupler

18c, 18d‧‧‧ spout gas tank

19‧‧‧Workpiece

19a, 19b‧‧‧ electrodes

20‧‧‧ terminals

20a‧‧‧Longside

20b‧‧‧ Short side

21‧‧‧Workpiece supply mechanism

22‧‧‧ hopper

23‧‧‧Parts feeder for workpieces

24‧‧‧Aspirator

31‧‧‧Joint material coating mechanism

32‧‧‧Distributor

32a‧‧‧Spray outlet

32b‧‧‧Hose

33‧‧‧Distributor moving mechanism

34‧‧‧ horizontal board

36‧‧‧1 track

37‧‧‧ movable table

37a, 109a‧‧‧ dent

38‧‧‧2nd track

39‧‧‧Mobile board

41‧‧‧temperature adjustment block

42, 47, 86, 95, 113, 118‧‧ ‧ motors

42a, 86a‧‧‧Rotary axis

43, 87, 114‧‧‧ slotted cam

44, 78, 96, 116‧‧‧ cam followers

46, 64, 94, 117‧‧‧ ball screw

48, 119‧‧ ‧ threaded components

51‧‧‧Location adjustment mechanism

52, 53‧‧‧ Pressing members

61‧‧‧Inspector

62‧‧‧ lens

63‧‧‧ illumination

65‧‧‧bump knob

70‧‧‧Terminal transport mechanism

71‧‧‧Terminal indexing plate

71a‧‧‧ body disk

71b‧‧‧1st ring member

71c‧‧‧2nd ring member

71d‧‧‧ recess

71e‧‧‧Central trough

71g‧‧‧1st through hole

71h‧‧‧2nd through hole

71j‧‧‧2nd horizontal hole

71k‧‧‧ suction hole

72‧‧‧Vertical orbit

73‧‧‧ vertical board

74‧‧‧Terminal transport motor

75‧‧‧2nd extended rotation axis

76‧‧‧2nd support member

77‧‧‧Plywood for terminals

77a‧‧‧Air tank for terminals

79‧‧‧Terminal supply mechanism

79a‧‧‧Helical spring

80‧‧‧Parts feeder for terminals

81‧‧‧Terminal lifting device

82‧‧‧XY platform

82a‧‧‧Y-axis position adjustment

82b‧‧‧X-axis position adjustment

83‧‧‧Installation table

84, 88, 92, 108, 111, 106b‧‧‧ tracks

85‧‧‧ lifting platform

89‧‧‧ terminal support

90‧‧‧ Lifting mechanism

91‧‧‧Auxiliary board

93‧‧‧Cam plate

97‧‧‧Terminal detection sensor

101‧‧‧Good product removal agency

102‧‧‧Don't move out of the agency

103‧‧‧Joining mechanism

104‧‧‧heating body

105‧‧‧heating body moving mechanism

106‧‧‧ board

106a‧‧‧ pillar

107‧‧‧ 台台

109‧‧‧ movable plate

A-A, B-B, C-C, D-D, E-E, F-F, G-G‧‧‧ lines

H‧‧‧Width

L‧‧‧ longest side

N‧‧‧ side

T‧‧‧thickness

X, Y, Z‧‧‧ axis direction

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front elevational view showing a terminal joining device according to an embodiment of the present invention.

Figure 2 is a cross-sectional view taken along line A-A of Figure 1.

Fig. 3 is a cross-sectional view taken along line B-B of Fig. 1 showing a bonding material applying mechanism.

Fig. 4 is a cross-sectional view taken along line C-C of Fig. 1 showing the joining mechanism.

Fig. 5 is a cross-sectional view taken along line D-D of Fig. 2 showing the elevating mechanism.

Figure 6 is a front elevational view of a workpiece plywood.

Fig. 7 is a front view of the overlapping plate for the terminal.

Fig. 8 is a front elevational view showing the terminal supply mechanism.

Fig. 9 is a right side view showing the terminal supply mechanism.

Figure 10 is a perspective view showing the workpiece and the terminal.

Fig. 11 is a cross-sectional view taken along line E-E of Fig. 1 showing a workpiece supply mechanism.

FIG. 12 is a plan view showing a state in which the workpiece is conveyed to the bonding material application mechanism.

Fig. 13 is a plan view corresponding to Fig. 12 showing a state in which the bonding material is applied to both sides of the workpiece.

Fig. 14 is a cross-sectional view taken along line G-G of Fig. 1 showing a state in which a pair of terminals are supported by a terminal indexing plate.

Fig. 15 is a cross-sectional view taken along line F-F of Fig. 14 showing a suction hole of the terminal indexing plate.

Fig. 16 is a cross-sectional view corresponding to Fig. 15 showing a state in which the terminal indexing disk is rotated to convey a pair of terminals to a position facing the workpiece.

Fig. 17 is a cross-sectional view corresponding to Fig. 16 showing a state in which a pair of terminals are joined to both ends of a workpiece.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

A terminal bonding apparatus 10 according to an embodiment of the present invention will be described with reference to Figs. 1 to 17 . In each of the figures, three axes X, Y, and Z orthogonal to each other are set, the X axis extends in a substantially horizontal front-rear direction, the Y-axis extends in a substantially horizontal horizontal direction, and the Z-axis extends in the vertical direction.

The terminal bonding device 10 is a device for manufacturing an electronic component with a metal terminal, and the electronic component with the metal terminal is formed by attaching a terminal to an electrode of the electronic component, and more specifically, the terminal bonding device 10 is connected via A pair of terminals are joined to the terminal engaging means on both sides of the workpiece.

Hereinafter, "(A) configuration of the terminal bonding device" and "(B) operation of the terminal bonding device" will be separately described.

(A) Composition of the terminal bonding device of the present invention

(1) Description of Overall Configuration of Terminal Bonding Device 10

Fig. 1 is a schematic front view showing the entire terminal joining device 10, and Fig. 2 is a cross-sectional view taken along line A-A of Fig. 1.

As shown in FIG. 1, the terminal joining device 10 is provided with a workpiece indexing disk 11 which is rotatable in a vertical plane centering on a horizontal rotating shaft extending in the X-axis direction.

As shown in FIG. 2, the terminal bonding device 10 includes a base 12 disposed at an installation location, and a platen 13 extending along the Y-axis direction and erected on the upper surface of the base 12 along the vertical direction; The workpiece conveyance motor 14 is attached to the platen 13 with the rotation axis being the X-axis direction, and the first extension rotation shaft 16 is coaxially attached to the rotation shaft of the workpiece conveyance motor 14.

The workpiece indexing disk 11 is formed in a disk shape and is attached to the tip end of the first extension rotary shaft 16 by a mounting screw 16a, and the workpiece transfer motor 14 is driven to rotate the first extension rotary shaft 16 . The workpiece indexing table 11 is rotatable in a YZ plane forming a vertical plane centering on a rotation axis extending horizontally in the X-axis direction.

