JP2016021736A - Assembly device and assembly method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an assembly device which may supply a conductive adhesive even to an extremely small element, enables highly accurate control of the supply position and the supply amount, prevents the conductive adhesive from being dried during the operation to minimize discarded components (packages).SOLUTION: An assembly device includes: transfer means 3 which transfers electronic components; holding means 21 which holds an element 10 of each electronic component; and application means 6 which applies an adhesive. The assembly device mounts the element 10 on a mounting member 20 to assemble each electronic component. The application means 6 directly applies the adhesive N to the element 10 held by the holding means 21. The transfer means 3 transfers the element 10 or the mounting member 20 so that the element 10, to which the adhesive N has been applied, is moved to an area above the corresponding mounting member 20.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an assembling apparatus and an assembling method for attaching and mounting a minimal component on a package.

  Conventionally, in a crystal resonator, a conductive adhesive is supplied to a predetermined position of a package (component container), and an element piece (crystal piece) on which an electrode is formed is mounted and fixed, whereby an electrode and a conductive pattern of the package are formed. Electrically connected.

  As an example, a crystal resonator assembly apparatus includes a conductive adhesive supply (coating) stage and a crystal piece mounting stage, and the supply stage applies conductive adhesive to a package placed on a table. Supply. Specifically, the nozzle of the dispenser is inserted into the package, the conductive adhesive is supplied, the nozzle is moved to the next package, the conductive adhesive is supplied, and this is repeated to conduct the conductive to the package continuously. Supply of adhesive material. Thereafter, on the mounting stage, crystal pieces are sequentially mounted on the individual packages and fixed to the package with a conductive adhesive (see, for example, Patent Document 1 and Patent Document 2).

JP 2011-91695 A JP 2004-15792 A

  However, at present, with the miniaturization of electronic components, the crystal piece and the package for mounting the crystal piece have been miniaturized, and it has become difficult to apply (supply) a conductive adhesive. Is causing problems.

  First, when the conductive adhesive is supplied to the package, the nozzle (or needle) of the dispenser comes into contact with the inner wall of the package, resulting in misalignment of the supply position and variations in the supply amount (application amount). In order to solve such a problem, a method of inserting a nozzle (or needle) so as to be inclined with respect to the inner wall (side wall and bottom surface) of the package and supplying a conductive adhesive is also employed. As the miniaturization of packages continues to increase, this method also has limitations. Displacement of the supply position of conductive adhesive and variation in supply amount have little effect when the element is of a certain size, but when the element is extremely small, it is easy to short between the electrodes, and defective elements Will increase.

  Second, each package has a shape error (bottom distortion), and the amount of conductive adhesive applied varies depending on the position of the bottom of each package, that is, the position of the conductive adhesive application surface. End up. For this reason, when applying a conductive adhesive to a package, it has become necessary to control the application amount with high accuracy in accordance with the package shape error.

  Thirdly, in the conventional method in which the conductive adhesive is supplied to a plurality of packages at the supply stage and then the elements are mounted on the individual packages at the mounting stage, when the elements are mounted, a certain amount of coating is applied. It was inevitable that time passed. In this case as well, if the applied amount is large to some extent, the influence of the passage of time is small, but especially when the element is small and the supply amount of the conductive adhesive is small, the applied conductive adhesive is dried before the element is fixed. There was a problem.

  Fourth, if the line is stopped for a long time while the element is mounted after supplying the conductive adhesive to the package, the conductive adhesive is dried in the package where the element is not mounted. Therefore, there is a problem that these packages must be discarded and the number of discarded packages increases.

  Note that the above problem is not limited to crystal resonators, but also when piezoelectric elements (piezo elements) or MEMS (Micro Electro Mechanical Systems) elements other than crystal resonators are mounted and fixed to a package or substrate with an adhesive. Therefore, further improvement has been demanded in an assembly apparatus for extremely small electronic components.

  The present invention has been made in view of the above problems, and can supply a conductive adhesive even with a very small element, and can control the supply position and the supply amount with high accuracy and work. It is an object of the present invention to provide an assembling apparatus and an assembling method capable of preventing the conductive adhesive material therein from being dried and minimizing waste parts (packages).

  (1) An assembling apparatus according to the present invention includes a conveying unit that conveys an electronic component, a holding unit that holds an element of the electronic component, and an application unit that applies an adhesive, and the element is mounted on a mounting member. In the assembling apparatus for assembling the electronic component, the application unit directly applies the adhesive to the element held by the holding unit, and the transport unit includes the element to which the adhesive is applied. It is an assembling apparatus that conveys the element or the mounting member so as to move above the corresponding mounting member.

  (2) The assembly apparatus according to (1), wherein the element is any one of a crystal piece, a piezoelectric element, and a MEMS element.

  (3) The holding means holds the element from the upper surface side when the element is mounted, and the application means applies the adhesive to the lower surface side when the element is mounted. The assembly apparatus according to 1) or (2).

  (4) The holding means holds the element by turning the element before application of the adhesive material upside down so that the lower surface side when mounted is upward, and the application means The assembly apparatus according to (3), wherein the adhesive is applied to the lower surface side when the element is mounted from above.

  (5) In addition, any one of the above (1) to (4), wherein the conveying means includes a rotating turret and the holding means provided on the outer periphery of the turret so as to be vertically inverted. An assembly apparatus according to claim 1.

  (6) In addition, the holding means holds the element before applying the adhesive so that the upper surface side at the time of mounting is upward, and the applying means is used when the element is mounted from below the element. The assembly apparatus according to (3), wherein the adhesive is applied to a lower surface side of the assembly.

  (7) Moreover, the said application | coating means is a dispenser, It is an assembly apparatus in any one of said (1) to (6) characterized by the above-mentioned.

  (8) The assembly apparatus according to any one of (1) to (7), wherein the adhesive is a paste-like or liquid adhesive.

  (9) Further, from the above (1), the holding means holds the element coated with the adhesive so that the upper surface side at the time of mounting is upward and adheres to the mounting member. (8) The assembly apparatus according to any one of (8).

  (10) Also, a mounting member camera that images the mounting member before mounting, an element camera that images the element before mounting, the mounting member camera, and an imaging result of the element camera An analysis unit for deriving the relative displacement of the mounting member and the element based on the above, and a position adjustment unit for adjusting at least one position of the element and the mounting member based on the deriving result of the analysis unit The assembly apparatus according to any one of (1) to (9), wherein the assembly apparatus includes:

  (11) Further, in the above (1) to (10), the application unit applies the adhesive by moving in a vertical direction relative to the lower surface of the element. It is an assembly device.

  (12) The assembly device according to any one of (1) to (11), wherein the element has a plane size of 1 mm square or less.

  (13) The assembly device according to any one of (1) to (12), wherein the mounting member has a mounting surface size of 1 mm square or less.

  (14) Further, the present invention is an assembly method for assembling the electronic component by mounting an element of the electronic component on a mounting member, wherein the adhesive is directly applied to the element, and the adhesive is applied An assembly method is characterized in that an element is aligned and bonded to the mounting member.

  (15) The assembly method according to (14), wherein the element is any one of a crystal piece, a piezoelectric element, and a MEMS element.

  (16) The assembly according to (14) or (15), wherein the element is held from an upper surface side when mounted, and the adhesive is applied to a lower surface side when the element is mounted. Is the method.

  (17) Further, the element before application of the adhesive is held from the upper surface side when mounted, the element is turned upside down, and the adhesive is applied from above the element to the lower surface side when the element is mounted. The assembling method according to any one of the above (14) to (16), wherein coating is performed.

  (18) Further, from the above (1), the application means applies the adhesive to the element so that at least a part of the adhesive protrudes from an end of the element in a plan view. (13) The assembly apparatus according to any one of (13).

  (19) Further, the coating means has a nozzle having a tapered outer shape in the vicinity of the discharge portion, and the coating means has the nozzle discharge hole at a position where a part of the nozzle discharge hole in the radial direction protrudes from the end portion of the element. The assembly apparatus according to any one of (1) to (13) and (18), wherein the adhesive is applied to an element.

  (20) In the assembling apparatus according to (19), the diameter of the nozzle discharge hole is 0.2 mm or less.

  Thereby, even if it is a case where the existing supply nozzle (precision nozzle) is used, the excess adhesive material with respect to the size of the very fine application | coating area | region (electrode) of an element can be supplied to the outer side of an element. . Accordingly, it is possible to prevent the adhesives protruding from the application area on the mounting surface from coming into contact with each other, and to prevent the occurrence of defects such as a short circuit between the electrodes.

  (21) Further, the application means applies less than 1 cc of the adhesive to one application region of the element, wherein (1) to (13), (18) to (20) The assembling apparatus according to any one of the above.

  (22) The plane size of the element is such that the short side is 0.4 mm or less and the long side is 0.6 mm or less. (1) to (13), (18) To (21).

  (23) Further, the coating means includes a table on which a film-like adhesive is formed, and an application needle penetrating from below to above the table, and the table on which the film-like adhesive is formed (1) to (3), (6), wherein the coating needle penetrates and contacts the element held above the table, thereby transferring the adhesive to the element. The assembling apparatus according to any one of the above.

  (24) In any one of (14) to (17), the adhesive is applied to the element so that at least a part thereof protrudes from an end of the element in a plan view. The assembling method described.

  Thereby, even if it is a case where the existing supply nozzle (precision nozzle) is used, the excess adhesive material with respect to the size of the very fine application | coating area | region (electrode) of an element can be supplied to the outer side of an element. . Accordingly, it is possible to prevent the adhesives protruding from the application area on the mounting surface from coming into contact with each other, and to prevent the occurrence of defects such as a short circuit between the electrodes.

  (25) The assembly according to any one of (14) to (17) and (24), wherein the adhesive is applied from the lower surface side to the side surface side when the element is mounted. Is the method.

  (26) The adhesive may be applied in an amount of less than 1 cc to one application region of the element. (14) to (17), (24) and (25) The assembly method according to any one of the above.

  (27) The plane size of the element is such that the short side is 0.4 mm or less and the long side is 0.6 mm or less. (14) to (17), (24) To (26).

  According to the assembling apparatus of the present invention, it is possible to supply a conductive adhesive even with a very small element, and it is possible to control the supply position and the supply amount with high accuracy and An excellent effect of preventing drying and minimizing waste parts (packages) can be obtained.

