CN107708328A - Improve the chip adequately grounded welding method with radiating - Google Patents
Improve the chip adequately grounded welding method with radiating Download PDFInfo
- Publication number
- CN107708328A CN107708328A CN201710497802.1A CN201710497802A CN107708328A CN 107708328 A CN107708328 A CN 107708328A CN 201710497802 A CN201710497802 A CN 201710497802A CN 107708328 A CN107708328 A CN 107708328A
- Authority
- CN
- China
- Prior art keywords
- pad
- chip
- ground hole
- tin ball
- radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
Abstract
The invention discloses improve the chip adequately grounded welding method with radiating, it is characterised in that comprises the following steps：Step SS1：Prepare tin ball；Step SS2：The tin ball in the step SS1 is filled into the pad ground hole of chips on circuit boards pad；Step SS3：Heating makes the tin ball fusing in the pad ground hole in the step SS2.The present invention compares with existing process, add and fill tin ball into pad ground hole one by one, it is then placed within the process that heating melts the tin ball of pad ground hole on heating platform, make to be full of scolding tin in pad ground hole, to realize chip back adequately grounded, and it ensure that chip fully radiates, improve chip welding quality.
Description
Technical field
The chip adequately grounded welding method with radiating is improved the present invention relates to a kind of, belongs to component welding technique neck
Domain.
Background technology
With the development of microelectric technique, chip integration more and more higher, the appearance of high-power integrated chip so as to core
The requirement more and more higher of piece welding procedure, particularly high-power chip, it is necessary to adequately grounded and radiating, so just can guarantee that chip
Normal work.In existing process, chip-pad area to be welded coats soldering paste on circuit boards for use, finds in solder paste melts
Afterwards, because scolding tin trickling property is bad, scolding tin is caused not trickle fully to chip bonding pad ground hole to be welded on circuit board
Interior, the scolding tin in ground hole is not full, or even does not have scolding tin substantially in some ground holes, and chip does not fill when this allows for welding
Tap ground, and chip cooling is also bad.
The content of the invention
The technical problems to be solved by the invention are the defects of overcoming prior art, there is provided one kind improves chip adequately grounded
With the method for radiating, by filling tin ball into ground hole one by one by hand, be then placed within heating on heating platform makes this method
The tin ball fusing of ground hole, so makes each ground hole be filled with scolding tin.The present invention compare with existing process, add one by one to
Tin ball is filled in ground hole, to be then placed within heating platform heating make the tin ball melting process of ground hole, so as to improve core
The piece back side adequately grounded, and ensure that chip fully radiates, and improve chip welding quality.
The present invention adopts the following technical scheme that：Improve the chip adequately grounded welding method with radiating, it is characterised in that bag
Include following steps：
Step SS1：Prepare tin ball；
Step SS2：The tin ball in the step SS1 is filled into the pad ground hole of chips on circuit boards pad；
Step SS3：Heating makes the tin ball fusing in the pad ground hole in the step SS2.
As a kind of preferred embodiment, specifically included in the step SS1：Under the microscope, solder stick is performed the operation
Knife cuts into multiple spheroidal things, and the size of the spheroidal thing is less than or equal to the pad ground connection of chips on circuit boards pad
The aperture in hole.
As a kind of preferred embodiment, the temperature of the solder stick is 183 DEG C.
As a kind of preferred embodiment, the step SS2 is specifically included：Under the microscope, the tin is gripped with tweezers
Ball is put into the pad ground hole of chips on circuit boards pad one by one, until the pad of the chips on circuit boards pad is grounded
Full the tin ball is filled in hole.
As a kind of preferred embodiment, the step SS3 is specifically included：Circuit board is placed on heating platform and added
Heat, melt the tin ball in the pad ground hole of the chips on circuit boards pad, until the chips on circuit boards pad
Scolding tin is full of in pad ground hole.
As a kind of preferred embodiment, the heating-up temperature of the heating platform is 210 ± 5 DEG C.
The beneficial effect that the present invention is reached：The present invention compares with existing process, adds one by one into pad ground hole
Tin ball is filled, the process that heating melts the tin ball of pad ground hole on heating platform is then placed within, makes in pad ground hole
Full of scolding tin, it to realize chip back adequately grounded, and ensure that chip fully radiates, improve chip welding quality.
