TWI591738B - Die bonding apparatus - Google Patents
Die bonding apparatus Download PDFInfo
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- TWI591738B TWI591738B TW102144493A TW102144493A TWI591738B TW I591738 B TWI591738 B TW I591738B TW 102144493 A TW102144493 A TW 102144493A TW 102144493 A TW102144493 A TW 102144493A TW I591738 B TWI591738 B TW I591738B
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Description
本發明涉及一種從貼附著包含多個半導體元件的晶片的貼片環取出半導體元件並塗布黏著劑，將塗布了黏著劑的半導體元件安裝在基板的黏晶機裝置。 The present invention relates to a die bonder apparatus in which a semiconductor element is taken out from a patch ring to which a wafer including a plurality of semiconductor elements is attached and an adhesive is applied, and a semiconductor element coated with an adhesive is mounted on a substrate.
在半導體的製造步驟中，經過貼裝步驟、切割步驟之後，實施黏片步驟。貼裝步驟是將晶片貼附在環的步驟。切割步驟是將晶片分割而單片化為半導體元件的步驟。黏片步驟是將從晶片單片化的半導體元件依次取出而黏片在導線架或基板(以下，將這些總稱為基板)的步驟，使用黏晶機裝置而實施。將半導體元件安裝在基板時，利用漿料塗布裝置，預先將黏著劑塗布在安裝半導體元件的基板上的相應部位。 In the manufacturing step of the semiconductor, after the mounting step and the cutting step, the adhesive sheeting step is performed. The placement step is the step of attaching the wafer to the ring. The dicing step is a step of dicing the wafer into a semiconductor element. The adhesive sheet step is a step of sequentially taking out semiconductor elements singulated from a wafer and adhering the adhesive sheets to a lead frame or a substrate (hereinafter, collectively referred to as a substrate), using a die bonder apparatus. When the semiconductor element is mounted on the substrate, the adhesive is applied to the corresponding portion on the substrate on which the semiconductor element is mounted by the slurry coating device.
黏晶機裝置是包含使吸嘴升降以及在二維方向上水平移動的焊頭，且在其下方配置著基板保持部與環座(例如參照專利文獻1)。基板保持部保持基板，環座保持貼片環。基板保持部與環座具有與吸嘴水平移動的平面平行的基板的保持平面與貼片環的保持平面。漿料塗布裝置包含貯存著黏著劑的接盤、及可以朝 向基板上的各處水平移動及升降的衝壓針(例如參照專利文獻2)。 The die bonder device includes a horn that moves the nozzle up and down and moves horizontally in a two-dimensional direction, and a substrate holding portion and a ring seat are disposed below the substrate (see, for example, Patent Document 1). The substrate holding portion holds the substrate, and the ring holder holds the patch ring. The substrate holding portion and the ring seat have a holding plane of the substrate parallel to the plane in which the nozzle moves horizontally and a holding plane of the patch ring. The slurry coating device comprises a tray for storing the adhesive, and A press pin that moves horizontally and vertically to the entire surface of the substrate (see, for example, Patent Document 2).
具備漿料塗布裝置的黏晶機裝置一般經過如下步驟將半導體元件安裝在基板上。首先，進行半導體元件的拾取步驟。即，使吸嘴從貼片環的上方下降，利用存在於貼片環的背面側的頂出銷與吸嘴夾入半導體元件。然後，利用吸嘴吸附半導體元件之後，使該吸嘴上升，並且利用頂出銷將半導體元件頂出。 A die bonder apparatus having a slurry coating apparatus generally mounts a semiconductor element on a substrate by the following steps. First, a pickup step of a semiconductor element is performed. That is, the nozzle is lowered from above the patch ring, and the semiconductor element is sandwiched by the ejector pin existing on the back side of the patch ring and the nozzle. Then, after the semiconductor element is adsorbed by the suction nozzle, the nozzle is raised, and the semiconductor element is ejected by the ejector pin.
漿料塗布裝置是與拾取步驟同時期地實施點膠步驟。即，漿料塗布裝置是將衝壓針的前端浸漬在接盤內的黏著劑中，使衝壓針移動到拾取步驟中提取的半導體元件的相應的安裝部位，將保持在衝壓針的前端的黏著劑塗布在基板的相應的安裝部位。 The slurry coating device performs the dispensing step at the same time as the picking step. That is, the slurry application device immerses the tip end of the punching needle in the adhesive in the tray, moves the stamping needle to the corresponding mounting portion of the semiconductor element extracted in the picking step, and holds the adhesive at the front end of the stamping needle. Coated on the corresponding mounting portion of the substrate.
當拾取步驟及點膠步驟結束時，進行半導體元件的安裝步驟。即，使吸附著半導體元件的吸嘴上升時，使該吸嘴在水平方向上二維移動，使其位於基板上的塗布著黏著劑的相應的安裝部位。然後，使吸嘴下降，將半導體元件按壓在相應的安裝部位。 When the pickup step and the dispensing step are completed, the mounting step of the semiconductor element is performed. That is, when the nozzle to which the semiconductor element is adsorbed is raised, the nozzle is moved two-dimensionally in the horizontal direction so as to be positioned on the substrate at the corresponding mounting portion where the adhesive is applied. Then, the nozzle is lowered to press the semiconductor element against the corresponding mounting portion.
背景技術文獻 Background art literature
專利文獻 Patent literature
專利文獻1：日本專利特開2009-59961公報 Patent Document 1: Japanese Patent Laid-Open Publication No. 2009-59961
專利文獻2：日本專利特開2011-159979公報 Patent Document 2: Japanese Patent Laid-Open Publication No. 2011-159979
像這樣，在黏晶機裝置中，關於拾取步驟、點膠步驟及半導體元件安裝在基板的步驟，按照該時間序列依序連續地重複進行。此時，吸附著半導體元件的吸嘴的移動距離根據基板的安裝部位而發生變化，而且，接盤存在於固定位置上，因此，在接盤與半導體元件的相應的安裝部位之間往返運動的衝壓針的移動距離也發生變化。此外，將黏著劑塗布在基板的情况下，安裝時也必須確認黏著劑的塗布部位與半導體元件的安裝部位的位置對準。 As described above, in the die bonder apparatus, the steps of the pickup step, the dispensing step, and the mounting of the semiconductor element on the substrate are sequentially repeated in this order in that time series. At this time, the moving distance of the nozzle to which the semiconductor element is adsorbed changes according to the mounting portion of the substrate, and the land is present at a fixed position, thereby moving back and forth between the land and the corresponding mounting portion of the semiconductor element. The moving distance of the punching needle also changes. Further, when the adhesive is applied to the substrate, it is necessary to confirm the alignment of the application portion of the adhesive with the mounting portion of the semiconductor element during mounting.
因此，在以往的黏晶機裝置中，拾取一個半導體元件後到安裝為止的周期時間變長。此外，也提出了將接盤與衝壓針安裝在同一殼體而包括殼體在內移動到塗布黏著劑的部位的漿料塗布裝置。但是，如果使接盤與衝壓針一起移動，則接盤內部的黏著劑因慣性力而偏倚化，黏在衝壓針上的黏著劑的量變得不穩定，因此，難以實用化。 Therefore, in the conventional die bonder apparatus, the cycle time until the mounting of one semiconductor element is completed is long. Further, a slurry application device in which a tray and a press needle are mounted in the same casing and moved to a portion where the adhesive is applied is also included. However, if the tray is moved together with the press needle, the adhesive inside the tray is biased by the inertial force, and the amount of the adhesive adhered to the press needle becomes unstable, so that it is difficult to put it into practical use.
因此，為了實現整體的周期時間的縮短，考慮單純地提高衝壓針的升降速度或移動速度的方法。但是，如果硬要提高衝壓針的升降速度或移動速度，則像以下那樣產生黏著劑的拉絲或過量塗布的問題，成為使半導體元件的可靠性降低的一個原因。 Therefore, in order to shorten the overall cycle time, a method of simply increasing the lifting speed or the moving speed of the press needle is considered. However, if the lifting speed or the moving speed of the press needle is hard to be increased, the problem of drawing or excessive application of the adhesive is caused as follows, which is one of the reasons for lowering the reliability of the semiconductor element.
圖14表示在基板上塗布了黏著劑的情况下的半導體元件的安裝狀况。如圖14的(a)所示，如果附著在衝壓針的黏著劑適量，則即使將半導體元件按壓在塗布在基板上的黏著劑上，黏著劑也不會黏在半導體的側面。 Fig. 14 shows a state in which the semiconductor element is mounted on the substrate with the adhesive applied thereto. As shown in Fig. 14 (a), if an appropriate amount of the adhesive adhered to the press needle is applied, the adhesive does not stick to the side surface of the semiconductor even if the semiconductor element is pressed against the adhesive applied to the substrate.
