TW201614763A - Devices for methodologies for debonding and handling semiconductor wafers - Google Patents

Devices for methodologies for debonding and handling semiconductor wafers

Info

Publication number
TW201614763A
TW201614763A TW105100597A TW105100597A TW201614763A TW 201614763 A TW201614763 A TW 201614763A TW 105100597 A TW105100597 A TW 105100597A TW 105100597 A TW105100597 A TW 105100597A TW 201614763 A TW201614763 A TW 201614763A
Authority
TW
Taiwan
Prior art keywords
methodologies
debonding
devices
wafer
handling
Prior art date
Application number
TW105100597A
Other languages
Chinese (zh)
Other versions
TWI584406B (en
Inventor
Steve Canale
David Zapp
Daniel E Sanchez
Hung V Phan
Hyong Y Lee
Jens A Riege
Elena B Woodard
Daniel K Berkoh
Original Assignee
Skyworks Solutions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/898,648 external-priority patent/US8758553B2/en
Priority claimed from US12/898,627 external-priority patent/US8888085B2/en
Priority claimed from US12/898,623 external-priority patent/US8758552B2/en
Application filed by Skyworks Solutions Inc filed Critical Skyworks Solutions Inc
Publication of TW201614763A publication Critical patent/TW201614763A/en
Application granted granted Critical
Publication of TWI584406B publication Critical patent/TWI584406B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer

Abstract

Disclosed are systems, devices and methodologies for debonding wafers from carrier plates and handling of debonded wafers. In certain wafer processing operations, it is desirable to temporarily mount a wafer on a carrier plate for support and ease of handling. Such a mounting can be achieved by bonding the wafer and the carrier plate with an adhesive. Once such operations are completed, the wafer needs to be debonded from the carrier plate. Such a debonding process can be achieved by applying a suction force or a shear force to the wafer-carrier plate assembly. Various debonding systems, devices and methodologies, and related features, are disclosed. Also disclosed are various devices and methodologies for handling and processing wafers that have been debonded from their carriers.
TW105100597A 2010-06-07 2011-06-07 Devices for methodologies for debonding and handling semiconductor wafers TWI584406B (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US35232410P 2010-06-07 2010-06-07
US12/898,648 US8758553B2 (en) 2010-10-05 2010-10-05 Fixtures and methods for unbonding wafers by shear force
US12/898,627 US8888085B2 (en) 2010-10-05 2010-10-05 Devices and methodologies for handling wafers
US12/898,623 US8758552B2 (en) 2010-06-07 2010-10-05 Debonders and related devices and methods for semiconductor fabrication

Publications (2)

Publication Number Publication Date
TW201614763A true TW201614763A (en) 2016-04-16
TWI584406B TWI584406B (en) 2017-05-21

Family

ID=45098602

Family Applications (2)

Application Number Title Priority Date Filing Date
TW100119898A TWI531024B (en) 2010-06-07 2011-06-07 Devices for methodologies for debonding and handling semiconductor wafers
TW105100597A TWI584406B (en) 2010-06-07 2011-06-07 Devices for methodologies for debonding and handling semiconductor wafers

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW100119898A TWI531024B (en) 2010-06-07 2011-06-07 Devices for methodologies for debonding and handling semiconductor wafers

Country Status (2)

Country Link
TW (2) TWI531024B (en)
WO (1) WO2011156292A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8758553B2 (en) 2010-10-05 2014-06-24 Skyworks Solutions, Inc. Fixtures and methods for unbonding wafers by shear force
US8888085B2 (en) 2010-10-05 2014-11-18 Skyworks Solutions, Inc. Devices and methodologies for handling wafers
US8758552B2 (en) 2010-06-07 2014-06-24 Skyworks Solutions, Inc. Debonders and related devices and methods for semiconductor fabrication
US20120080832A1 (en) 2010-10-05 2012-04-05 Skyworks Solutions, Inc. Devices for methodologies related to wafer carriers
JP2013060489A (en) * 2011-09-12 2013-04-04 Three M Innovative Properties Co Member peeling method and member peeling device
TWI608875B (en) * 2016-05-11 2017-12-21 All Ring Tech Co Ltd Stage and wafer residue cleaning device using the same
TWI829673B (en) * 2018-03-07 2024-01-21 美商康寧公司 Glass substrate adhesion control
TWI735115B (en) * 2019-12-24 2021-08-01 力成科技股份有限公司 A wafer storage cassette and a wafer carrier plate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61272927A (en) * 1985-05-29 1986-12-03 Hitachi Electronics Eng Co Ltd Method for separation of wafer and mask
JPH1022184A (en) * 1996-06-28 1998-01-23 Sony Corp Substrate bonding device
US6491083B2 (en) * 2001-02-06 2002-12-10 Anadigics, Inc. Wafer demount receptacle for separation of thinned wafer from mounting carrier
DE10140827B4 (en) * 2001-08-21 2004-07-29 Infineon Technologies Ag Device for debonding thin wafers
JP4668833B2 (en) * 2006-04-26 2011-04-13 三菱電機株式会社 Semiconductor wafer separation apparatus and separation method

Also Published As

Publication number Publication date
TW201207989A (en) 2012-02-16
WO2011156292A3 (en) 2012-04-19
TWI584406B (en) 2017-05-21
WO2011156292A2 (en) 2011-12-15
TWI531024B (en) 2016-04-21

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