CN103785490B - Online plasma cleaning method - Google Patents
Online plasma cleaning method Download PDFInfo
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- CN103785490B CN103785490B CN201210429856.1A CN201210429856A CN103785490B CN 103785490 B CN103785490 B CN 103785490B CN 201210429856 A CN201210429856 A CN 201210429856A CN 103785490 B CN103785490 B CN 103785490B
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Abstract
A kind of online plasma cleaning method, comprises the following steps: in feeding area, workpiece to be cleaned is taken out and is sent to article carrying platform in magazine, correspondence is put into spaced apart workpiece standing groove on article carrying platform; The article carrying platform that is mounted with workpiece to be cleaned moved to cleaning area and send in plasma cleaning storehouse, closing the hermatic door in plasma cleaning storehouse; Make to form vacuum environment in plasma cleaning storehouse, then in plasma cleaning warehouse, be filled with gas, electrifying electrodes, starts to clean; After cleaning, open the hermatic door in plasma cleaning storehouse, article carrying platform shifts out Bing Cong cleaning area, plasma cleaning storehouse and moves to discharging area; Workpiece on article carrying platform is reinstalled in magazine. The inventive method was taken out workpiece to be cleaned and was placed on objective table before cleaning from magazine, and surface of the work to be cleaned is not blocked, and can clean the surface of workpiece comprehensively, thereby effectively eliminate chip bonding district and frame table surface pollution and oxide.
Description
Technical field
The present invention relates to semiconductor fabrication process process technology field, relate in particular to one and go in technical processExcept the plasma cleaning method of pollutant in framework or chip bonding district.
Background technology
The quality of chip bonding district and framework bonding region plays extremely important to the reliability of IC-componentsEffect. Encapsulation is as the unique connection between device and electronic system, and bonding region must contamination-free and toolThere is good bonding performance. If bonding region exists pollutant can seriously undermine the adhesive property of bonding region, easilyCause spun gold not weld bonding region; Even in welding, bonding also can cause circuit oepration at full load in the future timeGold goal and chip bonding are distinguished pull-up and are fallen, and cause device function to lose efficacy. At present, cause bonding regional pollutionMaterial is mainly oxide and organic detritus, and these pollutants mainly comprise when Qian Dao FAB factory manufactures waferResidual oxide and fluoride, chip and framework are exposed to the surface oxidation causing in air for a long timeWhen the pollution of epoxy resin when thing, load (epoxy) colloid and colloid solidify, epoxy evaporates goes outOrganic detritus. The pollutants such as microparticle, organic matter and the oxide on surface on these bonding region surfaces cannot adoptTraditional cleaning method is removed, and generally adopts radio frequency plasma cleaning technique to clean.
Plasma is the same with solid, liquid or gas, is a kind of state of material, when sufficient to gas exertsWhen making it ionization, enough energy just become plasmoid. The active component of plasma comprises: ion, electricityNucleic (metastable state), the photon etc. of son, active group, excitation state. Plasma surface treatment technology justBe to utilize " activation " of active particle in gas ions to come processing sample surface, thereby reach removal objectThe object of surface blot. With regard to reaction mechanism, plasma clean generally includes following process: inorganic gasBody is activated into plasma state; Gaseous substance is attracted to the surface of solids; Be adsorbed group and the surface of solids dividesSon reaction generates product molecule; Product molecule is resolved and is formed gas phase; Reaction residue departs from surface.
The main van-type plasma cleaner that uses cleans framework or chip at present, and plasma cleaner is logicalOften form by cleaning cavity, source of the gas, power source and vavuum pump four parts. Cleaning cavity is an airtight casing,In the middle of cleaning cavity both sides are provided with the electrode that forms electric field, clean cavity, rack is set, is equipped with and treats clearlyThe magazine of washing workpiece is positioned on rack, and vavuum pump is by after vacuumizing in cleaning cavity, to cleaning in cavityPour argon gas or other gas, then electrifying electrodes is isolated ion, starts element to carry out plasma cleaning.After adopting plasma cleaning technology sharpest edges to be to clean without waste liquid, to metal, semiconductor, oxide andMost of macromolecular materials etc. can finely be processed, and can realize the cleaning of whole and part and labyrinth.
