CN219425872U - Solder ball planting device for accurately separating tiny solder balls - Google Patents

Abstract

The utility model provides a tin ball planting device for accurately separating tiny tin balls, which comprises a tin ball separation fixing plate, a tin ball adsorption transfer plate, a tiny tin ball separation container and a vibration platform, wherein the tin ball separation fixing plate is provided with tiny tin ball accommodating meshes which are arranged in an array, the tin ball adsorption transfer plate is provided with tiny tin ball adsorption meshes which are arranged in an array, the tiny tin ball adsorption meshes are matched with the tiny tin ball accommodating meshes, the tin ball separation fixing plate is detachably arranged in the tiny tin ball separation container, the tiny tin ball separation container is arranged on the vibration platform, discrete solvents can be contained in the tiny tin ball separation container, and the tin ball adsorption transfer plate is provided with a negative pressure component. The beneficial effects of the utility model are as follows: the device can realize the quick and accurate separation of the tiny solder balls and the transfer of the tiny solder balls to the solder ball bonding pad of the PCB to finish the ball implantation work of the tiny solder balls, and has the advantages of simple structure, low ball implantation cost, high ball implantation efficiency and low ball implantation missing rate.

Description

Solder ball planting device for accurately separating tiny solder balls

Technical Field

The utility model relates to the technical field of tin ball planting, in particular to a tin ball planting device for accurately separating tiny tin balls.

Background

The laser tin ball welding is a high-efficiency and precise brazing welding method for precisely connecting applicable products by using a laser beam with high energy density as a heat source to melt tiny tin balls. Laser soldering is one of the important aspects of electronic component (SMT) processing technology applications. The laser industry has developed rapidly worldwide for many years, and the laser tin ball welding device and method have been widely and successfully applied to the precision welding of micro and small parts, and make a contribution to the development of microelectronics and modern communication technology.

At present, the realization of the connection of the PCB and the pins of the electronic chip by using solder ball welding is one of the general methods in the industry, but the method for placing the solder balls on the PCB usually adopts a vacuum suction head to be matched with a mechanical arm to automatically adsorb and fix the solder balls on a bonding pad of the PCB or uses a pressing plate to press and scatter the solder balls on the bonding pad in the industry, the first mode has the advantages of complex structure, high cost, low ball implantation efficiency, and the second mode can not accurately implant the solder balls with accurate quantity into the bonding pad of the PCB, has high ball implantation missing rate and low ball implantation efficiency. Especially for a large number of planting balls of tiny tin balls smaller than 0.1mm, the tiny tin balls are easy to be adsorbed together due to the small diameter of the tiny tin balls, and the two device planting ball processes are difficult to accurately separate the tiny tin balls, so that the production requirements cannot be met.

Disclosure of Invention

In order to solve the problems in the prior art, the utility model provides the tin ball planting device for accurately separating the tiny tin balls, and by arranging the tin ball separating and fixing plate, the tin ball adsorbing and transferring plate, the tiny tin ball separating container and the vibrating platform which are matched with each other in the tin ball planting device, the tiny tin balls can be rapidly and accurately separated and transferred to the tin ball welding plate of the PCB to complete the planting work of the tiny tin balls, the rapid and accurate planting of the tiny tin balls with the diameter of 0.05mm can be realized at the minimum, the planting efficiency can reach 500 ten thousand balls per hour, the structure is simple, the planting cost is low, the planting efficiency is high, the planting loss rate is low, and the problems that the tiny tin ball planting device in the prior art is high in cost, low in efficiency, high in loss rate and difficult to accurately separate the tiny tin balls with the diameter of less than 0.1mm are solved.

The utility model provides a tin ball planting device for accurately separating tiny tin balls, which comprises a tin ball separation fixing plate, a tin ball adsorption transfer plate, a tiny tin ball separation container and a vibration platform, wherein tiny tin ball containing holes which are arranged in an array are formed in the tin ball separation fixing plate, tiny tin ball adsorption transfer plates are provided with tiny tin ball adsorption holes which are arranged in an array, the tiny tin ball adsorption holes are matched with the tiny tin ball containing holes, the tin ball separation fixing plate is detachably arranged in the tiny tin ball separation container, the tiny tin ball separation container is arranged on the vibration platform, discrete solvents can be contained in the tiny tin ball separation container, the tin ball adsorption transfer plate is provided with a negative pressure component, the vibration platform can drive tiny tin balls placed on the tin ball separation fixing plate to move into the tiny tin ball containing holes, and the negative pressure component can drive the tiny tin ball adsorption holes which are positioned in the tiny tin ball containing holes to transfer tiny tin balls to a tin ball soldering disc of a PCB (printed circuit board) to complete the tiny tin ball planting operation.

