CN102956513A - Method, system and fixture for ball attachment in ball grid array devices - Google Patents
Method, system and fixture for ball attachment in ball grid array devices Download PDFInfo
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- CN102956513A CN102956513A CN2011102378035A CN201110237803A CN102956513A CN 102956513 A CN102956513 A CN 102956513A CN 2011102378035 A CN2011102378035 A CN 2011102378035A CN 201110237803 A CN201110237803 A CN 201110237803A CN 102956513 A CN102956513 A CN 102956513A
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- anchor clamps
- ball
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- bga device
- soldered ball
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Abstract
An embodiment of the invention discloses a fixture, a method and a system for ball attachment in ball grid array devices. A groove of the fixture matches with a ball grid array device in shape and size. The bottom of the groove is provided with holes corresponding to pads for ball grid array devices in position. Each hole right contains one solder ball to guarantee contact and adhesion between the solder ball and the corresponding pad. The lower portion of each hole is communicated with an external evacuator, so that one solder ball can be adsorbed into each hole and residual solder balls are further recycled. Therefore, precision alignment of the fixture with the ball grid array devices can be achieved. The solder balls are quickly placed in the holes and are contacted and adhered with the pads for the ball grid array devices, so that complexity in ball attachment is greatly simplified, efficiency in ball attachment is greatly improved, the need for manual supplementation of the solder balls is avoided and labor is economized.
Description
Technical field
The present invention relates to the BGA device manufacture field, relate in particular to a kind of ball-establishing method, system and anchor clamps thereof of BGA device.
Background technology
Ball grid array (Ball Grid Array, BGA) is a kind of package method that integrated circuit adopts organic support plate.The advantage such as it has that package area is little, powerful, number of pins is many, good electrical property, holistic cost are low.The I/O terminal of BGA encapsulation is distributed in substrate surface with sphere or column solder joint by array format.
The device of BGA packing forms (being the BGA device) is being welded to printed circuit board (Printed Circuit Broad, PCB) in the time of above, if occur the bad phenomenon such as short circuit, need to reprocess the BGA device, reprocessing flow process is mainly: first the BGA device is removed from PCB, then remove the residual scolding tin of BGA device bottom clean, after bond pad locations is coated weld-aiding cream, need to again plant ball to BGA device bottom, finish plant ball after, again the BGA device is welded on the PCB.In the technological process that whole BGA device is reprocessed, finishing at present the BGA device, to plant the operation of ball mainly be to finish by the steel disc that the pad made from the BGA device is complementary.The diameter of soldered ball mostly is 0.3-0.5mm, the opening size of steel disc is than the large 0.05-0.1mm of soldered ball diameter, steel disc is placed on the BGA device top that coats weld-aiding cream, make distance between steel disc and the BGA device be slightly less than the diameter of soldered ball, after the contraposition that realizes both, be sprinkled upon equably soldered ball on the steel disc, then the soldered ball on the continuous mobile steel disc, until just keep 1 soldered ball in each opening of steel disc, then, remove steel disc, check to have or not on the BGA device to lack soldered ball, lack if having, again with instrument polishing soldered balls such as tweezers.
There is following technical problem in the ball-establishing method of the BGA device of above-mentioned prior art: contraposition difficulty between steel disc and the BGA device, even need the instrument such as microscope to carry out contraposition; The nodule number amount of planting of each BGA device is more, and hundreds of is arranged usually, and can not guarantee well has a soldered ball just in each opening of steel disc, needs the quantity of manual polishing more, thereby production difficulty is large, inefficiency and wasted manpower.
Summary of the invention
Embodiment of the invention technical problem to be solved is, a kind of ball-establishing method, system and anchor clamps thereof of BGA device are provided, and plants sphere complexity with simplification, raises the efficiency and save manpower.
In order to solve the problems of the technologies described above, the embodiment of the invention has proposed a kind of anchor clamps of planting ball for BGA device, this anchor clamps one side offers the groove with described BGA device overall dimension coupling, in this trench bottom be provided with corresponding with pad locations on the described BGA device, be used for some perforates that accommodating soldered ball contacts with corresponding pad to be suitable for soldered ball, this perforate bottom is communicated with outside vacuum extractor.