  Further, even when an existing supply nozzle (precision nozzle) is used, an excessive adhesive can be supplied to the outside of the element with respect to the size of the extremely minute application region (electrode) of the element. Accordingly, it is possible to prevent the adhesives protruding from the application area on the mounting surface from coming into contact with each other, and to prevent the occurrence of defects such as a short circuit between the electrodes.

(A) It is a top view which shows the whole structure of the assembly apparatus which concerns on 1st Embodiment of this invention. (B) It is a front view of the element holding mechanism of the assembly apparatus which concerns on 1st Embodiment of this invention. (C) It is a side view of the element holding mechanism of the assembly apparatus which concerns on 1st Embodiment of this invention. It is a figure which shows operation | movement of the assembly apparatus which concerns on 1st Embodiment of this invention, (a) It is a top view which shows an element supply apparatus, (b) It is a front view of an element holding mechanism, (c), (d 2) A front view and a side view of the element holding mechanism, and FIG. 2E is a front view of the element holding mechanism. (A) It is a side view of the coating device which concerns on embodiment of this invention. (B), (c) It is a top view which shows the element with which the electroconductive adhesive material was apply | coated. It is a front view which shows the whole structure of the assembly apparatus which concerns on 2nd Embodiment of this invention. It is a side view which shows the whole structure of the assembly apparatus which concerns on 2nd Embodiment of this invention. It is a top view (top view) which shows the whole structure of the assembly apparatus which concerns on 2nd Embodiment of this invention. It is a figure which shows the structure of the attitude | position acquisition means of 2nd Embodiment of this invention. It is the schematic explaining the flow of the image signal etc. in the assembly apparatus of 2nd Embodiment of this invention. (A) It is the schematic which shows the image which imaged the element conveyed by the mounting area. (B) It is the schematic which shows the image which imaged the mounting member waiting in a mounting area. It is a top view explaining operation | movement of the assembly apparatus of 2nd Embodiment of this invention. It is a side view which shows the coating device of 3rd Embodiment of this invention. It is a figure explaining 4th Embodiment of this invention, (a) It is a top view which shows the supply method of the general adhesive material by a supply nozzle, (b) The general supply method of the adhesive material by a supply nozzle is shown. FIG. (A) It is a top view which shows the supply method of the general adhesive material by 4th Embodiment of this invention, (b), (c) It is a side view. It is a side view which shows the supply method of the adhesive material by the supply nozzle of 4th Embodiment of this invention. It is a side view explaining the supply method of the adhesive material by a supply needle and a supply nozzle. It is a sectional side view which shows the supply nozzle of 4th Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following example, an assembly apparatus for manufacturing a crystal resonator by mounting an element (crystal piece) on a mounting member (package) will be described.

  <First Embodiment>

  First, the overall configuration of the assembling apparatus 1 according to the first embodiment of the present invention will be described with reference to FIG. Fig.1 (a) is a top view which shows the principal part of an assembly apparatus. FIG. 1B is a front view of a part of the element supply device 2 as viewed from the Y direction (the lower side of FIG. 1A), and FIG. It is the side view seen from a direction (Drawing 1 (a) left side). Note that in each drawing, a part of the configuration is omitted as appropriate to simplify the drawing.

  As shown in FIG. 1, the assembling apparatus 1 includes an element supply device 2 that supplies an element (here, a crystal piece) 10 of an electronic component (here, a crystal resonator), a conveyance device 3 that conveys the electronic component, and the like. A mounting member supply device 5 for supplying a mounting member (here, a box-shaped ceramic package having an open top) 20, a coating device 6 for applying (supplying) the conductive adhesive N to the element 10, and a mounting member The apparatus includes an attitude information acquisition unit 11 that acquires 20 attitude information, an analysis unit 12, and a position adjustment unit 13, and assembles an electronic component by mounting the element 10 on the mounting member 20. Further, although illustration and detailed description are omitted, the assembling apparatus 1 inspects the state of the central control apparatus that controls the entire assembling apparatus 1, the element 10 during and after assembly, the mounting member 20, and the electronic components after assembly. And a discarding means for discarding electronic components determined to be defective by the various inspection apparatuses.

  The element 10 of the present embodiment has a plane size of 1 mm square or less (1 mm or less × 1 mm or less), and the mounting member 20 has a mounting surface size of 1 mm square or less (1 mm or less × 1 mm or less).

  The mounting member supply device 5 takes out the mounting members 20 one by one from the mounting member tray 51 on which the plurality of mounting members 20 before mounting are arranged, and supplies the mounting members 20 to the transport device 3. The mounting member 20 is transferred from the mounting member supply device 5 to the transport device 3 by a transport arm 51A that moves into and out of the transport device 3 (moves in the Y direction in FIG. 1A). Further, the present invention is not limited to this example, and the image recognition is performed from the supply table in which the mounting member 20 is supplied using the alignment tray in which the mounting members 20 are arranged and arranged freely on the table. Thus, the structure may be such that the individual mounting members 20 are picked up.

  The transport device 3 includes a disk-shaped rotary table (turret) 31 that rotates about a vertical axis (axis in the Z direction in FIG. 1), and a component holding mechanism 32 that is disposed on the outer periphery of the rotary table 31 in the circumferential direction. On the rotary table 31, along the circumferential direction, a supply region 311 to which the mounting member 20 is supplied, a posture information acquisition region 312 for acquiring the posture information of the mounting member 20, and a mounting for mounting the element 10 on the mounting member 20. A (mounting) region 313 and a collection region 314 for collecting the assembled electronic components (element 10 and mounting member 20) are set, and mounting is performed by supplying one by one from the mounting member supply device 5 in the supply region 311. The member 20 is transported to the mounting area 313, the element 10 is mounted on the mounting member 20 in the mounting area 313, and the assembled electronic component is recovered in the recovery area 314.

  The component holding mechanism 32 has a suction nozzle (not shown), for example, and a negative pressure generation hole 321 is formed at the tip of the suction nozzle. The suction nozzle is a negative pressure applied to the negative pressure generation hole 321. The mounting member 20 supplied from the mounting member supply device 5 is sucked and held in the supply region 311 by the pressure. The rotary table 31 is rotatable by a motor (not shown), and thereby, the component holding mechanism 32 disposed on the rotary table 31 can be rotated and moved. In the present embodiment, sixteen component holding mechanisms 32 are arranged in the circumferential direction with respect to the rotary table 31, but it is preferable to provide at least three or more. More desirably, five or more are provided.

  In the present embodiment, the turret mechanism using the rotary table 31 is exemplified as the structure of the transport device 3, but the present invention is not limited to this, and for example, a linear motion mechanism that reciprocates on a linear motion rail is used. You may do it.

  The posture information acquisition unit 11 is a camera arranged on the conveyance path of the mounting member 20 and above the posture information acquisition region 312 in the Z direction, and images the mounting member 20 before mounting. Based on the imaging result of the posture information acquisition means (camera) 11, the analysis unit 12 includes a mounting member 20 transported by the transport device 3 and an element held by the element holding mechanism 21 to be mounted on the mounting member 20. 10 is derived. Further, the position adjustment unit 13 adjusts the position of the element 10 held by the element holding mechanism 21 based on the derivation result of the analysis unit 12.

  The element supply device 2 includes an element holding mechanism 21 and an element holding mechanism driving unit 24. The element supply device 2 takes out (picks up) the element 10 from an element tray 22 on which a plurality of elements 10 before mounting are arranged, and mounts the element. It is supplied above the mounting member 20 conveyed to the region 313, and the mounting member 20 and the element 10 are bonded.

  The element holding mechanism driving unit 24 holds the element holding mechanism 21 so as to be movable in the vertical axis direction (Z direction) and the horizontal axis direction (X, Y direction) as shown in FIGS. . The element holding mechanism 21 is rotatable around a rotation axis R extending in the X direction and rotated around the vertical axis (in the θ direction), as shown in FIG. A camera 26 that can move in the X, Y, and Z directions together with the nozzle 25 is provided. The suction nozzle 25 and the camera 26 are also driven by the element holding mechanism driving unit 24.

  The coating device 6 is arranged in the vicinity of the mounting area 313 of the rotary table 31 along the movement path of the element holding mechanism 21, and a conductive adhesive (for example, silver paste) is applied to the element 10 held by the element holding mechanism 21. Apply directly.

  FIG. 2 is a diagram showing the operation of the element supply device 2. FIG. 2A is a top view of the entire element supply device 2. In FIG. Indicates the position. 2B is a front view of the element holding mechanism 21 in the first region 201 as viewed from the Y direction on the lower side of FIG. 2A, and the left diagram in FIG. 2C is the second region 202. 2 is a side view of the element holding mechanism 21 and the fixed camera 23 as viewed from the X direction on the left side of FIG. 2A, and the right side of FIG. 2C is from the Y direction on the lower side of FIG. 2A. It is the front view seen. FIG. 4D is a front view of the element holding mechanism 21 and the coating device 6 in the third region 203 as viewed from the Y direction on the lower side of FIG. 2A, and FIG. The figure is a side view as viewed from the X direction on the left side of FIG. FIG. 4E is a front view of the element holding mechanism 21 and the component holding mechanism 32 in the fourth region 204 as viewed from the Y direction on the lower side of FIG.

  As shown in FIG. 2A, the element supply device 2 includes an element holding area (first area) 201 for picking up the element 10 and an element for acquiring posture information of the element 10 along the movement path in the X direction. Posture information acquisition region (second region) 202, application region (third region) 203 for applying a conductive adhesive to element 10, and mounting (mounting) region (first) for mounting element 10 on mounting member 20 4 area) 204 is set. Note that the mounting area 204 in the element supply device 2 coincides with the mounting area 313 in the transport device 2.

  As shown in FIG. 2B, in the element holding area 201, the element holding mechanism driving unit 24 moves the element holding mechanism 21 in the horizontal direction (X and Y directions in FIG. The element 10 to be held is specified (left figure). Thereafter, the element holding mechanism 21 is slightly moved in the horizontal direction, and the suction nozzle 25 is disposed above the element 10 to be held. Further, the element holding mechanism driving unit 24 moves the suction nozzle 25 in the vertical direction (Z direction in FIG. 2A) and rotates it in the θ direction around the vertical axis so that the plurality of elements 10 before mounting are arranged. The elements 10 are taken out one by one from the element tray 22 (right figure).