According to the utility model, the tiny tin ball accommodating mesh penetrates through the tin ball separation fixing plate, the tiny tin ball accommodating mesh is in a conical hole or a horn hole with gradually reduced pore diameters from top to bottom, and the diameter of the tiny tin ball is 1.2 times smaller than the diameter of the tiny tin ball with the depth of the tiny tin ball accommodating mesh smaller than 1.8 times.

The utility model is further improved, the diameter of the mesh at the bottom of the micro tin ball accommodating mesh is less than 0.5 times of the diameter of the micro tin ball, the diameter of 1.2 times of the micro tin ball is less than the diameter of the mesh at the top of the micro tin ball accommodating mesh, the diameter of 1 time of the micro tin ball is less than the diameter of the mesh at the position of half the depth of the micro tin ball accommodating mesh, and the diameter of the micro tin ball is less than 1.1 times of the diameter of the micro tin ball.

According to the utility model, the tiny tin ball adsorption mesh penetrates through the tin ball adsorption transfer plate, the shape of the tiny tin ball adsorption mesh is an inverted conical hole or a horn hole with gradually reduced pore diameter from bottom to top, the mesh diameter at the bottom of the tiny tin ball adsorption mesh is larger than the mesh diameter at the top of the tiny tin ball accommodating mesh, and the diameter of 1.2 times of tiny tin balls is smaller than the diameter of the tiny tin ball adsorption mesh which is smaller than 1.8 times of the depth of the tiny tin balls.

According to the utility model, the top of the micro solder ball adsorption mesh is tightly matched with the negative pressure component, and the bottom of the micro solder ball adsorption mesh can be matched with the top of the micro solder ball accommodating mesh.

The utility model is further improved, the solder ball adsorption transfer plate is also provided with a positioning and aligning mechanism, and the positioning and aligning mechanism can assist the bottom of the micro solder ball adsorption mesh to align and cover the top of the micro solder ball accommodating mesh.

According to the utility model, the shape of the micro solder ball separating container is a groove or a box body, and the solder ball separating fixing plate is detachably arranged at the bottom of the groove or the bottom of the box body.

The utility model is further improved, the discrete solvent comprises an organic solvent and an inorganic solvent which can weaken the adsorption force among the tiny tin balls and increase the fluidity of the tiny tin balls, and the minimum diameter of the tiny tin balls is 0.05mm.

According to the utility model, the tin ball separation fixing plate and the tin ball adsorption transfer plate are both stainless steel plates, the tiny tin ball containing mesh in the shape of a horn hole is formed by combining a conical hole and a straight hole, and the tiny tin ball adsorption mesh in the shape of the horn hole is formed by combining a conical hole and a straight hole.

The utility model is further improved, and the vibration platform is provided with an ultrasonic vibration device or a vibration motor.

Compared with the prior art, the utility model has the beneficial effects that: the utility model provides a tin ball planting device for accurately separating tiny tin balls, which is characterized in that a tin ball separation fixing plate, a tin ball adsorption transfer plate, a tiny tin ball separation container and a vibration platform which are matched with each other are arranged in the tin ball planting device, the vibration platform can drive tiny tin balls placed on the tin ball separation fixing plate to move into tiny tin ball accommodating holes, a negative pressure component can drive the tiny tin balls in the tiny tin ball accommodating holes to be adsorbed by the tiny tin ball adsorption holes to transfer to a tin ball welding plate of a PCB (printed circuit board) to complete the planting work of the tiny tin balls, the tiny tin balls can be rapidly and accurately separated and transferred to the tin ball welding plate of the PCB to complete the planting work of the tiny tin balls, the rapid and accurate planting of the tiny tin balls of 0.05mm can be realized at the minimum, the planting efficiency can be up to 500 tens of thousands of hours, the structure is simple, the planting cost is low, the planting efficiency is high, the defect rate of the tiny tin balls is low, and the problem that the tiny tin ball planting device in the prior art is high in cost, the defect rate is difficult to separate tiny tin balls of 0.1mm is solved.