但是，如圖14的(b)所示，如果使衝壓針的移動加快，則有塗布在基板上的黏著劑產生拉絲的情况。如果在產生拉絲的狀態下將半導體元件安裝在基板上，則有拉絲部分附著在半導體元件的側面上露出的接點而發生短路的擔憂。 However, as shown in FIG. 14(b), if the movement of the press needle is accelerated, the adhesive applied to the substrate may be drawn. If the semiconductor element is mounted on the substrate in a state where the wire is drawn, there is a concern that the wire drawing portion adheres to the contact exposed on the side surface of the semiconductor element to cause a short circuit.
此外，如圖14的(c)所示，如果附著在衝壓針的黏著劑過量，則確認到半導體元件浸在黏著劑中的現象。如果半導體元件浸在黏著劑中，則有黏著劑附著在半導體元件的接點而發生短路的擔憂。 Further, as shown in (c) of FIG. 14, if the adhesive adhering to the press needle is excessive, the phenomenon in which the semiconductor element is immersed in the adhesive is confirmed. If the semiconductor element is immersed in the adhesive, there is a concern that the adhesive adheres to the contact of the semiconductor element to cause a short circuit.
因此，如果提高衝壓針的升降速度或移動速度，則存在半導體元件的可靠性降低的問題。 Therefore, if the lifting speed or the moving speed of the press needle is increased, there is a problem that the reliability of the semiconductor element is lowered.
本發明是為了解决如所述般的現有技術的問題而提出，其目的在於提供一種即使產生黏著劑的拉絲或過量塗布也不使半導體元件的可靠性降低，而且可以使半導體元件的黏片步驟高速化的黏晶機裝置。 SUMMARY OF THE INVENTION The present invention has been made to solve the problems of the prior art as described above, and an object of the invention is to provide a method of laminating a semiconductor element without causing degradation of reliability of a semiconductor element even if drawing or excessive application of an adhesive is caused. High-speed die bonding machine.
解决如所述般的問題的黏晶機裝置是從貼附著包含多個半導體元件的晶片的貼片環取出半導體元件並塗布黏著劑，將塗布了黏著劑的半導體元件安裝在基板上，其特徵在於包含：環座，保持所述貼片環；漿料塗布裝置，塗布所述黏著劑；基板搬送部，保持及搬送所述基板；及旋轉方式的拾取器件，將可以裝卸所述半導體元件的保持部配置成輻射狀而構成，且使該保持部繞著輻射中心每次旋轉規定角度；所述環座、所述漿料塗布裝置及所述 基板搬送部配置在所述拾取器件的周圍，所述拾取器件是通過旋轉，在同一時間，使多個所述保持部中的一架與所述環座的所述貼片環相對，使多個所述保持部中的另一架與所述漿料塗布裝置相對，且使多個所述保持部中的又一架與所述基板搬送部相對，所述漿料塗布裝置是對從所述貼片環取出並保持在所述保持部的所述半導體元件的安裝面塗布所述黏著劑。 A die bonder device that solves the above problems is obtained by taking out a semiconductor element from a patch ring to which a wafer including a plurality of semiconductor elements is attached, and applying an adhesive, and mounting the adhesive-coated semiconductor element on the substrate. The invention includes a ring holder for holding the patch ring, a slurry coating device for applying the adhesive, a substrate transfer portion for holding and transporting the substrate, and a rotary pick-up device for attaching and detaching the semiconductor component The holding portion is configured to be radially formed, and the holding portion is rotated by a predetermined angle around the radiation center; the ring seat, the slurry coating device, and the a substrate transporting portion disposed around the pick-up device, wherein the pick-up device rotates, and at the same time, one of the plurality of the holding portions is opposed to the patch ring of the ring seat, so that The other of the holding portions is opposed to the slurry coating device, and another one of the plurality of holding portions is opposed to the substrate conveying portion, and the slurry coating device is a pair of substrates The patch ring takes out and holds the adhesive on the mounting surface of the semiconductor element of the holding portion.
也可以設置成：所述拾取器件以所述保持部的輻射面垂直的方式設置，所述漿料塗布裝置配置在所述拾取器件的正上方，並且對使安裝面朝上的所述半導體元件從上方塗布所述黏著劑。 It is also possible to provide that the pickup device is disposed in such a manner that a radiation surface of the holding portion is perpendicular, the slurry coating device is disposed directly above the pickup device, and the semiconductor element is provided with the mounting surface facing upward The adhesive is applied from above.
所述漿料塗布裝置也可以包含衝壓針，該衝壓針與所述拾取器件的位於頂點的所述保持部共用軸線而相對，並且在下端保持著所述黏著劑。 The slurry application device may also include a stamping needle that opposes the axis of the holding portion of the pick-up device at the apex, and holds the adhesive at the lower end.
也可以設置成：所述漿料塗布裝置將多個所述衝壓針配置在對向或圓周均等分配位置上，且還包含貯存著所述黏著劑的接盤，使該衝壓針沿著共用圓周軌跡每次旋轉規定角度，依次使各衝壓針位於所述接盤，依次使各衝壓針與所述拾取器件的位於頂點的所述保持部共用軸線而相對。 It is also possible to provide that the slurry coating device arranges a plurality of the punching pins in an opposite or circumferentially equally distributed position, and further includes a tray in which the adhesive is stored, so that the punching needle is along a common circumference Each time the trajectory is rotated by a predetermined angle, the puncturing needles are sequentially placed on the splicing plate, and the puncturing needles are sequentially opposed to the holding portion at the apex of the pickup device.
也可以設置成：在所述拾取器件的周圍還包含觀察所述半導體元件的安裝面而檢測有無所述黏著劑的檢測器件。 It is also possible to provide a detecting means for detecting the presence or absence of the adhesive on the mounting surface of the semiconductor element around the pick-up device.
也可以設置成：在所述拾取器件的周圍還包含將沒有塗布所述黏著劑的所述半導體元件排出的排出位置。 It is also possible to provide that a discharge position for discharging the semiconductor element to which the adhesive is not applied is further included around the pickup device.
也可以設置成：所述環座的貼片環保持面、所述基板搬送部的基板保持面及配置在該拾取器件的所述保持部延伸的面以相互正交的方式配置，所述漿料塗布裝置配置成隔著所述拾取器件與基板搬送部相對。 The patch ring holding surface of the ring seat, the substrate holding surface of the substrate transfer portion, and the surface of the pick-up device that extends along the holding portion may be disposed to be orthogonal to each other, and the slurry may be disposed. The material application device is disposed to face the substrate transfer portion via the pickup device.
根據本發明，因在半導體元件側塗布黏著劑之後安裝在基板上，所以，不管是塗布黏著劑時產生拉絲部分，還是塗布過量的黏著劑，基板安裝時黏著劑均不易到達半導體元件的接點。因此，可以進行能够實現整體的高速化並且也不易發生短路而可靠性優异的黏片處理。 According to the present invention, since the adhesive is applied to the substrate after the application of the adhesive on the side of the semiconductor element, no matter whether the drawn portion is applied when the adhesive is applied or an excessive amount of the adhesive is applied, the adhesive does not easily reach the contact of the semiconductor element during the mounting of the substrate. . Therefore, it is possible to perform an adhesive sheet process which is capable of achieving an overall high speed and which is less likely to cause short-circuiting and is excellent in reliability.
1‧‧‧黏晶機裝置 1‧‧‧Crystal machine
10‧‧‧殼體 10‧‧‧shell
2‧‧‧環座 2‧‧‧ ring seat
21‧‧‧環插入部 21‧‧‧ Ring Insertion Department
21a、21b‧‧‧環形板 21a, 21b‧‧‧ ring plate
21c‧‧‧間隙部 21c‧‧‧Gap section
22‧‧‧環移動機構 22‧‧‧Circle moving agency
22a‧‧‧支持板 22a‧‧‧Support board
22b、22c‧‧‧軌道 22b, 22c‧‧ track
23‧‧‧環旋轉部 23‧‧‧ Ring Rotation
23a‧‧‧正時帶輪 23a‧‧‧ Timing pulley
23b‧‧‧皮帶 23b‧‧‧Belt
23c、42、53‧‧‧馬達 23c, 42, 53‧‧ motor
24‧‧‧頂出銷 24‧‧‧Top sales
3‧‧‧基板搬送裝置 3‧‧‧Substrate transport device
31、32‧‧‧匣盒 31, 32‧‧‧匣 box
33‧‧‧輸送機部 33‧‧‧Conveyor Department
34‧‧‧基板保持部 34‧‧‧Substrate retention department
4‧‧‧拾取裝置 4‧‧‧ picking device
41、41A、41B‧‧‧保持部 41, 41A, 41B‧‧‧ Keeping Department
41a‧‧‧吸嘴 41a‧‧‧ nozzle
41b、51a‧‧‧致動器 41b, 51a‧‧‧ actuator
41c、51b‧‧‧凸輪機構 41c, 51b‧‧‧ cam mechanism
41d、51c‧‧‧杆 41d, 51c‧‧‧ pole
5‧‧‧漿料塗布裝置 5‧‧‧Slurry coating device
51、51A、51B‧‧‧衝壓針 51, 51A, 51B‧‧ ‧ punching needle
52‧‧‧臂 52‧‧‧ Arm
54‧‧‧接盤 54‧‧‧
6‧‧‧檢測器件 6‧‧‧Detection device
61‧‧‧攝像機 61‧‧‧Camera
W‧‧‧晶片 W‧‧‧ wafer
R‧‧‧貼片環 R‧‧‧SMD ring
D、D1、D2、D3、D4、D5‧‧‧半導體元件 D, D1, D2, D3, D4, D5‧‧‧ semiconductor components
F、F1‧‧‧基板 F, F1‧‧‧ substrate
B‧‧‧黏著劑 B‧‧‧Adhesive
J‧‧‧接點 J‧‧‧Contact
Pa、Pb‧‧‧停止地點 Pa, Pb‧‧‧ stop location
α‧‧‧最側點 Α‧‧‧most point
β‧‧‧頂點 ‧‧‧‧ vertices
ε‧‧‧最低點 Ε‧‧‧ lowest point
γ、δ‧‧‧地點 γ, δ‧‧‧Location
圖1是表示本實施方式的黏晶機裝置的整體構成的立體圖。 FIG. 1 is a perspective view showing an overall configuration of a die bonder device according to the present embodiment.