  As shown in FIG. 5C, the element holding mechanism driving unit 24 moves the element holding mechanism 21 to the element posture information acquisition area (second area) 202 and moves the suction nozzle 25 in the vertical direction. Invert. That is, as shown by the broken line in the left figure of FIG. 9C, the suction nozzle 25 whose tip is directed downward in the vertical direction is rotated in the α direction around the rotation axis R so that the tip is directed upward in the vertical direction. Is inverted approximately 180 °.

  The element 10 is arranged on the element tray 22 so that the upper surface when mounted in the element holding region 201 in FIG. 5B is upward, and the element holding mechanism 21 moves the element 10 upward by the suction nozzle 25. Suck and hold from the top side (when mounted). In the element orientation information acquisition region 202 shown in FIG. 5C, the element 10 is held in a state where the lower surface side when the element 10 is mounted faces upward in the vertical direction.

  The fixed camera 23 is disposed in the element orientation information acquisition area 202, and the element holding mechanism driving unit 24 moves the element holding mechanism 21 to a position immediately below the fixed camera 23. Then, the attitude information of the element 10 is acquired by the fixed camera 23. Based on the orientation information of the element 10 and the orientation information of the mounting member 20 of the transport device 3, the relative displacement amount between them is derived, and the position of the element holding mechanism 21 is adjusted based on the derived result ((c) in the figure). ) Right figure).

  As shown in FIG. 4D, in the application region 203, the element holding mechanism driving unit 24 moves the element holding mechanism 21 and uses the camera 26 of the element holding mechanism 21 to apply the coating device 6 as in FIG. Is aligned with the supply nozzle 61 (left figure), and a conductive adhesive is applied to the element 10 by the coating device 6. Thereafter, the element holding mechanism driving unit 24 rotates the suction nozzle 25 in the β direction about the rotation axis R, and rotates the upper and lower sides of the element 10 again approximately 180 ° (right diagram).

  As shown in FIG. 5E, in the mounting area 204, the element holding mechanism driving unit 24 moves the element holding mechanism 21, and performs alignment with the mounting member 20 held by the component holding mechanism 32 by the camera 26. (Left figure) The suction nozzle 25 is moved up, down, left and right, and the mounting member 20 and the element 10 are bonded and mounted (right figure).

  Various moving structures of the element holding mechanism 21 (suction nozzle 25) can be adopted. For example, the vertical and horizontal directions can be moved by an air cylinder or the like, and the rotation direction can be a motor or the like. it can. In addition, for example, a ball screw mechanism or a rack and pinion mechanism using a screw shaft and a nut may be used in the vertical and horizontal directions.

  With reference to FIG. 3, the application | coating apparatus 6 and the application position of the conductive adhesive N are demonstrated. 3A is a side view showing the main part of the coating apparatus 6, and FIGS. 3B and 3C are bottom views of the element 10 showing the application position of the conductive adhesive N. FIG.

  The coating device 6 is a dispenser provided with a supply nozzle 61 capable of supplying a predetermined amount of conductive adhesive N, and directly applies the conductive adhesive N from above the element 10 to the lower surface side when the element 10 is mounted. . The coating device 6 aligns the two electrodes 11 and 12 formed on the element 10 with the supply nozzle 61, and lowers the supply nozzle 61 to apply (supply) the conductive adhesive N to the element 10. To do. In the present embodiment, the coating apparatus 6 is fixed, and the suction nozzle 25 that holds the element 10 is moved in the X direction, the Y direction, and the Z direction (and the θ direction) by the element holding mechanism driving unit 24 to apply the coating apparatus. 6, the coating device 6 (supply nozzle 61) can be moved in the X direction, Y direction, and Z direction (and θ direction) as indicated by broken arrows by the driving means. Good.

  As shown in FIGS. 2B and 2C, the element 10 of this embodiment is a crystal piece constituting a crystal resonator, and electrodes 11 and 12 made of a thin film metal layer are formed on the surface thereof. The electrodes 11 and 12 are formed at both ends of one side of the element (crystal piece) 10 as shown in FIG. 5B, and the electrodes (crystal pieces) 10 are opposed to each other as shown in FIG. In some cases, one is formed at each of the substantially central portions of the two sides. The conductive adhesive N is applied to each of the two electrodes 11 and 12 at one place. The two-dot chain line indicates the mounting member 20.

  <Operation of assembly equipment>

  Next, the operation of the assembling apparatus 1 will be described with reference to FIGS. 1 to 3 again.

  First, the mounting member supply device 5 takes out the mounting members 20 one by one from the mounting member tray 51 (see FIG. 1) on which the plurality of mounting members 20 before mounting are arranged by the transport arm 51A. The components are supplied to the component holding mechanism 32 in the supply region 311. The mounting member 20 of the present embodiment is a box-like body having an upper opening, and is supplied to the component holding mechanism 32 so that the opening is on the upper side. The component holding mechanism 32 sucks and holds the mounting member 20 through the suction holes 321.

  As the turntable 31 rotates, the mounting member 20 held by the component holding mechanism 32 is rotated and conveyed here counterclockwise. The mounting member 20 is imaged by the camera 11 in a posture information acquisition area (hereinafter, imaging area) 312. The imaging result is transmitted to the analysis unit 12 as the posture and position information of the mounting member 20.

  A plurality of elements 10 are arranged on the element tray 22 so that the upper surface when mounted is upward. The element holding mechanism driving unit 24 of the element supply device 2 moves the element holding mechanism 21 (suction nozzle 25) to the element holding area 201 (FIG. 2A), aligns it with the camera 26, and moves the element 10 above the element 10. Then, the element 10 is picked up (FIG. 2B).

  Thereafter, the element holding mechanism driving unit 24 moves the element holding mechanism 21 (suction nozzle 25) to the element posture information acquisition region 202 while inverting the suction nozzle 25 upside down (FIG. 2A), and the fixed camera 23 is moved. To obtain the orientation information of the element 10 (FIG. 2C). The attitude information 10 of the element 10 is transmitted to the analysis unit 12 (see FIG. 1A), and a relative positional deviation amount with respect to the corresponding mounting member 20 is derived. Based on the derivation result, the position adjustment unit 13 controls the element holding mechanism driving unit 24 and moves the suction nozzle 25 in the X, Y, Z, and θ directions to adjust the position and posture of the element 10.

  Thereafter, the element holding mechanism driving unit 24 moves the element holding mechanism 21 (suction nozzle 25) to the application region 203 (FIG. 2A). In the coating region 203, the electrode 26 of the element 10 and the coating device 6 (supply nozzle 61) are aligned by the camera 26 of the element holding mechanism 21, and the element 10 is brought close to the supply nozzle 61 to bring the element 10 close thereto. A conductive adhesive N is applied (supplied) to the electrode 11 (FIGS. 2D and 3). Subsequently, the electrode 12 of the element 10 and the supply nozzle 61 are aligned, and the conductive adhesive N is applied (supplied) to the electrode 12 of the element 10.

  When the conductive adhesive N is applied, the element holding mechanism driving unit 24 further moves the element holding mechanism 21 in the X direction ((right side in the X direction in FIG. 2A). Also, the element holding mechanism driving unit. 24, the suction nozzle 25 is turned upside down again before entering the mounting area 204. More specifically, the suction nozzle 25 is rotated in the β direction as shown in the right of FIG. The application amount detection unit 120 detects the application amount of the conductive adhesive N at the rotated position (position indicated by the broken line in FIG. 2D) (see FIG. 2A). If the amount is abnormal, it is discarded as a defective element, and if the amount applied is normal, the suction nozzle 25 is further rotated by approximately 90 ° in the β direction. The element 10 held by is inverted upside down. That is, below the coating device 6, the element 10 held by the suction nozzle 25 so that the lower surface at the time of mounting is above the upper surface at the time of mounting before entering the mounting region 204. Is held by the suction nozzle 25.

  Thereafter, the element holding mechanism driving unit 24 moves the element holding mechanism 21 (suction nozzle 25) to the mounting area 204 (FIG. 2A). In the mounting area 204 (mounting area 313), the mounting member 20 transported by the transport device 3 is on standby. The element holding mechanism drive unit 24 photographs the position of the mounting member 20 with the camera 26, adjusts the position with the position adjustment unit 13 as necessary, and moves the suction nozzle 25 to accommodate the element 10 in the mounting member 20. At the same time, the element 10 is bonded to the inner bottom surface of the mounting member 20 and mounted (FIGS. 1A and 2E).

  The component holding mechanism 32 conveys the bonded mounting member 20 and the element 10 (electronic component) to the collection region 314, and the electronic component (quartz crystal unit) is collected in the collection region 314 (see FIG. 1A). .

  Thus, the above operation is repeated, and the assembling apparatus 1 assembles the crystal resonator with high accuracy. That is, in the method of assembling electronic components by the assembly apparatus 1 described above, the elements 10 arranged on the element tray 22 with the upper surface side at the time of mounting are taken out one by one by the element holding mechanism 21 from the upper side, The conductive adhesive N is directly applied to the lower surface side when the element 10 is mounted by the coating device 6 by reversing the upper and lower sides of the element 10, the element 10 and the mounting member 20 are aligned, and the upper and lower sides of the element 10 are inverted. The quartz resonator is assembled with high accuracy by being housed and bonded to the mounting member 20 that is rotated and conveyed.

  According to such a configuration, since the conductive adhesive N is directly applied to the element 10 and does not need to be supplied to the mounting member (package) 20, the element 10 and the mounting member 20 are minimized. However, there is no possibility that the suction nozzle 61 of the coating device 6 (dispenser) contacts the inner wall of the mounting member 20, and it is possible to suppress deviations in supply position and supply amount (application amount) due to supply to the mounting member 20. Thereby, even if the element 10 is extremely small, a short circuit between the electrodes 11 and 12 can be prevented, and an increase in defective elements can be avoided.

  Further, since the conductive adhesive N is directly applied to the element 10, high-precision control of the application amount according to the shape error of the mounting member 20 becomes unnecessary.