Drawings

For a clearer description of the present application or of the solutions of the prior art, a brief introduction will be given below to the drawings used in the description of the embodiments or of the prior art, it being apparent that the drawings in the description below are some embodiments of the present application, from which other drawings can be obtained, without the inventive effort for a person skilled in the art.

FIG. 1 is a top view, front view and bottom view of a solder ball separating and fixing plate according to the present utility model;

FIG. 2 is a cross-sectional view of the solder ball separating and fixing plate of the present utility model;

FIG. 3 is a cross-sectional view of the solder ball separating and fixing plate of the present utility model;

FIG. 4 is a perspective view of the solder ball separating and fixing plate of the present utility model;

FIG. 5 is a bottom view, front view and top view of the solder ball adsorbing transfer plate of the present utility model;

fig. 6 is a cross-sectional view of the solder ball adsorbing transfer plate of the present utility model.

In the figure, a 1-solder ball separating and fixing plate, 11-minute solder ball accommodating mesh, 2-solder ball adsorbing and transferring plate, 21-minute solder ball adsorbing mesh and 3-minute solder ball.

Detailed Description

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the applications herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description and claims of the present application and in the description of the figures above are intended to cover non-exclusive inclusions.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

In order to better understand the technical solutions of the present application, the following description will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings.

As shown in fig. 1-6, the tin ball planting device for accurately separating tiny tin balls provided by the utility model comprises a tin ball separation fixing plate 1, a tin ball adsorption transfer plate 2, tiny tin ball separation containers and a vibration platform, wherein the tin ball separation fixing plate 1 is provided with tiny tin ball accommodating holes 11 which are arranged in an array manner, the tin ball adsorption transfer plate 2 is provided with tiny tin ball adsorption holes 21 which are arranged in an array manner, the tiny tin ball adsorption holes 21 are matched with the tiny tin ball accommodating holes 11, the tin ball separation fixing plate 1 is detachably arranged in the tiny tin ball separation containers, the tiny tin ball separation containers are arranged on the vibration platform, discrete solvents can be contained in the tiny tin ball separation containers, and the tin ball adsorption transfer plate 2 is provided with a negative pressure component. In this embodiment, the vibration platform can drive the tiny tin ball 3 on the tiny tin ball separation fixed plate to move and fall into the tiny tin ball accommodation mesh, the negative pressure component can drive the tiny tin ball adsorption mesh to adsorb the tiny tin ball in the tiny tin ball accommodation mesh and transfer the tiny tin ball to the tin ball welding disk of the PCB board to finish the ball planting work of the tiny tin ball, the tiny tin ball can be rapidly and accurately separated and transferred to the tin ball welding disk of the PCB board to finish the ball planting work of the tiny tin ball, the rapid and accurate ball planting of the tiny tin ball of 0.05mm can be realized at least, the ball planting efficiency can reach 500 ten thousand per hour at most, the structure is simple, the ball planting cost is low, the ball planting efficiency is high, and the ball planting missing rate is low.

As shown in fig. 1 to 4, the minute solder ball receiving mesh 11 penetrates the solder ball separating fixing plate 1, the minute solder ball receiving mesh 11 has a shape of a tapered hole or a horn hole with gradually decreasing aperture from top to bottom, the diameter of 1.2 times of minute solder balls < the depth of the minute solder ball receiving mesh 11 < the diameter of 1.8 times of minute solder balls; the diameter of the mesh at the bottom of the tiny solder ball accommodating mesh 11 is less than 0.5 times the diameter of the tiny solder ball, the diameter of 1.2 times the diameter of the tiny solder ball is less than 1.8 times the diameter of the mesh at the top of the tiny solder ball accommodating mesh 11, and the diameter of the tiny solder ball is less than 1.1 times the diameter of the mesh at half the depth of the tiny solder ball accommodating mesh 11. In this embodiment, the tiny tin ball accommodating mesh is used for accommodating a single tiny tin ball, the vibration platform vibration can drive the tiny tin ball in the discrete solvent to continuously perform irregular motion, the tiny tin balls in the discrete solvent can be separated from each other through the irregular motion, and as the diameter of the tiny tin ball is smaller than the mesh diameter of the top of the tiny tin ball accommodating mesh, the tiny tin ball finally falls into the tiny tin ball accommodating mesh, and the tiny tin ball cannot protrude out of the tiny tin ball accommodating mesh, cannot be taken out by the solvent or is vibrated out, and the tiny tin ball accommodating mesh depth and aperture in the range are adopted, so that the tiny tin balls with diameters of 0.1mm and below are separated from each other more accurately and efficiently.

