TWI670815B - Assembly device and assembly method - Google Patents

Abstract

Provides conductive connection even for extremely small components The supply of the material can control the supply position or the supply amount with high precision, prevent the drying of the conductive material during the work, and suppress the waste parts (package) into a minimum assembly device.

The assembly device is equipped with handling of handling electronic components The means (3), and the holding means (21) for holding the component (10) of the electronic component, and the coating means (6) for applying the bonding material, mounting the component (10) on the mounting member (20) to assemble the electronic component The assembly device (6) applies the adhesive material (N) directly to the component (10) held by the coating and holding means (21), and the transfer means (3) is coated with the adhesive material (N). The component (10) carries the component (10) or the mounting component (20) in a manner corresponding to the mounting member (20).

Description

Assembly device and assembly method

The present invention relates to an assembly apparatus and an assembly method for attaching a small component to a package.

Conventionally, in a crystal vibrator, a conductive material is supplied to a specific position of a package (part container), and an element piece (a wafer) on which an electrode is formed is mounted and fixed, and the electrode and the package are electrically connected. pattern.

For example, the crystal vibrator assembly device has a conductive (material) supply (coating) platform, and a wafer mounting platform for supplying conductivity to a package disposed on the platform in the supply platform. material. Specifically, the package is inserted into the nozzle of the dispenser, the conductive adhesive is supplied, the nozzle is moved to the next package, and the conductive adhesive is supplied, and the conductive package is continuously supplied to the package. . Then, in the mounting platform, the wafer is attached to each of the packages in order, and is fixed to the package with a conductive adhesive (see, for example, Patent Document 1 and Patent Document 2).

[Previous Technical Literature] [Patent Document]

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2011-91695

[Patent Document 2] Japanese Patent Laid-Open Publication No. 2004-15792

[Summary of the Invention]

However, in the present invention, the size of the electronic component is reduced toward the size of the electronic component, and the coating (supply) of the conductive adhesive material becomes difficult. Specifically, the following various types are produced. problem.

First, when a conductive adhesive is supplied to the package, the nozzle (or the needle) of the dispenser comes into contact with the inner wall of the package, and a deviation in the supply amount (coating amount) of the positional deviation of the supply position occurs. In order to solve such a problem, the nozzle (or the needle) is inserted into the inner wall (side wall and the bottom surface) of the package, and the method of supplying the conductive material is also used, but when the water chip and the package are increasingly miniaturized, This technique is limited. The positional deviation of the supply position of the conductive material or the deviation of the supply amount is less affected when the element is large, but when the element is extremely small, there is a problem that the electrode is easily short-circuited, which increases the problem of the defective element.

Second, a shape error (deformation of the bottom surface) occurs in each package, and variations in the coating amount of the conductive adhesive material occur due to variations in the positions of the bottom surfaces of the respective packages, that is, the positions of the coated surfaces of the conductive adhesive members. Therefore, when the conductive material is applied to the package, it is necessary to control the coating amount with high precision in accordance with the shape error of the package.

Thirdly, as in the past, after the supply platform supplies the conductive bonding material to the plurality of packages, the mounting platform mounts the components in the respective packages, and when the components are mounted, the coating cannot be avoided. Time. In this case, when the coating amount is too large, the influence due to the passage of time is small. However, when the component is small and the supply amount of the conductive material is small, the coated conductive material is fixed to the component. The problem of pre-drying.

Fourthly, after the conductive material is supplied to the package, when the production line is stopped for a long time while the component is mounted, the conductive material is dried in the package in which the component is not mounted, so that it is necessary to discard the material. There are also problems with the increase in discarded packages.

In addition, the above-described problem is not limited to the crystal vibrator, and when the piezoelectric element (piezoelectric element) other than the crystal vibrator or the MEMS (Micro Electro Mechanical Systems) is attached or fixed to the package or the substrate by the bonding material, In the same way, further improvements are required in the assembly of extremely small electronic components.

The present invention has been made in view of the above problems, and an object thereof is to provide a supply of a conductive adhesive material even for an extremely small component, and to perform high-precision control of a supply position or a supply amount, and to prevent conduction during operation. The drying of the material is used to suppress the waste parts (package) into a minimum assembly device and assembly method.

(1) The assembly apparatus of the present invention includes: a transport means for transporting electronic components; a holding means for holding the components of the electronic component; and a coating means for applying the adhesive material, The component is mounted on the mounting member to assemble the electronic component. The assembly device is characterized in that the coating means directly applies the bonding material to the element held by the holding means, and the conveying means is coated with the bonding material. The element or the mounting member is carried by moving the element above the corresponding mounting member.

(2) The assembly device according to (1) above, wherein the device is any one of a crystal wafer, a piezoelectric element, and a MEMS element.

(3) The assembly apparatus according to the above (1) or (2), wherein the holding means holds the element from an upper surface side during mounting, and the coating means applies the above-mentioned side of the element when the element is mounted. Then the material.

(4) The assembly apparatus according to the above (3), wherein the holding means moves the element before and after the application of the adhesive material upside down so that the lower surface side of the mounting means is upward, and the coating is performed. The means applies the above-mentioned backing material from the upper side of the above element to the lower side of the mounting of the element.

(5) The assembling device according to any one of the above (1) to (4), wherein the conveying means has a rotating turntable, and the holding means provided on the periphery of the turntable to be vertically reversed.

(6) As shown in the above (3), the assembly device is further In the holding means, the element before the application of the above-mentioned material is held so that the upper side of the element is placed upward, and the coating means applies the above-mentioned material from the lower side of the element to the lower side of the element. .

(7) The assembly device according to any one of the above (1) to (6), wherein the coating means is a dispenser.

(8) The assembly device according to any one of the above (1) to (7), wherein the bonding material is a paste or a liquid material.

(9) The assembly device according to any one of the above-mentioned (1), wherein the holding means holds the element coated with the bonding material so that the upper surface side of the mounting is upward. The above mounting members are joined.

(10) The assembly device according to any one of the above (1) to (9), further comprising: a camera for attaching a member, wherein the mounting member before imaging is mounted; and the camera for the component is paired The imaging unit performs imaging before the mounting, and the analysis unit derives a relative positional shift amount of the mounting member and the component based on an imaging result of the camera for the mounting member and the camera for the component; and a position adjusting unit. The position of at least one of the element and the mounting member is adjusted based on a result of the derivation of the analysis unit.

(11) The assembly apparatus according to any one of the above (1) to (10), wherein the coating means applies the above-mentioned bonding material by relatively moving in a direction perpendicular to the lower surface of the element.

(12) The assembly device according to any one of the above (1) to (11), wherein the size of the plane of the element is 1 mm square under.

(13) The assembly device according to any one of the above (1) to (12), wherein the mounting surface of the mounting member has a size of 1 mm or less.

(14) The present invention is an assembly method in which an electronic component is assembled by mounting an element of an electronic component on a mounting member, and the assembly method is characterized in that a bonding material is directly applied to the component to apply the above-mentioned bonding material. The element is joined to the mounting member in positional alignment.

(15) The assembly method according to (14) above, wherein the element is any one of a crystal wafer, a piezoelectric element, and a MEMS element.

(16) The assembly method according to (14) or (15) above, wherein the element is held from the upper surface side at the time of mounting, and the above-mentioned material is applied to the lower surface side at the time of mounting the element.

(17) The assembly method according to any one of the above (14) to (16), wherein the element before the application of the bonding material is held from the upper surface side at the time of mounting, and the element is reversed up and down. The above-mentioned adhesive material is applied to the lower side of the component to the lower side of the component.

(18) The assembly device according to any one of the above (1) to (13), wherein the coating means is configured such that at least a part of the bonding material protrudes from an end portion of the element in a plan view. The above-mentioned binder was applied to the above elements.

(19) The assembly device according to any one of claims (1) to (13) and (18), wherein the coating means has a discharge unit attached The nozzle is formed in a tapered shape, and the coating means applies a position at which a part of the radial direction of the nozzle discharge hole protrudes from the end portion of the element in a plan view, and the element is coated on the element.

(20) The assembly device according to (19) above, wherein the nozzle discharge hole has a diameter of 0.2 mm or less.

According to this, even when the existing supply nozzle (precision nozzle) is used, the remaining adhesive material can be supplied to the outer side of the element with respect to the size of the extremely small coating region (electrode) of the element. Therefore, it is possible to prevent the bonding materials protruding from the coating region on the mounting surface from coming into contact with each other, and it is possible to prevent the occurrence of defects such as short circuits between the electrodes.

(21) The assembly device according to any one of (1) to (13), (18) to (20), wherein the coating means applies 1 cc to a coating region of the element. The above-mentioned backing material.

(22) The assembly device according to any one of (1) to (13), (18) to (21), wherein the dimension of the plane of the element is 0.4 mm or less in short dimension and 0.6 mm in long side. the following.

(23) The assembly apparatus according to any one of the above (1) to (3), wherein the coating means has a platform in which a film-shaped backing material is formed, and upward from the lower side of the platform The coating needle that penetrates, the coating needle passes through the stage on which the film-shaped backing material is formed, and is transferred to the element by contact with the element held above the stage.

(24) The assembly method according to any one of the above (14) to (17), wherein the bonding material is at least one in plan view A portion is protruded from the end of the above element to be coated on the above element.

According to this, even when the existing supply nozzle (precision nozzle) is used, the remaining adhesive material can be supplied to the outer side of the element with respect to the size of the extremely small coating region (electrode) of the element. Therefore, it is possible to prevent the bonding materials protruding from the coating region on the mounting surface from coming into contact with each other, and it is possible to prevent the occurrence of defects such as short circuits between the electrodes.

(25) The assembly method according to any one of the above (14) to (17) or (24), wherein the adhesive material is applied to the side surface side from the lower side of the mounting of the element.

(26) The assembly method according to any one of the above (14) to (17), (24), or (25), wherein the bonding material is applied to one of the coating regions of the device by 1 cc or less the amount.

(27) The assembly method according to any one of (14) to (17), (24) to (26), wherein the dimension of the plane of the element is 0.4 mm or less in short dimension and 0.6 mm in long side. the following.

According to the assembling apparatus of the present invention, it is possible to obtain an excellent effect of supplying a conductive material even if it is an extremely small element, and it is possible to perform high-precision control of a supply position or a supply amount, and to prevent conduction during operation. The drying of the material is suppressed to minimize the waste parts (package).