Moreover, the handle 11f which is easy to operate the workpiece indexing plate 11 is attached to the work An indexing plate 11.

As shown in FIG. 2, the cylindrical first support member 17 surrounding the first extension rotary shaft 16 is attached to the platen 13. The workpiece overlap plate 18 superposed on the workpiece indexing plate 11 is attached to the front end of the first support member 17.

The workpiece overlap plate 18 is also disk-shaped, and the workpiece indexing plate 11 has a body portion 11a having an outer diameter substantially equal to an outer diameter of the workpiece overlap plate 18, and a flange portion 11b including a ridge, the convex portion The strips protrude from the outer circumference of the body portion 11a so as to enlarge the outer diameter of the main body portion 11a, and are connected in the circumferential direction.

As shown in Fig. 1, a notch 11c into which a workpiece 19 (Fig. 10) to be described later is inserted extends in the axial direction (X-axis direction) and is formed in a flange portion 11b constituting the periphery of the workpiece indexing plate 11.

As shown in Fig. 1, a workpiece supply mechanism 21 as a workpiece supply device is disposed on the upper right side of the workpiece indexing plate 11, and a bonding material coating mechanism 31 as a bonding material coating device is disposed on the upper left side. . Further, an inspection mechanism 61 as an inspection device is provided on the lower left side, and an engagement mechanism 103 as a bonding device is provided at a lower portion of the workpiece indexing plate 11.

When the workpiece indexing table 11 is viewed from the front, a good product carrying-out mechanism 101 as a good product carrying-out device and a defective product carrying-out mechanism 102 as a defective product carrying-out device are provided on the lower right side thereof, and the good product carrying-out mechanism 101 is carried out by the joining mechanism. In the case of the workpiece 19 having the terminals joined to the both ends, the defective product carrying-out mechanism 102 carries out the workpiece 19 which is determined to be defective by the inspection mechanism 61. The workpiece indexing table 11 is rotated to the left as indicated by the solid arrows in FIG.

In order not to cause the workpiece 19 to fall off, the workpiece indexing table 11 needs to suction and support the workpiece 19 around the workpiece supply mechanism 21 from the upper right to the good or defective product carry-out mechanisms 101 and 102 on the lower right side.

When the workpiece indexing plate 11 of Fig. 1 is viewed from the front, the workpiece supply mechanism 21 provided at the upper right side is provided with a hopper 22 that stores the workpiece 19, and a workpiece feeder 23 for the workpiece 19 that the hopper 22 supplies. The workpiece 19 is transported in a queue.

The inspection mechanism 61 is a camera 61 provided on the lower surface of the horizontal plate 34. The horizontal plate 34 is provided with a bonding material applying mechanism 31 on the upper surface, and the camera 61 is configured to pass the bonding material coating mechanism via the lens 62. 31, the state of the bonding material applied to both ends of the workpiece 19 is inspected. In this case, both ends of the workpiece 19 are irradiated by the illumination 63, whereby a clear image can be obtained.

The adjustment ball screw 64 and the knurled knob 65 are provided on the lower surface of the horizontal plate 34. The position of the camera 61 in the Y-axis direction can be adjusted by rotating the flange knob 65 to rotate the adjustment ball screw 64.

The terminal bonding device 10 further includes a terminal transfer mechanism 70 as a terminal transfer device that transports one of the pair of terminals 20 and 20 (FIG. 10), which will be described later, to both sides of the workpiece 19, and the workpiece 19 is supported by the workpiece indexing plate 11 and Both sides are coated with a bonding material.

The terminal transport mechanism 70 includes a terminal indexing plate 71 that is disposed in the same vertical plane as the workpiece indexing disk 11 and that is rotatable around the workpiece indexing disk 11.

The terminal transfer mechanism 70 can raise and lower the terminal indexing disk 71 by the elevating mechanism 90 (FIG. 5) which is a lifting device which will be described later. Thereby, the interval between the workpiece indexing plate 11 and the terminal indexing plate 71 can be changed. Further, the workpiece held by the workpiece indexing disk 11 and the terminal held by the terminal indexing plate 71 can be transported to a position where the workpiece is brought into contact with and joined to the terminal.

Fig. 10 shows the workpiece 19 and the terminal 20 in the present embodiment. As this implementation The workpiece 19 of the form is a sheet-like workpiece having a rectangular parallelepiped shape, a prismatic shape, or a cylindrical shape, and the workpiece 19 is a chip capacitor having a square shape with one side n or a rectangle having a long side n as a bottom surface and having a prism shape. The height L is formed longer than one side n. Further, electrodes 19a and 19b for terminal connection are formed at both ends of the longest side L of the workpiece 19.

Hereinafter, the joint material application mechanism 31, the joint mechanism 103, the lift mechanism 90 of the terminal indexing plate 71, the terminal transport mechanism 70, the workpiece supply mechanism 21, and the terminal supply mechanism 79 as the terminal supply device will be described.

(2) Description of the bonding material coating mechanism 31

The bonding material applying mechanism 31 will be described with reference to Figs. 1 to 3 .

Fig. 3 is a cross-sectional view taken along line B-B of Fig. 1 and showing a bonding material applying mechanism 31.

In the front view of FIG. 1, the bonding material applying mechanism 31 is provided on the upper left side of the workpiece indexing plate 11, and the paste-shaped bonding material is applied to both sides of the workpiece 19 in the direction of the rotation axis of the workpiece 19 around the workpiece indexing disk 11.

As shown in FIG. 3, the bonding material applying mechanism 31 is provided with: a pair of distributors 32, 32 which are disposed to sandwich the workpiece 19; and a dispenser moving mechanism 33 which divides the pair of distributors 32, 32 in the workpiece The rotation axis direction (X-axis direction) of the dial 11 is away from each other or close to each other. Further, the dispenser is generally referred to as a device for discharging a bonding material or the like, and includes a controller for performing quantitative supply and peripheral devices thereof. In the present embodiment, the configuration shown in FIG. 3 is referred to as distributors 32 and 32.

A horizontal horizontal plate 34 extending in the X-axis direction is provided on the platen 13 (FIG. 2), and a first rail 36 extending in the Y-axis direction is attached to the upper surface of the horizontal plate 34, and the movable table 37 is capable of It is mounted on the first rail 36 so as to move in the Y-axis direction.

In the movable table 37, a recess 37a for sandwiching the workpiece indexing plate 11 in a plan view is formed, and a second rail 38 extending in the X-axis direction is attached to both sides of the recess 37a in the X-axis direction. The moving plate 39 is mounted on the second rail 38 so as to be movable in the X-axis direction, and the temperature adjusting block 41 is attached to the moving plate 39.

Each of the distributors 32 is housed in the temperature adjustment block 41 in a state in which the discharge ports 32a are opposed to each other.