Brief description of the drawings
Fig. 1 is flow chart of the method for the present invention.
Fig. 2 is the structural representation of the operation embodiment of the present invention.
The implication marked in figure：1- chips on circuit boards pads, 2- pad ground holes, 3- tin balls.
Embodiment
The invention will be further described below in conjunction with the accompanying drawings.Following examples are only used for clearly illustrating the present invention
Technical scheme, and can not be limited the scope of the invention with this.
Fig. 1 is flow chart of the method for the present invention.Fig. 2 is the structural representation of the operation embodiment of the present invention.
The present invention proposes a kind of raising chip adequately grounded welding method with radiating, it is characterised in that including following step
Suddenly：
Step SS1：Tin ball 3 is prepared on request；
Step SS2：The tin ball in the step SS1 is filled into the pad ground hole 2 of chips on circuit boards pad 1
3；
Step SS3：Heating melts the tin ball 3 in the pad ground hole 2 in the step SS2.
As a kind of preferred embodiment, specifically included in the step SS1：Under the microscope, solder stick is performed the operation
Knife cuts into multiple spheroidal things, and the size of the spheroidal thing connects less than or equal to the pad of chips on circuit boards pad 1
The aperture in ground hole 2.
As a kind of preferred embodiment, the temperature of the solder stick is 183 DEG C.
As a kind of preferred embodiment, the step SS2 is specifically included：Under the microscope, the tin is gripped with tweezers
Ball 3 is put into the pad ground hole 2 of chips on circuit boards pad 1 one by one, until the pad of the chips on circuit boards pad 1
The full the tin ball of filling in ground hole 2.
As a kind of preferred embodiment, the step SS3 is specifically included：Circuit board is placed on heating platform and added
Heat, melt the tin ball 3 in the pad ground hole 2 of the chips on circuit boards pad 1, until the chips on circuit boards pad
Scolding tin is full of in 1 pad ground hole 2.
As a kind of preferred embodiment, the heating-up temperature of the heating platform is 210 ± 5 DEG C.
Described above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, without departing from the technical principles of the invention, some improvement and deformation can also be made, these are improved and deformation
Also it should be regarded as protection scope of the present invention.
Claims (6)
1. improve the chip adequately grounded welding method with radiating, it is characterised in that comprise the following steps：
Step SS1：Prepare tin ball；
Step SS2：The tin ball in the step SS1 is filled into the pad ground hole of chips on circuit boards pad；
Step SS3：Heating makes the tin ball fusing in the pad ground hole in the step SS2.
2. according to claim 1 improve the chip adequately grounded welding method with radiating, it is characterised in that the step
Specifically included in SS1：Under the microscope, solder stick is cut into multiple spheroidal things, the spheroidal thing with scalpel
Size be less than or equal to chips on circuit boards pad pad ground hole aperture.
3. according to claim 2 improve the chip adequately grounded welding method with radiating, it is characterised in that the scolding tin
The temperature of silk is 183 DEG C.
4. according to claim 1 improve the chip adequately grounded welding method with radiating, it is characterised in that the step
SS2 is specifically included：Under the microscope, the pad for being put into chips on circuit boards pad one by one with tweezers gripping the tin ball is grounded
In hole, until the full the tin ball of filling in the pad ground hole of the chips on circuit boards pad.
5. according to claim 1 improve the chip adequately grounded welding method with radiating, it is characterised in that the step
SS3 is specifically included：Circuit board is placed on heating platform and heated, in the pad ground hole for making the chips on circuit boards pad
Tin ball fusing, until the chips on circuit boards pad pad ground hole in be full of scolding tin.