Correspondingly, the embodiment of the invention also provides a kind of ball system of planting of BGA device, and this system comprises above-mentioned anchor clamps, and the vacuum extractor that is communicated with perforate bottom in the anchor clamps.
Correspondingly, the embodiment of the invention also provides a kind of ball-establishing method of BGA device, and the method adopts the ball system of planting of above-mentioned BGA device, and described method comprises:
Put described anchor clamps, make described channel opening upwards;
In described groove, add some soldered balls;
By described vacuum extractor described perforate is applied downward pull of vacuum, each described perforate is all adsorbed a soldered ball;
Overturn described anchor clamps to reclaim other soldered balls except the soldered ball that is adsorbed;
Again put described anchor clamps, make described channel opening upwards;
Discharge described pull of vacuum;
Described BGA device is inserted in the described groove, made on the described BGA device that to apply the pad that helps the wlding material also bonding with the soldered ball contact in the corresponding perforate;
Separate described anchor clamps and be stained with the BGA device of soldered ball.
Further, the described wlding material that helps is scaling powder or weld-aiding cream.
The embodiment of the invention is planted the anchor clamps of ball and ball-establishing method and the system of BGA device by providing a kind of for BGA device, the groove of anchor clamps and BGA device overall dimension are complementary, and trench bottom is provided with the perforate corresponding with the BGA device pad locations, perforate can contact also bonding with assurance soldered ball and corresponding pad by accommodating soldered ball, the perforate bottom is communicated with outside vacuum extractor, like this, when vacuum extractor is started working, can guarantee that each perforate all adsorbs 1 soldered ball is arranged, thereby the second surface at these anchor clamps forms enclosure space, because the continuous running of vacuum extractor, cause ambient pressure greater than the pressure in this enclosure space, therefore, when overturning these anchor clamps, the soldered ball that is adsorbed in the perforate can not break away from anchor clamps yet, other unnecessary soldered ball then can be collected in together in order to recycle, this shows, the present invention can realize the exactitude position of anchor clamps and BGA device, fast soldered ball is placed perforate and soldered ball is contacted with the pad of BGA device also bonding, greatly simplified and planted sphere complexity, and improved and planted ball efficient, needing to have avoided the operation of artificial polishing soldered ball, saved manpower.
Description of drawings
Fig. 1 is the first structural representation that the BGA device is planted the anchor clamps of ball that is used for of first embodiment of the invention.
Fig. 2 is the structural representation of the BGA device 1 of first embodiment of the invention.
Fig. 3 is the 706 step results figure of ball-establishing method of the BGA device of first embodiment of the invention.
Fig. 4 is the 707 step results figure of ball-establishing method of the BGA device of first embodiment of the invention.
Fig. 5 is the 708 step results figure of ball-establishing method of the BGA device of first embodiment of the invention.
Fig. 6 is the structural representation that the BGA device is planted the anchor clamps of ball that is used for of second embodiment of the invention.
Fig. 7 be the third embodiment of the invention anchor clamps the structural representation of main body 10.
Fig. 8 is the structural representation of the cover closing member 11 of third embodiment of the invention anchor clamps.
Fig. 9 is the jig main body 10 of third embodiment of the invention and the combining structure schematic diagram of cover closing member 11.
Figure 10 is the structural representation of main body 13 of the anchor clamps of fourth embodiment of the invention.
Figure 11 is the structural representation of support 14 of the anchor clamps of fourth embodiment of the invention.
Figure 12 is the jig main body 13 of fourth embodiment of the invention and the combining structure schematic diagram of support 14.
Figure 13 is the structural representation of perforated panel 16 of the anchor clamps of fifth embodiment of the invention.
Figure 14 is the structural representation of base 19 of the anchor clamps of fifth embodiment of the invention.
Figure 15 is the perforated panel 16 of fifth embodiment of the invention and the combining structure schematic diagram of base 19.
Figure 16 is the main flow chart of ball-establishing method of the BGA device of the embodiment of the invention.
Embodiment
Below in conjunction with accompanying drawing, the embodiment of the invention is elaborated.