  In addition, the coating device 6 is disposed in the vicinity of the mounting region 313 of the transport device 1 and immediately after the conductive adhesive N is applied to the element 10, the mounting member 20 is mounted on the mounting region 313. It is possible to shorten the time until the bonding to the substrate, and to avoid the problem that the conductive adhesive N is dried before the element 10 is fixed.

  In addition, by providing an imaging region between the supply region 311 and the mounting region 313 of the transport device 1, the orientation of the mounting member 20 is imaged in the imaging region 312, and alignment with an element waiting in the mounting region 313 is performed. Can do. That is, in the mounting region 313, the alignment of the element 10 and the mounting member 20 is completed (because the time required for alignment in the mounting region 313 can be shortened), and the conductive adhesive N is applied to the element 10 in the coating device 6. It is possible to adhere to the mounting member 20 in a short time after the coating. Thereby, even if the electroconductive adhesive material N supplied to the element 10 is very small, it can be adhered to the mounting member 20 while being prevented from drying.

  Further, during the assembly process, the element 10 before the conductive adhesive N is applied by the coating device 6 and mounted on the mounting member 20 is held by the suction nozzle 25 of the element holding mechanism 21. Therefore, even when the line is stopped for a long time during the assembly process, it is possible to minimize the number of discarded elements due to drying of the applied conductive adhesive (for example, one).

  Moreover, since the element holding mechanism 20 can be retrofitted in the assembling apparatus 1 of the first embodiment, the conventional assembling apparatus (an assembling apparatus for bonding an element by supplying a conductive adhesive to a mounting member) is improved. Thus, it is possible to realize an assembling apparatus corresponding to an extremely small element at a relatively low cost.

  <Second Embodiment>

  Next, a second embodiment of the present invention will be described with reference to FIGS.

  FIG. 4 is a front view of the assembling apparatus 101. FIG. 5 is a left side view of the assembling apparatus 101. FIG. 6 is a plan view (top view) of the assembly apparatus 101. Note that in each drawing, a part of the configuration is omitted as appropriate to simplify the drawing. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 4, the assembling apparatus 101 includes a base 102, an element supply device 110 disposed on the upper surface of the base 102 (left side of the upper surface in FIG. 4), and a swingable arrangement on the base 102. Arm 120, rotary table 130 rotatably disposed on arm 120, and a plurality of (four in the present embodiment) element holding units disposed on the outer peripheral surface of rotary table 130 along the circumferential direction. 140, the coating unit 116, the two external urging devices 150 disposed on the arm 120, the rotating table driving means 160 for rotating the rotating table 130, and the posture information disposed on the right side of the upper surface of the base 102. An acquisition unit 180, a central controller 190 that controls the entire assembly apparatus 101, a mounting member supply apparatus 170 disposed on the upper surface of the base 102 (on the right side of the upper surface in FIG. 4), and an assembly inspection apparatus (not shown) , And a.

  The base 102 is a substantially rectangular parallelepiped member. Inside the base 102, a central control device 190, a power supply device (not shown) and the like are arranged. A column member 102a is disposed at the back end of the upper surface of the base 102, and an arm bracket 102b for movably supporting the arm 120 is disposed at the upper end of the column member 102a. Yes.

  In the present embodiment, an element supply region 103 for supplying the element 10 from the element supply device 110 to the element holding unit 140 is set in a part of the upper surface of the base 102 (the upper left portion in FIG. 4). In addition, an application region 104 for applying a conductive adhesive to the element 10 is set on a part of the upper surface of the base 102 (the central portion of the upper surface in FIG. 4). Then, the element 10 held by the element holding unit 140 is housed and bonded to a part of the upper surface of the base 102 (the right side of the upper surface in FIG. 4) in the mounting member 20 mounted on the mounting member supply device 170. A mounting (mounting) area 105 is set. In addition, the posture information acquisition area 106 in which the posture information acquisition unit 180 is disposed is set in a part of the mounting area 105. Further, a disposal area 135 for discarding rejected products to the disposal tray 135 is set in the central back side portion (oscillating means 180 side) of the upper surface of the base 102 (see FIG. 5).

  The element supply device 110 arranges a plurality of elements 10. The elements 10 may be arranged at random in their posture, or a plurality of elements 10 may be arranged in a matrix with their postures adjusted. Specifically, the element supply device 110 includes a placement tray 115 on which the element 10 is placed, a placement tray moving unit 119 composed of an XY table, and a camera (CMOS camera) used to position the element 10. Or a CCD camera) 117. A plurality of elements 10 are placed on the placement tray 115. Although not shown, the loading tray moving unit 119 is configured by combining linear motion devices driven by a motor at right angles to each other. The mounting tray moving means 119 in the present embodiment can move the mounting tray 115 in the vertical direction and the horizontal direction (vertical direction (X direction) and horizontal direction (Y direction) in FIG. 5). The loading tray moving unit 119 sequentially arranges the elements 10 one by one so as to correspond to the position immediately below the suction nozzle 142 of the element holding unit 140 in the element supply area 103 based on the imaging result of the element 10 by the camera 117. Deploy.

  The arm 120 is an arm-like member extending from the arm bracket 102b toward the front of the element supply device 110. A rotary table 130 is rotatably held on the arm 120, and an external urging device 150 and a rotary table driving unit 160 are disposed. The external biasing device 150 is provided above each corresponding to the element supply region 103 and the mounting region 105 side.

  The turntable 130 is a substantially disk-shaped member, and four element holding units 140 are arranged on the outer peripheral surface at equal intervals (approximately 90 ° intervals in the present embodiment). The rotary table 130 is held by the arm 120 so that the rotation axis is in the vertical direction (vertical direction) at the illustrated operating position. Then, the turntable 130 rotates in one direction, clockwise or counterclockwise, and all the element holding units 140 are arranged in the element supply area 103, the application area 104, the mounting area 105 (attitude information acquisition area 106), and the disposal area. It is comprised so that the upper part of 135 may be passed in order. In this example, when any one of the element holding units 140 is in a position facing the element supply area 103, the other three element holding units 140 are placed in the mounting area 105 (attitude information acquisition area 106) and the disposal area 135. It is comprised so that it may exist in the position which opposes (refer FIG. 6).

  The element holding unit 140 has a suction nozzle 142 and takes out (pick up) and holds the elements 10 on the element supply device 110 one by one. Further, the element holding unit 140 includes a nozzle rotation unit (not shown), and the suction nozzle 142 is arranged so that the tip of the suction nozzle 142 is turned upside down around the horizontal axis by the nozzle rotation unit (the α direction or the α direction in FIG. 4). The element 10 can be turned upside down and can be turned upside down. Further, the suction nozzle 142 is rotatable around the vertical axis (in the θ direction in FIG. 4 or in the opposite direction to the θ direction), and the posture of the element 10 can be adjusted.

  The element holding unit 140 that sucks and holds the element 10 rotates around the vertical axis as the rotary table 130 rotates around the vertical axis (see FIG. 6). In addition, the element holding unit 140 rotates the suction nozzle 142 around the horizontal axis so that the vertical direction is reversed with the rotation around the vertical axis. As the moving structure of the suction nozzle 142, for example, a motor or the like can be used.

  Here, the element 10 is arranged in the element supply device 110 so that the upper surface when mounted is upward. In other words, the element holding unit 140 sucks and holds the element 10 from the upper side (the upper surface side at the time of mounting) at the tip of the suction nozzle 142 in the element supply region 103, and the element holding unit 140 itself rotates while rotating around the vertical axis. In the region 104, the suction nozzle 142 is rotated by approximately 180 ° so that the tip (element 10) of the suction nozzle 142 is positioned above the vertical direction. In this example, as indicated by a broken line in FIG. 4, the rotation (upside down) of the suction nozzle 142 is completed before reaching the application region 104, and the image of the element 10 is captured by the camera 118 positioned above. The posture is acquired and the alignment in the application region 104 is completed.

  The element holding unit 140 continues to rotate about the vertical axis, and in the mounting area 105, the suction nozzle 142 is turned upside down so that the tip (element) of the suction nozzle 142 is positioned below the vertical direction. The mounting member 20 moves to the waiting area 103 where the mounting member 20 stands by with its tip directed downward.

  The coating unit (coating apparatus) 116 is a dispenser (see FIG. 3) that can move the supply nozzle 156 similar to that of the first embodiment up and down in the vertical direction, and is disposed between the element supply region 103 and the mounting region 105. Then, a conductive adhesive (for example, silver paste) is applied (supplied) to the element 10 held and transported by the element holding unit 140. Specifically, in the application region 104, the supply nozzle 156 is lowered with respect to the element 10 in which the lower surface of the element 10 at the time of mounting is positioned upward by the suction nozzle 142 that is turned upside down. A predetermined amount of conductive adhesive is applied to a predetermined position (on the electrodes 11 and 12).

  One of the two external urging devices 150 is disposed above the element supply region 103. The other external biasing device 150 is disposed above the mounting area 105. One external urging device 150 applies an external force to the element holding unit 140 located on the element supply area 103, and causes the suction nozzle 142 of the element holding unit 140 to move closer to the element supply area 103 (downward). Move. The other external urging device 150 applies an external force to the element holding unit 140 located on the mounting area 105 to move the suction nozzle 142 of the element holding unit 140 in a direction (downward) close to the mounting area 105.

  The rotary table driving means 160 is fixed to the lower surface of the arm 120 and is positioned between the arm 120 and the rotary table 130. In the present embodiment, the rotary table driving means 160 is a hollow DD (direct drive) motor composed of a stator fixed to the arm 120 and a cylindrical rotor that rotates on the outer periphery of the stator. A through hole is formed in the axial direction in the center of the stator. The rotary table 130 is fixed to the rotor in a state where a hollow shaft (not shown) is inserted into the through hole.

  In addition, it is good also as a structure which arrange | positions a camera below the application | coating area | region 104 and the mounting area | region 105, and detects the application quantity of a conductive adhesive.