As shown in fig. 5 to 6, the fine solder ball adsorbing mesh 21 penetrates the solder ball adsorbing transfer plate 2, the fine solder ball adsorbing mesh 21 is shaped as an inverted conical hole or a horn hole with gradually decreasing aperture from bottom to top, the mesh diameter of the bottom of the fine solder ball adsorbing mesh 21 > the mesh diameter of the top of the fine solder ball accommodating mesh 11, the diameter of 1.2 times fine solder balls < the depth of the fine solder ball adsorbing mesh 21 < the diameter of 1.8 times fine solder balls; the top of the micro tin ball adsorption mesh 21 is tightly matched with the negative pressure component, and the bottom of the micro tin ball adsorption mesh 21 can be matched with the top of the micro tin ball accommodating mesh 11; the solder ball adsorbing transfer plate 2 is also provided with a positioning and aligning mechanism capable of assisting the bottom of the minute solder ball adsorbing mesh 21 to align with the top of the minute solder ball accommodating mesh 11. In this embodiment, the tiny solder ball adsorption mesh is used for adsorbing the tiny solder balls in the tiny solder ball accommodation mesh to transfer to the solder pads of the PCB to complete the ball implantation of the tiny solder balls; the depth and the aperture of the adsorption mesh of the micro tin balls in the range are adopted, so that the adsorption and the transfer of the micro tin balls with the diameter of 0.1mm or less are more accurate and efficient.

As shown in fig. 1-6, the shape of the tiny tin ball separating container is a groove or a box body, and the tin ball separating fixing plate 1 is detachably arranged at the bottom of the groove or the bottom of the box body; the discrete solvent comprises an organic solvent and an inorganic solvent which can weaken the adsorption force among the tiny tin balls and increase the fluidity of the tiny tin balls, and the minimum diameter of the tiny tin balls is 0.05mm; the tin ball separation fixing plate 1 and the tin ball adsorption transfer plate 2 are both stainless steel plates, the trumpet-shaped tiny tin ball accommodating mesh is formed by combining a conical hole and a straight hole, and the trumpet-shaped tiny tin ball adsorption mesh is formed by combining a conical hole and a straight hole; the vibration platform is provided with an ultrasonic vibration device or a vibration motor. In this embodiment, the discrete solvent is mainly used to weaken electrostatic force or other adsorption force between the tiny solder balls 3 when the vibration platform vibrates, so that the tiny solder balls 3 are more easily separated from each other, and thus the tiny solder balls are filled into the mesh of the solder ball fixing net.

According to the tin ball planting device for accurately separating the tiny tin balls, the tin ball separation fixing plate, the tin ball adsorption transfer plate, the tiny tin ball separation container and the vibration platform which are matched with each other are arranged in the tin ball planting ball, the vibration platform can drive the tiny tin balls placed on the tin ball separation fixing plate to move into the tiny tin ball accommodating holes, the negative pressure component can drive the tiny tin balls in the tiny tin ball accommodating holes to adsorb the tiny tin balls in the tiny tin ball accommodating holes to transfer to the tin ball welding plate of the PCB to complete the tiny tin ball planting work, the tiny tin balls can be rapidly and accurately separated, and the tin ball welding plate transferred to the PCB can complete the tiny tin ball planting work, the tiny tin balls can be rapidly and accurately planted in 0.05mm at the minimum, the ball planting efficiency can be up to 500 ten thousand per hour, the structure is simple, the ball planting cost is low, the ball planting efficiency is high, the ball planting loss rate is low, and the problems that in the prior art, the tiny tin ball planting device is high in cost, the efficiency is low, the loss rate is difficult to be less than 0.1mm of tiny tin balls which are difficult to separate accurately are solved.

The above embodiments are preferred embodiments of the present utility model, and are not intended to limit the scope of the present utility model, which includes but is not limited to the embodiments, and equivalent modifications according to the present utility model are within the scope of the present utility model.