The ball system of planting of the BGA array device of first embodiment of the invention comprises the anchor clamps that are used for BGA device ball-establishing method of the embodiment of the invention as shown in Figure 1, and the outside vacuum extractor that is communicated with these anchor clamps aftermentioned perforate 5 bottoms 6, with reference to Fig. 1, this anchor clamps first surface offers the groove 2 with the coupling of BGA device 1 overall dimension as shown in Figure 2, be provided with corresponding with pad 3 positions on the BGA device 1 in these groove 2 bottoms, be used for accommodating soldered ball 4 to be suitable for soldered ball 4 and corresponding pad 3 contacts and perforation to some perforates 5 of this anchor clamps second surface, these perforate 5 bottoms 6 all are communicated with outside vacuum extractor, perforate 5 is for running through anchor clamps and being funnelform through hole, its relative heavy caliber one end is used for accommodating soldered ball 4, a relatively small-bore end is used for being communicated with outside vacuum extractor, thereby on the second surface of these anchor clamps, form the enclosure space of this anchor clamps second surface of sealing, specifically, perforate 5 is corresponding one by one with pad 3 positions, the funnel-form through hole requires to guarantee that relative heavy caliber one end can place a soldered ball 4 and the soldered ball 4 of placing can be contacted with the pad 3 of BGA device 1 also bonding just, perforate 5 bottoms 6 diameters should less than the diameter of soldered ball 4, can't touch pad 3 to avoid soldered ball 4 to drop.
Correspondingly, the ball-establishing method of the BGA device 1 of the embodiment of the invention can adopt above-mentioned anchor clamps and outside vacuum extractor to carry out, and it specifically comprises flow process as shown in figure 16:
701, put anchor clamps, make groove 2 opening upwards, i.e. situation shown in Figure 1;
702, to the some soldered balls 4 of groove 2 interior addings, the quantity of soldered ball 4 should equate with the quantity of perforate 5 or greater than the quantity of perforate 5;
703, by outside vacuum extractor perforate 5 is applied downward pull of vacuum, each perforate 5 is all adsorbed a soldered ball 4;
704, turnover fixture is to reclaim other soldered balls 4 except the soldered ball 4 that is adsorbed, and like this, under the pull of vacuum effect, the soldered ball 4 of perforate 5 absorption can be owing to inverting action not be dropped, and other soldered balls 4 then can be owing to inverting action concentrates in together and reclaims;
705, again put anchor clamps, still make groove 2 opening upwards, under the pull of vacuum effect, still adsorbing in the perforate 5 has soldered ball 4;
706, discharge described pull of vacuum, like this, soldered ball 4 places in the perforate 5 correspondingly, and namely planting ball position at the needs of each correspondence has a soldered ball 4 just, can be as shown in Figure 3;
707, BGA device 1 is inserted in the groove 2, make on the BGA device 1 that to apply the pad 3 that helps the wlding material also bonding with soldered ball 4 contacts in the corresponding perforate 5, can be as shown in Figure 4, particularly, the above-mentioned wlding material that helps can be scaling powder or weld-aiding cream;
708, separating clamp and be stained with the BGA device 1 of soldered ball 4, like this, whole BGA device is planted the ball process and has just been finished, finish plant ball the BGA device as shown in Figure 5.
Anchor clamps as second embodiment of the invention, above-mentioned perforate 5 can also present other shapes, as shown in Figure 6, all perforates 5 share a vacuum orifice 7, inhaling the vacuum direction can be as shown by arrows in FIG., and its formation that shares the connectivity structure 8 adopt can be at anchor clamps side opening one passage, and to getting through perforate 5 bottoms, thereby make the described connectivity structure 8 of formation between perforate 5 and the vacuum orifice 7.Also can directly utilize this lateral access opening to be communicated with vacuum extractor.
Mainly there are following difference in the anchor clamps of third embodiment of the invention and the first embodiment shown in Figure 1: these anchor clamps comprise jig main body 10 as shown in Figure 7, an and cover closing member 11 that offers vacuum orifice 7 as shown in Figure 8, its combining structure schematic diagram can be as shown in Figure 9, cover closing member 11 tops form a re-entrant cavity 12 to be covered in jig main body one surface that is positioned at each perforate 5 bottom, vacuum extractor is communicated with the perforate 5 of anchor clamps by vacuum orifice 7, thereby forms an enclosure space in the re-entrant cavity 12 of this cover closing member 11.Like this, in the time of this vacuum extractor running, soldered ball 4 is under the effect of pull of vacuum, automatically fall in the heavy caliber end of perforate 5, and because the size of perforate 5 is corresponding with soldered ball 4 sizes, therefore, a soldered ball is just held in each perforate 5, and after each perforate all accommodates a soldered ball, therefore pressure in the described enclosure space, stir this anchor clamps less than external atmosphere pressure, the described soldered ball 4 that is contained in these perforate 5 heavy caliber ends can not break away from yet, and other soldered ball 4 then breaks away from these anchor clamps or is brought together under Action of Gravity Field.