  The posture information acquisition means 180 is composed of a camera (such as a CMOS camera or a CCD camera) not shown here, and is arranged in the posture information acquisition region 106 (a part of the mounting region 105). The camera images the element 10 held by the suction nozzle 142 of the element holding unit 140 located in the posture information acquisition area 106 from directly below, and images the mounted component 20 supplied to the mounting area 105 and waiting from above. To do. In other words, the camera waits for the element 10 being transported toward the mounting area 105, images the element 10 from below, and acquires tilt information regarding the horizontal plane of the element 10 as image information. In addition, the camera images the mounting member 20 waiting in the mounting area 105 from above, and acquires tilt information regarding the horizontal surface of the mounting member 20 as image information. The camera is electrically connected to the central controller 190 and transmits image information obtained by imaging to the central controller 190. And based on the image information of the attitude | position acquired with the camera, the height of the internal bottom face of the mounting member 20 which adhere | attaches the element 10 is detected, and the attitude | position (position, height) and / or mounting member of the element 10 according to it. 20 postures (position, height) are corrected.

  The central control device 190 is a control device including a CPU, a ROM, a RAM, and the like, and includes an element supply device 110, an external urging device 150, a rotary table drive means 160, an attitude information acquisition means 180, a mounting member supply device 170, and the like. Control directly. The central control device 190 also functions as an analysis unit that derives a relative displacement amount G between the mounting member 20 and the element 10 by comparing the imaging results of the posture information acquisition means (camera) 180.

  The mounting member supply device 170 includes an alignment tray 121 having a plurality of recesses arranged in a matrix on the upper surface, and an alignment tray moving means 117 configured by an XY table. The mounting member 20 before assembly is placed in the recess of the alignment tray 121. Although not shown, the alignment tray moving means 117 is configured by combining linear motion devices driven by a motor at right angles to each other. The alignment tray moving means 117 in the present embodiment can move the alignment tray 101 in the vertical direction and the horizontal direction in FIG.

  The alignment tray moving means 117 sequentially turns the plurality of mounting members 20 one by one before the elements 10 are conveyed so as to correspond to the position immediately below the suction nozzle 42 of the element holding unit 140 in the mounting area 105. To the mounting area 105. The alignment tray moving unit 117 functions as a position adjustment unit that adjusts the position of the mounting member 20 based on the relative displacement amount G derived by the central controller 190. In the mounting area 105, the element 10 attracted and held by the element holding unit 140 is bonded to the mounting member 20 while being housed. By repeating this operation, the elements 10 are mounted on all the mounting members 20 placed in the recesses of the alignment tray 121. When the assembly of all the mounting members 20 is completed, the alignment tray 121 is carried to the next process.

  The posture information acquisition unit 180 will be further described with reference to FIGS. FIG. 7 is a diagram illustrating the configuration of the posture information acquisition unit 180, and FIG. 8 is a schematic diagram illustrating the flow of image signals and the like in the assembling apparatus 101. FIG. 9A is a schematic diagram illustrating an image obtained by capturing the element 10 transported to the mounting area 105. FIG. 4B is a schematic diagram showing an image obtained by capturing the mounting member 20 waiting in the mounting area 105. In FIG. 8, the drawing is simplified and the mounting member 20 is shown in a rectangular parallelepiped shape. However, in actuality, the mounting member 20 is a box-shaped package having an upper opening.

  As shown in FIG. 7, the posture information acquisition unit 180 includes two cameras 180 (a camera 181 for a mounting member and a camera 182 for an element) and a light guide unit 183 in this embodiment, and includes posture information. It is arranged in the acquisition area 106 (a part of the mounting area 105). (The mounting member camera 181 and the element camera 182 are a CMOS camera, a CCD camera, or the like, respectively.

  The camera 181 images the mounting member 20 supplied to the mounting region 105 from directly above the light guide unit 183 before the element 10 is conveyed. That is, the camera 181 images the mounting member 20 supplied to the mounting area 105, and acquires position information regarding the horizontal direction of the mounting member 20 as image information. The camera 181 is electrically connected to the central controller 190 and transmits image information obtained by imaging to the central controller 190.

  The camera 182 images the element 10 that has been adjusted in posture by the nozzle rotation unit in the posture information acquisition region 106 and then transferred to the mounting region 105 from directly below via the light guide unit 183. That is, the camera 182 images the element 10 transported to the mounting area 105 and acquires position information regarding the horizontal direction of the element 10 as image information. The camera 182 is electrically connected to the central controller 190 and transmits image information obtained by imaging to the central controller 190. The central controller 190 derives the relative displacement G between the mounting member 20 and the element 10 based on the imaging results of the cameras 181 and 182. Specifically, as illustrated in FIG. 9A, the camera 182 obtains an imaging result in which the element 10 is located in, for example, the upper left region, and as illustrated in FIG. 9B, the camera 181 Thus, it is assumed that an imaging result in which the mounting member 20 is located, for example, in the lower right region is obtained. In this case, the relative positional deviation amount is derived as the amount indicated by the arrow G connecting the lower right region to the upper left region. The central control device 190 operates the alignment tray moving means (position adjustment unit) 117 based on the relative displacement amount G, so that the position of the mounting member 20 in the horizontal plane becomes the same as the position of the element 10 in the horizontal plane. As described above, the horizontal position of the mounting member 20 is adjusted.

  Although the case where only the positional deviation amount G in the XY plane direction is derived is shown here, it is also possible to derive the rotational deviation amount. In this case, before deriving the positional deviation amount G in the XY plane direction, images are once taken by the upper and lower cameras 181 and 182, and the rotational deviation amount is analyzed by the central control unit 190. The suction nozzle 142 is rotated so as to approach zero, and the angle of the element 10 is adjusted. Thereafter, the holding posture of the element 10 is imaged again, the positional deviation amount G in the XY plane direction is derived, and the horizontal position of the mounting member 20 is adjusted so that it approaches zero. This is because when the element 10 is held in an eccentric state with respect to the suction nozzle 142, the element 10 is displaced in the XY plane direction when positioning in the rotation direction is performed.

  The light guide unit 183 includes a mounting member side optical path (not shown) that guides the light from the lower daylighting unit 183a to the camera 181 and causes the camera 181 to image the mounting member 20, and guides the mounting member 20 from the upper daylighting unit 183b to the camera 182. An element side optical path (not shown) is provided to cause the camera 182 to image the element 10. The light guide unit 183 is a box-type unit incorporating a plurality of optical systems (optical paths) such as a mirror, a lens, and a prism, and has a size of about 10 mm square. The light guide unit 183 is driven by an advancing / retreating unit (not shown), and the lower daylighting unit 183a and the upper daylighting unit 183b are moved forward and backward to the mounting area 105 as necessary. The advancing / retreating unit causes the lower daylighting unit 183a to enter just above the mounting member 20 waiting in the mounting area 105 before the camera 181 images the mounting member 20 (see FIG. 8). Further, the advance / retreat unit causes the upper daylighting unit 183b to enter between the element 10 and the mounting member 20 waiting in the mounting area 105 before the camera 182 images the element 10 (see FIG. 8). The order of reaching the mounting area 105 is such that the light guide unit 183 is caused to enter the mounting area 105 by the advancing / retreating unit after the mounting member 20 is waited in the mounting area 105 or simultaneously with the standby operation. The element 10 is transferred to the mounting area 105.

  Thereby, when the camera 181 images the mounting member 20, the light guide unit 183 has the lower daylighting unit 183 a disposed immediately above the mounting member 20 that stands by in the mounting area 105, and directly above the mounting member 20. Enables imaging from. Further, when the camera 182 images the element 10, the light guide unit 183 has the upper daylighting unit 183 b disposed between the mounting member 20 that stands by in the mounting area 105 and the element 10 that is transported to the mounting area 105. This enables imaging from directly below the element 10. In addition, it is preferable that the light guide unit 183 has a small thickness t at a portion disposed between the element 10 and the mounting member 20 and a stroke at the time of assembly. For this reason, the thickness t of the corresponding portion of the light guide unit 183 is preferably 10 mm or less, and more preferably 8 mm or less. The thickness t has a limit in reducing the thickness because it has a built-in optical system, and can be reduced to 8 mm at the present time.

  7A and 7B, the two cameras 181 and 182 are arranged sideways, but depending on the mode of the assembling apparatus 101, the position information acquisition means 180 shown in FIG. ), The two cameras 181 and 182 may be arranged in one vertical direction.

  <Operation of assembly equipment>

  Next, the operation of the assembling apparatus 101 according to the second embodiment will be described. FIG. 10A to FIG. 10F are plan views showing the operation of the assembling apparatus 101. For ease of explanation, the element holding units 140A to 140D are numbered to the four element holding units 140, and the operation of the element holding unit 140A will be mainly described. Since the other element holding units 140B to 140D operate in the same manner as the element holding unit 140A, description thereof is omitted.

  First, as shown in FIG. 10A, the element supply device 110 arranges a plurality of elements 10 in a state in which the direction and posture are adjusted.

  After the plurality of elements 10 are arranged in the element supply region 103 by the element supply device 110 (or substantially simultaneously), the rotary table 130 is rotated approximately 90 ° counterclockwise, and the suction nozzle 142 of the element holding unit 140A is moved. The element 10 is moved to a position facing the element 10 arranged in the element supply region 103 (see FIG. 10B).

  The rotary table 130 is stationary for a predetermined time in the state shown in FIG. While the turntable 130 is stationary, the external urging device 150 presses the element holding unit 140 </ b> A to bring the suction nozzle 142 close to the element 10 disposed in the element supply region 103. The suction nozzle 142 sucks and holds the element 10. Thereafter, the suction nozzle 142 is lifted by releasing the pressing by the external biasing device 150 (or loosening the pressing force).

  Next, as shown in FIG. 3C, the rotary table 130 rotates counterclockwise again. While the turntable 130 is rotating, the element holding unit 140A rotates the suction nozzle 142 around the horizontal axis, and reverses the tip of the suction nozzle 142 and the top and bottom of the element 10 held there. Then, after the upside down of the suction nozzle 142 is completed, the camera 118 recognizes an image of the state (posture) of the element 10.

  During this time, the camera 181 recognizes an image of the state of the mounting member 20 waiting in the mounting area 105 (attitude information acquisition area 106). Note that the image recognition by the camera 181 may be completed before the element 10 arrives at the mounting area 105, and is not limited to this timing. Further, the entry of the light guide unit 183 into the mounting area 105 is completed before the image recognition by the camera 181.