Furthermore, even when using an existing supply nozzle (precision nozzle), it is a very small coating area (electrode) with respect to the element. Inch, it is also possible to supply the remaining adhesive to the outside of the component. Therefore, it is possible to prevent the bonding materials protruding from the coating region on the mounting surface from coming into contact with each other, and it is possible to prevent the occurrence of defects such as short circuits between the electrodes.

1, 101‧‧‧ assembly device

10‧‧‧ components

20‧‧‧Installation components

21‧‧‧Component Maintenance Mechanism

24‧‧‧Component Maintenance Mechanism Drive Department

140‧‧‧Component holding unit

6, 116, 206, 306‧ ‧ coating device (coating unit)

30, 130‧‧‧ Rotating platform

Fig. 1 (a) is a top view showing the overall configuration of an assembling apparatus according to a first embodiment of the present invention. (b) is a front view of the component holding mechanism of the assembling apparatus according to the first embodiment of the present invention. (c) is a side view of the component holding mechanism of the assembling apparatus according to the first embodiment of the present invention.

Fig. 2 is a view showing the operation of the assembling device according to the first embodiment of the present invention, wherein (a) is a top view showing the component supply device, and (b) is a front view of the component holding mechanism, (c), ( d) Front view and side view of the component holding mechanism, and (e) is a front view of the component holding mechanism.

Fig. 3 is a side view showing a coating apparatus according to an embodiment of the present invention. (b) and (c) are plan views showing the elements to which the conductive adhesive is applied.

Fig. 4 is a front elevational view showing the overall configuration of an assembling apparatus according to a second embodiment of the present invention.

Fig. 5 is a side view showing the overall configuration of an assembling apparatus according to a second embodiment of the present invention.

Fig. 6 is a plan view (top view) showing the overall configuration of an assembly apparatus according to a second embodiment of the present invention.

Fig. 7 is a view showing the configuration of a posture obtaining means according to a second embodiment of the present invention.

Fig. 8 is a schematic view showing a flow of an image signal and the like in the assembling device of the second embodiment of the present invention.

Fig. 9 (a) is a schematic view showing an image of an element that is imaged and transported to a mounting area. (b) is a schematic view showing an image of an attachment member that is imaged in the mounting area.

Fig. 10 is a top view for explaining the operation of the assembling device of the second embodiment of the present invention.

Fig. 11 is a side view showing a coating apparatus according to a third embodiment of the present invention.

Fig. 12 is a view for explaining a fourth embodiment of the present invention, wherein (a) is a top view showing a supply method of a general material by a supply nozzle, and (b) is a view showing a general supply by a supply nozzle. Side view of the method of supplying the material.

Fig. 13 (a) is a top view showing a method of supplying a general adhesive material according to a fourth embodiment of the present invention, and (b) and (c) are side views.

Fig. 14 is a side view showing a method of supplying a binder to a supply nozzle according to a fourth embodiment of the present invention.

Fig. 15 is a side view for explaining a supply method of a backing material by a supply needle and a supply nozzle.

Fig. 16 is a side sectional view showing a supply nozzle of a fourth embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. Further, in the following examples, an assembly device in which a device (a wafer) is attached to a mounting member (package) to manufacture a crystal vibrator will be described.

(first embodiment)

First, the overall configuration of the assembling apparatus 1 according to the first embodiment of the present invention will be described with reference to Fig. 1 . Fig. 1(a) is a top view showing a main part of the assembling device. Fig. 1(b) is a front view of a portion of the component supply device 2 viewed from the Y direction (the lower side of Fig. 1(a)), and Fig. 1(c) is a view of the component supply from the X direction (the left side of Fig. 1(a)). A side view of a part of the device 2. Further, in each of the drawings, a part of the configuration is omitted as appropriate, and the drawing is simplified.

As shown in Fig. 1, the assembly apparatus 1 has a component supply device 2 for supplying an electronic component (here, a crystal resonator), a carrier device 3 for transporting electronic components, and a supply mounting member ( Here, the mounting member supply device 5 of the box-shaped ceramic package 20 having the upper portion opened, the coating device 6 for applying (supplying) the conductive adhesive material N to the device 10, and the posture information of the mounting member 20 are obtained. The information acquisition means 11, the analysis unit 12, and the position adjustment unit 13 mount the component 10 on the attachment member 20 to assemble an electronic component. In addition, although the illustration and detailed description are abbreviate|omitted, the assembly apparatus 1 is equipped with the control of the central control apparatus of the whole assembly apparatus 1, and the state of the component 10 after assembly, the mounting member 20, and the electronic components after assembly. A device and a disposal means for discarding defective electronic components in various inspection devices.

Further, the planar size of the element 10 of the present embodiment is 1 mm square or less (1 mm or less × 1 mm or less), and the mounting member 20 has a mounting surface size of 1 mm or less (1 mm or less × 1 mm or less).

The mounting member supply device 5 is taken out from the mounting member trays 51 of the plurality of mounting members 20 before the mounting, and is supplied to the conveying device 3 one by one. Further, the attachment member 20 is transferred from the attachment member supply device 5 to the conveyance device 3 by the conveyance arm 51A that enters and exits the conveyance device 3 (moves in the Y direction of FIG. 1(a)). Further, the present invention is not limited to this example, and even if the entire row of trays in which the mounting members 20 are arranged is arranged in series, the mounting member 20 is supplied, or the supply platform in a state in which the mounting members 20 are freely dispersed on the platform, and each image is picked up by image recognition. The configuration of the mounting member 20 is also possible.

The conveying device 3 has a disk-shaped rotating platform (turret) 31 that rotates about a vertical axis (the axis in the Z direction of Fig. 1), and a component holding mechanism 32 that is disposed in the circumferential direction of the periphery thereof. In the rotating platform 31, a supply region 311 for supplying the mounting member 20, a posture information acquisition region 312 for acquiring posture information of the mounting member 20, and mounting of the component 10 on the mounting member 20 are installed along the circumferential direction thereof (installation) a region 313, and a recovery region 314 for recovering the assembled electronic components (the component 10 and the mounting member 20), and transporting one of the supplied mounting members 20 from the mounting member supply device 5 to the mounting region in the supply region 311 At 313, the component 10 is mounted on the mounting member 20 in the mounting region 313, and the assembled electronic component is recovered in the recovery area 314.

The component holding mechanism 32 has, for example, an adsorption nozzle (not shown), and a negative pressure generating hole 321 is formed at an end portion before the adsorption nozzle, and the adsorption nozzle is sucked and held in the supply region 311 by the negative pressure applied to the negative pressure generating hole 321 The mounting member 20 to which the component supply device 5 is attached is attached. The rotary table 31 is rotatable by a motor (not shown), whereby the rotational movement of the component holding mechanism 32 disposed on the rotary table 31 can be performed. In the present embodiment, 16 component holding mechanisms 32 are disposed in the circumferential direction with respect to the rotary table 31, but it is preferable to provide at least three or more. More preferably, it has more than five.

Further, in the present embodiment, the turret mechanism by the rotary table 31 is exemplified as the structure of the transport device 3. However, the present invention is not limited thereto, and even a linear motion mechanism that reciprocates, for example, on a linear motion track may be used. .

The posture information acquisition means 11 is a camera disposed above the Z direction of the posture information acquisition 312 on the conveyance path of the attachment member 20, and images the attachment member 20 before installation. The analysis unit 12 derives the mounting member 20 that is transported by the transport device 3 and the component 10 that is held by the component holding mechanism 21 that should be attached to the mounting member 20, based on the imaging result of the posture information acquiring means (camera) 11. The relative position offset. Further, the position adjusting unit 13 adjusts the position of the element 10 held by the element holding mechanism 21 based on the result of the derivation by the analyzing unit 12.

Component supply device 2 has component holding mechanism 21 and components The holding mechanism drive unit 24 takes out the component 10 (pickup) from the component tray 22 in which the plurality of components 10 before mounting are placed, and feeds it to the upper side of the mounting member 20 of the mounting region 313, and joins the mounting member 20 and the component 10.

The component holding mechanism drive unit 24 holds the component holding mechanism 21 so as to be movable in the vertical axis direction (Z direction) and the horizontal axis direction (X, Y direction) as shown in FIGS. (a) and (b). The element holding mechanism 21 is provided with an adsorption nozzle 25 that is rotatable about a rotation axis R extending in the X direction and rotatable about a vertical axis (θ direction), and an adsorption nozzle, as shown in FIG. 25 The camera 26 can be moved in the X, Y, and Z directions at the same time. The adsorption nozzle 25 and the camera 26 are also driven by the element holding mechanism drive unit 24.

The coating device 6 is arranged in the vicinity of the mounting region 313 of the rotary table 31 in the moving path of the component holding mechanism 21, and the conductive member (for example, silver paste) is directly applied to the component 10 held by the component holding mechanism 21. .

Fig. 2 is a view showing the operation of the component supply device 2, and Fig. 2(a) is a top view of the entire component supply device 2, and in the same figure, shows the positions of the four component timings of the moving component holding mechanism 21. Further, Fig. 2(a) is a front view of the component holding mechanism 21 in the first region 201 viewed from the Y direction of the lower side of Fig. 2(a), and Fig. 2(a) is the same as Fig. 2(a) A side view of the component holding mechanism 21 and the fixed camera 23 in the second region 202 is viewed in the X direction on the left side, and the right side view (c) is a front view seen from the Y direction of the lower side of FIG. 2(a). . again The figure on the left side of the same figure (d) is a front view of the component holding mechanism 21 and the coating device 6 in the third region 203 viewed from the Y direction on the lower side of Fig. 2(a), and the right view of the figure (d) is the same as A side view of the left side of Fig. 2(a) viewed in the X direction. Further, the same figure (e) is a front view of the component holding mechanism 21 and the component holding mechanism 32 in the fourth region 204 viewed from the Y direction on the lower side of Fig. 2(a).

As shown in FIG. (a), the component supply device 2 is provided with a component holding region (first region) 201 of the pickup element 10 and a component posture information acquisition region for acquiring posture information of the component 10 along the movement path in the X direction ( The second region 202 is a coating region (third region) 203 in which the conductive adhesive is applied to the device 10, and a region (fourth region) 204 in which the component 10 is mounted (mounted) on the mounting member 20. Further, the mounting area 204 in the component supply device 2 coincides with the mounting region 313 in the transport device 2.