On the movable table 37, a pair of motors 42, 42 are provided spaced apart from each other in the Y-axis direction of the distributors 32, 32 in such a manner as to sandwich the workpiece 19, and the rotation shafts 42a of the motors 42, 42 are provided. Grooved cams 43, 43 are attached to each of 42a, and cam followers 44, 44 that are engaged with the grooved cams 43, 43 are attached to the moving plate 39, respectively.

The pair of motors 42, 42 rotate the grooved cams 43, 43 in synchronization, respectively. Thereby, as described below, the pair of distributors 32 and 32 operate in such a manner that they are mutually in the rotation axis direction (X-axis direction) of the workpiece indexing disk 11 via the moving plate 39 and the temperature adjustment block 41. Stay away from (Figure 12) or close to each other.

On the upper surface of the horizontal plate 34, a ball screw 46 that is parallel to the first rail 36 and a motor 47 that can rotate the ball screw 46 are provided. A screw member 48 screwed to the ball screw 46 is attached to the movable table 37. Therefore, after the motor 47 is driven to rotate the ball screw 46, the movable table 37 is moved in the Y-axis direction to adjust the position of the pair of the distributors 32, 32 in the Y-axis direction. In this manner, the movable table 37 can adjust the position of the pair of the distributors 32 and 32 in the Y-axis direction.

As shown in FIG. 1 and FIG. 3, a position adjustment mechanism 51 as a position adjustment means is provided in a conveyance path of the workpiece 19 between the workpiece supply mechanism 21 of the workpiece indexing plate 11 and the bonding material application mechanism 31. The adjusting mechanism 51 adjusts the support around the workpiece indexing plate 11 The position of the workpiece 19 in the rotation axis direction (X-axis direction) of the workpiece indexing disk 11.

The position adjusting mechanism 51 is shown as a pressing member 52, 53 attached to the moving plate 39, and the moving plate 39 is moved in the X-axis direction by the one of the dispenser moving mechanisms 33 for the motors 42, 42.

The position adjusting mechanism 51 is provided with a pair of pressing members 52, 53 which position the workpiece 19 at a specific position around the workpiece indexing plate 11 so that when the pair of the dispensers 32, 32 are close to each other, the folder The workpiece 19 before the bonding material is applied. The specific operation of the position adjustment mechanism 51 will be described later.

(3) Description of the joint mechanism 103

The joining mechanism 103 will be described with reference to Figs. 1 and 4 .

4 is a cross-sectional view taken along line C-C of FIG. 1, and is a view showing the joint mechanism 103.

When the workpiece indexing disk 11 of FIG. 1 is viewed from the front, the joining mechanism 103 provided at the lower portion thereof pushes one of the pair of terminals 20 and 20 (FIG. 10) conveyed by the terminal conveying mechanism 70 to both sides of the coating material of the workpiece 19. And heating is performed to engage the pair of terminals 20, 20 with the workpiece 19.

As shown in FIG. 1 and FIG. 4, the joining mechanism 103 is provided with one of the heat generating bodies 104 and 104 and the heat generating body moving mechanism 105 for moving the heat generating body so as to sandwich the workpiece 19. The heating element moving mechanism 105 includes a mechanism that causes the pair of heating elements 104 and 104 to move away from each other or close to each other in the rotation axis direction (X-axis direction) of the workpiece indexing disk 11.

As shown in FIG. 1, the horizontal plate 106 is provided on the base 12 via the support 106a, and the rail 106b extending in the X-axis direction is attached to the upper surface of the plate 106.

The gantry 107 is mounted on the rail 106b so as to be movable in the X-axis direction. Further, a fixing device (not shown) is provided, which prohibits the X-axis of the gantry 107 Move to it to fix the stand 107 to a specific position. Further, a rail 108 extending in the Y-axis direction is attached to the upper surface of the gantry 107, and the movable panel 109 is mounted on the rail 108 so as to be movable in the Y-axis direction.

In the movable plate 109, a recess 109a for sandwiching the workpiece indexing plate 11 in a plan view as shown in Fig. 4 is formed, and rails 111 extending in the X-axis direction are attached to both sides of the recess 109a in the X-axis direction. The platen 112 is mounted on the rail 111 so as to be movable in the X-axis direction, and the heating element 104 is provided on the platen 112, respectively.

As shown in FIG. 4, the heating element 104 can generate heat by means of resistance heating, induction heating, or the like.

A pair of motors 113 and 113 are provided on the movable plate 109 so as to be spaced apart from each other in the Y-axis direction of the heating elements 104 and 104 so as to be placed on the rotating shaft of the motors 113 and 113. Grooved cams 114 are attached, respectively, and cam followers 116 that are engaged with the grooved cams 114 are attached to the platen 112, respectively.

The pair of motors 113 and 113 rotate the grooved cams 114 and 114 in synchronization, whereby the pair of heating elements 104 and 104 operate as follows, that is, the rotation of the workpiece indexing plate 11 via the platen 112. The axial directions (X-axis directions) are distant from each other (Fig. 16) or close to each other (Fig. 17).

As shown in FIG. 1, a ball screw 117 which is parallel to the rail 108 and a motor 118 which can rotate the ball screw 117 are provided on the upper surface of the horizontal stage 107. A screw member 119 screwed to the ball screw 117 is attached to the movable plate 109.

After the motor 118 is driven to rotate the ball screw 117, the movable plate 109 is moved in the Y-axis direction to adjust the position of the heating elements 104 and 104 in the Y-axis direction. So moving The plate 109 can adjust the position of the heating elements 104, 104 in the Y-axis direction. In addition, the specific operation of the joining mechanism 103 will be described later.

(4) Description of the terminal indexing plate 71 and the lifting mechanism 90

The elevating mechanism 90 of the terminal indexing plate 71 will be described with reference to Figs. 1, 2, and 5.

Fig. 5 is a cross-sectional view taken along line D-D of Fig. 2 and showing a diagram of the elevating mechanism 90.

As shown in FIGS. 2 and 5, on the platen 13 (FIG. 2), a pair of vertical rails 72 extending in the vertical direction and a vertical plate 73 parallel to the platen 13 are provided spaced apart in the Y-axis direction. It is disposed on a pair of vertical rails 72 so as to be movable up and down. The terminal transport motor 74 is attached to the vertical plate 73. The rotation axis of the terminal transport motor 74 extends below the first extended rotary shaft 16 in parallel with the first extended rotary shaft 16 in the X-axis direction.

As shown in FIG. 2, the second extension rotary shaft 75 is coaxially attached to the rotation shaft of the terminal conveyance motor 74, and the terminal indexing plate 71 is attached to the second extension after the extension in the same vertical plane as the workpiece indexing plate 11. The front end of the rotating shaft 75.