But, when at present lead frame or chip cleanings, be by be cleaned to multiple frameworks or chip etc.Workpiece interval is placed in magazine, then puts into cleaning machine together with magazine and cleans. Existing magazine knotStructure mostly is both sides and arranges the structure of the four sides hollow out of side plate, and workpiece to be cleaned from top to bottom interval is placed, clearlyWash in process, due to magazine sidewall stop or spacing between the adjacent workpieces hour, can cause clearlyWash insufficient, cannot implementation framework surface All Ranges be all cleaned. And, the material of special engraved structureBox cost is high, need to manufacture the cleaning magazine of multiple correspondingly-sized when each product cleans, and gives undoubtedly enterpriseA lot of costs are increased.
Summary of the invention
The object of this invention is to provide a kind of automaticity high, clean fully online plasma cleaning method,Adopt the method can remove chip bonding district and frame table surface pollution and oxide comprehensively, thereby improve bondingCohesive force.
To achieve these goals, the present invention takes following technical solution:
A kind of online plasma cleaning method, comprises the following steps:
Step 1, in feeding area, workpiece to be cleaned taken out in magazine and be sent to article carrying platform correspondencePut into spaced apart workpiece standing groove on article carrying platform;
Step 2, the article carrying platform that is mounted with workpiece to be cleaned is moved to cleaning area and sends into plasma cleaningIn storehouse, close the hermatic door in plasma cleaning storehouse;
Step 3, make in plasma cleaning storehouse to form vacuum environment, then in plasma cleaning warehouse, be filled withGas, electrifying electrodes, starts to clean;
After step 4, cleaning, open the hermatic door in plasma cleaning storehouse, article carrying platform shifts out plasmaClean Bing Cong cleaning area, storehouse and move to discharging area;
Step 5, the workpiece on article carrying platform is reinstalled in magazine.
A kind of online plasma cleaning method, adopts automatic on-line plasma cleaning system to clean, described inPurging system comprises feeding area, cleaning area, discharging area and can be between feeding area, cleaning area and discharging areaThe article carrying platform moving back and forth, is provided with some workpiece standing grooves on described article carrying platform;
Described cleaning method comprises the following steps:
Step 1, in feeding area, workpiece to be cleaned taken out in magazine and be sent to article carrying platform correspondencePut into the workpiece standing groove on article carrying platform;
Step 2, the article carrying platform that is mounted with workpiece to be cleaned is moved to cleaning area and sends into plasma cleaningIn storehouse, close the hermatic door in plasma cleaning storehouse;
Step 3, make in plasma cleaning storehouse to form vacuum environment, then in plasma cleaning warehouse, be filled withGas, electrifying electrodes, starts to clean;
After step 4, cleaning, open the hermatic door in plasma cleaning storehouse, article carrying platform shifts out plasmaClean Bing Cong cleaning area, storehouse and move to discharging area;
Step 5, the workpiece on article carrying platform is reinstalled in magazine.
Preferably, the workpiece standing groove of described article carrying platform is established along the length direction interval of described article carrying platformPut.
As shown from the above technical solution, cleaning method of the present invention is being treated before cleaning workpiece cleans,Workpiece to be cleaned is taken out from magazine, workpiece to be cleaned is placed on objective table, due to workpiece to be cleanedBe to be positioned on same plane, but not be spaced placement up and down, objective table does not have side plate yet simultaneously, treats clearlyWash the surface of workpiece and can not expose completely and can be blocked, therefore can carry out the surface of workpiece comprehensively clearWash, thereby effectively eliminate chip bonding district and frame table surface pollution and oxide, reach and improve bond adhesion powerObject.
Brief description of the drawings
Fig. 1 is schematic diagram of the present invention.
Fig. 2 is the schematic diagram of another embodiment of the present invention.
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described in further detail.