Claims (10)

1. The utility model provides a tin ball planting ball device of accurate separation tiny tin ball, its characterized in that includes tin ball separation fixed plate, tin ball absorption transfer board, tiny tin ball separation container and vibrating platform, the tin ball separation fixed plate is equipped with the tiny tin ball that the array was arranged and holds the mesh, the tin ball absorption transfer board is equipped with the tiny tin ball absorption mesh that the array was arranged, tiny tin ball absorption mesh with tiny tin ball holds mesh looks adaptation, the tin ball separation fixed plate can dismantle set up in the tiny tin ball separation container, tiny tin ball separation container set up in on the vibrating platform, tiny tin ball separation container can hold discrete solvent, tin ball absorption transfer board is equipped with negative pressure assembly, vibrating platform can drive place tiny tin ball motion on the tin ball separation fixed plate falls into in the tiny tin ball holds the mesh, negative pressure assembly can drive tiny tin ball absorption that is located tiny tin ball holds the mesh and shifts to the tiny tin ball of PCB of tiny tin ball and plants the work of tin ball to the tiny tin ball of PCB board.

2. The solder ball implanting device for accurately separating tiny solder balls according to claim 1, wherein: the micro solder ball accommodating mesh penetrates through the solder ball separation fixing plate, the shape of the micro solder ball accommodating mesh is a conical hole or a horn hole with gradually reduced pore diameter from top to bottom, and the diameter of the micro solder ball is 1.2 times less than the diameter of the micro solder ball with the depth of the micro solder ball accommodating mesh less than 1.8 times.

3. The solder ball implanting device for accurately separating micro solder balls according to claim 2, wherein: the diameter of the mesh at the bottom of the micro solder ball accommodating mesh is less than 0.5 times of the diameter of the micro solder ball, the diameter of 1.2 times of the micro solder ball is less than 1.8 times of the diameter of the mesh at the top of the micro solder ball accommodating mesh, and the diameter of 1 times of the micro solder ball is less than 1.1 times of the diameter of the mesh at one half of the depth of the micro solder ball accommodating mesh.

4. A solder ball implanting device for accurately separating micro solder balls according to claim 3, wherein: the micro tin ball adsorption mesh penetrates through the tin ball adsorption transfer plate, the shape of the micro tin ball adsorption mesh is an inverted conical hole or a horn hole with the aperture gradually reduced from bottom to top, the mesh diameter of the bottom of the micro tin ball adsorption mesh is larger than the mesh diameter of the top of the micro tin ball accommodating mesh, and the diameter of 1.2 times of micro tin balls is smaller than the diameter of the micro tin ball adsorption mesh which is smaller than the diameter of 1.8 times of micro tin balls.

5. The solder ball implanting device for accurately separating micro solder balls according to claim 4, wherein: the top of the micro tin ball adsorption mesh is tightly matched with the negative pressure component, and the bottom of the micro tin ball adsorption mesh can be matched with the top of the micro tin ball accommodating mesh.

6. The solder ball implanting device for accurately separating micro solder balls according to claim 5, wherein: the solder ball adsorption transfer plate is also provided with a positioning and aligning mechanism, and the positioning and aligning mechanism can assist the bottom of the micro solder ball adsorption mesh to align and cover the top of the micro solder ball accommodating mesh.

7. The solder ball implanting device for accurately separating micro solder balls according to claim 6, wherein: the shape of the tiny tin ball separating container is a groove or a box body, and the tin ball separating fixing plate is detachably arranged at the bottom of the groove or the bottom of the box body.

8. The solder ball implanting device for accurately separating micro solder balls according to claim 7, wherein: the discrete solvents include organic solvents and inorganic solvents capable of weakening the adsorption force between the tiny tin balls and increasing the fluidity of the tiny tin balls, and the minimum diameter of the tiny tin balls is 0.05mm.

9. The solder ball implanting device for accurately separating micro solder balls according to claim 8, wherein: the tin ball separation fixing plate and the tin ball adsorption transfer plate are stainless steel plates, the tiny tin ball containing mesh in the shape of a horn hole is formed by combining a conical hole and a straight hole, and the tiny tin ball adsorption mesh in the shape of the horn hole is formed by combining a conical hole and a straight hole.

10. The solder ball implanting device for accurately separating micro solder balls according to claim 9, wherein: the vibration platform is provided with an ultrasonic vibration device or a vibration motor.