圖2是拾取裝置的立體圖。 2 is a perspective view of a pickup device.
圖3是拾取裝置的側視圖。 Figure 3 is a side view of the pickup device.
圖4是環座的立體圖。 Figure 4 is a perspective view of the ring seat.
圖5是漿料塗布裝置的立體圖。 Fig. 5 is a perspective view of a slurry coating device.
圖6是基板搬送裝置的立體圖。 Fig. 6 is a perspective view of the substrate transfer device.
圖7是說明半導體元件的提取處理的圖。 FIG. 7 is a view for explaining an extraction process of a semiconductor element.
圖8是說明對於半導體元件的黏著劑塗布處理的圖。 FIG. 8 is a view for explaining an adhesive coating process for a semiconductor element.
圖9是說明利用漿料塗布裝置的黏著劑塗布處理的詳細情况 的局部放大圖。 Figure 9 is a view for explaining the details of the adhesive coating treatment using the slurry coating device Partial enlarged view.
圖10是說明檢測有沒有對半導體元件塗布黏著劑的處理的圖。 Fig. 10 is a view for explaining a process of detecting the presence or absence of application of an adhesive to a semiconductor element.
圖11是說明將沒有塗布黏著劑的半導體元件排出的處理的圖。 Fig. 11 is a view for explaining a process of discharging a semiconductor element to which an adhesive is not applied.
圖12是說明半導體元件的安裝處理的圖。 Fig. 12 is a view for explaining a mounting process of a semiconductor element.
圖13是表示利用本實施方式的黏晶機裝置塗布的黏著劑的狀態的圖。 FIG. 13 is a view showing a state of an adhesive applied by the die bonder device of the embodiment.
圖14是表示利用以往的黏晶機裝置塗布的黏著劑的狀態的圖。 Fig. 14 is a view showing a state of an adhesive applied by a conventional die bonder device.
(整體構成) (overall)
以下，一面參照附圖一面對本發明的黏晶機裝置的實施方式詳細地進行說明。 Hereinafter, an embodiment of the die bonder apparatus of the present invention will be described in detail with reference to the accompanying drawings.
圖1是表示本實施方式的黏晶機裝置1的整體構成的立體圖。黏晶機裝置1是從貼附著晶片的貼片環取出半導體元件，在所述半導體元件的安裝面塗布黏著劑，將塗布了黏著劑的半導體元件貼附在基板上。半導體元件是例如LED元件等。晶片是通過被切割而單片排列成陣列狀的圓板，各個單片是半導體元件。基板是例如導線架。黏著劑是焊錫或樹脂漿料等。 FIG. 1 is a perspective view showing an overall configuration of a die bonder device 1 of the present embodiment. In the die bonder apparatus 1, a semiconductor element is taken out from a patch ring to which a wafer is attached, an adhesive is applied to a mounting surface of the semiconductor element, and a semiconductor element coated with an adhesive is attached to the substrate. The semiconductor element is, for example, an LED element or the like. The wafer is a circular plate which is monolithically arranged in an array by being cut, and each of the individual pieces is a semiconductor element. The substrate is, for example, a lead frame. The adhesive is a solder or a resin paste or the like.
該黏晶機裝置1包含環座2、漿料塗布裝置5、基板搬送 裝置3及拾取裝置4。環座2固定在殼體10，且以將貼片環竪起來的方式保持垂直。漿料塗布裝置5對半導體元件的安裝面塗布黏著劑。基板搬送裝置3保持及搬送基板。拾取裝置4是從貼片環取出半導體元件，並依次向漿料塗布裝置5及基板搬送裝置3搬送。 The die bonder device 1 includes a ring seat 2, a slurry coating device 5, and a substrate transfer Device 3 and picking device 4. The ring seat 2 is fixed to the housing 10 and is held vertically in a manner to erect the patch ring. The slurry coating device 5 applies an adhesive to the mounting surface of the semiconductor element. The substrate transfer device 3 holds and transports the substrate. The pickup device 4 takes out the semiconductor element from the patch ring and sequentially transfers it to the slurry coating device 5 and the substrate transfer device 3.
環座2、漿料塗布裝置5及基板搬送裝置3配置在旋轉方式的拾取裝置4的周圍。環座2、漿料塗布裝置5及基板搬送裝置3是從上下及一側三個方向包圍拾取裝置4，環座2位於拾取裝置4的側方，基板搬送裝置3位於拾取裝置4的下方，漿料塗布裝置5位於拾取裝置4的正上方。即，環座2、基板搬送裝置3及拾取裝置4是以相互正交的方式配置。 The ring seat 2, the slurry coating device 5, and the substrate transfer device 3 are disposed around the rotary pick-up device 4. The ring seat 2, the slurry coating device 5, and the substrate transfer device 3 surround the pick-up device 4 from three directions of up and down and one side, the ring seat 2 is located on the side of the pick-up device 4, and the substrate transfer device 3 is located below the pick-up device 4. The slurry coating device 5 is located directly above the pickup device 4. That is, the ring seat 2, the substrate transfer device 3, and the pickup device 4 are arranged to be orthogonal to each other.
拾取裝置4是呈輻射狀包含多個保持半導體元件的保持部41，且使這些保持部41繞著輻射中心間歇性地每次旋轉規定角度。該黏晶機裝置1可以同時進行從貼片環提取半導體元件的拾取步驟、將黏著劑塗布在半導體元件的點膠步驟、及將半導體元件安裝在基板上的安裝步驟。 The pickup device 4 is a holding portion 41 that radially includes a plurality of holding semiconductor elements, and these holding portions 41 are intermittently rotated by a predetermined angle every time around the radiation center. The die bonder apparatus 1 can simultaneously perform a pickup step of extracting a semiconductor element from the patch ring, a dispensing step of applying an adhesive to the semiconductor element, and a mounting step of mounting the semiconductor element on the substrate.
(拾取裝置) (pickup device)
圖2是拾取裝置4的立體圖，圖3是拾取裝置4的側視圖。如圖2及3所示，保持部41是從圓形架的周緣朝向外側在半徑方向上呈輻射狀延伸，各保持部41在圓周均等分配位置上。保持部41的輻射面相對於設置面垂直。 2 is a perspective view of the pickup device 4, and FIG. 3 is a side view of the pickup device 4. As shown in FIGS. 2 and 3, the holding portion 41 radially extends from the peripheral edge of the circular frame toward the outside in the radial direction, and each of the holding portions 41 is equally distributed at the circumferential position. The radiation surface of the holding portion 41 is perpendicular to the installation surface.
保持部41的輻射中心嵌入在馬達42的旋轉軸。保持部 41是通過馬達42的驅動而在圓周方向上間歇性地每次轉動固定角度。保持部41的1節距的旋轉角度和與相鄰的保持部41的設置角度相等，將保持部41的圓軌跡上的頂點β、最低點ε、環座2側的最側點α、及其他任意一點γ及δ包含在停止位置內。 The radiation center of the holding portion 41 is embedded in the rotation shaft of the motor 42. The holding portion 41 is intermittently rotated by a fixed angle every time in the circumferential direction by the driving of the motor 42. The rotation angle of one pitch of the holding portion 41 is equal to the installation angle of the adjacent holding portion 41, and the vertex β at the circular locus of the holding portion 41, the lowest point ε , the most side point α on the ring seat 2 side, and Any other point γ and δ is included in the stop position.