As shown in (b), in the component holding region 201, the component holding mechanism driving portion 24 moves the component holding mechanism 21 in the horizontal direction (X, Y direction of FIG. 2(a)), and is specifically held by the camera 26. Element 10 of the object (left). Thereafter, the component holding mechanism 21 is moved only in the horizontal direction, and the adsorption nozzle 25 is placed above the element 10 to be held. Further, the component holding mechanism drive unit 24 moves the adsorption nozzle 25 to the vertical direction (Z direction in Fig. 2(a)), and further rotates the θ direction about the vertical axis, and arranges the components of the plurality of components 10 before mounting. The component 10 is taken out one by one with the tray 22 (right).

As shown in (c), the component holding mechanism drive unit 24 When the component holding mechanism 21 is moved to the component posture information acquisition region (second region) 202, the direction of the adsorption nozzle 25 is reversed to be vertically above and below. In other words, as shown by the broken line in the left diagram of the figure (c), the adsorption nozzle 25 whose front end is directed downward in the vertical direction is rotated in the α direction around the rotation axis R, and is slightly inclined so that the front end faces upward in the vertical direction. 180° reverse.

The component 10 is placed on the component tray 22 so that the upper surface of the component holding region 201 in the same drawing (b) is attached upward, and the component holding mechanism 21 is adsorbed from above (upper side when mounted) by the adsorption nozzle 25. The element 10 is held. Further, in the component posture information acquisition region 202 shown in the same figure (c), the lower side of the component 10 at the time of mounting is held in a state of being vertically upward.

A fixed camera 23 is disposed in the component posture information acquisition region 202, and the component holding mechanism drive 24 moves the component holding mechanism 21 directly below the fixed camera 23. Moreover, the posture information of the component 10 is acquired by the fixed camera 23. Based on the posture information of the component 10 and the posture information of the mounting member 20 of the transporting device 3, the relative positional shift amount of the two is derived, and the position of the component holding mechanism 21 is adjusted based on the result of the derivation (the same as the right side of the figure (c)).

As shown in (d), in the coating region 203, the component holding mechanism driving portion 24 moves the component holding mechanism 21 in the same manner as in the drawing (b), and the coating device 6 is performed by the camera 26 of the component holding mechanism 21. The position of the supply nozzle 61 is aligned (left), and the conductive adhesive is applied to the element 10 by the coating device 6. After that, the component holder The configuration driving unit 24 rotates the adsorption nozzle 25 in the β direction around the rotation axis R, and again rotates the element 10 slightly above and below 180° (right).

As shown in (e), in the mounting region 204, the component holding mechanism driving portion 24 moves the component holding mechanism 21, and the camera 26 performs alignment of the mounting member 20 held by the component holding mechanism 32 (left) Fig. 4) The adsorption nozzle 25 is moved up, down, left, and right to engage the mounting member 20 and the component 10, and is mounted (right).

The movement structure of the element holding mechanism 21 (adsorption nozzle 25) may be various. For example, the vertical and horizontal directions may be moved by a cylinder or the like, and in the rotation direction, a motor or the like may be used. Others, for example, a ball screw mechanism or a rack and pinion mechanism by a screw shaft and a nut may be used in the up and down and left and right directions.

The application position of the coating device 6 and the conductive adhesive material N will be described with reference to Fig. 3 . Fig. 3 (a) is a side view showing a main part of the coating device 6, and Figs. 3 (b) and (c) are lower views of the element 10 showing a coating position of the conductive adhesive N.

The coating device 6 is provided with a dispenser that supplies the supply nozzle 61 of the conductive adhesive material N in a specific amount, and the conductive adhesive N is directly applied from above the component 10 to the lower surface side of the component 10 when it is mounted. The coating device 6 aligns the positions of the two electrodes 11 and 12 formed on the element 10 and the supply nozzle 61, and lowers the supply nozzle 61 to apply (supply) the conductive material N to the element 10. In the present embodiment, the coating device 6 is fixed, and the adsorption nozzle 25 for the holding member 10 is moved to the X direction, the Y direction, and the Z direction by the element holding mechanism driving portion 24 (and The mechanism for positioning with the coating device 6 is performed in the θ direction. However, even if the coating device 6 (supply nozzle 61) is moved by the driving means as indicated by a broken line to the X direction, the Y direction, and the Z direction (and θ) The configuration of the direction) is also possible.

As shown in Figs. (b) and (c), the element 10 of the present embodiment is a crystal wafer constituting a crystal vibrating piece, and electrodes 11 and 12 made of a thin film metal layer are formed on the surface thereof. The electrodes 11, 12 have a case where they are formed at one end of one side of the element (water wafer) 10 as shown in Fig. (b), and are opposed to each other in the element (water wafer) 10 as shown in Fig. (c). The central part of the two sides is formed separately. The conductive adhesive N is applied to each of the two electrodes 11, 12, respectively. Also, the two-dot chain line indicates the mounting member 20.

[Operation of assembly device]

Next, the operation of the assembling device 1 will be described with reference to FIGS. 1 to 3 again.

First, the mounting member supply device 5 takes out the mounting member 20 one by one by the transport arm 51A from the mounting member tray 51 (see FIG. 1) of the plurality of mounting members 20 before the mounting, and supplies it to the supply region 311 of the transport device 3. To the member holding mechanism 32. The mounting member 20 of the present embodiment is a box-shaped body that is open at the top, and is supplied to the member holding mechanism 32 so that the opening portion is upward. The member holding mechanism 32 sucks and holds the mounting member 20 by the adsorption hole 321 .

With the rotation of the rotating platform 31, at the part holding mechanism 32 The held mounting member 20 is here rotated and transported around the counterclock. The mounting member 20 is imaged by the camera 11 in the posture information acquisition area (hereinafter, the imaging area) 312. The imaging result is transmitted to the analysis unit 12 with the posture and position information of the mounting member 20.

The plurality of elements 10 are disposed such that the upper surface of the component tray 22 is mounted upward. The component holding mechanism driving section 24 of the component supply device 2 moves the component holding mechanism 21 (adsorption nozzle 25) to the component holding region 201 (Fig. 2(a)), and is aligned by the camera 26 from above the component 10. The component 10 is picked up (Fig. 2(b)).

After that, the component holding mechanism drive unit 24 moves the component holding mechanism 21 (adsorption nozzle 25) to the component posture information acquisition region 202 (FIG. (2a)) while the adsorption nozzle 25 is reversed up and down, by fixing the camera 23 The posture information of the component 10 is obtained (Fig. 2(c)). The posture information 10 of the component 10 is sent to the analysis unit 12 (see FIG. 1(a)), and the relative positional shift amount with the corresponding mounting member 20 is derived. Based on the result of the derivation, the position adjusting unit 13 controls the element holding mechanism driving unit 24 to move the adsorption nozzle 25 to the X, Y, Z, and θ directions to adjust the position and posture of the element 10.

Thereafter, the component holding mechanism driving portion 24 moves the component holding mechanism 21 (adsorption nozzle 25) to the coating region 203 (Fig. 2(a)). In the coating region 203, the position of the electrode 11 of the component 10 and the coating device 6 (supply nozzle 61) is aligned by the camera 26 of the component holding mechanism 21 so that the component 10 is immediately below the supply nozzle 61. Coating (supplying) a conductive adhesive N on the electrode 11 of the component 10 (Fig. 2(d), Figure 3). Next, the position of the electrode 12 of the element 10 and the supply nozzle 61 are aligned, and the conductive adhesive N is applied (supplied) to the electrode 12 of the element 10.

When the conductive adhesive N is applied, the component holding mechanism driving portion 24 moves the component holding mechanism 21 to the X direction (the right side in the X direction in Fig. 2(a)). Further, before the component holding mechanism driving unit 24 enters the mounting region 204, the adsorption nozzle 25 is again turned upside down. More specifically, it rotates in the β direction as shown in the right diagram of Fig. 2(d). Further, the coating amount detecting unit 120 performs the coating amount of the conductive adhesive material N at a position rotated by 90° in the β direction (the position shown by the broken line in the right drawing in Fig. 2(d)). The detection (see Fig. 2 (a)) is discarded as a defective component when the coating amount is abnormal. When the coating amount is normal, the adsorption nozzle 25 is rotated by 90° to the right in the β direction. By the rotation of the adsorption nozzle 25, the element 10 held by the adsorption nozzle 25 is vertically inverted. In other words, the element 10 held by the adsorption nozzle 25 is placed below the coating device 6 before being placed on the mounting region 204, and is held above the mounting surface at the time of mounting. Nozzle 25.

Thereafter, the component holding mechanism driving unit 24 moves the component holding mechanism 21 (adsorption nozzle 25) to the mounting region 204 (FIG. 2(a)). The mounting member 20 that is transported by the transport device 3 in the mounting area 204 (the mounting area 313) stands by. The component holding mechanism driving unit 24 photographs the position of the mounting member 20 by the camera 26, and performs position adjustment by the position adjusting unit 13 as needed, and moves the adsorption nozzle 25 to move the component. 10 is housed inside the mounting member 20, and the element 10 is joined to the inside of the mounting member 20, and this is mounted (Fig. 1 (a), Fig. 2 (e)).

The component holding mechanism 32 conveys the joined mounting member 20 and the component 10 (electronic component) to the recovery region 314, and collects the electronic component (crystal vibrator) in the recovery region 314 (see FIG. 1(a)).

In this way, the above operation is repeated, and the assembly device 1 assembles the crystal vibrator with high precision. In the assembly method of the electronic component of the assembly device 1, the component 10 of the component tray 22 is placed upward from the upper side during mounting, and the component holding mechanism 21 is taken out one by one from above. And the element 10 is reversed in the upper and lower direction, and the conductive material N is directly applied to the lower side of the element 10 by the coating device 6, and the positional alignment of the element 10 and the mounting member 20 is performed, and the material is placed and joined. The crystal vibrator is assembled with high precision by the mounting member 20 that reverses the element 10 and is transported by rotation.

