JPH0550696U - Electronic component soldering equipment - Google Patents

Abstract

(57) [Summary] [Purpose] To make it possible to solder a feedthrough capacitor to a mounting board efficiently, and at the same time avoid thermal effects on the feedthrough capacitor. [Structure] Solder 5 is built up in advance on the outer periphery of the feedthrough capacitor 3, and a plurality of capacitors 3 are attached to the mounting holes 2 of the protruding pieces 7.
The mounting substrate 1 in which the
Clap at 3,14. The mounting substrate 1 is heated by energizing the electrodes 13 and 14 for a predetermined time, and the heat melts the solder 5 to solder the capacitor 3 to the protruding piece 7.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a device for soldering electronic components such as capacitors to mounting boards of various electronic devices.

[0002]

[Prior Art]

 For example, as shown in FIG. 6 and FIG. 7, when a feedthrough capacitor (hereinafter simply referred to as a capacitor) 3 which is an electronic passive component is inserted into a plurality of mounting holes 2 formed in a metal mounting board 1 and soldered As shown in FIG. 8, solder 5 is built up on the outer periphery of the case (made of metal) 4 of the capacitor 3 in advance by the dipping method, and the capacitor 3 having the solder 5 built up is mounted on the mounting board 1. After inserting into the holes 2, each capacitor 3 is soldered with a soldering iron, or the entire mounting board 1 is heated by using a hot air heater or an oven to solder a plurality of capacitors 3 at the same time. I am trying to attach it. Reference numeral 6 is a lead wire of the capacitor 3.

[0003]

[Problems to be solved by the device]

 However, in the conventional soldering method as described above, when each capacitor 3 is soldered using a soldering iron, if the thickness of the mounting board 1 becomes large, the board 1 Since it has a large heat capacity, it takes time to complete the soldering, and improvement in work efficiency cannot be expected. When a hot air heater or oven is used, not only the mounting board 1 but also the capacitor 3 itself is heated. Therefore, unless the heating temperature is strictly controlled, the quality and function of the capacitor 3 itself will be impaired. There is a possibility that it remains a problem in terms of reliability.

The present invention has been made by paying attention to the above problems and enables efficient soldering and does not impair the quality of electronic components such as capacitors to be soldered. An object is to provide a soldering device.

[0005]

[Means for Solving the Problems]

 The present invention is a device for inserting and soldering an electronic component such as a capacitor, which is covered with a metal case and is pre-deposited with solder on the outer periphery, into a mounting hole of a metal mounting board. A pair of electrodes that pressurize the mounting board with the electronic components inserted from both sides, and the mounting board through the electrodes to the temperature required for soldering the electronic components by controlling the current flowing to the pair of electrodes. It is composed of a conduction current control means for generating heat.

[0006]

[Action]

 According to this structure, when electricity is applied to the mounting board through the electrodes, the mounting board itself generates heat due to the Jur heat, and due to this heat, the solder that has been built up in the electronic component in advance melts and the electronic component is mounted on the mounting board. To be soldered to.

[0007]

【Example】

 1 to 4 are views showing an embodiment of the present invention, and show an example of a device for soldering a feedthrough capacitor 3 to a mounting substrate 1 shown in FIGS. 6 to 8.

As shown in FIGS. 6 and 7, the mounting board 1 is formed with a projection piece 7 formed by cutting and raising at right angles at one end, and the three mounting holes 2 formed in the projection piece 7 are each provided with a capacitor. 3 is inserted into the soldering device of FIGS. As shown in FIG. 8, the capacitor 3 is preliminarily coated with solder 5 on the outer periphery of the case 4 by a dipping method.

A work base 9 is provided on the vertical base plate 8 shown in FIGS. 2 and 3, and the mounting substrate 1 is positioned and fixed at the center of the work base 9 by suction fixing means such as a magnet chuck. To be done. A bar 10 that moves up and down by a cylinder (not shown) or the like is provided on the front side of the base plate 8, and a pressing block 12 having three escape holes 11 is fixed to the center of the bar 10. There is. Therefore, when the mounting substrate 1 is fixed to the work pedestal 9 as described above, the bar 10 descends, and the pressing block 12 integrated with the bar 10 presses each capacitor 3 against the protruding piece 7 with a predetermined pressure. become.

Below the base plate 8, a pair of electrodes 13.14 are arranged facing each other on both sides of the projecting piece 7. The pair of electrodes 13 and 14 are fixed to the linear guide 15 respectively, and the linear guide 15 is guided by the guide rail 16, and the linear guide 15 is connected to the piston rod 19 of the air cylinder 18 via the bracket 17. Has been done. Therefore, the pair of electrodes 13 and 14 moves forward and backward on the guide rail 16 in accordance with the expansion and contraction of the air cylinder 18, and the protrusion piece 7 is held by the pair of electrodes 13 and 14 from both sides thereof during the forward movement. It has become so.