最側點α是與環座2對向且從貼片環提取半導體元件的地點。頂點β是與漿料塗布裝置5對向且對半導體元件的安裝面塗布黏著劑的地點。最低點ε是與基板搬送裝置3對向且將塗布著黏著劑的半導體元件安裝在基板的地點。 The most side point α is a place where the ring element 2 faces and the semiconductor element is extracted from the patch ring. The vertex β is a place where the paste coating device 5 is opposed to the mounting surface of the semiconductor element. The lowest point ε is a point at which the semiconductor element coated with the adhesive is placed on the substrate facing the substrate transfer device 3.
地點γ是在保持部41的旋轉方向上位於較頂點β更靠下游側且較最低點ε更靠上游側，檢測對於半導體元件的黏著劑的塗布的地點，且配置有包含攝像機61與圖像處理裝置的檢測器件6。地點δ是位於較地點γ更靠下游側且較最低點ε更靠上游側，將沒有塗布黏著劑的半導體元件排出的地點，且配置有接收從保持部41脫落的半導體元件的容器。 The point γ is located on the downstream side of the apex β in the rotation direction of the holding portion 41 and on the upstream side from the lowest point ε , and detects the application of the adhesive to the semiconductor element, and is provided with the camera 61 and the image. The detection device 6 of the processing device. The point δ is a point on the downstream side of the point γ and on the upstream side from the lowest point ε , and the semiconductor element to which the adhesive is not applied is discharged, and a container that receives the semiconductor element that has fallen off from the holding unit 41 is disposed.
保持部41是例如吸嘴。如圖3所示，吸嘴41被包含致動器41b、凸輪機構41c及杆41d的噴嘴驅動部推拉。噴嘴驅動部設置在保持部41的背面側且與保持部41的圓軌跡上的頂點β、最低點ε及最側點α相對應的位置上。 The holding portion 41 is, for example, a suction nozzle. As shown in FIG. 3, the suction nozzle 41 is pushed and pulled by the nozzle drive unit including the actuator 41b, the cam mechanism 41c, and the rod 41d. The nozzle driving portion is provided on the back side of the holding portion 41 at a position corresponding to the vertex β , the lowest point ε, and the most side point α on the circular locus of the holding portion 41.
吸嘴41a是內部中空的管。管內部是經由軟管而與真空發生裝置的氣壓回路連通。該吸嘴41a是通過利用真空發生裝置產生負壓而吸附半導體元件，通過真空破壞而使半導體元件脫離。而且，如果使致動器41b作動而經由凸輪機構41c使杆41d 朝向吸嘴41a推出，則吸嘴41a在後端與杆41d的前端抵接而被擠壓，噴嘴前端朝著飛出的方向移動。如果利用致動器41b拉回杆41d，則吸嘴41a與杆41d的抵接被解除，噴嘴前端朝著返回到基端中心側的方向移動。 The suction nozzle 41a is a hollow tube inside. The inside of the tube is in communication with the pneumatic circuit of the vacuum generating device via a hose. The suction nozzle 41a sucks a semiconductor element by generating a negative pressure by a vacuum generating device, and detaches the semiconductor element by vacuum breakage. Moreover, if the actuator 41b is actuated, the rod 41d is made via the cam mechanism 41c. When the suction nozzle 41a is pushed out, the suction nozzle 41a is pressed against the front end of the rod 41d at the rear end and is pressed, and the tip end of the nozzle moves in the direction in which it flows. When the rod 41d is pulled back by the actuator 41b, the contact between the suction nozzle 41a and the rod 41d is released, and the tip end of the nozzle moves in the direction of returning to the center side of the base end.
(環座) (ring seat)
圖4是環座2的立體圖。如圖4所示，環座2的環保持面相對於設置面垂直且與保持部41的輻射面正交。即，環座2是在對於殼體10的設置面的垂直面包含供貼片環插入的環插入部21。將設置著該環插入部21的面稱為正面。 4 is a perspective view of the ring seat 2. As shown in FIG. 4, the ring holding surface of the ring seat 2 is perpendicular to the installation surface and orthogonal to the radiation surface of the holding portion 41. That is, the ring seat 2 includes a ring insertion portion 21 into which a patch ring is inserted in a vertical plane with respect to the installation surface of the casing 10. The surface on which the loop insertion portion 21 is provided is referred to as a front surface.
而且，環座2包含使環插入部21沿著殼體10的正面活動的環移動機構22、使環插入部21旋轉的環旋轉機構23、及設置在最側點α且從貼片環的背面側將半導體元件頂出的頂出銷24。 Further, the ring seat 2 includes a ring moving mechanism 22 that moves the ring insertion portion 21 along the front surface of the casing 10, a ring rotating mechanism 23 that rotates the ring inserting portion 21, and a ring rotating mechanism 23 that is disposed at the most side point α and from the patch ring. The ejector pin 24 that ejects the semiconductor element on the back side.
環插入部21包含2塊環形板21a、21b。一個環形板21a與環形板21b是設置間隙部21c而重叠。間隙部21c是為了插入貼片環而設置。從正面觀察時設在環形板21a、21b的中心的孔包含插入在間隙部21c的貼片環的晶片整體。 The ring insertion portion 21 includes two annular plates 21a and 21b. One annular plate 21a and the annular plate 21b are overlapped with the gap portion 21c. The gap portion 21c is provided to insert the patch ring. The hole provided at the center of the annular plates 21a and 21b when viewed from the front includes the entire wafer of the patch ring inserted in the gap portion 21c.
環移動機構22包含固定殼體10側的環形板21a的支持板22a及軌道22b、22c。在支持板22a的中心設置著從正面觀察時包含插入在間隙部21c的貼片環的晶片整體的孔。軌道22b、22c設置在支持板22a的背面。2種軌道22b、22c是以橫穿且縱貫殼體10的正面的方式延伸。如果支持板22a沿著軌道22b、22c滑 動，則固定在支持板22a的環插入部21在與殼體10的正面平行的面上二維移動。 The ring moving mechanism 22 includes a support plate 22a and rails 22b, 22c that fix the annular plate 21a on the side of the casing 10. A hole of the entire wafer including the patch ring inserted in the gap portion 21c when viewed from the front is provided at the center of the support plate 22a. The rails 22b, 22c are provided on the back surface of the support plate 22a. The two kinds of rails 22b and 22c extend so as to traverse and extend across the front surface of the casing 10. If the support plate 22a slides along the tracks 22b, 22c The ring insertion portion 21 fixed to the support plate 22a is moved two-dimensionally on a surface parallel to the front surface of the casing 10.
環旋轉部23包含固定在環插入部21的正時帶輪23a、捲繞在正時帶輪23a的皮帶23b、及使皮帶23b移行的馬達23c。正時帶輪23a具有與環插入部21為同心圓的環形狀，且在外周捲繞著皮帶23b。該環旋轉部23是通過使馬達23c旋轉，而使皮帶23b移行，伴隨著皮帶23b的移行使正時帶輪23a旋轉。環插入部21是與正時帶輪23a的旋轉連動地進行旋轉。 The ring rotating portion 23 includes a timing pulley 23a fixed to the ring insertion portion 21, a belt 23b wound around the timing pulley 23a, and a motor 23c for moving the belt 23b. The timing pulley 23a has a ring shape concentric with the ring insertion portion 21, and a belt 23b is wound around the outer circumference. The ring rotating portion 23 moves the belt 23b by rotating the motor 23c, and the timing pulley 23a rotates as the belt 23b moves. The ring insertion portion 21 is rotated in conjunction with the rotation of the timing pulley 23a.
頂出銷24是隨著朝向前端而越來越細的棒狀構件。該頂出銷24是以與位於最側點α的保持部41共用軸線的方式，設置在殼體10並朝向環插入部21的孔突出。頂出銷24的前端可以通過驅動機構而沿著延伸方向前進及後退，前進時，前進到將由擴展機構展開的貼片環的薄片推上去為止。 The ejector pin 24 is a rod-like member that becomes thinner as it goes toward the front end. The ejector pin 24 is provided on the casing 10 and protrudes toward the hole of the ring insertion portion 21 so as to be coaxial with the holding portion 41 located at the most side point α . The front end of the ejector pin 24 can be advanced and retracted in the extending direction by the driving mechanism, and proceeds to the state where the sheet of the patch ring developed by the expanding mechanism is pushed up.
(漿料塗布裝置) (slurry coating device)
圖5是漿料塗布裝置的立體圖。如圖5所示，漿料塗布裝置5在下部包含多個衝壓針51。衝壓針51是將黏著劑塗布在半導體元件的前端越來越細的棒狀構件。衝壓針51是配置在對向或圓周均等分配位置上，分別相對於設置面垂直地竪立，且越來越細的前端朝向拾取裝置4。在包含1對衝壓針51的情况下，兩衝壓針51是隔開180度間隔地配置。在包含4根衝壓針51的情况下，衝壓針51是隔開90度間隔地配置。 Fig. 5 is a perspective view of a slurry coating device. As shown in FIG. 5, the slurry coating device 5 includes a plurality of punching pins 51 at the lower portion. The press pin 51 is a rod-shaped member in which an adhesive is applied to a tip end of the semiconductor element to be thinner. The punching needles 51 are disposed at the opposite or circumferentially equally distributed positions, respectively erected vertically with respect to the set surface, and the increasingly thin front end faces the pick-up device 4. In the case where one pair of press pins 51 is included, the two press pins 51 are arranged at intervals of 180 degrees. In the case where four press pins 51 are included, the press pins 51 are arranged at intervals of 90 degrees.