  As shown in FIG. 4D, the turntable 130 further rotates counterclockwise, and when the element holding unit 140A rotates approximately 90 ° from the position shown in FIG. 4B, the element 10 held by the element holding unit 140A. Is conveyed to the application area 106. Even at this position, the element holding unit 140A holds the suction nozzle 142 so that the tip (element 10) of the suction nozzle 142 is positioned upward in the vertical direction. The element 10 held by the suction nozzle 142 is turned upside down from the state in which the upper surface at the time of mounting faces upward ((b) in the same figure) to the state in which the lower surface at the time of mounting faces upward. Retained. That is, the element 10 is held from below (the upper surface side when mounted). And in this state, it rests for a predetermined time again.

  While the rotary table 30 is stopped, the nozzle rotating unit (not shown) of the element holding unit 140A moves the suction nozzle 142 of the element holding unit 140A by an appropriate angle θ based on the image information captured by the camera 118. The element 10 held in the suction nozzle 142 is adjusted by rotating in the direction.

  While the turntable 130 is stationary, the coating unit 116 lowers the supply nozzle 156 from above the element 10 and conductively adheres to a predetermined region of the element 10 (on the electrodes 11 and 12 (see FIG. 3)). Apply (supply) the material.

  Note that, after application of the conductive adhesive N, the application amount detection unit (not shown) detects the application amount of the conductive adhesive N. If there is an abnormality in the coating amount, it is further rotated, for example, approximately 180 ° counterclockwise without being mounted on the mounting member 20, and the element 10 having the abnormality is discharged to the waste tray 135 (FIG. 10). (Refer to (f)).

  While the turntable 30 is rotating, the element supply device 110 arranges the next element 10 at an appropriate location in the element supply region 103 (just below the suction nozzle 42 of the element holding unit 140B) as described above. To do. While the rotary table 130 is stationary, the suction nozzle 142 of the element holding unit 140B located at a position facing the element supply area 103 sucks the element 10 arranged in the element supply area 103 as described above. And hold.

  After the application of the conductive adhesive N, the turntable 130 rotates approximately 90 ° counterclockwise and then stops again for a predetermined time (see FIG. 10E). As a result, the element 10 held by the element holding unit 140 </ b> A arrives at the mounting area 105. Further, while the turntable 130 is rotating, the element holding unit 140A rotates the suction nozzle 142 approximately 180 ° (upside down) around the horizontal axis. As a result, the element 10 is again held upside down, that is, held by the suction nozzle 142 so that the upper surface when mounted is upward.

  While the rotary table 130 is stationary, the state of the element 10 conveyed to the posture information acquisition region 106 by the camera 182 is recognized as an image. The light guide unit 183 retracts promptly after image capturing by the camera 182. The result of image recognition by the camera 182 is compared with the result of image recognition by the camera 181 in the central controller 190, and the relative displacement G between the mounting member 20 and the element 10 is derived. Based on the relative displacement amount G, the alignment tray moving unit 117 of the mounting member supply apparatus 170 moves the mounting member 20 in the XY direction to perform position correction. Thereafter, the external urging device 50 presses the element holding unit 140A. As a result, the suction nozzle 142 of the element holding unit 140A is lowered, and the element 10 is housed in the mounting member 20 waiting in the mounting region 105 and bonded to assemble an electronic component (quartz crystal resonator).

  In addition, after mounting the element 10 on the mounting member 20 as described above, it is preferable that the assembly state of the element 10 and the mounting member 20 is photographed by an unillustrated assembly inspection apparatus to determine whether the assembly state is good or bad. That is, when it is determined that the assembled state is defective due to misalignment or the like based on the image information of the element 10 and the mounting member 20 photographed by the assembly inspection apparatus, the element holding unit 140A standing by in the mounting area 105 By 142, the element 10 determined to be defective and the mounting member 20 are sucked. Then, the turntable 130 further rotates approximately 90 ° counterclockwise, and the element 10 and the mounting member 20 determined to be defective are discharged to the waste tray 135 (see FIG. 10F).

  Note that the elements 10 that are determined to be unable to be controlled in attitude or position based on the image information captured by the attitude information acquisition unit 180 or the camera 182 are not mounted in the mounting area 105, and the elements at this stage are not mounted. 10 is discharged to the waste tray 135 side (see FIG. 10F).

  As described above, the above-described operation is repeated, and the assembling apparatus 101 assembles the crystal resonator with high accuracy. That is, in the method of assembling an electronic component by the assembly apparatus 101, the element supply unit 110 takes out the elements 10 arranged so that the upper surface when mounted is upward in the element supply region 103 one by one, and the element holding unit 140 While being held, the substrate 10 is rotated and conveyed around the vertical axis, and the element 10 is turned upside down around the horizontal axis, and the conductive adhesive N is applied to the lower surface side when the element 10 is mounted by the coating unit 116 in the coating region 104 from above. Directly applied, the element 10 is turned upside down around the horizontal axis again, the element 10 and the mounting member 20 are aligned in the mounting region 105, and then stored in the mounting member 20 and bonded to attach the crystal resonator. It is assembled with high accuracy.

  According to such a configuration, since the conductive adhesive N is directly applied to the element 10 and does not need to be supplied to the mounting member (package) 20, the element 10 and the mounting member 20 are minimized. However, there is no possibility that the supply nozzle 156 of the application unit 116 (dispenser) will contact the inner wall of the mounting member (package) 20, and supply position deviation or supply amount (application amount) variation due to the supply to the mounting member 20 is eliminated. Can be suppressed. Thereby, even if the element 10 is extremely small, a short circuit between the electrodes 11 and 12 can be prevented, and an increase in defective elements can be avoided.

  Further, since the conductive adhesive N is directly applied to the element 10, high-precision control of the application amount according to the shape error of the mounting member 20 becomes unnecessary.

  Further, since the conductive adhesive N is applied to the element 10 in the application region 104 and mounted on the mounting member 20 immediately thereafter, the time from application to adhesion (to the mounting member 20) can be shortened compared to the conventional method. Even if a small amount of conductive adhesive N is used, the problem of drying before the element 10 is fixed can be avoided.

  In addition, among the elements 10 held by the element holding unit 140, the number of elements 10 until the conductive adhesive N is applied and mounted on the mounting member 20 can be reduced. That is, as shown in FIG. 10, when the number of element holding units 140 is four, the number of elements 10 until the conductive adhesive N is applied and mounted on the mounting member 20 is one or two. (It increases according to the number of element holding units 140, but it is several at most). Therefore, even when the line is stopped for a long time during the assembly process, the conductive adhesive N is applied and the number of elements 10 before mounting on the mounting member 20 is small. Waste elements due to drying of N can be minimized.

  In the assembling apparatus 101, the element holding unit 140 that holds the elements 10 arranged in the circumferential direction of the turret can rotate the suction nozzle 142 about 180 degrees (or 360 degrees) around the horizontal axis. Compared with the element holding mechanism 21 that moves in the horizontal direction of the first embodiment, the assembly apparatus 101 can save space (of the base 102 that performs the actual work).

  Further, in this assembling apparatus 101, since the position adjustment of the mounting member 20 that stands by in the mounting area 105 using the light guide unit 183 is performed before the element 10 is transported, there is a wasteful waiting time. Does not occur. Further, in the assembling apparatus 101, the posture of the element 10 held by the suction nozzle 142 is adjusted during the rotational movement of the rotary table 130 (in the middle of the movement locus), so that no unnecessary waiting time is generated. . Furthermore, since the assembly apparatus 101 performs the final adjustment of the relative position of the element 10 held by the suction nozzle 142 with the mounting member 20 after being transported to the mounting area 105, it is not affected by the mechanical accuracy of the transport apparatus. In addition, accurate and reliable adjustment can be performed. In addition, since the relative positional deviation between the element 10 and the mounting member 20 can be eliminated simply by driving the alignment tray moving means 117 of the mounting member supply apparatus 170, the apparatus does not need to be complicated.

  Further, the assembly apparatus 101 includes a plurality of element holding units 140 having suction nozzles 142 in the circumferential direction of the turntable 30. Therefore, the step in which the first element holding unit 140 holds the element 10 by suction, the step in which the second element holding unit 140 applies a conductive adhesive to the element 10, and the third element holding unit 140 in the element 10 The process of adhering to the mounting member 20 for assembly can be performed simultaneously during the same stationary time.

  The assembling apparatus 101 includes posture information acquisition means 180 that acquires the posture information of the element 10 held by the element holding unit 140 and the posture information of the mounting member 20 that stands by in the mounting area 105. The posture information acquisition unit 180 includes a camera 181 that images the element 10 from below at the same position in the imaging region, and a camera 182 that images the mounting member 20 from above, and based on the imaging results of both cameras 181 and 182. Then, the relative displacement G of the mounting member 20 and the element 10 is derived. Along with miniaturization of the element 10 and the mounting member 20, high accuracy is required for the alignment when assembling them. According to the present embodiment, the alignment of the element 10 and the mounting member 20 can be performed in a short time and in a small space. Can be performed with high accuracy.

  In addition, the element supply area 103, the mounting area 105, and the discard area 135 are provided in this order on a rotation path that rotates in one direction of the element holding unit 140. Therefore, the assembly apparatus 101 can sequentially transport the element holding unit 140 from the element supply area 103 to the disposal area 135 by rotating the turntable 130, and these processes can be performed reliably.

  Further, the assembly apparatus 101 further includes an element supply device 110 that arranges the next element 10 in the element supply region 103 and a mounting member supply device 170 that conveys the mounting member 20 before assembly to the mounting region 105. . Therefore, the next element 10 is arranged at the element holding position 111 before the rotation table 130 rotates and the arbitrary element holding unit 140 stops in the element supply region 103. In the assembly apparatus 101, the mounting member supply apparatus 170 moves the next mounting member 20 to the mounting area 105 before the rotary table 130 rotates and the element holding unit 140 stops in the mounting area 105. ing. Therefore, useless time can be eliminated and the operation can be speeded up.

  Note that the assembling apparatus 101 according to the present embodiment includes the four element holding units 140, but the present invention is not limited to this, and other numbers (for example, 6, 8, 12) are provided. The element holding unit 140 may be provided.

  In the assembling apparatus 101, the rotary table 130 is arranged such that the central axis of rotation is in the vertical direction (vertical direction) at the operating position, but the present invention is not limited to this. The central axis may be arranged in the horizontal direction or the oblique direction. Further, the rotary table 130 may have a shape other than the shape shown in the present embodiment.