According to this configuration, since the conductive adhesive N is directly applied to the element 10 and does not need to be supplied to the mounting member (package) 20, even when the element 10 or the mounting member 20 is minimized, When the adsorption nozzle 61 of the coating device 6 (dispenser) comes into contact with the inner wall of the mounting member 20, it is possible to suppress the deviation of the supply position or the supply amount (coating amount) due to the supply to the mounting member 20. Accordingly, even when the element 10 is extremely small, it is possible to prevent a short circuit between the electrodes 11 and 12, and it is possible to avoid an increase in defective elements.

Furthermore, since the conductive adhesive material N is directly applied to the element 10, there is no need for a high precision coating amount in response to the shape error of the mounting member 20. Degree of control.

In addition, after the application device 6 is disposed in the vicinity of the mounting region 313 of the transport device 1 and the conductive adhesive material N is applied to the device 10, the mounting region 313 is attached to the mounting member 20, so that it can be shortened compared with the prior art. From the time of application to bonding to the mounting member 20, the problem that the conductive adhesive N has dried before the fixing of the component 10 can be avoided.

Further, by providing an imaging region between the supply region 311 of the transport device 1 and the mounting region 313, the posture of the mounting member 20 can be imaged in the imaging region 312, and the position of the component waiting in the mounting region 313 can be aligned. That is, in the mounting region 313, the alignment of the component 10 and the mounting member 20 is completed (since the time for alignment in the mounting region 313 can be shortened), and the component 10 can be coated with conductive material in the coating device 6. The adhesive member N is joined to the mounting member 20 in a short time. Accordingly, even if the conductive adhesive material N supplied to the element 10 is a small amount, it can be prevented from drying and joined to the mounting member 20.

Further, in the assembly process, the conductive adhesive N is coated with the coating device 6, and since the member 10 mounted before the mounting member 20 has only one member 10 held by the adsorption nozzle 25 of the member holding mechanism 21, Therefore, even when the production line is stopped for a long time in the assembly process, the waste elements due to the drying of the coated conductive material can be suppressed to a minimum (for example, one).

In addition, since the component holding device 20 can be mounted after the assembly device 1 of the first embodiment, the conventional assembly device (the assembly device for bonding the components to the mounting member by supplying the conductive member) can be improved. In order to achieve an assembly device corresponding to a relatively inexpensive and extremely small component.

(Second embodiment)

Next, a second embodiment of the present invention will be described with reference to Figs. 4 to 10 .

4 is a front view of the assembly device 101. FIG. 5 is a left side view of the assembly device 101. FIG. 6 is a plan view (top view) of the assembly device 101. Further, in each of the drawings, a part of the configuration is omitted as appropriate, and the drawing is simplified. In addition, the same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

As shown in FIG. 4, the assembly apparatus 101 includes a base 102, a component supply device 110 disposed on the upper surface of the base 102 (on the left side in FIG. 4), and is rotatably disposed on the base 102. The robot arm 120 is rotatably disposed on the rotating platform 130 of the robot arm 120, and the component holding unit 140 is disposed in the circumferential direction on the outer circumferential surface of the rotating platform 130 (four in the present embodiment). The coating unit 116, the two external biasing devices 150 disposed on the robot arm 120, the rotating platform driving means 160 for rotating the rotating platform 130, and the posture information acquiring means 180 disposed on the right side of the upper surface of the base 102, The central control device 190 that controls the entire assembly device 101 and the mounting member supply device 170 and the assembly inspection device (not shown) that are disposed on the upper surface of the base 102 (on the right side in FIG. 4).

The base 102 is a member having a substantially rectangular parallelepiped shape. Inside the base 102, a central control unit 190 or a power supply without a special illustration is provided. Wait. A column member 102a is disposed at a deep end portion of the upper surface of the base 102, and a robot arm tray 102b that supports the robot arm 120 in an operable (swingingly) manner is disposed at an upper end of the column member 102a.

In the present embodiment, a component supply region 103 for supplying the component 10 from the component supply device 110 to the component holding unit 140 is provided at a portion above the base 102 (the upper left portion in FIG. 4). Further, a portion (on the upper central portion in FIG. 4) of the upper portion of the base 102 is provided with a coating region 104 to which the conductive member is applied to the member 10. Further, one of the upper portions of the base 102 (the upper right portion in FIG. 4) is provided with the component 10 held by the component holding unit 140 housed and joined to the mounting member 20 placed on the mounting member supply device 170. The area 105 is mounted (installed). Further, a part of the re-installation area 105 is provided with a posture information acquisition area 106 in which the posture information acquisition means 180 is disposed. Further, on the central deep side portion (the side of the rocking means 180) on the upper surface of the base 102, a waste area 135 (see FIG. 5) for discarding the waste to the waste tray 135 is provided.

The component supply device 110 is provided with a plurality of components 10. The element 10 may be arranged in a random manner, and the plurality of elements 10 may be arranged in a matrix even if the posture is adjusted. Specifically, the component supply device 110 includes a mounting tray 115 on which the component 10 is placed, a mounting tray moving means 119 formed of an XY stage, and a camera (such as a CMOS camera or a CCD camera) 117 for positioning the component 10. . The plurality of elements 10 are placed on the loading tray 115. The mounting tray 119 is not shown, and is configured by a linear motion device that is driven by a motor at right angles to each other. In the loading tray moving means 119 of the present embodiment, the placing tray 115 can be moved in the vertical direction and the horizontal direction (the upper and lower directions (X direction) and the left and right direction (Y direction) in Fig. 5). The loading tray moving means 119 sequentially arranges the components one by one in a manner corresponding to the photographing result of the component 10 generated by the camera 117 so as to correspond to the suction nozzle 142 of the component holding unit 140 in the component supply region 103. 10.

The robot arm 120 is a wrist-shaped member that extends upward from the upper side of the component supply device 110 from the robot arm tray 102b. The rotary arm 130 is rotatably held by the mechanical arm 120, and an external biasing device 150 and a rotary table driving means 160 are disposed. The external biasing device 150 is provided above each of the component supply region 103 and the mounting region 105 side.

The rotary table 130 is a member having a substantially disk shape, and four element holding units 140 are disposed at equal intervals on the outer peripheral surface (slightly spaced apart from each other in the present embodiment). The rotary table 130 is held at the robot arm 120 so as to be in the vertical direction (vertical direction) so that the rotation axis is in the illustrated operation position. Further, the rotary stage 130 is rotated in the clockwise or counterclockwise direction, and all of the component holding units 140 are configured to sequentially pass through the component supply region 103, the coating region 104, the mounting region 105 (posture information acquisition region 106), and discarded. Above area 135. In this example, when any of the component holding units 140 is located at a position facing the component supply region 103, the other three component holding units 140 are located in the mounting region 105 (posture information obtaining region 106) and the discarded region. 135 facing position (refer to Figure 6).

The component holding unit 140 has adsorption nozzles 142 that take out (pick up) the components 10 on the component supply device 110 one by one and hold them. Further, the element holding unit 140 includes a nozzle rotating unit (not shown), and the adsorption nozzle 142 is vertically inverted by the nozzle rotating unit at the front end of the adsorption nozzle 142 (opposite to the α direction or the α direction of FIG. 4). The method is free to rotate around the horizontal axis, and the component 10 can be reversed up and down. Further, the adsorption nozzle 142 is rotatable about a vertical axis (the direction opposite to the θ direction or the θ direction of FIG. 4), and the posture of the element 10 can be adjusted.

The component holding unit 140 of the adsorption holding member 10 is rotated about a vertical axis as it rotates about the vertical axis of the rotary table 130 (refer to FIG. 6). Furthermore, the component holding unit 140 rotates about the vertical axis while rotating the adsorption nozzle 142 about the horizontal axis in a vertical direction upside down. The moving structure of the adsorption nozzle 142 can be, for example, a motor or the like.

Here, the element 10 is placed on the component supply device 110 in such a manner that the upper surface is mounted upward. That is, the component holding unit 140 sucks the holding member 10 from the upper side (the upper side at the time of mounting) at the front end of the adsorption nozzle 142 in the component supply region 103, and the component holding unit 140 itself also rotates about the vertical axis, and in the coating region. In the 104, the adsorption nozzle 142 is rotated by 180° in such a manner that the front end (element 10) of the adsorption nozzle 142 is positioned above the vertical direction. Further, in this example, as shown by the broken line in FIG. 4, before the application to the application region 104, the rotation of the adsorption nozzle 142 is completed (vertical up and down), and the camera 118 positioned above is imaged to obtain the posture of the component 10. And complete the alignment of the coated area 104.

The element holding unit 140 then rotates toward the center of the vertical axis, and the adsorption nozzle 142 is reversed up and down again in the mounting region 105 so that the front end (element) of the adsorption nozzle 142 is positioned below the vertical direction, and the front end of the adsorption nozzle 142 faces downward. In the state, it moves to the mounting area 103 in which the mounting member 20 stands by.

The coating unit (coating device) 116 is a dispenser (see FIG. 3) that can move the supply nozzle 156 in the vertical direction in the same manner as in the first embodiment, and is disposed between the component supply region 103 and the mounting region 105. The component holding unit 140 is held, and the conveyed component 10 is coated (supplied) with a conductive adhesive (for example, silver paste or the like). Specifically, in the coating region 104, the supply nozzle 156 is lowered by the adsorption nozzle 142 which is vertically inverted, and the upper surface of the component 10 at the time of mounting is lowered, from above the component 10, at a specific position. A specific amount of conductive adhesive is applied to the electrodes 11 and 12.

One of the two external biasing devices 150 is disposed above the component supply region 103. Further, the other external biasing device 150 is disposed above the mounting region 105. One of the external biasing devices 150 applies an external force to the component holding unit 140 located on the component supply region 103, and moves the adsorption nozzle 142 of the component holding unit 140 to a direction (downward) close to the component supply region 103. The other external biasing device 150 applies an external force to the component holding unit 140 located on the mounting region 105, and moves the adsorption nozzle 142 of the component holding unit 140 to a direction (lower) close to the mounting region 105.

The rotary platform driving means 160 is fixed to the robot arm 120 Below it is located between the robot arm 120 and the rotating platform 130. In the present embodiment, the rotary stage driving means 160 is fixed to the stator of the robot arm 120, and a hollow DD (direct drive) motor composed of a cylindrical rotor that rotates around the periphery of the stator. A through hole is formed in the axial direction of the center portion of the stator. The rotating platform 130 is fixed to the rotor in a state in which the hollow shaft (not shown) is inserted into the through hole.