After the terminal transport motor 74 is driven to rotate together with the second extension rotary shaft 75, the terminal indexing plate 71 rotates below the workpiece indexing plate 11 in the same vertical plane as the workpiece indexing disk 11. Thus, the terminal indexing plate 71 is in the same vertical plane as the workpiece indexing disk 11, and is rotatable below the workpiece indexing disk 11.

Further, as shown in FIG. 1, the terminal indexing plate 71 has a disk shape and is centrally attached to the second extension rotating shaft 75.

As shown in FIG. 2, the cylindrical second support member 76 that surrounds the second extension rotary shaft 75 is attached to the vertical plate 73, and the disc-shaped terminal overlap plate 77 that is superposed on the terminal indexing plate 71 is attached to the second. The front end of the member 76 is supported.

As shown in FIGS. 1 and 2, the terminal indexing plate 71 is disposed below the workpiece indexing plate 11, and further, below the terminal indexing plate 71, a terminal supply mechanism 79 for supplying the terminal to the terminal indexing plate 71 is provided. .

Therefore, the terminal indexing plate 71 is rotated to the right by the terminal transport motor 74 as indicated by the solid arrow in FIG. 1 in the front view, and the terminal 20 needs to be transported from the terminal supply mechanism 79 directly below to the directly above. The workpiece 19 supported by the workpiece indexing plate 11 is completed.

As shown in detail in FIGS. 2 and 5, the elevating mechanism 90 includes an auxiliary plate 91 which is erected in parallel with the platen 13 on the base 12, and a cam plate 93 which is provided on the auxiliary plate 91 via the rail 92. Moving back and forth in the Y-axis direction; a ball screw 94 screwed to the cam plate 93; and a motor 95 that rotates the ball screw 94.

On the vertical plate 73 provided with the terminal indexing plate 71, a cam follower 96 is provided which is in contact with the cam plate 93 from above, and the upper surface of the cam plate 93 which the cam follower 96 contacts is in front view. Formed in a way that rises to the right.

Therefore, due to the self-weight of the terminal indexing plate 71, the cam follower 96 is always in contact with the upper surface of the cam plate 93, and the cam plate 93 is moved in the Y-axis direction, thereby being along with the vertical plate 73 along the vertical rail 72. The lifting and lowering causes the terminal indexing plate 71 to reciprocate between the first position shown in FIG. 17 and the second position shown in FIG. In this manner, the terminal indexing plate 71 can reciprocate between the first position shown in FIG. 17 and the second position shown in FIG.

(5) Description of Terminal Transfer Mechanism 70 and Terminal Supply Mechanism 79

The terminal transport mechanism 70 and the terminal supply mechanism 79 will be described with reference to Figs. 1 and 7 to 9 .

Fig. 7 is a front view of the terminal plywood 77.

As shown in FIG. 1, the terminal indexing plate 71 of the terminal conveying mechanism 70 is disposed on the workpiece. Below the indexing disk 11, a terminal supply mechanism 79 for supplying a terminal to the terminal indexing plate 71 is provided below the terminal indexing plate 71.

The terminal indexing plate 71 is configured to be rotated to the right by the terminal transport motor 74 (FIG. 2) as indicated by a solid arrow in the front view of FIG.

Therefore, the terminal indexing plate 71 needs to transport the terminal 20 supplied from the terminal supply mechanism 79 directly below to the workpiece 19 supported by the workpiece indexing plate 11 directly above.

In order to allow the above-described conveyance, the terminal indexing plate 71 is provided with a groove or a through hole for sucking the terminal 20, and the terminal air groove 77a of the terminal overlapping plate 77 shown in FIG. The position of the lower terminal supply mechanism 79 is formed to a position corresponding to the workpiece 19 immediately above.

Further, in the present embodiment, the terminal air groove 77a of Fig. 7 is shown as one groove, but may be a plurality of grooves from a position facing the terminal supply mechanism 79 to a position facing the workpiece 19. In addition, the configuration of the groove or the through hole for sucking the terminal 20 will be described with reference to "the state in which the terminal is supported by the terminal indexing plate" (FIG. 14).

The terminal supply mechanism 79 includes a terminal component feeder 80 that stores the terminal 20 and transports the terminal 20 in a queue, and a terminal lifting device 81 that raises the transferred terminal 20 so that the terminal 20 adsorption is supported around the terminal indexing plate 71.

The terminal component feeder 80 is configured such that the short side portion 20b (FIG. 10) of the pair of terminals 20 and 20 is set to the upper side and the pair of terminals 20 and 20 are placed in accordance with the principle of vibration or the like. In the opposite state, the pair of terminals 20 and 20 are arranged side by side in the X-axis direction, and the pair of terminals 20 and 20 are conveyed in the Y-axis direction in this state, and the terminal holder 89 of the terminal lifting device 81 is attached. The pair of terminals 20, 20 are shipped out.

Further, in order to prevent the rise of the terminal that is carried out to the front end of the terminal component feeder 80, it is preferable to suction-fix the previous terminal of the terminal to be shipped out.

Next, the terminal lifting device 81 will be described. 8 is a front view showing the terminal supply mechanism 79, and FIG. 9 is a right side view of the terminal supply mechanism 79.

As shown in FIGS. 8 and 9, the terminal lifting device 81 includes a mounting base 83 that is provided on the upper surface of the base 12 via the XY stage 82, and a rail 84 that extends in the Z-axis direction and is provided on the mounting base 83. And a lifting platform 85 that is provided on the rail 84 so as to be movable up and down.

The XY stage 82 includes a Y-axis position adjusting member 82a that determines a position in the Y-axis direction with respect to the mounting base 83 of the base 12, and an X-axis position adjusting member 82b that determines the mounting table 83 with respect to the base 12. The position in the X-axis direction. Each of the position adjusting members 82a and 82b includes an upper plate and a lower plate, and a micrometer 82c. The micrometer 82c shifts the upper plate and the lower plate to adjust the position of the upper and lower sides.

As a result, the micrometer 82c can be used to set the connection tolerance between the components that are sequentially sent by the terminal component feeder 80 as the terminal components, and the terminal components can be smoothly transferred.

On the mounting table 83, a motor 86 is provided spaced apart in the Y-axis direction of the rail 84, and a grooved cam 87 is attached to the rotating shaft 86a of the motor 86. The cam follower 78 that is engaged with the grooved cam 87 is attached to the lift table 85, and the motor 86 is driven to rotate the grooved cam 87, thereby causing the lift table 85 to move up and down.

Further, a rail 88 extending in the vertical direction is provided on the lifting platform 85, and the terminal holder 89 is provided on the rail 88 so as to be movable up and down. The coil spring 79a is interposed between the terminal support member 89 and the lifting platform 85, and the coil spring 79a is used to face the terminal support member upward. 89 is composed of pressure.