  Furthermore, the assembly apparatus 101 has a configuration in which each unit is centrally controlled by the central control apparatus 190, but is not limited thereto, and a dedicated control apparatus may be provided individually.

  In the assembly apparatus 101, the arm 120 is not limited to the one disposed on the base 102, but is disposed on another member or independently. Also good. Further, the arm 120 may be configured to be able to perform operations other than swinging. For example, the movement may be only in the vertical direction, or may be swung after linearly moving in the vertical direction. Alternatively, the arm 120 may be configured to swing or rotate about a plurality of different rotation axes.

  Further, the positions of the element supply area 103, the posture information acquisition area 106, the mounting area 105, and the discard area 135 are not limited to the positions shown in this embodiment, and may be arranged at other positions. . Furthermore, an area for processing and assembling parts and inspecting may be provided in the middle of conveyance.

  The rotation of the turntable 130 is not limited to intermittent rotation that stops every 90 ° rotation. The element holding unit 140 includes the element supply area 103, the posture information acquisition area 106, the mounting area 105, and the disposal area. Even in the position facing each of 135, the rotary table 130 may continue to rotate at a low speed. In this case, the element supply device 110 and the mounting member supply device 170 are preferably rotary tables that rotate to move in the same direction and at the same speed as the rotary table 130 in the element supply region 103 and the mounting region 105. That is, in the element supply region 103, the suction nozzle 142 arranged on the rotary table 130 can suck the element 10 supplied to the element supply device 110 that moves in the same direction and at the same speed as it is rotating. . In the mounting region 105, the element holding unit 140 applies the element 10 sucked by the suction nozzle 142 to the mounting member 20 supplied to the mounting member supply device 170 that moves in the same direction and at the same speed as the element 10. Can be assembled during rotation.

  <Third Embodiment>

  A third embodiment of the present invention will be described with reference to FIG. FIG. 11 is a side view showing another example of the coating apparatuses 206 and 306. FIG. 11A shows a coating device 206 that applies a conductive adhesive to the element 10 by transfer, and FIG. 11B shows another example of a coating device 306 that is a dispenser.

  As shown in FIG. 2A, the coating device 206 includes a table 210 on which the film-like adhesive MN is formed, a coating needle 211 that penetrates from the bottom to the top of the table 210, and a squeegee 212. A liquid conductive adhesive is supplied to the table 210, and a film adhesive MN is formed by the squeegee 212. Thereafter, when the application needle 211 moves in the vertical direction from the lower side to the upper side of the table 210, the film adhesive MN adheres to the tip of the application needle 211 when penetrating the table 210. When the coating needle 211 to which the film adhesive MN is attached contacts the element 10, the film adhesive MN is transferred to the element 10. Here, the squeegee 212 that moves in the horizontal direction in the table shape is shown as an example, but a squeegee 212 having a plurality of wings rotating on the circular table 210 may be used.

  According to such a configuration, the control becomes relatively easy even if the amount of the conductive adhesive applied is small compared to the case of the dispenser.

  Moreover, as shown in FIG.11 (b), the coating device 306 may be a dispenser in which the tip (only) of the supply nozzle 307 is bent upward.

  When the coating devices 206 and 306 of the third embodiment are used, the element 10 is held from above with the upper surface side at the time of mounting upward, and the film-like adhesive MN (from the lower side of the element 10) on the lower surface side at the time of mounting. A conductive adhesive N) can be applied (transferred). That is, it is not necessary to provide a configuration for inverting the element 10 as in the element holding mechanism 21 of the first embodiment or the element holding unit 140 of the second embodiment, and the configuration of the assembling apparatuses 1 and 101 can be simplified.

  <Fourth embodiment>

  A fourth embodiment of the present invention will be described with reference to FIGS. FIG. 12 is a diagram showing a state in which the conductive adhesive N is supplied to the element 10 of the present embodiment by a conventional method, and FIG. 12 (a) is a top view with the bottom surface at the time of mounting upward. FIG. (B) is a side view. FIGS. 13 and 14 are diagrams showing a method of supplying the conductive adhesive N in the present embodiment, and FIG. 13A is a top view with the bottom surface at the time of mounting upward, and FIG. ), (C) are side views, and FIG. 14 is a side view. FIG. 15 is a side view for explaining the supply needle 71 and the supply nozzle (precision nozzle 61) of this embodiment, and FIG. 16 is a side sectional view of the supply nozzle (precision nozzle 61) of this embodiment.

  As described above, the element 10 of the present embodiment is an extremely small element having a plane size of 1 mm square or less, and more specifically, the short side is, for example, 0.4 mm or less, and the long side is 0.6 mm or less. . For this reason, the application region (that is, a part of the electrode 11 and the electrode 12) to which the conductive adhesive N is applied also has a minute size (for example, about 0.1 mm square). Further, not only the application area is very small, but also the application areas (electrodes 11 and 12) are very close to each other.

  For example, as shown in FIG. 3, when the conductive adhesive N is directly applied to the application region of the element 10, generally, the conductive adhesive N does not protrude from the element 10 to the outside. Alternatively, the center position of the supply nozzle 61 (discharge hole) is set within the region of the mounting surface of the element 10 (for example, near the center of the coating region) so that the conductive adhesive N is applied at least near the center of the coating region. And the conductive adhesive N is discharged.

  However, in the case of the extremely small element 10 having a plane size of 1 mm square or less as in the present embodiment, the paste-like shape is obtained with the center position of the discharge hole of the supply nozzle 61 being aligned in the region of the mounting surface of the element 10 Alternatively, when the liquid conductive adhesive N is applied, the conductive adhesive N protrudes from the application region, and there is a problem that a short circuit occurs due to the electrodes 11 and 12 contacting each other.

  When specifically described with reference to FIG. 12, the conductive adhesive N of the present embodiment is a silver paste in which, for example, glass frit (silicon, silica) and a silver filler of about 30 μm are mixed in a resin such as epoxy, This is discharged from the supply nozzle 61 of the coating device 6 and applied. Here, even if the supply nozzle 61 uses a so-called precision nozzle capable of supplying a small amount of the conductive adhesive material N, the minimum nozzle diameter (the diameter of the discharge hole 61A) is 0.1 mm at present. It is about -0.2 mm (specifically, about 0.15 mm-0.2 mm), and the standard application amount at one time is less than 1 cc (for example, about 0.3 cc-0.5 cc).

  For this reason, as shown in the figure, similarly to the conventional general method, the discharge hole 61A (of the supply nozzle 61 is provided in the region of the mounting surface of the element 10 so as to cover the coating region (electrodes 11 and 12). When the conductive adhesive N is supplied by aligning the center position of the center (shown by a thick broken line in FIG. 4A), the conductive adhesive N protrudes greatly from the application region, and the conductive adhesive N comes into contact with each other between the electrodes 11 and 12. There is a problem that a short circuit occurs.

  On the other hand, it is conceivable that the amount of application at one time is less than a predetermined amount (for example, about 0.3 cc to 0.5 cc), but in this case, the supply amount varies, and adhesion and support of the element 10 are not good. There is a problem that becomes stable.

  Therefore, the coating apparatus 6 according to the present embodiment directly connects the conductive adhesive N to the element 10 so that at least a part of the conductive adhesive N protrudes outside the element 10 from the end of the element 10 in plan view. It was decided to apply.

  Specifically, as shown in FIG. 13, the supply nozzle 61 of the coating device 6 is a known precision nozzle in which the outer shape near the discharge hole 61A is tapered, and the tip end portion of the discharge hole 61A is processed into an ultrafine shape. is there. Moreover, the diameter of the discharge hole 61A of the supply nozzle 61 is about 0.1 mm to 0.2 mm (more specifically, about 0.15 mm to 0.2 mm) as described above, and a standard application amount at one time. Is less than 1 cc (for example, about 0.3 cc to 0.5 cc).

  However, when the conductive adhesive N is applied, the coating device 6 has a portion in the radial direction of the discharge hole 61A (indicated by a thick broken line in FIG. Positioning is performed so as to protrude from the (corner portion), and the conductive adhesive N is applied to the element 10 at that position. As shown in FIGS. 2B and 2C, the element 10 is held by the suction nozzle 25 so that the lower surface when mounted is upward, and the coating device 6 includes two elements formed on the element 10. The center position of the supply nozzle 61 (ejection hole 61A) is shifted with respect to the center position of the electrodes 11 and 12, and alignment is performed so that a part of the ejection hole 61A in the radial direction protrudes from the end (corner) of the element 10. Then, the supply nozzle 61 is lowered from above the element 10 to directly apply the conductive adhesive N to the element 10.

  As a result, the conductive adhesive N is applied to the element 10 so that at least a part thereof protrudes from the end of the element 10 (the edge (corner) of the element 10) in plan view (FIG. 5A). Alternatively, the conductive adhesive N is applied at least from the end of the element 10 to the side surface of the element 10 and applied from the lower surface side to the side surface when the element 10 is mounted (FIG. 5B or FIG. (C).

  In this state, as shown in FIG. 14A, the suction nozzle 25 is reversed and moved to house the element 10 in the mounting member 20, and the element is mounted on the inner bottom surface of the mounting member 20 by the conductive adhesive N. 10 is bonded and mounted.

  In addition, after accommodating the element 10 in the mounting member 20, as shown to the figure (a), it is good to press with the suction nozzle 25 etc., before the electroconductive adhesive material N adheres. Even when the surplus conductive adhesive N protruding from the mounting surface of the element 10 wraps around the lower surface and side surface of the element 10 and a gap is generated between the lower surface of the element 10 and the mounting member 20, The element 10 and the mounting member 20 can be brought into close contact with each other.

  Further, as shown in FIGS. 2B and 2C, when the element 10 is accommodated in the mounting member 20, the element 10 is coated so that the portion coated with the conductive adhesive N is lowered with respect to the other side. 10 may be inclined and the element 10 may be released from the suction nozzle 25 at the timing when the conductive adhesive N on the lower surface of the element 10 contacts the bottom surface of the mounting member 20. Thereby, the element 10 can be submerged by its own weight, and the element 10 and the mounting member 20 can be closely_contact | adhered.