In addition, even if the camera is disposed between the application region 104 and the mounting region 105 on the lower side, the coating amount of the conductive adhesive may be detected.

The posture information acquisition means 180 is constituted by a camera (such as a CMOS camera or a CCD camera) (not shown), and is disposed in the posture information acquisition area 106 (part of the mounting area 105). The camera captures the component 10 held by the adsorption nozzle 142 of the component holding unit 140 located in the posture information acquisition area 106 from immediately below, and images the mounting component 20 that is supplied to the mounting region 105 and waits for the imaging component 10 from the top. That is, the camera waits for the component 10 that is carried toward the mounting area 105, and images the component 10 from below, and obtains tilt information related to the horizontal plane of the component 10 as image information. Further, the camera images the mounting member 20 that is standing by in the mounting area 105 from above, and acquires tilt information relating to the horizontal plane of the mounting member 20 as image information. Further, the camera system is electrically connected to the central control unit 190, and the image information obtained by the imaging is transmitted to the central control unit 190. Further, the inner bottom surface of the mounting member 20 of the engaging member 10 is detected based on the portrait information of the posture acquired by the camera. The height matches the posture (position, height) of the correcting element 10 and/or the posture (position, height) of the mounting member 20.

The central control unit 190 includes control devices such as a CPU, a ROM, and a RAM, and directly controls the component supply device 110, the external biasing device 150, the rotary table driving means 160, the posture information obtaining means 180, the mounting member supply device 170, and the like. The central control unit 190 compares the imaging result of the posture information acquiring means (camera) 180, and also functions as an analyzing means for deriving the relative position shift amount G of the mounting member 20 and the element 10.

The mounting member supply device 170 includes an entire row of trays 121 on which a plurality of concave portions arranged in a matrix are formed, and an array of tray moving means 117 formed of an X-Y platform. The mounting member 20 before assembly is placed in the recess of the entire tray 121. The entire tray moving means 117 is not shown, and is configured by a linear motion device in which the motor is driven at right angles to each other. In the present embodiment, the entire tray moving means 117 can move the entire tray 101 in the up-down direction and the left-right direction in FIG.

The entire tray moving means 117 sequentially supplies a plurality of mounting members 20 one by one to the mounting area before the component 10 is transported so as to correspond to the suction nozzle 42 of the component holding unit 140 located in the mounting region 105. 105. The entire tray moving means 117 functions as a position adjusting means for adjusting the position of the mounting member 20 based on the relative position shift amount G derived by the central control unit 190. In the region 105 to be loaded, the component 10 that is held by the component holding unit 140 is housed in the mounting member 20 and joined. By repeating the movement The component 10 is attached to all of the mounting members 20 placed in the recesses of the entire row of trays 121. When the assembly of all the mounting members 20 is completed, the entire tray 121 is carried to the next project.

The posture information obtaining means 180 will be further described with reference to Figs. 7 to 9 . FIG. 7 is a view showing the configuration of the posture information obtaining means 180, and FIG. 8 is a schematic view showing the flow of the image signal in the assembling device 101. FIG. 9( a ) is a schematic view showing an image of the element 10 that has been imaged and transported to the mounting area 105 . (b) is a schematic view showing an image of the mounting member 20 that has been imaged in the mounting area 105. Further, although the mounting member 20 is shown in a rectangular parallelepiped shape in the simplified drawing in FIG. 8, the mounting member 20 is actually a package having a box-shaped body that is opened upward.

As shown in Figure 7. In the present embodiment, the posture information acquisition means 180 is composed of two cameras 180 (a camera 181 for mounting members, a camera 182 for components) and a light guiding unit 183, and is disposed in the viewing information acquisition area 106 ( Mounting part of area 105). The camera 181 for mounting members and the camera 182 for components are each a CMOS camera, a CCD camera, or the like.

The camera 181 first images the mounting member 20 that is supplied to the mounting region 105 from the upper side via the light guiding element 183 before the component 10 is transported. In other words, the camera 181 captures the mounting member 20 that is supplied to the mounting area 105, and acquires positional information on the horizontal direction of the mounting member 20 as image information. Further, the camera 181 is electrically connected to the central control unit 190, and transmits the image information obtained by the imaging to the central control unit 190.

The camera 182 is imaged by the light guiding unit 183 from the immediately lower side to the component 10 in the posture information acquisition area 106 by the nozzle rotation unit, and then transported to the mounting area 105. In other words, the camera 182 captures the mounting member 10 that is supplied to the mounting area 105, and acquires positional information on the horizontal direction of the mounting member 10 as image information. Further, the camera 182 is electrically connected to the central control unit 190, and transmits the image information obtained by the imaging to the central control unit 190. The central control unit 190 derives the relative position shift amount G of the mounting member 20 and the component 10 based on the imaging results of the cameras 181 and 182. Specifically, as shown in FIG. 9(a), it is assumed that the image pickup result of the component 10 is located, for example, in the upper left area by the camera 182, and is obtained by the camera 181 as shown in FIG. 9(b). The member 20 is located in the case of, for example, an imaging result in the area of the lower right. At this time, the relative positional shift amount is derived as an amount indicated by an arrow G connecting the upper left region from the lower right region. The central control unit 190 operates the entire tray moving means (position adjusting unit) 117 based on the relative position shift amount G, and adjusts the mounting so that the position in the horizontal plane of the mounting member 20 is the same as the position in the horizontal plane of the component 10. The position of the member 20 in the horizontal direction.

Here, although the case where only the positional shift amount G in the X-Y plane direction is derived is shown, the amount of shift of the rotation can be derived. At this time, before the position shift amount G in the XY plane direction is derived, the offset of the rotation is analyzed by the central control unit 190 by the upper and lower cameras 181 and 182, and the offset is zero by the rotation offset. In a manner, the adsorption nozzle 142 is rotated to adjust the angle of the element 10. After that, take another shot In the holding posture of the element 10, the position shift amount G in the X-Y plane direction is derived, and the position of the mounting member 20 in the horizontal direction is adjusted so as to be close to zero. When the element 10 is held in an eccentric state with respect to the adsorption nozzle 142, when the positional alignment in the rotational direction is performed, the element 10 is displaced to the X-Y plane direction.

The light guide element 183 captures the mounting member 20 by the camera 181 including the optical path (not shown) that guides the light from the lower side lighting unit 183a to the camera 181, and is provided with light from the upper side lighting unit 183b. The camera 182 of the component side optical path (not shown) of the camera 182 is image pickup element 10. The light guiding unit 183 is a box type unit having a plurality of optical systems (optical paths) such as a mirror, a lens, and a cymbal, and has a size of about 10 mm square. The light guiding unit 183 is driven by an advancing and retracting unit (not shown), and the lower side lighting unit 183a and the upper side lighting unit 183b are advanced and retracted to the mounting area 105 as needed. The advancing and retracting unit first enters the lower side lighting unit 183a directly above the mounting member 20 that stands by in the mounting area 105 before the camera 181 images the mounting member 20 (see FIG. 8). Further, before the camera 182 captures the mounting member 10, the advancing and retreating unit first enters the upper lighting unit 183b between the mounting member 20 and the component 10 that are waiting in the mounting region 105 (see FIG. 8). Then, the order in which the mounting member 20 reaches the mounting region 105 waits after the mounting region 105 stands by, or in the same manner as the standby operation, the light guiding unit 183 enters the mounting region 105 by the advancing and retracting unit, and then the component 10 is transported to the mounting region 105.

Accordingly, the light guiding unit 183 is attached to the camera 181. The mounting member 20 and the lower side lighting unit 183a are disposed directly above the mounting member 20 in which the mounting area 105 stands by, and can be imaged from directly above the mounting member 20. Further, when the light guiding unit 183 is attached to the image sensor 10 of the camera 182, the upper side lighting unit 183b is disposed between the mounting member 20 that is in standby in the mounting area 105 and the component 10 that is transported to the mounting area 105, and is available from the component 10. Take a picture directly below. Further, the light guiding unit 183 is preferably configured to reduce the thickness t of the portion disposed between the element 10 and the mounting member 20, and to reduce the stroke during assembly. Therefore, the thickness t of the portion of the light guiding unit 183 is preferably 10 mm or less, and more preferably 8 mm or less. Since the thickness t is built-in optical system, the thinning is limited, and in reality, it can be thinned to 8 mm.

Further, although the position information acquiring means 180 shown in FIGS. 7(a) and 7(b) arranges the two cameras 181 and 182 in the horizontal direction, even if the apparatus 101 is assembled, as shown in FIG. 7(c), It is also possible to arrange two cameras 181, 182 in the longitudinal direction of one.

[Operation of assembly device]

Next, the operation of the assembly device 101 of the second embodiment will be described. 10(a) to 10(f) are plan views showing the operation of the assembly apparatus 101. Further, for ease of explanation, the element holding units 140A to 140D are indicated to the four element holding units 140, and the operation of the element holding unit 140A will be mainly described. The other component holding units 140B to 140D are the same as the component holding unit 140A, and thus the description thereof is omitted.

First, as shown in FIG. 10(a), the component supply device 110 arranges the plurality of elements 10 in a state in which the direction and posture are adjusted.

By the component supply device 110, after the plurality of components 10 are disposed in the component supply region 103 (or slightly simultaneously), the rotary table 130 is rotated by 90° around the counterclock, and the adsorption nozzle 142 of the component holding unit 140A is moved to the It is disposed at a position where the elements 10 of the component supply region 103 face each other (see FIG. 10(b)).

The rotating platform 130 is stationary for a specific time in the state of the same figure (b). While the rotary table 130 is stationary, the component holding unit 140A is pushed by the external pressing device 150 to bring the adsorption nozzle 142 close to the component 10 disposed in the component supply region 103. Further, the adsorption nozzle 142 adsorbs the element 10 and holds it. Thereafter, the pressing (or the pressing force) by the external pressing device 150 is released, whereby the adsorption nozzle 142 is raised.

Next, as shown in (c), the rotating platform 130 is again rotated counterclockwise. On the way of rotation of the rotary table 130, the component holding unit 140A rotates the adsorption nozzle 142 about the horizontal axis to reverse the front end of the adsorption nozzle 142 and the element 10 held therein. Further, after the upper and lower inversion of the adsorption nozzle 142 is completed, the state (posture) of the component 10 is subjected to image recognition by the camera 118.