Detailed description of the invention
Lead frame, as the chip carrier of integrated circuit, is that one realizes chip internal by means of bonding gold wireThe electrical connection of circuit exit and outer lead, is the key structure part that forms electric loop, has played with outerThe function served as bridge that portion's wire connects, all needs to use lead frame in the semiconductor integrated block of the overwhelming majority, isImportant foundation material in electronics and information industry. In the following description taking the cleaning of lead frame as example is to thisBright method is described further. As shown in Figure 1, plasma cleaning method of the present invention adopts automatic on-line etc.Ion Cleaning system is cleaned, and this system comprises feeding area A, the cleaning area B, the discharging area C that are arranged in orderAnd article carrying platform 1, article carrying platform 1 under the control of moving control mechanism can feeding area A, cleaning area B,Between the C of discharging area, move back and forth, the length direction along article carrying platform on article carrying platform 1 is arranged at intervals with frameworkStanding groove 11, lead frame 2 can be positioned in framework standing groove 11. Article carrying platform 1 and framework standing groove11 length and width size, according to the size setting of lead frame, preferably arranges 10～15 on article carrying platform 1Framework standing groove 11 is provided with 10 framework standing grooves 11 on article carrying platform 1 in the present embodiment, can be sameTime place 10 lead frames. The cleaning area B of the present embodiment is the plasma cleaning of a rectangular shapeStorehouse, the basic phase of cleaning chambers body structure of the structure in this plasma cleaning storehouse and prior art ionic medium cleaning machineWith, it comprise clean cavity, be arranged on electrode on cavity, be communicated with inside cavity be used to form vacuumThe vavuum pump of environment and argon gas source of the gas, be provided with hermatic door in the both sides in plasma cleaning storehouse, article carrying platform1 can enter and shift out plasma cleaning storehouse through hermatic door.
Cleaning method of the present invention comprises the following steps:
Step 1, the magazine 3 that lead frame 2 is housed is placed in the A of feeding area, gripper is by lead frameFrame 2 is extracted out one by one and is coordinated conveyer belt to deliver on article carrying platform 1 from magazine 3, by lead frame 2 correspondencesPut into the framework standing groove 11 of article carrying platform 1;
Step 2, the article carrying platform 1 that has loaded lead frame 2 is moved in the B of cleaning area and enters plasmaClean in storehouse, the hermatic door of closing both sides, plasma cleaning storehouse, forms a confined space;
Step 3, cleaning procedure start, and cleaning principle of the present invention is same as the prior art, first vavuum pumpStart to take out the air in plasma cleaning storehouse, make to form vacuum environment in plasma cleaning storehouse, along with gas is healedCome thinlyyer, molecular separating force is more and more less, and the freely-movable distance of intermolecular distance and molecule or ion is also more comeLonger; Then open argon gas control valve, in plasma cleaning warehouse, be filled with argon gas until argon gas is full of wholePlasma cleaning storehouse; Electrifying electrodes, argon gas is bumped by electric field action and forms plasma decomposes ion,The ion producing in argon plasma is with enough energy impact chip surfaces, with organic pollution and microparticlePollutant reaction or collision form volatile materials, to remove lip-deep any dirt, then by work gasStream and vavuum pump clear out these volatile materials;
After step 4, cleaning, the hermatic door of both sides, plasma cleaning storehouse is opened, and article carrying platform 1 leavesPlasma cleaning storehouse, moves to discharging area C from cleaning area B;
Step 5, gripper coordinate conveyer belt that the lead frame on article carrying platform 12 is reinstalled to magazine 3In.
As shown in Figure 2, be the another kind of optional embodiment of the present invention, material loading and the blanking of the present embodiment all existThe same area--loading/unloading material district A ' carries out, and article carrying platform 1 can be at loading/unloading material district A ' and cleaning area BBetween move back and forth, gripper is extracted lead frame 2 out from magazine 3 and to coordinate conveyer belt to deliver to loading flatAfter placing on platform 1, article carrying platform 1 moves to cleaning area B, closes the sealing of side, plasma cleaning storehouseDoor cleans in plasma cleaning storehouse, and after cleaning, hermatic door is opened, and article carrying platform 1 is got back toLoading/unloading material district A ', gripper is reinstalled magazine by the lead frame on article carrying platform 12 through conveyer beltIn 3, complete cleaning.
From above technical scheme, the inventive method adopts feed mechanism (being gripper and driving-belt)The lead frame being contained in magazine is taken out separately and put one by one to the article carrying platform of slab structure, thenArticle carrying platform is sent into clean in storehouse and clean, in cleaning process, workpiece to be cleaned (lead frame) justFace is unobstructed, and upper and lower side does not also stop, can fully clean by effects on surface, after cleaning by unloadingMaterial mechanism (gripper and driving-belt) reloads workpiece in magazine. With existing van-type plasma cleaningMachine is compared, and the product of each external form only need to be made an article carrying platform, does not need to make multiple hollow out magazines,Reduce and manufactured cost; And each 10～15 frameworks capable of washing of the inventive method, clean cavity designLess, use more flexibly, be not only applicable to be pilot but also be applicable to producing in enormous quantities, the argon gas amount of use andThe relatively existing van-type cleaning machine of power consumption is less, is conducive to enterprise and controls cost.