各衝壓針51可以升降地支持在各臂52的前端。各臂52 是長度相同，具有共用的基端，從該基端呈輻射狀延伸且相對於設置面平行。臂52的基端樞轉支承在馬達53的旋轉軸。馬達53是以與衝壓針51的配置間隔相同的旋轉角度，與拾取裝置4的旋轉同步地間歇性地進行旋轉。 Each of the press pins 51 is supported at the front end of each arm 52 so as to be movable up and down. Each arm 52 They are of the same length and have a common base end extending radially from the base end and parallel to the set surface. The base end of the arm 52 is pivotally supported on the rotating shaft of the motor 53. The motor 53 is intermittently rotated in synchronization with the rotation of the pickup device 4 at the same rotation angle as that of the press needle 51.
該衝壓針51是以描繪共用的圓軌跡的方式間歇性地每次旋轉規定旋轉角度，且至少在兩地點Pa、Pb停止。停止地點Pa設定為與拾取裝置4的頂點β重合，在停止地點Pa停止的衝壓針51的越來越細的前端與在頂點β停止的保持部41的前端共用軸線而相對。在停止地點Pb設置著接盤54。在接盤54中貯存著黏著劑。停止在停止地點Pb的衝壓針51位於該接盤54的正上方。 The punching needle 51 intermittently rotates a predetermined rotation angle every time so as to draw a common circular trajectory, and stops at at least two points Pa and Pb. The stop point Pa is set to coincide with the apex β of the pickup device 4, and the thinner tip end of the press needle 51 stopped at the stop point Pa is opposed to the front end of the holding portion 41 where the apex β is stopped. A tray 54 is provided at the stop point Pb. An adhesive is stored in the tray 54. The press pin 51 stopped at the stop point Pb is located directly above the land 54.
在停止地點Pa及Pb分別配置著銷驅動部。銷驅動部是在衝壓針51的上方包含致動器51a、凸輪機構51b及杆51c，在臂52內包含朝向上方對衝壓針51施力的彈簧構件。杆的下端是與停止在停止位置Pa及Pb的衝壓針51的上端共用軸線而相對。 A pin drive unit is disposed at each of the stop points Pa and Pb. The pin drive unit includes an actuator 51a, a cam mechanism 51b, and a rod 51c above the press needle 51, and the arm 52 includes a spring member that biases the press needle 51 upward. The lower end of the rod is opposed to the common axis of the upper end of the press pin 51 stopped at the stop positions Pa and Pb.
該銷驅動部是使致動器51a驅動，使凸輪機構51b將該驅動力向杆51c傳遞，將杆51c往下壓，由此將衝壓針51往下壓。而且，銷驅動部是通過使杆51c上升，而將衝壓針51從經由杆51c的負荷解放出來，並且利用彈簧構件的作用力使衝壓針51上升。 The pin driving unit drives the actuator 51a to cause the cam mechanism 51b to transmit the driving force to the rod 51c, and presses the rod 51c downward, thereby pressing the pressing needle 51 downward. Further, the pin driving portion lifts the pressing needle 51 from the load passing through the rod 51c by raising the rod 51c, and raises the pressing needle 51 by the urging force of the spring member.
通過利用該銷驅動部的升降，衝壓針51是在停止地點Pb將越來越細的前端浸在接盤54內的黏著劑中，且在停止地點Pa對拾取裝置4的位於頂點的保持部41保持的半導體元件的安裝面塗布黏著劑。 By using the lifting and lowering of the pin driving portion, the punching needle 51 is immersed in the adhesive in the tray 54 at the stop point Pb, and the holding portion of the picking device 4 at the apex at the stop point Pa. The mounting surface of the semiconductor element held by 41 is coated with an adhesive.
(基板搬送裝置) (substrate transfer device)
圖6是基板搬送裝置3的立體圖。如圖6所示，基板搬送裝置3包含配置在環座2的兩旁的一對匣盒31、32、及將匣盒31、32間橋接且通過拾取裝置4的正下方的搬送線。在其中一個匣盒31中重叠地收納多個未安裝半導體元件的基板。在另一個匣盒32中收納已安裝半導體元件的基板。 FIG. 6 is a perspective view of the substrate transfer device 3. As shown in FIG. 6, the substrate transfer device 3 includes a pair of cassettes 31 and 32 disposed on both sides of the ring holder 2, and a transfer line that bridges between the cassettes 31 and 32 and passes directly under the pickup device 4. A plurality of substrates on which semiconductor elements are not mounted are stacked and stacked in one of the cassettes 31. The substrate on which the semiconductor element is mounted is housed in another cassette 32.
搬送線是由輸送機部33與基板保持部34構成。輸送機部33與基板保持部34是以埋入匣盒31、32間的方式連續地配置。收納未安裝半導體元件的基板的匣盒31、輸送機部33、基板保持部34、及收納已安裝半導體元件的基板的匣盒32按照該順序連接地配置。 The conveyance line is constituted by the conveyor unit 33 and the substrate holding unit 34. The conveyor unit 33 and the substrate holding unit 34 are continuously disposed so as to be buried between the cassettes 31 and 32. The cassette 31 accommodating the substrate on which the semiconductor element is not mounted, the conveyor unit 33, the substrate holding portion 34, and the cassette 32 accommodating the substrate on which the semiconductor element is mounted are arranged in this order.
輸送機部33是平行地配置著2根導軌，且在兩導軌的內側包含環形皮帶。該輸送機部33使皮帶從其中一個匣盒31朝向基板保持部34移行。該輸送機部33可以利用驅動機構而上下移動，在規定的高度與基板保持部34的高度一致。以輸送機部33的皮帶上表面的高度與基板保持部34的載置台的高度一致時輸送機部33與基板保持部34大體上連接的方式設定輸送機部33的長度。此外，輸送機部33並不限定於帶式輸送機方式，也可以利用搬送爪同時搬送2塊。 The conveyor unit 33 has two guide rails arranged in parallel, and an endless belt is included inside the two guide rails. The conveyor portion 33 moves the belt from one of the cassettes 31 toward the substrate holding portion 34. The conveyor unit 33 can be moved up and down by a drive mechanism, and can match the height of the substrate holding portion 34 at a predetermined height. When the height of the upper surface of the belt of the conveyor portion 33 matches the height of the mounting table of the substrate holding portion 34, the length of the conveyor portion 33 is set such that the conveyor portion 33 and the substrate holding portion 34 are substantially connected. Further, the conveyor unit 33 is not limited to the belt conveyor system, and two pieces may be simultaneously conveyed by the transport claws.
基板保持部34是載置一塊基板的寬度的XY平臺，可以利用未圖示的驅動機構而在高度固定的二維方向上移動。基板保持部34能够移動的範圍是以保持在基板保持部34的基板的各安 裝部位可以通過朝向正下方的保持部41的正下面的方式設定。基板保持部34二維移動時，輸送機部33預先上升，成為不存在基板保持部34與輸送機部33的物理接觸的狀態。 The substrate holding portion 34 is an XY stage on which the width of one substrate is placed, and can be moved in a two-dimensional direction in which the height is fixed by a drive mechanism (not shown). The range in which the substrate holding portion 34 can move is the security of the substrate held by the substrate holding portion 34. The mounting portion can be set so as to face directly below the holding portion 41 directly below. When the substrate holding portion 34 moves two-dimensionally, the conveyor portion 33 rises in advance, and there is no state in which the substrate holding portion 34 and the conveyor portion 33 are in physical contact.
在該基板保持部34設置著基板的位置傳感器與基板的定位機構。位置傳感器是在由輸送機部33搬送的一塊基板位於規定部位的情况下輸出偵測信號。定位機構是例如在載置面開口且與真空發生裝置連接的孔，以所保持的基板不發生位置偏移的方式吸附。 The substrate holding portion 34 is provided with a position sensor of the substrate and a positioning mechanism of the substrate. The position sensor outputs a detection signal when one of the substrates conveyed by the conveyor unit 33 is located at a predetermined portion. The positioning mechanism is, for example, a hole that is opened on the mounting surface and connected to the vacuum generating device, and is adsorbed so that the held substrate does not shift in position.
(動作) (action)
(安裝動作) (installation action)
關於該黏晶機裝置1的動作，尤其是關於從半導體元件的取出到安裝為止的動作，根據圖7至11詳細地進行說明。首先，預先在環插入部21中插入貼片環R，在基板保持部34載置安裝半導體元件D的基板F1。 The operation of the die bonder device 1, in particular, the operation from the removal of the semiconductor element to the mounting, will be described in detail with reference to Figs. First, the patch ring R is inserted into the ring insertion portion 21 in advance, and the substrate F1 on which the semiconductor element D is mounted is placed on the substrate holding portion 34.