Mainly there are following difference in the ball system of planting and first embodiment shown in Figure 1 of the BGA array device of fourth embodiment of the invention: this system comprises jig main body 13 as shown in figure 10, an and support 14 that offers vacuum orifice 7 as shown in figure 11, wherein jig main body forms a re-entrant cavity 15 to be covered in the upper surface of support 14 in each perforate 5 bottom, and its combining structure schematic diagram can be as shown in figure 12.
Mainly there are following difference in the ball system of planting of the BGA array device of fifth embodiment of the invention and the first embodiment shown in Figure 1: this system comprises the perforated panel that is provided with some perforates 5 16 as shown in figure 13, and as shown in figure 14 offer vacuum orifice 7 in the bottom surface, offer successively re-entrant cavity 17 in the top, bottom surface, the board slot 18 of accommodating described perforated panel 16 and the base 19 of the groove 2 of BGA device 1 overall dimension coupling as shown in Figure 2, perforated panel 16 places board slot 18, and be closed with re-entrant cavity 17 between perforated panel 16 and base 19 bottom surfaces, its combining structure schematic diagram can be as shown in figure 15.
The BGA device that said method and anchor clamps can be applicable in the BGA device rework process of surface mounting technology (Surface Mounted Technology, SMT) field is planted the ball exercise work, certainly, also can be used in the BGA device and plant ball preliminary working operation.
Above-mentioned groove and BGA device overall dimension of planting the anchor clamps of ball for BGA device is complementary, and trench bottom is provided with the perforate corresponding with the BGA device pad locations, perforate can contact also bonding with assurance soldered ball and corresponding pad by accommodating soldered ball, the perforate bottom is communicated with outside vacuum extractor, like this, when vacuum extractor is started working, can guarantee that each perforate all adsorbs 1 soldered ball is arranged, thereby the second surface at these anchor clamps forms enclosure space, because the continuous running of vacuum extractor, cause ambient pressure greater than the pressure in this enclosure space, therefore, when overturning these anchor clamps, the soldered ball that is adsorbed in the perforate can not break away from anchor clamps yet, other unnecessary soldered ball then can be collected in together in order to recycle, this shows, the present invention can realize the exactitude position of anchor clamps and BGA device, fast soldered ball is placed perforate and soldered ball is contacted with the pad of BGA device also bonding, greatly simplified and planted sphere complexity, and improved and planted ball efficient, needing to avoid the operation of artificial polishing soldered ball, saved manpower.
The above is the specific embodiment of the present invention; should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the principle of the invention; can also make some improvements and modifications, these improvements and modifications also are considered as protection scope of the present invention.
Claims (9)
1. one kind is used for the anchor clamps that BGA device is planted ball, it is characterized in that, this anchor clamps one side offers the groove with described BGA device overall dimension coupling, in this trench bottom be provided with corresponding with pad locations on the described BGA device, be used for some perforates that accommodating soldered ball contacts with corresponding pad to be suitable for soldered ball, this perforate bottom is for being communicated with outside vacuum extractor.
2. anchor clamps as claimed in claim 1 is characterized in that, described perforate is for running through described anchor clamps and being funnelform through hole, and its relative heavy caliber one end is used for accommodating described soldered ball, and a relatively small-bore end is used for being communicated with outside vacuum extractor.
3. anchor clamps as claimed in claim 1 is characterized in that, described perforate shares a vacuum orifice and is communicated with outside vacuum extractor.
4. anchor clamps as claimed in claim 1 is characterized in that, described anchor clamps comprise jig main body, and the cover closing member that offers vacuum orifice, and this cover closing member top forms re-entrant cavity to be covered in the jig main body surface that is positioned at each perforate bottom.
5. anchor clamps as claimed in claim 1 is characterized in that, described anchor clamps comprise jig main body, and the support that offers vacuum orifice, and wherein jig main body forms re-entrant cavity to be covered in the upper surface of support in each perforate bottom.