6. according to claim 5 improve the chip adequately grounded welding method with radiating, it is characterised in that the heating
The heating-up temperature of platform is 210 ± 5 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710497802.1A CN107708328A (en) | 2017-06-27 | 2017-06-27 | Improve the chip adequately grounded welding method with radiating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710497802.1A CN107708328A (en) | 2017-06-27 | 2017-06-27 | Improve the chip adequately grounded welding method with radiating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107708328A true CN107708328A (en) | 2018-02-16 |
Family
ID=61170438
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710497802.1A Pending CN107708328A (en) | 2017-06-27 | 2017-06-27 | Improve the chip adequately grounded welding method with radiating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107708328A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110132453A (en) * | 2019-05-28 | 2019-08-16 | 无锡莱顿电子有限公司 | A kind of pressure sensor bonding method |
| CN113369626A (en) * | 2021-06-25 | 2021-09-10 | 中国电子科技集团公司第五十四研究所 | Low-contact thermal resistance mounting method for high-power amplifier chip |
| JP7432258B1 (en) | 2022-08-31 | 2024-02-16 | 晶呈科技股▲分▼有限公司 | Method for filling through holes in glass substrate with through electrodes |
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| CN104439587A (en) * | 2014-07-25 | 2015-03-25 | 乐辉 | Laser welding method |
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| CN105914165A (en) * | 2015-02-20 | 2016-08-31 | 株式会社日立制作所 | Substrate processing apparatus, substrate processing system and substrate processing method |
| CN106238949A (en) * | 2016-08-24 | 2016-12-21 | 浙江亚通焊材有限公司 | A kind of precise welded ball of band soldering flux coating and preparation method thereof |
| CN106793559A (en) * | 2015-11-25 | 2017-05-31 | 深南电路股份有限公司 | A kind of BGA ball-establishing methods |
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2017
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Patent Citations (13)
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| CN1476954A (en) * | 2003-06-30 | 2004-02-25 | 广州市特铜电子材料有限公司 | Production method of soldering tin ball for BGA and its equipment |
| CN201114990Y (en) * | 2007-08-01 | 2008-09-10 | 锐德科无线通信技术(上海)有限公司 | Printed circuit board with heat radiation structure |
| CN101960586A (en) * | 2008-02-28 | 2011-01-26 | Lsi公司 | Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive |
| CN102083281A (en) * | 2010-10-27 | 2011-06-01 | 北京遥测技术研究所 | Method for enhancing welding reliability of high-frequency quad flat no lead (QFN) device |
| CN102956513A (en) * | 2011-08-18 | 2013-03-06 | 深南电路有限公司 | Method, system and fixture for ball attachment in ball grid array devices |
| KR20130030988A (en) * | 2011-09-20 | 2013-03-28 | 삼성전기주식회사 | Method for manufacturing of printed circuit board |
| KR20130052884A (en) * | 2011-11-14 | 2013-05-23 | 삼성테크윈 주식회사 | Substrate with via formed using metal ball and method for manufacturing the via |
| CN104439587A (en) * | 2014-07-25 | 2015-03-25 | 乐辉 | Laser welding method |
| CN204669723U (en) * | 2014-10-21 | 2015-09-23 | 珠海迈科智能科技股份有限公司 | A kind of circuit board, printed circuit board and steel mesh |
| CN104470262A (en) * | 2014-10-24 | 2015-03-25 | 成都博芯联科科技有限公司 | Three-dimensional circuit interlayer connection method based on soldering tin welding technology |
| CN105914165A (en) * | 2015-02-20 | 2016-08-31 | 株式会社日立制作所 | Substrate processing apparatus, substrate processing system and substrate processing method |
| CN106793559A (en) * | 2015-11-25 | 2017-05-31 | 深南电路股份有限公司 | A kind of BGA ball-establishing methods |
| CN106238949A (en) * | 2016-08-24 | 2016-12-21 | 浙江亚通焊材有限公司 | A kind of precise welded ball of band soldering flux coating and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110132453A (en) * | 2019-05-28 | 2019-08-16 | 无锡莱顿电子有限公司 | A kind of pressure sensor bonding method |
| CN113369626A (en) * | 2021-06-25 | 2021-09-10 | 中国电子科技集团公司第五十四研究所 | Low-contact thermal resistance mounting method for high-power amplifier chip |
| JP7432258B1 (en) | 2022-08-31 | 2024-02-16 | 晶呈科技股▲分▼有限公司 | Method for filling through holes in glass substrate with through electrodes |
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Legal Events
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180216 |
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| RJ01 | Rejection of invention patent application after publication |