如果設置了貼片環R及基板F1，則如圖7所示，與頂出銷24相對的位於最側點α的保持部41A提取位於正面的半導體元件D1。 When the patch ring R and the substrate F1 are provided, as shown in FIG. 7, the holding portion 41A at the most side point α opposed to the ejector pin 24 extracts the semiconductor element D1 located on the front surface.
即，保持部41A的吸嘴41a是利用噴嘴驅動部朝向半導體元件D1進入而與半導體元件D1抵接。此外，也可以使吸嘴41a進入到將半導體元件D1略微壓入的程度為止。使吸嘴41a抵接於半導體元件D1時，使頂出銷24朝向貼片環R前進，利用吸嘴41a與頂出銷24夾入半導體元件D1。此時，吸嘴41a是通過利用真 空發生裝置產生負壓而吸附所夾入的半導體元件D1。然後，利用頂出銷24將半導體元件D1頂出，並且使吸嘴41a在吸附著半導體元件D1的狀態下後退。 In other words, the nozzle 41a of the holding portion 41A enters the semiconductor element D1 by the nozzle driving portion and comes into contact with the semiconductor element D1. Further, the suction nozzle 41a may be brought into a state where the semiconductor element D1 is slightly pressed in. When the suction nozzle 41a is brought into contact with the semiconductor element D1, the ejector pin 24 is advanced toward the patch ring R, and the semiconductor element D1 is sandwiched between the suction nozzle 41a and the ejector pin 24. At this time, the suction nozzle 41a is utilized by using The empty generating device generates a negative pressure to adsorb the sandwiched semiconductor element D1. Then, the semiconductor element D1 is ejected by the ejector pin 24, and the suction nozzle 41a is retracted in a state in which the semiconductor element D1 is adsorbed.
其次，如圖8所示，保持部41每次旋轉1節距，保持著半導體元件D1的保持部41A在頂點β停止時，漿料塗布裝置5對使安裝面朝上而停止的該半導體元件D1塗布黏著劑。 Next, as shown in FIG. 8, the holding portion 41 is rotated by one pitch, and the holding portion 41A of the semiconductor element D1 is held at the apex β , and the slurry coating device 5 stops the semiconductor element with the mounting surface facing upward. D1 is coated with an adhesive.
圖9是表示漿料塗布裝置5的詳細動作的局部放大圖。此處，如圖9所示，在漿料塗布裝置5中，與利用拾取裝置4的保持部41的間歇旋轉同步地使衝壓針51間歇旋轉。然後，依次使各衝壓針51停止在停止位置Pb，由此使接盤54內的黏著劑附著在前端，在規定節距後使各衝壓針51停止在停止位置Pa，由此對拾取裝置4的位於頂點β的保持部41保持的半導體元件D1塗布黏著劑。 FIG. 9 is a partial enlarged view showing a detailed operation of the slurry coating device 5. Here, as shown in FIG. 9, in the slurry application device 5, the press needle 51 is intermittently rotated in synchronization with the intermittent rotation of the holding portion 41 of the pickup device 4. Then, each of the press pins 51 is sequentially stopped at the stop position Pb, whereby the adhesive in the land 54 is adhered to the tip end, and after each predetermined pitch, each of the press pins 51 is stopped at the stop position Pa, thereby the pickup device 4 The semiconductor element D1 held by the holding portion 41 located at the vertex β is coated with an adhesive.
即，與保持部41A停止在頂點β同步地位於停止位置Pa的衝壓針51A是在2節距前在停止位置Pb浸在接盤54內的黏著劑中，而黏著劑附著在其前端。該衝壓針51A是利用銷驅動部朝向半導體元件D1壓入，使附著在衝壓針51A的前端的黏著劑附著在半導體元件D1的安裝面。 That is, the press pin 51A which is located at the stop position Pa in synchronization with the holding portion 41A at the apex β is immersed in the adhesive in the tray 54 at the stop position Pb before the two pitches, and the adhesive adheres to the tip end thereof. The press pin 51A is press-fitted toward the semiconductor element D1 by the pin drive portion, and the adhesive adhering to the tip end of the press pin 51A adheres to the mounting surface of the semiconductor element D1.
如果利用銷驅動部使衝壓針51A再次上升，則因由於衝壓針51A的前端面積與半導體元件D1的安裝面的面積不同而產生的黏著劑的附著力的差异，附著在衝壓針51A的前端的黏著劑向半導體元件D1的安裝面側轉移。 When the press pin 51A is raised again by the pin driving portion, the difference in the adhesion force of the adhesive due to the difference in the area of the tip end of the press pin 51A and the mounting surface of the semiconductor element D1 adheres to the tip end of the press pin 51A. The adhesive is transferred to the mounting surface side of the semiconductor element D1.
在該衝壓針51A的一連串黏著劑塗布處理的期間，停止在停止位置Pb上的其他衝壓針51B是通過配置在停止位置Pb上的銷驅動部升降而在前端保持黏著劑。該衝壓針51B是在2節距後進行與衝壓針51A相同的黏著劑塗布處理，對在2節距後停止在頂點β的其他半導體元件D的安裝面塗布黏著劑。 During the series of adhesive application processing of the press needle 51A, the other press pin 51B stopped at the stop position Pb is lifted and lowered by the pin drive unit disposed at the stop position Pb to hold the adhesive at the tip end. The punching needle 51B is subjected to the same adhesive coating treatment as the press needle 51A after two pitches, and applies an adhesive to the mounting surface of the other semiconductor element D which is stopped at the vertex β after two pitches.
接下來，如圖10所示，保持部41每次旋轉1節距，保持著半導體元件D1的保持部41A在地點γ停止時，利用檢測器件6的攝像機61觀察半導體元件D1的安裝面，通過圖像處理檢測有無黏著劑。此外，如圖11所示，保持部41A從地點γ旋轉1節距而該保持部41A在地點δ停止時，將利用檢測器件6檢測出沒有黏著劑的半導體元件從黏晶機裝置1排出。具體來說，在保持部41包含吸嘴41a的情况下，通過真空破壞使半導體元件從吸嘴41a脫落。 Subsequently, as shown in FIG 10, the holding portion 41 is rotated one pitch, maintaining the camera 61 to observe the semiconductor element mounting surface of the holding portion D1 of the semiconductor element 41A at locations D1 γ stopped by the detecting means 6 by Image processing detects the presence or absence of an adhesive. Further, as shown in FIG. 11, when the holding portion 41A is rotated by one pitch from the point γ and the holding portion 41A is stopped at the point δ , the semiconductor device that detects the absence of the adhesive by the detecting device 6 is discharged from the die bonder device 1. Specifically, when the holding portion 41 includes the suction nozzle 41a, the semiconductor element is detached from the suction nozzle 41a by vacuum breakage.
此外，如圖12所示，保持部41每次旋轉1節距，保持著半導體元件D1的保持部41A在最低點ε停止時，保持部41A將半導體元件D1貼附在載置在基板保持部34的基板F1的相應的安裝部位。 Further, as shown in FIG. 12, when the holding portion 41 is rotated by one pitch and the holding portion 41A of the semiconductor element D1 is held at the lowest point ε , the holding portion 41A attaches the semiconductor element D1 to the substrate holding portion. The corresponding mounting portion of the substrate F1 of 34.
即，保持部41A的吸嘴41a是在將半導體元件D1保持在前端的狀態下利用噴嘴驅動部向基板進入。此時，因在半導體元件D1塗布著黏著劑，所以，不用確認半導體元件D1與黏著劑的位置關係而進行位置修正。 In other words, the suction nozzle 41a of the holding portion 41A enters the substrate by the nozzle driving portion while holding the semiconductor element D1 at the tip end. At this time, since the adhesive is applied to the semiconductor element D1, the positional correction is performed without confirming the positional relationship between the semiconductor element D1 and the adhesive.
半導體元件D1接觸於基板F1時，利用噴嘴驅動部施加 一定程度的負荷，以提高密接性。然後，通過真空破壞使半導體元件D1從吸嘴41a脫離，使保持部41A上升。 When the semiconductor element D1 is in contact with the substrate F1, it is applied by the nozzle driving portion. A certain degree of load to improve the adhesion. Then, the semiconductor element D1 is detached from the suction nozzle 41a by vacuum destruction, and the holding portion 41A is raised.
此外，如圖12所示，保持部41A將半導體元件D1安裝在基板F1時，在最側點α，另一保持部41B將另一半導體元件D2取出，在頂點β，漿料塗布裝置5對另一半導體元件D3的安裝面塗布黏著劑，在地點γ，檢測器件6對另一半導體元件D4檢測有無黏著劑，在地點δ，如果另一半導體元件D5上沒有塗布黏著劑則將該半導體元件D5排出。 Further, as shown in FIG. 12, when the holding portion 41A mounts the semiconductor element D1 on the substrate F1, the other holding portion 41B takes out the other semiconductor element D2 at the most side point α , and at the vertex β , the slurry applying device 5 pairs The mounting surface of the other semiconductor element D3 is coated with an adhesive. At the point γ , the detecting device 6 detects the presence or absence of an adhesive on the other semiconductor element D4 at the point δ . If the other semiconductor element D5 is not coated with an adhesive, the semiconductor element is applied. D5 is discharged.