6. anchor clamps as claimed in claim 1, it is characterized in that, described anchor clamps comprise the perforated panel that is provided with some perforates, and offer vacuum orifice in the bottom surface, offer successively the board slot of re-entrant cavity, accommodating described perforated panel and the base of described groove in bottom surface top.
7. the ball system of planting of a BGA device is characterized in that, this system comprises each described anchor clamps in the claims 1 to 6, and the vacuum extractor that is communicated with described perforate bottom.
8. the ball-establishing method of a BGA device is characterized in that, the method adopts the ball system of planting of the claims 7 described BGA device, and described method comprises:
Put described anchor clamps, make described channel opening upwards;
In described groove, add some soldered balls;
By described vacuum extractor described perforate is applied downward pull of vacuum, each described perforate is all adsorbed a soldered ball;
Overturn described anchor clamps to reclaim other soldered balls except the soldered ball that is adsorbed;
Again put described anchor clamps, make described channel opening upwards;
Discharge described pull of vacuum;
Described BGA device is inserted in the described groove, made on the described BGA device that to apply the pad that helps the wlding material also bonding with the soldered ball contact in the corresponding perforate;
Separate described anchor clamps and be stained with the BGA device of soldered ball.
9. method as claimed in claim 8 is characterized in that, the described wlding material that helps is scaling powder or weld-aiding cream.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102378035A CN102956513A (en) | 2011-08-18 | 2011-08-18 | Method, system and fixture for ball attachment in ball grid array devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102378035A CN102956513A (en) | 2011-08-18 | 2011-08-18 | Method, system and fixture for ball attachment in ball grid array devices |
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| Publication Number | Publication Date |
|---|---|
| CN102956513A true CN102956513A (en) | 2013-03-06 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102378035A Pending CN102956513A (en) | 2011-08-18 | 2011-08-18 | Method, system and fixture for ball attachment in ball grid array devices |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107708328A (en) * | 2017-06-27 | 2018-02-16 | 安徽华东光电技术研究所 | Improve the chip adequately grounded welding method with radiating |
| CN108321093A (en) * | 2018-02-02 | 2018-07-24 | 英特尔产品（成都）有限公司 | Method for clearing up soldered ball template |
| CN110085527A (en) * | 2019-04-24 | 2019-08-02 | 苏州浪潮智能科技有限公司 | A kind of BGA ball-establishing method based on POP technique |
| WO2023125455A1 (en) * | 2021-12-27 | 2023-07-06 | 深圳中科四合科技有限公司 | Bga element self-alignment structure and alignment method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5741410A (en) * | 1994-12-06 | 1998-04-21 | Kabushiki Kaisha Toshiba | Apparatus for forming spherical electrodes |
| JP2000340935A (en) * | 1999-05-26 | 2000-12-08 | Nec Corp | Ball mounting jig and ball mounting method |
| CN1703295A (en) * | 2002-10-14 | 2005-11-30 | 奥利进科技有限公司 | An apparatus and method for filling a ball grid array template |
-
2011
- 2011-08-18 CN CN2011102378035A patent/CN102956513A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5741410A (en) * | 1994-12-06 | 1998-04-21 | Kabushiki Kaisha Toshiba | Apparatus for forming spherical electrodes |
| JP2000340935A (en) * | 1999-05-26 | 2000-12-08 | Nec Corp | Ball mounting jig and ball mounting method |
| CN1703295A (en) * | 2002-10-14 | 2005-11-30 | 奥利进科技有限公司 | An apparatus and method for filling a ball grid array template |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107708328A (en) * | 2017-06-27 | 2018-02-16 | 安徽华东光电技术研究所 | Improve the chip adequately grounded welding method with radiating |
| CN108321093A (en) * | 2018-02-02 | 2018-07-24 | 英特尔产品（成都）有限公司 | Method for clearing up soldered ball template |
| CN110085527A (en) * | 2019-04-24 | 2019-08-02 | 苏州浪潮智能科技有限公司 | A kind of BGA ball-establishing method based on POP technique |
| WO2023125455A1 (en) * | 2021-12-27 | 2023-07-06 | 深圳中科四合科技有限公司 | Bga element self-alignment structure and alignment method |
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Application publication date: 20130306 |