The terminal support member 89 can suck the pair of terminals 20 and 20 that are transported by the terminal component feeder 80 to support the pair of terminals 20 and 20 (FIG. 14). After the motor 86 is driven, the lift table 85 and the terminal support The member 89 is raised together, whereby the pair of terminals 20, 20 are raised, so that the pair of terminals 20, 20 are suction-supported to the lower portion around the terminal indexing plate 71.

At the time of the above-described rise, there is a case where the elevating table 85 is intended to rise further even if the terminal holder 89 abuts against the terminal indexing plate 71 and is difficult to rise further.

Even in such a case, the terminal lifting device 81 can prevent the terminal holder 89 from rising further by shortening the entire length of the coil spring 79a, and can further raise the lifting table 85.

Therefore, the pair of terminals 20, 20 are surely raised until they come into contact with the periphery of the terminal indexing plate 71, thereby supporting the periphery of the terminal indexing plate 71, and preventing the terminal support member 89 from abutting against the terminal indexing plate 71. As a result, the terminal lifting device 81 is broken.

It is also possible to detect whether or not the pair of terminals 20, 20 have reached the position of the terminal holder 89 by the terminal detecting sensor 97 shown in Fig. 9, or whether or not the lower portion around the terminal indexing plate 71 has been adsorbed and supported.

The terminal indexing plate 71 supports a pair of terminals 20 and 20 around, and is rotated by the terminal transport motor 74 (FIG. 2) to transfer the pair of terminals 20 and 20 to the workpiece located above the terminal indexing plate 71. Both sides of the workpiece 19 supported by the dial 11.

(6) Description of the workpiece supply mechanism 21

The workpiece supply mechanism 21 will be described with reference to Figs. 1, 6, 11, and 12.

11 is a cross-sectional view taken along line EE of FIG. 1, and shows a view of the workpiece supply mechanism 21, and FIG. 12 is a plan view showing a state in which the workpiece is conveyed to the bonding material application mechanism 31, and FIG. 6 is a front view of the workpiece composite plate 18. Figure.

As shown in Fig. 11, the workpiece feeder 23, which is a part of the workpiece supply mechanism 21, horizontally conveys the workpiece 19 that has been queued in the X-axis direction, and the workpiece 19 enters the notch 11c.

Since the workpiece indexing disk 11 rotates, the workpiece 19 that has entered the notch 11c and is attracted to the notch 11c is transported out and transported in a queue arranged by the rotation of the workpiece indexing disk 11, and is used for the next notch 11c and the workpiece. When the part feeder 23 is opposed to the state, the next workpiece 19 is re-supplied to the notch 11c.

The aspirator 24 constituting a part of the workpiece supply mechanism 21 suctions the workpiece 19 that has entered the notch 11c from the workpiece feeder 23 from the opposite side, whereby the workpiece 19 is surely entered into the notch 11c.

On the workpiece indexing plate 11, a superposed disc-shaped workpiece overlap plate 18 is attached.

The workpiece indexing plate 11 has a body portion 11a having an outer diameter substantially equal to an outer diameter of the workpiece overlap plate 18, and a flange portion 11b including a rib to enlarge the outer diameter of the body portion 11a. The protrusions protrude from the outer circumference of the main body portion 11a and are connected in the circumferential direction. The notch 11c into which the workpiece 19 is inserted extends in the axial direction (X-axis direction) and is formed in the flange portion 11b.

As shown in FIG. 11, the thickness t (the thickness in the rotation axis direction (X-axis direction)) of the flange portion 11b constituting the periphery of the workpiece indexing plate 11 is formed to be shorter than the length of the longest side L of the workpiece 19, and is inserted. The electrodes 19a, 19b at both ends of the workpiece 19 placed on the notch 11c are set to be self-convex Both ends of the edge portion 11b protrude.

In particular, in order to prevent solder such as solder from adhering to the flange portion 11b and then adhering to the workpiece 19 again, the thickness t of the flange portion 11b is preferably smaller than the L dimension of the workpiece 19 by 0.4 mm or more.

Further, as shown in FIG. 12, the width H of the notch 11c formed around the workpiece indexing disk 11 is formed to be shorter than the length of the longest side L of the workpiece 19.

The reason is that the workpiece 19 is not inserted into the notch 11c even when the following abnormality occurs, and the abnormality means that the longest side L between the electrodes 19a and 19b at both ends of the workpiece 19 is placed in the circumferential direction.

Next, the workpiece indexing plate 11 and the workpiece overlap plate 18 will be described with reference to Figs. 6 and 11 .

As shown in FIG. 11, in the workpiece indexing plate 11, a bottomed pit hole 11d and a first horizontal hole of the communication notch 11c and the column hole 11d are formed from the workpiece overlap plate 18 side corresponding to the notch 11c. 11e.

On the other hand, as shown in Figs. 6 and 11, a workpiece air groove 18a opposed to the column hole 11d is formed in the workpiece overlap plate 18, and a coupler that communicates with the workpiece air groove 18a is attached ( Coupler) 18b. The disk-shaped workpiece indexing disk 11 is superposed on the workpiece overlap plate 18 while maintaining a very small gap (for example, 0.05 mm). Therefore, the workpiece air groove 18a is sealed by the workpiece indexing disk 11. When air is sucked from the workpiece air tank 18a via the coupling 18b, air is sucked from the notch 11c through the first horizontal hole 11e and the column hole 11d from the periphery of the workpiece indexing plate 11, and the workpiece indexing plate is placed on the workpiece indexing plate. The workpiece 19 that has been inserted into the notch 11c around the periphery of 11 is attracted to the periphery of the workpiece indexing plate 11 and is supported.

The workpiece indexing table 11 is rotated to the left as indicated by the solid arrows in FIG. therefore, In order not to cause the workpiece 19 to fall off, the workpiece indexing table 11 needs to suction and support the workpiece 19 around the workpiece supply mechanism 21 from the upper right to the good or defective product carry-out mechanisms 101 and 102 on the lower right side.

In order to perform the above operation, as shown in Fig. 6, the workpiece air groove 18a of the workpiece overlap plate 18 is opposed to the column hole 11d (Fig. 11) of the workpiece indexing plate 11, and the upper right side of the workpiece 19 to be adsorbed is attached. The side workpiece supply mechanism 21 (FIG. 1) is positioned to face the position of the lower right product or defective product carrying-out mechanisms 101 and 102 (FIG. 1).

Further, at a position facing the good or defective product carrying-out mechanisms 101 and 102, discharge air grooves 18c and 18d are formed independently of the workpiece air grooves 18a, and the discharge air grooves 18c and 18d are used to reversely apply air. The self-coupling device 18b is blown to the column hole 11d (Fig. 11), so that the workpiece 19 adsorbed to the notch 11c (Fig. 11) is separated from the notch 11c.

Further, in the present embodiment, the workpiece air groove 18a is shown as one groove, but may be located from the position facing the workpiece supply mechanism 21 to the position opposite to the good or defective product carrying-out mechanisms 101 and 102 (Fig. 1). Thus, the workpiece air groove 18a is constituted by a plurality of grooves.