In addition, during this period, the state of the mounting member 20 in which the mounting area 105 (posture information acquisition area 106) stands by is recognized by the camera 181. Further, the image recognition by the camera 181 is completed before the component 10 reaches the mounting area 105, and is not Limited to this timing. Furthermore, the light guide unit 183 enters the mounting area 105 and is completed before the image recognition by the camera 181.

As shown in (d), when the rotary table 130 is rotated counterclockwise again, and the component holding unit 140A is rotated by 90° from the position of the same figure (b), the component 10 held by the component holding unit 140A is carried. To the coating area 106. Even at this position, the component holding unit 140A is reversed so that the front end (element 10) of the adsorption nozzle 142 is positioned above the vertical direction and held. The element 10 held by the adsorption nozzle 142 is held in the adsorption nozzle 142 in a state in which the element 10 is moved upward from the upper surface during mounting (the same as (b) in the same figure) so that the lower surface of the element 10 is vertically upward. That is, the element 10 is held from below (upper side when mounted). Moreover, in this state, the specific time is again stopped.

While the rotary table 30 is stopped, the nozzle rotation unit (not shown) of the component holding unit 140A causes the adsorption nozzle 142 of the component holding unit 140A to rotate toward the θ only at an appropriate angle in accordance with the image information captured by the camera 118. The posture of the member 10 held by the adsorption nozzle 142 is adjusted.

While the rotating platform 130 is stationary, the coating unit 116 lowers the supply nozzle 156 from above the element 10, and applies (supplied) conductivity to a specific region of the element 10 (on the electrodes 11, 12 (see FIG. 3). material.

Then, after the application of the conductive adhesive material N, the coating amount detecting unit (not shown) detects the amount of the coating portion of the conductive adhesive material N. When the coating amount is abnormal, it is not attached to the mounting member 20, for example. When the right side is slightly rotated by 180° counterclockwise, the abnormality element 10 is discharged to the disposal tray 135 (refer to FIG. 10(f)).

Further, during the rotation of the rotary table 30, the next element 10 is disposed at an appropriate position of the component supply region 103 (directly under the adsorption nozzle 42 of the component holding unit 140B) as described above. Further, during the period in which the rotary table 130 is stationary, the adsorption nozzle 142 of the component holding unit 140B located at a position facing the component supply region 103 adsorbs the component 10 disposed in the component supply region 103 and holds it.

After the application of the conductive adhesive material N, the rotary stage 130 is rotated by 90° around the counterclockwise, and then rested for a predetermined time again (see FIG. 10(e)). Thereby, the element 10 held by the element holding unit 140A reaches the mounting area 105. Further, during the rotation of the rotary table 130, the component holding unit 140A rotates the adsorption nozzle 142 by 180° about the horizontal axis (upside down). Accordingly, the element 10 is reversed up and down again, that is, it is held by the adsorption nozzle 142 so that the upper surface is mounted upward.

While the rotary table 130 is stationary, the state of the component 10 transported to the posture information acquisition area 106 is image-recognized by the camera 182. The light guiding unit 183 is quickly retracted after being imaged by the camera 182. The result of the image recognition by the camera 182 is transmitted to the central control unit 190, and the relative position shift amount G of the mounting member 20 and the component 10 is derived by comparing the result of the image recognition by the camera 181. The entire tray moving means 117 of the mounting member supply device 170 is rooted According to the relative position shift amount G, the mounting member 20 is moved in the X-Y direction to perform position correction. Thereafter, the external pressing device 50 pushes the component holding unit 140A. As a result, the adsorption nozzle 142 of the component holding unit 140A is lowered, and the component 10 is housed in the mounting member 20 that is in standby in the mounting region 105, and is joined to assemble an electronic component (crystal vibrator).

Further, even after the component 10 is attached to the mounting member 20 in the above-described manner, it is preferable to determine the state of assembly by the assembly state of the imaging device 10 and the mounting member 20 by an assembly inspection device (not shown). In other words, when the assembly state is determined to be defective by the positional shift or the like based on the image information of the component 10 and the mounting member 20 which are imaged by the assembly inspection device, the component holding unit 140A that is in standby in the mounting region 105 is adsorbed. The nozzle 142 sucks the element 10 and the mounting member 20 which are judged to be defective. Further, the rotary table 130 is rotated by 90° counterclockwise, and the component 10 and the mounting member 20 which are judged to be defective are discharged to the disposal tray 135 (refer to FIG. 10(f)).

Further, based on the image information captured by the posture information obtaining means 180 or the camera 182, the component 10 that is determined to be incapable of controlling the posture or position is not mounted in the mounting area 105, and the component 10 is discharged to the discarding stage in this stage. The tray 135 side (see Fig. 10 (f)).

In this way, the above operation is repeated, and the assembly device 101 assembles the crystal vibrator with high precision. In other words, the assembly method of the electronic component by the above-described assembly device 101 is disposed one by one in the component supply region 103, and is disposed on the component supply device so that the upper surface thereof is mounted upward. The component 10 of the 110 is held while being held by the component holding unit 140, and is rotated and transported about the vertical axis while the component 10 is reversed up and down about the horizontal axis, and the component 10 is applied from above by the coating unit 116. The lower side of the mounting is directly coated with the conductive material N, and the element 10 is reversed again and downward around the horizontal axis. After the position of the element 10 and the mounting member 20 is aligned in the mounting region 105, the mounting member is housed and joined to the mounting member. 20 and assemble the crystal vibrator with high precision.

According to this configuration, since the conductive adhesive N is directly applied to the element 10 and does not need to be supplied to the mounting member (package) 20, even when the element 10 or the mounting member 20 is minimized, There is a possibility that the supply nozzle 156 of the coating device 116 (dispenser) contacts the inner wall of the mounting member (package) 20, and the supply position shift or the supply amount (coating amount) due to the supply to the mounting member 20 can be suppressed. Deviation. Accordingly, even when the element 10 is extremely small, it is possible to prevent a short circuit between the electrodes 11 and 12, and it is possible to avoid an increase in defective elements.

Furthermore, since the conductive adhesive N is directly applied to the element 10, high-precision control of the coating amount in accordance with the shape error of the mounting member 20 is not required.

Further, the element 10 is coated with the conductive adhesive material N in the application region 104, and then attached to the mounting member 20, so that the time from application (toward the mounting member 20) to the bonding can be shortened compared to the prior art, and Even if the supplied conductive adhesive N is in a small amount, it is possible to avoid the problem that the component 10 has dried before being fixed.

Furthermore, it can be reduced while the component holding unit 140 is held In the element 10, the number of the elements 10 to which the conductive member N is applied and attached to the mounting member 20 is applied. That is, as shown in FIG. 10, when the number of the element holding units 140 is four, the conductive adhesive N is applied, and the number of the elements 10 mounted on the mounting member 20 is one or two (although In response to the increase in the number of component holding units 140, there are at most several). Therefore, in the assembly process, even when the production line is stopped for a long time, since the conductive adhesive N is applied and the element 10 before the mounting member 20 is applied, the conductive adhesive N can be coated. Drying becomes a waste component and suppresses it to a minimum.

Further, since the assembly device 101 can hold the adsorption nozzle 142 by about 180 degrees (or 360 degrees) about the horizontal axis by holding the element holding unit 140 of the element 10 disposed in the circumferential direction of the turntable, it is compared with the first embodiment. The component holding mechanism 21 that moves in the horizontal direction can save space for the assembly device 101 (the base 102 that performs the actual work).

Further, in the assembly apparatus 101, the light guide unit 183 performs the approximate positional adjustment of the mounting member 20 that is waiting in the mounting area 105 before the component 10 is transported, so that the wasteful waiting time does not occur. Further, in the assembling apparatus 101, since the posture of the element 10 held by the adsorption nozzle 142 is adjusted during the rotational movement of the rotary table 130 (during the movement of the trajectory), the wasteful waiting time is not generated. Further, since the assembly device 101 is transported to the mounting region 105 and finally adjusted to the position relative to the mounting member 20 of the component 10 held by the adsorption nozzle 142, it is not affected by the mechanical accuracy of the transport device. , can make correct and correct adjustments. Furthermore, not only the driver installation Since the entire tray moving means 117 of the member supply device 170 can eliminate the relative positional deviation of the component 10 and the mounting member 20, it is not necessary to complicate the apparatus.

Further, the assembly device 101 is provided with a plurality of component holding units 140 having adsorption nozzles 142 in the circumferential direction of the rotary table 30. Therefore, it is possible to simultaneously perform the process of adsorbing and holding the first element holding unit 140 to adsorb the holding element 10 in the same stationary time, the second element holding unit 140 to apply the conductive element to the element 10, and the third element holding unit 140. The component 10 is assembled to the mounting member 20 to perform assembly work or the like.

Further, the assembly apparatus 101 includes the posture information acquisition means 180 that acquires the posture information of the component 10 held by the component holding unit 140 and the posture information of the attachment member 20 that is waiting in the region 105 to be loaded. The posture information acquisition means 180 includes a camera 181 that images the component 10 from the lower side in the imaging area, and a camera 182 that images the attachment member 20 from above, and derives the mounting member 20 and the component 10 based on the imaging results of the two cameras 181 and 182. The relative position offset G. With the miniaturization of the component 10 and the mounting member 20, the positional alignment at the time of assembling these requires high precision. However, with the present embodiment, the component 10 can be performed with high precision in a short time and space. The position of the mounting member 20 is aligned.

Further, the component supply region 103, the mounting region 105, and the discarded region 135 are taken in this order to a rotation path that rotates in one direction of the component holding unit 140. Therefore, the assembly device 101 can be By rotating the rotary table 130 and sequentially transporting the component holding unit 140 from the component supply region 103 to the disposal region 135, these processes can be surely performed.

Further, the assembly device 101 further includes a component supply device 110 in which the next component 10 is disposed in the component supply region 103, and a mounting member supply device 170 that transports the mounting member 20 before assembly to the mounting region 105. Therefore, the rotary table 130 is rotated, and the next element 10 is disposed at the component holding position 111 before the arbitrary component holding unit 140 is stopped at the component supply region 103. Further, the assembly device 101 rotates the rotating platform 130, and before the component holding unit 140 stops in the mounting region 105, the mounting member supply device 170 moves the next mounting member 20 to the mounting region 105. Therefore, it is possible to eliminate the waste of time and perform high-speed operation.