(作用效果) (Effect)
如以上說明所述，本實施方式的黏晶機裝置1包含環座2、漿料塗布裝置5、基板搬送裝置3及旋轉式的拾取裝置4。環座2保持貼片環R。漿料塗布裝置5塗布黏著劑。基板搬送裝置3保持及搬送基板。拾取裝置4是將可以裝卸半導體元件D的保持部41配置成輻射狀而構成，且使該保持部41繞著輻射中心每次旋轉規定角度。 As described above, the die bonder apparatus 1 of the present embodiment includes the ring holder 2, the slurry application device 5, the substrate transfer device 3, and the rotary pickup device 4. The ring seat 2 holds the patch ring R. The slurry coating device 5 applies an adhesive. The substrate transfer device 3 holds and transports the substrate. The pickup device 4 is configured by arranging the holding portion 41 that can detach the semiconductor element D in a radial shape, and rotates the holding portion 41 by a predetermined angle around the radiation center.
而且，環座2、漿料塗布裝置5及基板搬送裝置3配置在拾取裝置4的周圍。拾取裝置4是通過旋轉，在同一時間，使多個保持部41中的一架與環座2的貼片環R相對，使多個保持部41中的另一架與漿料塗布裝置5相對，且使多個保持部41中的又一架與基板搬送裝置3相對。漿料塗布裝置5是對從貼片環R取出並保持在保持部41的半導體元件的安裝面塗布黏著劑。 Further, the ring seat 2, the slurry coating device 5, and the substrate transfer device 3 are disposed around the pickup device 4. The pickup device 4 rotates, and at the same time, one of the plurality of holding portions 41 faces the patch ring R of the ring seat 2, and the other of the plurality of holding portions 41 is opposed to the slurry coating device 5 Further, one of the plurality of holding portions 41 is opposed to the substrate transfer device 3. The slurry application device 5 applies an adhesive to a mounting surface of a semiconductor element taken out from the patch ring R and held by the holding portion 41.
圖13是表示利用如所述般的黏晶機裝置1塗布的黏著劑 的狀態的圖。圖13的(a)表示適量的黏著劑B塗布在半導體元件D的安裝面的情况。如圖13的(a)所示，適量的黏著劑B塗布在半導體元件D的安裝面的情况下，在半導體元件D與基板F之間黏著劑B不易到達半導體元件D的側面上露出的接點J。 Figure 13 is a view showing an adhesive applied by the die bonder device 1 as described above. Diagram of the state. (a) of FIG. 13 shows a case where an appropriate amount of the adhesive B is applied to the mounting surface of the semiconductor element D. As shown in FIG. 13(a), when an appropriate amount of the adhesive B is applied to the mounting surface of the semiconductor element D, the adhesive B does not easily reach the exposed side of the semiconductor element D between the semiconductor element D and the substrate F. Point J.
圖13的(b)表示塗布黏著劑時產生拉絲的情况。如圖13的(b)所示，因黏著劑B塗布在半導體元件D的安裝面，所以，拉絲部分朝向半導體元件D的下方延伸。因此，將半導體元件D安裝在基板F時，拉絲部分在半導體元件D與基板F之間被壓扁，而拉絲部分不易到達半導體元件D的側面上露出的接點J。 Fig. 13 (b) shows the case where the drawing is generated when the adhesive is applied. As shown in FIG. 13(b), since the adhesive B is applied to the mounting surface of the semiconductor element D, the wire drawing portion extends downward from the semiconductor element D. Therefore, when the semiconductor element D is mounted on the substrate F, the wire drawing portion is crushed between the semiconductor element D and the substrate F, and the wire drawing portion is less likely to reach the contact J exposed on the side surface of the semiconductor element D.
而且，圖13的(c)表示過量的黏著劑塗布在半導體元件D的安裝面的情况。如圖13的(c)所示，明確如下情况：在半導體元件側塗布著黏著劑B的情况下，過量的黏著劑在半導體元件D與基板F之間被壓扁而橫向擴散，其厚度變薄。因此，黏著劑B不易到達半導體元件D的側面上露出的接點J。 Moreover, (c) of FIG. 13 shows a case where an excessive amount of the adhesive is applied to the mounting surface of the semiconductor element D. As shown in (c) of FIG. 13, it is clarified that when the adhesive B is applied to the semiconductor element side, an excessive amount of the adhesive is flattened between the semiconductor element D and the substrate F to be laterally diffused, and the thickness thereof is changed. thin. Therefore, the adhesive B does not easily reach the contact J exposed on the side surface of the semiconductor element D.
如果像這樣在半導體元件側塗布黏著劑之後安裝在基板上，則不管是塗布黏著劑時產生拉絲部分，還是塗布過量的黏著劑，安裝基板時黏著劑均不易到達半導體元件的側面上露出的接點。因此，即使不進行高精度的黏著劑塗布控制，也可以實施可靠性優异的黏片處理，可以實現黏片處理的整體的高速化，而提高生產效率。 If the adhesive is applied to the substrate after the application of the adhesive on the semiconductor element side, the drawn portion is applied when the adhesive is applied, or an excessive amount of the adhesive is applied. When the substrate is mounted, the adhesive does not easily reach the exposed side of the semiconductor element. point. Therefore, even if high-precision adhesive application control is not performed, it is possible to carry out the adhesive sheet treatment excellent in reliability, and it is possible to increase the overall speed of the adhesive sheet processing and improve the production efficiency.
而且，因可以同時進行半導體元件D的拾取、黏著劑的塗布及安裝，所以，可以提高生產率。此外，因黏著劑B已經塗 布在半導體元件D側，所以，不用像在基板側塗布著黏著劑B的情况那樣，確認黏著劑B的塗布位置與半導體元件D的安裝位置的位置關係，進行所需的修正，因此，可進一步提高生產效率。 Further, since the pickup of the semiconductor element D and the application and mounting of the adhesive can be performed at the same time, the productivity can be improved. In addition, since the adhesive B has been coated Since it is disposed on the side of the semiconductor element D, it is not necessary to confirm the positional relationship between the application position of the adhesive B and the mounting position of the semiconductor element D as in the case where the adhesive B is applied to the substrate side, and the necessary correction is performed. Further improve production efficiency.
而且，在該黏晶機裝置1中，拾取裝置4是以保持部41的輻射面垂直的方式設置，漿料塗布裝置5配置在拾取裝置4的正上方，並且對使安裝面朝上的半導體元件D從上方塗布黏著劑B。 Further, in the die bonder device 1, the pickup device 4 is disposed such that the radiation surface of the holding portion 41 is perpendicular, and the slurry coating device 5 is disposed directly above the pickup device 4, and the semiconductor having the mounting surface facing upward The component D is coated with the adhesive B from above.
以使保持部41的輻射面垂直的方式設置的拾取裝置4與對半導體元件的安裝面塗布黏著劑B的漿料塗布裝置5的親和性非常高，可以在從晶片取出半導體元件D之後不進行翻轉處理的情况下對半導體元件D的安裝面塗布黏著劑B。 The pickup device 4 provided such that the radiation surface of the holding portion 41 is perpendicular to the slurry coating device 5 to which the adhesive agent B is applied to the mounting surface of the semiconductor element has a very high affinity, and can be omitted after the semiconductor element D is taken out from the wafer. In the case of the inversion process, the adhesive B is applied to the mounting surface of the semiconductor element D.
而且，在漿料塗布裝置5為利用衝壓針51塗布黏著劑B的方式的情况下，衝壓針51從接盤54接受黏著劑B之後，移動固定距離到達與拾取裝置4的位於頂點的保持部41共用軸線的固定位置即可。因此，從接盤54接受黏著劑B到塗布黏著劑B的平均時間大幅度縮短，而可以提高生產率。而且，因始終是移動固定距離到達固定位置即可，所以，衝壓針51的移動精度變高，可以使良率提升。 Further, when the slurry application device 5 is a method in which the adhesive B is applied by the press needle 51, the press pin 51 receives the adhesive B from the land 54, and then moves the fixed distance to reach the holding portion at the apex of the pickup device 4. 41 The fixed position of the common axis can be. Therefore, the average time for receiving the adhesive B from the tray 54 to the application of the adhesive B is greatly shortened, and productivity can be improved. Further, since it is only necessary to move the fixed distance to reach the fixed position, the movement accuracy of the press needle 51 is increased, and the yield can be improved.