(B) Action of the terminal engaging device 10

Next, the operation of the terminal bonding device 10 will be described.

Hereinafter, the operation of the terminal bonding apparatus 10 will be described as follows. The four states are referred to as (1) the state in which the bonding material is applied to both sides of the workpiece 19; and (2) the pair of terminals 20 are supported by the terminal indexing. (3) The state in which the terminal indexing plate 71 rotates to convey the pair of terminals 20 to the position facing the workpiece 19; and (4) the state in which the pair of terminals 20 are joined to both ends of the workpiece 19.

(1) A state in which the bonding material is applied to both sides of the workpiece 19

12 is a plan view showing a state in which the workpiece 19 is conveyed to the bonding material application mechanism 31, and FIG. 13 is a plan view corresponding to FIG. 12 in a state in which the bonding material is applied to both sides of the workpiece 19.

As described above with reference to Fig. 11, the workpiece 19 enters the gap 11c of the workpiece indexing plate 11 in a queue from the workpiece feeder 23 for the workpiece.

As shown in FIG. 12, the workpiece 19 conveyed by the rotation of the workpiece indexing table 11 reaches the position adjusting mechanism 51.

The pair of distributors 32, 32 are moved away from each other in the rotation axis direction (X-axis direction) of the workpiece indexing plate 11 by rotating one of the dispenser moving mechanisms 33 to the motors 42, 42 (Fig. 3) (Fig. 12) or Close to each other (Figure 13).

The center of the discharge ports 32a, 32a of the distributors 32, 32 facing each other when the ones are close to each other is set to a specific position of the workpiece 19, and the workpiece 19 is adjusted to the workpiece by the action of the pair of pressing members 52, 53. A specific position on the indexing disk 11.

After the position of the workpiece 19 is adjusted to a specific position, as shown in FIG. 12, the pressing members 52, 53 are separated from the workpiece 19, and in this state, the workpiece indexing disk 11 is again rotated.

Next, the workpiece 19 conveyed by the rotation of the workpiece indexing plate 11 reaches between the pair of distributors 32 and 32 in the joint material application mechanism 31, and is temporarily stopped.

Next, as shown in FIG. 13, in the bonding material applying mechanism 31, the moving plate 39 is moved in the X-axis direction by a pair of motors 42, 42 (FIG. 3), whereby the pair of distributors 32, 32 are mutually connected Closely, a specific amount of paste-like joining material is ejected from the front end discharge ports 32a, 32a by the air pressure of the compressed air supplied from the hose 32b (Fig. 3). Thereby, a paste-like bonding material is applied to both ends of the workpiece 19.

Then, the moving plate 39 is reversed in the X-axis direction by a pair of motors 42, 42 The ground moves, whereby, as shown in FIG. 12, the pair of dispensers 32, 32 are separated from each other and away from the workpiece 19. In this state, the workpiece indexing disk 11 is again rotated.

Here, since the workpiece 19 is located at the center of the discharge ports 32a and 32a facing each other by the position adjustment mechanism 51, a specific amount of the joint material ejected from the discharge ports 32a and 32a is uniformly applied to both ends of the workpiece 19. .

Further, after the pair of the distributors 32 and 32 are moved away from each other, the workpiece indexing disk 11 is rotated, and the discharge ports 32a and 32a are moved away from the workpiece 19, whereby it is possible to prevent a part of the applied bonding material from remaining in the discharge port. The workpiece 19 is again conveyed in the state of 32a and 32a.

Further, since the workpiece 19 is conveyed so that both ends face the horizontal X-axis direction, even if the joint material applied to both ends of the workpiece 19 is deformed by its own weight, the degree of deformation on both sides is uniform.

Then, after the workpiece 19 conveyed by the rotation of the workpiece indexing disk 11 passes between the cameras 61 (FIG. 1), it reaches the lowermost end where the bonding mechanism 103 is provided, and the camera 61 inspects the solder applied to both ends of the workpiece 19. status. The camera 61 checks the area and position of the applied solder using an image, and confirms the coating amount based on the area.

Further, the dispenser 32 continuously ejects the bonding material to the workpiece 19 that is transported one by one, and applies the bonding material to the workpiece 19, so that the bonding material can be stably ejected from the distributor 32.

(2) A pair of terminals 20 support the state of the terminal indexing plate 71

14 is a cross-sectional view taken along line GG of FIG. 1, and shows a state in which a pair of terminals 20 are supported by a terminal indexing plate 71, and FIG. 15 is a cross-sectional view taken along line FF of FIG. 14 and shows a terminal indexing plate 71. A diagram of the suction hole 71k.

The workpiece 19 coated with the bonding material at both ends is moved by the rotation of the workpiece indexing plate 11 Send to the bottom.

On the other hand, the terminal 20 stored in the terminal component feeder 80 (FIG. 1) of the terminal supply mechanism 79 is set to the upper side by the short-side portion 20b (FIG. 10) by the terminal component feeder 80. In the state of being opposite to each other, they are transported one by one.

As shown in FIG. 14, the pair of terminals 20 and 20 are lifted by the terminal holder 89 of the terminal lifting device 81 (FIG. 1) while the short side portion 20b is placed on the upper side and opposed to each other. Further, the concave portion 71d supported by the lower portion of the terminal indexing plate 71 is adsorbed.

At this time, it is detected by the terminal detecting sensor 97 (FIG. 9) whether or not the position of the terminal holder 89 has been reached, or whether the pair of terminals 20, 20 have been suction-supported to the lower portion of the periphery of the terminal indexing plate 71.

Here, the configuration of the terminal indexing plate 71 for sucking the support terminal 20 will be described.

As shown in FIGS. 1 and 2, the terminal indexing plate 71 has a disk shape, and a disc-shaped terminal overlapping plate 77 which is superposed on the terminal indexing plate 71 is attached to the terminal indexing plate 71.

Further, as shown in FIG. 14, the center grooves 71e and 71e facing the center are formed on both sides of the main body disk 71a of the terminal indexing plate 71 in the thickness direction of the concave portion 71d to which the terminal 20 is in contact. A first through hole 71g that communicates with the center grooves 71e and 71e is formed around the main body disk 71a.

In the main body disk 71a on the center side of the first through hole 71g, the second through hole 71h is further formed, and the second horizontal hole 71j that communicates the first through hole 71g and the second through hole 71h is further formed. The second lateral hole 71j is formed on one side that does not face the terminal overlap plate 77.

The first through hole 71g is sealed by the first annular member 71b, and the first annular structure The member 71b is superposed on the periphery of the body disk 71a from the terminal overlap plate 77 side. The first through hole 71g, the second through hole 71h, and the second horizontal hole 71j are sealed by the second annular member 71c, and the second annular member 71c is superposed on the body disk 71a from the opposite side of the terminal overlapping plate 77. around. Therefore, the second through hole 71h of the terminal indexing plate 71 is open to the terminal overlapping plate 77.