  As described above, according to the present embodiment, even when the existing supply nozzle (precision nozzle) 61 is used, an excessive conductive adhesive material N (for example, the size of the application region (electrodes 11 and 12) of the element 10 is used. The conductive adhesive N), which is about one-fourth of the amount applied at one time (about 0.25 cc), can be supplied to the outside of the element 10. Accordingly, it is possible to prevent the conductive adhesives N protruding from the application area on the mounting surface from coming into contact with each other, and to prevent occurrence of defects such as a short circuit between the electrodes 11 and 12.

  On the other hand, since the conductive adhesive N is supplied to substantially the entire surface of the application region, sufficient adhesiveness can be maintained and the element 10 can be stably supported. Furthermore, since the surplus conductive adhesive material N enters between the element 10 and the mounting member 20 and can also be brought into contact with the side surface of the mounting member 20, the element 10 can be securely bonded to the mounting member 20. it can.

  Here, the known supply needle 70 and the precision nozzle 61 of this embodiment will be further described with reference to FIG. In the figure, a conductive adhesive N is attached to a minimal mounting member 20 on which the element 10 of the present embodiment is mounted using a supply needle 70 (FIG. 1A) and a precision nozzle 61 (FIG. 2B). It is a side view which shows a mode that it supplies.

  In the conventional technique, when the conductive adhesive N is supplied to a minute package (mounting member 20), the mounting member is used by using the supply needle 70 whose outer shape near the discharge hole 70A is an elongated needle shape. The method of inserting and applying so that it inclined with respect to 20 inner walls (a side wall and a bottom face) was employ | adopted (the figure (a)). However, since the supply needle 70 has an elongated outer shape, there is a limit to reducing the diameter of the discharge hole 70H in order to maintain strength. That is, under the present circumstances, although the outer shape of the precision nozzle 61 whose tip outer shape is tapered is larger, the diameter of the discharge hole 61A can be made smaller. That is, it is very difficult (impossible) to supply a very small amount of the conductive adhesive N to the extremely small mounting member 20 even if the supply needle 70 is inserted obliquely.

  On the other hand, since the precision nozzle 61 whose tip outer shape is tapered has a large outer size, when supplying the conductive adhesive N to the extremely small mounting member 20, the precision nozzle 1 interferes with the side wall (side surface) of the mounting member 20. In addition, it is very difficult to bring the precision nozzle 61 close to a predetermined application area inside the mounting member 20 ((b) in the figure).

  As described above, it is extremely difficult to apply the conductive adhesive N to the extremely small mounting member 20 on which the element 10 of the present embodiment is mounted, regardless of whether the supply needle 70 or the precision nozzle 61 is used. It is difficult (or impossible).

  In the present embodiment, since the conductive adhesive N is supplied directly to the element 10 instead of the mounting member 20, the problem of interference between the mounting member 20 and the precision nozzle 61 does not occur. Accordingly, it is possible to employ a supply nozzle (precision nozzle) 61 in which the size of the tip outer shape is larger than that of the supply needle 70 (while the discharge hole 61A is smaller than that of the supply needle 70).

  As shown in FIG. 16, the supply nozzle 61 of this embodiment includes a temperature adjustment mechanism 61H on the outer peripheral portion, for example, thereby holding the conductive adhesive N at room temperature (for example, about 25 ° C.). can do. The temperature adjustment mechanism 61H may be, for example, a temperature adjustment mechanism that enables heating / cooling using a Peltier element, or a temperature adjustment mechanism that enables heating / cooling using a heater such as a coil and a water flow. There may be.

  The conductive adhesive N (for example, silver paste) is stored in an appropriate amount by freezing, defrosted at the time of use, and supplied while being maintained at room temperature by the temperature control mechanism 61H.

  Further, the supply nozzle (precision nozzle) 61 may be connected to the coating device 6 by a deformable tube or the like. Accordingly, the conductive adhesive N can be supplied by deforming the tube so that the tip of the supply nozzle 61 faces upward as shown in FIG.

  As described above, the coating apparatus (coating unit) of the present embodiment is an example in which the conductive adhesive is applied to a plurality of locations (two locations) with respect to one element by moving in the left-right direction (X, Y direction). Although described, for example, a plurality (two) of coating apparatuses may be provided on the transport path of the element 10 of the second embodiment. In this case, application is performed at the first position by the first application device, and then the element is moved and applied at the second position by the second application device. According to such a configuration, since it is not necessary to move the supply nozzle with respect to the element 10, it is possible to perform highly accurate alignment.

  In the present embodiment, the conductive paste is exemplified as the material of the conductive adhesive applied to the element 10, but this is not particularly limited. For example, a chemical material that volatilizes completely in the subsequent heating step may be used.

  In addition, a cleaning device may be provided that has a cleaning surface formed of fibers, a grindstone, and the like, contacts the tip of the suction nozzle, and periodically wipes the attached conductive adhesive.

  Further, the component mounting apparatus and component mounting method of the present invention are not limited to the above-described embodiments, and it is needless to say that various modifications can be made without departing from the scope of the present invention.

The present invention can be widely used in the field of manufacturing electronic components.

DESCRIPTION OF SYMBOLS 1,101 Assembling apparatus 10 Element 20 Mounting member 21 Element holding mechanism 24 Element holding mechanism drive part 140 Element holding unit 6,116,206,306 Coating apparatus (coating unit)
30, 130 rotary table

Claims (27)

Conveying means for conveying electronic components;
Holding means for holding an element of the electronic component;
An application means for applying an adhesive;
An assembly apparatus for assembling the electronic component by mounting the element on a mounting member,
The application means directly applies the adhesive to the element held by the holding means,
The transport means transports the element or the mounting member so that the element to which the adhesive is applied moves above the corresponding mounting member.
An assembly apparatus characterized by that. The element is any one of a crystal piece, a piezoelectric element, and a MEMS element.
The assembling apparatus according to claim 1. The holding means holds the element from the upper surface side when mounted,
The application means applies the adhesive to the lower surface side when the element is mounted.
The assembling apparatus according to claim 1 or 2, characterized in that The holding means holds the element by turning the element before application of the adhesive upside down so that the lower surface side when mounted is upward,
The application means applies the adhesive from above the element to the lower surface side when the element is mounted.
The assembly apparatus according to claim 3. The conveying means includes a rotating turret and the holding means provided on the outer periphery of the turret so as to be turned upside down.
The assembling apparatus according to any one of claims 1 to 4, wherein the assembling apparatus is characterized in that The holding means holds the element before applying the adhesive so that the upper surface side when mounted is upward,
The application means applies the adhesive from below the element to the lower surface side when the element is mounted.
The assembly apparatus according to claim 3. The application means is a dispenser.
The assembly apparatus according to any one of claims 1 to 6, wherein The adhesive is a paste or liquid adhesive,
The assembling apparatus according to any one of claims 1 to 7, wherein the assembling apparatus is characterized in that The holding means holds the element coated with the adhesive so that the upper surface side at the time of mounting is upward and adheres to the mounting member.
The assembling apparatus according to any one of claims 1 to 8, wherein A camera for a mounting member that images the mounting member before mounting;
A device camera for imaging the device before mounting;
Based on the imaging results of the camera for the mounting member and the camera for the element, an analysis unit for deriving the amount of relative displacement between the mounting member and the element;
A position adjustment unit that adjusts at least one of the position of the element and the mounting member based on a result of the analysis unit derived;
The assembly apparatus according to any one of claims 1 to 9, wherein The applying means applies the adhesive by moving in a vertical direction relative to the lower surface of the element;
The assembly apparatus according to any one of claims 1 to 10, wherein the assembly apparatus is characterized in that The element has a plane size of 1 mm square or less,
The assembly apparatus according to any one of claims 1 to 11, wherein the assembly apparatus is characterized in that The mounting member has a mounting surface size of 1 mm square or less,
The assembly apparatus according to any one of claims 1 to 12, wherein An assembly method for assembling the electronic component by mounting an element of the electronic component on a mounting member,
Apply adhesive directly to the element,
Aligning and bonding the element to which the adhesive is applied to the mounting member;
An assembling method characterized by the above. The element is any one of a crystal piece, a piezoelectric element, and a MEMS element.
The assembly method according to claim 14, wherein Hold the element from the top side when mounted,
Applying the adhesive on the lower surface side when the element is mounted,
16. The assembling method according to claim 14, wherein the assembling method is characterized by the above. Holding the element before applying the adhesive from the upper surface side during mounting,
Flip the element upside down,
Applying the adhesive material from above the element to the lower surface side when the element is mounted,
The assembling method according to any one of claims 14 to 16, wherein the assembling method is provided. The application means applies the adhesive to the element so that at least a part of the adhesive protrudes from an end of the element in a plan view.
The assembling apparatus according to any one of claims 1 to 13, wherein the assembling apparatus is characterized in that The coating means has a nozzle having a tapered outer shape in the vicinity of the discharge portion, and the coating means is attached to the element at a position where a part of the nozzle discharge hole in the radial direction protrudes from the end of the element in plan view. Apply,
The assembly apparatus according to any one of claims 1 to 13 and claim 18, wherein The nozzle discharge hole has a diameter of 0.2 mm or less.
The assembly apparatus according to claim 19. The application means applies less than 1 cc of the adhesive to one application region of the element;
The assembling apparatus according to any one of claims 1 to 13, and 18 to 20. The plane size of the element has a short side of 0.4 mm or less and a long side of 0.6 mm or less.
The assembling apparatus according to any one of claims 1 to 13, and 18 to 21. The application means includes a table on which a film-like adhesive is formed, and an application needle penetrating from the lower side to the upper side of the table,
The coating needle passes through the table on which the film-like adhesive is formed, and contacts the element held above the table, thereby transferring the adhesive to the element.
The assembling apparatus according to any one of claims 1 to 3 and 6, wherein The adhesive is applied to the element so that at least part of the adhesive protrudes from the end of the element in plan view.
The assembling method according to any one of claims 14 to 17, wherein the assembling method is provided. The adhesive is applied from the lower surface side to the side surface side when the element is mounted.
25. The assembling method according to any one of claims 14 to 17, and 24. The adhesive is applied in an amount of less than 1 cc to one application region of the element.
The assembly method according to any one of claims 14 to 17, 24, and 25. The plane size of the element has a short side of 0.4 mm or less and a long side of 0.6 mm or less.
27. The assembling method according to any one of claims 14 to 17, and 24 to 26.

Images