而且，在本實施方式中，漿料塗布裝置5是將多個衝壓針51配置在對向或圓周均等分配位置上，且包含貯存著黏著劑B的接盤54，通過使衝壓針51沿著共用圓周軌跡每次旋轉規定角度，依次使各衝壓針51位於接盤54，依次使各衝壓針51與拾取 裝置4的位於頂點的保持部41共用軸線而相對。由此，為了將黏著劑塗布1次，不在黏著劑B的接受位置與塗布位置之間往返而單程移動即可，因此，黏著劑B的接受到塗布的時間進一步縮短，可以進一步提高生產率。 Further, in the present embodiment, the slurry application device 5 is configured such that a plurality of press pins 51 are disposed at an opposite or circumferentially equally distributed position, and includes a pad 54 in which the adhesive B is stored, by which the press pin 51 is placed Each of the common circumferential trajectories is rotated by a predetermined angle, and each of the punching pins 51 is sequentially placed on the susceptor 54 to sequentially press the respective punching pins 51 and pick up The holding portions 41 of the device 4 located at the apex are opposed to each other with an axis. Therefore, in order to apply the adhesive once, it is not necessary to move back and forth between the receiving position and the application position of the adhesive B in a single pass. Therefore, the time until the application of the adhesive B to the coating is further shortened, and the productivity can be further improved.
此外，即使為從噴嘴噴出黏著劑B的噴射器方式的漿料塗布裝置5，也可以將該漿料塗布裝置5配置在拾取裝置4的正上方，對使安裝面朝上的半導體元件D從上方塗布黏著劑。由此，環座2、漿料塗布裝置5、基板搬送裝置3及拾取裝置4的配置關係控制得緊凑，有助於裝置的小型化，並且半導體元件D在各步驟中的移動距離也縮短，可以進一步提高生產率。 Further, even in the ejector-type slurry application device 5 that ejects the adhesive B from the nozzle, the slurry application device 5 can be disposed directly above the pickup device 4, and the semiconductor element D having the mounting surface facing upward can be Apply adhesive on top. Thereby, the arrangement relationship of the ring seat 2, the slurry application device 5, the substrate transfer device 3, and the pickup device 4 is controlled to be compact, which contributes to miniaturization of the device, and the moving distance of the semiconductor element D in each step is also shortened. Can further increase productivity.
此外，也可以設置成：環座2的貼片環保持面、基板搬送裝置3的基板保持面及配置在拾取裝置4的保持部41延伸的面以相互正交的方式配置，漿料塗布裝置5配置成隔著拾取裝置4與基板搬送裝置3相對。由此，有助於裝置的進一步小型化，並且半導體元件D在各步驟中的移動距離也進一步縮短，可以進一步提高生產率。 In addition, the patch ring holding surface of the ring seat 2, the substrate holding surface of the substrate transfer device 3, and the surface on which the holding portion 41 of the pickup device 4 extends may be disposed to be orthogonal to each other, and the slurry coating device may be disposed. The fifth portion 5 is disposed to face the substrate transfer device 3 via the pickup device 4. Thereby, further miniaturization of the apparatus is facilitated, and the moving distance of the semiconductor element D in each step is further shortened, and productivity can be further improved.
而且，在本實施方式中，在拾取裝置4的周圍包含觀察半導體元件D的安裝面而檢測有無黏著劑的檢測器件6。由此，不會將沒有塗布黏著劑B的半導體元件D安裝在基板上，而良率提升。在此情况下，在拾取裝置4的周圍更包含將沒有塗布黏著劑B的半導體元件D排出的排出位置即可。 Further, in the present embodiment, the periphery of the pickup device 4 includes a detecting device 6 that detects the presence or absence of an adhesive on the mounting surface of the semiconductor element D. Thereby, the semiconductor element D to which the adhesive B is not applied is not mounted on the substrate, and the yield is improved. In this case, the discharge position of the semiconductor element D to which the adhesive B is not applied may be further included around the pickup device 4.
(其他實施方式) (Other embodiments)
像以上說明那樣對本發明的實施方式進行了說明，可在不脫離發明的主旨的範圍內進行多種省略、替換、變更。而且，該實施方式或其變形包含在發明的範圍或主旨內，並且包含在申請專利範圍記載的發明及其均等的範圍內。 The embodiments of the present invention have been described as described above, and various omissions, substitutions and changes may be made without departing from the scope of the invention. Further, the embodiment or its modifications are included in the scope and spirit of the invention, and are included in the scope of the invention described in the claims.
例如，作為漿料塗布裝置5，采用了使用衝壓針51的銷轉印方式，但也可以應用利用氣壓或機械壓力使裝在注射器中的液體從噴嘴的前端噴出的分配器方式。 For example, although the pin transfer method using the press needle 51 is employed as the slurry application device 5, a dispenser method in which the liquid contained in the syringe is ejected from the tip end of the nozzle by air pressure or mechanical pressure may be applied.
1‧‧‧黏晶機裝置 1‧‧‧Crystal machine
2‧‧‧環座 2‧‧‧ ring seat
3‧‧‧基板搬送裝置 3‧‧‧Substrate transport device
4‧‧‧拾取裝置 4‧‧‧ picking device
5‧‧‧漿料塗布裝置 5‧‧‧Slurry coating device
10‧‧‧殼體 10‧‧‧shell
41‧‧‧保持部 41‧‧‧ Keeping Department
Claims (7)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2012/081410 WO2014087489A1 (en) | 2012-12-04 | 2012-12-04 | Die bonder device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201423877A TW201423877A (en) | 2014-06-16 |
| TWI591738B true TWI591738B (en) | 2017-07-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW102144493A TWI591738B (en) | 2012-12-04 | 2013-12-04 | Die bonding apparatus |
Country Status (6)
| Country | Link |
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| JP (1) | JP5777261B2 (en) |
| CN (1) | CN103975425B (en) |
| HK (1) | HK1200976A1 (en) |
| MY (1) | MY162038A (en) |
| TW (1) | TWI591738B (en) |
| WO (1) | WO2014087489A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6181108B2 (en) * | 2014-06-19 | 2017-08-16 | アキム株式会社 | Assembly apparatus and assembly method |
| KR102449536B1 (en) * | 2015-08-10 | 2022-09-30 | ㈜큐엠씨 | Apparatus for sorting electronic device |
| JP5975556B1 (en) * | 2015-12-11 | 2016-08-23 | 上野精機株式会社 | Transfer equipment |
| MY191024A (en) * | 2016-04-27 | 2022-05-29 | Mit Semiconductor Pte Ltd | Transfer system for flipping and multiple checking of electronic devices |
| JP6164624B1 (en) * | 2016-10-18 | 2017-07-19 | 上野精機株式会社 | Electronic component moving device and electronic component conveying device |
| KR101826522B1 (en) | 2016-11-30 | 2018-03-22 | 원호 | Wafer sorting equipment |
| CN109638150B (en) * | 2018-10-22 | 2023-05-02 | 武汉纺织大学 | Automatic dispensing and mounting machine for piezoelectric wafer of ultrasonic probe |
| CN111916375B (en) * | 2020-08-12 | 2024-03-26 | 深圳市诺泰芯装备有限公司 | Rotary chip glue-free die bonder |
| CN115318552B (en) * | 2022-07-15 | 2024-01-30 | 济南金威刻激光科技股份有限公司 | Adhesive smearing device for invisible semiconductor cutting |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02239636A (en) * | 1989-03-13 | 1990-09-21 | Fujitsu Ltd | Diebonding device |
| JPH10308403A (en) * | 1997-05-06 | 1998-11-17 | Fujitsu Ltd | Method and equipment for manufacturing semiconductor device |
| JP2006513565A (en) * | 2003-01-16 | 2006-04-20 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | Chip transfer method and apparatus |
| DE102010031939B4 (en) * | 2010-07-22 | 2012-05-24 | Asm Assembly Systems Gmbh & Co. Kg | Dispenser system for a placement machine, placement machine and method for applying a dispensing medium to components |
-
2012
- 2012-12-04 WO PCT/JP2012/081410 patent/WO2014087489A1/en active Application Filing
- 2012-12-04 CN CN201280027247.1A patent/CN103975425B/en not_active Expired - Fee Related
- 2012-12-04 MY MYPI2013702337A patent/MY162038A/en unknown
- 2012-12-04 JP JP2013554701A patent/JP5777261B2/en not_active Expired - Fee Related
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2013
- 2013-12-04 TW TW102144493A patent/TWI591738B/en not_active IP Right Cessation
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2015
- 2015-02-04 HK HK15101231.0A patent/HK1200976A1/en unknown
Also Published As
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|---|---|
| MY162038A (en) | 2017-05-31 |
| HK1200976A1 (en) | 2015-08-14 |
| TW201423877A (en) | 2014-06-16 |
| JPWO2014087489A1 (en) | 2017-01-05 |
| JP5777261B2 (en) | 2015-09-09 |
| WO2014087489A1 (en) | 2014-06-12 |
| CN103975425A (en) | 2014-08-06 |
| CN103975425B (en) | 2017-11-14 |
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