On the other hand, a terminal air groove 77a that faces the second through hole 71h is formed in the terminal overlap plate 77, and a coupler 77b that communicates with the terminal air groove 77a is attached.

The disk-shaped terminal indexing plate 71 is superposed on the terminal overlapping plate 77 while maintaining a very small gap (for example, 0.05 mm). Therefore, the terminal air groove 77a is sealed by the terminal indexing plate 71. Therefore, when air is sucked from the terminal air tank 77a via the coupler 77b, the second through hole 71h, the second horizontal hole 71j, and the first through hole 71g are used from the terminal air groove 77a as indicated by a broken line arrow. The central grooves 71e and 71e suck air from the periphery of the terminal indexing plate 71.

Thereby, the terminal indexing plate 71 adsorbs the pair of terminals 20, 20 around it to support the pair of terminals 20, 20, and the short side portion 20b of the pair of terminals 20, 20 and the periphery of the terminal indexing plate 71 The formed concave portion 71d is in surface contact.

Here, the suction holes are formed in the terminal indexing plate 71, and the central grooves 71e and 71e formed on both sides in the thickness direction of the main body disk 71a are sealed by the first and second annular members 71b and 71c. The terminals 20, 20 are sucked through the suction holes.

(3) The state in which the terminal indexing plate 71 rotates and conveys the pair of terminals 20 to the position opposite to the workpiece 19

Fig. 16 is a cross-sectional view corresponding to Fig. 14 showing a state in which the terminal indexing disk 71 is rotated to convey the pair of terminals 20 to a position facing the workpiece 19.

The terminal indexing plate 71 shown in FIG. 14 is held to support a pair of terminals 20, 20 State and rotate.

As shown in FIG. 16, the terminal indexing plate 71 transports the pair of terminals 20, 20 to the lower side of the workpiece 19 supported by the workpiece indexing plate 11 and located below the workpiece indexing plate 11.

Since the ball screw 94 in the elevating mechanism 90 shown in FIG. 5 is rotated by the motor 95, the cam plate 93 is moved in the Y-axis direction, whereby the pair of terminals 20 and 20 are conveyed to the lower side of the workpiece 19. The terminal indexing plate 71 is raised. Thereby, as shown in FIG. 17, one of the pair of terminals 20, 20 supported on the upper portion of the terminal indexing plate 71 is located on both sides of the workpiece 19 supported on the lower portion of the workpiece indexing plate 11.

As shown in Fig. 16, the pair of terminals 20 and 20 are held in such a state that the short side portions 20b are in surface contact with the bottom portion of the concave portion 71d (Fig. 15) on the inner side, and the long side portion 20a and the first and second portions are formed. The annular members 71b and 71c are opposed to each other in the opposite direction.

Further, the gap d (the gap in the rotation axis direction (X-axis direction)) between the first and second annular members 71b and 71c shown in Fig. 16 is capable of maintaining a very small gap and inserting the workpiece 19 relatively long. Formed between the sides 20a.

(4) A state in which the pair of terminals 20 are joined to both ends of the workpiece 19

Fig. 17 is a cross-sectional view corresponding to Fig. 16 showing a state in which a pair of terminals 20 are joined to both ends of the workpiece 19.

As shown in Fig. 17, the workpiece 19 is inserted between the opposite long side portions 20a of the pair of terminals 20, 20 and is stationary.

Then, as shown in FIG. 17, one of the pair of heating elements 104, 104 which is transferred to the workpiece 19 by the heat generating body moving mechanism 105 (FIG. 4) pushes the terminal 20, 20 to the workpiece. 19 is coated with both sides of the bonding material, and is heated to thereby couple a pair of terminals 20, 20 is joined to both sides of the workpiece 19.

Then, the pair of heating elements 104, 104 are separated from each other and separated from the pair of terminals 20, 20, and the terminal indexing plate 71 is lowered again by the elevating mechanism 90 (FIG. 5) so that one of the two ends of the workpiece 19 is joined. The terminals 20, 20 are separated from the terminal indexing plate 71.

Then, the workpiece indexing disk 11 is rotated, whereby the workpiece 19 having the pair of terminals 20 and 20 joined to both sides is further conveyed by being adsorbed and supported by the workpiece indexing disk 11.

Then, when the suction mechanisms 101 and 102 provided at the lower right side of the workpiece indexing table 11 shown in FIG. 1 are reached, the workpiece 19 is released from the workpiece indexing plate 11 after the suction is released, and the good product is dropped to constitute the good product carrying mechanism 101. The belt conveyor is discharged, and the defective product is dropped onto the belt conveyor constituting the defective product carrying-out mechanism 102 and discharged. Further, the hole for blowing (blowing) can be placed at the central portion where the workpiece 19 is placed, and the discharge timing and posture of the workpiece 19 can be stabilized.

In this manner, the pair of terminals 20 and 20 are pressed against the electrodes 19a and 19b on both sides of the workpiece 19 coated with the bonding material by the pair of heating elements 104 and 104, and are bonded to the electrodes 19a and 19b. In this case, the pressing force of one of the pair of heating elements 104 and 104 is set to be large (about 40 N) in advance, and the pressing force of the other heating element 104 is set based on this.

In the above process, one of the terminals 20 and 20 adsorbed on the terminal indexing plate 71 is slightly moved by the influence of the pressing of the pair of heating elements 104 and 104 in the suction state, and the terminal posture can be stabilized. .

Further, as described above, the workpiece 19 to which the pair of terminals 20 and 20 are joined on both sides is further conveyed in a state of being adsorbed and supported by the workpiece indexing plate 11, and thereafter, the pair of terminals 20, 20 are separated from the terminal indexing. Disk 71.

The terminal indexing plate 71 includes a suction hole 71k (FIG. 15) formed around the terminal indexing plate 71 to suck the pair of terminals 20 and 20. Thereby, the pair of terminals 20, 20 are surely moved, and are surely detached from the terminal indexing plate 71.

Further, the elevating mechanism 90 can reciprocate the terminal indexing plate 71 between the first position shown in FIG. 17 and the second position shown in FIG. 16 by using the cam mechanism.

In the terminal engaging device 10, the workpiece 19 is supported by the surrounding and the rotating workpiece indexing table 11 is rotated in the vertical plane. Therefore, the horizontal area occupied by the workpiece indexing disk 11 is remarkably lowered in the thickness direction.

Further, the workpiece 19 is supported by the surrounding and the rotating workpiece indexing table 11 is rotated in the vertical plane. Therefore, the working device for processing the workpiece 19 can be disposed around the vertical surface where the workpiece indexing plate 11 is located. . Thereby, the occupied area of the entire apparatus including the working equipment in the horizontal plane can be significantly reduced as compared with the previous product in which the workpiece indexing disc exists in the horizontal plane.