The pair of electrodes 13 and 14 are connected to the secondary side of the transformer 21 via the secondary cable 20 as shown in FIG. 4, while the primary side of the transformer 21 is a power adjustment unit for controlling the energization current. Connected to the container 22. The power regulator 22 has a built-in timer unit and serves to control the energization current to the pair of electrodes 13 and 14 as well as the energization time. A temperature controller 23 is connected to the upper side of the power regulator 22, and a radiation thermometer 24 for monitoring the temperature of the soldering portion is connected to the temperature controller 23 as described later. Then, the temperature controller 23 is capable of variably setting the specific temperature as a set temperature in order to confirm whether or not the temperature measured portion has reached a specific temperature, and the measured temperature of the radiation thermometer 24 is Since the emissivity ε of the temperature measurement site changes, the emissivity ε can also be set variably.

In the soldering apparatus thus configured, when the mounting board 1 is positioned by a loading device (not shown) so as to be in close contact with the work receiving base 9 of the base plate 8, the mounting board 1 is mounted. 1 is firmly adsorbed and fixed by a magnet chuck or the like. Since the capacitor 3 is previously inserted into the mounting hole 2 of the protruding piece 7 of the mounting board 1 as described above (see FIGS. 6 and 7), the pressing block 12 integrated with the bar 10 descending from above is formed. Thus, the capacitor 3 is pressed against the protruding piece 7.

When the positioning of the mounting substrate 1 and the capacitor 3 is completed in this way, the pair of electrodes 13 and 14 move forward due to the extension of the air cylinder 18, and the both end surfaces of the projecting piece 7 are sandwiched between the pair of electrodes 13 and 14. .. When the electrodes 13 and 14 sandwich the protruding piece 7, a predetermined voltage is applied between the pair of electrodes 13 and 14 by the power regulator 22 of FIG. 4 to energize, and the heating of the protruding piece 7 accompanying this energization causes The solder 5 (see FIG. 8) that has been built up on the capacitor 3 in advance is melted, and the capacitor 3 is soldered to the protruding piece 7.

At this time, the energization time to the electrodes 13 and 14 is set to about 7 seconds by the timer unit of the power regulator 22, while the temperature of the protruding piece 7 near the capacitor 3 is set to the radiation of FIG. It is monitored by a thermometer 24. Assuming that the temperature controller 23 is set to 200 ° C. as the optimum temperature for soldering, the temperature controller 23 instructs the electrodes 13 and 14 to turn off the power when the temperature of the temperature measurement region exceeds 200 ° C. On the other hand, when the temperature of the temperature measurement part becomes 200 ° C or lower, the energization start command is output to the power regulator 22 again, and as long as it is within one energization time as shown in FIG. The ON-OFF control of such energization is repeated. As a result, the temperature in the vicinity of the protruding piece 7 is maintained at around 200 ° C.

When the soldering of the capacitor 3 is completed after the energization time for the pair of electrodes 13 and 14 has elapsed as described above, the bar 10 that has been holding the capacitor 3 up to that point rises and the magnet chuck is used. The suction fixing force of the mounting board 1 is released, and the mounting board 1 that has been soldered slides down the chute 25 by its own weight and is collected. Thereafter, the same operation as described above is repeated.

[0016]

[Effect of the device]

 As described above, according to the present invention, when soldering an electronic component previously inserted in the mounting board to the mounting board, the mounting board is sandwiched by a pair of electrodes from both sides of the mounting board to energize, and the mounting board itself generates heat. By doing so, soldering can be performed more efficiently than when using a soldering iron, etc., and since the mounting board itself generates heat, it has a thermal effect on electronic components. The quality and function of the electronic components themselves are not impaired, and the reliability of soldering is improved.

[Brief description of drawings]

FIG. 1 is a structural explanatory view of a main part showing an embodiment of the present invention.

FIG. 2 is a front explanatory view showing details of FIG.

3 is a sectional view taken along the line aa of FIG.

FIG. 4 is a block circuit diagram of the energization control system of FIG.

FIG. 5 is a temperature characteristic diagram during soldering.

FIG. 6 is an exploded perspective view of essential parts showing the relationship between a mounting substrate and a feedthrough capacitor.

7 is a sectional view of FIG.

FIG. 8 is a sectional view of a feedthrough capacitor in which solder is built up.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Mounting board 2 ... Mounting hole 3 ... Penetration capacitor as an electronic component 4 ... Case 5 ... Solder 7 ... Protrusion piece 13, 14 ... Electrode 18 ... Air cylinder 21 ... Transformer 22 ... Power regulator 23 as energization current control means 23 … Temperature controller 24… Radiation thermometer

Claims (1)

[Scope of utility model registration request] 1. A device for inserting and soldering an electronic component, which is covered with a metal case and has a solder padded on the outer periphery in advance, into a mounting hole of a metal mounting board, the electronic component being mounted in the mounting hole. A pair of electrodes that press the mounting board in which the components are inserted from both sides thereof, and a current flowing to the pair of electrodes is controlled to heat the mounting board through the electrodes to a temperature required for soldering the electronic component. An electronic component soldering device, comprising: an energizing current control means.