Really, technical conceive of the present invention is not limited in above-described embodiment, can also be according to structure of the present inventionThink to obtain many different concrete schemes, for example, the quantity of workpiece standing groove and arrangement mode on article carrying platformCan also have different variations, if can realize on platform, carry workpiece and facilitate on/shedding mechanism is workPart is corresponding to be placed, and all should be included in technical scheme of the present invention such as these changes and equivalent transformationScope within.
Claims (2)
1. an online plasma cleaning method, is characterized in that: adopt automatic on-line plasma cleaning systemSystem cleans, and described automatic on-line plasma cleaning system comprises feeding area, cleaning area, discharging area and canThe article carrying platform moving back and forth between feeding area, cleaning area and discharging area, is provided with on described article carrying platformSome workpiece standing grooves;
Described cleaning method comprises the following steps:
Step 1, in feeding area, workpiece to be cleaned taken out in magazine and be sent to article carrying platform correspondencePut into the workpiece standing groove on article carrying platform;
Step 2, the article carrying platform that is mounted with workpiece to be cleaned move to cleaning area and enter plasma cleaning storehouseIn, the hermatic door of closing plasma cleaning storehouse;
Step 3, make in plasma cleaning storehouse to form vacuum environment, then in plasma cleaning warehouse, be filled withGas, electrifying electrodes, starts to clean;
After step 4, cleaning, open the hermatic door in plasma cleaning storehouse, article carrying platform shifts out plasmaClean Bing Cong cleaning area, storehouse and move to discharging area;
Step 5, the workpiece on article carrying platform is reinstalled in magazine,
Described workpiece is lead frame.
2. online plasma cleaning method as claimed in claim 1, is characterized in that: described loading is flatThe workpiece standing groove of platform arranges along the length direction interval of described article carrying platform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210429856.1A CN103785490B (en) | 2012-10-31 | 2012-10-31 | Online plasma cleaning method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210429856.1A CN103785490B (en) | 2012-10-31 | 2012-10-31 | Online plasma cleaning method |
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| CN103785490A CN103785490A (en) | 2014-05-14 |
| CN103785490B true CN103785490B (en) | 2016-05-11 |
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| CN201210429856.1A Active CN103785490B (en) | 2012-10-31 | 2012-10-31 | Online plasma cleaning method |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107845568A (en) * | 2017-10-31 | 2018-03-27 | 浙江华越芯装电子股份有限公司 | Plasma cleaning method and device before a kind of integrated antenna package bonding |
| CN108176679A (en) * | 2017-12-28 | 2018-06-19 | 深圳市鑫承诺环保产业股份有限公司 | A kind of metallic film on-line cleaning method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001185535A (en) * | 1999-12-22 | 2001-07-06 | Sony Corp | Plasma vacuum system and plasma vacuum processing method |
| CN101890414A (en) * | 2010-07-12 | 2010-11-24 | 中国电子科技集团公司第二研究所 | Online plasma cleaner |
| CN101980798A (en) * | 2008-03-27 | 2011-02-23 | 飞电半导体株式会社 | Plasma cleaning apparatus for a semiconductor panel with cleaning chambers |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101412031B (en) * | 2007-10-19 | 2012-07-04 | 深圳富泰宏精密工业有限公司 | Cleaning jig |
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- 2012-10-31 CN CN201210429856.1A patent/CN103785490B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001185535A (en) * | 1999-12-22 | 2001-07-06 | Sony Corp | Plasma vacuum system and plasma vacuum processing method |
| CN101980798A (en) * | 2008-03-27 | 2011-02-23 | 飞电半导体株式会社 | Plasma cleaning apparatus for a semiconductor panel with cleaning chambers |
| CN101890414A (en) * | 2010-07-12 | 2010-11-24 | 中国电子科技集团公司第二研究所 | Online plasma cleaner |
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| CN103785490A (en) | 2014-05-14 |
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