Further, the assembly device 101 according to the present embodiment includes four component holding units 140, and the present invention is not limited thereto, and other components (for example, six, eight, and twelve) are provided. Unit 140 is also possible.

In addition, the assembly apparatus 101 is provided with the rotation stage 130 so that the center axis which rotates in an operation position may become an up-down direction (vertical direction), It is not limited to this, It is set as the center of rotation of an operation position. The axis may be horizontal or inclined. Further, the rotating platform 130 may have a shape other than the shape shown in the present embodiment.

Further, the assembly device 101 is configured such that each unit is integrally controlled by the central control unit 190. However, the present invention is not limited thereto, and a dedicated control unit may be separately provided.

Further, the assembly device 101 is not limited to the case where the robot arm 120 is disposed on the base 102, and may be disposed in another member or independently. Further, the robot arm 120 may be an executor other than the oscillating member. For example, it is possible to move only in the downward direction, and it is possible to swing after moving linearly in the up and down direction. Further, the robot arm 120 may be formed even if the plurality of different rotation axes are swung or rotated.

Further, the positions of the component supply region 103, the posture information acquisition region 106, the mounting region 105, and the disposal region 135 are not limited to the positions shown in the present embodiment, and may be disposed at other positions. Further, even in the middle of transportation, an area for processing, assembling, inspecting, or the like of the parts may be provided.

Further, the rotation of the rotary table 130 is not limited to the intermittent rotation every 90 degrees of rotation, even if the component holding unit 140 is located at a position facing each of the component supply region 103, the posture information acquisition region 106, the mounting region 105, and the disposal region 135. At this time, the rotating platform 130 may be continuously rotated at a low speed. At this time, the component supply device 110 and the mounting member supply device 170 are in the component supply region 103 or the mounting region 105, and it is preferable to rotate the platform into the same direction as the rotating platform 130 and to move at the same speed. That is, in the component supply region 103, the adsorption nozzle 142 disposed on the rotary stage 130 can adsorb the element 10 that is supplied to the component supply device 110 that moves in the same direction and at the same speed as itself during rotation. Further, in the mounting region 105, the component holding unit 140 can assemble the component 10 adsorbed to the adsorption nozzle 142 to the mounting member supply device 170 that moves in the same direction as the component 10 and at the same speed during rotation.

(third embodiment)

A third embodiment of the present invention will be described with reference to Fig. 11 . Fig. 11 is a side view showing another example of the coating devices 206 and 306. Fig. 11(a) shows a coating device 206 for applying a conductive adhesive member to the element 10 by transfer, and Fig. 11(b) shows another example of the coating device 306 for the dispenser.

As shown in (a), the coating device 206 has a stage 210 on which a film-like backing material MN is formed, and a coating needle 211 that penetrates upward from the lower side of the stage 210, and a squeegee 212. The platform 210 is supplied with a liquid conductive adhesive, and a film-like adhesive MN is formed by the squeegee 212. Thereafter, when the coating needle 211 is moved in the vertical direction from the lower side of the stage 210, when the plate 210 is penetrated, the film-shaped backing material MN is attached to the front end of the coating needle 211. The coating needle 211 to which the film-like adhesive material MN is attached is brought into contact with the element 10, and the film-like adhesive material MN is transferred to the element 10. Further, although the squeegee 212 that moves in the horizontal direction in the horizontal direction is exemplified here, the squeegee 212 or the like of the plurality of blades that rotate on the circular platform 210 may be used.

According to this configuration, even when the amount of the conductive adhesive is applied to the dispenser, the control is relatively easy.

Further, as shown in FIG. 11(b), the coating device 306 is a dispenser that is bent upwards at the front end of the supply nozzle 307 (only). can.

When the coating apparatuses 206 and 306 of the third embodiment are used, the upper surface side at the time of mounting can be made to hold the element 10 from above, and the lower side of the mounting (from the lower side of the element 10) can be applied (transfer). Film-like bonding material MN (conductive bonding material N). In other words, it is not necessary to have the configuration in which the element holding unit 21 of the first embodiment or the element holding unit 140 of the second embodiment is reversed, and the configuration of the assembling devices 1 and 101 can be simplified.

(fourth embodiment)

A fourth embodiment of the present invention will be described with reference to Figs. 12 to 16 . Fig. 12 is a view showing a state in which the conductive member N is supplied to the element 10 of the present embodiment by a conventional method, and Fig. 12(a) is a top view in which the lower surface at the time of mounting is upward, and Fig. 2(b) For side view. 13 and FIG. 14 are views showing a method of supplying the conductive adhesive material N in the present embodiment, and FIG. 13(a) is a top view in which the lower surface of the mounting is upward, and FIG. 13(b), (c) is a side view, and FIG. 14 is a side view. Fig. 15 is a side elevational view for explaining the supply needle 71 and the supply nozzle (precision nozzle 61) of the present embodiment, and Fig. 16 is a side sectional view showing the supply nozzle (precision nozzle 61) of the present embodiment.

As described above, the element 10 of the present embodiment has an extremely small element having a planar size of 1 mm square or less. More specifically, the short side is, for example, 0.4 mm or less, and the long side is 0.6 mm or less. Therefore, the coated region of the conductive adhesive N is applied (that is, a portion of the electrode 11 and the electrode 12) It also becomes a small size (for example, 0.1 mm square). Furthermore, not only the coating area is small, but also the coating areas (electrodes 11, 12) are very close to each other.

For example, as shown in FIG. 3, when the conductive adhesive N is directly applied to the coated region of the component 10, generally, the conductive adhesive N is not exposed from the component 10 to the outside, or The conductive adhesive material N is applied at least in the vicinity of the center of the coating region, and the center position of the supply nozzle 61 (the discharge hole) is in the region of the mounting surface of the component 10 (for example, near the center of the coating region). The conductive adhesive material N is discharged while being aligned.

However, in the case of the extremely small element 10 having a plane size of 1 mm square or less in the present embodiment, the supply nozzle is positioned to align the center position of the discharge hole of the supply nozzle 61 in the region of the mounting surface of the element 10. When the paste or liquid conductive adhesive N is applied, the conductive adhesive N protrudes from the coating region, and there is a problem that the electrodes 11 and 12 are in contact with each other to cause a short circuit.

When specifically described with reference to Fig. 12, the conductive adhesive material N of the present embodiment is a silver filler which is mixed with a resin such as epoxy to, for example, a glass frit (矽, cerium oxide) and about 30 μm, from coating. The supply nozzle 61 of the apparatus 6 discharges and applies this. Here, when the supply nozzle 61 uses a so-called precision nozzle that can supply a small amount of the conductive adhesive material N, the smallest nozzle diameter (diameter of the discharge hole 61A) is about 0.1 mm to 0.2 mm (detailed in detail). , which is about 0.15mm~0.2mm), and the standard coating amount is 1cc or less (for example, 0.3cc~) About 0.5cc).

Therefore, as in the conventional method, the discharge port 61A of the supply nozzle 61 is provided in the region of the mounting surface of the element 10 so as to cover the application regions (electrodes 11 and 12) (the same figure). When the center position of (a) is indicated by a thick broken line is aligned and the conductive material N is supplied, there are many protruding from the coating region, and the conductive materials N are in contact with each other to cause a short circuit between the electrodes 11 and 12. problem.

Further, it is also considered that the coating amount at one time is less than a specific amount (for example, about 0.3 cc to 0.5 cc), but at this time, the amount of supply varies, and there is a problem that the bonding of the element 10 and the support are unstable.

Then, the coating device 6 of the present embodiment is applied from the end portion of the element 10 to at least a part of the conductive adhesive material N to the outside of the element 10 in plan view, and the conductive adhesive material N is directly applied to the element 10.

Specifically, as shown in FIG. 13 , the supply nozzle 61 of the coating device 6 is formed into a tapered shape in the vicinity of the discharge hole 61A, and the front end portion of the discharge hole 61A is processed into a known fine nozzle having a very fine shape. Further, the diameter of the discharge hole 61A of the supply nozzle 61 is about 0.1 mm to 0.2 mm (specifically, about 0.15 mm to 0.2) as described above, and the standard coating amount at one time is 1 cc or less (for example, , 0.3cc~0.5cc degree).

However, when the coating device 6 is applied to the conductive adhesive material N, one part of the radial direction of the discharge hole 61A (shown by a thick broken line in the same figure (a)) of the nozzle 61 is supplied from a plan view. The end portion (corner portion) of the element 10 is aligned so as to protrude, and the conductive adhesive material N is applied to the element 10 at its position. As shown in (b) and (c), the element 10 is held by the adsorption nozzle 25 so that the lower surface of the element is mounted upward, and the coating device 6 is formed by the supply nozzle 61 (discharge hole 61A). The center positions of the two electrodes 11 and 12 on the 10 are offset, and a part of the radial direction of the discharge hole 61A is aligned from the end portion (corner portion) of the element 10, and then the supply nozzle is provided from above the element 10. 61 is lowered and the conductive adhesive N is applied directly to the component 10.

Accordingly, the conductive adhesive member N is applied to the member 10 (in the same drawing (a)) in such a manner that at least a portion protrudes from the end portion of the member 10 (the edge (corner portion) of the member 10) in plan view. Alternatively, the portion of the conductive adhesive material N protruding from the end of the element 10 is at least wrapped to the side of the element 10, and the lower side of the element 10 is applied to the side of the side (the same as (b)) or the same Figure (c).

In this state, as shown in FIG. 14(a), the adsorption nozzle 25 is reversed and moved to house the element 10 inside the mounting member 20, and the element 10 is joined to the mounting member by the conductive adhesive N. The inside bottom of the 20, and install this.

Further, after the component 10 is housed in the mounting member 20, as shown in FIG. (a), it may be pressed by the adsorption nozzle 25 or the like before the conductive adhesive material N is fixed. Accordingly, the remaining conductive adhesive material N protruding from the mounting surface of the component 10 is wrapped around the underside and the side of the component 10, and can be closely attached even when a gap is formed between the underside of the component 10 and the mounting member 20. Element 10 and mounting member 20.

Furthermore, even as shown in Figures (b) and (c), When the component 10 is housed in the mounting member 20, the component 10 is tilted in such a manner that the portion of the conductive adhesive N coated with the component 10 is lowered to the other side, and the conductive adhesive N and the mounting member under the component 10 are attached. The timing of the contact of the bottom surface of 20 may be such that the component 10 is released from the adsorption nozzle 25. Accordingly, the component 10 sinks due to its own weight, and the component 10 and the mounting member 20 can be brought into close contact.