Further, the workpiece indexing plate 11 sucks air from the surroundings, whereby the workpiece 19 is attracted to the periphery to support the workpiece 19, and therefore, the jig necessary for supporting the workpiece is not required.

Further, the support workpiece 19 is adsorbed in the above manner, whereby the apparatus necessary for holding the workpiece by the jig is not required, and therefore, the occupied area in the horizontal plane can be further reduced.

Further, since the paste-like joining material is applied to both ends of the workpiece 19 which is horizontally supported, even if the paste-shaped joining material changes its shape due to its own weight, the degree of the deformation on both sides is uniform.

Thereby, the application of the bonding material to the upper and lower sides of the vertically supported workpiece In comparison, the uniformity of each of the paste-like bonding materials applied to both ends of the workpiece 19 is ensured, and therefore, the pair of terminals 20 can be equally joined to both sides of the workpiece 19.

As described above, according to the present embodiment, it is possible to manufacture electronic components for surface mounting with stable quality and productivity.

Although the embodiments of the present invention have been described above, the above embodiments are only a part of the application examples of the present invention, and the technical scope of the present invention is not limited to the specific configuration of the above embodiments.

10‧‧‧Terminal joint device

11‧‧‧Workpiece indexing plate

11a‧‧‧ Body Department

11b‧‧‧Flange

11c‧‧‧ gap

11f‧‧‧Handle

12‧‧‧Abutment

21‧‧‧Workpiece supply mechanism

22‧‧‧ hopper

23‧‧‧Parts feeder for workpieces

24‧‧‧Aspirator

31‧‧‧Joint material coating mechanism

32‧‧‧Distributor

33‧‧‧Distributor moving mechanism

34‧‧‧ horizontal board

37‧‧‧ movable table

38‧‧‧2nd track

39‧‧‧Mobile board

41‧‧‧temperature adjustment block

42, 47, 86, 113, 118‧‧ ‧ motors

43, 87, 114‧‧‧ slotted cam

46, 64, 117‧‧‧ ball screw

48, 119‧‧ ‧ threaded components

51‧‧‧Location adjustment mechanism

61‧‧‧Inspector

62‧‧‧ lens

63‧‧‧ illumination

65‧‧‧bump knob

70‧‧‧Terminal transport mechanism

71‧‧‧Terminal indexing plate

75‧‧‧2nd extended rotation axis

79‧‧‧Terminal supply mechanism

80‧‧‧Parts feeder for terminals

81‧‧‧Terminal lifting device

82‧‧‧XY platform

82a‧‧‧Y-axis position adjustment

82b‧‧‧X-axis position adjustment

83‧‧‧Installation table

84, 88, 92, 108, 111, 106b‧‧‧ tracks

85‧‧‧ lifting platform

89‧‧‧ terminal support

101‧‧‧Good product removal agency

102‧‧‧Don't move out of the agency

105‧‧‧heating body moving mechanism

106‧‧‧ board

106a‧‧‧ pillar

107‧‧‧ 台台

109‧‧‧ movable plate

112‧‧‧ board

A-A, B-B, C-C, E-E, G-G‧‧‧ lines

X, Y, Z‧‧‧ axis direction

Claims (9)

A terminal joining device comprising: a workpiece indexing plate (11) that is rotatable in a vertical plane about a horizontal axis of rotation and capable of supporting a workpiece (19) around; a bonding material coating a means (31) for applying a bonding material to both sides of the above-mentioned rotating shaft direction of the workpiece (19) supported by the workpiece indexing plate (11); and a terminal carrying means (70) for a pair of terminals (20) Transferring to both sides of the workpiece (19) supported on the workpiece indexing plate (11) and having the bonding material coated on both sides thereof; and bonding means (103) for transporting the terminal carrying means (70) The pair of terminals (20) are pressed to both sides of the workpiece (19) coated with the bonding material, and heated to bond the pair of terminals (20) to the workpiece (19). The terminal joining device of claim 1, wherein the workpiece indexing disk (11) sucks air from the surroundings, whereby the workpiece (19) is attracted to the periphery to support the workpiece (19). The terminal joining device of claim 2, wherein a notch (11c) into which the workpiece (19) is inserted is formed along the axial direction around the workpiece indexing plate (11), and the notch (11c) The width in the circumferential direction is formed to be shorter than the length of the longest side of the workpiece (19). The terminal joining device according to any one of claims 1 to 3, wherein the workpiece transfer portion between the workpiece supply portion (21) of the workpiece indexing plate (11) and the bonding material coating means (31) In the path, a position adjustment means (51) is provided, and the position adjustment means (51) adjusts the rotation of the workpiece (19) supported on the workpiece indexing plate (11) on the workpiece indexing plate (11) The position in the direction of the rotation axis. The terminal bonding device of claim 4, wherein the bonding material applying means (31) comprises: a pair of dispensers (32) disposed to sandwich the workpiece (19); and a dispenser moving mechanism (33) The pair of dispensers (32) are spaced apart from each other or close to each other in the direction of the rotation axis of the workpiece indexing disk (11); and the position adjusting means (51) is provided with one or more pressing members ( 52, 53), the one or more pressing members (52, 53) are combined with the pair of dispensers (32) moved by the dispenser moving mechanism (33) on the workpiece indexing plate (11) moves in the direction of the above-mentioned rotation axis. The terminal bonding device of claim 1, wherein the terminal transfer means (70) is provided with a terminal indexing disk (71), and the terminal indexing disk (71) is provided to be capable of being indexed with the workpiece indexing plate (11). The same vertical plane rotates below the workpiece indexing plate (11); the terminal indexing plate (71) supports the pair of terminals (20) to rotate around, and the pair of terminals (20) It is conveyed to both sides of the workpiece (19) supported by the above-mentioned workpiece indexing plate (11). The terminal bonding device according to claim 6, wherein the terminal transfer means (70) further includes a lifting means (90) for moving the terminal indexing plate (71) between the first position and the second position. The first position is a position at which the pair of terminals (20) supported on the upper portion of the terminal indexing plate (71) are located on both sides of the workpiece (19) supported on the lower portion of the workpiece indexing plate (11). The position 2 is supported at a position where the pair of terminals (20) on the upper portion of the terminal indexing plate (71) are located below the workpiece (19) supported on the lower portion of the workpiece indexing plate (11). The terminal joining device of claim 6 or 7, wherein the terminal indexing plate (71) sucks air from a suction hole formed in the periphery, thereby absorbing support The above pair of terminals. The terminal bonding device according to claim 1, wherein the bonding means (103) includes: a pair of heating elements (104) disposed to sandwich the workpiece (19); and a heating element moving mechanism (105) The heat generating body moving mechanism (105) includes a mechanism for moving the pair of heat generating elements (104) away from or close to each other in the rotation axis direction of the workpiece indexing disk (11).