MY162038A - Die bonding apparatus - Google Patents

Die bonding apparatus

Info

Publication number
MY162038A
MY162038A MYPI2013702337A MYPI2013702337A MY162038A MY 162038 A MY162038 A MY 162038A MY PI2013702337 A MYPI2013702337 A MY PI2013702337A MY PI2013702337 A MYPI2013702337 A MY PI2013702337A MY 162038 A MY162038 A MY 162038A
Authority
MY
Malaysia
Prior art keywords
holders
semiconductor element
face
die bonding
bond
Prior art date
Application number
MYPI2013702337A
Inventor
Hara Yoshiaki
Nagasato Shoichi
Original Assignee
Ueno Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ueno Seiki Co Ltd filed Critical Ueno Seiki Co Ltd
Publication of MY162038A publication Critical patent/MY162038A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/27—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27—Manufacturing methods
    • H01L2224/273—Manufacturing methods by local deposition of the material of the layer connector
    • H01L2224/2731—Manufacturing methods by local deposition of the material of the layer connector in liquid form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

A die bonding apparatus is provided which does not decrease the reliability of a semiconductor element even if a bond becomes stringy or an excessive amount of the bond is applied, thereby speeding up the die bonding process of the semiconductor element. A ring holder (2), a paste applying device (5), and a substrate conveyer device (3) are disposed around a pickup device (4). The pickup device (4) includes holders (41) that can attach/detach a semiconductor element and are disposed in a radial fashion. This pickup device (4) causes one of the holders (41) to face a wafer ring of the ring holder (2), causes another one of the holders (41) to face the paste applying device (5), and causes the other one of the holders (41) to face the substrate conveyer device (3) at the same timing upon a rotation. The paste applying device (5) applies a bond to the mount face of the semiconductor element held by the holder (41).
MYPI2013702337A 2012-12-04 2012-12-04 Die bonding apparatus MY162038A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2012/081410 WO2014087489A1 (en) 2012-12-04 2012-12-04 Die bonder device

Publications (1)

Publication Number Publication Date
MY162038A true MY162038A (en) 2017-05-31

Family

ID=50882940

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI2013702337A MY162038A (en) 2012-12-04 2012-12-04 Die bonding apparatus

Country Status (6)

Country Link
JP (1) JP5777261B2 (en)
CN (1) CN103975425B (en)
HK (1) HK1200976A1 (en)
MY (1) MY162038A (en)
TW (1) TWI591738B (en)
WO (1) WO2014087489A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6181108B2 (en) * 2014-06-19 2017-08-16 アキム株式会社 Assembly apparatus and assembly method
KR102449536B1 (en) * 2015-08-10 2022-09-30 ㈜큐엠씨 Apparatus for sorting electronic device
JP5975556B1 (en) * 2015-12-11 2016-08-23 上野精機株式会社 Transfer equipment
CN109075104B (en) * 2016-04-27 2022-03-18 砺铸智能装备私人有限公司 Transfer system for turning and repeatedly detecting electronic device
JP6164624B1 (en) * 2016-10-18 2017-07-19 上野精機株式会社 Electronic component moving device and electronic component conveying device
KR101826522B1 (en) 2016-11-30 2018-03-22 원호 Wafer sorting equipment
CN109638150B (en) * 2018-10-22 2023-05-02 武汉纺织大学 Automatic dispensing and mounting machine for piezoelectric wafer of ultrasonic probe
CN111916375B (en) * 2020-08-12 2024-03-26 深圳市诺泰芯装备有限公司 Rotary chip glue-free die bonder
CN115318552B (en) * 2022-07-15 2024-01-30 济南金威刻激光科技股份有限公司 Adhesive smearing device for invisible semiconductor cutting

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02239636A (en) * 1989-03-13 1990-09-21 Fujitsu Ltd Diebonding device
JPH10308403A (en) * 1997-05-06 1998-11-17 Fujitsu Ltd Method and equipment for manufacturing semiconductor device
KR20050092765A (en) * 2003-01-16 2005-09-22 코닌클리즈케 필립스 일렉트로닉스 엔.브이. Chip transfer method and apparatus
DE102010031939B4 (en) * 2010-07-22 2012-05-24 Asm Assembly Systems Gmbh & Co. Kg Dispenser system for a placement machine, placement machine and method for applying a dispensing medium to components

Also Published As

Publication number Publication date
HK1200976A1 (en) 2015-08-14
WO2014087489A1 (en) 2014-06-12
TW201423877A (en) 2014-06-16
TWI591738B (en) 2017-07-11
CN103975425B (en) 2017-11-14
CN103975425A (en) 2014-08-06
JP5777261B2 (en) 2015-09-09
JPWO2014087489A1 (en) 2017-01-05

Similar Documents

Publication Publication Date Title
MY162038A (en) Die bonding apparatus
GB2520905A (en) Advanced handler wafer debonding method
PH12013000318A1 (en) Semiconductor die singulation method and apparatus
SG11201906510PA (en) Method and device for bonding chips
SG2013088984A (en) Thermocompression bonding method and apparatus for the mounting of semiconductor chips on a substrate
MY171178A (en) Method of reducing residual contamination in singulated semiconductor die
SG11201806511XA (en) Device and method for bonding substrates
EP2770032A3 (en) Film adhesive, dicing tape with film adhesive, method of manufacturing semiconductor device, and semiconductor device
EP2506295A3 (en) Bonding apparatus and bonding method
EP3187559A4 (en) Adhesive for temporary bonding, adhesive layer, method for manufacturing wafer work piece and semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition
SG11201708735SA (en) Tape for semiconductor processing
MY168172A (en) Adhesive sheet manufacturing semiconductor device and manufacturing method of semiconductor device
SG11201705967TA (en) Paste-like adhesive composition, semiconductor device, method for manufacturing semiconductor device, and method for bonding heatsink
WO2015156891A3 (en) Method of providing a flexible semiconductor device and flexible semiconductor device thereof
MY172339A (en) Semiconductor die back layer separation method
TW201613142A (en) Light-emitting unit and semiconductor light-emitting device
SG11201811626TA (en) Method and sample holder for the controlled bonding of substrates
WO2017034644A3 (en) Method of providing an electronic device and electronic device thereof
TW201614763A (en) Devices for methodologies for debonding and handling semiconductor wafers
WO2015107290A3 (en) Process for placing and bonding chips on a receiving substrate using a pad, by means of a magnetic, electrostatic or electromagnetic force
MY160071A (en) Apparatus for Mounting Semiconductor Chips
MY179367A (en) Adhesive film and semiconductor package using adhesive film
EP3428600A4 (en) Adhesive for semiconductor sensor chip mounting, and semiconductor sensor
PH12020550712A1 (en) Silicone-based adhesive sheet, multilayer structure including same, and method for producing semiconductor device
MY178992A (en) Die attachment apparatus and method utilizing activated forming gas