As a result, in the present embodiment, even if a known supply nozzle (precision nozzle) 61 is used, the conductive adhesive N remaining relative to the size of the coated region (electrodes 11, 12) of the element 10 can be used ( For example, the conductive material of the amount of about one-fourth of the amount of one coat (about 0.25 cc) is supplied to the outer side of the element 10. Therefore, it is possible to prevent the conductive adhesive materials N protruding from the coating region on the mounting surface from coming into contact with each other, and it is possible to prevent occurrence of defects such as short-circuiting between the electrodes 11 and 12.

Further, since the conductive adhesive material N is supplied to the coating area in a slightly more comprehensive manner, sufficient adhesion can be maintained, and the element 10 can be stabilized and supported. Further, the remaining conductive adhesive material N enters between the component 10 and the mounting member 20, and since it is also in contact with the side surface of the mounting member 20, the component 10 can be surely engaged with the mounting member 20.

Here, the known supply needle 70 and the precision nozzle 61 of the present embodiment will be further described with reference to FIG. In the same figure, the supply pin 70 (the same figure (a)) and the precision nozzle 61 (the same figure (b)) are used to supply the conductive member N to the mounting member 20 to which the element 10 of the present embodiment is mounted. Side view.

In the prior art, it was applied to a tiny package. (When the mounting member 20 is supplied with the conductive adhesive material N), the supply needle 70 having an elongated needle shape other than the vicinity of the discharge hole 70A is inserted so as to be inclined to the inner wall (side wall and bottom surface) of the attachment member 20 And the method of coating (the same as (a)). However, the supply needle 70 is also limited in diameter to reduce the diameter of the discharge hole 70H in order to maintain the strength due to its elongated outer shape. In other words, although the shape of the precision nozzle 61 having a tapered front end shape is relatively large, the diameter of the discharge hole 61A can be made small. That is, even if the supply needle 70 is obliquely inserted into the extremely small attachment member 20, it is extremely difficult to supply a small amount of the conductive adhesive N.

Further, since the precision nozzle 61 having a tapered front end shape has a large outer size, when the conductive connecting member N is supplied to the extremely small mounting member 20, the side wall (side surface) of the mounting member 20 interferes with the precision nozzle 1, which is very It is difficult to bring the precision nozzle 61 close to a specific coating area inside the mounting member 20 (Fig. (b)).

As a result, it is very difficult (or impossible) to apply the conductive bonding material to the mounting member 20 having the extremely small component 10 of the present embodiment even if it is one of the supply needle 70 and the precision nozzle 61. N.

In the present embodiment, the mounting member 20 is not attached, and since the conductive adhesive N is directly supplied to the element 10, there is no problem that the mounting member 20 and the precision nozzle 61 interfere. Therefore, a supply nozzle (precision nozzle) 61 having a larger front end outer shape than the supply needle 70 (in addition, the discharge hole 61A is smaller than the supply needle 70) can be used.

And, as shown in FIG. 16, the supply spray of this embodiment The nozzle 61 is provided with, for example, a temperature adjustment mechanism 61H at a peripheral portion, whereby the conductive adhesive N can be held at a normal temperature (for example, at about 25 ° C). The temperature adjustment mechanism 61H may be a temperature adjustment mechanism that can be heated/cooled by using a Peltier element, for example, and may be a temperature adjustment mechanism that performs heating/cooling by using a heater such as a coil or a water flow or the like. .

The conductive adhesive material N (for example, silver paste) is held frozen in an appropriate amount each time, and is thawed at the time of use and supplied at a normal temperature by the temperature adjustment mechanism 61H.

Further, the supply nozzle (precision nozzle) 61 may be connected to the coating device 6 by a deformable pipe member or the like. As a result, as shown in FIG. 11(b), the tube member is deformed to supply the conductive material N so that the front end of the supply nozzle 61 faces upward.

As described above, the coating apparatus (coating unit) of the present embodiment is described by taking a case where a conductive member is applied to a single element (two places) by moving in one of the left and right directions (X, Y directions). However, for example, a plurality of (two) coating devices may be provided on the conveyance path of the component 10 of the second embodiment. At this time, the first coating device is applied at the first position, and then the element is moved and applied by the second coating device at the second position. According to this configuration, since it is not necessary to move the supply nozzle to the element 10, high-precision alignment can be performed.

In the present embodiment, the conductive paste is exemplified as the material of the conductive adhesive to which the element 10 is applied, but is not particularly limited thereto. For example, it may be a chemical material that is fully utilized by the subsequent heating process.

Further, even if the cleaning device is provided, the cleaning device has a cleaning surface formed by fibers or grindstones, and abuts against the front end of the adsorption nozzle to periodically wipe the adhered conductive adhesive.

In addition, the mounting apparatus of the components of the present invention and the mounting method of the components are not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the invention.

[Industrial use feasibility]

The present invention can be widely utilized in the field of manufacturing electronic parts.

Claims (26)

An assembly apparatus comprising: a transport means for transporting electronic components; a holding means for holding components of the electronic component; and a coating means for applying a bonding material to mount the component The assembly device is characterized in that the coating means directly applies the above-mentioned member to the element held by the holding means, and the conveying means is the element to which the above-mentioned bonding material is applied. The element or the mounting member is transported by moving to above the corresponding mounting member, and the coating means applies the bonding material to the vicinity of an edge on one side of the element, and the coating means is wrapped to In the side surface of the element, the adhesive is applied, and when the element is mounted on the mounting member, the element is positioned such that an edge of the one side of the element is lower than an edge of the side The opposite side has a low edge. The assembly device according to claim 1, wherein the element is any one of a crystal wafer, a piezoelectric element, and a MEMS element. The assembly device according to claim 1 or 2, wherein the holding means holds the member from the upper side of the mounting, The coating means applies the above-mentioned binder to the lower surface side of the above-mentioned component mounting. The assembly device according to claim 3, wherein the holding means holds the element upside down and the element before the application of the material is placed so that the lower side of the attachment is upward, and the coating means is from the above The above-mentioned adhesive material is applied to the lower side of the component to the lower side of the component. The assembling device according to claim 1 or 2, wherein the conveying means has a rotating turntable, and the holding means provided on the periphery of the turntable to be vertically reversed. The assembly device according to claim 3, wherein the holding means holds the element before the application of the bonding material so that the upper surface side of the mounting means is upward, and the coating means is from below the element to the element The above-mentioned backing material was applied to the lower side of the mounting. The assembly device according to claim 1 or 2, wherein the coating means is a dispenser. The assembly device according to claim 1 or 2, wherein the above-mentioned binder is a paste or a liquid material. The assembly device according to claim 1 or 2, wherein the holding means holds the member to which the above-mentioned material is applied so as to be attached to the mounting member. The assembly device of claim 1 or 2, wherein a camera for mounting a member for imaging the mounting member before mounting, a camera for a component for imaging the component before mounting, and an analyzing unit for the camera and the component for mounting the component Using the imaging result of the camera to derive the relative positional offset of the mounting member and the component; and the position adjusting unit adjusting at least one of the component and the mounting component based on a result of the derivation of the analyzing unit s position. The assembly apparatus according to claim 1 or 2, wherein the coating means applies the above-mentioned bonding material by relatively moving in a direction perpendicular to the lower surface of the element. The assembly device according to claim 1 or 2, wherein the dimension of the plane of the element is 1 mm square or less. The assembly device according to claim 1 or 2, wherein the mounting surface of the mounting member has a size of 1 mm square or less. The assembly apparatus according to claim 1 or 2, wherein the coating means applies the above-mentioned bonding material to the element so that at least a part of the bonding material protrudes from an end portion of the element in a plan view. The assembly device according to claim 1 or 2, wherein the coating means has a nozzle having a tapered shape in the vicinity of the discharge portion, and the coating means is a part of a radial direction of the nozzle discharge hole in a plan view from the element a position where the end portion protrudes, and the above component is coated with the above Then the material. The assembly device according to claim 15, wherein the nozzle discharge hole has a diameter of 0.2 mm or less. The assembly apparatus according to claim 1 or 2, wherein the coating means applies 1 cc of the above-mentioned adhesive material to one of the coating regions of the element. The assembly apparatus according to claim 1 or 2, wherein the dimension of the plane of the element is 0.4 mm or less in the short side and 0.6 mm or less in the long side. The assembly apparatus according to claim 1 or 2, wherein the coating means has a platform on which a film-shaped backing material is formed, and a coating needle penetrating upward from a lower side of the platform, wherein the coating needle is formed to penetrate The above-mentioned platform of the film-like adhesive material is transferred to the above-mentioned element by contact with the above-mentioned element held above the above-mentioned stage. An assembly method of assembling an electronic component by mounting an element of an electronic component on a mounting member, the assembly method being characterized in that a bonding material is directly applied in the vicinity of an edge on one side of the component, and the bonding material is at least partially viewed in plan view Projecting from the end of the element, the adhesive material is applied to the side surface side from the lower surface side when the element is mounted, and when the element is mounted on the mounting member, the element is aligned to the above-mentioned element. The edge of one side is lower than the edge of the side The other side of the opposite side is low, and the above-mentioned element coated with the above-mentioned backing material and the above-mentioned mounting member are followed. The assembly method according to claim 20, wherein the element is any one of a crystal wafer, a piezoelectric element, and a MEMS element. The assembly method according to claim 20 or 21, wherein the above-mentioned member is held from the upper side of the mounting, and the above-mentioned member is applied to the lower side of the mounting of the above-mentioned member. The assembly method according to claim 20 or 21, wherein the member before the application of the bonding material is held from the upper side of the mounting, and the element is reversed up and down, from above the element to the lower side of the mounting of the element. The above-mentioned binder was coated on the side. The assembly method according to claim 20 or 21, wherein the adhesive member is applied to the member so that at least a portion protrudes from an end portion of the member in a plan view. The assembly method according to claim 20 or 21, wherein the adhesive material is applied to an application region of the element by an amount of less than 1 cc. The assembly method according to claim 20 or 21, wherein the dimension of the plane of the element is 0.4 mm or less in the short side and 0.6 mm or less in the long side.